Planar Type Patents (Class 336/232)
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Publication number: 20100237977Abstract: A coil component includes coil windings, and resin portions that are insulating members having electrical insulation properties and integrally formed with the coil windings covering parts of surfaces of the coil windings, and the coil component is sandwiched by magnetic core members in directions of winding axes of the coil windings. The coil windings are composed of a plurality of plate-like coil members in a ring shape having ends joined in a stacking direction with a clearance therebetween to be continuous in a predetermined winding direction. The resin portions that are the insulating members cover outermost plate surfaces of the coil members facing the magnetic core members, a space between the adjacent coil members, and inner perimeter edges of the coil members, and have openings along the directions of winding axes of the coil windings.Type: ApplicationFiled: March 12, 2010Publication date: September 23, 2010Applicant: TDK CORPORATIONInventor: Akira IKEZAWA
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Patent number: 7796007Abstract: In an on-chip transformer, external electromagnetic field influences are reduced by providing an isolation transformer having primary and secondary windings with a figure 8 configuration so that current induced by an external magnetic field is nulled.Type: GrantFiled: December 8, 2008Date of Patent: September 14, 2010Assignee: National Semiconductor CorporationInventors: Peter J. Hopper, William French, Kyuwoon Hwang
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Patent number: 7786840Abstract: The present invention is an optimized geometry for stacking multiple windings, where each winding multiple-turn coil having both a start lead and a finish lead on a perimeter of the coil. The start lead of each winding of the stack is indexed respective of adjacent windings of the stack.Type: GrantFiled: June 25, 2006Date of Patent: August 31, 2010Inventor: Jonathan Nord
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Patent number: 7785697Abstract: The present invention provides a thin film device in which resin film does not easily separate. In a thin film device, a conductor pattern is formed on one of the main surfaces of a plate-shaped base, and the conductor pattern is covered with a resin film. This conductor pattern has a bottom face disposed on the main surface of the base, a top face that faces the bottom face and is distant from the main surface of the base, and two side faces that connect the bottom face and the top face. A depressed portion is formed in these side faces, and an insulation film extends into the depressed portion.Type: GrantFiled: June 26, 2007Date of Patent: August 31, 2010Assignee: TDK CorporationInventors: Taku Masai, Hitoshi Sakuma, Kyung-Ku Choi, Toshiyasu Fujiwara
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Patent number: 7786832Abstract: An inductor (100) includes a magnetic core (30) and an insulative housing (10). The magnetic core has a wire wound (40) around a central portion (33) thereof, a projecting portion (31) formed on a lower end thereof and a stepped-portion (321) extending downwardly from the projecting portion. The insulative housing encloses the stepped-portion and the projecting portion of magnetic core to thereby integrate the insulative housing and the magnetic core together by insert molding.Type: GrantFiled: June 5, 2007Date of Patent: August 31, 2010Assignee: Hon Hai Precision Ind. Co., Ltd.Inventor: Chih-Min Lin
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Patent number: 7786838Abstract: A wire wound electronic part includes a ferrite core comprising ferrite having a columnar wire wound core and flanges formed at both ends thereof, a coil conductor wound around the wire wound core of the ferrite core, and at least a pair of terminal electrodes having a Cu conduction layer disposed to the outer surface of the flange, in which both ends of the coil conductor wound around the wire wound core are conductively connected to the terminal electrodes. The terminal electrode is formed by coating an electrode paste containing a Cu powder and a glass frit to the outer surface of the ferrite core, and then applying a heat treatment to the ferrite core. There is a reaction layer of a portion of the ferrite core and the glass frit at a boundary between the ferrite core and the Cu conduction layer. The terminal electrodes has the peel strength identical with that of an existent Ag terminal electrode, without forming a plate layer.Type: GrantFiled: August 25, 2008Date of Patent: August 31, 2010Assignee: Taiyo Yuden Co., Ltd.Inventors: Yoshinari Nakada, Takayuki Maruyama, Hideharu Suzuki, Koihci Iguchi, Takahiro Samata, Satoshi Kimura
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Patent number: 7772956Abstract: A multilayer transformer component includes a chip body including a primary-side coil and a secondary-side coil, and first to fourth external electrodes. The primary-side coil includes a body portion, a first lead, and a second lead, and the secondary-side coil includes a body portion, a third lead, and a fourth lead. A first projection and a second projection of each body portion are arranged to lie substantially on a linear line. The first lead and the fourth lead are arranged to be line-symmetrical with respect to a center line which is arranged at an approximate center between respective distal ends of the first projection and the second projection, and which is perpendicular or substantially perpendicular to an overlying direction of the primary-side and secondary-side coils. The second lead and the third lead are also arranged to be line-symmetrical with respect to the center line.Type: GrantFiled: June 12, 2009Date of Patent: August 10, 2010Assignee: Murata Manufacturing Co., Ltd.Inventors: Takaomi Toi, Kosuke Ishida, Daisuke Ishide, Kazuhide Kudo
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Patent number: 7768370Abstract: An electromagnetic assembly which has a base, at least one winding, and a magnetic core connected to the base, where at least one winding is mounted on the magnetic core. A housing part encloses at least part of at least one winding, and a printed circuit board is mounted to the housing part. The electromagnetic assembly can be a transformer or inductor, for example.Type: GrantFiled: August 29, 2007Date of Patent: August 3, 2010Assignee: Hammond Power Solutions, Inc.Inventor: Michael J. Brown
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Patent number: 7768372Abstract: An inductance formed in a stacking of insulating layers, the inductance comprising first and second half-turns, each first half-turn being at least partly symmetrical to one of the second half-turns, the first half-turns being distributed in first groups of first half-turns at least partly aligned along the insulating layer stacking direction and the second half-turns being distributed in second groups of second half-turns at least partly aligned along the insulating layer stacking direction. For any pair of first adjacent half-turns of a same group, one of the first half-turns in the pair is electrically series-connected to the other one of the first half-turns in the pair by a single second half turn and for each pair of second adjacent half-turns of a same group, one of the second half-turns in the pair is electrically series-connected to the other one of the second half-turns in the pair by a single first half-turn.Type: GrantFiled: July 17, 2008Date of Patent: August 3, 2010Assignee: STMicroelectronics, SAInventor: Frederic Gianesello
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Patent number: 7764158Abstract: An electromagnetic induction type processing apparatus includes a coil and a functional device. The coil is configured to generate electromotive force from a magnetic field supplied from the outside. The functional device is configured to operate with the electromotive force and containing conductive substance having a conductivity with which eddy current to be generated in the conductive substance by the magnetic field supplied from the outside is suppressed such that the lowest electromotive force for operation of the functional device is assured regardless of a magnetic field generated by the eddy current and acting in the opposite direction to that of the magnetic field supplied from the outside.Type: GrantFiled: July 17, 2007Date of Patent: July 27, 2010Assignee: Sony CorporationInventors: Fumio Kubono, Yoshihito Ishibashi, Shoji Nagai, Yuko Yoshida
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Patent number: 7760064Abstract: An apparatus includes an electrically conductive generally planar strip having a thickness, having a width greater than the thickness and having a length greater than the width. The strip is arranged in alternating length segments. Each adjacent pair of length segments are oriented about divergent axes and are joined by a respective transition arrangement. Each respective transition arrangement presents the strip foldingly lapped upon itself in a laminate structure.Type: GrantFiled: May 22, 2007Date of Patent: July 20, 2010Assignee: Lineage Power CorporationInventors: Arthur Ray Martin, Roger Dale Grandchampt
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Patent number: 7755463Abstract: The claimed invention relates to arrangements of inductors and integrated circuit dice. One embodiment pertains to an integrated circuit die that has an inductor formed thereon. The inductor includes an inductor winding having a winding input and a winding output. The inductor also comprises an inductor core array having at least first and second sets of inductor core elements that are magnetically coupled with the inductor winding. Each inductor core element in the first set of inductor core elements is formed from a first metallic material. Each inductor core element in the second set of inductor core elements is formed from a second metallic material that has a different magnetic coercivity than the first magnetic material. The inductor further comprises a set of spacers that electrically isolate the inductor core elements. Some embodiments involve multiple inductor windings and/or multiple inductor core elements that magnetically interact in various ways.Type: GrantFiled: October 13, 2008Date of Patent: July 13, 2010Assignee: National Semiconductor CorporationInventors: Peter J. Hopper, Peter Johnson, Peter Smeys, Andrei Papou
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Patent number: 7755464Abstract: An inductor device is provided. The inductor includes: a first inductor; a second inductor, wherein the first inductor and the second inductor are arranged such that a magnetic field generated by the first inductor and passing through the inside of a loop formed from the second inductor comprises a first magnetic field and a second magnetic field, the first magnetic field passing from the topside of the loop to the downside of the loop, the second magnetic field passing from the downside of the loop to the topside of the loop.Type: GrantFiled: December 17, 2008Date of Patent: July 13, 2010Assignee: Fujitsu LimitedInventor: Kazuya Hisamitsu
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Patent number: 7750434Abstract: A first wiring layer in a circuit substrate structure is provided with a first inductor and a second inductor. A dielectric layer is provided with a first via and a second via electrically connected to the first inductor and the second inductor, respectively. A second wiring layer is provided with: a bridge electrically connecting the first via and the second via; and a conductive pattern provided around the bridge, the outer edge of the conductive pattern being located outside the outer edge of the first wiring pattern and the second wiring pattern in the first wiring layer. The bridge functions as a coplanar line and suppresses generation of electromagnetic field.Type: GrantFiled: January 20, 2006Date of Patent: July 6, 2010Assignee: Sanyo Electric Co., Ltd.Inventors: Toshikazu Imaoka, Tetsuro Sawai, Atsushi Saita, Takeshi Yamaguchi, Makoto Tsubonoya, Kazunari Kurokawa
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Patent number: 7750783Abstract: A coil unit includes a planar coil, a magnetic member that is provided under the planar coil, a magnetic flux leakage prevention member that is provided under the magnetic member, and a heat sink that is provided under the magnetic flux leakage prevention member. The magnetic flux leakage prevention member is electrically insulated from the heat sink. The magnetic flux leakage prevention member is insulated from the heat sink using a double-sided adhesive tape, for example. Since the heat sink dissipates heat generated from the planar coil and is electrically insulated from the magnetic flux leakage prevention member, the heat sink does not function as a member which receives a magnetic flux.Type: GrantFiled: February 19, 2008Date of Patent: July 6, 2010Assignee: Seiko Epson CorporationInventors: Minoru Hasegawa, Masao Kuroda
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Patent number: 7743482Abstract: A semiconductor device and fabricating method thereof are provided. A first substrate with an inductor cell and a through-electrode is connected to a second substrate having an RF device circuit unit. The first substrate can be stacked on the second substrate, and a connecting electrode can electrically connect the inductor cell to the RF device circuit unit.Type: GrantFiled: September 28, 2007Date of Patent: June 29, 2010Assignee: Dongbu Hitek Co., Ltd.Inventor: Jae Won Han
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Patent number: 7746208Abstract: The present invention describes a winding for a transformer comprising first (60) and second (70) planar sections which are arranged parallel to each other. First (1, e.g., from 602 to 603)) and second (2, e.g., from 703 to 704)) current paths are arranged on the first and second planar sections. The first and second current paths are connected to each other by means of an interconnection (603/703). The first and second current (603/703) paths are respectively angled with respect to a direction along which the first and second planar sections are extending.Type: GrantFiled: December 8, 2006Date of Patent: June 29, 2010Assignee: Koninklijke Philips Electronics N.V.Inventors: Christoph Loef, Bernd Ackermann
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Patent number: 7733207Abstract: Provided are an inductor, which is vertically formed, and an electronic device having the inductor, and more particularly, an inductor capable of minimizing loss of a surface area and accomplishing high efficiency impedance by vertically forming the inductor in a plurality of insulating layers, and an electronic device having the same. The inductor includes a plurality of conductive lines disposed in the insulating layers; and vias vertically formed in the insulating layers to electrically connect the plurality of conductive lines. When a board or an electronic device including an inductor proposed by the present invention is manufactured, the inductor can occupy a minimum area in the electronic device or board while providing high inductance. In particular, the surface area of the electronic device or board occupied by the inductor can be remarkably decreased to reduce manufacturing costs.Type: GrantFiled: March 24, 2008Date of Patent: June 8, 2010Assignee: Electronics and Telecommunications Research InstituteInventors: Ho Gyeong Yun, Kwang Seong Choi, Jong Tae Moon
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Patent number: 7719398Abstract: A laminated coil includes a laminated body having magnetic body sections that are provided on both main surfaces of a non-magnetic body section and include a plurality of stacked magnetic layers, the non-magnetic body section including at least one non-magnetic layer, and a coil including helically connected coil conductors provided in the laminated body. The conductor width of at least one of the coil conductors provided inside the non-magnetic body sections and the coil conductors provided on both main surfaces of the non-magnetic body sections is greater than the conductor width of the other coil conductors in the laminated body.Type: GrantFiled: December 27, 2005Date of Patent: May 18, 2010Assignee: Murata Manufacturing Co., Ltd.Inventor: Keniichi Tsuzuki
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Publication number: 20100109831Abstract: A multi-turn coil formed from a single sheet of conductive material and the method of forming same eliminates the use of a weld. The multi-turn coil includes a single sheet of conductive material having at least a first turn in a first plane, and at least a second turn in a second plane, where the first plane is parallel to the second plane. An interconnecting fold interconnects the first and second turns, and any additional turns. The method of forming a multiple turn coil includes providing a continuous strip of conductive material having at least first and second turns extending through substantially 360° and formed in a first plane. The method further includes displacing at least the first turn from the first plane into generally overlapping, parallel relation with the second turn.Type: ApplicationFiled: October 31, 2008Publication date: May 6, 2010Inventors: Andrew Lawrence Podevels, Gary Robert Allen, Aaron Edward Franczyk, Glenn Howard Kuenzler, Derek Lee Watkins, Joshua Ian Rintamaki, Jianwu Li
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Patent number: 7710234Abstract: An embodiment is a magnetic via. More specifically, an embodiment is a magnetic via that increases the inductance of, for example, an integrated inductor or transformer while mitigating eddy currents therein that may limit the operation of the inductor or transformer at high frequency.Type: GrantFiled: August 6, 2008Date of Patent: May 4, 2010Assignee: Intel CorporationInventors: Donald S. Gardner, Gerhard Schrom, Peter Hazucha, Fabrice Paillet, Tanay Kamik
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Patent number: 7705704Abstract: An inductor structure disposed over a substrate and including a coil layer is provided. The coil layer has a plurality of coil turns electrically connected with each other. An innermost coil turn of the coil layer has a portion with a narrower width in a region with a higher magnetic flux density than that in the other region with lower magnetic flux density.Type: GrantFiled: March 19, 2008Date of Patent: April 27, 2010Assignee: Via Technologies, Inc.Inventors: Sheng-Yuan Lee, Hsiao-Chu Lin
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Patent number: 7692527Abstract: A common mode choke coil is provided with first and second coil conductors that are magnetically coupled to each other, a third coil conductor that is electrically connected in series to the first coil conductor and substantially not magnetically coupled to the first coil conductor, a fourth coil conductor that is electrically connected in series to the second coil conductor and substantially not magnetically coupled to the second coil conductor, a first contact conductor for connecting the third coil conductor with the inner end of the first coil conductor, and a second contact conductor for connecting the fourth coil conductor with the inner end of the second coil conductor. The third coil conductor and the fourth coil conductor are substantially not magnetically coupled, and are in a linear symmetrical relationship based on a prescribed center line.Type: GrantFiled: May 13, 2008Date of Patent: April 6, 2010Assignee: TDK CorporationInventors: Tomokazu Ito, Takeshi Okumura, Toshio Tomonari
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Patent number: 7688173Abstract: A common mode choke coil includes a core, external electrodes, a pair of windings, and a top plate. The core includes a winding core portion and a pair of flanges disposed at respective ends thereof. The external electrodes are provided at lower portions of the flanges. The pair of the windings is wound around the winding core portion of the core, and ends thereof are connected to the external electrodes, respectively. A lower surface and a side surface of the top plate are covered with a metal film and are adhered to upper surfaces of the flanges with an adhesive. Preferably, magnetic powder is mixed in the adhesive.Type: GrantFiled: April 17, 2009Date of Patent: March 30, 2010Assignee: Murata Manufactoring Co., Ltd.Inventors: Takahiro Azuma, Yoshie Nishikawa, Takahiro Aoki, Yoshimasa Goto, Yasushi Saito, Shinya Hirai, Yu Ishiwata, Tetsuya Morinaga
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Patent number: 7688159Abstract: A SAW duplexer includes a first SAW filter having a passband with a relatively low frequency, and a second SAW filter having a passband with a relatively high frequency. The first and second SAW filters each have a ladder-shaped circuit configuration. A bridging inductor is connected in parallel to at least one serial arm resonator in the second SAW filter. The bridging inductor includes a coiled portion provided on a multilayer package substrate. The coiled portion is defined by connecting first to third wires provided on first to third layers by via-hole conductors. First, third, and fifth via-hole conductors that define a coil return wire portion are disposed inside the coiled portion.Type: GrantFiled: November 19, 2007Date of Patent: March 30, 2010Assignee: Murata Manufacturing Co., Ltd.Inventors: Masashi Omura, Norio Taniguchi
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Patent number: 7675397Abstract: A transformer includes: a multilayer board; one or more input conductive lines formed on the multilayer board, whose both ends connected to input terminals of a positive signal and a negative signal, respectively; one output conductive line formed adjacent to the one or more input conductive lines to form an electromagnetic coupling with the one or more input conductive lines, whose one end is connected to an output terminal and another end is connected to a ground; a power supply pad formed in an area of the one or more input conductive lines; and a harmonics remover formed between the one end and the another end of the output conductive line to remove harmonics components of a signal outputted from the output conductive line.Type: GrantFiled: April 9, 2008Date of Patent: March 9, 2010Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Ki Joong Kim, Shinichi Iizuka, Sang Hee Kim, Hyo Keun Bae, Youn Suk Kim
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Publication number: 20100052839Abstract: Transformers and methods of manufacture thereof are disclosed. In one embodiment, a transformer includes a semiconductor workpiece and a packaging system disposed over the semiconductor workpiece. The packaging system includes a redistribution layer. At least a portion of at least one winding of the transformer is disposed in the redistribution layer of the packaging system.Type: ApplicationFiled: September 4, 2008Publication date: March 4, 2010Inventors: Koen Mertens, Marc Tiebout, Konrad Hirsch
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Patent number: 7663460Abstract: A planar transformer comprises a primary coil board including a primary coil, a secondary coil board including a secondary coil, a heat sink integrally having a spacer portion, and a magnetic core assembly mounted to the primary coil board and the secondary coil board. The spacer portion is inserted into a gap between and facing the primary coil board and the secondary coil board and at least a surface of the heat sink is electrical insulating.Type: GrantFiled: September 10, 2007Date of Patent: February 16, 2010Assignee: TDK CorporationInventor: Nobuaki Suzuki
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Publication number: 20100026442Abstract: In a method of manufacturing an antenna structure (16), the following steps are carried out: a) providing a process support (1), b) applying a process support coating (2) to a work surface (1 a) of the process support (1), c) producing a negative (3) of the antenna structure in the process support coating (2) by removing corresponding regions of the process support coating along the contours of the antenna structure to be produced, d) introducing a release agent (4) into the negative antenna structure (3) of the process support coating, e) introducing an electrically conductive antenna material (5) into the negative antenna structure (3) of the process support coating (2), optionally followed by curing of the antenna material (5), f) joining the antenna material (5) to an antenna substrate (7) by means of an adhesive (6), and g) pulling the antenna structure (16) off the process support (1), said antenna structure being joined to the antenna substrate (7) and made of the antenna material (5).Type: ApplicationFiled: August 17, 2005Publication date: February 4, 2010Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V.Inventor: Gerald Schaffler
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Patent number: 7656260Abstract: A wire wound electronic part includes a core having a wire wound core and flanges formed on both ends thereof, a coil conductor wound around the wire wound core and terminal electrodes disposed at the bottom of the flange, in which both ends of the coil conductor are conductively connected to the terminal electrodes by a solder, wherein a pair of grooves are formed at the bottom crossing the wire wound core of one of the flanges. The groove has a bottom and side walls disposed being slanted on both sides thereof, in which the vertical height for the side wall is formed larger than the length for the bottom of the side wall. The terminal electrodes are contained in the groove, and edge portion in the lateral direction of the terminal electrode is restricted by the side wall of the groove.Type: GrantFiled: August 25, 2008Date of Patent: February 2, 2010Assignee: Taiyo Yuden Co., Ltd.Inventors: Hideharu Suzuki, Yoshinari Nakada, Takayuki Maruyama, Koichi Iguchi
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Patent number: 7656262Abstract: There is provided a balun transformer, in which first to fourth layer coils are stacked and coupled magnetically; one end of each coil of the first to fourth layer coils is grounded; the second and third layer coils are connected in parallel, an unbalanced signal is input/output to/from a common terminal of the second and third layer coils; a first balanced signal is input/output to/from the other end of the first layer coil; and a second balanced signal is input/output to/from the other end of the fourth layer coil.Type: GrantFiled: February 14, 2008Date of Patent: February 2, 2010Assignee: Sony CorporationInventor: Akira Muto
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Patent number: 7656259Abstract: A method is proposed to manufacture a precise multi-pole magnetic component for using in magnetic encoders. A special layout of the circuit pattern is designed and formed on a printed circuit board (PCB). Alternate and regular magnetic field is induced according to Ampere's law after a current flowing through the circuit on the PCB. The multi-pole magnetic component with fine magnetic pole pitch is achieved by forming the high-density circuit patterns on a substrate using the PCB technology.Type: GrantFiled: August 5, 2005Date of Patent: February 2, 2010Assignee: Industrial Technology Research InstituteInventors: Kuo-Chi Chiu, Der-Ray Huang, Han-Ping Shieh
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Publication number: 20100001827Abstract: A transformer, adapted for being configured in a wiring substrate, is provided. The transformer includes a first plane coil and a second plane coil. The first plane coil includes a plurality of first loops. The second plane coil includes a plurality of second loops. A first bundle constituted by at least two adjacent first loops and a second bundle constituted by at least two adjacent second loops are stridden one over another.Type: ApplicationFiled: March 16, 2009Publication date: January 7, 2010Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Chi-Han Chen, Pao-Nan Lee
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Publication number: 20100001826Abstract: An inductor may be formed from a magnetic film on a package substrate. Conductors coupled either to a die or a voltage converter extend perpendicularly through the film to conductive plates, defining current paths through and across the film.Type: ApplicationFiled: July 2, 2008Publication date: January 7, 2010Inventors: Donald Gardner, Gerhard Schrom, Fabrice Paillet, Shamala Chickamenahalli
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Publication number: 20090314434Abstract: The present invention discloses an inductively coupled coil and an inductively coupled plasma device using the same. The inductively coupled coil comprises an internal coil and an exterior coil which are respective from each other and coaxially arranged, internal coil comprising a plurality of internal respective branches having the same configurations which are nested together, the plurality of internal respective branches being arranged symmetrically with respect to an axis of the inductively coupled coil; the external coil comprising a plurality of external respective branches having the same configurations which are nested together, the plurality of external respective branches being arranged symmetrically with respect to the axis of the inductively coupled coil. The inductively coupled coil is located on the reaction chamber of the inductively coupled plasma device and is connected to a RF source.Type: ApplicationFiled: January 26, 2007Publication date: December 24, 2009Inventors: Qiaoli Song, Jianhui Nan
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Publication number: 20090284341Abstract: A coil unit includes a coil formed by winding a coil wire, a wiring substrate, and a magnetic substance for receiving magnetic lines of force generated by the coil. The wiring substrate includes a connection terminal connected to both ends of the coil, an external connection terminal, and a wiring pattern for connecting the connection terminal and the external connection terminal. No circuit element other than the coil is mounted on the wiring substrate.Type: ApplicationFiled: April 24, 2009Publication date: November 19, 2009Applicant: SEIKO EPSON CORPORATIONInventors: Hirofumi Okada, Yoichiro Kondo
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Publication number: 20090267721Abstract: A coil unit includes a coil and a magnetic substance for receiving magnetic force lines generated by the coil, the magnetic substance including a first magnetic substance having a first magnetic permeability and a second magnetic substance having a second magnetic permeability.Type: ApplicationFiled: April 22, 2009Publication date: October 29, 2009Applicant: SEIKO EPSON CORPORATIONInventors: Hirofumi Okada, Mikimoto Jin, Kentaro Yoda, Takahiro Kamijo
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Patent number: 7598836Abstract: A multilayer winding inductor. The inductor at least includes multi-level interconnect and single-level interconnect structures. The multi-level interconnect structure includes a plurality of conductive plugs and a plurality of looped conductive traces overlapping and separated from each other. Each looped conductive trace has a gap to define first and second ends and at least two conductive plugs disposed between the neighboring looped conductive traces. The single-level interconnect structure is located over the multi-level interconnect structure, comprising an uppermost looped conductive trace and a second conductive plug. The uppermost looped conductive trace has a gap to define first and second ends, and the second conductive plug is disposed between the second end of the uppermost looped conductive trace and the first end of the looped conductive trace adjacent thereto, thereby electrically connecting the multi-level and single-level interconnect structures.Type: GrantFiled: November 13, 2006Date of Patent: October 6, 2009Assignee: Via Technologies, Inc.Inventor: Sheng-Yuan Lee
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Publication number: 20090243785Abstract: The invention relates to a reader antenna for use with radio frequency identification (RF ID) transponders. A reader and the transponder are connected to one another via a wireless interface. It is the object of the invention to provide a reader antenna for RFID systems whose transmission range is increased in comparison with a transmission range in a normal air environment without metallic influence with otherwise the same electrical and electromagnetic parameters. The reader antenna in accordance with the invention is provided with an antenna which is formed with a coil having at least one winding. The coil lies on a side of a carrier remote from a transponder and the carrier is made exclusively of a soft magnetic material.Type: ApplicationFiled: March 20, 2009Publication date: October 1, 2009Applicant: Fraunhofer-Gessellschaft zur Forderung der angewandten Forschung e.V.Inventors: Frank Deicke, Hagen Gratz, Wolf-Joachim Fischer
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Patent number: 7583171Abstract: The present invention efficiently radiates heat generated by a coil while suppressing a decrease in the efficiency of generation of magnetic fields caused by an eddy current. The present invention includes a coil extending spirally in a plane and covered with a dielectric material, a magnetic substance provided parallel with the plane so as to overlap the coil, and a radiator extending in the plane so as to surround the coil and having projecting portions which project toward an outermost periphery of the coil and groove portions recessed in a direction opposite to that in which the projecting portions project, the projecting portions and the groove portions being alternately arranged, the radiator having a higher thermal conductivity than the magnetic substance.Type: GrantFiled: March 16, 2005Date of Patent: September 1, 2009Assignee: Fujitsu LimitedInventors: Tsuyoshi Matsumoto, Tohru Fujimaki, Hiroyasu Yoshikawa
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Patent number: 7564319Abstract: An LC tack structure. The structure, including a set of wiring levels on top of a semiconductor substrate, the wiring levels stacked on top of each other from a lowest wiring level nearest the substrate to a highest wiring level furthest from the substrate; an inductor in the highest wiring level, the inductor confined within a perimeter of a region of the highest wiring level; and a varactor formed in the substrate, the varactor aligned completely under the perimeter of the region of the highest wiring level. The structure may additionally include an electric shield in a wiring level of the set of wiring levels between the lowest wiring level and the highest wiring level. Alternatively, the inductor includes a magnetic core and alternating electrically non-magnetic conductive metal coils and magnetic coils around the core.Type: GrantFiled: September 24, 2007Date of Patent: July 21, 2009Assignee: International Business Machines CorporationInventors: Hanyi Ding, Kai D. Feng, Zhong-Xiang He, Xuefeng Liu
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Publication number: 20090160018Abstract: An inductor includes an inductor wiring made of a metal layer and having a spiral planar shape. In a cross-sectional shape in a width direction of the inductor wiring, the inductor wiring has a larger film thickness at least in its inner side end than in its middle part.Type: ApplicationFiled: December 11, 2008Publication date: June 25, 2009Inventors: Yutaka Nabeshima, Masaoki Kajiyama, Tomohiro Matsunaga, Hidenori Iwadate
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Publication number: 20090108835Abstract: A device for generating a magnetic field in a goal area with at least two coils arranged in parallel to a goal area defined and bounded by a goal, wherein a first coil is attached in an area behind the goal and a second coil is attached closer to the goal than the first coil or identical to the goal, wherein the first coil and the second coil respectively have a coil impedance, wherein the coil impedance of the second coil is set so that a magnetic field of the second coil generated due to a magnetic field of the first coil reduces the magnetic field of the first coil at a location within the second coil by at least 20%.Type: ApplicationFiled: February 22, 2008Publication date: April 30, 2009Inventors: Walter Englert, Tilman Bucher, Oliver Braun, Christian Holzer
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Patent number: 7525406Abstract: The invention of the multiple coupling & non-coupling inductor includes at least an wrapped iron-core assembly and plural conductors where the wrapped iron-core assembly is composed of mutually corresponding magnetic conductors, which lie penetrated grooves on the X-axis & the Y-axis for penetration of plural conductors. Plural conductors provide mutual inductance along the X-axis and the Y-axis but none between the X-axis and the Y-axis to create a structural design of an iron-core assembly with a multiple coupling & non-coupling.Type: GrantFiled: January 17, 2008Date of Patent: April 28, 2009Assignee: Well-Mag Electronic Ltd.Inventor: Chuan Tsai Cheng
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Patent number: 7518481Abstract: An embodiment is an inductor that may include a slotted magnetic material to decrease eddy currents therein that may limit the operation of the inductor at high frequency. An embodiment may employ electro- or electroless plating techniques to form a layer or layers of magnetic material within the slotted magnetic material structure, and in particular those magnetic material layers adjacent to insulator layers.Type: GrantFiled: June 30, 2006Date of Patent: April 14, 2009Assignee: Intel CorporationInventors: Donald S. Gardner, Gerhard Schrom, Peter Hazucha, Fabrice Paillet, Tanay Karnik
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Patent number: 7511599Abstract: The present invention provides a continuous conductive planar coil structure. The continuous conductive planar coil structure includes a first output terminal, a second output terminal, a coil body and a projection plane parallel to the coil body, wherein a first projection on the projection plane is formed by the first output terminal, a second projection on the projection plane is formed by the second output terminal, and an overlapping portion is between the first projection and the second projection.Type: GrantFiled: November 8, 2007Date of Patent: March 31, 2009Assignee: Delta Electronics, Inc.Inventors: Hao-Yi Ye, Jia-Ping Chen, Hong-Shan Tao, Jian-Ping Ying, Zhong Chen, Jing-Fei He, Feng Li, Hong-Jian Gan
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Patent number: 7508195Abstract: A source for inducing an electromagnetic magnetic field, comprising: a substrate, a conductive layer coupled to the substrate, and a planar coil coupled to the substrate, wherein the planar coil comprises non-concentric rings, and wherein the non-concentric rings are configured such that a drive current applied across the non-concentric rings provides a magnetic field, and wherein the magnetic field comprises a moment vector that is tilted at an angle from the normal to a plane of the planar coil. Also provided are a method of electromagnetic tracking, a method of manufacture of a planar coil, and an electromagnetic sensor.Type: GrantFiled: January 18, 2007Date of Patent: March 24, 2009Assignee: General Electric CompanyInventor: Peter Traneus Anderson
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Patent number: 7508292Abstract: The invention relates to surface-mount type coil components having a mounting surface for mounting them on a printed circuit board or hybrid IC (HIC) and provides a coil component having high electrical characteristics. A common mode filter includes a coil conductor formed in a spiral shape, cut ends which are parts of the coil conductor cut to face each other, and bridge conductors formed so that an insulation film is interposed between the coil conductor and the same to connect the cut ends to each other.Type: GrantFiled: November 2, 2007Date of Patent: March 24, 2009Assignee: TDK CorporationInventors: Tomonaga Nishikawa, Tomokazu Ito, Makoto Yoshida, Hiroshi Kamiyama
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Patent number: 7504923Abstract: An inductor structure disposed over a substrate and comprising a first spiral wire and a second spiral wire is provided. The first spiral wire has a first end and a second end. The first end rotates in a spiral way outward from an inner portion of the first spiral wire. The second spiral wire and the first spiral wire are intertwisted with each other and symmetrically disposed about a symmetry plane. The second spiral wire has a third end and a fourth end. The third end rotates in a spiral way outward from an inner portion of the second spiral wire and is connected to the first end of the first spiral wire, so as to form a coil layer having a plurality of coil turns.Type: GrantFiled: December 28, 2007Date of Patent: March 17, 2009Assignee: Via Technologies, Inc.Inventors: Hsiao-Chu Lin, Sheng-Yuan Lee
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Patent number: 7501924Abstract: An oscillator circuit formed at least partially on an integrated circuit substrate includes a self-shielding inductor. The self-shielding inductor has a toroidal structure. A coil forms a structure that is symmetric around an axis orthogonal to a surface of the integrated circuit substrate. A magnetic filed generated by the self-shielding inductor is confined to a core region of the coil. Portions of the self-shielding inductor may be formed in integrated circuit layers, redistribution layers, package layers, through-substrate interconnect, backside substrate conductor layers, or combinations thereof.Type: GrantFiled: September 30, 2005Date of Patent: March 10, 2009Assignee: Silicon Laboratories Inc.Inventor: Ligang Zhang