Abstract: An object of the present disclosure is to provide a common mode noise filter that can be used in a high-frequency band. The common mode noise filter of the present disclosure includes first to fifth insulator layers and stacked body in which first to fifth insulator layers are stacked along a vertical direction. The common mode noise filter further includes first spiral conductor and second spiral conductor that are formed inside stacked body and face each other across first insulator layer. The common mode noise filter further includes first pad connected to an inner end of first spiral conductor and second pad connected to an inner end of second spiral conductor. Neither first pad nor second pad overlaps each of first spiral conductor and second spiral conductor in top view.

Abstract: A reactance cancelling radio frequency (RF) circuit array is disclosed. The reactance cancelling RF circuit array includes multiple RF circuits each coupled to one or two adjacent RF circuits by one or two pairs of coupling mediums each having a respective length less than one-quarter wavelength. In one aspect, an RF input signal is first split across the RF circuits and then combined to form an RF output signal. As a result, each RF circuit requires a lower power handling capability to process a portion of the RF input signal. In another aspect, each pair of the coupling mediums can cause reactance cancellation in each reactance-cancelling pair of the RF circuits. By coupling the RF circuits via the coupling mediums and enabling splitting-combining among the RF circuits, it is possible to miniaturize the reactance cancelling RF circuit array for improved performance across a wide frequency spectrum.

Abstract: A circuit board assembly includes a connection circuit board, a near field communication antenna and solders. The connection circuit board includes circuit board pads. The near field communication antenna is attached to the connection circuit board, and the near field communication antenna includes: an antenna coil, antenna pads electrically connected to the antenna coil, and through holes penetrating the antenna pads and disposed opposite to the circuit board pads. The solders are connected to the circuit board pads through the through holes.

Abstract: A planar transformer employing an insulating structure for performance improvement includes: a pair of ferrite cores (110) including an upper core (110-1) and a lower core (110-2); a printed circuit board (120), which is disposed between the pair of ferrite cores (110), one end of which has primary via holes (121) electrically connecting primary coil patterns, and the other end of which has secondary via holes (123) electrically connecting secondary coil patterns; an insulating block (130-1) for receiving one side of the pair of ferrite cores (110); and an insulating base (130-2) disposed in the pair of ferrite cores (110) and fittedly coupled to the insulating block (130-1), wherein the insulating block (130-1) and the insulating base (130-2) receive a given region of the printed circuit board (120) at one side at which the secondary via holes (123) is disposed.

Abstract: A sanitization apparatus includes an excimer lamp, a power converter configured to power the excimer lamp and a controller. The controller is configured to monitor an impedance of the excimer lamp and vary an output voltage waveform of the power converter based upon the impedance.

Abstract: An antenna for transfer of information or energy is described. The antenna includes an electrically conductive first layer having a width in a thickness direction of the antenna and extending longitudinally along a length of the first layer between first and second longitudinal ends of the first layer, and an electrically insulative thermally conductive second layer bonded to the first layer along the length of the first layer. The first and second layers are wound to form a plurality of substantially concentric loops. A width and a length of the second layer are substantially co-extensive with the respective width and length of the first layer so as to expose opposing longitudinal edge surfaces of the first layer along the length of the first layer. Coils and assemblies useful for making coils are also described.

Abstract: An inductor array component including an element body and a first straight wiring line and a second straight wiring line that are arranged on the same plane inside the element body. The element body includes a first region that is located on a first side of the first straight wiring line or the second straight wiring line in a normal direction that is normal to the plane, a second region that is located on a second side of the first straight wiring line or the second straight wiring line in the normal direction that is normal to the plane, and a third region that is located between the first straight wiring line and the second straight wiring line. The greater one out of the magnetoresistance of the first region and the magnetoresistance of the second region is greater than or equal to the magnetoresistance of the third region.

Abstract: An inductor element includes a core including a first core portion and a second core portion that are disposed to face each other in a first direction; and a conductor including a first mounting portion and a second mounting portion that are exposed from the core at a predetermined interval therebetween on one side of a second direction orthogonal to the first direction, and a connecting portion which connects the first mounting portion and the second mounting portion and of which at least a part is interposed between the first core portion and the second core portion. The first mounting portion and the second mounting portion are disposed to overlap both of the first core portion and the second core portion as seen from the second direction.

Abstract: An inductor element includes a core including a first core portion and a second core portion that are disposed to face each other in a first direction; and a conductor including a first mounting portion and a second mounting portion that are exposed from the core at a predetermined interval therebetween on one side of a second direction orthogonal to the first direction, and a connecting portion which connects the first mounting portion and the second mounting portion and of which at least a part is interposed between the first core portion and the second core portion. The first mounting portion and the second mounting portion are disposed to overlap both of the first core portion and the second core portion as seen from the second direction.

Abstract: An Isolating Transmission Line Transformer (ITLT) for use in a data communications system is provided, the transformer comprising: a substantially planar substrate formed of electrically insulative material having opposed first and second surfaces; a first port formed of two separate terminals provided at one part of the substrate; a second port formed of two separate terminals provided at a second part of the substrate; a first conductor connected in series to the first port and arranged as a single loop; a second conductor which is electrically isolated from the first conductor and connected in series to the second port, the second conductor being arranged as a single loop in a substantially opposite orientation to the first conductor; wherein the first and second ports and at least part of the first and second conductors are provided on the substrate surface (s); and a core arranged between the first and second ports to cover the majority of the first and second conductors.

Abstract: An inductor component comprising a first magnetic layer, a spiral wiring disposed on the first magnetic layer, and a second magnetic layer covering the spiral wiring. The first magnetic layer and the second magnetic layer contain a magnetic powder and a resin containing the magnetic powder, and the spiral wiring includes a spiral-shaped first conductor layer and a second conductor layer disposed on the first conductor layer and shaped along the first conductor layer.

Abstract: A common mode choke coil includes an element body formed by stacking a plurality of insulating layers in a height direction, first and second coils that are built into the element body, first and second outer electrodes that are provided on surfaces of the element body so as to face each other in a width direction and are electrically connected to one end and the other end of the first coil, and third and fourth outer electrodes that are provided on surfaces of the element body so as to face each other in the width direction and are electrically connected to one end and the other end of the second coil. When L1 and L2 are the inductances of the first and second coils, 100×|L1?L2|/((L1+L2)/2)?5 at 1 GHz.

Abstract: An induction heating cooker according to the present invention has a top plate on which a heater area indication indicating a mount position of to-be-heated object is formed, and a first coil and a second coil that are formed of an annular coil arranged below the heater area indication of the top plate, the second coil includes a first winding portion extending in a circumferential direction of the first coil, and a second winding portion spaced apart from the first winding portion and extending in the circumferential direction of the first coil, and the distance between the first winding portion and the top plate is different from the distance between the second winding portion and the top plate.

Abstract: Disclosed are embodiments of a transceiver front-end configured for a reduced noise figure (NF). Each of the embodiments includes an antenna, a transmitter branch and a receiver branch all connected to an input/output pad. The transmitter branch is coupled to the input/output pad (and thereby the antenna) by an impedance transformer. Only the receiver branch is selectively electrically connected to the input/output pad (and thereby the antenna) by a switch. A common matching network between the input/output pad and the switch provides both impedance matching and electrostatic discharge protection for the switch and the low noise amplifier, thereby reducing NF. Specific embodiments are disclosed for integration into specific technologies (e.g., fully depleted silicon-on-insulator (FDSOI) technology and fin-type field effect transistor (finFET) technology).

Abstract: Disclosed herein is a coil component that includes a magnetic core having first and second through holes extending in a first direction and arranged in a second direction perpendicular to the first direction, and a conductive plate including first and second body parts inserted respectively through the first and second through holes. The magnetic core includes a middle leg part positioned between the first and second through holes, a first outer leg part positioned on an opposite side to the middle leg part across the first through hole, and a second outer leg part positioned on an opposite side to the middle leg part across the second through hole. Area of each of the first and second outer leg parts defined by the first and second directions is larger than that of the middle leg part.

Abstract: Disclosed herein is a coil component that includes a conductor plate; and a magnetic core comprising a magnetic material having conductivity, the magnetic core having a through hole into which the conductor plate is inserted. The conductor plate includes: a metal element body having a body part positioned inside the through hole and a terminal part positioned outside the through hole; a metal film formed on the terminal part, the metal film comprising a metal material having a lower melting point than the metal element body; and an insulating film formed on a surface of the body part without the metal film interposed.

Abstract: An isolated converter reduced in size compared with a conventional isolated converter and having a high heat dissipation characteristic is provided. The isolated converter includes a multilayer substrate having a first through hole and a magnetic core partially passing through the first through hole. The multilayer substrate includes a first conductor pattern formed at a position overlapping the magnetic core on a second surface when viewed from a direction orthogonal to a first surface, a second conductor pattern formed between the first surface and the second surface at a position overlapping the magnetic core and the first conductor pattern when viewed from the direction orthogonal to the first surface, at least one thermal conductive member formed on the first conductor pattern and having a portion disposed between the multilayer substrate and the magnetic core, and an electric insulating layer electrically insulating the first conductor pattern from the second conductor pattern.

Abstract: A coil module for an induction type power supply system includes a supporting frame, an upper lid and a first wire. The upper lid, disposed on the supporting frame, includes a spiral slot. The first wire is used for being inserted in the spiral slot to form a coil.

Abstract: A transmitting coil module for wirelessly transmitting power, the transmitting coil module including at least one transmission coil having a hollow portion in a center area thereof; a shield disposed below the at least one transmission coil; and a metal sheet disposed below the shield. Further, the shield includes at least one functional hole in a region corresponding to the hollow portion of the at least one transmission coil.

Abstract: Radio frequency (RF) transmission line transformers are disclosed. Unlike conventional transformers that employ magnetic cores that transmit energy from input to output through magnetic flux linkages, the embodiments of the RF transmission line transformer disclosed herein transfer energy by configuring transformer coils as balanced transmission lines. More specifically, the RF transmission line transformers have a primary transformer coil that forms at least one primary winding and a secondary transformer coil that forms at least a pair of secondary windings. The primary winding of the primary transformer coil is disposed between the pair of secondary windings so that the primary winding forms a different balanced transmission line with each one of the pair of secondary windings. This results in greater bandwidth and higher transformer power efficiency (TPE) at RF frequencies.

Abstract: One object is to reduce, in a common mode choke coil having three coil conductors, a deviation in stray capacities generated between the coil conductors. A common mode choke coil according to one embodiment of the present invention includes a first coil conductor, a second coil conductor, and a third coil conductor. In said embodiment, the first coil conductor, the second coil conductor, and the third coil conductor extend parallel with each other in a first region in plan view as seen from an axial direction along the coil axis. In said embodiment, in the first region, when seen in a cross section cut along a plane including the coil axis, in an n-th turn, an arranging order of the first coil conductor, the second coil conductor, and the third coil conductor from an inner side in a radial direction thereof is inverted from that in an n+1th turn.

Abstract: One object is to reduce, in a common mode choke coil having three coil conductors, a deviation in stray capacities generated between the coil conductors. A common mode choke coil according to one embodiment of the present invention includes a first coil conductor, a second coil conductor, and a third coil conductor. In said embodiment, the first coil conductor, the second coil conductor, and the third coil conductor extend parallel with each other in a first region in plan view as seen from an axial direction along the coil axis. In said embodiment, in the first region, when seen in a cross section cut along a plane including the coil axis, in an n-th turn, an arranging order of the first coil conductor, the second coil conductor, and the third coil conductor from an inner side in a radial direction thereof is inverted from that in an n+1th turn.

Abstract: A transformer structure includes at least three sections, each corresponding to metal layers of an integrated circuit. A first section of the at least three sections is electrically coupled to a third section with a second section disposed between the first and third sections. The at least three sections includes inductor coils, all of which are wound in a same direction and voltage phase starting at an outer terminal and continuing to an inner terminal of each inductor coil. At least one radial wiring channel passes through a portion of a coil in one of the three sections to provide an external connection to an internal terminal of the coil in at least one of the three sections.

Abstract: A wireless charging coil PCB structure includes a first coil disposed on a first layer of PCB, where a center or peripheral of the first coil is a first non-coil region; a second coil disposed on a second layer of PCB, where a center or peripheral of the second coil is a second non-coil region; first conductive wires on the first non-coil region; and second conductive wires on the second non-coil region. Electric contacts are arranged between the first conductor and the second coil, and electrically connected in parallel to the first conductive wires and the portion of the second coil. Electric contacts are arranged between the second conductor and the first coil, and electrically connected in parallel to the second conductive wires and the portion of the first coil. The amount of charge is increased in the coil and resistance is reduced to overcome proximity effect.

Abstract: A surface mount power inductor includes a preformed conductive winding clip and first and second-shaped core pieces. The core pieces may be configured to reduce unbalanced force experienced in the power inductor in certain types of power management circuitry. Reduction in the unbalanced force reduces vibration of the power inductor in use, and in turn reduces acoustic noise as the power inductor operates.

Abstract: The invention relates to a balanced antenna system comprising a radiator connected via a matching circuit to a balun. In certain embodiments, the radiator comprises a first radiating element and a second radiating element and the matching circuit comprises a first impedance-matching circuit connected to the first radiating element and a second impedance-matching circuit connected to the second radiating element. The first and second matching circuits may be identical and are connected through the balun to a single port. To minimize the component count, the design of the matching circuit and balun is co-optimized.

Abstract: An electrical connector (500) includes a transformer (100) including a magnetic core (3), a first wire group (1), and a second wire group (2). The magnetic core has a left half (31), a right half (32), and an opening (30). The first and second wire groups each have four wires with different colors. Each wire has a first end, a second end, and a central portion. The central portion of the first wire group is only wound around the left half. The central portion of the second wire group is only wound around the right half.

Abstract: Disclosed herein is a chip inductor. The chip inductor according to the present invention includes a substrate on which a through-hole is formed, a conductive coil that is formed on the substrate, an upper resin composite magnetic layer that is filled to surround the conductive coil so that a core is formed on a center portion of the substrate, a lower resin composite magnetic layer that is formed on a bottom portion of the substrate, and an external electrode that is formed on both sides of the upper and lower resin composite magnetic layers.

Abstract: A wideband high frequency bandpass filter is disclosed, which includes an open-circuit resonator structure and a short-circuit resonator structure. The open-circuit resonator has a signal transmission strip line and a T-shaped strip line. Both ends of the signal transmission strip line are bent toward to opposite ends of the T-shaped strip line respectively, so as to form gaps in the open-circuit resonator. The open-circuit resonator structure and the short-circuit resonator structure are coupled under the resonant mode, thereby achieving a bandpass filtering at 60 GHz.

Abstract: An integrated circuit transformer structure includes at least two conductor groups stacked in parallel in different layers. A first spiral track is formed in the at least two conductor groups, the first spiral track includes first turns of a first radius within each of the at least two conductor groups, and second turns of a second radius within each of the at least two conductor groups, the first and second turns being electrically connected. A second spiral track is formed in the at least two conductor groups, the second spiral track including a plurality of adjacent turns of one or more radii within each of the at least two conductor groups and disposed in a same plane between the first and second turns in each of the at least two conductor groups.

Abstract: A wireless charging coil is provided herein. The wireless charging coil comprising a first stamped coil having a first spiral trace, the first spiral trace defining a first space between windings, and a second stamped coil having a second spiral trace, the second spiral trace defining a second space between windings, wherein the first stamped coil and second stamped coil are planar to and interconnected with one another, such that the first stamped coil is positioned within the second space of the second stamped coil, and the second stamped coil is positioned within the first space of the first stamped coil.

Abstract: A wireless charging coil is provided herein. More specifically, provided herein is a wireless charging coil comprising a first stamped coil having a first spiral trace, the first spiral trace defining a first space between windings, and a second stamped coil having a second spiral trace, the second spiral trace defining a second space between windings, the first stamped coil and second stamped coil in co-planar relation, the first stamped coil positioned within the second space of the second stamped coil, and the second stamped coil positioned within the first space of the first stamped coil, the first and second coils electronically connected and an adhesive covering and surrounding the first stamped coil and the second stamped coil to bond the coils together and to insulate the coils.

Abstract: Embodiments of the present invention provide novel techniques for creating a high speed transformer such as a pulse transformer. In particular, a secondary coil of the high speed transformer may include a single turn. The use of a single turn secondary coil simplifies the design and manufacture of the transformer and aids in more efficient inspections. Further, the single turn secondary coil transformer may reduce the number of vias used to interconnect the components of the transformer. Additionally, the embodiments described herein may significantly improve voltage isolation by single turn coils, and eliminate vias between board layers.

Abstract: Disclosed herein is a multilayer inductor, manufactured by stacking laminates each including: a substrate having internal electrode coil patterns formed thereon; and a magnetic substance filling the substrate on which the internal electrode coil patterns are formed, wherein the substrate is formed by using a composition including a magnetic material, so that, when the substrate is placed in the middle of the electrode circuit patterns at the time of manufacturing a power inductor, the substrate can be utilized as a gap material, and thus the thickness of an inductor chip can be minimized, and, in addition, the magnetic material is included in the substrate forming composition, thereby improving magnetic characteristics, and the liquid crystal oligomer and the nanoclay are added to the composition, to thereby increase insulating property between magnetic metals, thereby raising inductance, and thus dimensional stability and physical hardness of the structure can be secured.

Abstract: Disclosed herein are various embodiments of coil transducers and galvanic isolators configured to provide high voltage isolation and high voltage breakdown performance characteristics in small packages. A coil transducer is provided across which data or power signals may be transmitted and received by primary and secondary coils disposed on opposing sides thereof without high voltage breakdowns occurring therebetween. At least portions of the coil transducer are formed of an electrically insulating, non-metallic, non-semiconductor, low dielectric loss material. Circuits are disclosed herein that permit high speed data signals to be transmitted through the coil transducer and faithfully and accurately reconstructed on the opposing side thereof. The coil transducer may be formed in a small package using, by way of example, printed circuit board, CMOS and other fabrication and packaging processes.

Abstract: Integrated inductive device comprising a central loop arranged between two outer loops mutually coupled to the central loop so as to form two patterns roughly in the form of an eight having a common portion corresponding to said central loop.

Abstract: A multi-phase coupled inductor includes a magnetic core formed of a powder magnetic material and first, second, third, and fourth terminals. The coupled inductor further includes a first winding forming at least one turn and at least partially embedded in the core and a second winding forming at least one turn and at least partially embedded in the core. The first winding is electrically coupled between the first and second terminals, and the second winding electrically is coupled between the third and fourth terminals. The second winding is at least partially physically separated from the first winding within the magnetic core. The multi-phase coupled inductor is, for example, used in a power supply.

Abstract: The present disclosure provides a high-power variable inductor and a filter employing the same. A provided variable inductor comprises a first inductor and a second inductor. The first inductor is connected to a first input terminal and to a first output terminal of a two-port circuit. The second inductor is connected to a second input terminal and to a second output terminal of the two-port circuit. The first inductor and the second inductor are symmetrical to each other and jointly surround an adjustable area for varying an inductance of the variable inductor.

Abstract: A coil component includes: a bar-like core; and a winding part formed of a conducting wire that is wound in a plurality of layers around the outer periphery of the core according to a solenoidal winding method. Winding collapse preventing shifts D1 to D4 each corresponding to a plurality of turns between an end part of a lower winding layer and an end part of an upper winding layer are respectively set to both end parts in the winding width direction of winding layers of the winding part. In transitioning from the lower winding layer to the upper winding layer, the conducting wire is turned back from the end part of the lower winding layer, and is obliquely wound in a small number of turns across each winding collapse preventing shift corresponding to the plurality of turns, and dense winding of the upper winding layer is started.

Abstract: A laminated inductor includes a laminate constituted by multiple insulator layers, and a coil conductor formed in a spiral shape inside the laminate; wherein the coil conductor has conductor patterns formed on the insulator layers, and via hole conductors that penetrate through the insulator layers and electrically connect the multiple conductor patterns; wherein conductor patterns formed on some insulator layers each represent a C-shaped pattern that includes the four corners and has an open part on one side, of a roughly rectangular shape, while a conductor pattern formed on other insulator layer(s) represents a line-shaped pattern corresponding to the open part of one side of the aforementioned C-shaped pattern of the roughly rectangular shape; and wherein an insulator layer on which the C-shaped pattern is formed, and insulator layer(s) on which the line-shaped pattern is formed, adjoin each other at least in one part of the laminate.

Abstract: A coil-type electronic component having a coil inside or on the surface of a base material is characterized in that the base material of the coil-type electronic component is constituted by a group of soft magnetic alloy grains inter-bonded via oxide layers, multiple crystal grains are present in each soft magnetic alloy grain, and the oxide layers preferably have a two-layer structure whose outer layer is thicker than the inner layer.

Abstract: A method of manufacturing an inductor includes a lamination step, a division step, a firing step, and a plating step. In the lamination step, a laminate including an insulator, a coil body, and external electrodes is formed. That is, in the lamination step, insulating layers having wide filling conductors, insulating layers having narrow filling conductors, and conductor patterns having external electrode patterns are laminated. As a result, the conductor patterns form the coil body, and the wide filling conductors, the narrow filling conductors, and the external electrode patterns form the external electrodes. The narrow filling conductors have a width that is less than the widths of the wide filling conductors and the external electrode patterns, and recesses and projections are provided in the external electrodes.

Abstract: An inductor device and method of forming the inductor device are provided. In some embodiments the inductor device includes a post passivation interconnect (PPI) layer disposed and an under bump metallization (UBM) layer, each disposed over a substrate. The PPI layer forms a coil and dummy pads. The dummy pads are disposed around a substantial portion of the coil to shield the coil from electromagnetic interference. A first portion of the UBM layer is electrically coupled to the coil and configured to interface with an electrical coupling member.

Abstract: Disclosed herein is a common mode filter with an ESD protection pattern built therein. The common mode filter includes a base substrate that is made of an insulating material, a first insulating layer that is formed on the base substrate, a coil-shaped internal electrode that is formed on the first insulating layer, a second insulating layer that is formed on the internal electrode, a first external electrode terminal that is formed on the second insulating layer, a first ferrite resin layer that is formed on the second insulating layer and receives the first external electrode terminal, an ESD protection pattern that is formed on the first external electrode terminal, a second external electrode terminal that is formed on the ESD protection pattern, and a second ferrite resin layer that is formed on the first ferrite resin layer and receives the second external electrode terminal.

Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a first inductor formed on a first substrate; a second inductor formed on a second substrate and conductively coupled with the first inductor as a transformer; and a plurality of micro-bump features configured between the first and second substrates. The plurality of micro-bump features include a magnetic material having a relative permeability substantially greater than one and are configured to enhance coupling between the first and second inductors.

Abstract: Disclosed is a transformer using a symmetrical printing pattern which includes: a substrate; a plurality of first printing lines printed at predetermined distances on the substrate; a plurality of second printing lines printed at predetermined distances on the substrate; first bonding wires connecting the first printing lines; and second bonding wires connecting the second printing lines, in which the first printing lines and the second printing lines are printed in a symmetrical printing pattern, respectively, on the substrate, and the first bonding wires and the second bonding wires are formed symmetrically, respectively.

Abstract: In a planar coil element, the quantitative ratio of inclined particles to total particles of a first metal magnetic powder contained in a metal magnetic powder-containing resin provided in a through hole of a coil unit is higher than the quantitative ratio of inclined particles to total particles of the first metal magnetic powder contained in the metal magnetic powder-containing resin provided in other than the through hole, and many of particles of the first metal magnetic powder in the magnetic core are inclined particles whose major axes are inclined with respect to the thickness direction and the planar direction of a substrate. Therefore, the planar coil element has improved strength as compared to a planar coil element shown in FIG. 9A and has improved magnetic permeability as compared to a planar coil element shown in FIG. 9B.

Abstract: Provided is an electronic component that can suppress the occurrence of disconnections between line conductor layers and via hole conductors and a method of manufacturing the electronic component. A multilayer body is formed by stacking insulating layers. A conductor layer is provided on a first insulating layer. A line conductor layer is provided on a second insulating layer that is provided on an upper side of the first insulating layer in a stacking (z-axis) direction. A via hole conductor connects an end portion of the line conductor layer to the conductor layer and extends through the second insulating layer in the z-axis direction. In the via hole conductor, a connection surface connected to the line conductor layer is formed of a circular portion and a protrusion. The protrusion protrudes from the circular portion in the x-axis direction in which the line conductor layer extends from the end portion.

Abstract: With some embodiments, a VCO (voltage controlled oscillator) operates at an integer multiple (N) above a desired transmission frequency. In accordance with one embodiment, a chip is provided with a VCO to generate a signal and a frequency dividing circuit to provide a reduced frequency version of the signal to a transmit mixer. The transmit mixer is followed by a power amplifier that is on the same die as the VCO. The power amplifier is to generate an OFDM output transmission.

Abstract: A method for fabricating a carrier with a three-dimensional inductor comprises the steps of providing a substrate having a protective layer; forming a first photoresist layer on the protective layer; patterning the first photoresist layer to form a second opening and a plurality of disposing slots; forming a first metal layer in second opening and disposing slots; removing the first photoresist layer; forming a first dielectric layer on the protective layer; forming a second photoresist layer on the first dielectric layer; patterning the second photoresist layer to form a plurality of slots; forming a second metal layer in slots to form a plurality of inductive portions; removing the second photoresist layer; forming a second dielectric layer on the first dielectric layer; forming a third photoresist layer on the second dielectric layer; patterning the third photoresist layer to form a plurality of slots; and forming a third metal layer in slots.