Abstract: The electronic component includes an element body 4 having plurality of side faces 5a to 5d along a circumference direction. The element body 4 includes insulation layers 16a to 16d covering the plurality of side faces 5a to 5d along the circumference direction in a continuous manner, and melting points of the insulation layers 16a to 16d are lower than melting points of dielectric layers 10 and 11 included in the element body 4. The main component of the insulation layer is glass.

Abstract: The present invention relates to an externally mounted calibration device and a temperature measurement system using the same. The temperature measurement system calibrates the temperature of the thermal camera using an externally mounted temperature calibration device that is mounted on one side of the outside of the thermal camera unit and includes a temperature measurement substrate with a temperature sensor.

Abstract: A multilayer ceramic electronic component includes a ceramic body including a first internal electrode and a second internal electrode disposed to be alternately stacked with a dielectric layer interposed therebetween; a first external electrode connected to the first internal electrode and including a first electrode layer, a first conductive layer, and a first metal layer; a second external electrode connected to the second internal electrode and including a second electrode layer, a second conductive layer, and a second metal layer; and a first coating layer disposed on the ceramic body, the first electrode layer and the second electrode layer. The first conductive layer and the second conductive layer are sintered electrodes including a conductive metal and glass, and the first coating layer includes a plurality of openings disposed on the first electrode layer and the second electrode layer.

Abstract: A resistor arrangement having a first electrically conductive connection element and a second electrically conductive connection element, a first resistance element which is electrically conductively connected to the first connection element, a second resistance element which is electrically conductively connected to the second connection element, an electrically conductive intermediate element arranged between the first resistance element and the second resistance element and connected with these resistance elements in an electrically conductive manner, wherein the connection elements, the resistance elements and the intermediate element are arranged side by side in a row. The connection elements and the intermediate element on the one hand and the resistance elements on the other hand formed of different materials, wherein the material of the first resistance element differs from the material of the second resistance element.

Abstract: Embodiments of the present disclosure describe a magnetic substrate including a cured magnetic ink and a cured polymer resin, wherein the cured magnetic ink includes a plurality of functionalized magnetic iron oxide nanoparticles and wherein the magnetic substrate is a freestanding magnetic substrate.

Abstract: A resistor component includes a substrate having a first surface and a second surface, opposing each other; an external electrode disposed outside of the substrate; a resistive layer disposed on the first surface of the substrate, connected to the external electrode, and including an alloy of a first metal and a second metal; and a first protective layer disposed on the resistive layer and including any one of the first and second metals.

Abstract: Resistive elements are formed in belt shape in regions sandwiched between secondary division prediction lines set onto a large substrate and extending in a direction orthogonal to primary division prediction lines, a plurality of front electrodes disposed facing each other at predetermined intervals on the resistive elements are formed so as to be across the primary division prediction lines, a glass coat layer covering each of the resistive elements and extending in the direction orthogonal to the secondary division prediction lines is formed, a resin coat layer covering an entire surface of the large substrate from a top of the glass coat layer is formed, and after that, the large substrate is diced along the primary division prediction lines and the secondary division prediction lines to obtain individual chip base bodies.

Abstract: A multilayer ceramic electronic component includes a body including a dielectric layer, first and second internal electrodes, a stacked portion including first and second surfaces opposing each other in a stacking direction of the first and second internal electrodes, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first and second surfaces, connected to the third and fourth surfaces, and opposing each other, and a coating layer disposed on the first to sixth surfaces of the stacked portion and having first and second connection portions; and first and second external electrodes connected to the first and second internal electrodes, respectively, and arranged on the third and fourth surfaces of the body, wherein the first and second internal electrodes are respectively connected to the first and second external electrodes through the first and second connection portions.

Abstract: A multilayer capacitor includes a body including a stack structure in which a plurality of dielectric layers are stacked and a plurality of internal electrodes are stacked with the dielectric layers interposed therebetween, external electrodes disposed on an external surface of the body to be connected to the internal electrodes, and including a first electrode layer disposed on a first surface of the body to which the internal electrodes are exposed, and a second electrode layer covering the first electrode layer, a first insulating coating layer disposed between the first and second electrode layers and having a discontinuous region, and a second insulating coating layer having a discontinuous region to cover at least a portion of a surface of the body. The second insulating coating layer is exposed from the external electrodes.

Abstract: A multilayer capacitor includes a body including a stack structure in which a plurality of dielectric layers are stacked and a plurality of internal electrodes stacked with respective dielectric layers interposed therebetween, external electrodes disposed on external surfaces of the body and connected to the internal electrodes, and an insulating layer covering a surface of the body. One of the external electrodes includes a metal layer connected to the insulating layer, and the insulating layer includes an oxide of a metal component of the metal layer.

Abstract: A chip resistor with a reduced thickness is provided. The chip resistor includes an insulating substrate, a resistor embedded in the substrate, a first electrode electrically connected to the resistor, and a second electrode electrically connected to the resistor. The first electrode and the second electrode are spaced apart from each other in a lateral direction that is perpendicular to the thickness direction of the substrate.

Abstract: A semiconductor device includes a resistor having a resistor body including polysilicon, with fluorine in the polysilicon. The resistor body has a laterally alternating distribution of silicon grain sizes. The semiconductor device further includes an MOS transistor having a gate including polysilicon with fluorine. The fluorine in the gate has a higher average concentration than the fluorine in the resistor body. The semiconductor device may be formed by forming a gate/resistor layer including polysilicon. A fluorine implant mask is formed over the gate/resistor layer, exposing the gate/resistor layer in an area for the gate and over implant segments in an area for the resistor body. The implant segments do not cover the entire area for the resistor body. Fluorine is implanted into the gate/resistor layer where exposed by the fluorine implant mask. The gate/resistor layer is patterned to form the gate and the resistor body.

Abstract: A method for manufacturing a circuit board with nickel resistor embedded therein provides a copper substrate, the copper substrate includes a copper foil. A nickel resistance layer is formed on the copper foil. A first dielectric layer and a first copper layer are formed on the nickel resistance layer. The copper foil and the first copper layer are etched to form a first conductive wiring layer and a second conductive wiring layer respectively, the nickel layer not being subjected to an etching process, to obtain the finished circuit board.

Abstract: A capacitor component includes a body including a layered portion having alternately stacked first and second internal electrodes laminated with dielectric layers interposed therebetween in a first direction, and first and second connecting portions disposed on two opposing surfaces of the layered portion, respectively, in a second direction perpendicular to the first direction and electrically connected to the first and second internal electrodes, respectively. The first and second connecting portions each include a metal layer disposed on the layered portion, a ceramic layer disposed on the metal layer, and an exposed portion penetrating through the ceramic layer to be in contact with the metal layer.

Abstract: A multilayer electronic component in the example embodiment includes a Si-organic compound layer including a body covering portion disposed on a region of an exterior surface of a body between external electrodes and an extended portion extending from the body covering portion to a region between a plating layer and an additional plating layer of the external electrode, thereby having improved warpage strength and moisture resistance.

Abstract: A multilayered capacitor includes a shock absorbing layer disposed between an upper layer of a capacitor body and a conductive resin layer of an external electrode and between a lower layer of the capacitor body and the conductive resin layer of the external electrode. A length of the shock absorbing layer is longer than that of the conductive resin layer, thereby improving warpage strength characteristics of the capacitor body.

Abstract: Methods systems and apparatus are set forth herein. There is provided in one embodiment determining one or more body physiological parameter of a patient based on one or more input; and controlling a heating system for warming the patient based on a result of the determining.

Abstract: An electronic component includes: an element body in which a plurality of insulator layers are stacked; a coil in which a plurality of inner conductors installed in the element body are electrically connected to each other; and an outer electrode that is disposed on an outer surface of the element body, is electrically connected to the coil, and includes at least a baked electrode layer. The inner conductor connected to the outer electrode includes a connection conductor that electrically connects the baked electrode layer to the inner conductor. The connection conductor includes a protruding portion that protrudes from the outer surface of the element body to the outer electrode. The protruding portion includes a metal having a smaller diffusion coefficient than a metal of a main component included in the baked electrode layer. The inner conductors have a lower electric resistance value than the metal included in the protruding portion.

Abstract: A multi-layer ceramic electronic device includes an element body and terminal electrodes. The terminal electrodes include end electrode parts covering ends of the element body in which internal electrode layers are led and upper electrode parts continuing to the end electrode parts and each partially covering an upper surface of the element body in a lamination direction. An upper-surface cover layer covering the upper surface of the element body located between the upper electrode parts has an external surface substantially flush with external surfaces of the upper electrode parts. The terminal electrodes are not substantially formed on a lower surface of the element body located opposite to the upper surface of the element body in the lamination direction.

Abstract: A multilayer ceramic electronic component includes a stacked body, and an external electrode including an underlying electrode layer containing a conductive metal and a glass component, a resin layer containing a thermosetting resin and no metal component, and a plating layer. The underlying electrode layer extends from a first or second end surface, and covers a portion of each of first and second main surfaces and first and second lateral surfaces. The resin layer covers the underlying electrode layer on the second main surface adjacent to the first or second end surface. The plating layer covers a portion of the surface of the underlying electrode layer that is not covered with the resin layer, and covers the surface of the resin layer.

Abstract: A high frequency termination for converting a high frequency electrical signal of a circuit into heat. The high frequency termination includes a substrate. The high frequency termination also includes a spiral resistor formed on the substrate and having a first end and a second end. The high frequency termination also includes a conductive pad electrically coupled to the first end of the spiral resistor. The high frequency termination also includes a contact electrically coupled to the conductive pad and configured to connect to the circuit.

Abstract: A multilayer electronic component has a body and a non-conductive resin layer. The non-conductive resin layer includes a body cover portion disposed in a region of an external surface of the body in which an electrode layer of an external electrode is not disposed, and an extending portion extending from the body cover portion between the electrode layer and a conductive resin layer of the external electrode, to thereby suppress arc discharge, improve bending strength, and improve moisture resistance.

Abstract: A multilayer ceramic electronic component includes a stacked body and external electrodes provided on two end surfaces of the stacked body. Each external electrode includes an underlying electrode layer including a conductive metal, a resin electrode layer including a resin and metal component, a resin layer including a resin and no metal component, and a metal layer. The underlying electrode layers extend from the two end surfaces to cover a portion of two main surfaces and two lateral surfaces. The resin electrode layers cover the underlying electrode layers provided on the two end surfaces. The resin layers are connected to the resin electrode layers and provided on the underlying electrode layers located on a portion of the two main surfaces and two lateral surfaces. The metal layers cover the surfaces of the resin electrode layers and resin layers.

Abstract: A method for working a first component and a second component comprises the following steps: providing the first component, which comprises a thermally sprayed electrically conductive layer, providing the second component, which has a longitudinally extended strip of copper, which at least in a first region has a thickness transversely to the longitudinal direction of more than 0.1 millimeter, arranging the strip and the layer one on top of the other, so that the first region of the strip and the layer have a contact region in common with one another, emitting a laser beam onto the contact region and forming a welded connection, which connects the strip and the layer to one another.

Abstract: A capacitor component includes a body including a layered portion having alternately stacked first and second internal electrodes laminated with dielectric layers interposed therebetween in a first direction, and first and second connecting portions disposed on two opposing surfaces of the layered portion, respectively, in a second direction perpendicular to the first direction and electrically connected to the first and second internal electrodes, respectively. The first and second connecting portions each include a metal layer disposed on the layered portion, a ceramic layer disposed on the metal layer, and an exposed portion penetrating through the ceramic layer to be in contact with the metal layer.

Abstract: A film capacitor includes: a main body portion including dielectric films and metal films which are laminated; external electrodes; and an insulating layer disposed on a surface of the main body portion. The main body portion includes a pair of first faces, a pair of first side faces and a pair of second side faces, the first side faces and the second side faces connecting the first faces. The external electrodes are disposed on the first side faces, respectively. The metal films each include a plurality of first segments into which the metal films are divided by a plurality of first grooves extending in a first direction. The insulating layer is disposed between the main body portion and parts of the external electrodes within first regions which are regions of the first side faces that are distant from the second side faces, respectively, by a distance of P or less.

Abstract: A multilayer ceramic electronic component includes a body including a dielectric layer, first and second internal electrodes, a stacked portion including first and second surfaces opposing each other in a stacking direction of the first and second internal electrodes, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first and second surfaces, connected to the third and fourth surfaces, and opposing each other, and a coating layer disposed on the first to sixth surfaces of the stacked portion and having first and second connection portions; and first and second external electrodes connected to the first and second internal electrodes, respectively, and arranged on the third and fourth surfaces of the body, wherein the first and second internal electrodes are respectively connected to the first and second external electrodes through the first and second connection portions.

Abstract: A multilayered capacitor includes a shock absorbing layer disposed between an upper layer of a capacitor body and a conductive resin layer of an external electrode and between a lower layer of the capacitor body and the conductive resin layer of the external electrode. A length of the shock absorbing layer is longer than that of the conductive resin layer, thereby improving warpage strength characteristics of the capacitor body.

Abstract: A multilayer electronic component in the example embodiment includes a Si-organic compound layer including a body covering portion disposed on a region of an exterior surface of a body between external electrodes and an extended portion extending from the body covering portion to a region between a plating layer and an additional plating layer of the external electrode, thereby having improved warpage strength and moisture resistance.

Abstract: A resistance pattern that contains platinum as a main component is formed into a meander shape and on a main surface of a ceramic substrate. A protective film layer that covers the resistance pattern has a two-layer structure including a trap layer as an inner layer and an overcoat layer as an outer layer. The trap layer contains alumina as a main component and 2 to 30 vol % of platinum. The overcoat layer contains alumina as a main component. With such a configuration, even when reactivity of the platinum resistance pattern becomes higher under high temperature use, platinum contained in the trap layer reacts with oxygen or impurities etc. contained in the ceramic substrate. Thus, reaction of the platinum resistance pattern can be suppressed.

Abstract: A room temperature nitrogen dioxide gas sensor comprising tin(IV) oxide decorated with gold nanoparticles is described. The tin(IV) oxide may have an average layer thickness of 10-1,000 nm, and is topped with dispersed gold nanoparticles having an average longest dimension of 200-650 nm. The room temperature nitrogen dioxide gas sensor may be used to detect and measure levels of nitrogen dioxide gas at room temperature and at concentrations of 100 ppb-1800 ppm, with a high stability. A method of making the room temperature nitrogen dioxide sensor is also described, and involves sputtering to deposit a tin(IV) oxide layer and a gold layer on a substrate, followed by annealing.

Abstract: A thermal printhead includes a substrate, a protrusion formed on an obverse surface of the substrate and extending in a main scanning direction, a heat storage layer formed on a top surface of the protrusion, and a plurality of heat-generating parts arranged along the main scanning direction on the heat storage layer. The substrate and the protrusion are integrally formed from a single-crystal semiconductor.

Abstract: The present disclosure discloses a circuit protection device including a first magnetic layer in which a plurality of magnetic sheets are laminated and of which at least a portion of one surface is exposed, a second magnetic layer in which a plurality of magnetic sheets are laminated and of which at least a portion of one surface is exposed, and a nonmagnetic layer in which a plurality of nonmagnetic sheets are laminated and which is disposed between the first and second magnetic layers. A noise filter part including a plurality of coil patterns is disposed in the nonmagnetic layer.

Abstract: A hydrogen detection apparatus includes a hydrogen sensor, a sensor control circuit configured to sense a resistance value of the hydrogen sensor, and a microcomputer configured to set an off time that differs depending on an operating environment and intermittently drive the sensor control circuit. The hydrogen sensor includes a first electrode; a metal-oxide layer on the first electrode, and in which a resistance value is configured to change in response to contacting hydrogen atoms; a second electrode on the metal-oxide layer; and an insulating film that covers at least a portion of lateral surfaces of the first electrode, the metal-oxide layer, and the second electrode. A portion of at least one of: (i) a first interface between the first electrode and the metal-oxide layer; and (ii) a second interface between the second electrode and the metal-oxide layer is uncovered by the insulating film and exposed to a detection space.

Abstract: The present disclosure discloses a circuit protection device including a first magnetic layer in which a plurality of magnetic sheets are laminated and of which at least a portion of one surface is exposed, a second magnetic layer in which a plurality of magnetic sheets are laminated and of which at least a portion of one surface is exposed, and a nonmagnetic layer in which a plurality of nonmagnetic sheets are laminated and which is disposed between the first and second magnetic layers. A noise filter part including a plurality of coil patterns is disposed in the nonmagnetic layer.

Abstract: Methods and apparatus providing a vertically constructed, temperature sensing resistor are disclosed. An example apparatus includes a semiconductor substrate including a plurality of resistor unit cells arranged in an array, each resistor unit cell formed within the semiconductor substrate and including a top contact. A conductive layer located over the semiconductor substrate electrically connects to a subset of the top contacts.

Abstract: A variable RF attenuator includes a substrate, a first microstrip trace, a first thin film resistor, a second microstrip trace, and a wire bond. The substrate includes a dielectric layer. The first thin film resistor is disposed on the substrate. The first microstrip trace is disposed on the substrate and the first thin film resistor. The second microstrip trace is disposed on the substrate and is uncoupled from the first microstrip trace. The wire bond extends from the second microstrip trace to a position on the first microstrip trace. The position is selected to tune RF attenuation over a conductive path defined by the first microstrip trace, the wire bond, and the second microstrip trace.

Abstract: An apparatus for a heating device for a vehicle comprises a layer stack which, in a stacking direction, has a heating conductor layer, an electrically conductive layer which forms a contact region, wherein a contour in a projection in the stacking direction of the electrically conductive layer is prespecified, in order to prevent a hotspot on the electrically conductive layer, by at least one of a prespecified width of a front side of the electrically conductive layer which faces a central region of the heating conductor layer, a prespecified distance from a joint of the heating conductor layer, and a prespecified curvature of the contour.

Abstract: An electrical connection element for the electrical contacting of an electrically conductive structure on a substrate is described. The electrical connection element has at least two solid subelements made from different materials, the first subelement being adapted for soldering to the electrically conductive structure, and the second subelement being adapted for connection to an electrical connection cable. The first subelement and the second subelement are connected to one another by way of at least one rivet.

Abstract: We disclose herein a sensing device comprising a substrate, a dielectric layer located on the substrate, a heater located within the dielectric layer; a material for sensing a gas. The material comprises an alumina (Al2O3) doped conductive metal oxide.

Abstract: An electrical terminal includes a planar base portion having a base portion outer surface, a base portion inner surface, and two securing tabs extending from an edge of the base portion. The electrical terminal also includes a planar attachment portion having an attachment portion outer surface, an attachment portion inner surface, and an attachment member extending from the attachment portion outer surface. The attachment member is configured to secure a wire cable to the electrical terminal. The base portion inner surface is arranged such that it is in contact with the attachment portion inner surface and the two securing tabs are bent over the attachment portion outer surface. The electrical terminal may be especially well suited for making an electrical connection to components disposed on a glass surface. A method for forming such a terminal is also presented.

Abstract: A composite electronic component includes a capacitor and a resistor stacked in a height direction. The capacitor includes a capacitor body, and first and second external electrodes. The resistor includes a base portion, a resistor, first and second upper surface conductors, first and second lower surface conductors, first connecting conductors, and second connecting conductors. An upper surface of the base portion of the resistor faces a lower surface of the capacitor body of the capacitor, and the first upper surface conductor and the first external electrode are electrically connected, and the second upper surface conductor and the second external electrode are electrically connected.

Abstract: An adhesive connector for making an electrical connection to a conductor formed on a support surface is provided. The adhesive connector includes a substrate and a metal strip attached to a first surface of the substrate, wherein the metal strip is configured to engage a releasable electrical connector. The adhesive connector also includes a conductive strip attached to a second surface of the substrate and a conductive staple configured to secure the conductive strip, the substrate, and the metal strip together. The adhesive connector further includes an electrically-conducting adhesive that coats a first portion of the conductive strip, and is configured to provide electrical contact to a conductor formed on a support surface.

Abstract: A multilayer ceramic electronic component includes a ceramic body including first and second internal electrodes alternately stacked with dielectric layers interposed therebetween, and first and second external electrodes disposed on outer surfaces of the ceramic body. The first and second external electrodes include, respectively, first and second base electrode layers and first and second plating layers. The first and second plating or base electrodes layers have at least one hole positioned in at least one corner of the ceramic body, and the hole includes a point of a respective edge of the ceramic body at which the respective edge meets a virtual line extending in a thickness direction and drawn through an end in a width direction of an exposed edge of one of the first and second internal electrodes exposed in a surface in which first or second internal electrodes contact first or second external electrodes.

Abstract: A glass composition including 65 to 72 wt-% SiO2, at least 10.1 wt-% Li2O, at least 10.1 wt-% Al2O3, 0 to 2 wt-% K2O, at most 4 wt-% Na2O, 0 to 1.5 wt-% CaO, 0 to 1.5 wt-% CeO2, 1 to 5 wt-% P2O5, 0 to 0.5 wt-% V2O5, 0 to 1 wt-% Ag, and 0 to 1 wt-% ZrO2, based on a total weight of the composition. The composition is devoid of TiO2, Cu2O, BaO, Sb2O3, Nb2O5, MgO, La2O3, and SnO2. The proportion of Li2O to Al2O3 in the composition is in a range of from 1:1 to 1.5:1.

Abstract: A ceramic electronic component includes a body including a dielectric layer and first and second internal electrodes, a first external electrode including a first electrode layer electrically connected to the first internal electrode, a first inorganic insulating layer disposed on the first electrode layer, and a first plating layer disposed on the first inorganic insulating layer, a second external electrode including a second electrode layer electrically connected to the second internal electrode, a second inorganic insulating layer disposed on the second electrode layer, and a second plating layer disposed on the second inorganic insulating layer, and a third inorganic insulating layer disposed on the body and connected to the first and second inorganic insulating layers. The first, second and third inorganic insulating layers comprise one or more of SiO2, Al2O3 and ZrO2, and the first, second and third inorganic insulating layers have a thickness within a range from 20 nm to 150 nm.

Abstract: A composite electronic component includes an electronic element and a resistance element in a height direction. The electronic element includes an electronic element body, and a first and second external electrodes separated from each other in a length direction. The resistance element includes a base portion, a resistor disposed on the upper surface of the base portion, a protective film, and first to third upper surface conductors. The first and second upper surface conductors are separated from each other in the length direction, and the resistor and the third upper surface conductor connected thereto are located between the first and the second upper surface conductors.

Abstract: Provided is a chip resistor including: a rectangular parallelepiped insulating substrate which is made of ceramics; a pair of front electrodes which are provided on lengthwise opposite end portions in a front surface of the insulating substrate; a resistive element which is provided between and connected to the two front electrodes; a protective layer which is made of a resin and which entirely covers the front surface of the insulating substrate including the two front electrodes and the resistive element; and a pair of cap-shaped end-surface electrodes which are provided on the lengthwise opposite end portions of the insulating substrate to establish electrical continuity to the front electrodes respectively; wherein: a chip element assembly in which the insulating substrate and the protective layer are laminated on each other but the end-surface electrodes have not been formed yet has an external shape substantially like a square cylinder.

Abstract: A multilayer capacitor includes a capacitor body including dielectric layers and a plurality of first and second internal electrodes exposed through the third and fourth surfaces, and having first to sixth surfaces; first and second external electrodes including first and second connection portions disposed on the third and fourth surfaces, and first and second band portions extending from the first and second connection portions to portions of the first and second surfaces and the fifth and sixth surfaces; first and second conductive resin layers covering portions of the first and second band portions; an insulating layer disposed on the first surface; and first and second terminal electrodes spaced apart from each other, covering portions of the insulating layer, and connected to the first and second external electrodes.

Abstract: In order to provide a chip resistor which has wide and flat terminal electrodes in its front surface and which has high connection reliability between front electrodes and the terminal electrodes, a chip resistor according to the present invention includes: an insulating substrate 1 shaped like a cuboid; a pair of front electrodes 2 provided on lengthwise opposite edge portions of a front surface of the insulating substrate 1; a resistor body 3 provided between the front electrodes 2; an insulating protection layer 4 covering entire surfaces of the front electrodes 2 and the resistor body 3; and a pair of terminal electrodes 5 provided on lengthwise opposite end surfaces of the insulating substrate 1.