Probe Type Patents (Class 338/28)
  • Patent number: 11566948
    Abstract: A method, apparatus and system for measuring a temperature can involve measuring a voltage with a resistance temperature detector using a variable excitation current, and deriving a process temperature from the voltage measured by the resistance temperature detector. The process temperature can be further derived by applying a plurality of values of the variable excitation current, measuring corresponding values of voltage, and estimating a resistance by applying a least square estimation. The process temperature can also be derived by applying a different value of the variable excitation current at every iteration, using a recursive least square estimation to measure a resistance, and using confidence intervals for instrument diagnostics.
    Type: Grant
    Filed: February 13, 2020
    Date of Patent: January 31, 2023
    Assignee: Honeywell International Inc.
    Inventors: Eduardo Gallestey Alvarez, Sarabjit Singh, Shripad Kumar Pande, Seshagiri Yamarthi
  • Patent number: 11353370
    Abstract: An air temperature sensor with a housing having a skin with a first and second portion, a temperature sensor having at least a portion extending through the housing, a set of fluid passageways defined within an interior of the housing, and a tube to receive bleed air from an aircraft engine located within the interior and to allow hot bleed air into the set of fluid passageways.
    Type: Grant
    Filed: March 2, 2020
    Date of Patent: June 7, 2022
    Assignee: Unison Industries, LLC
    Inventors: John Patrick Parsons, Gregory Lloyd Ashton, Jarodd Dan Goedel, Chiong Siew Tan
  • Patent number: 11280684
    Abstract: The present disclosure is directed toward a temperature detector probe that includes a housing, a pair of electrical connectors, a support cap, and a sensor. The housing defines a bore longitudinally extending through the housing, and the pair of electrical connectors extend through the bore. The support cap is disposed at a first end portion of the housing. The sensor is provided on the support cap and is electrically coupled to the pair of electrical connectors. The support cap is positioned between the pair of electrical connectors and the support cap.
    Type: Grant
    Filed: March 21, 2019
    Date of Patent: March 22, 2022
    Assignee: WATLOW ELECTRIC MANUFACTURING COMPANY
    Inventor: John Lilleland
  • Patent number: 11131587
    Abstract: A temperature sensor comprises a temperature sensing element, a protective housing, and a heat transfer element. The temperature sensing element transduces a sensed temperature into an electrical output signal. The protective housing at least partly encases the temperature sensing element. The heat transfer element has an outer surface in heat conductive contact with an inner wall of the protective housing and receives at least a part of the temperature sensing element. The heat transfer element is formed separately from the temperature sensing element.
    Type: Grant
    Filed: June 26, 2017
    Date of Patent: September 28, 2021
    Assignee: MEAS FRANCE
    Inventors: Nicolas Christophe R. Pecquet, Hamza Boumeddane
  • Patent number: 11105688
    Abstract: A temperature-sensitive element including an element main body and a pair of lead wires that is drawn out from the element main body; a case accommodating the temperature-sensitive element and having a heat transfer surface configured to come into contact with a measurement object for temperature; a pair of lead frames electrically connected with each of the lead wires and drawn out from the case; and a filler covering the temperature-sensitive element accommodated in the case and the lead frames and holding the temperature-sensitive element and the lead frames in the case while maintaining a state of the connection.
    Type: Grant
    Filed: January 16, 2017
    Date of Patent: August 31, 2021
    Assignee: SHIBAURA ELECTRONICS CO., LTD.
    Inventors: Tatsuyuki Suzuki, Toshiyuki Okumura
  • Patent number: 11070001
    Abstract: Airtightness of a connector molding is improved. There is provided a connector molding in which a conductor and a fixing member are integrally molded with a molded body including a connector portion. The conductor is fixed to the fixing member, and is integrally molded with the molded body in a state in which an external connection end portion protrudes into a space within the connector portion. A part of the fixing member is exposed to the space within the connector portion and the remaining portion is covered by the molded body, or the entire fixing member is covered by the molded body.
    Type: Grant
    Filed: May 24, 2018
    Date of Patent: July 20, 2021
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Yusuke Kitai, Katsuhide Oohashi, Ko Sasaki, Takayuki Hagiya, Takuya Igarashi, Michimori Watanabe
  • Patent number: 10931259
    Abstract: An acousto-electric amplifier having insertion gain is provided. The acousto-electric amplifier comprises resistive material coupled to sensors such as conductive fingers. The conductive fingers are disposed on piezoelectric material. The piezoelectric material may be disposed on or above the piezoelectric material. Transducers may be used to couple a surface acoustic wave to and from the acousto-electric amplifier. The acousto-electric amplifier amplifies the surface acoustic wave in one propagation direction and attenuates a surface wave in the opposite propagation direction.
    Type: Grant
    Filed: June 11, 2020
    Date of Patent: February 23, 2021
    Assignee: Pegasense, LLC
    Inventor: Donald Chester Malocha
  • Patent number: 10745604
    Abstract: In one aspect, compositions are described herein. In some embodiments, a composition comprises a phase change material, a hydrophobic sorption material, and a viscosity modifier. In some embodiments, a composition comprises a foam and a latent heat storage material dispersed in the foam, the latent heat storage material comprising a phase change material and a hydrophobic sorption material.
    Type: Grant
    Filed: January 10, 2018
    Date of Patent: August 18, 2020
    Assignee: Phase Change Energy Solutions, Inc.
    Inventors: Reyad I. Sawafta, Najih Naser
  • Patent number: 10605637
    Abstract: A probe assembly includes a heat source; and a probe tip configured to enhance conduction of heat provided by the heat source into a front end tip of the probe. The probe tip includes: a first region having high thermal conductivity in at least a z-direction, wherein the z-direction is parallel to an axis along which the probe tip is extended; and at least one additional region having thermal characteristics different from the first region.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: March 31, 2020
    Assignee: Honeywell International Inc.
    Inventors: Grant A. Gordon, Yates Wong
  • Patent number: 10605675
    Abstract: A total air temperature sensor can include an airfoil portion. The airfoil portion can an inlet and an outlet through which a diverted airflow path can flow. The total air temperature sensor can include a temperature sensor located within a housing defining the total air temperature sensor and a sheath surrounding the temperature sensor. The temperature sensor can be configured to take a total temperature of the diverted airflow path.
    Type: Grant
    Filed: June 22, 2017
    Date of Patent: March 31, 2020
    Assignee: UNISON INDUSTRIES, LLC
    Inventors: John Patrick Parsons, Gregory Lloyd Ashton, Jarodd Dan Goedel, Chiong Siew Tan
  • Patent number: 10378968
    Abstract: An apparatus for determining and/or monitoring at least one process variable. The apparatus includes: at least one sensor element, which is connected to at least one connection line; and at least one conductor element, which is connected to the connection line. At least one formed part is provided; that at least one opening is provided in the formed part for introduction of the connection line; that at least one opening is provided in the formed part for introduction of the conductor element; and that there is provided in the formed part at least one chamber section, into which open the opening for introduction of the connection line and the opening for introduction of the conductor element.
    Type: Grant
    Filed: November 9, 2009
    Date of Patent: August 13, 2019
    Assignee: ENDRESS + HAUSER WETZER GMBH + CO. KG
    Inventors: Dirk Boguhn, Torsten Iselt, Larry De Guzmann
  • Patent number: 10375768
    Abstract: A heater is provided for a waste water system comprising of a heating element encased in a protective pipe. The pipe is closed at one end and attached at the opposite end to an end cap that may be connected by a standard fitting to a sewer installation. The protective pipe is sealed to the end cap and the heating element is removable from within the protective pipe without adversely affecting the integrity of the installation.
    Type: Grant
    Filed: March 4, 2016
    Date of Patent: August 6, 2019
    Assignee: Heat-Line Corporation
    Inventor: Lorne R. Heise
  • Patent number: 10254172
    Abstract: A temperature sensor includes a temperature sensitive element, a sheath portion, a surrounding portion, and a holding member. This temperature sensor has a void formed forward of a temperature sensitive body. When the void is projected in an axial direction of the surrounding portion from a forward end side of the surrounding portion, the void contains at least a forward end surface of the temperature sensitive body.
    Type: Grant
    Filed: October 23, 2014
    Date of Patent: April 9, 2019
    Assignee: NGK SPARK PLUG CO., LTD.
    Inventors: Akio Mori, Tatsuya Suzuki, Toshinori Nishi, Seiji Oya, Toshiya Oya
  • Patent number: 10132667
    Abstract: The invention relates to a method of manufacturing an element sensitive to at least one physical parameter of a flow of fluid, comprising a step consisting in a single cycle of immersing, in molten glass, a core of a preassembled sensitive element, said core comprising at least two longitudinal channels along which there pass longitudinally at least two conducting connecting wires which are connected to an at least two-wire winding, said winding being suited to forming a resistive or inductive circuit for detecting said physical parameter, said immersion allowing the connecting wires to be sealed into the channels, allowing said channels to be filled and allowing the outside of the core to be coated in a single immersion, the core, at the end of said single immersion cycle, being sealed and coated in such a way as to obtain an assembled sensitive element.
    Type: Grant
    Filed: March 17, 2015
    Date of Patent: November 20, 2018
    Assignee: AUXITROL S.A.
    Inventors: Christian Gras, Catherine Donat
  • Patent number: 10031030
    Abstract: A sensor configuration measures the temperature of a medium in a vehicle. The sensor configuration includes a sensor body and two connecting wires and is completely insulated from the medium. The sensor body is electrically and thermally insulated from the medium by a covering completely surrounding the sensor body and is in heat-conducting contact with the medium substantially through the connecting wires.
    Type: Grant
    Filed: September 12, 2014
    Date of Patent: July 24, 2018
    Assignee: Conti Temic microelectronic GmbH
    Inventors: Matthias Keuten, Andreas Voegerl, Juergen Henniger, Matthias Wieczorek, Lisa-Maria Wittmann
  • Patent number: 10024726
    Abstract: A temperature sensor includes a temperature detector having a thermosensitive element, element electrode wires, leads, and intermediate members. The temperature sensor is formed such that ends of the element electrode wires are embedded in the temperature detector, the leads are electrically connected to the respective element electrode wires, and the intermediate members electrically connect the element electrode wires to the respective leads. Each element electrode wire and the corresponding intermediate member are arranged being aligned in the extending direction, and bonded to each other, with opposing surfaces facing each other being abutted each other. The intermediate member and the corresponding lead are juxtaposed in a direction perpendicular to the extending direction, and bonded being overlapped with each other.
    Type: Grant
    Filed: March 30, 2015
    Date of Patent: July 17, 2018
    Assignee: DENSO CORPORATION
    Inventors: Kouichi Yoshida, Toshiya Ozeki
  • Patent number: 9739652
    Abstract: A sensor of a thermal flow measuring device, as well as the flow measuring device itself. The sensor comprises a sensor platform, which bears at least one measuring sensor element and a heated sensor element. Each of the at least two sensor elements is surrounded by a metal sleeve, which protrudes from the sensor platform. The sensor has a plate-shaped element, which defines a plane, whose axis extends parallel to the axis of at least one of the metal sleeves, wherein the plane is spaced from the sensor platform in the axial direction of the metal sleeve. The metal sleeve with the heated sensor element has a terminal end face and the plate-shaped element is provided along the end face of the metal sleeve with the heated sensor element for flow guidance.
    Type: Grant
    Filed: October 28, 2013
    Date of Patent: August 22, 2017
    Assignee: Endress + Hauser Flowtec AG
    Inventors: Axel Pfau, Achim Wiest, Martin Barth
  • Patent number: 9696191
    Abstract: A thermal, flow measuring device for determining and/or monitoring a mass flow of a measured medium through a measuring tube, comprising a sensor having a first heatable resistance thermometer and at least a second heatable resistance thermometer, wherein the sensor has a longitudinal axis and an end face, which is divided into at least two adjoining segments, wherein a surface normal vector of at least a first segment forms with the longitudinal axis of the sensor an angle of at least 5°; and use of a thermal, flow measuring device.
    Type: Grant
    Filed: September 23, 2013
    Date of Patent: July 4, 2017
    Assignee: Endress + Hauser Flowtec AG
    Inventors: Axel Pfau, Panagiotis Papathanasiou, Stephan Gaberthuel, Tobias Baur, Hanno Schultheis
  • Patent number: 9696215
    Abstract: A system and a method for monitoring and inspecting food safety is disclosed. The system adopts insert and use concept that only requires an initial push on a button to begin its function. The system provides visual alert for different conditions if food products are in unsafe status. The system is pre-calibrated during manufacture without complicated or multi-step calibration or recalibration procedures during application. The system relies on modern surface-mount microprocessor technology that enables long-term calibration stability along with very low power consumption for extended battery life.
    Type: Grant
    Filed: October 20, 2014
    Date of Patent: July 4, 2017
    Assignee: Novarus Corporation
    Inventors: Benjamin Brock, David Conn
  • Patent number: 9638585
    Abstract: A sensor is disclosed. The sensor includes a substrate including a cold junction area and a hot junction area and a thermocouple including a pair of thermoelectric elements which is formed to extend linearly between the cold junction area and the hot junction area, and stacked on an upper surface of the substrate. Wherein, a stepwise portion is formed adjacent to an end portion of the thermocouple by removing a portion adjacent to an end portion of one of the pair of thermoelectric elements, and a wiring part of metal is formed in the stepwise portion so as to connect electrically the pair of thermoelectric elements each other.
    Type: Grant
    Filed: March 11, 2014
    Date of Patent: May 2, 2017
    Assignee: RICOH COMPANY, LTD.
    Inventor: Hidenori Kato
  • Patent number: 9622812
    Abstract: Electrosurgical cannulas for use with an electrosurgical generator to thermally treat tissue are disclosed. An electrosurgical cannula for use with an electrosurgical generator to treat tissue is provided. The electrosurgical cannula includes a cylindrical body portion defining a lumen therethrough. The body portion includes a non-coring pointed distal tip which is electrically conductive. The electrosurgical cannula further includes at least one thermocouple having a distal end connected to the conductive distal tip.
    Type: Grant
    Filed: March 29, 2006
    Date of Patent: April 18, 2017
    Assignee: COVIDIEN AG
    Inventors: Gene H. Arts, Jose D. Sartor
  • Patent number: 9534960
    Abstract: There is provided a method for measuring a temperature using a thermistor with which it is possible to precisely measure a temperature above a thermoelectric device by using a thermistor disposed on the thermoelectric device in a module for controlling a temperature of a component arranged on the thermoelectric device by using the thermoelectric device. In the method for measuring a temperature using a thermistor, by electrically connecting the thermistor to an electrode pin through a thermoelectric device or a bridge sub-mount mounted on the thermoelectric device when electrically connecting a top surface of the thermistor and the electrode pin, it is possible to suppress direct heat exchange between the thermistor and the electrode pin. Further, it is possible to effectively suppress heat exchange between the thermistor and a package lid by internal gas of a package by covering the thermistor with a polymer material, such as an epoxy having low thermal transmittance.
    Type: Grant
    Filed: May 15, 2012
    Date of Patent: January 3, 2017
    Inventor: Jeong Soo Kim
  • Patent number: 9506818
    Abstract: The invention provides a thermocouple assembly for use with a thermocouple harness in a gas turbine engine, comprising a thermocouple connected to a resistor, the resistor comprising a conductor, a mineral insulating material surrounding the conductor, and a metal sheath surrounding the conductor.
    Type: Grant
    Filed: July 31, 2012
    Date of Patent: November 29, 2016
    Assignee: Weston Aerospace Limited
    Inventor: Paul Walling
  • Patent number: 9482729
    Abstract: An NMR measuring configuration has a temperature control device for a sample vial (1). The temperature control device has a temperature sensor with supply wires which are both surrounded by a sensor tube (15). The sensor tube (15) is connected to a measurement space via a sensor flow inlet (26) in such a way that a partial flow of a temperature-control fluid flows as a temperature-control flow (16) into a free space (17) between the temperature sensor and the inner wall of the sensor tube along the supply wires and flows out of the sensor tube via a sensor flow outlet (18) at the opposite end of the sensor tube. This minimizes both the temperature penetration factor and the difference between the sensor and sample temperatures (?Tp).
    Type: Grant
    Filed: September 13, 2013
    Date of Patent: November 1, 2016
    Assignee: Bruker BioSpin AG
    Inventors: Philipp Gisler, Dirk Wilhelm, Christoph Pfenninger
  • Patent number: 9464947
    Abstract: Provided is a cryogenic temperature measuring resistor element including a metallic temperature measuring resistor wire, an electric insulator made of a polycrystalline ceramic material, and a filler filled between the electric insulator and the temperature measuring resistor wire. The filler includes polycrystalline inorganic electric insulating powder, particles of the insulating powder being connected by glass. The glass has a lower softening point than respective melting points of the inorganic electric insulating powder, the temperature measuring resistor wire, and the electric insulator.
    Type: Grant
    Filed: October 19, 2012
    Date of Patent: October 11, 2016
    Assignee: OKAZAKI MANUFACTURING COMPANY
    Inventors: Shinichiro Saraie, Takashi Mihara, Koichi Ito
  • Patent number: 9417140
    Abstract: A sensor assembly including a sensing element, a conductor connected to the sensing element, and an elongated shaft. The elongated shaft includes a proximal end and a distal end. An inner surface of the shaft defines a through-bore extending from the proximal end to the distal end. The through-bore is configured to receive the conductor therethrough. An outer surface of the shaft includes a proximal diameter at the proximal end and a distal diameter at the distal end. The proximal diameter is greater than the distal diameter and configured to dampen vibration.
    Type: Grant
    Filed: September 3, 2013
    Date of Patent: August 16, 2016
    Assignee: Denso International America, Inc.
    Inventor: Edward Szczepanski
  • Patent number: 9316544
    Abstract: Provided is an electronic thermometer that is inexpensive, has fast thermal response, and suppresses bending and directional misalignment of the lead of the temperature sensor during assembly of the electronic thermometer. The electronic thermometer includes: a temperature sensor that includes a temperature sensing unit that measures the body temperature of a measurement subject and a lead having one end that is fixed to the temperature sensing unit; a hollow housing that houses the lead, and in which the temperature sensing unit is arranged on the tip side; a printed circuit board to which the other end of the lead is fixed; and an assembly that includes the printed circuit board and is housed in the housing. The assembly includes an extension portion extending toward the tip side of the housing. The extension portion has a guide portion that orients the extending direction of the lead.
    Type: Grant
    Filed: March 8, 2013
    Date of Patent: April 19, 2016
    Assignee: OMRON HEALTHCARE CO., LTD.
    Inventors: Gaku Hasegawa, Naoki Matsumoto, Takanobu Yamauchi, Atsushi Kawano, Yasuo Fujita
  • Patent number: 9267848
    Abstract: The thermometer using differential temperature measurements utilizes a pair of adjacent temperature sensors in order to measure the temperature of a common surface over a pre-selected period of time. The thermometer includes a housing and first and second thermistors mounted adjacent one another on the housing. The first and second thermistors are positioned against the surface, which can be a body part (for oral, rectal or axial body temperature measurements) or can be any other desired surface for which a spot check temperature reading is desired. A programmable current source pre-heats the second thermistor to a pre-selected temperature, while the first thermistor is initially at room temperature. A controller inside the housing causes both the first and second thermistors to take instantaneous temperature measurements of the surface at two successive times. The controller linearizes the measurements to predict the temperature of the surface, which is then displayed to the user.
    Type: Grant
    Filed: January 2, 2014
    Date of Patent: February 23, 2016
    Assignees: KING ABDULLAH INTERNATIONAL MEDICAL RESEARCH CENTER, KING SAUD BIN ABDULAZIZ UNIVERSITY FOR HEALTH SCIENCES, NATIONAL GUARD HEALTH AFFAIRS
    Inventor: Abdulrahman Musa Al-Faifi
  • Patent number: 9188489
    Abstract: A sensor tube for protecting a sensor inserted into a moving process fluid is provided. The sensor tube includes a process interface section for mounting to a process vessel and an extended section extending from the process interface section to a sealed end. The extended section includes a twisted section having a longitudinal axis. The process interface section and the extended section define a sensor bore configured to receive a sensor therein. The twisted section has a cross section that includes at least three equally sized walls and wherein the walls form helixes along the longitudinal axis of the twisted section.
    Type: Grant
    Filed: June 29, 2012
    Date of Patent: November 17, 2015
    Assignee: Rosemount Inc.
    Inventor: Lowell A. Kleven
  • Patent number: 9188490
    Abstract: A temperature sensing system comprises a thermowell, a sensor, and a solid insert. The thermowell extends into a sensing region of a fluid flow. The sensor has a probe housed in the thermowell to sense a temperature in the sensing region. The solid insert is configured to removably support the probe within the thermowell and to provide a thermal contact between the thermowell and the probe.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: November 17, 2015
    Assignee: Rosemount Inc.
    Inventors: Aaron Andrew Perrault, Andrew Steven Dierker
  • Patent number: 9183719
    Abstract: A human safety system includes a circuit including a microcontroller and at least one power source; a probe in communication with the circuit; at least one use detector in communication with the circuit; and at least one alert indicator in communication with the circuit. A method of using a human safety device, the method includes initiating operation of the human safety device; arranging the human safety device in communication with skin; and monitoring the human safety device for alert indicators. A method of monitoring a user includes waking from sleep state; sensing at least one condition of the user; determining if the sensed condition is in a human condition; continuously monitoring the condition of the user; and, returning to sleep state when the user condition is outside of the human condition for an amount of time.
    Type: Grant
    Filed: August 24, 2012
    Date of Patent: November 10, 2015
    Assignee: Safetyminded Holdings, Inc.
    Inventors: Charles Mack Gouge, Kenneth Armstrong, Terrance Ransbury, Robert Smith, Darrel Self
  • Patent number: 9157808
    Abstract: A detector assembly is provided and includes a board, a temperature response element and a support coupled to the board to support the temperature response element, the support including an elongate member having first and second opposing ends and being coupled to the board at the first end, guides through which temperature response element leads are threadable, and a saddle disposed at the elongate member second end to inhibit displacement of the temperature response element.
    Type: Grant
    Filed: September 7, 2010
    Date of Patent: October 13, 2015
    Assignee: UTC FIRE & SECURITY CORPORATION
    Inventors: Jan A. Braam, Paul Schatz
  • Patent number: 9153365
    Abstract: A temperature sensing element includes a thermistor composed of Si-base ceramics and a pair of metal electrodes bonded onto the surfaces of the thermistor. The metal electrodes contain Cr and a metal element ? having a Si diffusion coefficient higher than that of Cr. A diffusion layer is formed in a bonding interface between the thermistor and each metal electrode, the diffusion layer including a silicide of the metal element ? in a crystal grain boundary of the Si-base ceramics. A temperature sensor including the diffusion layers is provided. Owing to the diffusion layers, the temperature sensor ensures heat resistance and bonding reliability and enables temperature detection with high accuracy in a temperature range, in particular, of from ?50° C. to 1050° C.
    Type: Grant
    Filed: April 27, 2011
    Date of Patent: October 6, 2015
    Assignees: DENSO CORPORATION, KABUSHIKI KAISHA TOYOTA CHUO KENKYUSHO
    Inventors: Tsunenobu Hori, Kaoru Kuzuoka, Chiaki Ogawa, Motoki Satou, Katsunori Yamada, Takao Kobayashi, Kazuhiro Inoguchi
  • Patent number: 9118123
    Abstract: A crimp terminal includes; a crimping portion and a cover covering the conductor portion, the crimping portion is formed in a hollow cylindrical shape in cross section and has a first end portion and a second end portion opposite to the first end portion. The conductor portion is inserted into the first end portion in a longitudinal direction, and the second end is sealed. The second end portion at the opposite side is sealed by welding. The crimping portion, in which the exposed conductor portion is crimped, further includes a locking section locking the exposed conductor portion. A length between the first end portion into which the conductor portion is inserted and a portion, of the locking section, that is the closest to the first end portion is larger than a length of the exposed conductor portion of the insulated wire.
    Type: Grant
    Filed: September 9, 2014
    Date of Patent: August 25, 2015
    Assignees: FURUKAWA ELECTRIC CO., LTD., FURUKAWA AUTOMOTIVE SYSTEMS INC.
    Inventors: Yukihiro Kawamura, Takashi Tonoike, Takuro Yamada
  • Patent number: 9109957
    Abstract: A method of manufacturing a temperature sensor unit comprising the steps of: providing the conductors in the sheath such that in a first zone a space is defined between the sheath and the conductors; providing the second insulating material in liquid form in the space; positioning the sensors in the space such that the conductors are provided closer to the center of the sheath than the sensors; and soldering and/or welding the set of conductors to the set of terminals. A temperature sensor in which sets of conductors and one or more temperature sensors are arranged inside a sheath and with respect to each other such that the conductors are provided closer to the center of the sheath than the temperature sensors.
    Type: Grant
    Filed: March 11, 2010
    Date of Patent: August 18, 2015
    Assignee: Danfoss A/S
    Inventors: Svend Peder Pedersen, Jan Dyhr
  • Patent number: 9103731
    Abstract: The present disclosure relates to a high temperature resistance temperature detector for measuring exhaust gas temperature for example. The structure includes a resistive element disposed on an insulated carrier. The structure further includes a housing disposed over the carrier and resistive element for inhibiting oxidation of the element which would result in failure of the detector.
    Type: Grant
    Filed: August 20, 2012
    Date of Patent: August 11, 2015
    Assignee: Unison Industries, LLC
    Inventors: Dennis M. DeFrietas, John Patrick Parsons, Denis O'Flynn, Jarodd Goedel
  • Patent number: 8935843
    Abstract: A thermal, flow measuring device for determining and/or monitoring the flow of a measured medium through a measuring tube. The thermal, flow measuring device includes: a first pin-shaped shell and at least a second pin-shaped shell; a first resistance thermometer and at least a second resistance thermometer. At least the first resistance thermometer is embodied so as to be heatable, wherein the resistance thermometers, in each case, have a first surface, and at least a second surface, which lies opposite the first surface. The first pin-shaped shell surrounds the first resistance thermometer, and the second pin-shaped shell surrounds the second resistance thermometer. The pin-shaped shells are fillable with a fill material. In each case, at least one spacer is placeable between the pin-shaped shell and the first surface of the resistance thermometer, and the second surface of the resistance thermometer is at least partially covered with fill material.
    Type: Grant
    Filed: July 9, 2012
    Date of Patent: January 20, 2015
    Assignee: Endress + Hauser FLowtec AG
    Inventors: Dirk Boguhn, Jiri Holoubek, Axel Pfau, Oliver Popp, Jiri Polak
  • Patent number: 8705245
    Abstract: A sensor device has a ceramic carrier substrate. At least two conductor tracks are arranged on the carrier substrate. The sensor device has at least one ceramic component that is in the form of a chip and is connected to the conductor tracks in an electrically conductive manner. The at least one ceramic component is mechanically connected to the conductor tracks by means of a screen printing paste which has been burnt in.
    Type: Grant
    Filed: January 28, 2011
    Date of Patent: April 22, 2014
    Assignee: EPCOS AG
    Inventors: Gerald Kloiber, Heinz Strallhofer, Norbert Freiberger
  • Patent number: 8497759
    Abstract: The RTD device of the present invention is comprised of a semiconductor substrate and a substantially thin conductive metal layer disposed upon the semiconductor substrate, wherein the conductive metal has a substantially linear temperature-resistance relationship. The conductive layer is etched into a convoluted RTD pattern, which consequently increases the overall resistance and minimizes the overall mass of the RTD assembly. A contact glass cover and a conductive metal-glass frit are placed over the RTD assembly to hermetically seal the RTD. The resultant structure can be “upside-down” mounted onto a header or a flat shim so that the bottom surface of the semiconductor substrate is exposed to the external environment, thus shielding the RTD from external forces. The resultant structure is a low mass, highly conductive, leadless, and hermetically sealed RTD that accurately measures the temperature of liquids and gases and maintains fast response time in high temperatures and harsh environments.
    Type: Grant
    Filed: March 25, 2010
    Date of Patent: July 30, 2013
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Alexander Ned, Vikram Patil, Joseph VanDeWeert, Nora Kurtz
  • Patent number: 8390420
    Abstract: An immersion well assembly may include a thermistor housing defining a first axial passage and a thermistor wire collar axially secured to the thermistor housing and defining a second axial passage. The second axial passage may receive a thermistor wire and may axially fix the thermistor wire relative to the thermistor housing.
    Type: Grant
    Filed: December 16, 2010
    Date of Patent: March 5, 2013
    Assignee: Emerson Electric Co.
    Inventors: Thomas R. Zuchek, Patrick S. Bauman
  • Patent number: 8305186
    Abstract: A resistive temperature detector assembly characterized by improved calibration means is generally provided. The assembly includes a primary resistive element, characterized by a temperature coefficient of resistance TCR1, for detecting temperature, and a calibration component characterized by first and second resistive elements, each operatively united with each other, and with the primary resistive element. The first resistive element is configured and/or adapted so as to permit selective passage of current through at least a portion thereof, with the first and second resistive elements characterized by temperature coefficients of resistance TCR1 and TCR2, TCR1 having a value intermediate the value of TCR1 and TCR2.
    Type: Grant
    Filed: August 24, 2011
    Date of Patent: November 6, 2012
    Assignee: Minco Products, Inc.
    Inventor: Bryan Jacob Myers
  • Patent number: 8269598
    Abstract: The present invention relates to a laminate thermistor device comprising a lead terminal 12 connected to a terminal electrode 10. A device main body 4 is a rectangular parallelepiped having mutually perpendicular first side 4a, second side 4b and third side 4c, and when a length of the first side is ?, a length of the second side is ? and a length of the third side is ?, the length of each side ?, ? and ? satisfies a relation of ???>?. The terminal electrodes 10 are respectively formed on two plane surfaces including the first side 4a and second side 4b, and the lead terminals 12 are connected to the terminal electrodes 10 respectively to sandwich the third side 4c of the device main body 4 in a length direction therebetween.
    Type: Grant
    Filed: February 16, 2010
    Date of Patent: September 18, 2012
    Assignee: TDK Corporation
    Inventors: Hirokazu Kobayashi, Takayuki Tanaka
  • Patent number: 8228160
    Abstract: A high-temperature sensor element includes at least one thermistor element having at least two contact areas and one contacting element including an isolating ceramic base body and at least two conductor lines. The contact areas of the thermistor element are connected to the conductor lines of the contacting element by an electro conductive bridge. A process for assembling a sensor element is also described in which an thermistor element is connected by a temperature resistant junction to a contacting element, and in which the thermistor element and part of the contacting element adjacent to the thermistor element are sealed by a encapsulation compound.
    Type: Grant
    Filed: November 5, 2009
    Date of Patent: July 24, 2012
    Assignee: EPCOS AG
    Inventors: Gerald Kloiber, Norbert Freiberger
  • Patent number: 8220140
    Abstract: A system for performing bonding of a first substrate including a first plurality of solder pads to a second substrate including a second plurality of solder pads comprises a first alignment mark set and a first plurality of dots on the first substrate. The system further comprises a second alignment mark set and a second plurality of dots on the second substrate. The second plurality of dots are configured to interlock and form an interlocking key with the first plurality of dots. The first alignment mark set is aligned with the second alignment mark set corresponding to the first and second plurality of dots being aligned and the first and second plurality of solder pads being aligned. The first and second plurality of dots are configured to remain substantially solid during a reflow of the first plurality of solder pads.
    Type: Grant
    Filed: September 13, 2010
    Date of Patent: July 17, 2012
    Assignee: Western Digital (Fremont), LLC
    Inventors: Lei Wang, Luc Ving Chung
  • Patent number: 8162541
    Abstract: A two-terminal temperature sensor connects a first end of thermistor or other thermometer device to a first electrical terminal via an inner compression coil. A second electrical terminal is connected to a second end of the thermistor via an outer compression coil and a formed conductor. The inner compression coil and thermistor are positioned within the formed conductor. The inner compression coil and thermistor are prevented from contact with the formed conductor by an inner insulating tube. The first and second electrical contacts are mounted in a molded terminal assembly that insulates the electrical contacts from one another. The entire assembly is housed within a housing that is electrically isolated from the formed conductor and outer compression coil via an outer insulating tube and an insulating disk.
    Type: Grant
    Filed: April 6, 2009
    Date of Patent: April 24, 2012
    Inventors: Vincent H. Rose, Roxanne P. Ostlund, legal representative
  • Patent number: 8134446
    Abstract: An electrical component is specified with a sensor element, which is embedded in a plate arrangement. The plate arrangement includes at least three plates and conductor tracks, which are located between them and are conductively connected with the sensor element. At least two of the conductor tracks have exposed areas. Furthermore, a method for the encapsulation of a sensor element and a method for the production of a plate arrangement are specified.
    Type: Grant
    Filed: January 6, 2009
    Date of Patent: March 13, 2012
    Assignee: Epcos AG
    Inventors: Gerald Kloiber, Adalbert Feltz, Claus Cernoch
  • Patent number: 8130072
    Abstract: A temperature probe includes a substrate, a cantilever body portion formed on the substrate, having an anchor portion held in contact to the substrate and a free end portion extending out of the surface of the substrate, and a sputter-deposited thermistor sensor portion located at the free end portion of the cantilever body portion.
    Type: Grant
    Filed: May 15, 2009
    Date of Patent: March 6, 2012
    Assignee: Palo Alto Research Center Incorporated
    Inventors: Dirk De Bruyker, Michal V. Wolkin
  • Patent number: 8115139
    Abstract: An infrared sensor with an electrically heatable sensor housing. The housing including a heating device in the form of a strip conductor-like electric heating track, which is controlled by a control device, and applied onto a ceramic substrate. The ceramic substrate comprises an electrically insulated ceramic material providing adequate thermal conductivity and preferably forming the bottom of the sensor housing, and carrying at least one infrared sensor element, e.g., a thermopile sensor. The ceramic substrate having electric strip conductors serving as a contact surface for a corresponding (not-shown) housing cover and through-hole contacts serving as electrical connections between the top side and the bottom side of the ceramic substrate. The electric heating tracks and strip conductors in a preferred embodiment comprise thick-film tracks. The infrared sensor being suitable for a measuring tip of an intra-auricular infrared thermometer.
    Type: Grant
    Filed: August 20, 2004
    Date of Patent: February 14, 2012
    Assignee: Kaz USA, Inc.
    Inventors: Stefan Scharf, Stefan Neth, Bernhard Kraus
  • Patent number: 8115585
    Abstract: In a variable resistance element having a variable resistor between first and second electrodes and changing its electric resistance when a voltage pulse is applied between both electrodes, data holding characteristics can be improved by increasing a programming voltage and programming in a high current density. Therefore, a booster circuit for supplying a high voltage is needed when the variable resistance element is applied to a nonvolatile memory. When the smaller of the areas of the contact regions between the first electrode and variable resistor and between the second electrode and variable resistor is set to the electrode area of the variable resistance element, it is set within a specific range not larger than the predetermined electrode area. Thereby the programming current density can be increased without raising the programming voltage, and the variable resistance element having preferable data holding characteristics even at a high temperature can be provided.
    Type: Grant
    Filed: July 5, 2006
    Date of Patent: February 14, 2012
    Assignee: Sharp Kabushiki Kaisha
    Inventor: Kazuya Ishihara
  • Patent number: 8106740
    Abstract: A resistance thermometer, composed of a plurality of components, at least comprising: at least one substrate, which is composed essentially of a material, whose thermal coefficient of expansion is essentially greater than 10.5 ppm/K; at least one resistive element, which is arranged on the substrate; and at least one electrically insulating, separating layer, which is arranged essentially between the resistive element and the substrate. The invention includes that the effective thermal coefficient of expansion TCEeff is greater than or equal to the thermal coefficient of expansion of the bulk metal of the resistive element.
    Type: Grant
    Filed: May 9, 2008
    Date of Patent: January 31, 2012
    Assignee: Innovative Sensor Technology IST AG
    Inventor: Jiri Holoubek