Abstract: The present invention relates to a planar transformer, the transformer including a core provided to induce formation of a magnetic field, a bobbin coupled to a core, at least one primary winding interposed between the core and the bobbin to supply a power signal, a first insulation unit provided to the at least one primary winding to insulate the at least one primary winding, at least one secondary winding provided to the first insulation unit and insulated by the first insulation unit to transform the power signal, and a second insulation unit provided to the at least one secondary winding to insulate the at least one secondary winding.

Abstract: A transformer assembly includes a substrate having a first surface and an opposing second surface, a first spiral wound inductive coil formed on the first surface, a second spiral wound inductive coil formed on the first surface, and a third spiral wound inductive coil formed on the first surface, the first, second and third spiral wound inductive coils forming a triple spiral arrangement on the first surface such that the first coil is inductively coupled to the second coil and the third coil. An RF coil including the transformer assembly and a method of fabricating the transformer assembly are also described.

Abstract: Disclosed herein are a common mode filter and a method of manufacturing the same. The common mode filter includes: a primary coil that includes a primary coil body forming a plane in a vortex structure; and a secondary coil that includes a secondary coil body forming a co-plane in the same vortex structure as the primary coil body and forms a 180° rotational symmetry with the primary coil body, having the same length, width, and turn number as the primary coil body. Further, the method of manufacturing a common mode filter is proposed.

Abstract: The embodiment relates to a transformer. A transformer according to an aspect includes: a first coil assembly including a first core, a first bobbin coupled to the first core, and a first coil provided on the first bobbin; and a second coil assembly coupled to the first coil assembly, and including a second core, a second bobbin coupled to the second core, and a second coil provided on the second bobbin.

Abstract: An induction device includes a casing, a coil retainer, a coil that is disposed in the casing and retained to the coil retainer and a core that is disposed in the casing. The coil extends spirally around the core. The core and the coil retainer are fixed to the casing separately.

Abstract: A coil component including: a magnetic core which is formed by a magnetic material and which has a top surface, a bottom surface facing the top surface and a side surface continuous approximately perpendicularly to the top surface and the bottom surface; a coil which is buried inside the magnetic core and whose end portion protrudes from the side surface of the magnetic core; a flat-shaped terminal which protrudes from the side surface of the magnetic core, is bent toward the bottom surface of the magnetic core and is connected with the end portion of the coil, wherein there is formed an opening portion at a position corresponding to the place which is bent for the flat-shaped terminal from the side surface to the bottom surface of the magnetic core.

Abstract: In a power and data transmission method which can transmit power and information (data) simultaneously and contactlessly, and an apparatus therefor, a pair of coil units are magnetically coupled to each other. Each of the coil units has: a power transmission coil configured by a coil which is wound in a plane, and a magnetic shield member which is placed on a rear surface of the coil; and an information transmission coil configured by a coil which is wound in a plane, and a magnetic shield member which is placed on a rear surface of the coil, the coil diameter of the information transmission coil is made different from that of the power transmission coil, and the information transmission coil and the power transmission coil are stacked. Data are transmitted while power is transmitted.

Abstract: A monolithic ceramic electronic component including coil conductors is capable of reducing the number of stacked ceramic layers without sacrifice of the performance of coils and be capable of increasing the number of turns of the coils without increasing the size in. In the monolithic ceramic electronic component, coil conductors having more than one turn for one ceramic layer are formed. The coil conductors include surface coil conductors that are located along surfaces of sequentially stacked ceramic layers and intra-layer coil conductors that are located inside the ceramic layers so as not to extend beyond the thickness of the individual ceramic layers. The surface coil conductors and the intra-layer coil conductors are connected in series with connecting portions therebetween.

Abstract: Semiconductor packages with air core inductors (ACIs) having metal-density layer units of fractal geometry are described. In an example, an inductor structure includes a stack of metal loops. One or more input terminals is coupled to the stack of metal loops. One or more output terminals is coupled to the stack of metal loops. One or more metal-density layer units is disposed above and over the stack of metal loops. At least one of the metal-density layer units has a fractal geometry.

Abstract: Disclosed herein is a method of manufacturing a noise removing filter, including preparing at least one conductive pattern, an insulating layer for covering the at least one conductive pattern, and a lower magnetic body including input/output stud terminals for electrically inputting and outputting electricity to and from the at least one conductive pattern; disposing a recognizable portion on upper surfaces of the input/output stud terminals; disposing an upper magnetic body on the recognizable portion and the insulating layer; polishing the upper magnetic body; and removing the recognizable portion such that a level of an upper surface of the upper magnetic body is higher than levels of the upper surfaces of the input/output stud terminals.

Abstract: A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency.

Abstract: A laminated coil includes a plurality of circular conductive plates in the form of a flat plate, each of the circular conductive plates being laminated via an insulating material in an axis direction. The plurality of circular conductive plates each include a plurality of concentric circular arc parts having different inner diameter and outer diameter from each other, and a connection part interconnecting the plurality of circular arc parts. The plurality of circular conductive plates are arranged such that the connection parts thereof face each other and the circular arc parts thereof are juxtaposed to each other in a radial direction.

Abstract: A coil-type electronic component having a coil inside or on the surface of a base material, characterized in that the base material of the coil-type electronic component is constituted by a group of soft magnetic alloy grains whose main ingredients are iron, silicate and chromium, and that an oxide layer is formed on the surface of each soft magnetic alloy grain, where the oxide layer is produced as a result of oxidization of the grain and has more chromium than the alloy grain, and this oxide layer has a two-layer structure constituted by an inner layer whose main ingredient is chromium oxide and an outer layer whose main ingredient is iron-chromium oxide, and the outer layers of soft magnetic alloy grains are inter-bonded.

Abstract: A laminated-type electronic component including: plural magnetic material layers; plural conductive patterns; a laminated layer body formed by laminating the plural magnetic material layers and the plural conductive patterns; a coil formed in the laminated layer body by connecting the conductive patterns between the magnetic material layers; and at least one magnetic gap formed in the laminated layer body, wherein the magnetic gaps are formed of a compound of Ni and Cu.

Abstract: Two-phase coupled inductors including a magnetic core, at least a first winding, and at least three solder tabs. Power supplies including a printed circuit board, a two-phase coupled inductor affixed to the printed circuit board, and first and second switching circuits affixed to the printed circuit board. Each of the first and second switching circuits are electrically coupled to a respective solder tab of the two-phase coupled inductor affixed to the printed circuit board.

Abstract: An electronic component is provided with a substrate, a thin-film element layer provided on the substrate, first and second bump electrodes, provided on a surface of the thin-film element layer, and an insulator layer provided between the first bump electrode and the second bump electrode. The thin-film element layer contains a first spiral conductor which is a plane coil pattern. The first bump electrode is connected to an internal peripheral end of the first spiral conductor. The second bump electrode is connected to an external peripheral end of the first spiral conductor. Both of the first and second bump electrodes, have a first exposure surface exposed to a principal surface of the insulator layer and a second exposure surface exposed to an end face of the insulator layer.

Abstract: Rogowski coil assemblies and methods for providing or forming Rogowski coil assemblies are provided. A Rogowski coil assembly may include a printed circuit board and a plurality of Rogowski coil sections mounted to an external surface of the printed circuit board by one or more respective circuit traces. The circuit traces may retain and connect the plurality of Rogowski coil sections.

Abstract: A laminated inductor offers higher magnetic permeability, high inductance, low resistance and high rated current, while also supporting downsizing of device, by using a soft magnetic alloy as the magnetic material. Provided is a laminated inductor, comprising: an internal conductor forming area and a top cover area and a bottom cover area formed in a manner sandwiching the internal conductor forming area from above and below, wherein the internal conductor forming area has a magnetic material part formed by soft magnetic alloy particles, and internal conductors buried in the magnetic material part, and at least one of the top cover area and bottom cover area is formed by soft magnetic alloy particles exhibiting a two-peak particle size distribution curve (based on count).

Abstract: A magnetic assembly is formed by a Printed Circuit Board (PCB) and a cover. A plurality of magnetic elements is electrically disposed on the PCB, and the magnetic elements are connected to one another through an electric circuit on the PCB. An accommodation space is formed on the cover for receiving the magnetic elements. During the manufacturing of the magnetic assembly, a cover with an appropriate space is selected according to the size, quantity, and specification type of the magnetic elements. After the two components are assembled, adhesive is injected into the cover, so that the cover and the PCB are fixedly disposed, and the elements in the accommodation space are protected. Therefore, in a process of manufacturing the magnetic assembly, covers with different accommodation spaces are selected for collocation according to requirements of the assembled electrical elements.

Abstract: An inductor structure comprising: a first loop and a second loop; a first feed line connected to a first end of the first loop and a second feed line connected to a first end of the second loop, each of the first and second feed lines extending through an area circumscribed by one of the first and second loops; and a crossover section adjacent to the first end of the first loop and the first end of the second loop, the crossover section coupling the first loop to the second loop so as to cause current flowing from the first feed line to the second feed line to circulate around the first loop in a first rotational direction and around the second loop in a second rotational direction opposite to the first rotational direction.

Abstract: Integrated circuits with phase-locked loops are provided. Phase-locked loops may include an oscillator, a phase-frequency detector, a charge pump, a loop filter, a voltage-controlled oscillator, and a programmable divider. The voltage-controlled oscillator may include multiple inductors, an oscillator circuit, and a buffer circuit. A selected one of the multiple inductors may be actively connected to the oscillator circuit. The voltage-controlled oscillators may have multiple oscillator circuits. Each oscillator circuit may be connected to a respective inductor, may include a varactor, and may be powered by a respective voltage regulator. Each oscillator circuit may be coupled to a respective input transistor pair in the buffer circuit through associated coupling capacitors. A selected one of the oscillator circuits may be turned on during normal operation by supplying a high voltage to the selected one of the oscillator circuit and by supply a ground voltage to the remaining oscillator circuits.

Abstract: A method for producing a current metering device with current conductor optionally made of aluminum or aluminum alloy, which has a middle section in the form of a bar and two end sections with flattened areas, and is bent between one end section at a time and the middle section, a magnetic module which has a bushing which holds the current conductor, and two copper or copper alloy sleeves which are applied at least to parts of the end sections of the current conductor.

Abstract: A common mode filter is manufactured to include a coil part including an insulation layer and a conductor pattern formed in the insulation layer; and a magnetic substrate coupled to one surface or both surfaces of the coil part. The magnetic substrate includes: an electrostatic absorbing layer made of an electrostatic absorbing material; a magnetic layer provided on one surface or both surfaces of the electrostatic absorbing layer and made of a magnetic material; and an electrode provided between the magnetic layer and the electrostatic absorbing layer and made of a conductive material. Therefore, common mode filter may maintain high efficiency characteristics while preventing an electrostatic discharge phenomenon.

Abstract: The chip-type coil component includes: a body; conductive patterns connected to each other so as to have a coil structure; and external electrodes formed on the bottom surface and the two surfaces in the length direction; wherein a height of the external electrodes in a thickness direction of the body is greater than a height from the bottom surface to a farthest conductive pattern therefrom among the conductive patterns and is less than a height from the bottom surface of the body to the top surface thereof. According to embodiments of the present invention, even in a case in which a chip-type coil component set contacts a metal can, interference such as short-circuits does not occur, and as a result, a chip-type coil component having excellent reliability can be acquired.

Abstract: A flat inductor, a method of manufacturing a flat inductor, and a circuit including a flat inductor are provided. A flat inductor includes a coil having a predetermined thickness, and a first magnetic medium layer disposed along a side surface of the coil, the first magnetic medium layer having a first width and a first height.

Abstract: This disclosure provides implementations of inductors, transformers, and related processes. In one aspect, a device includes a substrate having first and second surfaces. A first inducting arrangement includes a first set of vias, a second set of vias, a first set of traces arranged over the first surface connecting the first and second vias, and a second set of traces arranged over the second surface connecting the first and second vias. A second inducting arrangement is inductively-coupled and interleaved with the first inducting arrangement and includes a third set of vias, a fourth set of vias, a third set of traces arranged over the first surface connecting the third and fourth vias, and a fourth set of traces arranged over the second surface connecting the third and fourth vias. One or more sets of dielectric layers insulate portions of the traces from one another.

Abstract: A laminated common-mode choke coil offering higher insulation reliability has a glass ceramic layer, two spiral internal conductors facing each other and sandwiching the glass ceramic layer in between, and insulation layers sandwiching the two internal conductors, wherein the glass ceramic layer contains segregated Al regions and the maximum dimension t1 of each segregated Al region in the glass ceramic layer, in the layer-thickness direction, is no more than 80% of the distance t0 between the two internal conductors.

Abstract: A transformer power combiner includes a plurality of current combiners and a voltage combiner. The current combiners are coupled in series, and include a plurality of primary winding conductors magnetically coupled to a plurality of secondary winding conductors respectively. Each of the current combiners is configured to combine currents flowing therethrough. The voltage combiner is coupled to a series connection of the current combiners, and is configured to combine voltages across the current combiners to thereby generate an output of the transformer power combiner.

Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a substrate that spans in an X-direction and a Y-direction that is orthogonal to the X-direction. The semiconductor device includes an interconnect structure formed over the substrate in a Z-direction that is orthogonal to both the X-direction and the Y-direction. The interconnect structure includes a plurality of metal lines interconnected together in the Z-direction by a plurality of vias. The interconnect structure contains a transformer device that includes a primary coil and a secondary coil. The primary coil and the secondary coil are each wound at least partially in the Z-direction.

Abstract: A system and method for manufacturing of a micro-transformer providing direct electrical isolation between a primary winding and a secondary winding while featuring tight magnetic coupling for a large possible step-up or step-down ratio. The micro-transformer may be implemented in an integrated circuit, and may include a magnetic core. A high stepping ratio, e.g. approximately 50 to 100, may be achieved by connecting multiple symmetric primary windings in parallel and multiple symmetric secondary windings in series, or vice-versa. A plurality of windings may be stacked vertically. The micro-transformer may be of particular utility in wireless sensor networks, thermal and vibrational energy harvesters, power converters, and signal isolators.

Abstract: A transcranial magnetic stimulation induction coil device (“TMS coil device”) is manufactured to contain coil windings of a predetermined size and shape and fixedly positioned at a predetermined location within and orientation in relation to a casing of the TMS coil device. In one embodiment, the coil windings are encased in a casting at a predetermined location within and orientation in relation to the casting, and the casting is fixedly positioned at a predetermined location within and orientation in relation to the casing. The size and shape of the coil windings and the casing within, and the location and orientation of the coil windings in relation to each other and the casing of, the TMS coil device are known with a high level of precision, such that navigated brain stimulation can be performed with the TMS coil device with a high degree of accuracy.

Abstract: The present application relates to circuitry having a plurality of inductors, each inductor having a first end and a second end; and a switching arrangement connected to the first end and to the second end of each of the plurality of inductors for routing a current via the inductors; wherein the switching arrangement is arranged to at least one of selectably prevent current from flowing through a subset of the plurality of inductors and select a current flow direction through one of the inductors relative to a current flow direction through at least one other of the inductors so as to vary an effective inductance that the plurality of inductors represents to the current.

Abstract: A cost effective solution for construction of high frequency, double ended, isolated, push pull, center tapped power transformers operating in continuous/discontinuous mode with minimized winding proximity losses comprises at least two identical sets of windings with identical coupling coefficients. Each set of windings consists of at least one primary winding and at least one secondary winding tightly coupled to each other. Both the sets of windings are loosely coupled to each other with a magnetic field isolating separator.

Abstract: An electronic component that can be prevented from being mounted on a circuit board with inclination, and a manufacturing method thereof are provided. An electronic component is mountable on a circuit board including a first land and a second land. The electronic component includes outer electrodes on a lower surface of a stack to be arranged along a direction and are connectable to the first land and the second land, respectively. With the electronic component mounted to the circuit board, respective contact surfaces of the outer electrodes to the first land and the second land have a structure being symmetric about a line parallel to the direction, and each respective contact surface is divided into a plurality of portions.

Abstract: Disclosed is an inductor structure. The inductor structure includes a base material, at least one bottom spiral conductor disposed on the base material, a middle spiral conductor disposed on the bottom spiral conductor, a top spiral conductor disposed on the middle spiral conductor, and dielectric material separating the bottom, middle and top spiral conductors. The at least one bottom spiral conductor is connected electrically in parallel to the middle spiral conductor and the middle spiral conductor is connected electrically in series to the top spiral conductor. The top spiral conductor is thicker, narrower and less tightly wound than the middle spiral conductor and the bottom spiral conductor.

Abstract: An electronic component that can be prevented from being shifted from a normal mount position and can be manufactured with a low cost is provided. The component is configured by stacking a plurality of insulating layers and a plurality of inner conductors provided on the respective insulating layers. The connection conductors have respective exposure portions that are each exposed between corresponding ones of the insulating layers at a surface of the stack. An outer electrode is formed, for example, by plating on the lower surface so that the exposure portions are covered with the outer electrode. The plurality of exposure portions do not have uniform thicknesses or are not arranged at uniform intervals in the stacking direction.

Abstract: A tunable inductor circuit is disclosed. The tunable inductor circuit includes a first inductor. The tunable inductor circuit also includes a second inductor in parallel with the first inductor. The tunable inductor circuit also includes a switch coupled to the second inductor. A resistance of the switch is added in parallel to the first inductor based on operation of the switch.

Abstract: In a laminated inductor element, a magnetic ferrite layer sandwiched between two conductor patterns is thinner than other magnetic ferrite layers. Therefore, a crack occurs in the magnetic ferrite layer due to firing. As a result of the occurrence of this crack, a stress applied to each layer is relaxed, and it becomes possible to avoid warpage, a crack, or the like. In addition, in the laminated type inductor element, the two conductor patterns are electrically connected by two via holes, and subjected to a same potential. Since the two conductor patterns correspond to a same wiring pattern and a coil of coil conductor is defined by the two conductor patterns, even if upper and lower coil conductors are electrically in contact with each other due to the crack, the two conductor patterns are not put into a short-circuited state.

Abstract: A coil-type electronic component has a coil inside or on an outer surface of its base material and is characterized in that: the base material is constituted by a group of grains of a soft magnetic alloy containing iron, silicon and other element that oxidizes more easily than iron; the surface of each soft magnetic alloy grain has an oxide layer formed on its surface as a result of oxidization of the grain; the oxide layer contains the other element that oxidizes more easily than iron by a quantity larger than that in the soft magnetic alloy grain; and grains are bonded with one another via the oxide layer.

Abstract: Disclosed herein is a coil component that includes an insulating layer formed on a substrate, a coil conductor provided between the substrate and the insulting layer, a first electrode connected to one end of the coil conductor, a second electrode connected to the other end of the coil conductor, and a magnetic layer formed on the insulting layer so as to cover a side surface of each of the first and second electrodes without covering a top surface of each of the first and second electrodes.

Abstract: A thin film inductor having yokes, one or more of which is laminated, and one or more conductors passing between the yokes. The laminated yoke or yokes help reduce eddy currents and/or hysteresis losses.

Abstract: An inductor including a primary coil coaxially arranged and operated in parallel with isolated secondary coils each including at least one loop winding with two open-circuited ports. At least one phase shifting device is arranged between open-circuited ports of at least one secondary coil. A method to operate an inductor by combining primary and secondary coils with phase shifting devices to get a wide tuning range is also provided. The method includes the step of phase shifting open-circuited ports of at least one secondary coil.

Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a first inductor formed on a first substrate; a second inductor formed on a second substrate and conductively coupled with the first inductor as a transformer; and a plurality of micro-bump features configured between the first and second substrates. The plurality of micro-bump features include a magnetic material having a relative permeability substantially greater than one and are configured to enhance coupling between the first and second inductors.

Abstract: A flux concentrator and method for manufacturing a flux concentrator is provided. The method can include combining powdered soft magnetic material, a binder, a solvent, a internal lubricant; mixing the materials to create a mixture, evaporating the solvent from the mixture, molding the mixture to form a flux concentrator, and curing the flux concentrator. The flux concentrator may be laminated and broken into multiple pieces, which makes the flux concentrator more flexible. Breaking the flux concentrator does not significantly affect the magnetic properties. Since the permeability of the binder is very similar to that of air, adding tiny air gaps between the fractions is not significantly different than adding more binder.

Abstract: A transformer assembly includes a substrate having a first surface and an opposing second surface, a first spiral wound inductive coil formed on the first surface, and a second spiral wound inductive coil formed on the first surface; the first and second spiral wound inductive coils forming a double spiral arrangement on the first surface such that the first coil is inductively coupled to the second coil. An RF coil including the transformer assembly and a method of fabricating the transformer assembly are also described.

Abstract: A semiconductor device, a method of manufacturing a semiconductor device and a method for transmitting a signal are disclosed. In accordance with an embodiment of the present invention, the semiconductor device comprises a first semiconductor chip comprising a first coil, a second semiconductor chip comprising a second coil inductively coupled to the first coil, and an isolating intermediate layer between the first semiconductor chip and the second semiconductor chip.

Abstract: A transformer-based circuit has at least a first port and a plurality of second ports. The transformer-based circuit includes a first winding conductor and a plurality of second winding conductors. The first winding conductor is electrically connected to the first port, and has a plurality of sectors connected in series to thereby form a plurality of loops, where the loops are arranged in a concentric-like fashion. The second winding conductors are magnetically coupled to the first winding conductor; besides, the second winding conductors are electrically connected to the second ports, respectively. Overall layout patterns of the second winding conductors are identical to each other. The first winding conductor acts as one of a primary winding conductor and a secondary winding conductor, and each of the second winding conductors acts as the other of the primary winding conductor and the secondary winding conductor.

Abstract: A magnetic member includes a substrate and a magnetic element. A configuration groove is formed on the substrate, so as to accommodate the magnetic element. Furthermore, a first electrode is formed on a periphery of the substrate, so that ends of a conductive coil of the magnetic element are electrically laid thereon. A guide groove is formed on a position adjacent to the first electrode, and the guide groove is filled with a conductive metal, so that the first electrode is electrically connected to the guide groove. In this way, after an IR reflow process of the magnetic member, conditions of abnormal adhesion and poor conductivity are avoided. The magnetic member is applicable to various electronic devices requiring the magnetic elements, for example, a communication circuit and a frequency conversion circuit.

Abstract: A common mode noise filter includes: a first magnetic body and a second magnetic body; a non-magnetic body sandwiched between the first magnetic body and second magnetic body; and a first coil conductor and a second coil conductor of planar shape which are embedded in the non-magnetic body and positioned on the first magnetic body side and second magnetic body side in the non-magnetic body in a manner facing each other in a non-contact state; wherein a first lead conductor that connects one end of the first coil conductor to a first external terminal is embedded in the non-magnetic body 13, while a second lead conductor that connects one end of the second coil conductor to a third external terminal is embedded in the non-magnetic body.

Abstract: An electronic component is configured to include a laminate disposed between first and second magnetic substrates. The laminate is formed by laminating resin insulating layers, a coil pattern, and a lead pattern. The coil pattern is connected to external electrodes disposed on end surfaces of the laminate by using internal electrodes. The electronic component further includes expansion relaxation portions disposed in the inside of the resin insulating layers and located in the vicinity of connection regions of the internal electrodes and the external electrodes. The expansion relaxation portions are formed by using a magnetic powder resin in which a ferrite powder and a resin material are mixed.