Resistance Element Coated On Base Patents (Class 338/308)
  • Patent number: 11031169
    Abstract: The present disclosure discloses a circuit protection device including a first magnetic layer in which a plurality of magnetic sheets are laminated and of which at least a portion of one surface is exposed, a second magnetic layer in which a plurality of magnetic sheets are laminated and of which at least a portion of one surface is exposed, and a nonmagnetic layer in which a plurality of nonmagnetic sheets are laminated and which is disposed between the first and second magnetic layers. A noise filter part including a plurality of coil patterns is disposed in the nonmagnetic layer.
    Type: Grant
    Filed: May 15, 2017
    Date of Patent: June 8, 2021
    Inventors: Gyeong Tae Kim, Myung Ho Lee, Tae Geun Seo, Heon Guk Ha, Jae Ho Han
  • Patent number: 11027604
    Abstract: A hydrogen detection apparatus includes a hydrogen sensor, a sensor control circuit configured to sense a resistance value of the hydrogen sensor, and a microcomputer configured to set an off time that differs depending on an operating environment and intermittently drive the sensor control circuit. The hydrogen sensor includes a first electrode; a metal-oxide layer on the first electrode, and in which a resistance value is configured to change in response to contacting hydrogen atoms; a second electrode on the metal-oxide layer; and an insulating film that covers at least a portion of lateral surfaces of the first electrode, the metal-oxide layer, and the second electrode. A portion of at least one of: (i) a first interface between the first electrode and the metal-oxide layer; and (ii) a second interface between the second electrode and the metal-oxide layer is uncovered by the insulating film and exposed to a detection space.
    Type: Grant
    Filed: December 8, 2017
    Date of Patent: June 8, 2021
    Assignee: PANASONIC SEMICONDUCTOR SOLUTIONS CO., LTD.
    Inventors: Ken Kawai, Shinichi Yoneda
  • Patent number: 10937574
    Abstract: Methods and apparatus providing a vertically constructed, temperature sensing resistor are disclosed. An example apparatus includes a semiconductor substrate including a plurality of resistor unit cells arranged in an array, each resistor unit cell formed within the semiconductor substrate and including a top contact. A conductive layer located over the semiconductor substrate electrically connects to a subset of the top contacts.
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: March 2, 2021
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Gregory Keith Cestra, Andrew Strachan
  • Patent number: 10903542
    Abstract: A variable RF attenuator includes a substrate, a first microstrip trace, a first thin film resistor, a second microstrip trace, and a wire bond. The substrate includes a dielectric layer. The first thin film resistor is disposed on the substrate. The first microstrip trace is disposed on the substrate and the first thin film resistor. The second microstrip trace is disposed on the substrate and is uncoupled from the first microstrip trace. The wire bond extends from the second microstrip trace to a position on the first microstrip trace. The position is selected to tune RF attenuation over a conductive path defined by the first microstrip trace, the wire bond, and the second microstrip trace.
    Type: Grant
    Filed: February 25, 2020
    Date of Patent: January 26, 2021
    Assignee: THE BOEING COMPANY
    Inventors: Walid M. Al-Bondak, Kyu-Pyung Hwang, Young Kyu Song
  • Patent number: 10897794
    Abstract: An apparatus for a heating device for a vehicle comprises a layer stack which, in a stacking direction, has a heating conductor layer, an electrically conductive layer which forms a contact region, wherein a contour in a projection in the stacking direction of the electrically conductive layer is prespecified, in order to prevent a hotspot on the electrically conductive layer, by at least one of a prespecified width of a front side of the electrically conductive layer which faces a central region of the heating conductor layer, a prespecified distance from a joint of the heating conductor layer, and a prespecified curvature of the contour.
    Type: Grant
    Filed: October 28, 2016
    Date of Patent: January 19, 2021
    Assignee: WEBASTO SE
    Inventors: Achim Holzwarth, Stephan Buckl, Tino Klinkmüller, Andreas Schmidmayer, Andreas Reuter, Thorsten Kabelitz, Karl Göttl, Daniel Eckert
  • Patent number: 10873143
    Abstract: An electrical connection element for the electrical contacting of an electrically conductive structure on a substrate is described. The electrical connection element has at least two solid subelements made from different materials, the first subelement being adapted for soldering to the electrically conductive structure, and the second subelement being adapted for connection to an electrical connection cable. The first subelement and the second subelement are connected to one another by way of at least one rivet.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: December 22, 2020
    Assignees: SAINT-GOBAIN GLASS FRANCE, FEW FAHRZEUGELEKTRIK WERK GMBH & CO. KG
    Inventors: Klaus Schmalbuch, Mitja Rateiczak, Bernhard Reul, Bjoern Schneider
  • Patent number: 10837935
    Abstract: We disclose herein a sensing device comprising a substrate, a dielectric layer located on the substrate, a heater located within the dielectric layer; a material for sensing a gas. The material comprises an alumina (Al2O3) doped conductive metal oxide.
    Type: Grant
    Filed: March 12, 2018
    Date of Patent: November 17, 2020
    Assignee: SCIOSENSE B.V.
    Inventors: Sanjeeb Tripathy, Wolfram Simmendinger
  • Patent number: 10840611
    Abstract: An electrical terminal includes a planar base portion having a base portion outer surface, a base portion inner surface, and two securing tabs extending from an edge of the base portion. The electrical terminal also includes a planar attachment portion having an attachment portion outer surface, an attachment portion inner surface, and an attachment member extending from the attachment portion outer surface. The attachment member is configured to secure a wire cable to the electrical terminal. The base portion inner surface is arranged such that it is in contact with the attachment portion inner surface and the two securing tabs are bent over the attachment portion outer surface. The electrical terminal may be especially well suited for making an electrical connection to components disposed on a glass surface. A method for forming such a terminal is also presented.
    Type: Grant
    Filed: February 6, 2020
    Date of Patent: November 17, 2020
    Inventors: David B. Martins, Marco M. Lucci, Tyler Folger
  • Patent number: 10811194
    Abstract: A composite electronic component includes a capacitor and a resistor stacked in a height direction. The capacitor includes a capacitor body, and first and second external electrodes. The resistor includes a base portion, a resistor, first and second upper surface conductors, first and second lower surface conductors, first connecting conductors, and second connecting conductors. An upper surface of the base portion of the resistor faces a lower surface of the capacitor body of the capacitor, and the first upper surface conductor and the first external electrode are electrically connected, and the second upper surface conductor and the second external electrode are electrically connected.
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: October 20, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kazuo Hattori, Isamu Fujimoto, Shinichiro Kuroiwa
  • Patent number: 10601148
    Abstract: An adhesive connector for making an electrical connection to a conductor formed on a support surface is provided. The adhesive connector includes a substrate and a metal strip attached to a first surface of the substrate, wherein the metal strip is configured to engage a releasable electrical connector. The adhesive connector also includes a conductive strip attached to a second surface of the substrate and a conductive staple configured to secure the conductive strip, the substrate, and the metal strip together. The adhesive connector further includes an electrically-conducting adhesive that coats a first portion of the conductive strip, and is configured to provide electrical contact to a conductor formed on a support surface.
    Type: Grant
    Filed: October 23, 2018
    Date of Patent: March 24, 2020
    Assignee: Illinois Tool Works Inc.
    Inventors: Edward F. Bulgajewski, Piotr Sliwa, John F. Healey
  • Patent number: 10504653
    Abstract: A multilayer ceramic electronic component includes a ceramic body including first and second internal electrodes alternately stacked with dielectric layers interposed therebetween, and first and second external electrodes disposed on outer surfaces of the ceramic body. The first and second external electrodes include, respectively, first and second base electrode layers and first and second plating layers. The first and second plating or base electrodes layers have at least one hole positioned in at least one corner of the ceramic body, and the hole includes a point of a respective edge of the ceramic body at which the respective edge meets a virtual line extending in a thickness direction and drawn through an end in a width direction of an exposed edge of one of the first and second internal electrodes exposed in a surface in which first or second internal electrodes contact first or second external electrodes.
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: December 10, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Gwang Hyeon Park, Jang Yeol Lee, Yong Park, Hye Young Choi, Jong Ho Lee, Ji Hong Jo
  • Patent number: 10442726
    Abstract: A glass composition including 65 to 72 wt-% SiO2, at least 10.1 wt-% Li2O, at least 10.1 wt-% Al2O3, 0 to 2 wt-% K2O, at most 4 wt-% Na2O, 0 to 1.5 wt-% CaO, 0 to 1.5 wt-% CeO2, 1 to 5 wt-% P2O5, 0 to 0.5 wt-% V2O5, 0 to 1 wt-% Ag, and 0 to 1 wt-% ZrO2, based on a total weight of the composition. The composition is devoid of TiO2, Cu2O, BaO, Sb2O3, Nb2O5, MgO, La2O3, and SnO2. The proportion of Li2O to Al2O3 in the composition is in a range of from 1:1 to 1.5:1.
    Type: Grant
    Filed: June 2, 2017
    Date of Patent: October 15, 2019
    Assignee: STRAUMANN HOLDING AG
    Inventors: Maria Borczuch-Laczka, Katharzyna Cholewa-Kowalska, Karolina Laczka
  • Patent number: 10366834
    Abstract: A ceramic electronic component includes a body including a dielectric layer and first and second internal electrodes, a first external electrode including a first electrode layer electrically connected to the first internal electrode, a first inorganic insulating layer disposed on the first electrode layer, and a first plating layer disposed on the first inorganic insulating layer, a second external electrode including a second electrode layer electrically connected to the second internal electrode, a second inorganic insulating layer disposed on the second electrode layer, and a second plating layer disposed on the second inorganic insulating layer, and a third inorganic insulating layer disposed on the body and connected to the first and second inorganic insulating layers. The first, second and third inorganic insulating layers comprise one or more of SiO2, Al2O3 and ZrO2, and the first, second and third inorganic insulating layers have a thickness within a range from 20 nm to 150 nm.
    Type: Grant
    Filed: November 12, 2018
    Date of Patent: July 30, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jang Yeol Lee, Eui Hyun Jo, Myung Jun Park, Jong Ho Lee
  • Patent number: 10299383
    Abstract: A composite electronic component includes an electronic element and a resistance element in a height direction. The electronic element includes an electronic element body, and a first and second external electrodes separated from each other in a length direction. The resistance element includes a base portion, a resistor disposed on the upper surface of the base portion, a protective film, and first to third upper surface conductors. The first and second upper surface conductors are separated from each other in the length direction, and the resistor and the third upper surface conductor connected thereto are located between the first and the second upper surface conductors.
    Type: Grant
    Filed: July 8, 2016
    Date of Patent: May 21, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kazuo Hattori, Isamu Fujimoto, Shinichiro Kuroiwa
  • Patent number: 10276285
    Abstract: Provided is a chip resistor including: a rectangular parallelepiped insulating substrate which is made of ceramics; a pair of front electrodes which are provided on lengthwise opposite end portions in a front surface of the insulating substrate; a resistive element which is provided between and connected to the two front electrodes; a protective layer which is made of a resin and which entirely covers the front surface of the insulating substrate including the two front electrodes and the resistive element; and a pair of cap-shaped end-surface electrodes which are provided on the lengthwise opposite end portions of the insulating substrate to establish electrical continuity to the front electrodes respectively; wherein: a chip element assembly in which the insulating substrate and the protective layer are laminated on each other but the end-surface electrodes have not been formed yet has an external shape substantially like a square cylinder.
    Type: Grant
    Filed: September 26, 2016
    Date of Patent: April 30, 2019
    Assignee: KOA Corporation
    Inventor: Kentaro Matsumoto
  • Patent number: 10192658
    Abstract: In order to provide a chip resistor which has wide and flat terminal electrodes in its front surface and which has high connection reliability between front electrodes and the terminal electrodes, a chip resistor according to the present invention includes: an insulating substrate 1 shaped like a cuboid; a pair of front electrodes 2 provided on lengthwise opposite edge portions of a front surface of the insulating substrate 1; a resistor body 3 provided between the front electrodes 2; an insulating protection layer 4 covering entire surfaces of the front electrodes 2 and the resistor body 3; and a pair of terminal electrodes 5 provided on lengthwise opposite end surfaces of the insulating substrate 1.
    Type: Grant
    Filed: March 8, 2016
    Date of Patent: January 29, 2019
    Assignee: KOA CORPORATION
    Inventors: Kentaro Matsumoto, Kotaro Kashiwagi
  • Patent number: 10192684
    Abstract: A multilayer capacitor includes a capacitor body including dielectric layers and a plurality of first and second internal electrodes exposed through the third and fourth surfaces, and having first to sixth surfaces; first and second external electrodes including first and second connection portions disposed on the third and fourth surfaces, and first and second band portions extending from the first and second connection portions to portions of the first and second surfaces and the fifth and sixth surfaces; first and second conductive resin layers covering portions of the first and second band portions; an insulating layer disposed on the first surface; and first and second terminal electrodes spaced apart from each other, covering portions of the insulating layer, and connected to the first and second external electrodes.
    Type: Grant
    Filed: July 7, 2017
    Date of Patent: January 29, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Heung Kil Park, Jong Hwan Park, Se Hun Park
  • Patent number: 10181369
    Abstract: An NTC thermistor to be embedded in a substrate includes a thermistor body that is a ceramic sintered body and includes two opposed main surfaces, two opposed side surfaces, and two opposed end surfaces, a plurality of internal electrodes provided inside the thermistor body, and two external electrodes provided on outer surfaces of the thermistor body, and electrically connected to the plurality of internal electrodes. Each of the external electrodes includes a first electrode layer covering one of the end surfaces of the thermistor body, a second electrode layer provided on each of the main surfaces of the thermistor body, the second electrode layer including at least one layer, one end of the second electrode layer being in contact with the first electrode layer, and another end thereof extending in a direction of another end surface, and a third electrode layer including at least one layer and covering the first electrode and the second electrode layers.
    Type: Grant
    Filed: August 17, 2017
    Date of Patent: January 15, 2019
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Kei Toda
  • Patent number: 10115504
    Abstract: Provided is a thin-film resistor that has a higher resistance value than the conventional thin-film resistors while retaining excellent TCR characteristics. The thin-film resistor includes a substrate, a pair of electrodes formed on the substrate, and a resistive film connected to the pair of electrodes. The resistive film includes a first resistive film and a second resistive film, the second resistive film having a different TCR from that of the first resistive film, and each of the first resistive film and the second resistive film contains Si, Cr, and N as the main components.
    Type: Grant
    Filed: July 1, 2016
    Date of Patent: October 30, 2018
    Assignee: KOA CORPORATION
    Inventor: Yasushi Hiroshima
  • Patent number: 10109398
    Abstract: The invention is to provide a chip resistor suitable for lowering an initial resistance value. A chip resistor 1 according to the present invention is provided with: an insulating substrate 2; a pair of front electrodes 3 which are provided on a front surface of the insulating substrate 2 so as to face each other with a predetermined interval therebetween; a resistive element 4 which is provided so as to bridge the front electrodes 3; a pair of auxiliary electrodes 5 which are provided so as to cover the front electrodes 3 and overlap end portions of the resistive element 4; and the like. The chip resistor 1 is configured such that: the front electrodes 3 are formed of a material which contains 1 to 5 wt % Pd and the balance Ag; and the auxiliary electrodes 5 are formed of a material which contains 15 to 30 wt % Pd and a metal material (e.g. Au) lower in resistivity than Pd and the balance Ag.
    Type: Grant
    Filed: July 22, 2015
    Date of Patent: October 23, 2018
    Assignee: KOA Corporation
    Inventor: Kentaro Matsumoto
  • Patent number: 9928947
    Abstract: A low-ohmic chip resistor with high conductivity is fabricated. The chip resistor has an electrode of a base metal or base-metal alloy. The base-metal or base-metal-alloy electrode and a resistor layer are fabricated through thick-film printing with sintering at a low temperature in the air. Therein, a thick-film paste made of a cheap low-reduction-potential metal (such as aluminum (Al) or nickel (Ni)) is formed through screen-printing and sintering. Then, the layer of the cheap low-reduction-potential metal is used as a sacrificial layer to be immersed in a metal solution having a high reduction potential. Therein, a wet chemical alternation reaction is processed for obtaining a metal electrode having the high reduction potential. Or, the sacrificial layer may be immersed in a mixed solution of several different metal having high reduction potential to process wet chemical alternation reaction for obtaining an alloy of metal mixed with different composition.
    Type: Grant
    Filed: July 19, 2017
    Date of Patent: March 27, 2018
    Assignee: NATIONAL CHENG KUNG UNIVERSITY
    Inventor: Wen-Hsi Lee
  • Patent number: 9918162
    Abstract: The present technique relates to an earhole-wearable sound collection device, a signal processing device, and a method for realizing sound collection at a high S/N ratio. In the earhole-wearable sound collection device, a microphone that collects emitted speech voice is provided in a space that is substantially sealed off from outside and connects to an ear canal of the wearer (the speaker). With the microphone being located in the space sealed off from outside, emitted speech voice that propagates through the ear canal of the wearer is collected. In a sound collection signal obtained through the ear canal, the emitted speech voice component is dominant over the noise component particularly at low frequencies. Therefore, the S/N ratio of an emitted speech voice collection signal is improved by an equalizing process for reducing muffled sound that is generated when sound is collected through the ear canal on the sound collection signal.
    Type: Grant
    Filed: January 11, 2016
    Date of Patent: March 13, 2018
    Assignee: SONY CORPORATION
    Inventors: Kohei Asada, Shinpei Tsuchiya, Daizen Kobayashi, Koji Nageno
  • Patent number: 9851237
    Abstract: Proposed is a contact material constituting a slider for a fuel sender, the slider moving on a conductor in conjunction with a float moving in accordance with a liquid level, wherein the contact material includes 10 to 25 mass % of nickel and a balance of palladium. The present contact material is useful in the light of material cost in addition to corrosion resistance and durability. The fuel sender is useful for vehicles, such as FFV, using composite fuel of alcohol and the like. The present invention allows for producing a slider for a fuel sender having excellent corrosion resistance and abrasion resistance.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: December 26, 2017
    Assignee: TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Takaomi Kishimoto, Yoshinori Horiuchi, Osamu Sakaguchi, Kouzou Kashiwagi
  • Patent number: 9835574
    Abstract: A gas measurement device measures gas using a gas sensor including a sense resistance exposed to the gas and a reference resistance not exposed to the gas. The gas measurement device applies a first current value and a second current value to the sensor. A detector functions to detect a first resistance variation and a second resistance variation of the sense resistance exposed to the gas with respect to the reference resistance as a function of the first current value and the second current value, respectively. The resistance variation dependent on relative humidity is then determined as a function of the first and second resistance variations and a first constant. The resistance variation dependent on gas content is then determined as a function of the first and second resistance variations and a second (different) constant.
    Type: Grant
    Filed: June 1, 2015
    Date of Patent: December 5, 2017
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Pasquale Biancolillo, Angelo Recchia, Pasquale Franco, Antonio Cicero, Giuseppe Bruno
  • Patent number: 9773779
    Abstract: A semiconductor device structure including a resistor layer is provided. The semiconductor device structure includes a gate structure formed over the first region of the substrate and an inter-layer dielectric (ILD) layer formed adjacent to the gate structure. The semiconductor device structure further includes a resistor layer is formed over the ILD layer over the second region of the substrate, and the major structure of the resistor layer is amorphous.
    Type: Grant
    Filed: September 17, 2015
    Date of Patent: September 26, 2017
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: I-Tseng Chen, Hon-Lin Huang, Chun-Hsien Huang, Yu-Hung Lin
  • Patent number: 9704621
    Abstract: A chip resistor includes a base member, a resistive element formed on the base member, a first inner electrode held in contact with a first end portion or the resistive element, a second inner electrode held in contact with a second end portion of the resistive element, a first reverse surface electrode reaching a first end portion of the base member, and a second reverse surface electrode reaching a second end portion of the base member. The length of the first and the second reverse surface electrodes is in a range of 2/10 to 3/10 of the length of the base member. Also, the length of the first and the second reverse surface electrodes is greater than the length of the first and the second inner electrodes.
    Type: Grant
    Filed: August 29, 2014
    Date of Patent: July 11, 2017
    Assignee: ROHM CO., LTD.
    Inventors: Shinsuke Ogawa, Makoto Toyonaga
  • Patent number: 9700379
    Abstract: An apparatus for determining a status of a medical device component is disclosed. The apparatus includes at least one fusible component to indicate whether the medical device component has been used, and at least one reference component having at least one reference property that is representative of the presence, identity or type of the medical device component. The reference component is non-fusible under ordinary operating conditions.
    Type: Grant
    Filed: April 30, 2013
    Date of Patent: July 11, 2017
    Assignee: EMBLATION LIMITED
    Inventors: Eamon McErlean, Gary Beale
  • Patent number: 9552908
    Abstract: A chip resistor having terminal electrodes is provided. In the chip resistor, a first protector layer has a size different from that of a first resistor layer. Thus, two ends of the first resistor layer are exposed to form new current conduction path. Original current conduction path having the same size of the protective layer and the resistor layer is thus replaced. Hence, resistance variation of the chip resistor is solved; yield of the chip resistor is increased; and, the material cost of the front terminal electrode is greatly reduced.
    Type: Grant
    Filed: June 16, 2015
    Date of Patent: January 24, 2017
    Assignee: NATIONAL CHENG KUNG UNIVERSITY
    Inventor: Wen-Hsi Lee
  • Patent number: 9431148
    Abstract: Thick film resistor paste compositions, and methods for making the thick film compositions are disclosed. The compositions include a resistor composition dispersed in an organic vehicle. The resistor composition has 3 to 60% by weight RuO2 conductive material, 5 to 75% by weight Ag conductive material, 15 to 60% by weight glass frit and optionally up to 10% by weight copper oxide or precursor thereof, and up to 20% by weight bismuth oxide or precursor thereof. Optionally the glass is (by weight) 25-45% SiO2, 2-15% Al2O3, 0-3% ZrO2, 0-8% B2O3, 5-15% CuO, 0-8% BaO, 0-3% P2O5, and 20-50% Bi2O3. The resistor composition when printed to a dry thickness and fired at a temperature between 750° C. and 950° C. achieves a sheet resistivity between 10 and 10,000 milliohms/square and a hot temperature coefficient of resistivity of 1000 ppm/C or higher. The fired resistor composition may achieve a resistance thickness ratio (Rtr) value between 0.75 and 1.50.
    Type: Grant
    Filed: December 30, 2013
    Date of Patent: August 30, 2016
    Assignee: EI DU PONT DE NEMOURS AND COMPANY
    Inventors: Marc H Labranche, Kenneth Warren Hang
  • Patent number: 9324448
    Abstract: In one embodiment, a programming circuit is configured to form a programming current for a silicide fuse element by using a non-silicide programming element.
    Type: Grant
    Filed: March 25, 2014
    Date of Patent: April 26, 2016
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventor: Jefferson W. Hall
  • Patent number: 9281355
    Abstract: An electronic device comprising a semiconductor structure having a back end capacitor and a back end thin film resistor and a method of manufacturing the same. The semiconductor structure includes a first dielectric layer, a bottom plate of the capacitor and a thin film resistor body. The bottom plate and the resistor body are laterally spaced apart portions of the same thin film layer. The bottom plate further includes a conductive layer overlying the thin film layer. A second dielectric layer is disposed on the conductive layer of the bottom plate of the capacitor. A top plate of the capacitor is disposed on the second dielectric layer.
    Type: Grant
    Filed: September 30, 2014
    Date of Patent: March 8, 2016
    Assignee: TEXAS INSTRUMENTS DEUTSCHLAND GMBH
    Inventor: Christoph Dirnecker
  • Patent number: 9252793
    Abstract: A semiconductor device is formed by sealing, with a resin, a semiconductor chip (CP1) having an oscillation circuit utilizing a reference resistor. The oscillation circuit generates a reference current by utilizing the reference resistor, a voltage is generated in accordance with this reference current and an oscillation frequency of the oscillation unit, and the oscillation unit oscillates at a frequency in accordance with the generated voltage.
    Type: Grant
    Filed: November 29, 2010
    Date of Patent: February 2, 2016
    Assignee: Renesas Electronics Corporation
    Inventors: Toshiaki Tsutsumi, Yoshihiro Funato, Tomonori Okudaira, Tadato Yamagata, Akihisa Uchida, Takeshi Terasaki, Tomohisa Suzuki, Yoshiharu Kanegae
  • Patent number: 9217721
    Abstract: Some aspects of the present disclosure relate to a sensor design that exploits the different majority carriers (holes/electrons) in WO3 and Cr2O3 to build sensitivity and selectivity to NO at ppb levels, while discriminating against CO at concentrations a thousand-fold higher (ppm) and spread over a considerable range (0-20 ppm). Practical application of this sensor system for detecting NO in human breath is demonstrated.
    Type: Grant
    Filed: February 28, 2013
    Date of Patent: December 22, 2015
    Assignee: Ohio State Innovation Foundation
    Inventors: Prabir Dutta, Chenhu Sun, Maduraiveeran Govindhan
  • Patent number: 9111779
    Abstract: A resistor is formed on field oxide with a portion of the resistor body configured to overlap an active region in an integrated circuit (IC) substrate to provide heatsinking for the resistor body. In one embodiment, cooling fingers extend from the resistor body beyond the field oxide to overlap the active region. In another embodiment, minor areas of the resistor body overlap the active region. The resistor body may be formed of polycrystalline silicon (polysilicon), silicided polysilicon, or metal. An oxide having greater thermal conductance than the field oxide is formed between the overlapping parts of the resistor body and the active region.
    Type: Grant
    Filed: August 7, 2009
    Date of Patent: August 18, 2015
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Young-Joon Park, Ki-Don Lee
  • Patent number: 9063020
    Abstract: A method and measuring sensor are disclosed for measuring temperature, the method including arranging a measuring element of the sensor into thermal contact with a process liquid being measured, and directing a measuring signal received from the measuring element onward by measuring conductors connected to the measuring element. Close to the measuring element, terminal areas are established which are arranged in unrestricted thermal contact with the process liquid being measured, and the measuring conductors are connected to the measuring element through the terminal areas.
    Type: Grant
    Filed: October 14, 2011
    Date of Patent: June 23, 2015
    Assignee: JANESKO OY
    Inventor: Esko Kamrat
  • Publication number: 20150022312
    Abstract: A chip resistor includes a resistor board, a first electrode, a second electrode and an insulating layer. The second electrode is offset from the first electrode in a lateral direction perpendicular to the thickness direction of the resistor board. The obverse surface of the resistor board includes a first region in contact with the first electrode, a second region in contact with the second electrode and an intermediate region in contact with the insulating layer. The intermediate region is disposed between the first region and the second region in the lateral direction. The first electrode includes a first underlying layer and a first plating layer. The first underlying layer is disposed between the first plating layer and the insulating layer in the thickness direction of the resistor board.
    Type: Application
    Filed: July 3, 2014
    Publication date: January 22, 2015
    Inventor: Masaki YONEDA
  • Patent number: 8815125
    Abstract: A method of manufacturing a resistor paste comprising steps of: (a) preparing a basic resistor paste comprising, (i) a conductive powder, (ii) a first glass frit, and (iii) a first organic medium; and (b) preparing a glass paste as a TCR driver comprising, (iv) a second glass frit comprising manganese oxide, and (v) a second organic medium, (c) adding the glass paste to the basic resistor paste to obtain a resistor paste with a desired TCR.
    Type: Grant
    Filed: June 20, 2012
    Date of Patent: August 26, 2014
    Assignee: E. I. du Pont de Nemours and Company
    Inventor: Yuko Ogata
  • Patent number: 8810355
    Abstract: The present disclosure relates to a thin film resistor that is formed on a substrate along with other semiconductor devices to form all or part of an electronic circuit. The thin film resistor includes a resistor segment that is formed over the substrate and a protective cap that is formed over the resistor segment. The protective cap is provided to keep at least a portion of the resistor segment from oxidizing during fabrication of the thin film resistor and other components that are provided on the semiconductor substrate. As such, no oxide layer is formed between the resistor segment and the protective cap. Contacts for the thin film resistor may be provided at various locations on the protective cap, and as such, are not provided solely over a portion of the resistor segment that is covered with an oxide layer.
    Type: Grant
    Filed: September 27, 2013
    Date of Patent: August 19, 2014
    Assignee: Cree, Inc.
    Inventors: Van Mieczkowski, Jason Gurganus
  • Patent number: 8791394
    Abstract: The present invention is to provide a heating substrate equipped with a conductive thin film and electrodes. The heating substrate includes a transparent substrate, a plurality of electrodes formed on a first face of the substrate, and a conductive thin film formed on the first face of the substrate and including a plurality of regions electrically connected each other in parallel by the plurality of electrodes. Furthermore, a method of manufacturing a heating substrate equipped with a conductive thin film and electrodes according to an exemplary embodiment of the present invention includes forming the conductive thin film on a substrate, forming main electrodes so as to extend on the substrate while being adjacent to edges of the conductive thin film, and forming branched electrodes that are extended from the conductive thin film across one side of the conductive thin film while coming in contact with the conductive thin film.
    Type: Grant
    Filed: August 7, 2008
    Date of Patent: July 29, 2014
    Assignee: Korea Institute of Machinery & Materials
    Inventors: Chang-Soo Han, Jin-Won Song, Joon-Dong Kim, Yu-Hwan Yoon
  • Publication number: 20140167911
    Abstract: A resistor component is provided, including a ceramic bar having a film applied thereon, a protection layer formed on the film in a middle portion of the ceramic bar, an end plating layer formed on the film at two ends of the ceramic bar, an insulation layer formed on the protection layer, and a color coded marking formed on the insulation layer that indicates the resistance of the resistor component. The end plating layer is formed by a barrel plating method and includes copper, tin, nickel and a combination thereof. The resistor component thus has a low cost and is manufactured by a simple process, simultaneously avoids the occurrence of pores or incompletely sealed join that may be caused by the prior method. Therefore the resistor component has high reliability.
    Type: Application
    Filed: May 14, 2013
    Publication date: June 19, 2014
    Applicant: VIKING TECH CORPORATION
    Inventors: Shih-Long Wei, Shen-Li Hsiao, Chien-Hung Ho
  • Patent number: 8754741
    Abstract: The resistance of a thin-film resistor is substantially increased by forming the thin-film resistor to line one or more non-conductive trenches. By lining the one or more non-conductive trenches, the overall length of the resistor is increased while still consuming approximately the same surface area as a conventional resistor.
    Type: Grant
    Filed: October 18, 2012
    Date of Patent: June 17, 2014
    Assignee: Texas Instruments Incorporated
    Inventors: Byron Lovell Williams, John Britton Robbins
  • Publication number: 20140111301
    Abstract: The resistance of a thin-film resistor is substantially increased by forming the thin-film resistor to line one or more non-conductive trenches. By lining the one or more non-conductive trenches, the overall length of the resistor is increased while still consuming approximately the same surface area as a conventional resistor.
    Type: Application
    Filed: October 18, 2012
    Publication date: April 24, 2014
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Byron Lovell Williams, John Britton Robbins
  • Publication number: 20140049358
    Abstract: There are provided a chip resistor and a method of manufacturing the same. The chip resistor includes a ceramic substrate; an adhesion portion formed on a surface of the ceramic substrate; and a resistor formed on the adhesion portion, wherein the adhesion portion includes at least one of copper (Cu), nickel (Ni), and copper-nickel (Cu—Ni).
    Type: Application
    Filed: December 17, 2012
    Publication date: February 20, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yong Min KIM, Jung II KIM, Ichiro TANAKA, Young Tae KIM, Heun Ku KANG
  • Publication number: 20140015635
    Abstract: The present invention provides a metal foil provided with an electrical resistance layer, in which peeling between the metal foil and the electrical resistance layer disposed on the metal foil can be prevented and variation in the resistivity of the resistance layer can be reduced, and a method of manufacturing the same. The present invention includes a metal foil with an electrical resistance layer including a metal foil having a surface of a ten-point mean roughness Rz, which is measured by an optical method according to 1 ?m or less and the surface being treated by irradiation with ion beams at an ion beam intensity of 0.70-2.10 sec·W/cm2 and an electrical resistance layer disposed on the surface of the metal foil.
    Type: Application
    Filed: March 27, 2012
    Publication date: January 16, 2014
    Applicant: JX Nippon Mining & Metals Corporation
    Inventor: Toshio Kurosawa
  • Patent number: 8628695
    Abstract: The invention relates to a surface-modified RuO2 conductive and a lead-free powdered glass material formulated to make a paste suitable for application to the manufacture of a thick film resistor material. The resistance range that is most suitable to this invention is a resistor having 10 kilo-ohms to 10 mega-ohms per square of sheet resistance. The resulting resistors have ±100 ppm/° C. TCRs.
    Type: Grant
    Filed: April 16, 2009
    Date of Patent: January 14, 2014
    Assignee: E I du Pont de Nemours and Company
    Inventors: Kenneth Warren Hang, Marc H. Labranche, Barry Edward Taylor, Paul Douglas Vernooy
  • Patent number: 8570140
    Abstract: The present disclosure relates to a thin film resistor that is formed on a substrate along with other semiconductor devices to form all or part of an electronic circuit. The thin film resistor includes a resistor segment that is formed over the substrate and a protective cap that is formed over the resistor segment. The protective cap is provided to keep at least a portion of the resistor segment from oxidizing during fabrication of the thin film resistor and other components that are provided on the semiconductor substrate. As such, no oxide layer is formed between the resistor segment and the protective cap. Contacts for the thin film resistor may be provided at various locations on the protective cap, and as such, are not provided solely over a portion of the resistor segment that is covered with an oxide layer.
    Type: Grant
    Filed: June 3, 2011
    Date of Patent: October 29, 2013
    Assignee: Cree, Inc.
    Inventors: Van Mieczkowski, Jason Gurganus
  • Patent number: 8558201
    Abstract: A method and device for measuring the soot load in the exhaust gas systems of diesel engines using a sensor which is mounted downstream of a particulate filter and comprises a sensor element, to measure the operability of the particulate filter. According to the method, the soot load of the sensor element is measured resistively or capacitively using electrodes. The measuring voltage of the sensor element is controlled depending on at least one actual operating parameter of the diesel engine.
    Type: Grant
    Filed: March 13, 2010
    Date of Patent: October 15, 2013
    Assignee: Siemens Aktiengesellschaft
    Inventors: Ralf Bitter, Camiel Heffels, Thomas Hörner
  • Patent number: 8530803
    Abstract: There is disclosed a honeycomb structure including a honeycomb structure section, and a pair of band-like electrode sections arranged on a side surface of the honeycomb structure section, an electrical resistivity of the honeycomb structure section is from 1 to 200 ?cm, in a cross section which is perpendicular to a cell extending direction, the one electrode section is disposed on an opposite side of the other electrode section via the center O, an angle which is 0.5 time as large as a central angle of the electrode section is from 15 to 65°, and each of the electrode sections is formed so as to become thinner from a center portion in a peripheral direction toward both ends in the peripheral direction, and in the cross section which is perpendicular to the extending direction of the cells, the whole outer peripheral shape is a round shape.
    Type: Grant
    Filed: September 27, 2012
    Date of Patent: September 10, 2013
    Assignee: NGK Insulators, Ltd.
    Inventors: Satoshi Sakashita, Yoshimasa Omiya
  • Patent number: 8482375
    Abstract: A solution for producing nanoscale thickness resistor films with sheet resistances above 1000?/? (ohm per square) and low temperature coefficients of resistance (TCR) from ?50 ppm/° C. to near zero is disclosed. In a preferred embodiment, a silicon-chromium based compound material (cermet) is sputter deposited onto a substrate at elevated temperature with applied rf substrate bias. The substrate is then exposed to a process including exposure to a first in-situ anneal under vacuum, followed by exposure to air, and followed then by exposure to a second anneal under vacuum. This approach results in films that have thermally stable resistance properties and desirable TCR characteristics.
    Type: Grant
    Filed: May 24, 2010
    Date of Patent: July 9, 2013
    Assignee: OEM Group, Inc.
    Inventor: Valery V. Felmetsger
  • Patent number: 8450660
    Abstract: A system for effectively defrosting a plastic window includes a transparent plastic panel, a heater grid having a plurality of grid lines that are integrally formed with the plastic panel, and equalizing means for equalizing the electrical current traveling through each of the grid lines.
    Type: Grant
    Filed: June 18, 2010
    Date of Patent: May 28, 2013
    Assignee: Exatec LLC
    Inventors: Keith D. Weiss, Yana Shvartsman