Ambient Temperature Patents (Class 338/25)
  • Patent number: 11735366
    Abstract: A multilayer ceramic electronic component includes a multilayer body and an outer electrode on each end surfaces of the multilayer body. The outer electrode includes an underlying electrode layer and a plating layer on the underlying electrode layer. Void portions inside the underlying electrode layer are each filled with a barrier film. The barrier film is formed by an atomic layer deposition method.
    Type: Grant
    Filed: July 19, 2021
    Date of Patent: August 22, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Syouta Ikebe, Yasuhiro Nishisaka, Takefumi Takahashi
  • Patent number: 11415601
    Abstract: A resistor having low temperature coefficient of resistance includes a resistive part and two conductive parts connected to opposite sides of the resistive part. One conductive part has a through slot and a sensing portion between the through slot and the resistive part. The through slot has two inter-connected sections. Each section extends and ends with a closed end and has a parallel component, parallel to a main current direction defined on the resistor, and a perpendicular component, perpendicular to the main current direction. Another resistor having low temperature coefficient of resistance includes a resistive part and two conductive parts connected to two sides of the resistive part respectively. Each conductive part has a protrusion block, extending outward perpendicular to a main current direction defined on the resistor, and a sensing portion at the protrusion block.
    Type: Grant
    Filed: December 9, 2019
    Date of Patent: August 16, 2022
    Assignee: CYNTEC CO., LTD.
    Inventors: Tzu-Hao Hung, Ying-Da Luo
  • Patent number: 11365990
    Abstract: A sensor device for detecting a physical variable. The sensor device includes a housing, a sensor module arranged in the housing, a potting compound which at least partially fills the housing and which encloses the sensor module, and at least one mounting element via which the sensor module is mounted to the housing. The sensor module includes a module board and at least one motion-sensitive sensor element which is arranged on the module board. The potting compound, in a cured state, has a hardness which is greater than a hardness of the at least one mounting element and less than a hardness of the housing.
    Type: Grant
    Filed: September 25, 2018
    Date of Patent: June 21, 2022
    Assignee: FRABA B.V.
    Inventors: Christian Fell, Dimitri Pritzkau
  • Patent number: 11231331
    Abstract: A temperature sensing tape including a flexible, electrically insulating substrate, a plurality of temperature sensing elements disposed on the substrate, each temperature sensing element including a first electrode and a second electrode arranged in a confronting, spaced-apart relationship to define a gap therebetween, and a variable resistance material disposed within the gap and connecting the first electrode to the second electrode, wherein the first electrode of at least one of the temperature sensing elements is connected to the second electrode of an adjacent temperature sensing element by a flexible electrical conductor.
    Type: Grant
    Filed: September 5, 2018
    Date of Patent: January 25, 2022
    Assignee: Littelfuse, Inc.
    Inventors: Boris Golubovic, Martin G. Pineda, Yuriy Borisovich Matus, Jianhua Chen
  • Patent number: 11099082
    Abstract: A sensor substrate includes an insulating substrate including a plurality of inorganic particles formed of an insulator in contact with each other and glass, and a wiring conductor disposed on the insulating substrate. The plurality of inorganic particles and the glass are in contact with the wiring conductor, and the glass is disposed at a position between the plurality of inorganic particles and the wiring conductor, and a contact portion between the plurality of inorganic particles and the wiring conductor is larger than a contact portion between the glass and the wiring conductor in a longitudinal sectional view.
    Type: Grant
    Filed: October 26, 2016
    Date of Patent: August 24, 2021
    Assignee: KYOCERA CORPORATION
    Inventors: Hiroshi Matsumoto, Takahito Hirata, Tsutomu Sugawara, Hiroshige Itou
  • Patent number: 11067454
    Abstract: In a particular embodiment of the present disclosure, an apparatus is disclosed for improving for the stability of a resistance temperature detector (RTD). In this particular embodiment, the apparatus includes an RTD having a case surrounding a resistive meander deposited on a substrate. The RTD also includes a pull-down resistor. A first end of the resistive meander is configured for coupling to a positive power supply. The second end of the resistive meander is coupled to a first end of the pull-down resistor. The second end of the pull-down resistor is coupled to a ground. The case of the RTD is also coupled to the ground.
    Type: Grant
    Filed: July 22, 2019
    Date of Patent: July 20, 2021
    Assignee: SENSATA TECHNOLOGIES, INC.
    Inventor: Nikolay S. Chehlarov
  • Patent number: 10973718
    Abstract: Systems, methods and techniques for operating a patient support apparatus are disclosed. The patient support apparatus includes a support structure including a base and a patient support surface to support a patient. The patient support apparatus also includes an actuator coupled to the support structure and operable to move the patient support surface. The actuator is configured to receive an applied voltage and an applied electrical current, and to produce an output power, where the applied electrical current varies based on different loads applied to the actuator. A controller is coupled to the actuator to determine a desired output power of the actuator and to control the actuator such that the output power produced by the actuator is controlled relative to the desired output power by modifying the applied voltage to compensate for the different loads being applied to the actuator.
    Type: Grant
    Filed: July 20, 2018
    Date of Patent: April 13, 2021
    Assignee: Stryker Corporation
    Inventors: Anish Paul, Krishna S. Bhimavarapu
  • Patent number: 10939596
    Abstract: Methods and apparatus for measuring and optionally adjusting the temperature profile of an optical window. In one example, an optical window with integrated temperature sensing functionality includes a first window layer of an optically transparent material, a second window layer of the optically transparent material, an electromagnetic interference shielding grid disposed between the first and second window layers and including a first electrically conductive structure and a second electrically conductive structure, and a thermally sensitive material disposed between the first and second electrically conductive structures, the thermally sensitive material having an electrical property that varies as a function of temperature.
    Type: Grant
    Filed: August 9, 2019
    Date of Patent: March 2, 2021
    Assignee: RAYTHEON COMPANY
    Inventors: Kyle L. Grosse, Gary A. Frazier, Catherine Trent
  • Patent number: 10847713
    Abstract: A method is for manufacturing a magnetic-tunnel-junction (MTJ) device. The method includes forming a free magnetic layer over a substrate, forming a metal layer over the free magnetic layer, and oxidizing the metal layer by exposing the metal layer to an oxidation gas at a temperature of 250° K or less.
    Type: Grant
    Filed: May 3, 2019
    Date of Patent: November 24, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Whan Kyun Kim, Eun Sun Noh, Joon Myoung Lee, Woo Chang Lim, Jun Ho Jeong
  • Patent number: 10837842
    Abstract: A substrate for a sensor assembly of a resistance thermometer is disclosed. The substrate is comprised of spinel and magnesium oxide and has a thermal coefficient of expansion approximately equal to the thermal coefficient of expansion of platinum.
    Type: Grant
    Filed: December 1, 2016
    Date of Patent: November 17, 2020
    Assignee: TE CONNECTIVITY SENSORS GERMANY GMBH
    Inventors: Heinrich Zitzmann, Horst Sirtl, Dirk Nusse
  • Patent number: 10842020
    Abstract: A substrate for a sensor assembly of a resistance thermometer is disclosed. The substrate has a plurality of first layers formed of a first material and a plurality of second layers formed of a second material. The first and second layers are disposed over one another such that a thermal coefficient of expansion of the substrate is approximately equal to the thermal coefficient of expansion of platinum.
    Type: Grant
    Filed: November 30, 2016
    Date of Patent: November 17, 2020
    Assignee: TE CONNECTIVITY SENSORS GERMANY GMBH
    Inventors: Heinrich Zitzmann, Horst Sirtl, Dirk Nusse
  • Patent number: 10840560
    Abstract: An improved high energy density rechargeable (HEDR) battery with an anode energy layer, a cathode energy layer, a separator between the anode and cathode energy layers for preventing internal discharge thereof, and at least one current collector for transferring electrons to and from either the anode or cathode energy layer, includes a resistive layer interposed between the separator and one of the current collectors for limiting the rate of internal discharge through the failed separator in the event of separator failure. The resistive layer has a fixed resistivity at temperatures between a preferred temperature range and an upper temperature safety limit for operating the battery. The resistive layer serves to avoid temperatures in excess of the upper temperature safety limit in the event of separator failure in the battery, and a fixed resistivity of the resistive layer is greater than the internal resistivity of either energy layer.
    Type: Grant
    Filed: June 8, 2018
    Date of Patent: November 17, 2020
    Assignee: American Lithium Energy Corporation
    Inventors: Jiang Fan, Dengguo Wu
  • Patent number: 10837838
    Abstract: A substrate for a sensor assembly of a resistance thermometer is disclosed. The substrate is comprised of aluminum oxide and zirconium dioxide and has a thermal coefficient of expansion approximately equal to the terminal coefficient of expansion of platinum.
    Type: Grant
    Filed: December 1, 2016
    Date of Patent: November 17, 2020
    Assignee: TE CONNECTIVITY SENSORS GERMANY GMBH
    Inventors: Heinrich Zitzmann, Horst Sirtl, Dirk Nusse
  • Patent number: 10753816
    Abstract: A manner to determine pressure (e.g. inside a vacuum package, such as a MEMS die), without prior calibration, is provided using a model and a set of one or more gauges (e.g. Pirani, thermistor, thermocouple gauges) with distinct geometries. In order to calculate pressure from the electrical measurements performed on the gauges, there are several intermediate steps and an analytical model describes each of these steps. Besides the electrical measurements, other inputs are required, such as material properties and certain dimensions, which may not be known accurately. Several different gauge geometries are proposed which can be combined in order to determine the vacuum (pressure) level without knowing the values of these inputs beforehand.
    Type: Grant
    Filed: June 6, 2018
    Date of Patent: August 25, 2020
    Inventors: Kevin Kornelsen, Pascal Newby, Cedric Spits, Luc Frechette
  • Patent number: 10748680
    Abstract: The invention concerns a resistor, in particular a low-resistance current measuring resistor, having two connecting parts made of a conductor material and a resistor element made of a resistance material inserted between the connecting parts, the resistance material having a specific thermal force which generates a specific thermoelectric voltage in the event of a temperature difference between the resistor element on the one hand and the connecting parts on the other hand. The invention additionally provides for a compensating element which in operation generates a thermoelectric voltage which at least partially compensates for the thermoelectric voltage generated by the resistor element. Furthermore, the invention includes a corresponding manufacturing process.
    Type: Grant
    Filed: July 3, 2017
    Date of Patent: August 18, 2020
    Assignee: ISABELLENHÜTTE HEUSLER GMBH & CO. KG
    Inventor: Ullrich Hetzler
  • Patent number: 10734141
    Abstract: An electronic component and a manufacturing method thereof are disclosed. The electronic component includes a substrate, a conductor pattern portion disposed on the substrate, a first electrode pattern and a second electrode pattern disposed on the conductor pattern portion, at least one dummy conductor pattern disposed to be spaced apart from the conductor pattern portion and disposed on the substrate, and at least one dummy electrode pattern disposed on the at least one dummy conductor pattern. A width of the first electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the first electrode pattern, and a width of the second electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the second electrode pattern.
    Type: Grant
    Filed: March 11, 2019
    Date of Patent: August 4, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong Pil Lee, Doo Ho Yoo, Hyung Gon Kim, Jung Il Kim, Hyun Jun Choi, Hyung Seok Roh
  • Patent number: 10663352
    Abstract: A sensor assembly for a resistance thermometer is disclosed. The sensor assembly comprises a substrate, a measuring structure disposed on the substrate, and a cover layer disposed on the measuring structure. The cover layer has a plurality of first layers formed of a first material and a plurality of second layers formed of a second material. The first and second layers are disposed over one another such that a thermal coefficient of expansion of the cover layer is adapted to a thermal coefficient of expansion of the measuring structure.
    Type: Grant
    Filed: December 1, 2016
    Date of Patent: May 26, 2020
    Assignee: TE CONNECTIVITY SENSORS GERMANY GMBH
    Inventors: Heinrich Zitzmann, Horst Sirtl, Dirk Nusse
  • Patent number: 10663355
    Abstract: A device having a first terminal region and a second terminal region. The first terminal region includes fine-tune (FT) metal stripes that are separated from each other by a first distance along the longitudinal direction. The second terminal region is spaced apart from the first terminal region by at least an inter-terminal distance. The second terminal region includes coarse-tune (CT) metal stripes that are separated from each other by a second distance along the longitudinal direction. The second distance is greater than the first distance, and the inter-terminal distance greater than the second distance. Each of the FT metal stripes may be selected as a first access location, and each of the CT metal stripes may be selected as a second access location. A pair of selected first and second access locations access a sheet resistance defined by a distance therebetween.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: May 26, 2020
    Assignee: Texas Instruments Incorporated
    Inventors: Keith Ryan Green, Byron Jon Roderick Shulver
  • Patent number: 10636550
    Abstract: A composite thermistor chip includes a thermosensitive ceramic chip, a metal electrode and a glass glaze resistor, wherein the thermosensitive ceramic chip has a front side and a back side, the metal electrode includes a first terminal electrode, a second terminal electrode and a third electrode layer; the first terminal electrode and the second terminal electrode are respectively arranged at two ends of the front side of the thermosensitive ceramic chip, and the glass glaze resistor is arranged on the front side of the thermosensitive ceramic chip, two ends of the glass glaze resistor are respectively connected to the first terminal electrode and the second terminal electrode; and the back side of the thermosensitive ceramic chip is covered with the third electrode layer.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: April 28, 2020
    Assignee: Exsense Electronics Technology Co., Ltd.
    Inventors: Zhaoxiang Duan, Jiankai Ye, Jun Yang, Qixing Bai, Limin Tang
  • Patent number: 10578572
    Abstract: A gas sensor device with temperature uniformity is presented herein. In an implementation, a device includes a complementary metal-oxide semiconductor (CMOS) substrate layer, a dielectric layer and a gas sensing layer. The dielectric layer is deposited on the CMOS substrate layer. Furthermore, the dielectric layer includes a temperature sensor and a heating element coupled to a heat transfer layer associated with a set of metal interconnections. The gas sensing layer is deposited on the dielectric layer.
    Type: Grant
    Filed: January 19, 2016
    Date of Patent: March 3, 2020
    Assignee: INVENSENSE, INC.
    Inventors: Fang Liu, Jim Salvia, Zhineng Zhu, Michael Perrott
  • Patent number: 10495521
    Abstract: A sensor substrate includes an insulating substrate, an electrode disposed on a principal face of the insulating substrate, a resistor wiring section in a form of multiple layers located within the insulating substrate, the multiple layers being disposed in a thickness direction of the insulating substrate, and a widened metallic layer disposed so as to overlap the electrode, as seen in a transparent plan view of the sensor substrate.
    Type: Grant
    Filed: April 26, 2017
    Date of Patent: December 3, 2019
    Assignee: KYOCERA Corporation
    Inventor: Hiroshi Matsumoto
  • Patent number: 10481040
    Abstract: A boundary layer suction system adapted to a surface exposed to the circulation of a fluid. The system comprises a portion of the surface, a bifurcation element for bifurcating a mass of fluid flowing along the front face of the surface, comprising an airfoil-shaped cross-section such that the fluid is bifurcated into a first and a second flow, a slot located on the portion of the surface and downstream of the leading edge of the bifurcation element, the slot communicating the front and the rear faces of the portion of the surface, and an arrangement to provide a pressure difference between the front and the rear faces of the surface around the slot, such that a suction of the boundary layer is performed through the slot by the pressure difference.
    Type: Grant
    Filed: July 21, 2016
    Date of Patent: November 19, 2019
    Assignee: AIRBUS OPERATIONS S.L.
    Inventors: José Maria Diaz Parrilla, Álvaro Jara Rodelgo, Miguel Ángel Gallego Lorenzo, José Ángel Hernanz Manrique
  • Patent number: 10386218
    Abstract: The invention relates to a temperature measurement system for measuring a temperature of a tube, comprising a temperature sensor contained in a housing having a contact surface which is connected to an outer surface of the tube, wherein the contact surface has a concave form matching a form of the outer surface of the tube, and wherein a temperature-conductive, flexible intermediate layer is arranged between the contact surface and the outer surface of the tube. A further object is a flowmeter, particularly a Coriolis mass flowmeter, comprising the temperature measurement system.
    Type: Grant
    Filed: November 22, 2016
    Date of Patent: August 20, 2019
    Assignee: ROTA YOKOGAWA GMBH & CO. KG
    Inventors: Matthias Amann, Thomas Boelke, Jacek Kowol, Peter Reinshaus
  • Patent number: 10345156
    Abstract: A temperature sensor including a mineral-insulated supply line, a bottomed metal tube and a temperature sensing element secured in a support structure. An open end part of the bottomed metal tube is connected mechanically to the mineral-insulated supply line. A wire connection mechanically and electrically couples the temperature sensing element to the mineral-insulated supply line. The support structure is moveable in axial direction of the bottomed metal tube in a bottom end part of the bottomed metal tube.
    Type: Grant
    Filed: June 14, 2016
    Date of Patent: July 9, 2019
    Assignee: Sensata Technologies, Inc.
    Inventors: Christiaan Eugene Eduard Baerts, Valentin Grigorov, Asparuh Pavlov Borisov, Tsvetomir Latinov Zarkov
  • Patent number: 10337931
    Abstract: Systems and methods for icing resistant total air temperature probes with air jets are presented. In one embodiment, a probe comprises: a base having a forced air input port; and a body having leading and trailing edges extending from the base, the body comprising: a first interior airflow passage; a temperature sensor positioned within the first airflow passage; a notched intake port at a distal end of the body including an open channel extending into an intake aperture, and a cutaway region defining a recessed second face inset from the first face and exposes the open channel. The intake aperture opens into the first interior airflow passage, the notched intake port comprising air jet ports at a tip of the notched intake port; and a heated airflow passage through the body and isolated from the first interior airflow passage, coupling the forced air input port to the air jet ports.
    Type: Grant
    Filed: January 5, 2017
    Date of Patent: July 2, 2019
    Assignee: Honeywell International Inc.
    Inventors: Morris G. Anderson, Zachary Price, Doug Hollingshead
  • Patent number: 10126178
    Abstract: A fast-responding RTD assembly is provided having a housing including a cage having at least one flow through aperture, a cover disposed over at least one of the housing and the cage, a thin-walled RTD member having a first polyimide tape layer, a second polyimide tape layer sandwiching first and second lead tabs, and a conductor extending between the lead tabs, the thin-walled RTD located within the housing and held in position by a support structure first and second leads extending to the thin-walled member and corresponding to the first and second leads tabs, the thin-walled RTD member being one of curvilinear, linear, circular and spiral and minimizing contact with the housing to minimize conduction error.
    Type: Grant
    Filed: June 17, 2014
    Date of Patent: November 13, 2018
    Assignee: Unison industries, LLC
    Inventor: Jarodd Dan Goedel
  • Patent number: 10121596
    Abstract: A multilayer ceramic capacitor includes a laminated body including multiple ceramic layers. On the ceramic layers, first internal electrodes and second internal electrodes are arranged spaced away from each other, and exposed at a second principal surface of the laminated body. On the ceramic layers which are different from the ceramic layers on which the first internal electrodes are disposed, first auxiliary conductors, second auxiliary conductors, and third auxiliary conductors are disposed, and the second auxiliary conductors and the third auxiliary conductors are exposed from the first principal surface. A first external electrode connected to the first internal electrodes and the second auxiliary conductors and a second external electrode connected to the second internal electrodes and the third auxiliary conductors are disposed on the second principal surface.
    Type: Grant
    Filed: December 5, 2016
    Date of Patent: November 6, 2018
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yutaka Ota, Satoshi Kodama
  • Patent number: 10103139
    Abstract: An integrated circuit structure includes: a semiconductor substrate; a shallow trench isolation (STI) region in the semiconductor substrate; one or more active devices formed on the semiconductor substrate; and a resistor array having a plurality of resistors disposed above the STI region; wherein the resistor array comprises a portion of one or more interconnect contact layers that are for interconnection to the one or more active devices.
    Type: Grant
    Filed: July 7, 2015
    Date of Patent: October 16, 2018
    Assignee: XILINX, INC.
    Inventors: Nui Chong, Jae-Gyung Ahn, Ping-Chin Yeh, Cheang-Whang Chang
  • Patent number: 10072988
    Abstract: A temperature-detecting device includes a thermally conductive sheet, a heat-generating body thermally connected to a first end portion of the thermally conductive sheet, and a temperature-detecting element thermally connected to a second end portion of the thermally conductive sheet. This temperature-detecting device is also provided with thermally insulating layers on the top and bottom faces of the thermally conductive sheet between the first and second end portions thereof.
    Type: Grant
    Filed: December 18, 2014
    Date of Patent: September 11, 2018
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Yoshiya Sakaguchi, Kazuhiko Kubo
  • Patent number: 10041487
    Abstract: A compressor may include a shell, a compression mechanism, first and second temperature sensors, and a control module. The shell may define a lubricant sump. The compression mechanism may be disposed within the shell and may be operable to compress a working fluid. The first temperature sensor may be at least partially disposed within the shell at a first position. The second temperature sensor may be at least partially disposed within the shell at a second position that is vertically higher than the first position. The control module may be in communication with the first and second temperature sensors and the pressure sensor and may determine whether a liquid level in the lubricant sump is below a predetermined level based on data received from the first and second temperature sensors.
    Type: Grant
    Filed: May 11, 2016
    Date of Patent: August 7, 2018
    Assignee: Emerson Climate Technologies, Inc.
    Inventors: Sunil S. Kulkarni, Ronald L. Van Hoose
  • Patent number: 10012551
    Abstract: The invention relates to a downhole measurement sensor assembly for an electrical submersible pump that is housed within a rugged, insulated and durable enclosure. The downhole measurement sensor assembly can be manufactured in accordance with the method described herein. The sensor assembly is configured to be inserted into a windings area of a downhole motor of the electrical submersible pump. The sensor assembly includes insulated lead wires that are connected to a thin-film temperature sensing element for monitoring the ESP motor operating temperature. The thin-film sensing element includes thin lead wires that are electrically connected via a connection substrate to the insulated lead wires. The thin-film sensing element is mounted the connection member, and the connection member may include attachment apertures for connecting the insulated lead wires.
    Type: Grant
    Filed: April 21, 2015
    Date of Patent: July 3, 2018
    Assignee: AUTOMATION SOLUTIONS INC.
    Inventors: Alistair G. Smith, Dennis Miles, Jr.
  • Patent number: 9978484
    Abstract: Provided are a metal nitride film for a thermistor, which has an excellent bending resistance and can be directly deposited on a film or the like without firing, a method for producing the same, and a film type thermistor sensor. The metal nitride film for a thermistor, which consists of a metal nitride represented by the general formula: TixAlyNz (where 0.70?y/(x+y)?0.95, 0.4?z?0.5, and x+y+z=1), wherein the crystal structure thereof is a hexagonal wurtzite-type single phase, and the peak ratio of the diffraction peak intensity of a-axis orientation (100) relative to the diffraction peak intensity of c-axis orientation (002) (i.e., the diffraction peak intensity of a-axis orientation (100)/the diffraction peak intensity of c-axis orientation (002)) is 0.1 or lower in X-ray diffraction.
    Type: Grant
    Filed: March 25, 2013
    Date of Patent: May 22, 2018
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Hiroshi Tanaka, Toshiaki Fujita, Noriaki Nagatomo, Kazutaka Fujiwara, Hitoshi Inaba
  • Patent number: 9964451
    Abstract: Provided is a temperature sensor which does not easily cause a crack in a Ti—Al—N-based thermistor material layer when the film is bent, can be directly deposited on a film or the like without firing, and has a high reliability with a high heat resistance. The temperature sensor includes an insulating film 2, a thin film thermistor portion 3 made of a Ti—Al—N-based thermistor material formed on the insulating film, a pair of pattern electrodes 4 formed on the insulating film with a pair of opposed electrode portions 4a being arranged so as to be opposed to each other on the thin film thermistor portion, wherein the pair of opposed electrode portions covers the entire surface of thin film thermistor portion excluding the region between the opposed electrode portions.
    Type: Grant
    Filed: March 26, 2013
    Date of Patent: May 8, 2018
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Hiroshi Tanaka, Hitoshi Inaba, Kazuta Takeshima, Noriaki Nagatomo
  • Patent number: 9606006
    Abstract: A high temperature sensor includes a substrate, at least two terminal contacts and at least one resistive structure, wherein the terminal contacts and the at least one resistive structure are disposed on a first side of the substrate, and at least one of the resistive structures is electrically contacted by the terminal contacts, wherein at least one electrode is disposed on each of the two terminal contacts next to the resistive structure on the first side of the substrate. The electrodes are electrically connected to the terminal contacts, respectively, or at least one electrode is disposed on at least one terminal contact next to the resistive structure on the first side of the substrate, wherein the electrode is designed in one piece with the resistive structure. The invention also relates to a high temperature sensor and a method for producing such a sensor.
    Type: Grant
    Filed: June 27, 2012
    Date of Patent: March 28, 2017
    Assignee: Heraeus Sensor Technology GmbH
    Inventors: Karlheinz Wienand, Margit Sander
  • Patent number: 9267851
    Abstract: A single-contact tunneling thermometry circuit includes a tunnel junction formed between two objects. Junction temperature gradient information is determined based on a mathematical relationship between a target alternating voltage applied across the junction and the junction temperature gradient. Total voltage measured across the junction indicates the magnitude of the target alternating voltage. A thermal gradient is induced across the junction. A reference thermovoltage is measured when zero alternating voltage is applied across the junction. An increasing alternating voltage is applied while measuring a thermovoltage component and a DC rectification voltage component created by the applied alternating voltage. The target alternating voltage is reached when the thermovoltage is nullified or doubled by the DC rectification voltage depending on the sign of the reference thermovoltage. Thermoelectric current and current measurements may be utilized in place of the thermovoltage and voltage measurements.
    Type: Grant
    Filed: May 21, 2013
    Date of Patent: February 23, 2016
    Assignee: UT-Battelle, LLC
    Inventor: Petro Maksymovych
  • Patent number: 9243392
    Abstract: A faucet includes a logical control, a spout, a hub, a handle, and a touch control operably coupled to at least one of the spout, the hub, and the handle.
    Type: Grant
    Filed: September 30, 2014
    Date of Patent: January 26, 2016
    Assignee: Delta Faucet Company
    Inventors: Garry R. Marty, Joel D. Sawaski, Kurt J. Thomas, Kyle R. Davidson
  • Patent number: 9228905
    Abstract: Aspects of the invention provide for a resistance temperature device (RTD) measurement device. In one embodiment, aspects of the invention include a RTD measurement device that includes: an input including a plurality of terminals from an RTD sensor; a plurality of burnout switches, each burnout switch connected to a terminal of the RTD sensor; a plurality of resources; and a switch block connecting the plurality of terminals and the plurality of resources to determine a measurement of the RTD sensor.
    Type: Grant
    Filed: August 21, 2012
    Date of Patent: January 5, 2016
    Assignee: General Electric Company
    Inventor: Daniel Milton Alley
  • Patent number: 9153366
    Abstract: A resistance element that includes a resistor made of a thin film containing VO2 as a main component and at least one of W, Nb, Mo and Ti as an additive element. The thin film has a plurality of layer regions distributed in the direction of thickness thereof, and amounts of the additive elements doped in the layer regions are different from each other between the adjacent layer regions. Terminal electrodes are disposed such that a current flows through the plural layer regions of the resistor. Preferably, an interval at which the plural layer regions are distributed is selected to be not less than 8 nm and not more than 35 nm.
    Type: Grant
    Filed: September 24, 2013
    Date of Patent: October 6, 2015
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Sakyo Hirose
  • Patent number: 8935843
    Abstract: A thermal, flow measuring device for determining and/or monitoring the flow of a measured medium through a measuring tube. The thermal, flow measuring device includes: a first pin-shaped shell and at least a second pin-shaped shell; a first resistance thermometer and at least a second resistance thermometer. At least the first resistance thermometer is embodied so as to be heatable, wherein the resistance thermometers, in each case, have a first surface, and at least a second surface, which lies opposite the first surface. The first pin-shaped shell surrounds the first resistance thermometer, and the second pin-shaped shell surrounds the second resistance thermometer. The pin-shaped shells are fillable with a fill material. In each case, at least one spacer is placeable between the pin-shaped shell and the first surface of the resistance thermometer, and the second surface of the resistance thermometer is at least partially covered with fill material.
    Type: Grant
    Filed: July 9, 2012
    Date of Patent: January 20, 2015
    Assignee: Endress + Hauser FLowtec AG
    Inventors: Dirk Boguhn, Jiri Holoubek, Axel Pfau, Oliver Popp, Jiri Polak
  • Patent number: 8896410
    Abstract: A chip thermistor has a thermistor portion including a ceramic material containing respective metal oxides of Mn, Ni, and Co as major ingredients; a pair of composite portions including a composite material of Ag—Pd, and respective metal oxides of Mn, Ni, and Co and arranged on both sides of the thermistor portion so as to sandwich in the thermistor portion between the composite portions; and external electrodes connected to the pair of composite portions, respectively. In this manner, the pair of composite portions are used as bulk electrodes and, for this reason, the resistance of the chip thermistor can be adjusted mainly with consideration to the resistance in the thermistor portion without need for much consideration to the distance between the external electrodes and other factors.
    Type: Grant
    Filed: June 21, 2011
    Date of Patent: November 25, 2014
    Assignee: TDK Corporation
    Inventors: Yo Saito, Kouki Yamada, Daisuke Tsuchida
  • Publication number: 20140306605
    Abstract: A PTC composition comprises crystalline polymer and conductive ceramic filler dispersed therein. The crystalline polymer has a melting point less than 90° C. and comprises 5%-30% by weight of the PTC composition. The crystalline polymer comprises ethylene, vinyl copolymer or the mixture thereof. The vinyl copolymer comprises at least one of the functional group selected from the group consisting of ester, ether, organic acid, anhydride, imide or amide. The conductive ceramic filler comprises a resistivity less than 500 ??-cm and comprises 70%-95% by weight of the PTC composition. The PTC composition has a resistivity about 0.01-5 ?-cm and its resistance at 85° C. is about 103 to 108 times that at 25° C.
    Type: Application
    Filed: September 4, 2013
    Publication date: October 16, 2014
    Applicant: POLYTRONICS TECHNOLOGY CORP.
    Inventors: Kuo Chang LO, Wei Tsang Dai, Yi An Sha, Chun Teng Tseng
  • Publication number: 20140247106
    Abstract: The present disclosure relates to a high temperature resistance temperature detector for measuring exhaust gas temperature for example. The structure includes a resistive element disposed on an insulated carrier. The structure further includes a housing disposed over the carrier and resistive element for inhibiting oxidation of the element which would result in failure of the detector.
    Type: Application
    Filed: August 20, 2012
    Publication date: September 4, 2014
    Inventors: Dennis M. DeFrietas, John Patrick Parsons, Denis O'Flynn, Jarodd Goedel
  • Patent number: 8786396
    Abstract: A heater design for post-process trimming of thin-film transistors is described. The heater incorporates low sheet-resistance material deposited in non-active connecting regions of the heater to reduce heat generation and power consumption in areas distant from active heating members of the heater. The heating members are proximal to a thin-film resistor. The resistance of the thin-film resistor can be trimmed permanently to a desired value by applying short current pulses to the heater. Optimization of a heater design is described. Trimming currents can be as low as 20 mA.
    Type: Grant
    Filed: December 29, 2011
    Date of Patent: July 22, 2014
    Assignee: STMicroelectronics Pte. Ltd.
    Inventors: Calvin Leung, Olivier Le Neel
  • Publication number: 20140197156
    Abstract: The present invention provides a semiconductor ceramic composition which is represented by a composition formula of [(Bi.A)x(Ba1-yRy)1-x](Ti1-zMz)aO3 (in which A is at least one kind of Na, Li and K, R is at least one kind of rare earth elements (including Y), and M is at least one kind of Nb, Ta and Sb), in which a, x, y and z satisfy 0.90?a?1.10, 0<x?0.30, 0?y?0.050 and 0?z?0.010 and an average distance between voids, which is an average value of a space between voids being internally present, is 1.0 ?m or more and 8.0 ?m or less.
    Type: Application
    Filed: September 28, 2012
    Publication date: July 17, 2014
    Applicant: HITACHI METALS, LTD.
    Inventors: Kentaro Ino, Takeshi Shimada, Itaro Ueda, Toshiki Kida
  • Patent number: 8777484
    Abstract: A resistance temperature sensor with a first temperature sensor element and a second temperature sensor element, wherein the first temperature sensor element comprises a first measuring path and the second temperature sensor element a second measuring path, wherein the first and the second measuring paths extend on a substrate, wherein the substrate has an anisotropic thermal expansion with at least two mutually differing expansion directions (a, c), and wherein a projection of the first measuring path on the expansion directions (a) differs from a projection of the second measuring path on the expansion directions (c).
    Type: Grant
    Filed: June 23, 2011
    Date of Patent: July 15, 2014
    Assignee: Endress + Hauser Wetzer GmbH + Co. KG
    Inventors: Peter Seefeld, Reinhard Buchner
  • Patent number: 8730002
    Abstract: A resistance thermometer is provided having a measuring resistor in a form of a 0.1 to 10 ?m thick structured platinum layer applied to an electrically insulated surface of a substrate and an electrically insulating coating layer covering the platinum layer. The substrate or its surface contains zirconium dioxide, which is stabilized with oxides of a trivalent and a pentavalent metal. Preferably, the trivalent metal is yttrium and the pentavalent metal is tantalum or niobium. The characteristic curve of the measuring resistor preferably conforms to DIN-IEC 751. For mass production of resistance thermometers having high and reproducible measurement accuracy, a structured platinum layer having a thickness of 0.1 to 10 ?m is applied to an electrically insulating substrate having a thermal expansion coefficient in the range of 8.5 to 10.5×10?6/° K and a roughness less than 1 ?m, and the structured platinum layer is covered by an electrical insulator.
    Type: Grant
    Filed: January 20, 2010
    Date of Patent: May 20, 2014
    Assignee: Heraeus Sensor Technology GmbH
    Inventors: Karlheinz Wienand, Matsvei Zinkevich
  • Patent number: 8632245
    Abstract: A temperature sensor is provided that can easily make possible stuffing with the filler or burying of the temperature detector element so that faster temperature response can be achieved. A temperature sensor has a closed-bottom tubular shaped case, a temperature detector element inserted and accommodated in the case, and a filler filled in the case and sealing the temperature detector element. The temperature sensor is provided with a filler flowing portion formed in a relative gap between the case and the temperature detector element along an insertion direction of the temperature detector element and having a gap relative to the temperature detector element larger than that relative to the remainder portion of the gap.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: January 21, 2014
    Assignee: Mitsubishi Electric Corporation
    Inventor: Seizo Fujimoto
  • Patent number: 8617433
    Abstract: A conductive sintered oxide including: a first crystal phase represented by RE14Al2O9 and a second crystal phase having a perovskite structure represented by (RE21-cSLc)(AlxM1y)O3. RE1 is a first element group consisting of Yb and/or Lu and at least one element selected from Group IIIA elements excluding Yb, Lu and La. RE2 is a second element group consisting of at least one element selected from Group IIIA elements excluding La and including at least one of the elements constituting the first element group RE1. SL is an element group consisting of at least one of Sr, Ca and Mg and which includes Sr as a main element, and M1 is an element group consisting of at least one element selected from Groups IVA, VA, VIA, VIIA and VIII excluding Cr. The coefficient c is in the range of 0.18<c<0.50, and the coefficients x and y are in the range of 0.95?x+y?1.1.
    Type: Grant
    Filed: August 16, 2011
    Date of Patent: December 31, 2013
    Assignee: NGK Spark Plug Co., Ltd.
    Inventors: Hiroshi Watanabe, Yasayuki Okimura, Shinji Ban, Takeshi Mitsuoka
  • Patent number: 8617432
    Abstract: A sintered electroconductive oxide forming a thermistor element has a first crystal phase having a composition represented by RE14Al2O9 and a second crystal phase having a perovskite structure represented by (RE21-aSLa)MO3. The factor a of the second crystal phase is: 0.18<a<0.50, wherein RE1 represents at least one of Yb and Lu and at least one species selected from among group 3A elements excluding Yb, Lu, and La; RE2 represents at least one species selected from among group 3A elements excluding La and which contains at least one species selected from the group RE1; M represents Al and at least one species selected from group 4A to 7A, and 8 elements; and SL represents Sr, Ca, and Mg, with at least Sr being included at a predominant proportion by mole.
    Type: Grant
    Filed: February 18, 2010
    Date of Patent: December 31, 2013
    Assignee: NGK Spark Plug Co., Ltd.
    Inventors: Yasuyuki Okimura, Shinji Ban, Hiroshi Watanbe, Takeshi Mitsuoka
  • Patent number: 8525637
    Abstract: A current sense resistor and a method of manufacturing a current sensing resistor with temperature coefficient of resistance (TCR) compensation are disclosed. The resistor has a resistive strip disposed between two conductive strips. A pair of main terminals and a pair of voltage sense terminals are formed in the conductive strips. A pair of rough TCR calibration slots is located between the main terminals and the voltage sense terminals, each of the rough TCR calibration slots have a depth selected to obtain a negative starting TCR value observed at the voltage sense terminals. A fine TCR calibration slot is formed between the pair of voltage sense terminals.
    Type: Grant
    Filed: June 11, 2012
    Date of Patent: September 3, 2013
    Assignee: Vishay Dale Electronics, Inc.
    Inventors: Clark L. Smith, Thomas L. Bertsch, Todd L. Wyatt, Thomas L. Veik