Planar Type Patents (Class 336/232)
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Patent number: 8416049Abstract: A laminated ceramic component includes a ferrite magnetic layer and a glass ceramic layer made chiefly of borosilicate glass. The glass ceramic layer is laminated with the ferrite magnetic layer, and has an Ag inner conductor embedded inside. A microscopic region where aluminum and silver coexist is dispersed in the glass ceramic layer.Type: GrantFiled: October 5, 2009Date of Patent: April 9, 2013Assignee: Panasonic CorporationInventors: Tsutomu Inuduka, Hironori Motomitsu
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Patent number: 8410751Abstract: A device housing a battery (50) includes a receiving coil (51), and a charging pad (10) includes a transmitting coil (11) that magnetically couples with, and supplies charging power to the receiving coil. The device further includes a modulator circuit (61) that changes the impedance of the receiving coil according to internal battery data. The charging pad further includes a detection circuit (17) that detects receiving coil impedance changes to detect the battery data. The modulator circuit has a load circuit (62) connected in parallel with the receiving coil and has a series-connected switching device (64) and impedance modulating capacitor (63), and a control circuit (65) that switches the load circuit switching device ON and OFF according to the battery data. The modulator circuit switches the switching device 64 ON and OFF to transmit battery data to the charging pad.Type: GrantFiled: June 14, 2010Date of Patent: April 2, 2013Assignee: Sanyo Electric Co., Ltd.Inventors: Kyozo Terao, Shoichi Toya
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Patent number: 8405482Abstract: An integrated circuit includes a substrate having a surface. An inductor is disposed over the surface of the substrate. The inductor is operable to generate a magnetic field through itself that is substantially parallel with the surface.Type: GrantFiled: February 23, 2011Date of Patent: March 26, 2013Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventor: Hsiu-Ying Cho
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Patent number: 8400251Abstract: An electronic component includes a multilayer composite including first insulating layers, second insulating layers, and a helical coil. The helical coil is disposed within the multilayer composite and includes a plurality of coil conductors connected to each other with a plurality of via hole conductors. The coil is located corresponding to the region defined by the second insulating layers when viewed in a stacking direction of the first and second insulating layers. The second insulating layers are located in the region coinciding with the locus of the coil without covering the via hole conductors when viewed in the stacking direction.Type: GrantFiled: June 23, 2010Date of Patent: March 19, 2013Assignee: Murata Manufacturing Co., Ltd.Inventors: Yoshiko Banno, Yoichi Nakatsuji
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Patent number: 8390417Abstract: The invention presents a laminated electronic component configured to include: first coil pattern formed on a plurality of insulating layers, and second coil pattern disposed to face first coil pattern through at least one insulating layer. Both ends of first coil pattern are coupled with external electrodes; both ends of second coil pattern are not coupled with the external electrodes.Type: GrantFiled: September 17, 2009Date of Patent: March 5, 2013Assignee: Panasonic CorporationInventor: Kenji Ueno
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Patent number: 8384507Abstract: A through via inductor or transformer in a high-resistance substrate in an electronic package. In one embodiment, the package comprises a target inductor which includes a through-via formed in the substrate through which a signal passes and a tuner inductor which includes a through-via formed in the substrate such that the through-via has an independent signal passing therethrough. The direction of the signal passing through the tuner inductor can be independently controlled to adjust the total inductance of the target inductor. In another embodiment, a transformer can comprise a primary loop and a secondary loop, each of which includes a plurality of through-vias that are coupled to a plurality of conductive traces. The primary loop forms a first continuous conductive path and the secondary loop forms a second continuous conductive path. A signal passing through the primary loop can induce a signal in the secondary loop such that the induced signal is dependent on the transformer ratio.Type: GrantFiled: June 1, 2010Date of Patent: February 26, 2013Assignee: QUALCOMM IncorporatedInventors: Xia Li, Jonghae Kim, Chi Shun Lo
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Patent number: 8384508Abstract: A new method and structure is provided for the creation of a semiconductor inductor. Under the first embodiment of the invention, a semiconductor substrate is provided with a scribe line in a passive surface region and active circuits surrounding the passive region. At least one bond pad is created on the passive surface of the substrate close to and on each side of the scribe line. A layer of insulation is deposited, a layer of dielectric is deposited over the layer of insulation, at least one bond pad is provided on the surface of the layer of dielectric on each side of the scribe line. At least one inductor is created on each side of the scribe line on the surface of the layer of dielectric. A layer of passivation is deposited over the layer of dielectric. The substrate is attached to a glass panel by interfacing the surface of the layer of passivation with the glass panel. The substrate is sawed from the backside of the substrate in alignment with the scribe line.Type: GrantFiled: March 31, 2011Date of Patent: February 26, 2013Assignee: Megica CorporationInventors: Mou-Shiung Lin, Jin-Yuan Lee
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Patent number: 8384506Abstract: A magnetic device that includes a magnetic core having a surface facing a conductive substrate. The magnetic device also includes a conductive clip facing a surface of the magnetic core with ends of the conductive clip electrically coupled to the conductive substrate to cooperatively form a winding therewith about the magnetic core.Type: GrantFiled: March 25, 2010Date of Patent: February 26, 2013Assignee: Enpirion, Inc.Inventors: Ashraf W. Lotfi, Mathew A. Wilkowski, Trifon M. Liakopoulos, John D. Weld
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Patent number: 8378777Abstract: A magnetic component and a method for manufacturing a low profile, magnetic component. The method comprises the steps of providing at least one sheet, coupling at least a portion of at least one winding to the at least one sheet, and laminating the at least one sheet with at least a portion of the at least one winding. The magnetic component comprises at least one sheet and at least a portion of at least one winding coupled to the at least one sheet, wherein the at least one sheet is laminated to at least a portion of the at least one winding. The winding may comprise a clip, a preformed coil, a stamped conductive foil, or an etched trace using chemical or laser etching. The sheet may comprise any material capable of being laminated and/or rolled, including, but not limited to, flexible magnetic powder sheets.Type: GrantFiled: July 29, 2008Date of Patent: February 19, 2013Assignee: Cooper Technologies CompanyInventors: Yipeng Yan, Robert James Bogert
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Patent number: 8378775Abstract: Transformers (1) for transforming primary signals into secondary signals comprise primary and secondary parts that comprise boards (11-14, 21-23) with turns. By introducing distances larger than zero between for example any pair of neighboring boards (11-14, 21-23), parasitic capacitances of the transformers (1) are reduced, and the secondary signals may comprise relatively fast/high voltage pulses having rise times >1 kV/?sec. To reduce proximity effects and any resulting losses, the primary and secondary boards (11-14, 21-23) may be stacked in interleaved ways. Such sandwich constructions reduce leakage inductances. In a particular direction, distances between subsequent primary boards (11-14, 21-23) and distances between subsequent combinations of primary and secondary boards (11-14, 21-23) are to be increased to further reduce capacitive losses in that particular direction.Type: GrantFiled: April 17, 2008Date of Patent: February 19, 2013Assignee: Koninklijke Philips Electronics N.V.Inventors: Wolfgang Schiene, Georg Greuel, Marc Maria Alex Bleukx, Roman Siegfried Schichl
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Patent number: 8378774Abstract: A coil unit includes a coil including a coil wire, a magnetic substance for receiving magnetic force lines generated by the coil, a first substrate, and a temperature detection element disposed on the first substrate.Type: GrantFiled: May 1, 2009Date of Patent: February 19, 2013Assignee: Seiko Epson CorporationInventors: Hirofumi Okada, Yoichiro Kondo
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Patent number: 8373534Abstract: The present invention is to provide a coil having flexibility even if it includes a core body. A flexible coil 10 comprises a plurality of sheet-like coils laminated together in a region sharing a magnetic flux, wherein each sheet-like coil has a coil section formed along a surface of an insulating sheet having flexibility; and magnetic bodies 80 and 81 that have flexibility and sandwich the plurality of the laminated sheet-like coils.Type: GrantFiled: October 5, 2006Date of Patent: February 12, 2013Assignee: Sumida CorporationInventor: Mitsugu Kawarai
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Patent number: 8362868Abstract: A plane coil which reduces an increase of an effective resistance in a high-frequency area and is made thinner is provided. The plane coil is equipped with plural conductive wires which are parallel to each other, wherein the conductive wires are arranged in a plane and spirally wound, and coil ends of the respective conductive wires are electrically connected to each other at coil lead-out portions and thus are connected in parallel. The conductive wires are arranged in plane, so that a coil thickness does not increase, and the coil is made thinner. Moreover, the plural conductive wires are connected in parallel, an increase of an effective resistance due to an influence of a skin effect in a high-frequency area is reduced.Type: GrantFiled: June 22, 2009Date of Patent: January 29, 2013Assignee: Panasonic CorporationInventors: Hideki Tamura, Tomohiro Ota, Kyohei Kada, Masayuki Suzuki
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Patent number: 8359730Abstract: A surgical navigation system for navigating a region of a patient includes a non-invasive dynamic reference frame and/or fiducial marker, sensor tipped instruments, and isolator circuits. The dynamic reference frame may be repeatably placed on the patient in a precise location for guiding the instruments. The instruments may be precisely guided by positioning sensors near moveable portions of the instruments. Electrical sources may be electrically isolated from the patient.Type: GrantFiled: July 1, 2011Date of Patent: January 29, 2013Assignee: Medtronic Navigation, Inc.Inventors: Bruce M. Burg, John H. Dukesherer, Bradley A. Jascob, Paul Kessman
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Publication number: 20130015938Abstract: A near field communication antenna device of a mobile terminal having a near field communication antenna function of 13.56 MHz by Alternating Current (AC) coupling a conductive pattern of a touch screen panel is provided. The device includes a conductive pattern formed in a touch screen panel, a first antenna line AC-coupled to one end of the conductive pattern, a second antenna line AC-coupled to the other end of the conductive pattern, and a near field communication module connected to the first antenna line and the second antenna line. Therefore, a near field communication antenna can be embodied using a conductive pattern of an existing touch screen panel. Accordingly, an increase in thickness and material cost of a mobile terminal can be prevented.Type: ApplicationFiled: June 22, 2012Publication date: January 17, 2013Applicant: SAMSUNG ELECTRONICS CO. LTD.Inventor: Sung Ryong PARK
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Patent number: 8347490Abstract: A method for fabricating a carrier with a three-dimensional inductor comprises the steps of providing a substrate having a protective layer; forming a first photoresist layer on the protective layer; patterning the first photoresist layer to form a second opening and a plurality of disposing slots; forming a first metal layer in second opening and disposing slots; removing the first photoresist layer; forming a first dielectric layer on the protective layer; forming a second photoresist layer on the first dielectric layer; patterning the second photoresist layer to form a plurality of slots; forming a second metal layer in slots to form a plurality of inductive portions; removing the second photoresist layer; forming a second dielectric layer on the first dielectric layer; forming a third photoresist layer on the second dielectric layer; patterning the third photoresist layer to form a plurality of slots; and forming a third metal layer in slots.Type: GrantFiled: June 30, 2011Date of Patent: January 8, 2013Assignee: Chipbond Technology CorporationInventors: Chih-Ming Kuo, You-Ming Hsu
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Patent number: 8344843Abstract: A flux transfer device includes a first conductive element for generating magnetic flux when energized by an electric current and a second conductive element being concentric with the first conductive element, wherein the second conductive element generates an electric voltage/current in response to changes in the magnetic flux. A first magnetic element is concentric with the first conductive element, such that the magnetic flux generated by the first conductive element displaces at least a portion of the magnetic flux from the first magnetic element, thereby inducing an electric voltage/current in the second conductive element. A third conductive element and a second magnetic element may be positioned concentrically with the first conductive element such that the magnetic flux generated by the first conductive element displaces at least a portion of magnetic flux from the second magnetic element, thereby inducing an electric voltage/current in the third conductive element.Type: GrantFiled: September 1, 2011Date of Patent: January 1, 2013Assignee: Solid State Magnetics CorporationInventor: John T. Larsen
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Patent number: 8339228Abstract: An edgewise coil achieves positioning of both end portions and accurate and reliable conduction with respect to a circuit board in a simple configuration, and can be downsized. The edgewise coil is usable in a conductor. The edgewise coil includes a base material and a coil member fixed at both end portions to the base material and including an external wound-wire portion placed on the base material and an internal wound-wire portion extending in the base material.Type: GrantFiled: January 12, 2011Date of Patent: December 25, 2012Assignee: TDK-Lambda CorporationInventor: Kazuki Ishizawa
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Patent number: 8339231Abstract: A magnetics package comprising: a primary coil configured to conduct a current flow; a secondary coil electrically isolated from the primary coil and configured to conduct a current flow, wherein the secondary coil is embedded in a mold compound; and a magnetic core inductively coupling the primary coil and the secondary coil, wherein a current flow in the primary coil produces a magnetic field in the magnetic core, and the magnetic field in the magnetic core induces a current flow in the secondary coil.Type: GrantFiled: March 22, 2010Date of Patent: December 25, 2012Assignee: Flextronics AP, LLCInventor: Rajeev Joshi
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Patent number: 8339230Abstract: An inductor element is formed in a multiple layer lead structure including a lead, an insulative layer that insulates leads above and below, and a via provided in the insulative layer and connecting leads above and below wherein lead layers are multiply laminated layers, characterized in that: at least a portion of at least a pair of vertically adjacent leads are coiled leads; the coiled leads are connected in series, wherein current directions of vertically adjacent coiled leads are the same by a via provided on an end portion thereof, and form a serial inductance; and an inter-lead capacitance of the vertically adjacent coiled leads is larger than an inter-lead capacitance between other coiled leads formed in the same lead layer.Type: GrantFiled: August 1, 2007Date of Patent: December 25, 2012Assignee: Renesas Electronics CorporationInventors: Kenichiro Hijioka, Akira Tanabe, Yoshihiro Hayashi
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Patent number: 8327523Abstract: There is provided a method of making two electrically separated inductors using deposition and wet-etching techniques, which inductors are formed by interwinding one of the inductors within the other inductor on the same planar level. In still another aspect of the invention, there is provided a method of making various levels inductors, each level having at least two electrically separated inductors, using deposition and wet-etching techniques. The inductors on each planar level are formed by interwinding one of the inductors within the other inductor, and then stacking these in a preferred manner. In still another aspect, there is provided a manner of connecting together inductors formed according to the above methods in order to achieve various inductor configurations.Type: GrantFiled: November 28, 2006Date of Patent: December 11, 2012Assignee: Semiconductor Components Industries, LLCInventors: Adam J. Whitworth, Wenjiang Zeng
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Patent number: 8331103Abstract: Disclosed herein is a wiring board including: a shield layer; and n layers (n is an integer of two or more) of inductor wiring formed above the shield layer and forming an inductor; wherein of the n layers of inductor wiring, the inductor wiring closest to the shield layer has a smallest wiring area.Type: GrantFiled: January 15, 2010Date of Patent: December 11, 2012Assignee: Sony CorporationInventor: Shuichi Oka
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Patent number: 8325001Abstract: Interleaved three-dimensional (3D) on-chip differential inductors 110, 120 and transformer 100 are disclosed. The interleaved 3D on-chip differential inductors 110, 120 and transformer 100 make the best use of multiple metal layers in mainstream standard processes, such as CMOS, BiCMOS and SiGe technologies.Type: GrantFiled: August 2, 2006Date of Patent: December 4, 2012Assignee: The Regents of the University of CaliforniaInventors: Daquan Huang, Mau-Chung Frank Chang
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Patent number: 8325003Abstract: A common mode filter includes at least two inductance unit sets. Each inductance unit set includes a coil leading layer, an insulating substrate, at least two electrically conductive columns, and a coil main body layer. The coil leading layer is disposed on a first surface of the substrate, and includes at least two leading wires, at least four leading terminals, and at least two contacts. Each leading wire respectively connects one leading terminal and one contact. The coil main body layer is disposed on a second surface of the substrate, and includes a coil lead and two end portions thereof. Each electrically conductive column extends through the substrate, connecting one contact and one end portion. The two substrates and two coil main body layers of the at least two inductance unit sets are bonded by an electrically insulating layer. The two coil main body layers are electrically isolated from each other by the electrically insulating layer.Type: GrantFiled: August 16, 2011Date of Patent: December 4, 2012Assignee: INPAQ Technology Co., Ltd.Inventor: Liang Chieh Wu
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Patent number: 8310329Abstract: The interleaved common mode transformer is a transformer particularly well suited for providing low voltage, high current dc outputs. Improving the efficiency of low voltage, high current transformer circuits requires a multi-faceted approach. Ac terminations and ac currents in connecting circuitry are particularly troublesome, so the input and output terminations of the transformer are dc. To utilize the winding fully, a common-mode push-pull configuration with common mode capacitors is used. Stray capacitance is less of a concern than leakage inductance at low voltages, so the windings are highly interleaved. Separate parallel secondary windings are used, an ac winding primarily for the ac currents, and a dc winding primarily for dc currents and heat sinking. The ac windings are thin; approximately two times the penetration depth. The dc windings are substantial, for low voltage drop and good heat sinking.Type: GrantFiled: May 31, 2011Date of Patent: November 13, 2012Inventor: Edward Herbert
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Patent number: 8310332Abstract: A magnetic component and a method of manufacturing the same. The method comprises the steps of providing at least one shaped-core fabricated from an amorphous powder material, coupling at least a portion of at least one winding to the at least one shaped-core, and pressing the at least one shaped-core with at least a portion of the at least one winding. The magnetic component comprises at least one shaped-core fabricated from an amorphous powder material and at least a portion of at least one winding coupled to the at least one shaped-core, wherein the at least one shaped-core is pressed to at least a portion of the at least one winding. The winding may be preformed, semi-preformed, or non-preformed and may include, but is not limited to, a clip or a coil. The amorphous powder material may be an iron-based or cobalt-based amorphous powder material or a nanoamorphous powder material.Type: GrantFiled: October 8, 2008Date of Patent: November 13, 2012Assignee: Cooper Technologies CompanyInventors: Yipeng Yan, Robert James Bogert
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Patent number: 8310328Abstract: A method of making a planar coil is disclosed in the present invention. First, a substrate having a trench is provided. Then, a barrier and a seed layer are formed on the substrate in sequence. An isolative layer is used for guiding a conductive material to flow into a lower portion of the trench such that accumulation of the conductive material at opening of the trench is prevented before the lower portion of the trench is completely filled up, thereby avoiding gap formation in the trench.Type: GrantFiled: October 7, 2010Date of Patent: November 13, 2012Assignee: Touch Micro-System Technology Corp.Inventors: Hung Yi Lin, Ming Fa Chen
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Patent number: 8305182Abstract: A symmetric differential inductor structure includes first, second, third and fourth spiral conductive wirings disposed in four quadrants of a substrate, respectively. Further, a fifth conductive wiring connects the first and fourth spiral conductive wirings, and a sixth conductive wiring connects the second and third spiral conductive wirings. The first and second spiral conductive wirings are symmetric but not intersected with one another, and the third and fourth spiral conductive wirings are symmetric but not intersected with one another. Therefore, the invention attains full geometric symmetry to avoid using conductive wirings that occupy a large area of the substrate as in the prior art and to thereby increase the product profit and yield.Type: GrantFiled: September 23, 2011Date of Patent: November 6, 2012Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Ming-Fan Tsai, Kuan-Yu Chen, Bo-Shiang Fang, Hsin-Hung Lee
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Patent number: 8284010Abstract: An inductor includes a coil electrode section in which a first spiral electrode and a second spiral electrode are wound in substantially the same direction, lie in substantially the same plane, and are connected to each other by a connection electrode. The coil electrode section is sandwiched by the first magnetic layer and the second magnetic layer from both directions substantially perpendicular to the plane. A first protrusion electrode and a second protrusion electrode at ends of the first spiral electrode and the second spiral electrode that are opposite to the connection electrode extend in a direction substantially perpendicular to the plane, have a length at which each of the protrusion electrodes protrudes from the first magnetic layer, and define opposite end electrodes of the inductor. Arranging this low-profile inductor on a mounting circuit board achieves a low-profile DC-DC converter including a two-layer structure.Type: GrantFiled: August 30, 2010Date of Patent: October 9, 2012Assignee: Murata Manufacturing Co., Ltd.Inventors: Hitoshi Tsuji, Sadao Yamashita, Takao Kakinoki
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Patent number: 8276259Abstract: A method of constructing a differential inductor having a high self-resonance frequency is provided. In general, a ground point is identified. A first coil having a first and second loop is created such that the first loop is electrically further away from the ground point than the second loop. A second coil having a third and fourth loop are created such that the third loop is electrically further away from the ground point than the second loop. The first coil and the second coil are positioned such that the first loop is positioned as a near neighbor to said fourth loop and said second loop is positioned as a near neighbor to said third loop.Type: GrantFiled: November 10, 2005Date of Patent: October 2, 2012Assignee: RF Micro Devices, Inc.Inventors: Paul Findley, Jon Tao, Gholam-Ali Rezvani
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Patent number: 8279036Abstract: A multilayer coil device is formed by alternately stacking a plurality of insulating layers and a plurality of substantially spiral coil patterns. In the multilayer coil device, the number of turns of each of the substantially spiral coil patterns is more than one. Each of the substantially spiral coil patterns has a protrusion protruding toward a center of the substantially spiral coil pattern. The protrusion is located in a specific region where the number of coil pattern portions that cross a virtual line extending radially outward from the center of the coil pattern is smaller than that in another region of the substantially spiral coil pattern. The protrusion is provided as an additional part of a coil pattern portion that is closest to the center of the substantially spiral coil pattern in the specific region.Type: GrantFiled: September 10, 2010Date of Patent: October 2, 2012Assignee: Murata Manufacturing Co., Ltd.Inventor: Yoshiko Banno
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Patent number: 8269594Abstract: An insulated transformer, which can suppress aging deterioration and can reduce the influence of noise caused by external magnetic flux, while improving reliability and environmental resistance, and can send and receive signals while electrically insulating a low-voltage side and a high-voltage side. A secondary coil is formed on a semiconductor substrate, and a primary coil is formed on one face of a glass substrate. The primary coil fixes the glass substrate formed on one face onto the semiconductor substrate through the other face of the glass substrate by an adhesive layer.Type: GrantFiled: April 18, 2008Date of Patent: September 18, 2012Assignee: Fuji Electric Co., Ltd.Inventors: Hiroyuki Yoshimura, Katsunori Ueno, Masaharu Edo
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Patent number: 8269595Abstract: A coil unit includes a planar coil, a coil-receiving housing having a depression that receives the planar coil, the planar coil being disposed in the coil-receiving housing so that a transmission side of the planar coil faces a bottom of the depression, and a substrate having a mounting surface that is provided with a mounted component and faces a non-transmission side of the planar coil, an inner end lead line and an outer end lead line of the planar coil being connected to the substrate. The substrate is secured as a lid of the coil-receiving housing on an open end side of the depression of the coil-receiving housing.Type: GrantFiled: July 10, 2008Date of Patent: September 18, 2012Assignee: Seiko Epson CorporationInventors: Hirofumi Okada, Yoichiro Kondo
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Patent number: 8258909Abstract: A foldable polymer-based coil structure and a method for fabricating the same are disclosed. The coil structure has metal wirings and interconnections between the wirings. The wirings and connections are embedded by a polymer. The coil structure is foldable in two or more layers. In the folded condition, coils of one layer overlap the coils of another layer. A stackable structure and jigs for aligning the foldable and stackable structures are also disclosed.Type: GrantFiled: April 19, 2008Date of Patent: September 4, 2012Assignee: California Institute of TechnologyInventors: Wen Li, Damien C Rodger, Yu-Chong Tai
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Patent number: 8258911Abstract: Disclosed herein are various embodiments of compact coil power transformers configured to provide high voltage isolation and high voltage breakdown performance characteristics in small packages. Compact coil transformers are provided across which power may be transmitted and received by primary and secondary coils disposed on opposing sides of a substrate without high voltage breakdowns occurring therebetween. At least portions of the compact coil transformer are formed of an electrically insulating, non-metallic, non-semiconductor, low dielectric loss material. The compact coil transformers may be formed in small packages using, by way of example, printed circuit boards, flex circuits, lead frames, CMOS and other fabrication and packaging processes.Type: GrantFiled: December 1, 2010Date of Patent: September 4, 2012Assignee: Avago Technologies ECBU IP (Singapor) Pte. Ltd.Inventor: Julie E. Fouquet
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Patent number: 8242872Abstract: Embodiments of the invention provide a transformer comprising: a first coil element having a transverse axis along a transverse direction, the first coil element having p turns where p is greater than or equal to 1; and a second coil element having a transverse axis generally parallel to the transverse axis of the first coil element, the second coil element having n turns, where n is greater than or equal to 5p; wherein the first and second coil elements are arranged to provide electromagnetic coupling between the coil elements along a portion of a length of the second coil element in both a transverse direction parallel to the transverse axes and a lateral direction, wherein the lateral direction is a direction normal to the transverse axes.Type: GrantFiled: July 19, 2007Date of Patent: August 14, 2012Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.Inventors: Chee Chong Lim, Kok Wai Chew, Kiat Seng Yeo, Suh Fei Lim, Manh Anh Do, Lap Chan
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Patent number: 8243960Abstract: An audio amplifier, that includes a planar inductor structure that includes a first plurality of windings, formed on layers of a first circuit board and a second plurality of windings, formed on layers of a second circuit board. The planar inductor structure may further include a sense winding.Type: GrantFiled: March 4, 2010Date of Patent: August 14, 2012Assignee: Bose CorporationInventor: Michael Nussbaum
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Patent number: 8237531Abstract: An inductor circuit with high quality (Q) factor includes a primary inductor and a compensation sub-circuit. The compensation sub-circuit is electrically isolated from the primary inductor. The compensation sub-circuit is magnetically coupled with the primary inductor to compensate the loss in the primary inductor.Type: GrantFiled: December 31, 2007Date of Patent: August 7, 2012Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.Inventors: Ping Qiu, Chirn Chye Boon, Johnny Kok Wai Chew, Kiat Seng Yeo, Manh Anh Do, Lap Chan, Suh Fei Lim
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Patent number: 8237532Abstract: An electronic circuit device 1 arranged with a first substrate 11, a core 33 (magnetic body) mounted on the first substrate 11, a resin sealing body 17 which covers the first substrate 11 and the core 33, and a curable type stress relieving material 35 which reduces stress applied to the core 33 by the resin sealing body 17 is arranged within the resin sealing body 33 from the side surface periphery of the core 33 across to the first substrate 11.Type: GrantFiled: November 12, 2009Date of Patent: August 7, 2012Assignee: Sanken Electric Co., Ltd.Inventor: Ryuji Takada
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Patent number: 8237533Abstract: An integrated printed inductor has a set of open petal loops, connected together in series. For a given inductance value higher quality factor and higher frequency value result using an equal chip surface area. With the same fabrication cost and equal occupied area, higher quality factor values at higher frequency can be achieved. The innovative shape is such that secondary mutual coupling effects occur and contribute to increases of overall inductance values. Small current loops arranged as petals corresponding to inductance value LO are connected in series for the inductance value to add up to a higher value. The loops are connected along a circular path to minimize the total chip area occupied. A secondary loop in the center of the inductor results in a stronger magnetic flux and a higher inductance value, due to both self inductance of the secondary loop and mutual inductance of it with the petals.Type: GrantFiled: January 19, 2010Date of Patent: August 7, 2012Assignee: Aristotle University Thessaloniki Research CommitteeInventors: Alkiviades Chatzopoulos, Giorgos Bontzios
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Patent number: 8234778Abstract: Methods and Apparatus for providing a low-cost and high-precision inductive device. In one embodiment, the inductive device comprises a plurality of vias having extended ends which replace windings disposed around a magnetically permeable core. In another embodiment, the inductive device comprises a wired center core as well as a plurality of vias having extended ends which act as windings disposed around a magnetically permeable core. In a second aspect of the invention, a method of manufacturing the aforementioned inductive devices as well as the wired core centers is disclosed.Type: GrantFiled: July 18, 2011Date of Patent: August 7, 2012Assignee: Pulse Electronics, Inc.Inventors: Christopher P. Schaffer, Alan Lindner
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Patent number: 8232855Abstract: A substrate layer for use in an inductor is provided. The substrate layer comprises traces disposed on a first side of the substrate layer, wherein the traces are configured to facilitate conduction of current in a winding of the inductor, a sealing layer disposed on a second side of the substrate layer, wherein the sealing layer is configured to provide a sealing border for an electrically isolated cooling channel and an interconnect foil disposed on the second side of the substrate layer, wherein the interconnect foil is configured to facilitate operationally coupling the substrate layer to a second substrate layer. Further, the first substrate layer and the second substrate layer may be operationally coupled to form a winding for use in an inductor with an electrically isolated cooling channel in between.Type: GrantFiled: December 15, 2008Date of Patent: July 31, 2012Assignee: General Electric CompanyInventors: Said Farouk Said El-Barbari, Stefan Schroeder, Robert Roesner
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Patent number: 8228156Abstract: An insulation transformer and a key input circuit having the same are disclosed. The insulation transformer includes: a core having a certain gap; and primary and secondary coils wound on the core. According to the insulation transformer, the operation deficiency of the insulation transformer can be reduced and thus the signal transmission efficiency can be improved. Also, the key input circuit including: an insulation transformer includes a core having a certain gap, and primary and secondary coils wound on the core; a microcomputer connected with the primary coil; and a key input unit connected with the secondary coil and including multiple resistors and switches. According to the key input circuit having the insulation transformer, the reliability of the operation of the key input circuit can be improved and user inconvenience that may be caused by an operation error can be prevented.Type: GrantFiled: October 17, 2007Date of Patent: July 24, 2012Assignee: LG Electronics Inc.Inventors: Jun-Young Lim, Sang-Young Kim
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Patent number: 8224003Abstract: The installation size of hearing apparatuses and in particular of hearing devices is to be reduced. Provision is thus made for a hearing apparatus with a transmitting facility including an antenna for the wireless, electromagnetic transmission of data and a switching controller including an inductor, which is used to supply energy to the hearing apparatus and the transmitting facility, with the inductor of the switching controller being identical to the antenna of the transmitting facility. This multiple use of the inductor can save on installation space. In order to avoid mutual interference of the transmitting facility and the switching controller, the signals thereof are modulated independently of one another.Type: GrantFiled: October 16, 2008Date of Patent: July 17, 2012Assignee: Siemens Medical Instruments Pte. Ltd.Inventor: Jürgen Reithinger
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Patent number: 8217749Abstract: A coil component includes coil windings, and resin portions that are insulating members having electrical insulation properties and integrally formed with the coil windings covering parts of surfaces of the coil windings, and the coil component is sandwiched by magnetic core members in directions of winding axes of the coil windings. The coil windings are composed of a plurality of plate-like coil members in a ring shape having ends joined in a stacking direction with a clearance therebetween to be continuous in a predetermined winding direction. The resin portions that are the insulating members cover outermost plate surfaces of the coil members facing the magnetic core members, a space between the adjacent coil members, and inner perimeter edges of the coil members, and have openings along the directions of winding axes of the coil windings.Type: GrantFiled: March 12, 2010Date of Patent: July 10, 2012Assignee: TDK CorporationInventor: Akira Ikezawa
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Patent number: 8217747Abstract: A planar inductor (50) comprises a conductive path in the form of a spiral pattern (53A-53D, 54A-54D). A conductive connecting path (62A, 63) connects a terminal (60) to an intermediate tap point (61A). The connecting path comprises at least one path portion which is radially directed with respect to the spiral pattern (53A-53D). The connecting path (62A, 63) can be routed via the inside of the spiral pattern. Where the connecting path comprises only radially-directed path portions, they are commonly joined at the center (64) of the spiral pattern. Multiple path portions (62A, 62B) can each connect to the intermediate tap point of a respective conductive path. The connecting path can use a further conductive track (85) which is parallel to the conductive path which forms the spiral pattern.Type: GrantFiled: June 17, 2005Date of Patent: July 10, 2012Assignee: NXP B.V.Inventor: Lukas Frederik Tiemeijer
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Patent number: 8212644Abstract: The present invention relates to a transformer assembly (1) and a process for manufacturing same. The transformer (1) comprises a primary winding (5) wound on a PCB (9) and a secondary winding (7) mounted adjacent to the primary winding. The primary winding comprises a spiral coil, for example of wire or insulated wire, wound on the PCB. Gate drive windings (31, 33) are incorporated in the PCB (9) and there is therefore very close coupling between the primary winding and the gate drive windings. Furthermore, the secondary winding (7) is a center-tapped secondary having two halves. A flux balance winding (13) is provided to connect the two halves of the center-tapped secondary winding (7) and minimize leakage inductance thereby reducing power loss and spiking effects and obviating the need for complex control arrangements.Type: GrantFiled: September 12, 2008Date of Patent: July 3, 2012Assignee: Texas Instruments (Cork) LimitedInventors: George Young, Brian Gaynor, Andrew B. Keogh
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Patent number: 8207810Abstract: A multilayer electronic component is provided which includes layers composed of different materials and bonded together and which is capable of suppressing the occurrence of delamination at a bonded portion between the layers composed of different materials. A magnetic first layer is composed of a material with relatively high magnetic permeability. A second magnetic layer is composed of a material with relatively low magnetic permeability. Boundary magnetic layers are provided between the two magnetic layers and include a partial magnetic layer composed of the same material as the first magnetic layer and a partial magnetic layer composed of the same material as the second magnetic layer. The partial magnetic layers are provided to be adjacent to each other in the boundary magnetic layers.Type: GrantFiled: June 7, 2010Date of Patent: June 26, 2012Assignee: Murata Manufacturing Co., Ltd.Inventor: Toshio Kawabata
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Patent number: 8203407Abstract: A surface mount magnetic device includes a magnetic core assembly, a winding coil and an extension region. The magnetic core assembly includes a first magnetic part and a second magnetic part. The second magnetic part has a first surface and a second surface. The first surface of the second magnetic part is connected to second magnetic part such that a receptacle is formed between the first magnetic part and the second magnetic part. The winding coil is partially accommodated within the receptacle and includes at least two pins, wherein the pins are attached on the second surface of the second magnetic part. The extension region is integrally formed on the second surface of the second magnetic part.Type: GrantFiled: June 18, 2007Date of Patent: June 19, 2012Assignee: Delta Electronics, Inc.Inventors: Tsai-Shen Lin, Jui-Chu Cheng, Su-Chiung Hsu
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Patent number: 8201318Abstract: A method of manufacturing an inductor includes a lamination step, a division step, a firing step, and a plating step. In the lamination step, a laminate including an insulator, a coil body, and external electrodes is formed. That is, in the lamination step, insulating layers having wide filling conductors, insulating layers having narrow filling conductors, and conductor patterns having external electrode patterns are laminated. As a result, the conductor patterns form the coil body, and the wide filling conductors, the narrow filling conductors, and the external electrode patterns form the external electrodes. The narrow filling conductors have a width that is less than the widths of the wide filling conductors and the external electrode patterns, and recesses and projections are provided in the external electrodes.Type: GrantFiled: July 10, 2008Date of Patent: June 19, 2012Assignee: Murata Manufacturing Co., Ltd.Inventor: Kazuhiko Yamano