Abstract: A heater apparatus includes a substrate, a resistive film formed on a first portion of the substrate, and first and second conductive leads formed on the substrate engaging the resistive film. First and second electrodes are coupled to the first and second conductive leads, respectively. The heater apparatus also includes an overmolded body made of an insulating material formed on the substrate to encapsulate the resistive film, the first and second conductive leads, and a portion of the first and second electrodes in an insulating material. The substrate is formed to include first and second apertures in close proximity to the first and second conductive leads, respectively. The first and second electrodes each include a tab portion extending through the first and second apertures, respectively. The tab portions are deformed so that the tab portion of the first electrode engages the first conductive lead and the tab portion of the second electrode engages the second conductive lead.

Abstract: Electrical resistors and resistor networks are provided on an insulative substrate with designated conductive terminations by direct and continuous writing of resistive lines in fine-line patterns between and over each two of neighboring terminations from heterogeneous resistive thick film compositions. The resistive lines of line width w and total length l between conductive terminations can be directly written by suitable writing apparatus to have a high aspect ratio n=l/w, thereby providing resistors and resistor networks of high resistance values on an overall substrate area significantly smaller than required for conventional thick film resistors of comparable resistance value and comparable operational characteristics.

Abstract: Flow-through fluid heaters useful, e.g., for the preheating of exhaust gas streams prior to catalytic treatment thereof, are made by bonding an electrically conductive metallic film or foil to at least one pre-sintered flexible ceramic foil substrate to provide a flexible, electrically conductive ceramic/metallic heating element, that element then being formed into a crimped sheet or base sheet for incorporation into a honeycomb structure which includes a plurality of open channels extending from one surface of the structure to another surface of the structure, formed by one or more contacting combinations of crimped sheet and base sheet. Catalytic coatings may be applied to the preheaters to provide a heater/converter with very rapid light-off characteristics.

Abstract: A resistive element film-forming paste includes (1) an organic metal compound, (2) at least one organic non-metal additive, and (3) a solution of asphalt in a solvent. A resistive element is formed by coating the paste on a substrate followed by calcining.

Abstract: An integrated circuit device includes a first insulation layer formed on a substrate; a second insulation layer formed above the first insulation layer; a thin-film resistor formed on the second insulation layer; a third insulation layer in covering relation to the thin-film resistor and the second insulating layer; first contact holes penetrating the third insulation layer in association with the thin-film resistor; second contact holes penetrating through the second and third insulation layers; and conductive layers for electromagnetically shielding the thin-film resistor, the conductive layers including a first conductive layer formed between the first and second insulation layers below the thin-film resistor and a wiring layers formed above the thin-film resistor within the first and second contact holes.

Abstract: A telephone resistor combination and method, that is formed by a ceramic substrate having a resistive film on it, and pins on one edge of the substrate and connected to the film. A U-shaped cold region is provided on the substrate around at least much of the film, and is so constructed that application of common high overload voltages to the pins causes vertical fracture of the substrate. The resulting substrate pieces are held by the pins to the circuit board.

Abstract: There is provided an ink jet head which includes an electrothermal converting body disposed along a pathway of ink, said electrothermal converting body being provided with a heat generating resistor capable of generating, upon energization, heat energy to be directly applied to ink on a heat acting face whereby discharging said ink, characterized in that said heat generating resistor is composed of a material containing at least Ir and other one specific element at the specific respective composition rates or a material containing at least Ir and other two specific elements at the specific respective composition rates, said heat generating resistor constituted by any of said materials being capable of exhibiting a sufficient durability even in the case of driving the ink jet head with a relatively long drive pulse duration.

Abstract: A method of fabricating a thin film resistor includes a step of sputter depositing a thin film of resistive material such as a chromium diboride compound on an insulative substrate using an argon sputter gas having a percentage of dopant such as nitrogen selected to optimize a trade off between desirably increasing the thickness of the film and undesirably increasing the temperature coefficient of resistance. A cap layer having a solid diffusant such as free chromium is deposited over the thin film of resistive material. The cap layer serves to protect the thin film of resistive material during subsequent patterning of conductors using wet etching, and also the solid diffusant diffuses into the resistive material during subsequent thermal treatment to drive the temperature coefficient of resistance back down.

Abstract: Thick film resistor ink compositions and a method for formulating and processing such inks are provided for producing thick film resistors having highly repeatable and stable resistance characteristics. The inks are specifically formulated to produce resistors whose resistivities are determined in part by the sintering temperature employed in the processing of the resistors. The processing of the inks involves using infrared radiation techniques to rapidly sinter the inks at highly controllable temperatures, so as to enable the resistance of a resistor to be predictably altered by the sintering operation, such that in-process adjustments can be made to the processing method. Thick film resistors produced in accordance with this invention are characterized by high stability to environmental influences and low TCR values on the order of about .+-.50 ppm/.degree.C.

Abstract: In an oxygen sensor of the type having an oxygen ion conductive tube of solid electrolyte, a ceramic heater disposed within the oxygen ion conductive tube for heating the same is in the form of a quadrangular prism or a bar of a rectangular cross section. The ceramic heater is formed by piling up ceramic green sheets with metallic thick-film patterns for heat generating resistors interposed between adjacent two of the ceramic green sheets. The ceramic heater is so shaped as to satisfy the relation of b/a=0.75.about.1 where "a" is the width and "b" is the thickness of the ceramic heater. The metallic thick films, which the metallic thick-film patterns are turned to by firing, are arranged so as to be parallel to the side surfaces opposed in the thickness direction of the ceramic heater.

Abstract: An electronic probe circuit having ac and dc amplifiers and an input compensation subcircuit is enclosed within a trim housing that replicates the electrical effect of the probe housing. The circuit is laser trimmed through ports in the trim housing. The difference between the voltage at 80 nsec and 1.4 .mu.sec points on a step voltage provides a first calibration factor while the difference between the 3 nsec voltage and the 80 nsec voltage provides a second calibration factor. A resistor in the DC amplifier is trimmed to an absolute voltage with a step scan laser cut. A resistor in the AC amplifier is trimmed with a laser L-cut until the difference between the 80 nsec and 1.4 .mu.sec points of the step voltage equals the first calibration factor. A capacitor in the input compensation subcircuit is trimmed until the voltage difference between the 3 nsec and 80 nsec points equals the second calibration factor.

Abstract: An improved temperature sensor is designed for the sensitive detection of temperature changes. The temperature sensor includes a frame 9 of monocrystalline silicon and a dielectric diaphragm 13 stretched on it. A monocrystalline silicon structure 35 is disposed on or under the dielectric diaphragm which is used for measuring the temperature. In the course of this, the Seebeck effect, as well as the temperature dependence of the electrical resistance, can be used for detection of any temperature changes.

Abstract: An embodiment of the present invention relates to a semiconductor wafer structure, the wafer structure comprising: a semiconductor substrate; a plurality of temperature sensing elements (12) disposed over the semiconductor substrate, where temperature sensing elements (12) are fabricated so that an electrical characteristic of the temperature sensing element changes as the temperature of the wafer changes; and a plurality of interconnection lines (10, 14) connecting the temperature sensing elements (12) to external devices. In addition the semiconductor wafer structure includes a passivation layer which is deposited over the semiconductor substrate and the temperature sensing elements. The temperature sensing elements are comprised of a refractory conductor, the refractory conductor has a temperature dependent electrical resistivity and has a width much less than its length.

Abstract: A vehicle fan motor controller includes a simple planar ceramic base providing a plurality of printed resistors. The resistors include electrically conductive paths printed on the ceramic overcoated with a thick resistive film. The thick film substantially covers the base to promote heat transfer to air moving in the fan duct in which the controller is placed. The thick film resistors are on both sides of the base to reduce overall size and improve heat transfer. A thermal fuse comprising a spring metal member held in a normally closed position by a meltable material opens in response to a predetermined high temperature.

Abstract: A fuse resistor protects a circuit from a surge, an overcurrent from an unexpected connection, or the like. When a continuous overvoltage higher than a predetermined value is applied to the circuit, the heat from a heat-generating resistant film fractures an insulating substrate of the fuse resistor to open the circuit. Changing the minimum current to which the fuse resistor responds, by modifying a cutout or notch on the substrate, makes it possible to use the fuse resistor anywhere in the circuit. A discharging-type surge absorbing element with a security mechanism that includes the fuse resistor can thus provide protection against a surge or a continuous overcurrent that is more than the rated value of the fuse resistor.

Abstract: The temperature adjustable coating and medium and method for providing an electrically-resistant temperature-adjustable article and structure. The coating provides a continuous electrically-conductive electrically-resistive path for the application of electrical current to the coating. The electrically-resistant temperature-adjustable article consists of a surface on which a high-temperature conductive-resistive coating is bound. The surface temperature of the article along the path is thereby adjustable between ambient and 2000.degree. F. in response to electric current applied to it without oxidization destroying the electrical conductivity of the medium in temperatures above 600.degree. F. The medium possesses the high-temperature conductive-resistive quality of the coating while maintaining a clay consistency capable of being formed into various shapes without a substrate.

Abstract: To provide a chip resistor with small variation of ESD required when in automobile use, a chip resistor containing(1) insulating substrate,(2) a pair of terminations disposed over said substrate,(3) resistor layer of thick film resistor composition comprising a mixture of finely divided of conductive component and glass binder,wherein said resistor layer being disposed and patterned on the surface of said substrate by printing and firing to form continuous conductive path comprising divided sections connecting to each of said termination, and divided section angled in its longitudinal direction from the direction of current flow in said respective 4 sections connected to said terminations being insulated and separated from one another by underlaying substrata resulting into considerably longer resistor geometry than distance between said terminations.

Abstract: A heater apparatus includes an electrically insulative base plate and a plurality of independent resistors, extending along a length of the base plate, for producing heat upon electric energization thereof. A temperature detecting element detects a temperature of the base plate, and a controller controls a supply of electric power to the plurality of independent resistors so that the temperature detected by the detecting element approaches a predetermined temperature. A selecting device selects at least one of the resistors to be energized to change a resultant resistance of the selected resistors in accordance with an output of the detecting element.

Abstract: A monolithic integrated circuit power sensor provides a monolithic integrated circuit substrate a conversion element formed either on or in the substrate for converting microwave energy into heat, an electrically insulating dielectric layer affixed to the conversion element, and an integrated circuit, heat sensitive element formed in sufficiently close proximity to the conversion element to be thermally coupled thereto through the dielectric layer for sensing temperature changes in the conversion element.

Abstract: Film resistors, for example, thin film thermistors having a negative temperature coefficient (NTCR) or near-zero TCR electronics resistors, are formed of an alloy of both an electrically insulating oxide and an electrically conducting nitride of at least one metal selected from titanium, tantalum, zirconium, hafnium and niobium. The electrically insulating oxide of the at least one metal is preferably present in the film sufficient to impart a negative temperature coefficient of resistance to thermistors which include the film as a component part. Preferably, the metal is reactive with both an oxygen-containing gas and nitrogen and is deposited onto a substrate by reactive sputtering in the presence of an inert gas (e.g., argon). By controlling the volume ratio of the reactive gasses (e.g.

Abstract: A hybrid resistance card (R-Card) is manufactured using a two-step process wherein an electrically conductive ink layer and an electrically resistive ink layer are printed onto a surface, which may be either a substrate or the part on which the R-Card is to be used. The conductive ink layer is selectively applied in a pattern of shapes to electrically short out portions of the resistive ink layer, thereby permitting the R-Card to have a predetermined resistive taper across its width according to a desired resistivity curve. The resistive ink layer comprises grid-like lines bordering and separating the conductive shapes. The resistive taper is substantially continuous along the length of the R-Card, at least linearly, though if the card is designed to cover an entire part, it is substantially continuous along a plurality of directions on the card, with the tapers being designed to round into one another.

Abstract: Thin or thick film resistor devices (e.g., electronic resistors and thermistors) are trimmable without disturbing the active resistor film or necessarily requiring temperature control during trimming by providing a plurality of electrically conductive fingers having one end integral with one of the electrodes and a terminal end which extends at least substantially across the cross-wise dimension of the resistance film. The electrode fingers thereby electrically bridge a respective surface region of the substrate on which the electrodes and film are disposed. One or more of these fingers may thus be severed from the electrodes at the bridged respective surface region of the substrate so that the resistance value of the device can be controllably selected.

Abstract: A balancing resistor and thermistor network for telephone circuits, and combination with an external relay, which reliably handles all three levels of adverse conditions, automatically resets under certain conditions, is physically small in size, and is strong. It is a flat ceramic substrate on both surfaces of which are screen-printed thick-film balancing resistor films. Also screen-printed on both surfaces are termination traces having portions so located that when the substrate substantially instantaneously fractures it reliably and substantially instantaneously breaks the circuits through the resistive films, the fracture occurring in response to a sudden high-voltage overload. Accordingly, there is no damage to, or melting or burning of, small wires in the telephone circuits at points near to or remote from the balancing resistor network. A thermistor film is screen-printed directly onto the substrate at a central region where there is no resistive film.

Abstract: The material to be used in a semiconductor resistor is produced by successively depositing multiple layers of substantially intrinsic polycrystalline semiconductor material. The deposition process is stopped between layers to create an interruption of the polycrystalline structure of the semiconductor material. This interruption reduces the modulation experienced by the resistor when it is located above an underlying conductor in a semiconductor circuit. Such a configuration typically exists in a memory cell where the load resistor of a field-effect transistor is located over the gate of the transistor.

Abstract: A chip-type ceramic element contains a terminal electrode at each end and an inorganic insulating layer on the surface of the ceramic element between the electrodes. The terminal electrodes include a baked electrode formed from a conductive paste reacted with the material of the inorganic insulating layer. Layers of nickel and tin are plated on the baked electrode for improved heat resistance and soldering adhesion, respectively. The insulating layer prevents unwanted portions of the terminal electrodes from coming into contact with the ceramic element, thereby preventing dispersion in the resistance values of the element.

Abstract: A resistor bank consisting of a group of resistors formed on the surface of die, all electrically connected together in parallel. All of the resistors have identical individual resistances, but each has a unique energy dissipating capacity. When an event subjects the resistor bank to a surge of current, some of the resistors blow out, thereby changing the resistance of the bank. By measuring the resistance of the bank before and after an event the energy of the surge can be determined.

Abstract: A high pressure discharge lamp having a thick film resistor comprising a plurality of resistive elements. A first resistive element is included in a starting circuit for the lamp and a second resistive element is in series with the arc tube during lamp operation for flicker elimination. The integral thick film resistor facilitates mounting and connection of the resistor elements within the lamp envelope. Favorably, the resistor substrate has a surface emissivity of greater than about 0.5, and preferably greater than about 0.9, to provide sufficient radiation cooling within an evacuated outer lamp envelope to prevent resistor failure while keeping the size of the resistor small enough for use as a component in an HID lamp. Additionally, a suitable coating of low vapor pressure thickness covers the solder connecting the metallic resistor terminals to the substrate to prevent evaporation of the solder and its deposition on the inner surface of the outer lamp envelope.

Abstract: A heater for a sheet material comprises an insulating substrate and a main resistor strip formed on the substrate. The substrate is further formed with auxiliary resistor strips adjacent to both ends of the main resistor strip. In operation, the main and auxiliary resistor strips are actuated simultaneously for heat generation. As a result, the additional heat generated by the auxiliary resistor strips compensates for higher heat dissipation at both ends of the heater, thereby equalizing the temperature distribution longitudinally of the heater.

Abstract: The power resistor has a metal housing and heatsink, the bottom wall of which is planar and has a bolt hole therethrough for tight securing of the resistor to a chassis. A planar film-type power resistor is mounted in the housing and encapsulated therein, being held close to the bottom wall of the housing. Heat from the film-type resistor passes through the bottom wall into the chassis, the result being that the power rating of the resistor is high. The metal housing is die-cast of a zinc alloy, at extremely low cost yet with substantially the same heat-transmission characteristic as that of conventional die-castable aluminum alloys.

Abstract: An improved blower motor speed control resistor array in which the resistor elements are defined by multiple optimally sized patches of resistive ink deposited onto opposite sides of a thin flat ceramic substrate. The array comprises three resistive patches connected in series via fusing elements to provide three reduced blower motor speeds MH, M and L. The thin ceramic substrate is flat on both of its faces, and each face comprises a terminal region for attachment of the resistive patches to the terminal elements, and a resistor region for deposition of the three resistive patches. The resistive patch of lowest resistivity (the MH resistor) is deposited on the entire resistor region of a first side of the substrate. The resistor patches of intermediate and highest resistivity (the M and L resistors, respectively) share the resistor region of the other side of the substrate in relation proportion to their respective resistivities.

Abstract: A radiant heater in the form of an overlay for an incubator hood. The heater has an optically transparent, radiotransparent and phototherapy transparent electrically conductive coating, preferably indium tin oxide, and includes appropriate retaining hook structure for retaining the heater on an incubator hood.

Abstract: This invention relates to a voltage pulse controlled variable resistor in which at least 2 leads are placed in direct contact with a material containing silica derived from hydrogen silsesquioxane. The resistor is formed by depositing a silica film derived from hydrogen silsesquioxane resin between at least two electrodes. The resistance of the component is varied by applying voltage pulses to the leads.

Abstract: A layer of ceramic material such as alumina is plasma-deposited on a sheet member such as molybdenum or a composite laminate of molybdenum and graphite or other material of low thermal expansion to form a circuit unit substrate having a thick, adherent, electrically-insulating coating on a light, rigid and thermally-conducting base. Thick and thin film materials are deposited and fired on the insulating coating to provide conductors, insulators or resistors or the like in a circuit unit. The materials of the sheet member and of the insulating coating are selected to have matching thermal expansion coefficients so that the substrate remains flat and free of bowing during the firing of the thick and thin film materials. The plasma-deposited electrically-insulating layer is sealed to prevent moisture absorption during use.

Abstract: The present invention relates to a resistance unit for controlling a motor speed of driving a blower of an automobile air conditioner. The resistance unit includes a resistance circuit board printing a plurality of resistors in the form of double layers on both sides thereof, a supporting plate for mounting the board and a plurality of lead frames each of which is electrically connected to a corresponding terminal of the resistors, and a socket, combined with the supporting plate, taking a part of each lead frame therein.

Abstract: A thick film resistive element superior in moisture resistance characteristic is provided, which includes a pair of film-like conductors formed on an insulating substrate, a film-like resistor formed on the substrate so as to be partially laminated on the electrode portions of the pair of conductors thereby covering the surfaces of the electrode portions, and a first covering member formed of a material containing a crystal glass as a main ingredient thereof which covers the other portions of the pair of conductors than said electrode portions. As a result, there does not exist such an area that is covered with a porous amorphous glass film only, so that even if a protection film of an organic resin is not provided, there is no possibility that the moisture in the application environment affects on the conductors to degrade the insulation resistance therebetween.

Abstract: A blower motor speed control resistor array in which the resistor elements contain an electrically conductive plastic material which melts to limit the blower motor current in the event of an extreme temperature condition. The conductive plastic is insert molded on a terminal array to form a self-supporting structure adapted to be disposed in an air duct. Each resistor of the array is defined by a number of legs of electrically conductive plastic extending between a pair of parallel headers, in the manner of a picket fence.

Abstract: An apparatus and method by which a flat film-type resistor is intentionally caused to thermal-shock fracture in response to a predetermined high-voltage overload condition. A stressed spring wire is mounted on such film-type resistor and connected in circuit with it. A predetermined solder and temperature gradient are employed to hold the spring wire in bent condition until the solder melts, whereupon the spring flexes and the circuit breaks. Heatsink portions are provided in the circuit board for such resistor, and receive terminal pins thereof.

Abstract: Resistor composition to produce thick film resistors, preferably the resistor films in sensors for temperature measurement, includes glass frit and an oxide which is at least one of CaCu.sub.3 Ru.sub.4 O.sub.12 and LaCu.sub.3 Ru.sub.4 O.sub.12.

Abstract: Electrodeposited planar resistive layers are disclosed, which may be combined with conductive layers and insulative layers to produce laminates useful in the preparation of printed circuit boards. The resistive layers are prepared by electroplating from an electroplating bath containing a source of a normally conductive metal component and a source of a non-metallic resistance increasing additive. Planar resistors may be produced which have sheet resistances in the range of from about 15 to about 1000 .OMEGA. per square.

Abstract: This is to introduce a strain sensor of high quality and excellent durability. This strain sensor is composed of a basic metal body, a crystallized glass layer formed over the surface of the basic metal body, and a resistance element that changes its resistance value by strain changes and is built on the glass layer surface. By this structure, where the crystallized glass layer fired at a high temperature is employed, both of the composition, the basic metal body and the glass layer, are fused with each other at the boundary plane, making their adhesion very strong. No peeling between the basic metal body and the glass layer will take place even under the severe environmental conditions such as high temperature and heavy load.

Abstract: A semiconductor processing method of forming a resistor device includes, a) providing a layer of conductively doped polysilicon atop a substrate to a selected thickness, the layer of polysilicon having an upper surface and a base, the layer of polysilicon having grain boundaries therewithin which extend from the upper surface to the base and define polysilicon grains; b) oxidizing the polysilicon layer at a temperature from about 850.degree. C. to about 1050.degree. C. for a selected period of time to form SiO.sub.x within the polysilicon layer along the grain boundaries and down to the base to separate individual grains of polysilicon within the layer; and c) patterning the oxidized polysilicon layer to form a resistor device within an integrated circuit.

Abstract: A thin film resistor having a characteristic that an increase phenomenon of a resistance controlled at a high temperature is generated. The resistor is obtained by controlling its composition and manufacturing method so as to suppress an increase in the resistance of a Cr-Si resistor thin film due to deposition of chromium silicide at a high temperature. A sputtering target, which is used as a raw material for forming the thin film, is made from chromium silicide and silicon so that some chromium silicide is already formed immediately after deposition, and chromium oxide and silicon oxide are contained in the thin film so as to suppress the speed whereat chromium and silicon, which do not form silicide, form silicide by heating after deposition and to allow the above silicide formation to advance slowly.

Abstract: A process of fabricating an electrical resistor and a product produced thereby in which trimming of a resistive element of a material exhibiting thermosetting properties is accomplished by in-situ annealing of one or more regions across the width of the resistive element to certain predetermined temperatures, thereby altering the crystal properties and the sheet resistance within those regions. Annealing is preferably done by laser radiation at levels below that at which any cutting or ablation of the resistive element will occur, thus avoiding defects in the resistor or associated circuits. By controlling laser radiation and the annealing process, virtually any desired trim slope may be obtained, resulting in improved trimming accuracy. Efficiency of the process is enhanced by annealing the resistive element to obtain compound trim slopes corresponding to coarse and fine trimming of the resistive element.

Abstract: In an electronic circuit device, a thin film resistor is formed on a substrate and includes first regions including one kind of atom such as Cr and exhibiting an electric conductivity and a second region including a compound such as SiO.sub.2 composed of two kinds of atoms and exhibiting an insulating property. In the thin film resistor, the first regions are scattered in the second region and have an average particle size of 2 nm to 20 nm.

Abstract: A thin-film thermistor element which has an electrically insulating substrate having first and second surfaces opposite to each other and also having a pair of through-holes defined therein so as to extend completely across the thickness thereof, and a pair of electrode films each including a body portion of large surface area and a generally comb-shaped portion continued outwardly from the body portion. The electrode films are formed by the use of a firing process on the first surface of the substrate with the respective comb-shaped portions thereof confronting with each other. First and second electroconductive films are also formed on respective surrounding wall faces defining the corresponding through-holes in the substrate in electrically connected relationship with the body portions of the associated electrode films. A temperature sensitive resistance film is formed by the use of a high frequency sputtering process on the first surface of the substrate so as to overlay the electrode films.

Abstract: An ink jet recording head comprises a discharging opening for liquid discharge and an electricity-heat convertor. The electricity-heat convertor has a region formed by oxidation of at least part of an electroconductive material, and the region is adapted to generate heat.

Abstract: A method is disclosed for producing superior optically clear laminates having a sheet of semi-rigid material encapsulated in a thermoplastic interlayer between layers of rigid material such as glass. Pre-cooled laminate elements are assembled at reduced temperature, allowing positioning of the sheet of semi-rigid material in the interlayer of the assembly with minimal wrinkling, formation of air bubbles or entrapment of moisture. Thereafter, the laminate assembly is maintained under vacuum for an extended period of time, substantially eliminating wrinkling, air bubbles and moisture from between the laminate elements as well as pre-forming the semi-rigid sheet. Bonding heat and pressure is then applied, first heating the assembly to "tack" the laminate elements together, and next applying heat and pressure for bonding the laminate elements.

Abstract: An intermediate product is provided and includes a substrate having at least one thick-film circuit formed thereon. An outer surface of a first portion of the thick-film circuit is coated with a readily removable protective material such as ethyl cellulose to protect the first portion from hot-slag substrate material generated during a laser scribing operation. The substrate also includes at least one uncoated portion which can be laser scribed for separation of the thick-film circuit from the remainder of the substrate. After laster scribing, the protective material is removed to permit visual inspection of the thick-film circuit.

Abstract: A resistor element for determining a parameter, including a planar ceramic substrate having a bearing surface and at least one aperture formed through the thickness thereof, an electrically resistive metallic layer which is substantially formed on the bearing surface of the ceramic substrate and has at least one extension which covers an inner wall surface of the above-indicated at least one aperture, a pair of conductors for connecting the resistive metallic layer to an external circuit, at least one of the pair of conductors being inserted into a corresponding one of the above-indicated at least one aperture of the ceramic substrate, and an electrically conductive adhesive at least partially filling each of the above-indicated at least one aperture, for securing an end portion of the corresponding one of the pair of conductors to the ceramic substrate, the electrically conductive adhesive electrically connecting the above-indicated at least one conductor to the above-indicated at least one extension of the

Abstract: The invention relates to a temperature sensor with platinum of temperature-sensitive material, and a process for the production of such a temperature sensor. The problem of the invention is to provide a miniaturized temperature sensor as small as possible which can be used at temperatures of 600.degree. C. to over 1,000.degree. C. For solution, the invention proposes a temperature sensor in which the layer contains finely divided metal platinum in oxide ceramic. Production takes place by mixing together platinum powder, oxide and binder, and after supplying the layer on the support substratum, tempering with this latter.