Abstract: The invention provides an on-chip transformer balun formed among N successive isolating layers. The transformer includes a primary winding and a secondary winding. The primary winding includes a plurality of first semi-turn coils, a plurality of second semi-turn coils, a plurality of metal junctions, and a plurality of first metal bridges. The secondary winding includes a plurality of third semi-turn coils, a plurality of fourth semi-turn coils, and a plurality of second metal bridges. The first semi-turn coils are connected with the second semi-turn coils by the metal junctions and the first metal bridges. The third semi-turn coils are connected with the fourth semi-turn coils by the second metal bridges. By use of the multi-layer first metal bridges, the transformer according to the invention allows a larger input current than a conventional on-chip transformer.

Abstract: An on-chip inductor can include an outer inductor portion that separates an inner region of the inductor from an outer region of the inductor outside the inductor. An interconnect inductor portion is electrically coupled to the main inductor portion wherein the interconnect inductor portion can include extension portions that follow the contour of the adjacent portions of the outer inductor in the inner region of the inductor. An input path is coupled to the outer inductor portion through the extension portion and extends away from the inductor beneath the outer inductor portion on a first side thereof. An output path is coupled to the outer inductor portion through the extension portion and extends away from the inductor beneath the outer inductor portion on a second side of the inductor opposite the first side.

Abstract: A multilayer coil component is constructed such that inductance can be finely adjusted and the coupling between two helical coils can be strengthened without increasing the types of patterns of coil conductors. Coil conductors of a first coil unit are connected to each other in series via via-hole conductors so as to form a first helical coil. Coil conductors of a second coil unit are connected to each other in series via via-hole conductors so as to form a second helical coil. The first and second helical coils are coaxially positioned, have different numbers of turns, and are electrically connected to each other in parallel. The sum of turns of the coil conductors facing each other at a portion where the first coil unit and the second coil unit are adjacent to each other is larger than the sum of turns of the coil conductors positioned on both outer sides in the coil axis direction of the first and second helical coils.

Abstract: A transformer and method of making same is disclosed. A substantially planar configured, first half primary winding and first half secondary winding are formed over a substantially planar base. The first half primary and secondary windings are overlaid with a ferrite layer. A substantially planar configured, second half primary winding and second half secondary winding are formed over the ferrite layer in stacked relation to the respective first half primary winding and secondary windings. The respective first and second half primary windings and respective first and second half secondary windings are interconnected together.

Abstract: A multilayer inductor includes a plurality of conductor layers for a coil, a plurality of magnetic substance layers, the magnetic substance layers and the conductor layers laminated alternately, and at least a magnetic flux restrictor layer disposed to block magnetic flux passing through the inner region of the coil. The magnetic flux restrictor layer is thinner at the center part of the coil than it is in a region near one of the conductor layers.

Abstract: A laminated balun transformer that achieves improved balance characteristics and prevents the occurrence of parasitic inductance has an impedance transformation ratio of one to four and outputs balanced signals generated from an unbalanced signal. The laminated balun transformer includes a magnetic substrate, a laminated body, and external electrodes. The laminated body includes a first transformer, a second transformer, and a non-magnetic body which completely covers the first and second transformers from the outside. The first and second transformers are arranged side by side in a direction substantially parallel to the magnetic substrate. A primary coil of the first transformer and a secondary coil of the second transformer are configured to be 180-degree rotationally symmetric with respect to a center line, while a secondary coil and a primary coil are also configured to be 180-degree rotationally symmetric with respect to the center line L.

Abstract: Embodiments of the present invention may provide for high-performing inductor structures utilizing multi-layer organic stackups. In particular, these high-performing inductor structures may be formed of one or more stitched metal layer building blocks, which are each formed of at least two inductor sections that are vertically or horizontally aligned, and then stitched or connected together. This stitching process significantly reduces the DC/RF losses while reducing the inductance value by a substantially lower factor, thereby significant increasing the Q-factor of the resulting inductor structure. Each stitched metal layer building block may be formed on an organic dielectric layer (e.g., liquid crystalline polymer (LCP)) having a first conductive layer on a first surface and perhaps a second conductive layer on a second surface opposite the first surface.

Abstract: An electrical inductor circuit element comprising an elongate electrical conductor coupled magnetically with thin layers of magnetic material extending along at least a part of the conductor above and below the conductor. The aspect ratio of the thickness of each of the layers of magnetic material to its lateral dimensions is between 0.001 and 0.5 and is preferably between 0.01 and 0.1. This range of aspect ratio has a high ferromagnetic resonance frequency. The inductor preferably includes magnetic interconnections extending beside the conductor and interconnecting the layers of magnetic material at positions where magnetic flux generated by electrical current flowing along the conductor is transverse to the layers.

Abstract: An output filter for an audio amplifier includes a printed circuit board having at least one aperture extending through the printed circuit board. The output filter includes a first coil winding formed on a layer of the printed circuit board. The first coil winding substantially surrounds the first aperture. A magnetic core includes at least one leg. The at least one leg passes through the at least one aperture.

Abstract: A multi-transformer unit is operative for converting an input AC voltage at a first voltage level to a net output AC voltage at a second voltage level. The multi-transformer unit can be used in place of a conventional transformer or an AC machine and is designed to suppress the transfer of harmonics between the input and output AC voltages. The unit comprises at least two phase-shifting transformers, each transformer being operative to provide a phase shift relative to the first voltage level. On the primary side of the unit the transformers are arranged for independent connection to the first voltage level, whereas on the secondary side of the unit the transformers are linked such that voltage vectors on the secondary side of the unit are added together to at least partially cancel the harmonic pollution and give the net output AC voltage.

Abstract: To form a center tap (CT), at least two coils must be formed. This increases the number of steps in the winding process and decreases the workability. To prevent this, a conductor having a plurality of plate portions that are connected to each other at one vertex of a rectangular shape is formed. The conductor is wound on a winding shaft, thus forming two coils.

Abstract: A multi-layered electromagnetic coil for a force-measuring system is based upon the principle of electromagnetic force compensation, as is a method for manufacturing the coil. The coil has a multifilar, specifically bifilar, wiring arrangement of coil wires. Preferably, the coil wires have a substantially rectangular cross-sectional profile. The cross-sectional profile of the coil wire is designed for achieving the densest possible packing of the windings in the coil can be achieved.

Abstract: An embodiment is a magnetic via. More specifically, an embodiment is a magnetic via that increases the inductance of, for example, an integrated inductor or transformer while mitigating eddy currents therein that may limit the operation of the inductor or transformer at high frequency.

Abstract: The coil comprises a plurality of non-joined turns, each turn comprising a rectangular bottom flat section in a bottom plane and a rectangular top flat section in a top plane and two rising sections. The turns fill almost all of the enveloping surface of the coil, a minimum isolating gap separating the adjacent turns. The top and bottom sections corresponding to one and the same turn are aligned with respect to one another and have a larger width than the width of the corresponding rising sections. The turns constitute a plurality of substantially parallel coil branches, rising sections of two adjacent branches arranged between the two adjacent branches being arranged alternately in a single plane.

Abstract: A semiconductor device having a semiconductor substrate and a first insulator overlying the semiconductor substrate. A spiral coil inductor overlies the first insulator and a second insulator overlies the spiral coil inductor. A patterned ferromagnetic film overlies the second insulator and a patterned magnetic-bias film overlies the patterned ferromagnetic film.

Abstract: An inductor is provided which includes a plurality of via holes vertically passing through a substrate, the substrate having insulating properties, vertical conductive portions filling the via holes, and horizontal conductive portions connecting each individual vertical conductive portions at the top and the bottom of the substrate to form a single coil structure with the vertical conductive portions.

Abstract: SMT-components known in the art usually have a thickness of approximately 1 mm and no flexibility. According to the present invention windings for an inductor are realized within a substrate, preferably by using copper layers which are already in the substrate. Then, thin metal sheet layers of high permeable material are laminated on top and bottom of the substrate. These layers are structured and then form the magnetic core of the inductor. Advantageously, an inductor may be provided with a very small building height.

Abstract: An inductor used in an RF unit for a wireless communication terminal, includes first inductor means for electrically connecting an RF chip placed over a substrate at a predetermined distance from the substrate that are enclosed by an interlayer dielectric layer and second inductor means for connecting the RF chip to the first inductor means.

Abstract: The invention relates to a common mode choke coil and a method of manufacturing the same and provides a compact, low-profile, and low-cost common mode choke coil and a method of manufacturing the same. A common mode choke coil has a general outline in the form of a rectangular parallelepiped provided by forming an insulation layer, a first helical coil unit, a second helical coil unit, and a closed magnetic path on a silicon substrate made of a single-crystal using thin film forming techniques. The first and second helical coil units are formed such that their axes of spiral extend substantially parallel to a substrate surface of the silicon substrate.

Abstract: An inductor embedded in a substrate, including a substrate, a coil electrode formed by filling a metal in a spiral hole formed on the substrate, an insulation layer formed on the substrate, and an external connection pad formed on the insulation layer to be connected to the coil electrode. The inductor-embedded substrate can be used as a cap for a micro device package by forming a cavity on its bottom surface.

Abstract: The invention relates to surface-mount type coil components having a mounting surface for mounting them on a printed circuit board or hybrid IC (HIC) and provides a low-cost coil component having a low direct-current resistance. A common mode filter includes a bridge conductor layer which has a bridge conductor one end of which is connected to one end of a lead wire and another end of which is connected to an inner circumferential end of a coil conductor and another bridge conductor one end of which is connected to one end of another lead wire and another end of which is connected to an inner circumferential end of another coil conductor, the bridge conductor layer being formed between two coil conductor layers with an insulation film interposed between the bridge conductor layer and each of the coil conductor layers.

Abstract: A three dimensional (3D) transformer includes a first coil and a second coil. Each coil includes a first port, a second port, a top layer metal line, inter-layer inner metal lines, inter-layer outer metal lines and a bottom layer metal line. Each metal line of the first coil and that of the second coil are correspondingly arranged to the opposite side of each other. Each of the first port is electrically connected to each of the top metal line. Each coil is arranged clockwise from the top metal line, the inter layer inner metal line down to the bottom layer metal line and arranged clockwise from the bottom layer metal line, the inter layer outer metal line up to the upper metal line of the inter layer outer metal line. Each upper metal line of the inter layer outer metal line is electrically connected to each second port.

Abstract: Within a method for fabricating an inductor structure there is first provided a substrate. There is then formed over the substrate a planar spiral conductor layer to form a planar spiral inductor, wherein a successive series of spirals within the planar spiral conductor layer is formed with a variation in at least one of: (1) a series of linewidths of the successive series of spirals; and (2) a series of spacings of the successive series of spirals. The method contemplates a planar spiral inductor structure fabricated in accord with the method. A planar spiral inductor structure fabricated in accord with the method is characterized by an enhanced Q value of the planar spiral inductor structure.

Abstract: The invention is applicable to a characteristic adjustment method for an inductor formed by laminating a plurality of coils and electrically connecting these coils by a through hole, and is aimed at providing a method which can easily adjust the characteristic of the inductor with a simple configuration. The method comprises determining a part of the coil in an outermost layer as an adjustment area, and not forming the through hole below the adjustment area, and removing at least a part of the adjustment area after the coil in the outermost layer is formed.

Abstract: The invention relates to a coil component used as a main component of a common mode choke coil or a transformer and a method of manufacturing the same, and the invention is aimed at providing a coil component with a small size and a low height having high differential transmission characteristics and a method of manufacturing the same. A common mode choke coil has a configuration in which an insulation film, a coil conductor, another insulation film, another coil conductor and another insulation film are stacked in the order listed between magnetic substrates provided opposite to each other. The coil conductors have a coil section which is in a trapezoidal general configuration. A top portion of the coil section is formed in a convex configuration such that it bulges in the form of a convex, and a bottom portion of the coil section is formed in a planar configuration.

Abstract: A transformer and method of making includes first half primary and secondary windings as metallic circuits that are etched on a metallic cladding of a first liquid crystal polymer (LCP) sheet. Secondary windings are positioned in spaced relation to the primary windings. A second LCP sheet is applied over the first LCP sheet. Second half primary and secondary windings are etched as metallic circuits on a metallic cladding of a second LCP sheet. Respective first and second half primary windings are interconnected to each other and the first and second half secondary windings are connected to each other by conductive vias.

Abstract: An on-chip inductor includes a main inductor portion configured to provide a main magnetic field of an on-chip inductor. An interconnect inductor portion is electrically coupled to the main inductor portion and is configured to provide an interconnect magnetic field that constructively combines with the main magnetic field.

Abstract: The invention relates to an inductor comprising a plurality of interconnected conductive segments interwoven with a substrate. The inductance of the inductor is increased through the use of coatings and films of ferromagnetic materials such as magnetic metals, alloys, and oxides. The inductor is compatible with integrated circuit manufacturing techniques and eliminates the need in many systems and circuits for large off chip inductors. A sense and measurement coil, which is fabricated on the same substrate as the inductor, provides the capability to measure the magnetic field or flux produced by the inductor. This on chip measurement capability supplies information that permits circuit engineers to design and fabricate on chip inductors to very tight tolerances.

Abstract: The present invention provides a continuous conductive planar coil structure. The continuous conductive planar coil structure includes a first output terminal, a second output terminal, a coil body and a projection plane parallel to the coil body, wherein a first projection on the projection plane is formed by the first output terminal, a second projection on the projection plane is formed by the second output terminal, and an overlapping portion is between the first projection and the second projection.

Abstract: A multi-layer laminated circuit board 10A of the present invention is formed by laminating together a multi-layer transformer 10, a multi-layer part sheet 30 formed with a multi-layer part, and a wiring sheet 50 formed with a circuit pattern. The multi-layer transformer 10 is incorporated into the multi-layer laminated circuit board 10A, and therefore a package for the multi-layer transformer 10 is omitted, and the wiring between the multi-layer transformer 10 and other components is reduced to a minimum.

Abstract: The multi-layer transformer 10 of the present invention comprises a composite sheet 14a comprising a center magnetic pattern 11a and peripheral magnetic pattern 12a that are formed at the center and periphery respectively, and a dielectric pattern 13a of a nonmagnetic body that is formed in a part except the center and periphery; a composite sheet 14b similarly comprising a center magnetic pattern 11b, peripheral magnetic pattern 12b and a dielectric pattern 13b; a primary winding 15a that is located on one face of the dielectric pattern 13a; a secondary winding 15b that is located on one face of the dielectric pattern 13b; and magnetic sheets 16a and 16b that hold the composite sheets 14a and 14b, primary winding 15a and secondary winding 15b from both sides and contact one another via the center magnetic patterns 11a and 11b and peripheral magnetic patterns 12a and 12b.

Abstract: A magnetic device of smaller size and lower profile comprising a coil conductor of high inductance and low resistance is provided. The magnetic device comprises a coil conductor and a multilayer magnetic layer formed so as to cover the periphery of the coil conductor. Further, a magnetic device having higher inductance value and lower conductor resistance value (AC resistance) by selecting a magnetic layer capable of suppressing the eddy current and having excellent magnetic characteristics even designed with smaller size and lower profile.

Abstract: A semiconductor apparatus having a semiconductor chip, a first coil electrically connected to the semiconductor chip and a first electrode electrically connected to the first coil is comprised of a second electrode which can be electrically connected to the first electrode as well as which can be electrically connected to a second coil on the outside of the semiconductor apparatus, and is characterized by that inductance composed of the first coil and the second coil is obtained by electrically connecting the second electrode to the first electrode and the second coil.

Abstract: The invention is directed to a method for manufacturing a metal-insulator-metal transformer together with a capacitor. The method comprises steps of providing a substrate having at least a dielectric layer formed thereon and then forming a first metal layer of the metal-insulator-metal capacitor together with a first metal coil of the transformer over the substrate. An insulating layer is formed to cover the substrate, the first metal layer and the first metal coil. A second metal layer of the metal-insulator-metal capacitor is formed together with a second metal coil of the transformer on the insulating layer.

Abstract: A high coupling factor transformer and a manufacturing method thereof are provided. The transformer includes a primary winding and a secondary winding. The secondary winding is adjacent to the primary winding. The secondary winding and the primary winding induct with each other. The primary winding includes a plurality of first protruding portions, and the secondary winding includes a plurality of second protruding portions. The first protruding portions stretch to the secondary winding without electro-contact, and the second protruding portions stretch to the primary winding without electro-contact.

Abstract: A common-mode filter comprises a first conductor layer, a second conductor layer, and an insulating layer placed between the first and second conductor layers. The first conductor layer has a first spiral part formed such as to draw a convolution and a first lead electrode extending from one end of the first spiral part. The second conductor layer has a second spiral part formed such as to draw a convolution and a second lead electrode extending from one end of the second spiral part. The first conductor layer is formed with third and fourth lead electrodes. The second conductor layer is formed with a connecting conductor connecting the third lead electrode to the other end of the first spiral part. The fourth lead electrode is connected to the other end of the second spiral part through a contact hole formed in the insulating layer. The third lead electrode is connected to one end of the connecting conductor through a contact hole formed in the insulating layer.

Abstract: An inductance with a midpoint formed in a monolithic circuit, comprising a first conductive spiral integrally formed in a first conductive level, a second conductive spiral integrally formed in a second conductive level, and a via of spiral interconnection at the position of the inductance midpoint.

Abstract: A method for producing an insulated wire having a cross section of a desired shape, in which a conductor having a cross section of a desired shape is coated with an insulating film, which method comprises: supplying a raw conductor while passing through a rolling unit composed of at least one pair of rolling rolls that are capable of freely rotating without a drive mechanism and that have a desired shape, thereby forming a conductor having a cross section of a desired shape; and coating the conductor with an insulating film.

Abstract: The present invention generally relates to the process of forming a magnetic element or magnetic device that may be used to form a component within an integrated circuit device using a combination of electroless plating and various standard semiconductor processing techniques. In one embodiment, a plurality of magnetic devices are formed on a surface of a substrate so that the orientation of features on the surface of the substrate can be ascertained. In one embodiment, the magnetic devices formed on a surface of a substrate are used to physically align a substrate to an external reference having a similar orientation of magnetic elements.

Abstract: An embedded inductor suitable for a wiring board is provided. The wiring board having a plurality of patterned conductive layers and a plurality of insulating layers, and one of the insulating layers is disposed between any two adjacent of the patterned conductive layers. The embedded inductor at least includes a first conductive trace, a second conductive trace, a third conductive trace, a first conductive structure, and a second conductive structure. These conductive traces are respectively formed of different patterned conductive layers of the wiring board. The first conductive structure and the second conductive structure passing through the insulating layers connect the conductive traces in a spiral pattern. The embedded inductor with such spiral pattern is arranged on a plane that is perpendicular to the patterned conductive layers of the wiring board.

Abstract: A lamination type electronic component includes spiral conductor patterns which are substantially quadrilateral and are electrically connected to each other through a via hole formed in a ceramic insulating layer so as to constitute a coil. The conductor patterns are arranged so that the center in the width direction of the sides extending in the Y-axis direction of the one conductor pattern may be positioned at the inside edges of the sides extending in the Y-axis direction of the other conductor pattern.

Abstract: A bandpass filter includes at least two thin-film layers, a first resonant circuit including a first inductor, and a second resonant circuit including a second inductor. In one embodiment, the first inductor comprises a coil having a counter-clockwise rotation positioned in two or more of the at least two thin-film layers and the second inductor comprises a coil having a clockwise rotation positioned in two or more of the at least two thin-film layer. In this case, the first inductor is coupled to the second inductor in at least one of the at least two thin-film layers when the bandpass filter is energized. In another embodiment, the first inductor has a clockwise rotation and the second has a counter-clockwise rotation positioned. In this case, the first inductor is coupled to the second inductor in at least two of the at least two thin-film layers when the bandpass filter is energized.

Abstract: An inductor is made of a flat conducting wire with a constant thickness. The inductor includes a coiled portion and two leg portions. The leg portions are end parts of the flat conducting wire that are processed with a specific process. In addition, each leg portion has a thickness smaller than that of the coiled portion.

Abstract: An embodiment is a magnetic via. More specifically, an embodiment is a magnetic via that increases the inductance of, for example, an integrated inductor or transformer while mitigating eddy currents therein that may limit the operation of the inductor or transformer at high frequency.

Abstract: An inductor comprises first and second winding portions symmetrically arranged in an insulating layer on a substrate. Each winding portion comprises first, second and third semicircular conductive traces arranged in concentricity from the inside to the outside. Each semicircular conductive trace has first and second ends, in which the first ends of the first semicircular conductive traces of the first and second winding portions are coupled to each other. A coupling portion comprises a first pair of connection layers cross-connecting the first ends of the second and third semicircular conductive traces of both winding portions and a second pair of connection layers cross-connecting the second ends of the first and second semicircular conductive traces of both winding portions. The adjacent semicircular conductive traces of each winding portion have a trace line space therebetween and the relatively outer trace line space is wider than the relatively inner trace line space.

Abstract: A semiconductor device includes a semiconductor substrate, an insulating film formed on the semiconductor substrate, and a thin-film inductor element which is formed on the insulating film, and which includes first and second terminals and a conductive layer formed into a spiral shape between the first and second terminals so as to have a plurality of turns and at least one intersection. The conductive layer includes (i) a first conductor layer formed on the semiconductor substrate, and (ii) a second conductor layer which is formed on the insulating film, intersects the first conductor layer via the insulating film at the intersection. The thin-film inductor element has an arrangement in which the first and second conductor layers are symmetrically arranged in directions from an intermediate point between the first and second terminals along the longitudinal direction of the conductive layer to the first and second terminals.

Abstract: A method of determining electrical parameters of inductive elements includes a novel technique of inverting an impedance matrix representative of said inductive circuit element. The method reduces model simulation time by a factor of 3000. In one embodiment, simulation time of a device model was reduced from 1 hour to less than 3 seconds. The method is suitable for use with circuit element modeling tools, circuit simulation environments, and antenna modeling systems. The method may be applied to inductors, transformers, antennas, etc.

Abstract: The present invention provides a coil structure capable of improving a differential transmission characteristic by reducing capacitance as much as possible. A common mode choke coil is constructed so that a section of each of two coil patterns constructing a thin film coil has an inverted trapezoid shape which is bilaterally asymmetrical. Because of the structural characteristic that the section of each of the two coil patterns has an inverted trapezoid shape which is bilaterally asymmetrical, the facing area of the two coil patterns contributing to capacitance is minimized. Thus, the capacitance of the thin film coil can be reduced as much as possible.

Abstract: A laminated coil includes a non-magnetic body section (5) inside a laminated body. On the non-magnetic body section (5), a coil conductor (4c) is provided. The coil number of the coil conductor (4c) is greater than the coil number of a coil conductor (4d) that is a coil conductor other the coil conductor (4c) on the non-magnetic body section (5).

Abstract: A toroidal inductor (100) and method of forming same. The invention is intended to decrease the direct current resistance (DCR) of the toroidal inductor circuit. Thus, an increase in the quality factor (Q) of the circuit is produced. The toroidal inductor includes a coil formed from an elongated conductor extending around a core material and defining a plurality of turns. The elongated conductor is comprised of one or more coil segments. The coil segments are arranged in an alternating pattern of a first type segment (101) and a second type segment (102). Each of the coil segments of the first type includes a plurality of elongated parallel conductors (104, 105) spaced apart and electrically connected by conductive links (108) at predetermined intervals along their respective lengths. The coil segments of the second type are formed of a single conductor defined by a conductive via (302, 304) formed in the substrate.