Abstract: An electromagnetic assembly which has a base, at least one winding, and a magnetic core connected to the base, where at least one winding is mounted on the magnetic core. A housing part encloses at least part of at least one winding, and a printed circuit board is mounted to the housing part. The electromagnetic assembly can be a transformer or inductor, for example.

Abstract: An inductance formed in a stacking of insulating layers, the inductance comprising first and second half-turns, each first half-turn being at least partly symmetrical to one of the second half-turns, the first half-turns being distributed in first groups of first half-turns at least partly aligned along the insulating layer stacking direction and the second half-turns being distributed in second groups of second half-turns at least partly aligned along the insulating layer stacking direction. For any pair of first adjacent half-turns of a same group, one of the first half-turns in the pair is electrically series-connected to the other one of the first half-turns in the pair by a single second half turn and for each pair of second adjacent half-turns of a same group, one of the second half-turns in the pair is electrically series-connected to the other one of the second half-turns in the pair by a single first half-turn.

Abstract: An electromagnetic induction type processing apparatus includes a coil and a functional device. The coil is configured to generate electromotive force from a magnetic field supplied from the outside. The functional device is configured to operate with the electromotive force and containing conductive substance having a conductivity with which eddy current to be generated in the conductive substance by the magnetic field supplied from the outside is suppressed such that the lowest electromotive force for operation of the functional device is assured regardless of a magnetic field generated by the eddy current and acting in the opposite direction to that of the magnetic field supplied from the outside.

Abstract: An upper frequency-range circuit (160) includes a load element (168) exhibiting a capacitive load impedance. A first matching network (166) includes at least one nano-scale Litz wire (100) inductor. The first matching network (166) exhibits an inductive impedance that nominally matches the capacitive load impedance. An electrical conductor for providing connections for radio-frequency signals includes a plurality of nano-scale conductors (120) that are arranged in the form of a Litz wire (100). In one method of making a Litz wire (142), a plurality of carbon nanotubes (144) is placed on a substrate (146). The carbon nanotubes (144) are woven according to a predefined scheme so as to form a Litz wire (142). An inductor may be formed by manipulating the Litz wire (100) to form a coil (150).

Abstract: Pad structures and methods for forming such pad structures are provided. For the pad structure, the first conductive material layer has a first hardness over about 200 kg/mm2. The second conductive material layer is over the first conductive material layer and has a second hardness over about 80 kg/mm2. For the method of forming the pad structure, a plurality of first conductive material layers is formed within each of a plurality of openings of a substrate. The substrate has a plurality of openings therein. The first conductive material layers are formed within each of the openings of the substrate. The first conductive material layers substantially have a round top surface. The second conductive material layers are formed and substantially conformal over the first conductive material layers. The second conductive material layers cover a major portion of the round top surface of the first conductive material layers.

Abstract: An apparatus includes an electrically conductive generally planar strip having a thickness, having a width greater than the thickness and having a length greater than the width. The strip is arranged in alternating length segments. Each adjacent pair of length segments are oriented about divergent axes and are joined by a respective transition arrangement. Each respective transition arrangement presents the strip foldingly lapped upon itself in a laminate structure.

Abstract: An inductor device is provided. The inductor includes: a first inductor; a second inductor, wherein the first inductor and the second inductor are arranged such that a magnetic field generated by the first inductor and passing through the inside of a loop formed from the second inductor comprises a first magnetic field and a second magnetic field, the first magnetic field passing from the topside of the loop to the downside of the loop, the second magnetic field passing from the downside of the loop to the topside of the loop.

Abstract: The claimed invention relates to arrangements of inductors and integrated circuit dice. One embodiment pertains to an integrated circuit die that has an inductor formed thereon. The inductor includes an inductor winding having a winding input and a winding output. The inductor also comprises an inductor core array having at least first and second sets of inductor core elements that are magnetically coupled with the inductor winding. Each inductor core element in the first set of inductor core elements is formed from a first metallic material. Each inductor core element in the second set of inductor core elements is formed from a second metallic material that has a different magnetic coercivity than the first magnetic material. The inductor further comprises a set of spacers that electrically isolate the inductor core elements. Some embodiments involve multiple inductor windings and/or multiple inductor core elements that magnetically interact in various ways.

Abstract: An impedance transformer includes a first winding and a second winding. The first winding includes a first plurality of winding components, wherein each of the first plurality of winding components is on a corresponding layer of a first set of layers of a supporting substrate. The second winding includes a second plurality of winding components, wherein each of the second plurality of winding components is on a corresponding layer of a second set of layers of the supporting substrate and the first and second sets of layers are interleaved. The first winding has a first impedance within a desired frequency range and the second winding has a second impedance within the desired frequency range, where the first and second impedances are based on at least one of spacing, trace width, and trace length of the first and second plurality of winding components.

Abstract: A coil unit includes a planar coil, a magnetic member that is provided under the planar coil, a magnetic flux leakage prevention member that is provided under the magnetic member, and a heat sink that is provided under the magnetic flux leakage prevention member. The magnetic flux leakage prevention member is electrically insulated from the heat sink. The magnetic flux leakage prevention member is insulated from the heat sink using a double-sided adhesive tape, for example. Since the heat sink dissipates heat generated from the planar coil and is electrically insulated from the magnetic flux leakage prevention member, the heat sink does not function as a member which receives a magnetic flux.

Abstract: A power amplifier formed by a plurality of pairs of transistors, each pair including a first transistor and a second transistor having each a respective input terminal and a respective output terminal. The output terminals of the first and second transistors of each pair are connected to an output distributed active transformer connected to a differential output of the power amplifier. The input terminals of the first and second transistors of each pair are connected to an input distributed active transformer connected to an input of the power amplifier.

Abstract: An equivalent circuit of an inductor is provided with a five wire structure. A first wire has a first resistor, an inductor, and a third resistor connected in series. A second wire is connected in parallel with the first wire and has a second resistor. A third wire is connected in parallel with the first and second wires and has a third capacitor. A fourth wire is serially connected to a first common node of the first, second, and third wires, and has a first capacitor connected between the first common node and a first sub capacitor and a first sub resistor connected in parallel. A fifth wire is serially connected to a second common node of the first, second, and third wires, and has a second capacitor connected between the second common node and a second sub capacitor and a second sub resistor connected in parallel.

Abstract: An edgewise coil which includes a non-circular cross-sectional shaped conductor having a cross-sectional shape defined by a pair of first and second long sides and a pair of first and second short sides, the shaped conductor wire being laminated while being bended with using the first short side as a bending fulcrum so as to form a plurality of laminated wire layers having a rectangular shape in a plan view, wherein the pair of long sides include, in a longitudinal cross section in a pre-bending-process state before the shaped conductor wire is bended, a pair of straight-line regions extending from both ends of the second sides so as to be parallel to each other and a pair of tapered regions extending between the straight-line regions and the first short side, and the pair of tapered regions, in a longitudinal cross section in the pre-bending-process state, come closer to each other as they approach the first short side.

Abstract: Provided are an inductor, which is vertically formed, and an electronic device having the inductor, and more particularly, an inductor capable of minimizing loss of a surface area and accomplishing high efficiency impedance by vertically forming the inductor in a plurality of insulating layers, and an electronic device having the same. The inductor includes a plurality of conductive lines disposed in the insulating layers; and vias vertically formed in the insulating layers to electrically connect the plurality of conductive lines. When a board or an electronic device including an inductor proposed by the present invention is manufactured, the inductor can occupy a minimum area in the electronic device or board while providing high inductance. In particular, the surface area of the electronic device or board occupied by the inductor can be remarkably decreased to reduce manufacturing costs.

Abstract: A laminated coil includes a laminated body having magnetic body sections that are provided on both main surfaces of a non-magnetic body section and include a plurality of stacked magnetic layers, the non-magnetic body section including at least one non-magnetic layer, and a coil including helically connected coil conductors provided in the laminated body. The conductor width of at least one of the coil conductors provided inside the non-magnetic body sections and the coil conductors provided on both main surfaces of the non-magnetic body sections is greater than the conductor width of the other coil conductors in the laminated body.

Abstract: An embodiment is a magnetic via. More specifically, an embodiment is a magnetic via that increases the inductance of, for example, an integrated inductor or transformer while mitigating eddy currents therein that may limit the operation of the inductor or transformer at high frequency.

Abstract: An inductor structure disposed over a substrate and including a coil layer is provided. The coil layer has a plurality of coil turns electrically connected with each other. An innermost coil turn of the coil layer has a portion with a narrower width in a region with a higher magnetic flux density than that in the other region with lower magnetic flux density.

Abstract: A common mode choke coil is provided with first and second coil conductors that are magnetically coupled to each other, a third coil conductor that is electrically connected in series to the first coil conductor and substantially not magnetically coupled to the first coil conductor, a fourth coil conductor that is electrically connected in series to the second coil conductor and substantially not magnetically coupled to the second coil conductor, a first contact conductor for connecting the third coil conductor with the inner end of the first coil conductor, and a second contact conductor for connecting the fourth coil conductor with the inner end of the second coil conductor. The third coil conductor and the fourth coil conductor are substantially not magnetically coupled, and are in a linear symmetrical relationship based on a prescribed center line.

Abstract: A common mode choke coil includes a core, external electrodes, a pair of windings, and a top plate. The core includes a winding core portion and a pair of flanges disposed at respective ends thereof. The external electrodes are provided at lower portions of the flanges. The pair of the windings is wound around the winding core portion of the core, and ends thereof are connected to the external electrodes, respectively. A lower surface and a side surface of the top plate are covered with a metal film and are adhered to upper surfaces of the flanges with an adhesive. Preferably, magnetic powder is mixed in the adhesive.

Abstract: A transformer includes: a multilayer board; one or more input conductive lines formed on the multilayer board, whose both ends connected to input terminals of a positive signal and a negative signal, respectively; one output conductive line formed adjacent to the one or more input conductive lines to form an electromagnetic coupling with the one or more input conductive lines, whose one end is connected to an output terminal and another end is connected to a ground; a power supply pad formed in an area of the one or more input conductive lines; and a harmonics remover formed between the one end and the another end of the output conductive line to remove harmonics components of a signal outputted from the output conductive line.

Abstract: An integrated structure of passive elements in an LLC resonance converter realized by flexible circuit boards includes a closed magnetic circuit formed by first and second magnetic cores, a tubular, double-sided, flexible circuit board, tubular magnetic-material layer and tubular, single-sided, flexible circuit board. The single-sided circuit board is coaxially sleeved in turn from inside outwards on a magnetic core column of the closed magnetic circuit. The tubular, double-sided, circuit board is a laminated plate material formed in turn of a first insulating layer, first copper foil, insulating medium layer, second copper foil and second insulating layer. The tubular, single-sided, circuit board is a laminated plate material formed in turn of a third insulating layer, third copper foil and fourth insulating layer. The integration of a resonance capacitor, resonance inductor, shunt inductor and transformer in a LLC resonance converter is realized by using these flexible circuit boards.

Abstract: A high coupling factor transformer and a manufacturing method thereof are provided. The transformer includes a primary winding and a secondary winding. The secondary winding is adjacent to the primary winding. The secondary winding and the primary winding induct with each other. The primary winding includes a plurality of first protruding portions, and the secondary winding includes a plurality of second protruding portions. The first protruding portions stretch to the secondary winding without electro-contact, and the second protruding portions stretch to the primary winding without electro-contact.

Abstract: There is provided a balun transformer, in which first to fourth layer coils are stacked and coupled magnetically; one end of each coil of the first to fourth layer coils is grounded; the second and third layer coils are connected in parallel, an unbalanced signal is input/output to/from a common terminal of the second and third layer coils; a first balanced signal is input/output to/from the other end of the first layer coil; and a second balanced signal is input/output to/from the other end of the fourth layer coil.

Abstract: An integrated inductor and capacitor component is provided and includes a number of tapered conductors. Neighboring ones of the tapered conductors are separated by a gap extending along a length of the component. A first one of the tapered conductors is characterized by a first width w1 that is larger at a first end of the component and tapers along the length of the component toward a second end of the component, and a second one of the tapered conductors is characterized by a second width w2 that is larger at the second end of the component and tapers toward the first end of the component.

Abstract: An electronic device can include an inductor overlying a shock-absorbing layer. In one aspect, the electronic device can include a substrate, an interconnect level overlying the substrate, and the shock-absorbing layer overlying the interconnect level. The inductor can include conductive traces and looped wires. The conductive traces can be attached to the conductive traces over the shock-absorbing layer. In another aspect, a process can be used to form the electronic device including the inductor. In still another aspect, an electronic device can a toroidal-shaped inductor that includes linear inductor segments that are connected in series.

Abstract: A surge absorbing circuit has a substrate on which a first conductor, a second conductor, and a third conductor are placed, and a surge absorber having a first terminal and a second terminal. The first conductor and the second conductor are mutually coupled in a polarity-reversed relation. One end of the first conductor is connected to one end of the second conductor. The third conductor is electrically isolated from the first conductor and the second conductor on the substrate. The first terminal of the surge absorber is connected to a connection portion between the first conductor and the second conductor. The second terminal of the surge absorber is connected to the third conductor.

Abstract: An inductor includes a casing, a coil and a core. The casing has an accommodating chamber. The casing is provided with two holes in communication with the accommodating chamber. The coil is accommodated in the accommodating chamber. The coil includes a first terminal, a first ring wrapping from a distal end of the first terminal, a second ring wrapped from a distal end of the first ring, and a second terminal extending from a distal end of the second ring. The second ring is formed at the outer periphery of the first ring and extends obliquely and downwardly. The second terminal and the first terminal penetrate through the two holes respectively. The core is disposed in the coil and is accommodated in the accommodating chamber. Via the above arrangement, the vertical space of the present invention can be reduced so as to be made more compact.

Abstract: A multilayer winding inductor. The inductor at least includes multi-level interconnect and single-level interconnect structures. The multi-level interconnect structure includes a plurality of conductive plugs and a plurality of looped conductive traces overlapping and separated from each other. Each looped conductive trace has a gap to define first and second ends and at least two conductive plugs disposed between the neighboring looped conductive traces. The single-level interconnect structure is located over the multi-level interconnect structure, comprising an uppermost looped conductive trace and a second conductive plug. The uppermost looped conductive trace has a gap to define first and second ends, and the second conductive plug is disposed between the second end of the uppermost looped conductive trace and the first end of the looped conductive trace adjacent thereto, thereby electrically connecting the multi-level and single-level interconnect structures.

Abstract: An LC tack structure. The structure, including a set of wiring levels on top of a semiconductor substrate, the wiring levels stacked on top of each other from a lowest wiring level nearest the substrate to a highest wiring level furthest from the substrate; an inductor in the highest wiring level, the inductor confined within a perimeter of a region of the highest wiring level; and a varactor formed in the substrate, the varactor aligned completely under the perimeter of the region of the highest wiring level. The structure may additionally include an electric shield in a wiring level of the set of wiring levels between the lowest wiring level and the highest wiring level. Alternatively, the inductor includes a magnetic core and alternating electrically non-magnetic conductive metal coils and magnetic coils around the core.

Abstract: [Problem] Manufacturing work of a coil is simplified and miniaturization of a reactor is achieved by reducing occupied space as much as possible.

Abstract: Method of forming a magnetic core or part of a magnetic core including several layers of windings of magnetic wire in a very compact configuration, and the core or part of core is formed by winding several layers of a collated band of wires side by side until desired number of layers of core or part of core is obtained. Method includes forming magnetic core or magnetic flux return path or part of magnetic core including several layers of windings of magnetic wire in compact configuration; core or part of core being formed by winding several layers of a collated band of wires side by side until reaching desired number of layers of the core or part of the core. Magnetic core or magnetic flux return path includes several layers of windings of magnetic wire in compact configuration; part of layers of windings being formed by collated band of wires.

Abstract: An embodiment is an inductor that may include a slotted magnetic material to decrease eddy currents therein that may limit the operation of the inductor at high frequency. An embodiment may employ electro- or electroless plating techniques to form a layer or layers of magnetic material within the slotted magnetic material structure, and in particular those magnetic material layers adjacent to insulator layers.

Abstract: The present invention provides a continuous conductive planar coil structure. The continuous conductive planar coil structure includes a first output terminal, a second output terminal, a coil body and a projection plane parallel to the coil body, wherein a first projection on the projection plane is formed by the first output terminal, a second projection on the projection plane is formed by the second output terminal, and an overlapping portion is between the first projection and the second projection.

Abstract: In a semiconductor device having a WCSP type construction package, to increase inductance without increasing further an area conventionally occupied by a coil. A pseudo-post part 27 comprising a magnetic body is extended in a direction perpendicular to a main surface 12a of a semiconductor chip 12, on a second insulating layer 21 of a WCSP 10. A first conductive part 15a and a second conductive part 15b constructed as square frames are respectively provided so as to surround the pseudo-post part, on respective top surfaces of a second insulation layer and a third insulating layer 22 which are separated parallel to each other, in an extension direction of the pseudo-post part. A coil 100 being a substantially spiral shape conductive path is formed from, the first conductive part, the second conductive part, and a connection part 26 which electrically connects the one ends of the first and second conductive parts.

Abstract: The invention relates to surface-mount type coil components having a mounting surface for mounting them on a printed circuit board or hybrid IC (HIC) and provides a coil component having high electrical characteristics. A common mode filter includes a coil conductor formed in a spiral shape, cut ends which are parts of the coil conductor cut to face each other, and bridge conductors formed so that an insulation film is interposed between the coil conductor and the same to connect the cut ends to each other.

Abstract: An inductor structure disposed over a substrate and comprising a first spiral wire and a second spiral wire is provided. The first spiral wire has a first end and a second end. The first end rotates in a spiral way outward from an inner portion of the first spiral wire. The second spiral wire and the first spiral wire are intertwisted with each other and symmetrically disposed about a symmetry plane. The second spiral wire has a third end and a fourth end. The third end rotates in a spiral way outward from an inner portion of the second spiral wire and is connected to the first end of the first spiral wire, so as to form a coil layer having a plurality of coil turns.

Abstract: An oscillator circuit formed at least partially on an integrated circuit substrate includes a self-shielding inductor. The self-shielding inductor has a toroidal structure. A coil forms a structure that is symmetric around an axis orthogonal to a surface of the integrated circuit substrate. A magnetic filed generated by the self-shielding inductor is confined to a core region of the coil. Portions of the self-shielding inductor may be formed in integrated circuit layers, redistribution layers, package layers, through-substrate interconnect, backside substrate conductor layers, or combinations thereof.

Abstract: A thin film device, which can maintain desirable performance characteristics by reducing parasitic capacitance and increasing the Q factor even when a thin film coil of a solenoid type is equipped, is provided. The thin film coil of a solenoid type has a cross sectional width which varies with position along a film thickness direction.

Abstract: The invention relates to a power converter (1) comprising a magnetic core (3) and a plurality of sub-converters each having a primary winding (17, 19) and a secondary winding. The magnetic core (3) comprises an inner leg (7) and a plurality of outer legs (5, 9), each of the outer legs (5, 9) having a gap (11, 13) formed therein. The primary winding (17) of one sub-converter is wound around an outer leg and the primary winding (19) of another sub-converter is wound around another outer leg. The primary windings (17, 19) are formed from a unitary winding (21) which is wound around the legs (5, 7, 9) in a continuous fashion. The primary windings (17, 19) are mounted on a printed circuit board (PCB) (15) and interconnects between turns of the primary windings are achieved using vias (27, 29) at the ends (23, 25) of the unitary winding. The vias may be conveniently placed in the corner sections or the PCB (15).

Abstract: A low cost, low profile and high performance inductive device for use in, e.g., electronic circuits. In one exemplary embodiment, the device includes a four-legged ferrite core optimized for fitting with four or more windings, thereby providing four close-tolerance inductors. Optionally, the device is also self-leaded, thereby simplifying its installation and mating to a parent device (e.g., PCB). In another embodiment, multiple windings per leg are provided. In yet another embodiment, the device has only to opposed legs, thereby reducing footprint. Methods for manufacturing and utilizing the device are also disclosed.

Abstract: The present invention relates to a spiral inductor for use in a semiconductor device. The spiral inductor comprises a dielectric layer formed of a plurality of layers stacked on a semiconductor substrate, and a plurality of curved metal lines formed in the dielectric layers which are serially connected in order to form a circular spiral shape.

Abstract: An on-chip transformer balun includes a primary winding as an input terminal of the on-chip transformer balun, and a secondary winding as an output terminal of the on-chip transformer balun, wherein one of the primary winding and secondary winding is formed of a plurality of metal layers in which a spiral trace portion excluding an underpass is disposed on mutually different layers to have an asymmetrical structure.

Abstract: The present invention provides an apparatus and method for measuring the conductivity of a fluid employing the differential radio frequency phase detection between two embedded toroidal coils.

Abstract: A transformer includes at least two windings. Each winding has at least one turn, and the windings are configured from a loop of electrically conductive material.

Abstract: Slot core inductors and transformers and methods for manufacturing same including using large scale flex circuitry manufacturing methods and machinery for providing two mating halves of a transformer winding. One winding is inserted into the slot of a slot core and one winding is located proximate to the exterior wall of the slot core. These respective halves are joined together using solder pads or the like to form continues windings through the slot and around the slotted core.

Abstract: Using MEMS device design and fabrication techniques, liquid metal inductors can be formed. Because of the common fabrication techniques, liquid metal inductors can be more easily integrated with certain MEMS microswitches.

Abstract: Disclosed is an apparatus and method for a magnetic component. The magnetic component includes a substrate having a feature and a first conductive pattern disposed on the feature. The magnetic component also includes a permeability material disposed within the feature. A substrate material is disposed on the substrate to facilitate substantial enclosure of the permeability material between the substrate and the substrate material, where the substrate material has a second conductive pattern. The first conductive pattern and the second conductive pattern cooperate to be capable of facilitating magnetic properties of the permeability material.

Abstract: A layered coil component includes a coil that is constructed by layering coil conductor patterns and ceramic sheets. The ceramic sheets include a first ceramic sheet and a third ceramic sheet having a permeability lower than the permeability of the first ceramic sheet. The third ceramic sheet has an arrangement that is astride at least two of the coil conductor patterns adjacent to each other in a layering direction, in a section including a coil axis of the coil. As a result, DC bias characteristics of the open magnetic circuit type layered coil component are improved.

Abstract: A magnetic device to be surface mounted on a substantially planar thermally conductive surface comprises a circuit board containing a winding pattern having at least one winding and a magnetic core that is at least partially encompassing the winding pattern. On a bottom side of the circuit board a region corresponding to a substantial part of the winding pattern is covered by a thermally conductive material for thermally contacting the thermally conductive surface. A transformer arrangement comprises such a magnetic device as well as a thermally clad circuit board having a surface area covered by a thermally conductive material, corresponding to at least substantially the covered region on the bottom side of the circuit board. For assembly, the covered region on the bottom side of the circuit board is soldered to the covered region on the surface of the thermally clad circuit board.

Abstract: A transformer includes a circuit board, a conductive winding structure and a magnetic core assembly. The circuit board has a trace pattern of a primary winding coil and a first through-hole. The first segment has a first pin and a first hollow portion. The second segment has a first end coupled with the first segment, and a second end formed as a second pin and a second hollow portion. The second segment is folded toward the first segment with respect to a folding line such that the first hollow portion and the second hollow portion are aligned with each other to define a second through-hole. The magnetic core assembly is partially embedded into the first through-hole of the circuit board and the second through-hole of the conductive winding structure.