Abstract: An oscillator circuit formed at least partially on an integrated circuit substrate includes a self-shielding inductor. The self-shielding inductor has a toroidal structure. A coil forms a structure that is symmetric around an axis orthogonal to a surface of the integrated circuit substrate. A magnetic filed generated by the self-shielding inductor is confined to a core region of the coil. Portions of the self-shielding inductor may be formed in integrated circuit layers, redistribution layers, package layers, through-substrate interconnect, backside substrate conductor layers, or combinations thereof.

Abstract: A thin film device, which can maintain desirable performance characteristics by reducing parasitic capacitance and increasing the Q factor even when a thin film coil of a solenoid type is equipped, is provided. The thin film coil of a solenoid type has a cross sectional width which varies with position along a film thickness direction.

Abstract: A planar magnetic device 1 includes a first magnetic layer 3 and a second magnetic layer 5 that are made of a mixture of a magnetic powder 7 and a resin, and a planar coil 4 disposed between the magnetic layers. When the planar coil 4 has an adjacent winding interval W between the potions 4c of the coil and the magnetic powder 7 has a maximum particle size L, planar magnetic device 1 satisfies the relationship W>L. In the planar magnetic device 1 having the above structure, fine magnetic powder that can produce a high inductance fills the spaces between the adjacent windings. Thus, the invention can achieve a high-performance planar magnetic device, such as a thin inductor.

Abstract: The present invention relates to a spiral inductor for use in a semiconductor device. The spiral inductor comprises a dielectric layer formed of a plurality of layers stacked on a semiconductor substrate, and a plurality of curved metal lines formed in the dielectric layers which are serially connected in order to form a circular spiral shape.

Abstract: An on-chip transformer balun includes a primary winding as an input terminal of the on-chip transformer balun, and a secondary winding as an output terminal of the on-chip transformer balun, wherein one of the primary winding and secondary winding is formed of a plurality of metal layers in which a spiral trace portion excluding an underpass is disposed on mutually different layers to have an asymmetrical structure.

Abstract: A transformer includes at least two windings. Each winding has at least one turn, and the windings are configured from a loop of electrically conductive material.

Abstract: Slot core inductors and transformers and methods for manufacturing same including using large scale flex circuitry manufacturing methods and machinery for providing two mating halves of a transformer winding. One winding is inserted into the slot of a slot core and one winding is located proximate to the exterior wall of the slot core. These respective halves are joined together using solder pads or the like to form continues windings through the slot and around the slotted core.

Abstract: Disclosed is an apparatus and method for a magnetic component. The magnetic component includes a substrate having a feature and a first conductive pattern disposed on the feature. The magnetic component also includes a permeability material disposed within the feature. A substrate material is disposed on the substrate to facilitate substantial enclosure of the permeability material between the substrate and the substrate material, where the substrate material has a second conductive pattern. The first conductive pattern and the second conductive pattern cooperate to be capable of facilitating magnetic properties of the permeability material.

Abstract: Means and methods of remotely powering a plurality of sensor coils are described. The plurality of sensor coils can be inductively coupled to a single, primary coil so as to bias the active circuitry of the sensors. The primary and sensor coils can have a separation on the order of inches, such that the sensors can be mounted exterior to a vessel and the primary coil can be mounted interior to the vessel. In some embodiments, the primary coil can be a wire coil. In other embodiments, the primary coil can be a planar coil pattern etched onto a printed circuit board.

Abstract: A layered coil component includes a coil that is constructed by layering coil conductor patterns and ceramic sheets. The ceramic sheets include a first ceramic sheet and a third ceramic sheet having a permeability lower than the permeability of the first ceramic sheet. The third ceramic sheet has an arrangement that is astride at least two of the coil conductor patterns adjacent to each other in a layering direction, in a section including a coil axis of the coil. As a result, DC bias characteristics of the open magnetic circuit type layered coil component are improved.

Abstract: An improved Rogowski coil is formed on a toroidal core made of a thermoplastic or other moldable material, the core having a preferably continuous groove or grooves extending around the core. The grooves correspond in size to magnet wire which registers within the grooves, thus controlling the specific location of the wires. The grooving may be helical. A return loop can be provided for return path cancellation, or a reverse winding can be added in a direction opposite to the direction of advancement of the main coil. In using the return loop, a resistive network can be added to improve the cancellation of the return path due to the effect of geometries. In addition, it can compensate for thermal and other variations.

Abstract: A magnetic device to be surface mounted on a substantially planar thermally conductive surface comprises a circuit board containing a winding pattern having at least one winding and a magnetic core that is at least partially encompassing the winding pattern. On a bottom side of the circuit board a region corresponding to a substantial part of the winding pattern is covered by a thermally conductive material for thermally contacting the thermally conductive surface. A transformer arrangement comprises such a magnetic device as well as a thermally clad circuit board having a surface area covered by a thermally conductive material, corresponding to at least substantially the covered region on the bottom side of the circuit board. For assembly, the covered region on the bottom side of the circuit board is soldered to the covered region on the surface of the thermally clad circuit board.

Abstract: A chip inductor is constructed by alternately laminating plural conductor patterns and plural insulating layers on and above a ceramic substrate, and connecting the plural conductor patterns to each other in series in a lamination direction thereof so as to constitute a coil. Specifically, the number of turns of the lowermost conductor pattern disposed directly on the ceramic substrate is larger than the number of turns of the other plural conductor patterns and the number of turns of the other plural conductor patterns are substantially equal to each other. Preferably, the number of turns of the lowermost conductor pattern is about 1.5 times the number of turns of the other plural conductor patterns.

Abstract: The invention provides an on-chip transformer balun formed among N successive isolating layers. The transformer includes a primary winding and a secondary winding. The primary winding includes a plurality of first semi-turn coils, a plurality of second semi-turn coils, a plurality of metal junctions, and a plurality of first metal bridges. The secondary winding includes a plurality of third semi-turn coils, a plurality of fourth semi-turn coils, and a plurality of second metal bridges. The first semi-turn coils are connected with the second semi-turn coils by the metal junctions and the first metal bridges. The third semi-turn coils are connected with the fourth semi-turn coils by the second metal bridges. By use of the multi-layer first metal bridges, the transformer according to the invention allows a larger input current than a conventional on-chip transformer.

Abstract: An on-chip inductor can include an outer inductor portion that separates an inner region of the inductor from an outer region of the inductor outside the inductor. An interconnect inductor portion is electrically coupled to the main inductor portion wherein the interconnect inductor portion can include extension portions that follow the contour of the adjacent portions of the outer inductor in the inner region of the inductor. An input path is coupled to the outer inductor portion through the extension portion and extends away from the inductor beneath the outer inductor portion on a first side thereof. An output path is coupled to the outer inductor portion through the extension portion and extends away from the inductor beneath the outer inductor portion on a second side of the inductor opposite the first side.

Abstract: A multilayer coil component is constructed such that inductance can be finely adjusted and the coupling between two helical coils can be strengthened without increasing the types of patterns of coil conductors. Coil conductors of a first coil unit are connected to each other in series via via-hole conductors so as to form a first helical coil. Coil conductors of a second coil unit are connected to each other in series via via-hole conductors so as to form a second helical coil. The first and second helical coils are coaxially positioned, have different numbers of turns, and are electrically connected to each other in parallel. The sum of turns of the coil conductors facing each other at a portion where the first coil unit and the second coil unit are adjacent to each other is larger than the sum of turns of the coil conductors positioned on both outer sides in the coil axis direction of the first and second helical coils.

Abstract: A transformer and method of making same is disclosed. A substantially planar configured, first half primary winding and first half secondary winding are formed over a substantially planar base. The first half primary and secondary windings are overlaid with a ferrite layer. A substantially planar configured, second half primary winding and second half secondary winding are formed over the ferrite layer in stacked relation to the respective first half primary winding and secondary windings. The respective first and second half primary windings and respective first and second half secondary windings are interconnected together.

Abstract: In this invention, a closed-form integral model for on-chip suspended rectangular spiral inductor is presented. The model of this invention bases on the Kramers-Kronig relations, field theory, and solid state physics to characterize a spiral inductor which RFIC designers could easily have the optimal design utilizing this analytical method. Meanwhile, this model can provide satisfactory prediction to the inductance and self-resonant frequency of the spiral inductor without complicated geometry analysis. Furthermore, unlike conventional formulations only based on circuit parameters, this model could safely predict the inductance and the self-resonant frequency when altering the material (excluding ferromagnetic materials) of a spiral inductor.

Abstract: A multilayer inductor includes a plurality of conductor layers for a coil, a plurality of magnetic substance layers, the magnetic substance layers and the conductor layers laminated alternately, and at least a magnetic flux restrictor layer disposed to block magnetic flux passing through the inner region of the coil. The magnetic flux restrictor layer is thinner at the center part of the coil than it is in a region near one of the conductor layers.

Abstract: A coil package which makes it easy to handle a high-frequency cone/pyramid-shaped coil and enhance frequency characteristics without degrading the characteristics of the coil. The cone/pyramid-shaped coil has a conical or pyramidal shape formed by wiring a conductor wire around an outer peripheral surface of a core such that the winding diameter of the coil progressively decreases from one end to the other end of the coil. The coil and a dielectric substrate are integrated with each other by forming a hole for inserting a tip portion of the coil in the dielectric substrate, making the bottom of the hole and a back surface of the dielectric substrate electrically continuous by a via, placing the coil in the hole by directing a small-diameter side of the cone/pyramid-shaped coil to the hole, electrically connecting the bottom of the hole and a tip-side lead wire extending from the coil to each other, and connecting an electrode on a large-diameter side of the coil to an electrode on the dielectric substrate.

Abstract: Embodiments of the present invention may provide for high-performing inductor structures utilizing multi-layer organic stackups. In particular, these high-performing inductor structures may be formed of one or more stitched metal layer building blocks, which are each formed of at least two inductor sections that are vertically or horizontally aligned, and then stitched or connected together. This stitching process significantly reduces the DC/RF losses while reducing the inductance value by a substantially lower factor, thereby significant increasing the Q-factor of the resulting inductor structure. Each stitched metal layer building block may be formed on an organic dielectric layer (e.g., liquid crystalline polymer (LCP)) having a first conductive layer on a first surface and perhaps a second conductive layer on a second surface opposite the first surface.

Abstract: A laminated balun transformer that achieves improved balance characteristics and prevents the occurrence of parasitic inductance has an impedance transformation ratio of one to four and outputs balanced signals generated from an unbalanced signal. The laminated balun transformer includes a magnetic substrate, a laminated body, and external electrodes. The laminated body includes a first transformer, a second transformer, and a non-magnetic body which completely covers the first and second transformers from the outside. The first and second transformers are arranged side by side in a direction substantially parallel to the magnetic substrate. A primary coil of the first transformer and a secondary coil of the second transformer are configured to be 180-degree rotationally symmetric with respect to a center line, while a secondary coil and a primary coil are also configured to be 180-degree rotationally symmetric with respect to the center line L.

Abstract: An electric winding is formed by the juxtaposition of several disks, each disk being made of an electric insulating material of good thermal conductivity and presenting a spiral-shaped groove in which an electric conductor is accommodated. The winding is applicable to high-voltage transformers used in a radiology apparatus.

Abstract: A variable integrated inductor is described herein which has an inductance value that can be switched between two or more values. In the preferred embodiment, the variable integrated inductor includes a multi-loop primary inductor which is electromagnetically coupled to a pair of secondary inductors. The secondary inductors are connected to one another to form a closed circuit within which the secondary inductors have a changeable topology that can be switched between a series connection and a parallel connection in order to change an inductance value which is output by the multi-loop primary inductor. In one application, the variable integrated inductor is used in a voltage controlled oscillator (VCO) which is of the type that can be used in a multi-band RF radio transceiver (e.g., wireless communication device).

Abstract: An electrical inductor circuit element comprising an elongate electrical conductor coupled magnetically with thin layers of magnetic material extending along at least a part of the conductor above and below the conductor. The aspect ratio of the thickness of each of the layers of magnetic material to its lateral dimensions is between 0.001 and 0.5 and is preferably between 0.01 and 0.1. This range of aspect ratio has a high ferromagnetic resonance frequency. The inductor preferably includes magnetic interconnections extending beside the conductor and interconnecting the layers of magnetic material at positions where magnetic flux generated by electrical current flowing along the conductor is transverse to the layers.

Abstract: A chip scale power converter package having an inductor substrate and a power integrated circuit flipped onto the inductor substrate is disclosed. The inductor substrate includes a high resistivity substrate having a planar spiral inductor formed thereon.

Abstract: Placing inductors or resistors in parallel causes the combined value of inductance or resistance to decrease according to the parallel combination rule. This invention decreases the parasitic resistance of an inductor by placing several inductors in parallel. Furthermore, by careful placement of these inductors, the mutual inductance between these inductors can be used to increase the equivalent inductance value to a value near that of the original inductance value of a single inductor. Thus, it is possible to create an inductance with a much lower value of parasitic resistance. This invention allows the formation of high Q inductors and would be beneficial in any circuit design requiring inductances. Another aspect of this invention is that the coils can be partitioned to minimize eddy current losses. This invention can easily be implemented in a planar technology. Simulations of several tank circuits indicate that the power dissipation can be reduced 3 to 4 times when compared to conventional techniques.

Abstract: To form a center tap (CT), at least two coils must be formed. This increases the number of steps in the winding process and decreases the workability. To prevent this, a conductor having a plurality of plate portions that are connected to each other at one vertex of a rectangular shape is formed. The conductor is wound on a winding shaft, thus forming two coils.

Abstract: An embodiment is a magnetic via. More specifically, an embodiment is a magnetic via that increases the inductance of, for example, an integrated inductor or transformer while mitigating eddy currents therein that may limit the operation of the inductor or transformer at high frequency.

Abstract: The coil comprises a plurality of non-joined turns, each turn comprising a rectangular bottom flat section in a bottom plane and a rectangular top flat section in a top plane and two rising sections. The turns fill almost all of the enveloping surface of the coil, a minimum isolating gap separating the adjacent turns. The top and bottom sections corresponding to one and the same turn are aligned with respect to one another and have a larger width than the width of the corresponding rising sections. The turns constitute a plurality of substantially parallel coil branches, rising sections of two adjacent branches arranged between the two adjacent branches being arranged alternately in a single plane.

Abstract: SMT-components known in the art usually have a thickness of approximately 1 mm and no flexibility. According to the present invention windings for an inductor are realized within a substrate, preferably by using copper layers which are already in the substrate. Then, thin metal sheet layers of high permeable material are laminated on top and bottom of the substrate. These layers are structured and then form the magnetic core of the inductor. Advantageously, an inductor may be provided with a very small building height.

Abstract: An inductor is provided which includes a plurality of via holes vertically passing through a substrate, the substrate having insulating properties, vertical conductive portions filling the via holes, and horizontal conductive portions connecting each individual vertical conductive portions at the top and the bottom of the substrate to form a single coil structure with the vertical conductive portions.

Abstract: A semiconductor device having a semiconductor substrate and a first insulator overlying the semiconductor substrate. A spiral coil inductor overlies the first insulator and a second insulator overlies the spiral coil inductor. A patterned ferromagnetic film overlies the second insulator and a patterned magnetic-bias film overlies the patterned ferromagnetic film.

Abstract: An inductor used in an RF unit for a wireless communication terminal, includes first inductor means for electrically connecting an RF chip placed over a substrate at a predetermined distance from the substrate that are enclosed by an interlayer dielectric layer and second inductor means for connecting the RF chip to the first inductor means.

Abstract: The invention relates to a common mode choke coil and a method of manufacturing the same and provides a compact, low-profile, and low-cost common mode choke coil and a method of manufacturing the same. A common mode choke coil has a general outline in the form of a rectangular parallelepiped provided by forming an insulation layer, a first helical coil unit, a second helical coil unit, and a closed magnetic path on a silicon substrate made of a single-crystal using thin film forming techniques. The first and second helical coil units are formed such that their axes of spiral extend substantially parallel to a substrate surface of the silicon substrate.

Abstract: The invention relates to surface-mount type coil components having a mounting surface for mounting them on a printed circuit board or hybrid IC (HIC) and provides a low-cost coil component having a low direct-current resistance. A common mode filter includes a bridge conductor layer which has a bridge conductor one end of which is connected to one end of a lead wire and another end of which is connected to an inner circumferential end of a coil conductor and another bridge conductor one end of which is connected to one end of another lead wire and another end of which is connected to an inner circumferential end of another coil conductor, the bridge conductor layer being formed between two coil conductor layers with an insulation film interposed between the bridge conductor layer and each of the coil conductor layers.

Abstract: An inductor embedded in a substrate, including a substrate, a coil electrode formed by filling a metal in a spiral hole formed on the substrate, an insulation layer formed on the substrate, and an external connection pad formed on the insulation layer to be connected to the coil electrode. The inductor-embedded substrate can be used as a cap for a micro device package by forming a cavity on its bottom surface.

Abstract: A three dimensional (3D) transformer includes a first coil and a second coil. Each coil includes a first port, a second port, a top layer metal line, inter-layer inner metal lines, inter-layer outer metal lines and a bottom layer metal line. Each metal line of the first coil and that of the second coil are correspondingly arranged to the opposite side of each other. Each of the first port is electrically connected to each of the top metal line. Each coil is arranged clockwise from the top metal line, the inter layer inner metal line down to the bottom layer metal line and arranged clockwise from the bottom layer metal line, the inter layer outer metal line up to the upper metal line of the inter layer outer metal line. Each upper metal line of the inter layer outer metal line is electrically connected to each second port.

Abstract: Within a method for fabricating an inductor structure there is first provided a substrate. There is then formed over the substrate a planar spiral conductor layer to form a planar spiral inductor, wherein a successive series of spirals within the planar spiral conductor layer is formed with a variation in at least one of: (1) a series of linewidths of the successive series of spirals; and (2) a series of spacings of the successive series of spirals. The method contemplates a planar spiral inductor structure fabricated in accord with the method. A planar spiral inductor structure fabricated in accord with the method is characterized by an enhanced Q value of the planar spiral inductor structure.

Abstract: The invention is applicable to a characteristic adjustment method for an inductor formed by laminating a plurality of coils and electrically connecting these coils by a through hole, and is aimed at providing a method which can easily adjust the characteristic of the inductor with a simple configuration. The method comprises determining a part of the coil in an outermost layer as an adjustment area, and not forming the through hole below the adjustment area, and removing at least a part of the adjustment area after the coil in the outermost layer is formed.

Abstract: The invention relates to a coil component used as a main component of a common mode choke coil or a transformer and a method of manufacturing the same, and the invention is aimed at providing a coil component with a small size and a low height having high differential transmission characteristics and a method of manufacturing the same. A common mode choke coil has a configuration in which an insulation film, a coil conductor, another insulation film, another coil conductor and another insulation film are stacked in the order listed between magnetic substrates provided opposite to each other. The coil conductors have a coil section which is in a trapezoidal general configuration. A top portion of the coil section is formed in a convex configuration such that it bulges in the form of a convex, and a bottom portion of the coil section is formed in a planar configuration.

Abstract: A transformer and method of making includes first half primary and secondary windings as metallic circuits that are etched on a metallic cladding of a first liquid crystal polymer (LCP) sheet. Secondary windings are positioned in spaced relation to the primary windings. A second LCP sheet is applied over the first LCP sheet. Second half primary and secondary windings are etched as metallic circuits on a metallic cladding of a second LCP sheet. Respective first and second half primary windings are interconnected to each other and the first and second half secondary windings are connected to each other by conductive vias.

Abstract: An on-chip inductor includes a main inductor portion configured to provide a main magnetic field of an on-chip inductor. An interconnect inductor portion is electrically coupled to the main inductor portion and is configured to provide an interconnect magnetic field that constructively combines with the main magnetic field.

Abstract: The invention relates to an inductor comprising a plurality of interconnected conductive segments interwoven with a substrate. The inductance of the inductor is increased through the use of coatings and films of ferromagnetic materials such as magnetic metals, alloys, and oxides. The inductor is compatible with integrated circuit manufacturing techniques and eliminates the need in many systems and circuits for large off chip inductors. A sense and measurement coil, which is fabricated on the same substrate as the inductor, provides the capability to measure the magnetic field or flux produced by the inductor. This on chip measurement capability supplies information that permits circuit engineers to design and fabricate on chip inductors to very tight tolerances.

Abstract: The invention relates to surface-mount type coil components having a mounting surface for mounting them on a printed circuit board or hybrid IC (HIC) and provides a coil component having high electrical characteristics. A common mode filter includes a coil conductor formed in a spiral shape, cut ends which are parts of the coil conductor cut to face each other, and bridge conductors formed so that an insulation film is interposed between the coil conductor and the same to connect the cut ends to each other.

Abstract: A multi-layer laminated circuit board 10A of the present invention is formed by laminating together a multi-layer transformer 10, a multi-layer part sheet 30 formed with a multi-layer part, and a wiring sheet 50 formed with a circuit pattern. The multi-layer transformer 10 is incorporated into the multi-layer laminated circuit board 10A, and therefore a package for the multi-layer transformer 10 is omitted, and the wiring between the multi-layer transformer 10 and other components is reduced to a minimum.

Abstract: The multi-layer transformer 10 of the present invention comprises a composite sheet 14a comprising a center magnetic pattern 11a and peripheral magnetic pattern 12a that are formed at the center and periphery respectively, and a dielectric pattern 13a of a nonmagnetic body that is formed in a part except the center and periphery; a composite sheet 14b similarly comprising a center magnetic pattern 11b, peripheral magnetic pattern 12b and a dielectric pattern 13b; a primary winding 15a that is located on one face of the dielectric pattern 13a; a secondary winding 15b that is located on one face of the dielectric pattern 13b; and magnetic sheets 16a and 16b that hold the composite sheets 14a and 14b, primary winding 15a and secondary winding 15b from both sides and contact one another via the center magnetic patterns 11a and 11b and peripheral magnetic patterns 12a and 12b.

Abstract: Within a method for fabricating an inductor structure there is first provided a substrate. There is then formed over the substrate a planar spiral conductor layer to form a planar spiral inductor, wherein a successive series of spirals within the planar spiral conductor layer is formed with a variation in at least one of: (1) a series of linewidths of the successive series of spirals; and (2) a series of spacings of the successive series of spirals. The method contemplates a planar spiral inductor structure fabricated in accord with the method. A planar spiral inductor structure fabricated in accord with the method is characterized by an enhanced Q value of the planar spiral inductor structure.

Abstract: A magnetic device of smaller size and lower profile comprising a coil conductor of high inductance and low resistance is provided. The magnetic device comprises a coil conductor and a multilayer magnetic layer formed so as to cover the periphery of the coil conductor. Further, a magnetic device having higher inductance value and lower conductor resistance value (AC resistance) by selecting a magnetic layer capable of suppressing the eddy current and having excellent magnetic characteristics even designed with smaller size and lower profile.

Abstract: The invention is directed to a method for manufacturing a metal-insulator-metal transformer together with a capacitor. The method comprises steps of providing a substrate having at least a dielectric layer formed thereon and then forming a first metal layer of the metal-insulator-metal capacitor together with a first metal coil of the transformer over the substrate. An insulating layer is formed to cover the substrate, the first metal layer and the first metal coil. A second metal layer of the metal-insulator-metal capacitor is formed together with a second metal coil of the transformer on the insulating layer.