Planar Type Patents (Class 336/232)
  • Patent number: 10177600
    Abstract: A transmitting coil module for wirelessly transmitting power, the transmitting coil module including at least one transmission coil having a hollow portion in a center area thereof; a shield disposed below the at least one transmission coil; and a metal sheet disposed below the shield. Further, the shield includes at least one functional hole in a region corresponding to the hollow portion of the at least one transmission coil.
    Type: Grant
    Filed: November 7, 2017
    Date of Patent: January 8, 2019
    Assignee: LG INNOTEK CO., LTD.
    Inventor: Sung Hyun Leem
  • Patent number: 10134518
    Abstract: Radio frequency (RF) transmission line transformers are disclosed. Unlike conventional transformers that employ magnetic cores that transmit energy from input to output through magnetic flux linkages, the embodiments of the RF transmission line transformer disclosed herein transfer energy by configuring transformer coils as balanced transmission lines. More specifically, the RF transmission line transformers have a primary transformer coil that forms at least one primary winding and a secondary transformer coil that forms at least a pair of secondary windings. The primary winding of the primary transformer coil is disposed between the pair of secondary windings so that the primary winding forms a different balanced transmission line with each one of the pair of secondary windings. This results in greater bandwidth and higher transformer power efficiency (TPE) at RF frequencies.
    Type: Grant
    Filed: June 15, 2012
    Date of Patent: November 20, 2018
    Assignee: Qorvo US, Inc.
    Inventors: Michael F. Zybura, Toshiaki Moriuchi
  • Patent number: 10096422
    Abstract: One object is to reduce, in a common mode choke coil having three coil conductors, a deviation in stray capacities generated between the coil conductors. A common mode choke coil according to one embodiment of the present invention includes a first coil conductor, a second coil conductor, and a third coil conductor. In said embodiment, the first coil conductor, the second coil conductor, and the third coil conductor extend parallel with each other in a first region in plan view as seen from an axial direction along the coil axis. In said embodiment, in the first region, when seen in a cross section cut along a plane including the coil axis, in an n-th turn, an arranging order of the first coil conductor, the second coil conductor, and the third coil conductor from an inner side in a radial direction thereof is inverted from that in an n+1th turn.
    Type: Grant
    Filed: March 17, 2017
    Date of Patent: October 9, 2018
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Akira Fukushima, Kenichiro Nogi, Masayuki Shimizu, Akihiro Hoshino
  • Patent number: 10062500
    Abstract: One object is to reduce, in a common mode choke coil having three coil conductors, a deviation in stray capacities generated between the coil conductors. A common mode choke coil according to one embodiment of the present invention includes a first coil conductor, a second coil conductor, and a third coil conductor. In said embodiment, the first coil conductor, the second coil conductor, and the third coil conductor extend parallel with each other in a first region in plan view as seen from an axial direction along the coil axis. In said embodiment, in the first region, when seen in a cross section cut along a plane including the coil axis, in an n-th turn, an arranging order of the first coil conductor, the second coil conductor, and the third coil conductor from an inner side in a radial direction thereof is inverted from that in an n+1th turn.
    Type: Grant
    Filed: March 17, 2017
    Date of Patent: August 28, 2018
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Akira Fukushima, Kenichiro Nogi, Masayuki Shimizu, Akihiro Hoshino
  • Patent number: 9831026
    Abstract: A transformer structure includes at least three sections, each corresponding to metal layers of an integrated circuit. A first section of the at least three sections is electrically coupled to a third section with a second section disposed between the first and third sections. The at least three sections includes inductor coils, all of which are wound in a same direction and voltage phase starting at an outer terminal and continuing to an inner terminal of each inductor coil. At least one radial wiring channel passes through a portion of a coil in one of the three sections to provide an external connection to an internal terminal of the coil in at least one of the three sections.
    Type: Grant
    Filed: July 24, 2013
    Date of Patent: November 28, 2017
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Robert L. Barry, Venkata Nr. Vanukuru
  • Patent number: 9595383
    Abstract: A wireless charging coil PCB structure includes a first coil disposed on a first layer of PCB, where a center or peripheral of the first coil is a first non-coil region; a second coil disposed on a second layer of PCB, where a center or peripheral of the second coil is a second non-coil region; first conductive wires on the first non-coil region; and second conductive wires on the second non-coil region. Electric contacts are arranged between the first conductor and the second coil, and electrically connected in parallel to the first conductive wires and the portion of the second coil. Electric contacts are arranged between the second conductor and the first coil, and electrically connected in parallel to the second conductive wires and the portion of the first coil. The amount of charge is increased in the coil and resistance is reduced to overcome proximity effect.
    Type: Grant
    Filed: January 26, 2015
    Date of Patent: March 14, 2017
    Assignee: TDK TAIWAN CORPORATION
    Inventors: Feng-Lung Chien, Takahiro Oishi, Chris T Burket, Chao-Neen Chang, Alan Wu
  • Patent number: 9558881
    Abstract: A surface mount power inductor includes a preformed conductive winding clip and first and second-shaped core pieces. The core pieces may be configured to reduce unbalanced force experienced in the power inductor in certain types of power management circuitry. Reduction in the unbalanced force reduces vibration of the power inductor in use, and in turn reduces acoustic noise as the power inductor operates.
    Type: Grant
    Filed: March 18, 2014
    Date of Patent: January 31, 2017
    Assignee: COOPER TECHNOLOGIES COMPANY
    Inventors: Zhuomin Liu, Robert James Bogert
  • Patent number: 9553361
    Abstract: The invention relates to a balanced antenna system comprising a radiator connected via a matching circuit to a balun. In certain embodiments, the radiator comprises a first radiating element and a second radiating element and the matching circuit comprises a first impedance-matching circuit connected to the first radiating element and a second impedance-matching circuit connected to the second radiating element. The first and second matching circuits may be identical and are connected through the balun to a single port. To minimize the component count, the design of the matching circuit and balun is co-optimized.
    Type: Grant
    Filed: November 11, 2011
    Date of Patent: January 24, 2017
    Assignee: SMART ANTENNA TECHNOLOGIES LTD
    Inventors: Zhen Hua Sampson Hu, Peter Hall
  • Patent number: 9502829
    Abstract: An electrical connector (500) includes a transformer (100) including a magnetic core (3), a first wire group (1), and a second wire group (2). The magnetic core has a left half (31), a right half (32), and an opening (30). The first and second wire groups each have four wires with different colors. Each wire has a first end, a second end, and a central portion. The central portion of the first wire group is only wound around the left half. The central portion of the second wire group is only wound around the right half.
    Type: Grant
    Filed: August 8, 2013
    Date of Patent: November 22, 2016
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Huan Chen
  • Patent number: 9472608
    Abstract: Disclosed herein is a chip inductor. The chip inductor according to the present invention includes a substrate on which a through-hole is formed, a conductive coil that is formed on the substrate, an upper resin composite magnetic layer that is filled to surround the conductive coil so that a core is formed on a center portion of the substrate, a lower resin composite magnetic layer that is formed on a bottom portion of the substrate, and an external electrode that is formed on both sides of the upper and lower resin composite magnetic layers.
    Type: Grant
    Filed: May 31, 2013
    Date of Patent: October 18, 2016
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD
    Inventors: Hwan Soo Lee, Hye Yeon Cha, Jung Min Park, Kang Heon Hur, Moon Soo Park
  • Patent number: 9225050
    Abstract: A wideband high frequency bandpass filter is disclosed, which includes an open-circuit resonator structure and a short-circuit resonator structure. The open-circuit resonator has a signal transmission strip line and a T-shaped strip line. Both ends of the signal transmission strip line are bent toward to opposite ends of the T-shaped strip line respectively, so as to form gaps in the open-circuit resonator. The open-circuit resonator structure and the short-circuit resonator structure are coupled under the resonant mode, thereby achieving a bandpass filtering at 60 GHz.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: December 29, 2015
    Assignee: NATIONAL TSING HUA UNIVERSITY
    Inventors: Ta-Jen Yen, Ruei-Han Jiang, Tsung-Yu Huang, Ai-Ping Yen
  • Patent number: 9171663
    Abstract: An integrated circuit transformer structure includes at least two conductor groups stacked in parallel in different layers. A first spiral track is formed in the at least two conductor groups, the first spiral track includes first turns of a first radius within each of the at least two conductor groups, and second turns of a second radius within each of the at least two conductor groups, the first and second turns being electrically connected. A second spiral track is formed in the at least two conductor groups, the second spiral track including a plurality of adjacent turns of one or more radii within each of the at least two conductor groups and disposed in a same plane between the first and second turns in each of the at least two conductor groups.
    Type: Grant
    Filed: July 25, 2013
    Date of Patent: October 27, 2015
    Assignee: GLOBALFOUNDRIES U.S. 2 LLC
    Inventors: Robert L. Barry, Robert A. Groves, Venkata Nr. Vanukuru
  • Publication number: 20150145635
    Abstract: A wireless charging coil is provided herein. More specifically, provided herein is a wireless charging coil comprising a first stamped coil having a first spiral trace, the first spiral trace defining a first space between windings, and a second stamped coil having a second spiral trace, the second spiral trace defining a second space between windings, the first stamped coil and second stamped coil in co-planar relation, the first stamped coil positioned within the second space of the second stamped coil, and the second stamped coil positioned within the first space of the first stamped coil, the first and second coils electronically connected and an adhesive covering and surrounding the first stamped coil and the second stamped coil to bond the coils together and to insulate the coils.
    Type: Application
    Filed: November 25, 2014
    Publication date: May 28, 2015
    Applicant: A.K. Stamping Company, Inc.
    Inventors: Arthur Kurz, Bernard Duetsch, Joshua Kurz
  • Publication number: 20150145634
    Abstract: A wireless charging coil is provided herein. The wireless charging coil comprising a first stamped coil having a first spiral trace, the first spiral trace defining a first space between windings, and a second stamped coil having a second spiral trace, the second spiral trace defining a second space between windings, wherein the first stamped coil and second stamped coil are planar to and interconnected with one another, such that the first stamped coil is positioned within the second space of the second stamped coil, and the second stamped coil is positioned within the first space of the first stamped coil.
    Type: Application
    Filed: August 27, 2014
    Publication date: May 28, 2015
    Applicant: A.K. Stamping Company, Inc.
    Inventors: Arthur Kurz, Bernard Duetsch, Joshua Kurz
  • Patent number: 9035738
    Abstract: Disclosed herein is a multilayer inductor, manufactured by stacking laminates each including: a substrate having internal electrode coil patterns formed thereon; and a magnetic substance filling the substrate on which the internal electrode coil patterns are formed, wherein the substrate is formed by using a composition including a magnetic material, so that, when the substrate is placed in the middle of the electrode circuit patterns at the time of manufacturing a power inductor, the substrate can be utilized as a gap material, and thus the thickness of an inductor chip can be minimized, and, in addition, the magnetic material is included in the substrate forming composition, thereby improving magnetic characteristics, and the liquid crystal oligomer and the nanoclay are added to the composition, to thereby increase insulating property between magnetic metals, thereby raising inductance, and thus dimensional stability and physical hardness of the structure can be secured.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: May 19, 2015
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sa Yong Lee, Jin Young Kim, Keun Yong Lee, Geum Hee Yun, Moon Soo Park
  • Patent number: 9035737
    Abstract: Embodiments of the present invention provide novel techniques for creating a high speed transformer such as a pulse transformer. In particular, a secondary coil of the high speed transformer may include a single turn. The use of a single turn secondary coil simplifies the design and manufacture of the transformer and aids in more efficient inspections. Further, the single turn secondary coil transformer may reduce the number of vias used to interconnect the components of the transformer. Additionally, the embodiments described herein may significantly improve voltage isolation by single turn coils, and eliminate vias between board layers.
    Type: Grant
    Filed: September 30, 2010
    Date of Patent: May 19, 2015
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Ravi Nanayakkara, Jeffrey R. Annis, Douglas J. Bader, Randall S. Langer
  • Patent number: 9019065
    Abstract: Integrated inductive device comprising a central loop arranged between two outer loops mutually coupled to the central loop so as to form two patterns roughly in the form of an eight having a common portion corresponding to said central loop.
    Type: Grant
    Filed: September 7, 2010
    Date of Patent: April 28, 2015
    Assignee: STMicroelectronics SA
    Inventor: Frederic Gianesello
  • Patent number: 9019057
    Abstract: Disclosed herein are various embodiments of coil transducers and galvanic isolators configured to provide high voltage isolation and high voltage breakdown performance characteristics in small packages. A coil transducer is provided across which data or power signals may be transmitted and received by primary and secondary coils disposed on opposing sides thereof without high voltage breakdowns occurring therebetween. At least portions of the coil transducer are formed of an electrically insulating, non-metallic, non-semiconductor, low dielectric loss material. Circuits are disclosed herein that permit high speed data signals to be transmitted through the coil transducer and faithfully and accurately reconstructed on the opposing side thereof. The coil transducer may be formed in a small package using, by way of example, printed circuit board, CMOS and other fabrication and packaging processes.
    Type: Grant
    Filed: March 31, 2008
    Date of Patent: April 28, 2015
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Julie E. Fouquet, Gek Yong Ng, Richard Baumgartner, Gary R. Trott
  • Patent number: 9013259
    Abstract: A multi-phase coupled inductor includes a magnetic core formed of a powder magnetic material and first, second, third, and fourth terminals. The coupled inductor further includes a first winding forming at least one turn and at least partially embedded in the core and a second winding forming at least one turn and at least partially embedded in the core. The first winding is electrically coupled between the first and second terminals, and the second winding electrically is coupled between the third and fourth terminals. The second winding is at least partially physically separated from the first winding within the magnetic core. The multi-phase coupled inductor is, for example, used in a power supply.
    Type: Grant
    Filed: May 24, 2010
    Date of Patent: April 21, 2015
    Assignee: Volterra Semiconductor Corporation
    Inventor: Alexandr Ikriannikov
  • Patent number: 9013262
    Abstract: A coil component includes: a bar-like core; and a winding part formed of a conducting wire that is wound in a plurality of layers around the outer periphery of the core according to a solenoidal winding method. Winding collapse preventing shifts D1 to D4 each corresponding to a plurality of turns between an end part of a lower winding layer and an end part of an upper winding layer are respectively set to both end parts in the winding width direction of winding layers of the winding part. In transitioning from the lower winding layer to the upper winding layer, the conducting wire is turned back from the end part of the lower winding layer, and is obliquely wound in a small number of turns across each winding collapse preventing shift corresponding to the plurality of turns, and dense winding of the upper winding layer is started.
    Type: Grant
    Filed: December 3, 2012
    Date of Patent: April 21, 2015
    Assignee: Sumida Corporation
    Inventors: Yasunori Morimoto, Masakazu Fukuoka
  • Patent number: 9013261
    Abstract: The present disclosure provides a high-power variable inductor and a filter employing the same. A provided variable inductor comprises a first inductor and a second inductor. The first inductor is connected to a first input terminal and to a first output terminal of a two-port circuit. The second inductor is connected to a second input terminal and to a second output terminal of the two-port circuit. The first inductor and the second inductor are symmetrical to each other and jointly surround an adjustable area for varying an inductance of the variable inductor.
    Type: Grant
    Filed: December 3, 2013
    Date of Patent: April 21, 2015
    Assignee: PSTEK Co., Ltd.
    Inventor: Jae Taek Lee
  • Patent number: 9007160
    Abstract: A laminated inductor includes a laminate constituted by multiple insulator layers, and a coil conductor formed in a spiral shape inside the laminate; wherein the coil conductor has conductor patterns formed on the insulator layers, and via hole conductors that penetrate through the insulator layers and electrically connect the multiple conductor patterns; wherein conductor patterns formed on some insulator layers each represent a C-shaped pattern that includes the four corners and has an open part on one side, of a roughly rectangular shape, while a conductor pattern formed on other insulator layer(s) represents a line-shaped pattern corresponding to the open part of one side of the aforementioned C-shaped pattern of the roughly rectangular shape; and wherein an insulator layer on which the C-shaped pattern is formed, and insulator layer(s) on which the line-shaped pattern is formed, adjoin each other at least in one part of the laminate.
    Type: Grant
    Filed: January 30, 2013
    Date of Patent: April 14, 2015
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Ichirou Yokoyama, Taisuke Suzuki, Yasuyuki Taki, Kazuhiko Oyama
  • Patent number: 9007159
    Abstract: A coil-type electronic component having a coil inside or on the surface of a base material is characterized in that the base material of the coil-type electronic component is constituted by a group of soft magnetic alloy grains inter-bonded via oxide layers, multiple crystal grains are present in each soft magnetic alloy grain, and the oxide layers preferably have a two-layer structure whose outer layer is thicker than the inner layer.
    Type: Grant
    Filed: December 7, 2012
    Date of Patent: April 14, 2015
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Masahiro Hachiya, Atsushi Tanada, Kenji Otake, Kiyoshi Tanaka, Tetsuyuki Suzuki
  • Patent number: 8997333
    Abstract: A method of manufacturing an inductor includes a lamination step, a division step, a firing step, and a plating step. In the lamination step, a laminate including an insulator, a coil body, and external electrodes is formed. That is, in the lamination step, insulating layers having wide filling conductors, insulating layers having narrow filling conductors, and conductor patterns having external electrode patterns are laminated. As a result, the conductor patterns form the coil body, and the wide filling conductors, the narrow filling conductors, and the external electrode patterns form the external electrodes. The narrow filling conductors have a width that is less than the widths of the wide filling conductors and the external electrode patterns, and recesses and projections are provided in the external electrodes.
    Type: Grant
    Filed: May 21, 2012
    Date of Patent: April 7, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Kazuhiko Yamano
  • Patent number: 9000876
    Abstract: An inductor device and method of forming the inductor device are provided. In some embodiments the inductor device includes a post passivation interconnect (PPI) layer disposed and an under bump metallization (UBM) layer, each disposed over a substrate. The PPI layer forms a coil and dummy pads. The dummy pads are disposed around a substantial portion of the coil to shield the coil from electromagnetic interference. A first portion of the UBM layer is electrically coupled to the coil and configured to interface with an electrical coupling member.
    Type: Grant
    Filed: March 13, 2012
    Date of Patent: April 7, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo, Jie Chen, Ying-Ju Chen, Tsung-Yuan Yu
  • Patent number: 8981889
    Abstract: Disclosed herein is a common mode filter with an ESD protection pattern built therein. The common mode filter includes a base substrate that is made of an insulating material, a first insulating layer that is formed on the base substrate, a coil-shaped internal electrode that is formed on the first insulating layer, a second insulating layer that is formed on the internal electrode, a first external electrode terminal that is formed on the second insulating layer, a first ferrite resin layer that is formed on the second insulating layer and receives the first external electrode terminal, an ESD protection pattern that is formed on the first external electrode terminal, a second external electrode terminal that is formed on the ESD protection pattern, and a second ferrite resin layer that is formed on the first ferrite resin layer and receives the second external electrode terminal.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: March 17, 2015
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Young Seuck Yoo, Kang Heon Hur, Jun Hee Bae, Yong Suk Kim, Sang Moon Lee, Won Chul Sim, Young Do Kweon, Sung Kwon Wi
  • Patent number: 8981526
    Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a first inductor formed on a first substrate; a second inductor formed on a second substrate and conductively coupled with the first inductor as a transformer; and a plurality of micro-bump features configured between the first and second substrates. The plurality of micro-bump features include a magnetic material having a relative permeability substantially greater than one and are configured to enhance coupling between the first and second inductors.
    Type: Grant
    Filed: December 16, 2013
    Date of Patent: March 17, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsiao-Tsung Yen, Yu-Ling Lin, Ying-Ta Lu, Huan-Neng Chen, Ho-Hsiang Chen
  • Patent number: 8975997
    Abstract: In a planar coil element, the quantitative ratio of inclined particles to total particles of a first metal magnetic powder contained in a metal magnetic powder-containing resin provided in a through hole of a coil unit is higher than the quantitative ratio of inclined particles to total particles of the first metal magnetic powder contained in the metal magnetic powder-containing resin provided in other than the through hole, and many of particles of the first metal magnetic powder in the magnetic core are inclined particles whose major axes are inclined with respect to the thickness direction and the planar direction of a substrate. Therefore, the planar coil element has improved strength as compared to a planar coil element shown in FIG. 9A and has improved magnetic permeability as compared to a planar coil element shown in FIG. 9B.
    Type: Grant
    Filed: March 19, 2013
    Date of Patent: March 10, 2015
    Assignee: TDK Corporation
    Inventors: Kyohei Tonoyama, Makoto Morita, Tomokazu Ito, Hitoshi Ohkubo, Manabu Ohta, Yoshihiro Maeda, Yuuya Kaname, Hideharu Moro
  • Patent number: 8975999
    Abstract: Disclosed is a transformer using a symmetrical printing pattern which includes: a substrate; a plurality of first printing lines printed at predetermined distances on the substrate; a plurality of second printing lines printed at predetermined distances on the substrate; first bonding wires connecting the first printing lines; and second bonding wires connecting the second printing lines, in which the first printing lines and the second printing lines are printed in a symmetrical printing pattern, respectively, on the substrate, and the first bonding wires and the second bonding wires are formed symmetrically, respectively.
    Type: Grant
    Filed: November 7, 2011
    Date of Patent: March 10, 2015
    Assignee: Soongsil University Research Consortium Techno-Park
    Inventors: Byung Joo Kang, Sung Hun Ahn, Ho Yong Hwang, Chang Kun Park
  • Patent number: 8975996
    Abstract: Provided is an electronic component that can suppress the occurrence of disconnections between line conductor layers and via hole conductors and a method of manufacturing the electronic component. A multilayer body is formed by stacking insulating layers. A conductor layer is provided on a first insulating layer. A line conductor layer is provided on a second insulating layer that is provided on an upper side of the first insulating layer in a stacking (z-axis) direction. A via hole conductor connects an end portion of the line conductor layer to the conductor layer and extends through the second insulating layer in the z-axis direction. In the via hole conductor, a connection surface connected to the line conductor layer is formed of a circular portion and a protrusion. The protrusion protrudes from the circular portion in the x-axis direction in which the line conductor layer extends from the end portion.
    Type: Grant
    Filed: February 13, 2013
    Date of Patent: March 10, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Satoki Sakai, Keishiro Amaya, Eita Tamezawa
  • Patent number: 8970314
    Abstract: With some embodiments, a VCO (voltage controlled oscillator) operates at an integer multiple (N) above a desired transmission frequency. In accordance with one embodiment, a chip is provided with a VCO to generate a signal and a frequency dividing circuit to provide a reduced frequency version of the signal to a transmit mixer. The transmit mixer is followed by a power amplifier that is on the same die as the VCO. The power amplifier is to generate an OFDM output transmission.
    Type: Grant
    Filed: April 27, 2012
    Date of Patent: March 3, 2015
    Assignee: Intel Corporation
    Inventors: Pankaj Goyal, Christopher Hull
  • Patent number: 8963671
    Abstract: A semiconductor transformer includes a first coil inductor and a second coil inductor. The first coil inductor has a first port, a second port and a first coil inductor wall, the first coil inductor wall having a height substantially equal to a thickness of the substrate. The second coil inductor has a third port, a first extension wall connected to the third port, a fourth port, a second extension wall connected to the fourth port and a second coil inductor wall.
    Type: Grant
    Filed: August 31, 2012
    Date of Patent: February 24, 2015
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Chi-Han Chen, Pao-Nan Lee, Chi Tsung Chiu, Chien Hua Chen
  • Patent number: 8963675
    Abstract: A method for fabricating a carrier with a three-dimensional inductor comprises the steps of providing a substrate having a protective layer; forming a first photoresist layer on the protective layer; patterning the first photoresist layer to form a second opening and a plurality of disposing slots; forming a first metal layer in second opening and disposing slots; removing the first photoresist layer; forming a first dielectric layer on the protective layer; forming a second photoresist layer on the first dielectric layer; patterning the second photoresist layer to form a plurality of slots; forming a second metal layer in slots to form a plurality of inductive portions; removing the second photoresist layer; forming a second dielectric layer on the first dielectric layer; forming a third photoresist layer on the second dielectric layer; patterning the third photoresist layer to form a plurality of slots; and forming a third metal layer in slots.
    Type: Grant
    Filed: October 4, 2012
    Date of Patent: February 24, 2015
    Assignee: Chipbond Technology Corporation
    Inventors: Chih-Ming Kuo, You-Ming Hsu
  • Patent number: 8963676
    Abstract: A configurable transformer module includes a primary printed circuit board, one or more secondary printed circuit boards, and one or more interface connectors. The primary PCB has planar primary windings formed thereon and openings for accommodating a planar transformer core. Each of the one or more secondary PCB has planar secondary windings and an opening for accommodating the planar transformer core. Some of the secondary PCB has mating terminals formed thereon. The planar secondary windings on a respective secondary printed circuit board are configured by electrical connections provided at a respective interface connector to realize a given transformer turns ratio between the respective secondary printed circuit board and the primary printed circuit board.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: February 24, 2015
    Assignee: XP Power Limited
    Inventor: Kevin P. Hoang
  • Patent number: 8963672
    Abstract: This wiring board is provided with an insulating core substrate, a first conductor pattern, a second conductor pattern, and a conductive material. The first conductor pattern and the second conductor pattern are adhered to the insulating core substrate. The second conductor pattern has a first surface and a second surface. The second conductor pattern has a concavity and a through-hole. The opening of the concavity that opens to the first surface and the opening of the through hole that opens to the first surface are interconnected to each other. The first conductor pattern is positioned at the opening of the concavity. The first conductor pattern and the second conductor pattern are electrically connected by means of the conductive material, which fills from the opening of the through hole that opens to the second surface.
    Type: Grant
    Filed: June 21, 2012
    Date of Patent: February 24, 2015
    Assignee: Kabushiki Kaisha Toyota Jidoshokki
    Inventors: Hiroaki Asano, Yasuhiro Koike, Kiminori Ozaki, Hitoshi Shimadu, Tetsuya Furuta, Masao Miyake, Takahiro Hayakawa, Tomoaki Asai, Ryou Yamauchi
  • Patent number: 8964410
    Abstract: A transformer has two magnetic cores, at least one primary winding unit mounted in the magnetic cores, at least one secondary winding unit mounted in the magnetic cores and two rectifying circuit boards externally mounted beside the magnetic cores. An AC voltage output from the secondary winding unit is transmitted to and rectified by the rectifying circuit board. Therefore, the size of the transformer is compact, and heat energy generated by electronic elements mounted on the rectifying circuit board is effectively dissipated to maintain normal operation of the transformer. Further, since the transmission path from the secondary winding unit to the rectifying circuit board is short, energy loss is reasonably reduced when the transformer is operated under a high frequency situation or a larger current mode.
    Type: Grant
    Filed: December 6, 2012
    Date of Patent: February 24, 2015
    Assignee: Acbel Polytech Inc.
    Inventors: Shun-Te Chang, Chien-Hua Wu, Chia-An Yeh, Hsiang-Yu Hung
  • Patent number: 8956486
    Abstract: In a manufacturing method for a monolithic ceramic electronic component, a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block are spaced apart from each other and then tumbled, thereby uniformly making the side surface of each of the green chips an open surface. Thereafter, an adhesive is applied to the side surface. Then, by placing a side surface ceramic green sheet on an affixation elastic body, and pressing the side surface of the green chips against the side surface ceramic green sheet, the side surface ceramic green sheet is punched and stuck to the side surface.
    Type: Grant
    Filed: August 29, 2013
    Date of Patent: February 17, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Togo Matsui, Minoru Dooka, Hiroyoshi Takashima, Kenichi Okajima
  • Patent number: 8947190
    Abstract: The present invention relates to a planar transformer, the transformer including a core provided to induce formation of a magnetic field, a bobbin coupled to a core, at least one primary winding interposed between the core and the bobbin to supply a power signal, a first insulation unit provided to the at least one primary winding to insulate the at least one primary winding, at least one secondary winding provided to the first insulation unit and insulated by the first insulation unit to transform the power signal, and a second insulation unit provided to the at least one secondary winding to insulate the at least one secondary winding.
    Type: Grant
    Filed: April 18, 2011
    Date of Patent: February 3, 2015
    Assignee: LG Innotek Co., Ltd.
    Inventor: Minsu Park
  • Patent number: 8928450
    Abstract: A transformer assembly includes a substrate having a first surface and an opposing second surface, a first spiral wound inductive coil formed on the first surface, a second spiral wound inductive coil formed on the first surface, and a third spiral wound inductive coil formed on the first surface, the first, second and third spiral wound inductive coils forming a triple spiral arrangement on the first surface such that the first coil is inductively coupled to the second coil and the third coil. An RF coil including the transformer assembly and a method of fabricating the transformer assembly are also described.
    Type: Grant
    Filed: August 9, 2011
    Date of Patent: January 6, 2015
    Assignee: General Electric Company
    Inventors: Victor Taracila, Fraser Robb, Aleksey Zemskov, Vijayanand Alagappan, Miguel Navarro
  • Patent number: 8928451
    Abstract: Disclosed herein are a common mode filter and a method of manufacturing the same. The common mode filter includes: a primary coil that includes a primary coil body forming a plane in a vortex structure; and a secondary coil that includes a secondary coil body forming a co-plane in the same vortex structure as the primary coil body and forms a 180° rotational symmetry with the primary coil body, having the same length, width, and turn number as the primary coil body. Further, the method of manufacturing a common mode filter is proposed.
    Type: Grant
    Filed: November 6, 2013
    Date of Patent: January 6, 2015
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Won Chul Sim, Chan Yoon, Young Seuck Yoo, Sung Kwon Wi
  • Patent number: 8922313
    Abstract: An induction device includes a casing, a coil retainer, a coil that is disposed in the casing and retained to the coil retainer and a core that is disposed in the casing. The coil extends spirally around the core. The core and the coil retainer are fixed to the casing separately.
    Type: Grant
    Filed: December 16, 2011
    Date of Patent: December 30, 2014
    Assignee: Kabushiki Kaisha Toyota Jidoshokki
    Inventors: Sergey Moiseev, Yasuhiro Koike, Hiroaki Asano, Kiminori Ozaki, Masanori Tsuzaka, Shimpei Sakoda
  • Patent number: 8922317
    Abstract: A coil component including: a magnetic core which is formed by a magnetic material and which has a top surface, a bottom surface facing the top surface and a side surface continuous approximately perpendicularly to the top surface and the bottom surface; a coil which is buried inside the magnetic core and whose end portion protrudes from the side surface of the magnetic core; a flat-shaped terminal which protrudes from the side surface of the magnetic core, is bent toward the bottom surface of the magnetic core and is connected with the end portion of the coil, wherein there is formed an opening portion at a position corresponding to the place which is bent for the flat-shaped terminal from the side surface to the bottom surface of the magnetic core.
    Type: Grant
    Filed: December 4, 2012
    Date of Patent: December 30, 2014
    Assignee: Sumida Corporation
    Inventors: Satoru Yamada, Kazuyuki Kikuchi, Yoshiyuki Tahara
  • Patent number: 8922321
    Abstract: In a power and data transmission method which can transmit power and information (data) simultaneously and contactlessly, and an apparatus therefor, a pair of coil units are magnetically coupled to each other. Each of the coil units has: a power transmission coil configured by a coil which is wound in a plane, and a magnetic shield member which is placed on a rear surface of the coil; and an information transmission coil configured by a coil which is wound in a plane, and a magnetic shield member which is placed on a rear surface of the coil, the coil diameter of the information transmission coil is made different from that of the power transmission coil, and the information transmission coil and the power transmission coil are stacked. Data are transmitted while power is transmitted.
    Type: Grant
    Filed: June 28, 2010
    Date of Patent: December 30, 2014
    Assignees: Aska Electron Co., Ltd., Fujikura Co., Ltd., Yonezawa Electric Wire Co., Ltd.
    Inventor: Konomu Takaishi
  • Patent number: 8922320
    Abstract: The embodiment relates to a transformer. A transformer according to an aspect includes: a first coil assembly including a first core, a first bobbin coupled to the first core, and a first coil provided on the first bobbin; and a second coil assembly coupled to the first coil assembly, and including a second core, a second bobbin coupled to the second core, and a second coil provided on the second bobbin.
    Type: Grant
    Filed: September 13, 2013
    Date of Patent: December 30, 2014
    Assignee: LSIS Co., Ltd.
    Inventors: Jun Seok Eom, Woo Sup Kim
  • Patent number: 8912874
    Abstract: A monolithic ceramic electronic component including coil conductors is capable of reducing the number of stacked ceramic layers without sacrifice of the performance of coils and be capable of increasing the number of turns of the coils without increasing the size in. In the monolithic ceramic electronic component, coil conductors having more than one turn for one ceramic layer are formed. The coil conductors include surface coil conductors that are located along surfaces of sequentially stacked ceramic layers and intra-layer coil conductors that are located inside the ceramic layers so as not to extend beyond the thickness of the individual ceramic layers. The surface coil conductors and the intra-layer coil conductors are connected in series with connecting portions therebetween.
    Type: Grant
    Filed: December 26, 2012
    Date of Patent: December 16, 2014
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Yoshihito Otsubo
  • Patent number: 8907756
    Abstract: Semiconductor packages with air core inductors (ACIs) having metal-density layer units of fractal geometry are described. In an example, an inductor structure includes a stack of metal loops. One or more input terminals is coupled to the stack of metal loops. One or more output terminals is coupled to the stack of metal loops. One or more metal-density layer units is disposed above and over the stack of metal loops. At least one of the metal-density layer units has a fractal geometry.
    Type: Grant
    Filed: June 28, 2012
    Date of Patent: December 9, 2014
    Assignee: Intel Corporation
    Inventor: Miguel Camarena Sainz
  • Patent number: 8904628
    Abstract: Disclosed herein is a method of manufacturing a noise removing filter, including preparing at least one conductive pattern, an insulating layer for covering the at least one conductive pattern, and a lower magnetic body including input/output stud terminals for electrically inputting and outputting electricity to and from the at least one conductive pattern; disposing a recognizable portion on upper surfaces of the input/output stud terminals; disposing an upper magnetic body on the recognizable portion and the insulating layer; polishing the upper magnetic body; and removing the recognizable portion such that a level of an upper surface of the upper magnetic body is higher than levels of the upper surfaces of the input/output stud terminals.
    Type: Grant
    Filed: December 17, 2012
    Date of Patent: December 9, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sang Moon Lee, Sung Kwon Wi, Jeong Bok Kwak, Won Chul Sim, Young Seuck Yoo, Yong Suk Kim
  • Patent number: 8898885
    Abstract: A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency.
    Type: Grant
    Filed: September 15, 2011
    Date of Patent: December 2, 2014
    Assignee: NuCurrent, Inc.
    Inventors: Vinit Singh, Christine A. Frysz, Matthew Geary, Eitan Babcock, Justin Derbas
  • Patent number: 8896405
    Abstract: A coil-type electronic component having a coil inside or on the surface of a base material, characterized in that the base material of the coil-type electronic component is constituted by a group of soft magnetic alloy grains whose main ingredients are iron, silicate and chromium, and that an oxide layer is formed on the surface of each soft magnetic alloy grain, where the oxide layer is produced as a result of oxidization of the grain and has more chromium than the alloy grain, and this oxide layer has a two-layer structure constituted by an inner layer whose main ingredient is chromium oxide and an outer layer whose main ingredient is iron-chromium oxide, and the outer layers of soft magnetic alloy grains are inter-bonded.
    Type: Grant
    Filed: October 26, 2012
    Date of Patent: November 25, 2014
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Masahiro Hachiya, Atsushi Tanada, Kenji Otake, Kiyoshi Tanaka, Tetsuyuki Suzuki
  • Patent number: 8896406
    Abstract: A laminated coil includes a plurality of circular conductive plates in the form of a flat plate, each of the circular conductive plates being laminated via an insulating material in an axis direction. The plurality of circular conductive plates each include a plurality of concentric circular arc parts having different inner diameter and outer diameter from each other, and a connection part interconnecting the plurality of circular arc parts. The plurality of circular conductive plates are arranged such that the connection parts thereof face each other and the circular arc parts thereof are juxtaposed to each other in a radial direction.
    Type: Grant
    Filed: September 12, 2012
    Date of Patent: November 25, 2014
    Assignee: Hitachi Metals, Ltd.
    Inventor: Satoshi Yamamoto