Abstract: An attenuator is in the form of a pad comprising a coating of resistive material which connects an input port, an output port and a pair of linked constant potential ports. The regions of the pad adjacent to the outer edges of the input port are provided with outwardly pointing cusps with curved boundary edges. These reduce current crowding at the edges of the input port, and avoid localized overheating of the adjacent regions of the pad, which could result in pad failure.

Abstract: A method of adjusting the values of resistors is described wherein regions of a resistive layer provided on a substrate are removed by means of a laser in dependence on the resistance that is required and/or by cutting marks of a specific shape into the resistive layer. In order to obtain resistors with values which are defined as accurately as possible, and which are free of disturbing inductivity, a point raster is formed in the resistive layer by means of single shots of the laser, with the extent and position of the raster, and/or the spacing between its individual points, and/or the size of the individual points being chosen in relation to the total area of the resistive layer in dependence on the required resistance and further physical values.

Abstract: The invention is directed to a thick film resistor composition for firing in a low oxygen-containing atmosphere comprising finely divided particles of (a) a semiconductive material consisting essentially of a refractory metal carbide, oxycarbide or mixtures thereof and (b) a nonreducing glass having a softening point below that of the semiconductive material dispersed in (c) organic medium and to resistor elements made therefrom.

Abstract: Base metal resistive paints, resistors made therefrom and method for making the resistive paint are disclosed. The base metal resistive paints comprise 20 to 25% tantala glass frit and 75 to 80% tin oxide, ground to a particle size of ten microns or less; and well mixed with 25 to 35% screening agent for subsequent screening upon a suitable substrate, and firing in an inert atmosphere at a peak temperature of about 900.degree. C. The tantala glass frit preferably comprises 5 to 25% tantatum oxide. The tin oxide is preferably preheated at 450.degree. to 600.degree. C. in the presence of a reducing gas, prior to mixing with the tantala glass frit. The screening agent preferably forms no carbon residue when pyrolytically decomposed in an inert atmosphere during firing.

Abstract: The invention is directed to a thick film resistor composition for firing in a low oxygen-containing atmosphere comprising finely divided particles of (a) semiconductive material consisting essentially of a cationic excess solid solution and (b) a nonreducing glass having a softening point below that of the semiconductive material dispersed in (c) organic medium and to resistor elements made therefrom.

Abstract: A semiconductor termination socket for use with a printed wiring board has a mounting socket base for attachment to the board and plural pin socket receiving elements in the base for connecting to leads of a semiconductor chip package which will be removably inserted into the socket. The socket further has electrical components fabricated within the socket base for connecting a pin of the socket and a termination potential. The electrical components are preferably fabricated using planar technology so that the socket becomes, in essence, a printed wiring board. The semiconductor packages can be of any configuration including, for example, 149 pin grid array packages. If more than one layer of component circuitry is needed, a plurality of layers can be embedded within the mounting socket.

Abstract: The specification discloses a method for making a curved, conductively coated glass member, and the resulting product, by providing for a sufficient degree of substoichiometry at the moment of bend that the glass can be bent using conventional bending techniques without crazing the coating. Two alternative methods for achieving the degree of substoichiometry are disclosed. One involves coating the part to an initial light transmittance (T.sub.o) which is lower than that typically sought by prior artisans. The other involves bending the part in a reducing environment. Also disclosed is a method for increasing conductivity of the coating by exposing the coated part to a reducing environment at temperatures considerably higher than those heretofore thought feasible for use in reduction curing.

Abstract: An electrical resistor of resistivity of less than about 600 ohms per square and with a temperature coefficient of resistance within the range of .+-.200 ppm/.degree.C. comprises an insulating substrate, electrically conductive terminations on a surface of the substrate, and a layer of resistor material on the surface of the substrate and in contact with the terminations. The resistor material comprises from about 25 to about 35% by weight glass and from about 50% to about 75% by weight conductive particles. Preferably the conductive particles consisting essential of tin oxide and at least about 0.2% by weight of ruthenium containing material, expressed as RuO.sub.2. The mass ratio of ruthenium containing material (as RuO.sub.2) to tin oxide is less than 7:93.

Abstract: A high power thick film resistor having improved power handling capability is obtained with a resistor having two overlying thick film layers wherein the first thick film layer has a relatively low resistivity and the second thick film layer has a relatively high resistivity.

Abstract: A signal termination device is illustrated using planar circuit technology for providing both broadband capabilities from DC to over ten gigahertz while maintaining small size and high power dissipation capabilities. This is accomplished by plating a series cascade of resistors and transmission lines such that the sum of the resistors is equal to the desired termination impedance and the impedance of the interconnecting transmission lines is equal to the sum of the remaining resistors between that point and ground. The use of the intervening transmission lines enhances the power handling capability of the resistor elements and enhances uniform power densities in the resistor elements.

Abstract: The invention is directed to a thick film resistor composition for firing in a low oxygen-containing atmosphere comprising finely divided particles of (a) an anion-deficient semiconductive material consisting essentially of a refractory metal nitride, oxynitride or mixture thereof and (b) a nonreducing glass having a softening point below that of the semiconductive material dispersed in (c) organic medium and to resistor elements made therefrom.

Abstract: A radiation source for infrared radiation includes an area radiator and a resistance layer which are arranged on a support substrate. The heat capacity of the radiation source is to be reduced to the extent that a modulation of the intensity of the radiation source with sufficiently high frequencies is made possible. To this end it is provided that the resistance layer is disposed in a thinned region of the support substrate.

Abstract: An electric potentiometer is proposed, which serves to convert a displacement movement into an electrical signal. The electric potentiometer has a wiper lever with brush wipers which upon a rotational movement about a pivot shaft stroke electrically conductive layers applied to a carrier plate. An electrically nonconductive layer is applied on the resistor layer such that in the region of the electrically conductive layer that is strokable by the wiper upon its deflection, a pickup zone which is narrower than the wiper and is defined on both sides by the electrically nonconductive layer remains uncovered by the electrically nonconductive layer.

Abstract: This invention relates to thick film base metal resistive paints for firing on a substrate to form a resistor having a temperature coefficient of resistance within .+-.100 ppm/.degree.C., while providing a means to selectively blend the resistive paint to provide a wide range of decade resistivities from less than 10 ohms/square to more than 1K ohms/square. The sheet resistance and TCR are controlled by mixing a glass frit from at least one of a first and second glass material; with TiSi.sub.2 ; and at least one of Ti.sub.5 Si.sub.3 and AL.sub.2 O.sub.3 ; and a screening agent, for subsequent screening onto a substrate and firing in an inert atmosphere at a peak temperature of about 900.degree. C. The first glass material comprises, by weight, 5 to 10% SiO.sub.2 ; 30 to 50% BaO; 40 to 60% B.sub.2 O.sub.3 and 1 to 5% CuO. The second glass material comprises, by weight, 50 to 70% B.sub.2 O.sub.3 ; 25 to 45% SrO; and 2 to 10% SiO.sub.2.

Abstract: An improved thermal printhead is disclosed which includes a plurality of addressable electrodes, each corresponding to a spot to be printed. In alternative embodiments, a single common electrode or a plurality of common electrodes are located in a plane below that of the addressable electrodes and are separated therefrom by an insulating layer. A portion of the common electrode is left exposed in the vicinity of each of the addressable electrodes and a covering of thermal resistive material electrically interconnects the two types of electrodes. Passage of a current through an addressable electrodes result in a current flow to the nearest points on a common electrode causing local heating in the resistive material. The electrode arrangement permits printing closer to the edge of the printhead and further, enables smaller, more clearly spaced printed "dots".

Abstract: An electrical heating device comprises a substrate, a pair of parallel, spaced apart elongated conductors extending longitudinally of the substrate, and a semi-conductor pattern carried on the substrate and electrically connected to and extending between the conductors. The semi-conductor pattern produces a thermal image for an infrared target. In some embodiments, the thermal image is irregular or circular in shape and the semi-conductor pattern includes a plurality of transversely-spaced bars having relatively wide portions outside, and relatively thin portions within, the area producing the thermal image.

Abstract: Precision high-voltage resistor comprising a plane substrate of insulating material (1) on which there has been deposited by silk-screening at least one resistive film (3) of approximately rectangular, square or similar shape and a conductive film in the form of two parallel strips (2a, 2b) extending along two opposite edges of the resistive film and constituting terminals electrically connected to one another by said resistive film, the resistive film comprising rectilinear cuts (5a to 5f) made in its thickness, down to the insulating substrate, parallel to said opposite edges from a third edge (6) of the resistive film, characterized in that the rectilinear cuts (5a to 5f) are evenly spaced along the third edge (6) and have lengths that are larger the closer they are to the center of the third edge (6), the ends opposite the third edge (6) of the rectilinear cuts defining from the intersections (8a, 8b) of the third edge (6) with the terminals (2a, 2 b) a contour (7; 9) exhibiting an apex in its center part

Abstract: A resistance thermometer element having a thin layer of platinum metal on an insulating substrate is formed by magnetron sputtering in a gaseous atmosphere containing at least 10% by volume of oxygen. Any balance gas has less than 10% by volume of argon, krypton and xenon. The atmosphere may have up to 100% oxygen with any balance gas being inert to platinum. Air can be used. A planar magnetron may be used.

Abstract: A planar resistance heating element with positive temperature coefficient characteristics includes a resistive body layer formed of a crystalline resin containing electrically conductive particles and disposed between at least a pair of electrodes on an insulating substrate. A phenolic resin layer or a denatured phenolic resin layer with an elastomer resin added is disposed on the resistive body layer in covering relation to the entire surface thereof. An insulating protective film of resin may be disposed on the covering layer with an adhesive layer interposed therebetween, and an adhesive layer may be disposed on an outer surface of the insulating protective film for attachment to an object to be heated.

Abstract: A thick film resistance element is disclosed which is especially suited for use on hybrid circuit subassemblies, which resistance element includes both coarse and fine adjustment, such as by laser beam trimming operation. The resistance element includes a first segment having a given resistance value per unit area and a second segment abutting the first segment along one edge thereof. The second segment includes a resistance material with a differing resistance value per unit area than exhibited by such first segment. In the trimming operation, a laser beam cuts a longitudinal slot in the segment with the higher resistance point below the desired value. The laser beam then cuts a similar longitudinal slot in the other segment to a point where the desired resistance value is obtained.

Abstract: A microwave attenuator forming two series connected L-pads is comprised of a plurality of electrically conductive, resistive, and non-conductive sections disposed on the surface of an elongate dielectric cylindrical base. The series resistances are connected through a conducting strip having an impedance that matches the impedance of the L-pads.

Abstract: The invention is directed primarily to a method of doping tin oxide with Ta.sub.2 O.sub.5 and/or Nb.sub.2 O.sub.5 using pyrochlore-related compounds derived from the system SnO--SnO.sub.2 --Ta.sub.2 O.sub.5 --Nb.sub.2 O.sub.5 for use in thick film resistor compositions. The invention is also directed to thick film resistors containing the above-described pyrochlore-related compounds and to various compositions and methods for making such thick film resistors.

Abstract: An improved thermal head for thermal recording includes an array of a plurality of heat generator elements arranged in a direction first, and a plurality of semiconductor chips each thereof including a plurality of transistors for selectively energizing the plural heat generator elements. An array of electrode terminals including the individual electrode terminals of the plurality of transistors each thereof being connected to one electrode of each of the plurality of heat generator elements are formed on one of the major surfaces of each of the semiconductor chips in a second direction substantially perpendicular to the first direction of the heat generator element array. The thermal head further comprises a flexible film associated with each of the semiconductor chips and having a slot or recess surrounding the electrode terminal array.

Abstract: A thermal head composed of an electrically insulative substrate, a resistive film made of TiO.sub.x (0<x<2) formed on the substrate, and an electrode made of a metal such as Au, Al, and Cu etc. The resistive film is produced by an electron beam vapor deposition method employing an apparatus having a vacuum chamber wherein an evaporation source composed of Ti is irradiated with an electron beam to evaporate Ti so as to deposit a resultant TiO.sub.x on the substrate.

Abstract: Improved thin film resistors and electrical devices and circuits with thin film resistors are fabricated utilizing a chromium, silicon, and nitrogen compound formed preferably by rf reactive sputtering of chromium and silicon in a nitrogen bearing atmosphere. An annealing step is used to produce time-stable resistance values and in combination with variations in the partial pressure of nitrogen during sputter deposition to control the temperature coefficient of resistivity to have positive, negative or zero values.

Abstract: A planar heating unit comprises a base plate (1) having a surface electrically insulated by an insulation enamel layer (2a) or the like, a heating conductor (3) placed on the insulation surface of the base plate for generating Joule heat, and an enamel layer (4) fixing the heating conductor to the base plate (1) and covering the upper surface of the heating conductor.

Abstract: A semiconductor body comprises (100) silicon having a (100) plane and a [110] direction. A depression is formed in a first surface of the semiconductor body which is substantially parallel to the (100) plane. A slotted diaphragm is located over the depression and comprises a layer of thin film material and a resistance film. The depression is bounded at the first surface by four perpendicular boundary edges either in line with or perpendicular to the [110] direction. The slotted diaphragm has first and second slots having a first end located at a maximum width of the depression as measured along the line oriented at substantially 45 degrees to the [110] direction. Each of the first and second slots has a second end located so that each of the first and second slots extends only a portion of the distance across the maximum width of the depression as measured along the line oriented at substantially 45 degrees to the [110] direction.

Abstract: Radio frequency sputtering of silicon and chromium alloy targets in a nitrogen and argon atmosphere while applying an electrical bias to the substrate produces an electrically resitive thin film on said substrate.

Abstract: According to the invention, a microstrip microwave frequency attenuator comprises a distributed series resistance medium and distributed shunt resistance medium, wherein the shunt resistance medium is disposed parallel to the direction established for electric fields in the microstrip between the signal path and ground through the energy supporting medium. In the preferred embodiment, the series resistance path has a resistance value per unit length equal to about one-third of the resistance value per unit length compared to the shunt resistance path between the series resistance path and the ground plane.

Abstract: A hand wrapper for plastic film that thermally cuts a length of plastic wrapping film withdrawn from a supply roll includes an improved heat cutter that uses film resistors instead of a metal blade or a single heater wire for the cutting because the film resistors are not likely to break and they have low heat capacity which permits instantaneous cutting of the plastic film without requiring preheating which causes large power losses.

Abstract: A thermal printhead for a thermoprinter having an electrically insulating substrate on which resistors are placed that form impression points and current supply and current discharge leads bonded to the resistors. A structure is provided in this thermal printhead for forming a magnetic field which acts upon the resistors in the immediate proximity of the resistors and along the resistor print line. The magnetic field is directed such that when the current flows through the resistors, the current paths within the resistors are deflected upwardly into the upper part of the resistor to the outer surface thereof. This thermal printhead has the advantage that the single resistor impression points reach their highest temperature at the printing surface, that is, at the site where the single impression point must deliver the heat to the recording medium.

Abstract: A thermal recording head wherein the resistive heater portion thereof is shaped in an "hour glass" configuration in order to provide accurate control over the size and configuration of the melt produced thereby.

Abstract: A device for measuring the mass of a flowing medium. The apparatus includes a carrier, to which at least one temperature-dependent resistor layer is applied; on opposing sides this layer is partially overlapped by electrical conductive connecting layers having low electrical resistance and is joined to these layers in an electrically conductive manner. The temperature-dependent resistor layer and the connecting layers are covered with a thin glass layer, except for a respective contact section at each end. Securing sections bent at an angle in the form of claws, each belonging to one electrical connection, are joined in an electrically conductive manner to the contact sections, and the electrical connections are embodied on or joined to holder bodies.

Abstract: Thick film resistor composition which is a dispersion of (a) a conductive phase of a nonprecious metal pyrochlore and SnO.sub.2, (b) inorganic binder and (c) CoCrO.sub.4 and/or NiCrO.sub.4 in (d) organic medium. The metal chromate functions as a TCR driver.

Abstract: The invention is directed primarily to a method of doping tin oxide with Ta.sub.2 O.sub.5 and/or Nb.sub.2 O.sub.5 using pyrochlore-related compounds derived from the system SnO-SnO.sub.2 -Ta.sub.2 O.sub.5 -Nb.sub.2 O.sub.5 for use in thick film resistor compositions. The invention is also directed to thick film resistors containing the above-described pyrochlore-related compounds and to various compositions and methods for making such thick film resistors.

Abstract: Resistor composition comprising an admixture of finely divided particles of (a) ruthenium-based conductive material, (b) inorganic binder and (c) cobalt ruthenate.

Abstract: The present invention relates to a piezoresistive gauge. This gauge comprises a support, on which are formed two pairs of electrical contacts, partly covered with a piezoresistive element, made from an electricity-conducting organic compound, chosen from among the salts of tetramethyl-tetrathiofulvalene, quaternary ammonium salts of tetracyanoquinodimethane and diethyl-dimethyl-tetrathiofulvalene-tetracyanoquinodimethane (DEDMTTF-TCNQ).This gauge can be used for measuring pressures of approximately 500 bars to a few kbars.

Abstract: Method for producing a thin film resistor by vapor deposition or cathode sputtering techniques, wherein part of the resistance area of the film is covered by an electrically insulating layer which prevents oxygen diffusion onto the resistance material and causes a decrease of the resistance during aging, while the rest of the resistance area remains free.

Abstract: The process is for manufacturing an electric circuit which comprises an electric element for firing a pyrotechnic device, in which a sheet (1) made from an electrically resistant material is fixed to an electrically insulating support (3), and in which two conducting zones (12a, 12b) separated by an electrically resistant element (13) are then etched on this sheet.This process comprises the following steps:a fine nickel layer and then a fine copper layer are applied to the sheet (1), after which;a hole (7) is pierced through the assembly,a fine copper layer is deposited on the assembly, a protecting mask is deposited in the openings etched in the resistive sheet, a copper layer (10) then a tin-lead layer are deposited in the hole (7) and on both faces of the assembly,the protecting mask is removed and the fine copper layer which was protected by the mask is stripped by chemical action and,the external tin-lead layer is removed by chemical action.

Abstract: A resistor having of an insulating substrate bearing a thin layer of the alloy CrSi.sub.x, where 1.ltoreq.x.ltoreq.5 and which layer is doped with nitrogen. The doping may be spread homogeneously throughout the thickness or be concentrated in one or two thickness zones on the outside and/or on the side adjoining the substrate. As a result of the nitrogen doping an improvement of the stability of the resistor is obtained.

Abstract: A thick film temperature sensitive device and method of making the same, comprising the steps of applying to the surface of a substrate and firing a resistance material comprising a mixture of glass frit and particles containing palladium and iron. The mixture is fired in a non oxidizing, neutral, or reducing atmosphere at a temperature between 700.degree. C. and 1100.degree. C. at which the glass frit softens. When cooled, a device is provided with a glass film strongly bonded to the substrate and having dispersed therein conductive metal particles of an alloy of palladium and iron. The device provides a relatively high positive temperature coefficient of resistance, a relatively high resistivity, and a resistance to temperature characteristic which is highly linear, and can be processed by spiralling and terminated by the use of electroless plating.

Abstract: A composition for the preparation of thick film resistors comprising an admixture of finely divided particles of a conductive metal hexaboride and a crystallizable glass frit which is irreducible by the metal hexaboride containing at least 5 mole % of Ta.sub.2 O.sub.5 which is reducible by the metal hexaboride under normal firing conditions.

Abstract: A strain sensor includes an insulating resin, e.g. polyimide resin, film formed on a beam body having a strain generating section and a wiring layer having a resistance material, e.g. nickel-chrome, layer formed on the polyimide resin film and a gold layer selectively formed on the nickel-chrome layer. A solid powder, e.g. silicon dioxide, is mixed with the polyimide resin film.

Abstract: A novel construction for a thick film resistor is disclosed. A substrate has a first face deposited with a layer of resistive material. Between the substrate and this first layer is located a strip of conductive material. The strip of material is oriented at approximately right angles to the current path through the first layer, midway along the current path. A second layer of resistive material is located on a second face, parallel to the first face, and the first and second layers are connected electrically in series such that the current path through the second layer is orthogonal to the current path through the first layer.

Abstract: A resistance paste for the manufacture of a resistor body, for example, by silk-screening and the resistance body manufactured herewith, which paste comprises a mixture of Pb.sub.2 Rh.sub.x Ru.sub.2-x O.sub.7-y, a permanent binder and a temporary firable binder. In the formula 0.15.ltoreq.x.ltoreq.0.95 and 0.ltoreq.y.ltoreq.1/2. The resulting resistor body in the temperature range from -55.degree. to +150.degree. C. has a temperature coefficient of the resistance between -10.times.10.sup.-6 /.degree.C. and +10.times.10.sup.-6 /.degree.C. and is very stable. The resistance variation during the life of the resistor is smaller than .+-.0.5%.

Abstract: An electrical resistor and method of making the same is disclosed wherein a ceramic substrate is coated with a relatively rough dielectric film which is subsequently coated with a thin metal film such as nichrome.

Abstract: An improved polycrystalline silicon resistor having limited lateral diffusion, integrated circuits containing such resistors, and a method of their preparation is disclosed. The polysilicon resistor is formed by first doping the polysilicon layer with a p or n type impurity and thereafter neutralizing the treated layer with impurities of the other type so as to form a device wherein the concentration gradient between the resistor region of the aforesaid layer and its environment is low. The low concentration gradient reduces lateral diffusion during manufacture, thereby permitting manufacture of integrated circuits of higher circuit density and resistors with smaller dimensions, lower temperature coefficients and higher reliability.

Abstract: A moisture sensor comprises a moisture-sensitive layer formed from the oxide of highly resistive porous low density tantalum on a moisture-insensitive substrate. Between the substrate and the moisture-sensitive tantalum oxide layer there is a base electrode of an anodically oxidizable metal, preferably tantalum, of a density higher than the density of the low density tantalum from which the tantalum oxide layer is formed. A covering electrode partially covering the tantalum oxide layer has windows through which the water vapor containing medium can penetrate into the moisture-sensitive tantalum oxide layer. The inactive regions of the tantalum oxide layer disposed below the windows are removed to increase the rate of response.

Abstract: Improved medium and high value resistor inks are disclosed. The subject inks comprise indium oxide, a barium calcium borosilicate glass frit, a suitable organic vehicle and a temperature coefficient of resistance modifier selected from the group consisting of ferric oxide and vanadium oxide.

Abstract: Battery feed resistors are constituted by thick film resistors on a substrate, electrically in series with switching type positive temperature coefficient (PTC) resistors which are closely thermally coupled to the thick film resistors by being mounted on the substrate behind the thick film resistors or on insulating layers over the thick film resistors. Precise battery feed resistances and matching of pairs of battery feed resistors are achieved by trimming the thick film resistors. The PTC resistors prevent excessively high temperatures being reached in the event that external high voltages are applied to a telephone subscriber line to which the battery feed resistors are connected.