Planar Type Patents (Class 336/232)
  • Patent number: 7132921
    Abstract: To reduce pattern resistance including a secondary winding in a power supply module having a pair of secondary windings transformer-coupled with a primary winding. The pair of secondary windings coupled with a primary winding through a transformer is drawn out in both directions each other, and further disposed on different layers. Also, output pattern films are disposed on both sides of the second and third layers, so that pattern films of wide shape can be produced.
    Type: Grant
    Filed: February 9, 2004
    Date of Patent: November 7, 2006
    Assignee: Fujitsu Limited
    Inventors: Susumu Eguchi, Hiroshi Shimamori, Kazuhiko Itakura
  • Patent number: 7126451
    Abstract: The present invention is to provide a process for the preparation of coil for an electric appliance by which a coil for electric appliances comprising an edgewise wound square coil having small intervals between coils and high quality can be easily prepared in good productivity and low-cost.
    Type: Grant
    Filed: August 25, 2004
    Date of Patent: October 24, 2006
    Assignee: Fuji Jukogyo Kabushiki Kaisha
    Inventor: Jiro Maruyama
  • Patent number: 7114237
    Abstract: A method is proposed to manufacture a precise multi-pole magnetic component for using in magnetic encoders. A special layout of the circuit pattern is designed and formed on a printed circuit board (PCB). Alternate and regular magnetic field is induced according to Ampere's law after a current flowing through the circuit on the PCB. The multi-pole magnetic component with fine magnetic pole pitch is achieved by forming the high-density circuit patterns on a substrate using the PCB technology.
    Type: Grant
    Filed: November 24, 2003
    Date of Patent: October 3, 2006
    Assignee: Industrial Technology Research Institute
    Inventors: Kuo-Chi Chiu, Der-Ray Huang, Han-Ping Shieh
  • Patent number: 7102480
    Abstract: A printed circuit board includes a first layer on which a first stationary contact terminal is formed and one or more second layers spaced apart from the first layer by at least one intermediate layer. A portion of the one or more second layers extends into a recess formed by a discontinuity of the intermediate layers. The portion is flexible and has a second terminal which can be brought into contact with the first stationary terminal.
    Type: Grant
    Filed: April 17, 2001
    Date of Patent: September 5, 2006
    Assignee: Telefonaktiebolaget LM Ericsson (publ)
    Inventors: Leif Bergstedt, Kent Falk, Per Ligander
  • Patent number: 7088215
    Abstract: A highly compact inductor formed on opposite faces of a dielectric substrate. Sets of parallel spaced conductive traces formed on the opposite faces of the substrate are interconnected by metallized vias through the substrate, in such a way as to form a continuous spiral conductive path. The inductor is preferably formed as two closely adjacent segments, each with conductive traces on each face of the substrate and each having metallized vias interconnecting the conductive traces. The segments are electrically connected in series and produce a magnetic field that extends through each segment in opposite directions and is closely coupled from one segment to the other. The inductor is, therefore, electromagnetically similar to a wire-wound toroidal inductor, providing high inductance and contourable Q values, but is highly compact, especially in the z-axis direction normal to the substrate.
    Type: Grant
    Filed: February 7, 2005
    Date of Patent: August 8, 2006
    Assignee: Northrop Grumman Corporation
    Inventors: Frank B. Winter, Harry S. Harberts, Julius G. Tolan
  • Patent number: 7078993
    Abstract: An electromagnet assembly for supplying a region of concentrated electromagnetic flux is provided. The assembly includes a flat strip of an electrically conductive metal. The strip has a first and a second opposite planar surfaces at least one of which is covered by a dielectric material. The strip has first and second end portions. The strip is wound in a coil including at least one first loop and one second loop and disposing the second opposite planar surface in the first loop substantially-adjacent the first opposite planar surface in the second loop. The coil is disposed about an axis of symmetry configured to concentrate electromagnetic flux at a midpoint on the axis of symmetry. First and second electrical terminals are connected at the first and second end portions, respectively.
    Type: Grant
    Filed: July 29, 2005
    Date of Patent: July 18, 2006
    Assignee: The Boeing Company
    Inventors: Frederic P. Berg, David B. Smith
  • Patent number: 7069639
    Abstract: A method of fabricating a chip type power inductor includes the steps of: preparing green sheets: forming cutting lines on a magnetic layer green sheet and a non-magnetic layer green sheet; forming via holes on the non-magnetic layer green sheet where the cutting lines are formed, and forming an electrode pattern at an upper surface of the non-magnetic layer green sheet; stacking a plurality of layers by constituting the magnetic layer and the non-magnetic layer where via holes and electrode patterns are formed as one unit in a state that a non-magnetic layer where cutting lines and electrode patterns are not formed is inserted; stacking a cover layer composed of a magnetic layer at upper and lower surfaces of the stacked layers; firing the stacked body; and forming external electrodes at an outer surface of the fired stack body.
    Type: Grant
    Filed: November 25, 2003
    Date of Patent: July 4, 2006
    Assignee: Ceratech Corporation
    Inventors: Myoung-Hui Choi, Soon-Gyu Hong, Sang-Eun Jang
  • Patent number: 7071807
    Abstract: Laminated primary winding for matrix transformers may be assembled from stacked layers of metal foil or stampings having ends of the metal foil or stampings extended successively to make stepped contact areas having as large a contact area as necessary for the application. In some embodiments the stepped contact areas are on ends of the laminated primary winding that extend beyond the matrix transformer. In other embodiments, the stepped contact areas are on complementary mating subassemblies within the transformer.
    Type: Grant
    Filed: March 26, 2004
    Date of Patent: July 4, 2006
    Inventor: Edward Herbert
  • Patent number: 7068140
    Abstract: A coplanar transformer with a capacitor that has the advantage of high space utilization is provided. The coplanar transformer comprises a primary coil and a secondary coil constructed by many conductor segments in a first metal layer and connectors in a second metal layer. The upper plate and lower plate of the capacitor are electrically coupled with the two terminals of the primary coil separately. The upper plate comprises the extended plate from the connected terminal toward the other terminal and the connected conductor segment in the first metal layer, and the lower plate locates in the second metal layer corresponding to the upper plate.
    Type: Grant
    Filed: October 25, 2004
    Date of Patent: June 27, 2006
    Assignee: VIA Technologies, Inc.
    Inventor: Ya-Wei Chou
  • Patent number: 7057488
    Abstract: An integrated inductor comprises a first substantially plane conducting track made on the surface of a substrate and having a shape which defines a predetermined number N of concentric turns. A first pair of access points corresponds to the two respective ends of the said first conducting track. In addition, at least a second pair of access points different from the access points of the first pair, are placed at two respective regions of the first conducting track.
    Type: Grant
    Filed: February 6, 2004
    Date of Patent: June 6, 2006
    Assignee: STMicroelectronics SA
    Inventors: Bart Van Haaren, Cécile Clement, Daniel Gloria
  • Patent number: 7046114
    Abstract: A laminated inductor includes ceramic sheets provided with spiral coil conductor patterns of one turn, ceramic sheets provided with spiral coil conductor patterns of two turns, and ceramic sheets provided with lead-out conductor patterns, which are laminated together. The coil conductor patterns are successively electrically connected in series in regular order through via holes. The via holes are disposed at fixed locations in the ceramic sheets.
    Type: Grant
    Filed: February 14, 2002
    Date of Patent: May 16, 2006
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Keiji Sakata
  • Patent number: 7040014
    Abstract: An object of the present invention is to provide a coil chip having a structure with which downsizing of the coil chip can be realized and a high inductance and a high Q can be obtained and to provide a method of producing such a coil chip. In order to attain the object, according to the present invention, there is provided a coil structure including a core member made of a material having low dielectric loss characteristics, a coil formed by metal plating and wound around the core member, and a layer functioning as a seed for metal plating provided between the core member and the coil.
    Type: Grant
    Filed: January 20, 2004
    Date of Patent: May 9, 2006
    Assignee: TDK Corporation
    Inventor: Shigeru Shoji
  • Patent number: 7042319
    Abstract: The present invention provided a thin-film electromagnet including a magnetic yoke and a thin-film coil, characterized in that the magnetic yoke includes a first magnetic yoke and a second magnetic yoke making contact with the first magnetic yoke, the first magnetic yoke is located at a center of a winding of the thin-film coil, and the second magnetic yoke is arranged above or below the thin-film coil such that the second magnetic yoke faces the thin-film coil, and overlaps at least a part of the thin-film coil.
    Type: Grant
    Filed: August 15, 2002
    Date of Patent: May 9, 2006
    Assignee: Denso Corporation
    Inventors: Nobuyuki Ishiwata, Hiroaki Honjo, Tamaki Toba, Shinsaku Saito, Keishi Ohashi
  • Patent number: 7012497
    Abstract: A transformer (1) serves to produce high electrical currents, in particular, for transforming high alternating and power pulse currents for producing magnetic fields in magnetic technology for magnetizing magnets and magnetic systems, as well as in conversion technology for forming electrically conductive materials by means of a magnetic field. The transformer has at least one primary coil (2) and at least one secondary part (3), which are connected with bus bars (4, 5). The secondary part (3) of the transformer (1) includes at least one electrically conductive plate (6), in which at least one cut-out penetrating the plate (6) is disposed. At least one slit (8) originating from the cut-out (7) is provided, which separates the plate (6) on one side of each cut-out (7) into two parts and produces the required bus bar (5).
    Type: Grant
    Filed: January 26, 2004
    Date of Patent: March 14, 2006
    Assignee: Magnet-Physik Dr. Steingroever GmbH
    Inventor: Dietrich Steingroever
  • Patent number: 6998952
    Abstract: An inductive device (105) is formed above a substrate (225) having a conductive coil formed around a core (109). The coil comprises segments formed from a first plurality of bond wires (113) and a second plurality of bond wires (111). The first plurality of bond wires (113) extends between the core (109) and the substrate (225). Each of the first plurality of bond wires is coupled to two of a plurality of wire bond pads (117, 116). The second plurality of bond wires (111) extends over the core (109) and is coupled between two of the plurality of wire bond pads (117, 119). A shield (141) includes a portion that is positioned between the core (109) and the substrate (225).
    Type: Grant
    Filed: December 5, 2003
    Date of Patent: February 14, 2006
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Yaping Zhou, Susan H. Downey, Sheila F. Chopin, Tu-Anh Tran, Alan H. Woosley, Peter R. Harper, Perry H. Pelley, III
  • Patent number: 6992557
    Abstract: There is disclosed a printed inductor 1 having a spiral coil formed outside a cavity 2 by providing an insulating substrate 3 with the cavity 2 extending in a direction orthogonal to that of the thickness of the insulating substrate 3, forming a plurality of mutually independent printed wiring lines 4 on both the top and bottom faces of the insulating substrate 3 facing each other through the cavity 2, and sequentially and continuously connecting terminals of the printed wiring lines 4 on both the top and bottom faces to each other through a plurality of through holes 5.
    Type: Grant
    Filed: December 15, 2003
    Date of Patent: January 31, 2006
    Assignee: Alps Electric Co., Ltd.
    Inventor: Toru Aoyagi
  • Patent number: 6982609
    Abstract: A balun that includes a first conductor, a second conductor and a third conductor. The first conductor has a length of about one quarter wavelength of a selected center frequency. The first conductor also has a first end connected to a first balanced power amplifier output port. The second conductor has a length of about one quarter wavelength of the selected center frequency. The second conductor also includes a first end connected to a second balanced power amplifier output port and a second end connected a second end of the first conductor. The third conductor has a length of about one quarter wavelength of the selected center frequency. The third conductor has a first end connected to an antenna port and a second end connected to a ground potential.
    Type: Grant
    Filed: July 2, 2003
    Date of Patent: January 3, 2006
    Assignee: Zeevo
    Inventors: Tom McKay, Vas Postoyalko, Edwin Li
  • Patent number: 6980074
    Abstract: A multilayer structure in which all the magnetic elements have the windings edged in the inner layers and the magnetic core which surrounds the winding has the legs penetrating through the multilayer structure. The interconnection between the magnetic elements and the rest of electronic components is done through the layers of the multilayer board, horizontally and vertically through via. For higher power components special cuts are performed in the multilayer board to accommodate the body of the components which may be connected to an external heatsink. The winding arrangement in the transformer is done in a such way to minimize and even eliminate the common mode noise injected through the capacitance between primary and secondary winding. The input filter is constructed to exhibit a differential and a common mode impedance.
    Type: Grant
    Filed: November 5, 1999
    Date of Patent: December 27, 2005
    Assignee: Delta Energy Systems (Switzerland) AG
    Inventor: Ionel Jitaru
  • Patent number: 6975199
    Abstract: A dielectric substrate having an embedded inductor wherein each turn of the inductor traverses several layers such that the top and bottom of each turn of the inductor are parallel to each other but are in different layers and the sides of each turn of the inductor traverse at least one layer to connect the top and bottom of the inductor.
    Type: Grant
    Filed: December 13, 2001
    Date of Patent: December 13, 2005
    Assignee: International Business Machines Corporation
    Inventors: David Clifford Long, Harsaran S. Bhatia, Harvey Charles Hamel, Edward R. Pillai, Christopher David Setzer, Benjamin Paul Tongue
  • Patent number: 6972656
    Abstract: A switching power supply device of the present invention comprises a transformer having at least a first primary coil, a first secondary coil, a second secondary coil, a second primary coil, and laminated in the sequence of the first primary coil, the first secondary coil, the second secondary coil, the second primary coil, and having a configuration wherein a center tap is drawn out from a connecting part between one end of said first secondary coil and one end of said second secondary coil; a switching part for alternately applying a voltage in a forward direction and an inverse direction to said transformer; a rectifying part for rectifying the voltage induced across the center tap of the transformer and the other end of the first secondary coil or the other end of the second secondary coil; a smoothing part for smoothing the voltage of the rectifying part; and a control part for controlling the on-off of the switching part so that the output voltage becomes stable.
    Type: Grant
    Filed: August 11, 2003
    Date of Patent: December 6, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yoshihiro Takeshima, Koji Yoshida, Satoshi Ikeda, Mitsuhiro Matsuo
  • Patent number: 6965289
    Abstract: A common-mode choke coil includes a core having flanges disposed at both ends and a winding section arranged between the flanges. Electrodes are disposed in the flanges, while two pieces of wire are wound around the winding section and ends of the pieces of wire are connected to the electrodes. A ferrite plate with a relative magnetic permeability that is smaller than that of the core is attached on the upper surface of the flanges with an adhesive so as to cover the wire.
    Type: Grant
    Filed: September 17, 2002
    Date of Patent: November 15, 2005
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takaomi Toi, Yoshio Hanato, Tatsuyuki Yamada
  • Patent number: 6952153
    Abstract: An electrical transformer having primary winding segments and secondary winding segments interconnected, respectively, by first and second multilevel printed circuit boards disposed in a pair of overlaying planes and additional segments disposed perpendicular to the overlaying planes.
    Type: Grant
    Filed: February 4, 2003
    Date of Patent: October 4, 2005
    Assignee: Raytheon Company
    Inventors: Boris Solomon Jacobson, Bruce William Chignola, Garo Dakessian, Dennis Robert Kling, Kevin Edward Martin, Eberhardt Praeger, William Edward Wesolowski
  • Patent number: 6948230
    Abstract: The invention relates to an inductor comprising a plurality of interconnected conductive segments interwoven with a substrate. The inductance of the inductor is increased through the use of coatings and films of ferromagnetic materials such as magnetic metals, alloys, and oxides. The inductor is compatible with integrated circuit manufacturing techniques and eliminates the need in many systems and circuits for large off chip inductors. A sense and measurement coil, which is fabricated on the same substrate as the inductor, provides the capability to measure the magnetic field or flux produced by the inductor. This on chip measurement capability supplies information that permits circuit engineers to design and fabricate on chip inductors to very tight tolerances.
    Type: Grant
    Filed: March 19, 2002
    Date of Patent: September 27, 2005
    Assignee: Micron Technology, Inc.
    Inventors: Kie Y. Ahn, Leonard Forbes
  • Patent number: 6947291
    Abstract: An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.
    Type: Grant
    Filed: May 23, 2002
    Date of Patent: September 20, 2005
    Assignee: Xerox Corporation
    Inventors: Christopher L. Chua, Francesco Lemmi, Koenraad F. Van Schuylenbergh, Jeng Ping Lu, David K. Fork, Eric Peeters, Decai Sun, Donald L. Smith, Linda T. Romano
  • Patent number: 6946945
    Abstract: In an electronic component, an element section is formed on a base, and the element section has functions of at least one of inductance, resistor, and capacitor. Resist film is formed on at least the lateral faces of the base. An unnecessary part of patterned resist film is removed, and a protective member is formed on that removed place. Then remaining resist film is removed. This manufacturing method can provide the electronic component excellent in bonding strength between the protective member and the base.
    Type: Grant
    Filed: October 1, 2002
    Date of Patent: September 20, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Satoshi Sato, Takuya Fujimaru, Yasuhiro Izumi, Yoshito Yoneda, Yasunori Tabaru, Yoshihiro Kiyomura
  • Patent number: 6940387
    Abstract: A coil-embedded dust core and a method for manufacturing the coil-embedded dust core are provided. The coil-embedded dust core comprises a coil formed from a flat conductor wound in a coil configuration, and a green body consisting of insulating material-coated ferromagnetic metal particles. This results in a coil-embedded dust core more compact in size but with larger inductance. A rectangular wire can be used as the flat conductor. In addition, parts of the coil may function as terminal sections. In this case, the terminal sections of the coil may be formed wider than other part of the coil. The coil-embedded dust core is less prone to joint failures between a coil and terminal sections and to insulation failures of the coil and the terminal section with respect to the magnetic powder. The coil-embedded dust core is more compact while achieving larger inductance.
    Type: Grant
    Filed: April 2, 2004
    Date of Patent: September 6, 2005
    Assignee: TDK Corporation
    Inventors: Kazuhiko Shibata, Takashi Nagasaka, Junetsu Tamura, Yasuhiko Kitajima, Hideharu Moro, Tsutomu Chou, Tsuneo Suzuki
  • Patent number: 6940381
    Abstract: A Mn—Zn based ferrite having a main component comprised of 51 to 54 mol % of an iron oxide in Fe2O3 conversion, 14 to 21 mol % of a zinc oxide in ZnO conversion and the rest of a manganese oxide, wherein a content (? [ppm]) of cobalt oxide in a CoO conversion with respect to 100 wt % of the main component satisfies a relation formula below. Relation formula: Y1???Y2??(1) Note that Y1 and Y2 are expressed by the formulas below and CoO>0 [ppm]. Y1=(?0.13·B2+1.5·B?15.6A+850)/(0.0003·B+0.0098)?233??(2) Y2=(?0.40·B2+4.6·B?46.7A+2546)/(0.0003·B+0.0098)+1074??(3) The A and B in the above Y1 and Y2 are A=Fe2O3 (mol %) and B=ZnO (mol %).
    Type: Grant
    Filed: December 11, 2003
    Date of Patent: September 6, 2005
    Assignee: TDK Corporation
    Inventors: Masahiko Watanabe, Katsushi Yasuhara
  • Patent number: 6940147
    Abstract: A dielectric layer is formed over a substrate comprising a semiconductor material. A magnetic layer is formed over the dielectric layer. The magnetic layer comprises an amorphous alloy comprising cobalt.
    Type: Grant
    Filed: April 16, 2004
    Date of Patent: September 6, 2005
    Assignee: Intel Corporation
    Inventors: Ankur Mohan Crawford, Donald S. Gardner
  • Patent number: 6940386
    Abstract: An integrated circuit including a differentially excited symmetric microstrip inductor formed over multiple layers while maintaining both electrical and geometrical symmetry.
    Type: Grant
    Filed: November 19, 2003
    Date of Patent: September 6, 2005
    Assignee: Scintera Networks, Inc
    Inventors: Debanjan Mukherjee, Jishnu Bhattacharjee, Abhijit Phanse
  • Patent number: 6940385
    Abstract: In a high-frequency coil device having small dispersion in coil inductance and suitable for use in GHz band and a method of manufacturing the high-frequency coil device, a spirally-shaped fine-pitch coil is embedded in the surface of a polyimide layer as a dielectric substrate so that the bottom surface and side surface of the coil is covered by the polyimide layer. The spirally-shaped coil has an Ni—Cu laminate structure in which an Ni plating layer and a Cu plating layer are laminated, and also the side surface thereof is made substantially vertical while the width thereof is uniform with high precision. The surface of the spirally-shaped coil, that is, the surface of the Ni plating layer serving as the upper layer is coated with an Au plating layer.
    Type: Grant
    Filed: September 30, 2003
    Date of Patent: September 6, 2005
    Assignee: Sony Corporation
    Inventor: Hidetoshi Kusano
  • Patent number: 6937128
    Abstract: An on-chip inductor and/or on-chip transformer includes at least one dielectric layer and at least one conductive winding on the at least one dielectric layer. The conductive winding has a substantially square geometry and has at least its exterior corners geometrically shaped to reduce impedance of the conductive winding at a particular operating frequency. Since the quality factor of an on-chip inductor is inversely proportional to the effective series impedance of an inductor at an operating frequency, by reducing the effective series impedance, the quality factor is increased.
    Type: Grant
    Filed: February 12, 2002
    Date of Patent: August 30, 2005
    Assignee: Broadcom Corp.
    Inventors: Harry Contopanagos, Sissy Kyriazidou
  • Patent number: 6933826
    Abstract: The manufacturing method for components of the inductive type, in particular inductance coils, transformers or antennae, consists in making by micro-machining simultaneously on a first substrate made of magnetic material a plurality of first parts (1) connected to each other by connecting elements (2) or a connecting support, inserting on the arms (8a, 8b, 8c) of these first parts (1) a printed multi-layered plate (4, 5) having openings for the arms and metal windings ending in at least two contact pads (7a, 7b), in placing and securing a second substrate made of magnetic material on the first substrate and the plate, said second substrate having undergone micro-machining to obtain second parts (13) complementary to the first parts. These second parts are connected to each other by connecting elements or a connecting support.
    Type: Grant
    Filed: October 31, 2003
    Date of Patent: August 23, 2005
    Assignee: Ecole Polytechnique Federale de Lausanne
    Inventor: Martin Gijs
  • Patent number: 6930584
    Abstract: A microminiature power converter includes a semiconductor substrate on which a semiconductor integrated circuit is formed, a thin film magnetic induction element, and a capacitor. The thin film magnetic induction element includes a magnetic insulating substrate, and a solenoid coil conductor in which a first conductor is formed on a first principal plane of the magnetic insulating substrate, a second conductor is formed on a second principal plane of the magnetic insulating substrate, and a connection conductor is formed in a through hole passing through the magnetic insulating substrate are connected. A relationship of a length L of the magnetic insulating substrate in a direction vertical to a magnetic field generated by the solenoid coil and a length d of the coil conductor is d?L/2.
    Type: Grant
    Filed: January 16, 2004
    Date of Patent: August 16, 2005
    Assignee: Fuji Electric Device Technology Co., Ltd.
    Inventors: Masaharu Edo, Zenchi Hayashi
  • Patent number: 6927661
    Abstract: The magnetic device consists of a planar winding board, which contains the windings for both the inductor and the transformer. Thus, this invention centers on integrating the windings of multiple magnetic devices, not integrating the cores. By connecting the transformer secondary winding directly to the output inductor winding without using any intermediate headers and/or termination pins or conductive copper traces, both electrical path and the termination resistance will be minimized. Furthermore, the number of headers or termination pins required will also be reduced, which helps to not only alleviate the issue associated with co-planarity of the termination pins, but also reduce the cost of the material and manufacturing.
    Type: Grant
    Filed: May 2, 2003
    Date of Patent: August 9, 2005
    Assignee: TDK Innoveta Inc.
    Inventors: Jin He, Michael Duane Lawrence, Gordon K. Y. Lee, Victor Ke-Ji Lee, Donald Bruce Rose
  • Patent number: 6927650
    Abstract: A common mode choke coil comprises: a holder including side walls which have wire guide strips respectively formed at their sides and which have vertical guide grooves and horizontal flange stoppers both formed at their inner side surfaces; a coil assembly with edgewise windings of a rectangular wire provided around a bobbin with flanges; and a core securing plate spring, wherein the coil assembly is fixedly set in a correct position inside the holder such that protrusions formed at the flanges are put through the guide grooves thereby fixedly holding the bobbin in place horizontally while the flanges are locked by the flange stoppers thereby fixedly holding the bobbin in place vertically, and wherein lead wires of the edgewise windings are bent at upper ends of the wire guide strips, and then extend along the wire guide strips.
    Type: Grant
    Filed: October 22, 2003
    Date of Patent: August 9, 2005
    Assignee: Minebea Co., Ltd.
    Inventor: Toshinori Okamoto
  • Patent number: 6927662
    Abstract: The present invention relates to an integrated transformer configuration having a first coil formed from an electrically conductive material having a spiral course with an essentially rectangular cross section. The transformer has a second coil with a spiral course. The first and the second coils are arranged such that they are electrically insulated from one another. The ratio between the height and the width of the rectangular cross section of the first coil is greater than 1.
    Type: Grant
    Filed: July 18, 2003
    Date of Patent: August 9, 2005
    Assignee: Infineon Technologies AG
    Inventors: Frank Kahlmann, Bernhard Strzalkowski, Wolfgang Werner
  • Patent number: 6927666
    Abstract: An inductor is fabricated on a substrate having a top surface and a bottom surface. The inductor includes a plurality of holes extending through the substrate, wherein the plurality of holes interconnect the top surface and the bottom surface of the substrate. The inductor also includes a plurality of conductive posts formed in the plurality of holes and a plurality of conductive segments formed on the top surface and on the bottom surface that interconnect the conductive posts such that a continuous conductive coil is formed. The inductor also includes a magnetic core that occupies substantially the entire volume enclosed by the conductive coil.
    Type: Grant
    Filed: November 23, 2004
    Date of Patent: August 9, 2005
    Assignee: Micron Technology, Inc.
    Inventors: Kie Y. Ahn, Leonard Forbes
  • Patent number: 6927663
    Abstract: A method of forming a surface mount transformer. The method comprises winding insulated wire around a magnetic core to form at least one secondary transformer coil, winding insulated wire around the magnetic core to form at least one primary transformer coil, attaching wire ends of the at least one primary coil to at least first and second vias of a printed circuit board (PCB), attaching wire ends of the at least one secondary coil to at least third and fourth vias of the PCB, affixing the coils and the magnetic core to the first side of the PCB, and attaching the coil wire ends flush to a surface of the vias on the second side of the PCB.
    Type: Grant
    Filed: July 23, 2003
    Date of Patent: August 9, 2005
    Assignee: Cardiac Pacemakers, Inc.
    Inventors: Tom Iverson, Bart Carey, Robert S. Harguth
  • Patent number: 6924725
    Abstract: A coil apparatus includes a coil trace, a semiconductor substrate and a dielectric layer arranged on the semiconductor substrate, at least parts of the coil trace being arranged above a recess in the dielectric layer. The coil apparatus further includes a support apparatus arranged in the recess and connected to the coil trace for mechanically supporting the coil trace. The supporting apparatus is preferably a conductive column that is not removed when the recessed is formed in the dielectric layer.
    Type: Grant
    Filed: September 21, 2004
    Date of Patent: August 2, 2005
    Assignee: Infineon Technologies AG
    Inventors: Kevni Bueyuektas, Klaus Koller, Karlheinz Mueller
  • Patent number: 6922129
    Abstract: A multilayered circuit board according to the present invention includes at least first and second stacked insulating layers. The first insulating layer has thereon a first electric conductor made of a conductive film constituting an inductor and a first electrode made of a conductive film constituting a capacitor. The second insulating layer has thereon a second electrode made of a conductive film constituting a capacitor. The first and second insulating layers are stacked such that the first and second electrodes are opposed to each other through the insulating layers. Therefore this provides a circuit board having a capacitor and an inductor through the use of the two insulating layers, thus providing an inexpensive thin circuit board with small parts count and high work-efficiency compared with the use of three insulating layers in a related art.
    Type: Grant
    Filed: October 20, 2003
    Date of Patent: July 26, 2005
    Assignee: Alps Electric Co., Ltd.
    Inventor: Toru Aoyagi
  • Patent number: 6922128
    Abstract: A method for forming a spiral inductor (11) or component of a transformer, compatible with very large scale integrated processing, that achieves a higher Q value without occupying more space by splitting at least one turn (13 51) as two or more crisscrossing or interwoven smaller-width turns (13a 13b 52 53 54 55). The at least one turn (51) may, for example, be split into four turns paired up to provide two pairs of two turns, and the turns of each pair may then be interwoven or crisscrossed, and then the two pairs may also be interwoven or crisscrossed. The splitting of a turn into two or more smaller-width turns results in the current being divided among the smaller-width turns.
    Type: Grant
    Filed: June 18, 2002
    Date of Patent: July 26, 2005
    Assignee: Nokia Corporation
    Inventors: Ari Vilander, Mikael Svard, Lassi Hyvonen
  • Patent number: 6922127
    Abstract: A raised on-chip planar inductor. An inductor is fabricated on a substrate. The inductor, except for an anchoring extremity, is lifted from the substrate, preferably by application of a magnetic field to a magnetic layer formed on the inductor. The lifting of the inductor deforms a plastic bending region. After the magnetic field is removed, the inductor remains raised with respect to the substrate.
    Type: Grant
    Filed: May 23, 2002
    Date of Patent: July 26, 2005
    Assignee: The Trustees of the University of Illinois
    Inventors: Jun Zou, Chang Liu, Jose Schutt-Aine
  • Patent number: 6922125
    Abstract: Circuit Elements such as capacitors and inductors are formed from electroconductive material printed on a sheet. By printing lines in electroconductive material on both sides of a sheet, a capacitor is generated with the sheet serving as the capacitor's dielectric. If a series of parallel lines is printed at an angle with respect to a sheet and the sheet is subsequently rolled so that one end of each line engages another line to create a coil and the ends of the coil are connected across a current source, an inductor is created. The inductor can be used with another inductor to form a transformer. If two identical inductor sheets are placed one on top of the other and both are rolled to form concentric inductors, the resultant circuit element has both inductance and capacitance properties.
    Type: Grant
    Filed: July 27, 2001
    Date of Patent: July 26, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Brian Craig Lee
  • Patent number: 6919775
    Abstract: For a network coupler for network users in a network comprising at least two lines, a simultaneous data and energy transfer is ensured in that the network coupler is formed in such a way that it is suitable for data transfer via the two lines (1, 2) of the network and for coupling out energy from the two lines (1, 2) of the network to which a terminal of a voltage source is coupled, in that the network coupler symmetrically couples energy into and/or out of the two lines (1,2), in that the network coupler couples the data symmetrically, differentially and inductively or capacitively into and/or out of the two lines (1, 2), and in that the network coupler symmetrically terminates the two lines (1, 2).
    Type: Grant
    Filed: May 25, 2004
    Date of Patent: July 19, 2005
    Assignee: Koninklijke Philips Electronics N.V.
    Inventors: Matthias Wendt, Wolfgang Budde, Peter Fuhrmann
  • Patent number: 6917274
    Abstract: A stacked coil device comprising: an inner electrode layer formed of at least two parts and having a non-magnetic electrode region and an inner magnetic region formed as one layer, the non-magnetic electrode region being provided with an opening at a center thereof and provided with an electrode pattern on at least one surface of an upper surface and a lower surface thereof and the inner magnetic region positioned at the center opening and a lateral surface of the non-magnetic electrode region; a cover layer in contact with both surfaces of the inner electrode layer; and an external electrode terminal electrically connected to the electrode pattern.
    Type: Grant
    Filed: October 1, 2003
    Date of Patent: July 12, 2005
    Assignee: Ceratech Corporation
    Inventors: Soon-Gyu Hong, Myoung-Hui Choi, Sang-Eun Jang
  • Patent number: 6914513
    Abstract: This invention describes materials system and processing conditions for manufacturing magnetic circuit components such as induction coils and transformers that are non wire-wound, miniature in size and, have a low manufacturing cost.
    Type: Grant
    Filed: November 6, 2002
    Date of Patent: July 5, 2005
    Assignee: Electro-Science Laboratories, Inc.
    Inventors: Richard L. Wahlers, Cornelius Y. D. Huang, Alvin H. Feingold, Merrill R. Heinz, Michael Alan Stein
  • Patent number: 6914508
    Abstract: A transformer has a primary winding made from a first conducting trace formed on a first multilayer printed circuit board, and a secondary winding made from a second conducting trace formed on a second multilayer printed circuit board. The primary winding is magnetically coupled to the secondary winding. The windings are etched as traces in copper layers of the PC boards as spirals. The spiral of one copper layer is connected to the spiral of a different copper layer by a via, or vias, formed through the insulating layer of the PC board. The vias are drilled, cleaned, and plated with conducting material, for example copper. By using multiple layers, and by connecting spiral windings of each layer to the windings of the next layer by use of vias, any number of turns can be built into a primary winding, or into a secondary winding.
    Type: Grant
    Filed: August 15, 2002
    Date of Patent: July 5, 2005
    Assignee: Galaxy Power, Inc.
    Inventors: Andrew Ferencz, Gregory A. Zvonar, Bernhard Schroter, Gerald Miller, William Ng
  • Patent number: 6914512
    Abstract: A 3-line balun transformer includes an unbalanced port for an unbalanced signal, first and second balanced ports for balanced signals, the balanced signals being the same in level and 180 degrees out of phase with each other, a first line having its first end connected to the unbalanced port and its second end connected to ground, a second line arranged in parallel with the first line while being spaced apart from the first line, the second line having its first end and its second end connected to the first balanced port, and a third line arranged in parallel with the second line while being spaced apart from the second, the third line having its first end connected to the first end of the second line and its second end connected to the second balanced port.
    Type: Grant
    Filed: June 16, 2003
    Date of Patent: July 5, 2005
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Dong Seok Park, Nam Chul Kim, Jeong Ho Yoon, Byoung Hwa Lee, Sang Soo Park
  • Patent number: 6914509
    Abstract: A printed circuit transformer includes a first wiring layer, a second wiring layer, a primary conductive coil including a first conductive trace, a second conductive trace, a third conductive trace, and a fourth conductive trace, which are on the first wiring layer or the second wiring layer, a first via plug, a second via plug, and a third via plug for connecting the ends of the conductive traces in the primary conductive coil, and a secondary conductive coil including a fifth conductive trace, a sixth conductive trace, a seventh conductive trace, and a eighth conductive trace, which are on the first wiring layer or the second wiring layer, a fourth via plug, a fifth via plug, and a sixth via plug for connecting the ends of the conductive traces in the secondary conductive coil.
    Type: Grant
    Filed: July 2, 2003
    Date of Patent: July 5, 2005
    Assignee: Via Technologies Inc.
    Inventors: Jay Yu, Jimmy Hsu, Nicole Li
  • Patent number: 6911889
    Abstract: A filter device may include a plurality of ferrite filters laminated together in vertically stacked relation, where each ferrite filter may include a pair of ferrite layers laminated together in vertically stacked relation and a lateral conductor extending therebetween. The filter device may also include at least one vertical conductor connecting the lateral conductors together in series. Moreover, at least some of the ferrite filters may have different operating characteristics. In particular, the different operating characteristics may be different impedance versus frequency characteristics to thereby broaden an attenuation frequency band of the filter device.
    Type: Grant
    Filed: August 20, 2002
    Date of Patent: June 28, 2005
    Assignee: Steward, Inc.
    Inventors: Lesley Paige Bodley, Marjorie E. Smith, Richard W. Meadors, Henry G. Paris, James A. Smith