Resistance Element Coated On Base Patents (Class 338/308)
  • Patent number: 11562859
    Abstract: A multilayered capacitor includes a shock absorbing layer disposed between an upper layer of a capacitor body and a conductive resin layer of an external electrode and between a lower layer of the capacitor body and the conductive resin layer of the external electrode. A length of the shock absorbing layer is longer than that of the conductive resin layer, thereby improving warpage strength characteristics of the capacitor body.
    Type: Grant
    Filed: October 19, 2021
    Date of Patent: January 24, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Seok Yi, Jung Min Kim, Chang Hak Choi, Bon Seok Koo, Byung Woo Kang, Hae Sol Kang, San Kyeong, Jun Hyeon Kim
  • Patent number: 11491049
    Abstract: Methods systems and apparatus are set forth herein. There is provided in one embodiment determining one or more body physiological parameter of a patient based on one or more input; and controlling a heating system for warming the patient based on a result of the determining.
    Type: Grant
    Filed: December 7, 2015
    Date of Patent: November 8, 2022
    Assignee: GENERAL ELECTRIC COMPANY
    Inventors: Yogen Vishwas Utturkar, Ernst Wolfgang Stautner, Pradeep Salapakkam, Bryan Whalen
  • Patent number: 11482371
    Abstract: An electronic component includes: an element body in which a plurality of insulator layers are stacked; a coil in which a plurality of inner conductors installed in the element body are electrically connected to each other; and an outer electrode that is disposed on an outer surface of the element body, is electrically connected to the coil, and includes at least a baked electrode layer. The inner conductor connected to the outer electrode includes a connection conductor that electrically connects the baked electrode layer to the inner conductor. The connection conductor includes a protruding portion that protrudes from the outer surface of the element body to the outer electrode. The protruding portion includes a metal having a smaller diffusion coefficient than a metal of a main component included in the baked electrode layer. The inner conductors have a lower electric resistance value than the metal included in the protruding portion.
    Type: Grant
    Filed: December 16, 2019
    Date of Patent: October 25, 2022
    Assignee: TDK CORPORATION
    Inventors: Shinichi Sato, Yohei Tadaki, Akihiko Oide, Yuma Ishikawa, Hidekazu Sato, Kazuhiro Ebina, Hiroyuki Tanoue
  • Patent number: 11476049
    Abstract: A multi-layer ceramic electronic device includes an element body and terminal electrodes. The terminal electrodes include end electrode parts covering ends of the element body in which internal electrode layers are led and upper electrode parts continuing to the end electrode parts and each partially covering an upper surface of the element body in a lamination direction. An upper-surface cover layer covering the upper surface of the element body located between the upper electrode parts has an external surface substantially flush with external surfaces of the upper electrode parts. The terminal electrodes are not substantially formed on a lower surface of the element body located opposite to the upper surface of the element body in the lamination direction.
    Type: Grant
    Filed: October 30, 2019
    Date of Patent: October 18, 2022
    Assignee: TDK CORPORATION
    Inventors: Toshio Sakurai, Hirobumi Tanaka, Keisuke Okai, Daisuke Iwanaga, Hisashi Nakata, Tomoya Shibasaki
  • Patent number: 11430587
    Abstract: A high frequency termination for converting a high frequency electrical signal of a circuit into heat. The high frequency termination includes a substrate. The high frequency termination also includes a spiral resistor formed on the substrate and having a first end and a second end. The high frequency termination also includes a conductive pad electrically coupled to the first end of the spiral resistor. The high frequency termination also includes a contact electrically coupled to the conductive pad and configured to connect to the circuit.
    Type: Grant
    Filed: January 14, 2020
    Date of Patent: August 30, 2022
    Assignee: SMITHS INTERCONNECT AMERICAS, INC.
    Inventors: Moamer Hasanovic, Michael J. Kettner, Conrad W. Jordan
  • Patent number: 11430609
    Abstract: A multilayer ceramic electronic component includes a stacked body, and an external electrode including an underlying electrode layer containing a conductive metal and a glass component, a resin layer containing a thermosetting resin and no metal component, and a plating layer. The underlying electrode layer extends from a first or second end surface, and covers a portion of each of first and second main surfaces and first and second lateral surfaces. The resin layer covers the underlying electrode layer on the second main surface adjacent to the first or second end surface. The plating layer covers a portion of the surface of the underlying electrode layer that is not covered with the resin layer, and covers the surface of the resin layer.
    Type: Grant
    Filed: July 16, 2020
    Date of Patent: August 30, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Takayoshi Yamamoto
  • Patent number: 11393630
    Abstract: A multilayer electronic component has a body and a non-conductive resin layer. The non-conductive resin layer includes a body cover portion disposed in a region of an external surface of the body in which an electrode layer of an external electrode is not disposed, and an extending portion extending from the body cover portion between the electrode layer and a conductive resin layer of the external electrode, to thereby suppress arc discharge, improve bending strength, and improve moisture resistance.
    Type: Grant
    Filed: March 30, 2020
    Date of Patent: July 19, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Seok Yi, Jung Min Kim, Bon Seok Koo, Chang Hak Choi, Il Ro Lee, Byung Woo Kang, San Kyeong, Hae Sol Kang
  • Patent number: 11361906
    Abstract: A multilayer ceramic electronic component includes a stacked body and external electrodes provided on two end surfaces of the stacked body. Each external electrode includes an underlying electrode layer including a conductive metal, a resin electrode layer including a resin and metal component, a resin layer including a resin and no metal component, and a metal layer. The underlying electrode layers extend from the two end surfaces to cover a portion of two main surfaces and two lateral surfaces. The resin electrode layers cover the underlying electrode layers provided on the two end surfaces. The resin layers are connected to the resin electrode layers and provided on the underlying electrode layers located on a portion of the two main surfaces and two lateral surfaces. The metal layers cover the surfaces of the resin electrode layers and resin layers.
    Type: Grant
    Filed: August 18, 2020
    Date of Patent: June 14, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Yasuhiro Mishima
  • Patent number: 11292085
    Abstract: A method for working a first component and a second component comprises the following steps: providing the first component, which comprises a thermally sprayed electrically conductive layer, providing the second component, which has a longitudinally extended strip of copper, which at least in a first region has a thickness transversely to the longitudinal direction of more than 0.1 millimeter, arranging the strip and the layer one on top of the other, so that the first region of the strip and the layer have a contact region in common with one another, emitting a laser beam onto the contact region and forming a welded connection, which connects the strip and the layer to one another.
    Type: Grant
    Filed: November 9, 2015
    Date of Patent: April 5, 2022
    Assignee: WEBASTO SE
    Inventors: Thorsten Kabelitz, Jürgen Lipp, Andreas Schmidmayer, Fritz Wegener, Achim Holzwarth, Stephan Buckl, Tino Klinkmüller, Andreas Reuter, Karl Göttl, Daniel Eckert
  • Patent number: 11250992
    Abstract: A capacitor component includes a body including a layered portion having alternately stacked first and second internal electrodes laminated with dielectric layers interposed therebetween in a first direction, and first and second connecting portions disposed on two opposing surfaces of the layered portion, respectively, in a second direction perpendicular to the first direction and electrically connected to the first and second internal electrodes, respectively. The first and second connecting portions each include a metal layer disposed on the layered portion, a ceramic layer disposed on the metal layer, and an exposed portion penetrating through the ceramic layer to be in contact with the metal layer.
    Type: Grant
    Filed: April 8, 2020
    Date of Patent: February 15, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yong Park, Jong Ho Lee, Woo Chul Shin, Ki Pyo Hong
  • Patent number: 11232906
    Abstract: A film capacitor includes: a main body portion including dielectric films and metal films which are laminated; external electrodes; and an insulating layer disposed on a surface of the main body portion. The main body portion includes a pair of first faces, a pair of first side faces and a pair of second side faces, the first side faces and the second side faces connecting the first faces. The external electrodes are disposed on the first side faces, respectively. The metal films each include a plurality of first segments into which the metal films are divided by a plurality of first grooves extending in a first direction. The insulating layer is disposed between the main body portion and parts of the external electrodes within first regions which are regions of the first side faces that are distant from the second side faces, respectively, by a distance of P or less.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: January 25, 2022
    Assignee: Kyocera Corporation
    Inventors: Yoshihiro Nakao, Kousei Kamigaki
  • Patent number: 11227720
    Abstract: A multilayer ceramic electronic component includes a body including a dielectric layer, first and second internal electrodes, a stacked portion including first and second surfaces opposing each other in a stacking direction of the first and second internal electrodes, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first and second surfaces, connected to the third and fourth surfaces, and opposing each other, and a coating layer disposed on the first to sixth surfaces of the stacked portion and having first and second connection portions; and first and second external electrodes connected to the first and second internal electrodes, respectively, and arranged on the third and fourth surfaces of the body, wherein the first and second internal electrodes are respectively connected to the first and second external electrodes through the first and second connection portions.
    Type: Grant
    Filed: May 1, 2020
    Date of Patent: January 18, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yong Jin Yun, So Ra Kang, Ki Pyo Hong, Byeong Gyu Park, Jong Ho Lee, Jung Min Park
  • Patent number: 11183331
    Abstract: A multilayered capacitor includes a shock absorbing layer disposed between an upper layer of a capacitor body and a conductive resin layer of an external electrode and between a lower layer of the capacitor body and the conductive resin layer of the external electrode. A length of the shock absorbing layer is longer than that of the conductive resin layer, thereby improving warpage strength characteristics of the capacitor body.
    Type: Grant
    Filed: August 12, 2019
    Date of Patent: November 23, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Seok Yi, Jung Min Kim, Chang Hak Choi, Bon Seok Koo, Byung Woo Kang, Hae Sol Kang, San Kyeong, Jun Hyeon Kim
  • Patent number: 11183332
    Abstract: A multilayer electronic component in the example embodiment includes a Si-organic compound layer including a body covering portion disposed on a region of an exterior surface of a body between external electrodes and an extended portion extending from the body covering portion to a region between a plating layer and an additional plating layer of the external electrode, thereby having improved warpage strength and moisture resistance.
    Type: Grant
    Filed: March 30, 2020
    Date of Patent: November 23, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Yeong Kim, Woo Chul Shin, Ji Hong Jo
  • Patent number: 11131586
    Abstract: A resistance pattern that contains platinum as a main component is formed into a meander shape and on a main surface of a ceramic substrate. A protective film layer that covers the resistance pattern has a two-layer structure including a trap layer as an inner layer and an overcoat layer as an outer layer. The trap layer contains alumina as a main component and 2 to 30 vol % of platinum. The overcoat layer contains alumina as a main component. With such a configuration, even when reactivity of the platinum resistance pattern becomes higher under high temperature use, platinum contained in the trap layer reacts with oxygen or impurities etc. contained in the ceramic substrate. Thus, reaction of the platinum resistance pattern can be suppressed.
    Type: Grant
    Filed: May 15, 2018
    Date of Patent: September 28, 2021
    Assignee: KOA Corporation
    Inventors: Katsuya Miura, Masahiro Shimodaira
  • Patent number: 11119066
    Abstract: A room temperature nitrogen dioxide gas sensor comprising tin(IV) oxide decorated with gold nanoparticles is described. The tin(IV) oxide may have an average layer thickness of 10-1,000 nm, and is topped with dispersed gold nanoparticles having an average longest dimension of 200-650 nm. The room temperature nitrogen dioxide gas sensor may be used to detect and measure levels of nitrogen dioxide gas at room temperature and at concentrations of 100 ppb-1800 ppm, with a high stability. A method of making the room temperature nitrogen dioxide sensor is also described, and involves sputtering to deposit a tin(IV) oxide layer and a gold layer on a substrate, followed by annealing.
    Type: Grant
    Filed: June 5, 2018
    Date of Patent: September 14, 2021
    Assignee: King Fahd University of Petroleum and Minerals
    Inventors: Qasem Ahmed Drmosh, Zain Hassan Yamani, Amar Kamal Mohamedkhair, Abdulmajeed Hasan Hendi, Mohammad Kamal Hossain, Abdullatif Mohammed Albaseer
  • Patent number: 11097554
    Abstract: A thermal printhead includes a substrate, a protrusion formed on an obverse surface of the substrate and extending in a main scanning direction, a heat storage layer formed on a top surface of the protrusion, and a plurality of heat-generating parts arranged along the main scanning direction on the heat storage layer. The substrate and the protrusion are integrally formed from a single-crystal semiconductor.
    Type: Grant
    Filed: June 24, 2020
    Date of Patent: August 24, 2021
    Assignee: ROHM CO., LTD.
    Inventors: Goro Nakatani, Akira Fujita, Kazuya Nakakubo, Yasuhiro Fuwa
  • Patent number: 11081271
    Abstract: The present disclosure discloses a circuit protection device including a first magnetic layer in which a plurality of magnetic sheets are laminated and of which at least a portion of one surface is exposed, a second magnetic layer in which a plurality of magnetic sheets are laminated and of which at least a portion of one surface is exposed, and a nonmagnetic layer in which a plurality of nonmagnetic sheets are laminated and which is disposed between the first and second magnetic layers. A noise filter part including a plurality of coil patterns is disposed in the nonmagnetic layer.
    Type: Grant
    Filed: May 15, 2017
    Date of Patent: August 3, 2021
    Inventors: Gyeong Tae Kim, Myung Ho Lee, Tae Geun Seo, Heon Guk Ha, Jae Ho Han
  • Patent number: 11031169
    Abstract: The present disclosure discloses a circuit protection device including a first magnetic layer in which a plurality of magnetic sheets are laminated and of which at least a portion of one surface is exposed, a second magnetic layer in which a plurality of magnetic sheets are laminated and of which at least a portion of one surface is exposed, and a nonmagnetic layer in which a plurality of nonmagnetic sheets are laminated and which is disposed between the first and second magnetic layers. A noise filter part including a plurality of coil patterns is disposed in the nonmagnetic layer.
    Type: Grant
    Filed: May 15, 2017
    Date of Patent: June 8, 2021
    Inventors: Gyeong Tae Kim, Myung Ho Lee, Tae Geun Seo, Heon Guk Ha, Jae Ho Han
  • Patent number: 11027604
    Abstract: A hydrogen detection apparatus includes a hydrogen sensor, a sensor control circuit configured to sense a resistance value of the hydrogen sensor, and a microcomputer configured to set an off time that differs depending on an operating environment and intermittently drive the sensor control circuit. The hydrogen sensor includes a first electrode; a metal-oxide layer on the first electrode, and in which a resistance value is configured to change in response to contacting hydrogen atoms; a second electrode on the metal-oxide layer; and an insulating film that covers at least a portion of lateral surfaces of the first electrode, the metal-oxide layer, and the second electrode. A portion of at least one of: (i) a first interface between the first electrode and the metal-oxide layer; and (ii) a second interface between the second electrode and the metal-oxide layer is uncovered by the insulating film and exposed to a detection space.
    Type: Grant
    Filed: December 8, 2017
    Date of Patent: June 8, 2021
    Assignee: PANASONIC SEMICONDUCTOR SOLUTIONS CO., LTD.
    Inventors: Ken Kawai, Shinichi Yoneda
  • Patent number: 10937574
    Abstract: Methods and apparatus providing a vertically constructed, temperature sensing resistor are disclosed. An example apparatus includes a semiconductor substrate including a plurality of resistor unit cells arranged in an array, each resistor unit cell formed within the semiconductor substrate and including a top contact. A conductive layer located over the semiconductor substrate electrically connects to a subset of the top contacts.
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: March 2, 2021
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Gregory Keith Cestra, Andrew Strachan
  • Patent number: 10903542
    Abstract: A variable RF attenuator includes a substrate, a first microstrip trace, a first thin film resistor, a second microstrip trace, and a wire bond. The substrate includes a dielectric layer. The first thin film resistor is disposed on the substrate. The first microstrip trace is disposed on the substrate and the first thin film resistor. The second microstrip trace is disposed on the substrate and is uncoupled from the first microstrip trace. The wire bond extends from the second microstrip trace to a position on the first microstrip trace. The position is selected to tune RF attenuation over a conductive path defined by the first microstrip trace, the wire bond, and the second microstrip trace.
    Type: Grant
    Filed: February 25, 2020
    Date of Patent: January 26, 2021
    Assignee: THE BOEING COMPANY
    Inventors: Walid M. Al-Bondak, Kyu-Pyung Hwang, Young Kyu Song
  • Patent number: 10897794
    Abstract: An apparatus for a heating device for a vehicle comprises a layer stack which, in a stacking direction, has a heating conductor layer, an electrically conductive layer which forms a contact region, wherein a contour in a projection in the stacking direction of the electrically conductive layer is prespecified, in order to prevent a hotspot on the electrically conductive layer, by at least one of a prespecified width of a front side of the electrically conductive layer which faces a central region of the heating conductor layer, a prespecified distance from a joint of the heating conductor layer, and a prespecified curvature of the contour.
    Type: Grant
    Filed: October 28, 2016
    Date of Patent: January 19, 2021
    Assignee: WEBASTO SE
    Inventors: Achim Holzwarth, Stephan Buckl, Tino Klinkmüller, Andreas Schmidmayer, Andreas Reuter, Thorsten Kabelitz, Karl Göttl, Daniel Eckert
  • Patent number: 10873143
    Abstract: An electrical connection element for the electrical contacting of an electrically conductive structure on a substrate is described. The electrical connection element has at least two solid subelements made from different materials, the first subelement being adapted for soldering to the electrically conductive structure, and the second subelement being adapted for connection to an electrical connection cable. The first subelement and the second subelement are connected to one another by way of at least one rivet.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: December 22, 2020
    Assignees: SAINT-GOBAIN GLASS FRANCE, FEW FAHRZEUGELEKTRIK WERK GMBH & CO. KG
    Inventors: Klaus Schmalbuch, Mitja Rateiczak, Bernhard Reul, Bjoern Schneider
  • Patent number: 10837935
    Abstract: We disclose herein a sensing device comprising a substrate, a dielectric layer located on the substrate, a heater located within the dielectric layer; a material for sensing a gas. The material comprises an alumina (Al2O3) doped conductive metal oxide.
    Type: Grant
    Filed: March 12, 2018
    Date of Patent: November 17, 2020
    Assignee: SCIOSENSE B.V.
    Inventors: Sanjeeb Tripathy, Wolfram Simmendinger
  • Patent number: 10840611
    Abstract: An electrical terminal includes a planar base portion having a base portion outer surface, a base portion inner surface, and two securing tabs extending from an edge of the base portion. The electrical terminal also includes a planar attachment portion having an attachment portion outer surface, an attachment portion inner surface, and an attachment member extending from the attachment portion outer surface. The attachment member is configured to secure a wire cable to the electrical terminal. The base portion inner surface is arranged such that it is in contact with the attachment portion inner surface and the two securing tabs are bent over the attachment portion outer surface. The electrical terminal may be especially well suited for making an electrical connection to components disposed on a glass surface. A method for forming such a terminal is also presented.
    Type: Grant
    Filed: February 6, 2020
    Date of Patent: November 17, 2020
    Inventors: David B. Martins, Marco M. Lucci, Tyler Folger
  • Patent number: 10811194
    Abstract: A composite electronic component includes a capacitor and a resistor stacked in a height direction. The capacitor includes a capacitor body, and first and second external electrodes. The resistor includes a base portion, a resistor, first and second upper surface conductors, first and second lower surface conductors, first connecting conductors, and second connecting conductors. An upper surface of the base portion of the resistor faces a lower surface of the capacitor body of the capacitor, and the first upper surface conductor and the first external electrode are electrically connected, and the second upper surface conductor and the second external electrode are electrically connected.
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: October 20, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kazuo Hattori, Isamu Fujimoto, Shinichiro Kuroiwa
  • Patent number: 10601148
    Abstract: An adhesive connector for making an electrical connection to a conductor formed on a support surface is provided. The adhesive connector includes a substrate and a metal strip attached to a first surface of the substrate, wherein the metal strip is configured to engage a releasable electrical connector. The adhesive connector also includes a conductive strip attached to a second surface of the substrate and a conductive staple configured to secure the conductive strip, the substrate, and the metal strip together. The adhesive connector further includes an electrically-conducting adhesive that coats a first portion of the conductive strip, and is configured to provide electrical contact to a conductor formed on a support surface.
    Type: Grant
    Filed: October 23, 2018
    Date of Patent: March 24, 2020
    Assignee: Illinois Tool Works Inc.
    Inventors: Edward F. Bulgajewski, Piotr Sliwa, John F. Healey
  • Patent number: 10504653
    Abstract: A multilayer ceramic electronic component includes a ceramic body including first and second internal electrodes alternately stacked with dielectric layers interposed therebetween, and first and second external electrodes disposed on outer surfaces of the ceramic body. The first and second external electrodes include, respectively, first and second base electrode layers and first and second plating layers. The first and second plating or base electrodes layers have at least one hole positioned in at least one corner of the ceramic body, and the hole includes a point of a respective edge of the ceramic body at which the respective edge meets a virtual line extending in a thickness direction and drawn through an end in a width direction of an exposed edge of one of the first and second internal electrodes exposed in a surface in which first or second internal electrodes contact first or second external electrodes.
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: December 10, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Gwang Hyeon Park, Jang Yeol Lee, Yong Park, Hye Young Choi, Jong Ho Lee, Ji Hong Jo
  • Patent number: 10442726
    Abstract: A glass composition including 65 to 72 wt-% SiO2, at least 10.1 wt-% Li2O, at least 10.1 wt-% Al2O3, 0 to 2 wt-% K2O, at most 4 wt-% Na2O, 0 to 1.5 wt-% CaO, 0 to 1.5 wt-% CeO2, 1 to 5 wt-% P2O5, 0 to 0.5 wt-% V2O5, 0 to 1 wt-% Ag, and 0 to 1 wt-% ZrO2, based on a total weight of the composition. The composition is devoid of TiO2, Cu2O, BaO, Sb2O3, Nb2O5, MgO, La2O3, and SnO2. The proportion of Li2O to Al2O3 in the composition is in a range of from 1:1 to 1.5:1.
    Type: Grant
    Filed: June 2, 2017
    Date of Patent: October 15, 2019
    Assignee: STRAUMANN HOLDING AG
    Inventors: Maria Borczuch-Laczka, Katharzyna Cholewa-Kowalska, Karolina Laczka
  • Patent number: 10366834
    Abstract: A ceramic electronic component includes a body including a dielectric layer and first and second internal electrodes, a first external electrode including a first electrode layer electrically connected to the first internal electrode, a first inorganic insulating layer disposed on the first electrode layer, and a first plating layer disposed on the first inorganic insulating layer, a second external electrode including a second electrode layer electrically connected to the second internal electrode, a second inorganic insulating layer disposed on the second electrode layer, and a second plating layer disposed on the second inorganic insulating layer, and a third inorganic insulating layer disposed on the body and connected to the first and second inorganic insulating layers. The first, second and third inorganic insulating layers comprise one or more of SiO2, Al2O3 and ZrO2, and the first, second and third inorganic insulating layers have a thickness within a range from 20 nm to 150 nm.
    Type: Grant
    Filed: November 12, 2018
    Date of Patent: July 30, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jang Yeol Lee, Eui Hyun Jo, Myung Jun Park, Jong Ho Lee
  • Patent number: 10299383
    Abstract: A composite electronic component includes an electronic element and a resistance element in a height direction. The electronic element includes an electronic element body, and a first and second external electrodes separated from each other in a length direction. The resistance element includes a base portion, a resistor disposed on the upper surface of the base portion, a protective film, and first to third upper surface conductors. The first and second upper surface conductors are separated from each other in the length direction, and the resistor and the third upper surface conductor connected thereto are located between the first and the second upper surface conductors.
    Type: Grant
    Filed: July 8, 2016
    Date of Patent: May 21, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kazuo Hattori, Isamu Fujimoto, Shinichiro Kuroiwa
  • Patent number: 10276285
    Abstract: Provided is a chip resistor including: a rectangular parallelepiped insulating substrate which is made of ceramics; a pair of front electrodes which are provided on lengthwise opposite end portions in a front surface of the insulating substrate; a resistive element which is provided between and connected to the two front electrodes; a protective layer which is made of a resin and which entirely covers the front surface of the insulating substrate including the two front electrodes and the resistive element; and a pair of cap-shaped end-surface electrodes which are provided on the lengthwise opposite end portions of the insulating substrate to establish electrical continuity to the front electrodes respectively; wherein: a chip element assembly in which the insulating substrate and the protective layer are laminated on each other but the end-surface electrodes have not been formed yet has an external shape substantially like a square cylinder.
    Type: Grant
    Filed: September 26, 2016
    Date of Patent: April 30, 2019
    Assignee: KOA Corporation
    Inventor: Kentaro Matsumoto
  • Patent number: 10192684
    Abstract: A multilayer capacitor includes a capacitor body including dielectric layers and a plurality of first and second internal electrodes exposed through the third and fourth surfaces, and having first to sixth surfaces; first and second external electrodes including first and second connection portions disposed on the third and fourth surfaces, and first and second band portions extending from the first and second connection portions to portions of the first and second surfaces and the fifth and sixth surfaces; first and second conductive resin layers covering portions of the first and second band portions; an insulating layer disposed on the first surface; and first and second terminal electrodes spaced apart from each other, covering portions of the insulating layer, and connected to the first and second external electrodes.
    Type: Grant
    Filed: July 7, 2017
    Date of Patent: January 29, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Heung Kil Park, Jong Hwan Park, Se Hun Park
  • Patent number: 10192658
    Abstract: In order to provide a chip resistor which has wide and flat terminal electrodes in its front surface and which has high connection reliability between front electrodes and the terminal electrodes, a chip resistor according to the present invention includes: an insulating substrate 1 shaped like a cuboid; a pair of front electrodes 2 provided on lengthwise opposite edge portions of a front surface of the insulating substrate 1; a resistor body 3 provided between the front electrodes 2; an insulating protection layer 4 covering entire surfaces of the front electrodes 2 and the resistor body 3; and a pair of terminal electrodes 5 provided on lengthwise opposite end surfaces of the insulating substrate 1.
    Type: Grant
    Filed: March 8, 2016
    Date of Patent: January 29, 2019
    Assignee: KOA CORPORATION
    Inventors: Kentaro Matsumoto, Kotaro Kashiwagi
  • Patent number: 10181369
    Abstract: An NTC thermistor to be embedded in a substrate includes a thermistor body that is a ceramic sintered body and includes two opposed main surfaces, two opposed side surfaces, and two opposed end surfaces, a plurality of internal electrodes provided inside the thermistor body, and two external electrodes provided on outer surfaces of the thermistor body, and electrically connected to the plurality of internal electrodes. Each of the external electrodes includes a first electrode layer covering one of the end surfaces of the thermistor body, a second electrode layer provided on each of the main surfaces of the thermistor body, the second electrode layer including at least one layer, one end of the second electrode layer being in contact with the first electrode layer, and another end thereof extending in a direction of another end surface, and a third electrode layer including at least one layer and covering the first electrode and the second electrode layers.
    Type: Grant
    Filed: August 17, 2017
    Date of Patent: January 15, 2019
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Kei Toda
  • Patent number: 10115504
    Abstract: Provided is a thin-film resistor that has a higher resistance value than the conventional thin-film resistors while retaining excellent TCR characteristics. The thin-film resistor includes a substrate, a pair of electrodes formed on the substrate, and a resistive film connected to the pair of electrodes. The resistive film includes a first resistive film and a second resistive film, the second resistive film having a different TCR from that of the first resistive film, and each of the first resistive film and the second resistive film contains Si, Cr, and N as the main components.
    Type: Grant
    Filed: July 1, 2016
    Date of Patent: October 30, 2018
    Assignee: KOA CORPORATION
    Inventor: Yasushi Hiroshima
  • Patent number: 10109398
    Abstract: The invention is to provide a chip resistor suitable for lowering an initial resistance value. A chip resistor 1 according to the present invention is provided with: an insulating substrate 2; a pair of front electrodes 3 which are provided on a front surface of the insulating substrate 2 so as to face each other with a predetermined interval therebetween; a resistive element 4 which is provided so as to bridge the front electrodes 3; a pair of auxiliary electrodes 5 which are provided so as to cover the front electrodes 3 and overlap end portions of the resistive element 4; and the like. The chip resistor 1 is configured such that: the front electrodes 3 are formed of a material which contains 1 to 5 wt % Pd and the balance Ag; and the auxiliary electrodes 5 are formed of a material which contains 15 to 30 wt % Pd and a metal material (e.g. Au) lower in resistivity than Pd and the balance Ag.
    Type: Grant
    Filed: July 22, 2015
    Date of Patent: October 23, 2018
    Assignee: KOA Corporation
    Inventor: Kentaro Matsumoto
  • Patent number: 9928947
    Abstract: A low-ohmic chip resistor with high conductivity is fabricated. The chip resistor has an electrode of a base metal or base-metal alloy. The base-metal or base-metal-alloy electrode and a resistor layer are fabricated through thick-film printing with sintering at a low temperature in the air. Therein, a thick-film paste made of a cheap low-reduction-potential metal (such as aluminum (Al) or nickel (Ni)) is formed through screen-printing and sintering. Then, the layer of the cheap low-reduction-potential metal is used as a sacrificial layer to be immersed in a metal solution having a high reduction potential. Therein, a wet chemical alternation reaction is processed for obtaining a metal electrode having the high reduction potential. Or, the sacrificial layer may be immersed in a mixed solution of several different metal having high reduction potential to process wet chemical alternation reaction for obtaining an alloy of metal mixed with different composition.
    Type: Grant
    Filed: July 19, 2017
    Date of Patent: March 27, 2018
    Assignee: NATIONAL CHENG KUNG UNIVERSITY
    Inventor: Wen-Hsi Lee
  • Patent number: 9918162
    Abstract: The present technique relates to an earhole-wearable sound collection device, a signal processing device, and a method for realizing sound collection at a high S/N ratio. In the earhole-wearable sound collection device, a microphone that collects emitted speech voice is provided in a space that is substantially sealed off from outside and connects to an ear canal of the wearer (the speaker). With the microphone being located in the space sealed off from outside, emitted speech voice that propagates through the ear canal of the wearer is collected. In a sound collection signal obtained through the ear canal, the emitted speech voice component is dominant over the noise component particularly at low frequencies. Therefore, the S/N ratio of an emitted speech voice collection signal is improved by an equalizing process for reducing muffled sound that is generated when sound is collected through the ear canal on the sound collection signal.
    Type: Grant
    Filed: January 11, 2016
    Date of Patent: March 13, 2018
    Assignee: SONY CORPORATION
    Inventors: Kohei Asada, Shinpei Tsuchiya, Daizen Kobayashi, Koji Nageno
  • Patent number: 9851237
    Abstract: Proposed is a contact material constituting a slider for a fuel sender, the slider moving on a conductor in conjunction with a float moving in accordance with a liquid level, wherein the contact material includes 10 to 25 mass % of nickel and a balance of palladium. The present contact material is useful in the light of material cost in addition to corrosion resistance and durability. The fuel sender is useful for vehicles, such as FFV, using composite fuel of alcohol and the like. The present invention allows for producing a slider for a fuel sender having excellent corrosion resistance and abrasion resistance.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: December 26, 2017
    Assignee: TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Takaomi Kishimoto, Yoshinori Horiuchi, Osamu Sakaguchi, Kouzou Kashiwagi
  • Patent number: 9835574
    Abstract: A gas measurement device measures gas using a gas sensor including a sense resistance exposed to the gas and a reference resistance not exposed to the gas. The gas measurement device applies a first current value and a second current value to the sensor. A detector functions to detect a first resistance variation and a second resistance variation of the sense resistance exposed to the gas with respect to the reference resistance as a function of the first current value and the second current value, respectively. The resistance variation dependent on relative humidity is then determined as a function of the first and second resistance variations and a first constant. The resistance variation dependent on gas content is then determined as a function of the first and second resistance variations and a second (different) constant.
    Type: Grant
    Filed: June 1, 2015
    Date of Patent: December 5, 2017
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Pasquale Biancolillo, Angelo Recchia, Pasquale Franco, Antonio Cicero, Giuseppe Bruno
  • Patent number: 9773779
    Abstract: A semiconductor device structure including a resistor layer is provided. The semiconductor device structure includes a gate structure formed over the first region of the substrate and an inter-layer dielectric (ILD) layer formed adjacent to the gate structure. The semiconductor device structure further includes a resistor layer is formed over the ILD layer over the second region of the substrate, and the major structure of the resistor layer is amorphous.
    Type: Grant
    Filed: September 17, 2015
    Date of Patent: September 26, 2017
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: I-Tseng Chen, Hon-Lin Huang, Chun-Hsien Huang, Yu-Hung Lin
  • Patent number: 9704621
    Abstract: A chip resistor includes a base member, a resistive element formed on the base member, a first inner electrode held in contact with a first end portion or the resistive element, a second inner electrode held in contact with a second end portion of the resistive element, a first reverse surface electrode reaching a first end portion of the base member, and a second reverse surface electrode reaching a second end portion of the base member. The length of the first and the second reverse surface electrodes is in a range of 2/10 to 3/10 of the length of the base member. Also, the length of the first and the second reverse surface electrodes is greater than the length of the first and the second inner electrodes.
    Type: Grant
    Filed: August 29, 2014
    Date of Patent: July 11, 2017
    Assignee: ROHM CO., LTD.
    Inventors: Shinsuke Ogawa, Makoto Toyonaga
  • Patent number: 9700379
    Abstract: An apparatus for determining a status of a medical device component is disclosed. The apparatus includes at least one fusible component to indicate whether the medical device component has been used, and at least one reference component having at least one reference property that is representative of the presence, identity or type of the medical device component. The reference component is non-fusible under ordinary operating conditions.
    Type: Grant
    Filed: April 30, 2013
    Date of Patent: July 11, 2017
    Assignee: EMBLATION LIMITED
    Inventors: Eamon McErlean, Gary Beale
  • Patent number: 9552908
    Abstract: A chip resistor having terminal electrodes is provided. In the chip resistor, a first protector layer has a size different from that of a first resistor layer. Thus, two ends of the first resistor layer are exposed to form new current conduction path. Original current conduction path having the same size of the protective layer and the resistor layer is thus replaced. Hence, resistance variation of the chip resistor is solved; yield of the chip resistor is increased; and, the material cost of the front terminal electrode is greatly reduced.
    Type: Grant
    Filed: June 16, 2015
    Date of Patent: January 24, 2017
    Assignee: NATIONAL CHENG KUNG UNIVERSITY
    Inventor: Wen-Hsi Lee
  • Patent number: 9431148
    Abstract: Thick film resistor paste compositions, and methods for making the thick film compositions are disclosed. The compositions include a resistor composition dispersed in an organic vehicle. The resistor composition has 3 to 60% by weight RuO2 conductive material, 5 to 75% by weight Ag conductive material, 15 to 60% by weight glass frit and optionally up to 10% by weight copper oxide or precursor thereof, and up to 20% by weight bismuth oxide or precursor thereof. Optionally the glass is (by weight) 25-45% SiO2, 2-15% Al2O3, 0-3% ZrO2, 0-8% B2O3, 5-15% CuO, 0-8% BaO, 0-3% P2O5, and 20-50% Bi2O3. The resistor composition when printed to a dry thickness and fired at a temperature between 750° C. and 950° C. achieves a sheet resistivity between 10 and 10,000 milliohms/square and a hot temperature coefficient of resistivity of 1000 ppm/C or higher. The fired resistor composition may achieve a resistance thickness ratio (Rtr) value between 0.75 and 1.50.
    Type: Grant
    Filed: December 30, 2013
    Date of Patent: August 30, 2016
    Assignee: EI DU PONT DE NEMOURS AND COMPANY
    Inventors: Marc H Labranche, Kenneth Warren Hang
  • Patent number: 9324448
    Abstract: In one embodiment, a programming circuit is configured to form a programming current for a silicide fuse element by using a non-silicide programming element.
    Type: Grant
    Filed: March 25, 2014
    Date of Patent: April 26, 2016
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventor: Jefferson W. Hall
  • Patent number: 9281355
    Abstract: An electronic device comprising a semiconductor structure having a back end capacitor and a back end thin film resistor and a method of manufacturing the same. The semiconductor structure includes a first dielectric layer, a bottom plate of the capacitor and a thin film resistor body. The bottom plate and the resistor body are laterally spaced apart portions of the same thin film layer. The bottom plate further includes a conductive layer overlying the thin film layer. A second dielectric layer is disposed on the conductive layer of the bottom plate of the capacitor. A top plate of the capacitor is disposed on the second dielectric layer.
    Type: Grant
    Filed: September 30, 2014
    Date of Patent: March 8, 2016
    Assignee: TEXAS INSTRUMENTS DEUTSCHLAND GMBH
    Inventor: Christoph Dirnecker
  • Patent number: 9252793
    Abstract: A semiconductor device is formed by sealing, with a resin, a semiconductor chip (CP1) having an oscillation circuit utilizing a reference resistor. The oscillation circuit generates a reference current by utilizing the reference resistor, a voltage is generated in accordance with this reference current and an oscillation frequency of the oscillation unit, and the oscillation unit oscillates at a frequency in accordance with the generated voltage.
    Type: Grant
    Filed: November 29, 2010
    Date of Patent: February 2, 2016
    Assignee: Renesas Electronics Corporation
    Inventors: Toshiaki Tsutsumi, Yoshihiro Funato, Tomonori Okudaira, Tadato Yamagata, Akihisa Uchida, Takeshi Terasaki, Tomohisa Suzuki, Yoshiharu Kanegae