Abstract: A trimmed resistor is provided which has no directional feature when used and is easily mounted on a printed base board. In the trimmed resistor, there are formed four external electrodes arranged at peripheral portions of a rectangular insulation base plate in a point symmetrical distribution about a center of the insulation base plate, a film-like resistance body connected with all of the external electrodes, and a protective film covering the film-like resistance body. Two electrodes among the above-mentioned four electrodes are used as resistor terminals, and a cut slit for trimming is formed in the resistance body longitudinally or as starting from a side of the electrodes serving as resistor terminals.

Abstract: A PTC resistive strip is mounted on a wall of a washer tub. Water in the tub carries away heat from the energized strip thereby reducing its resistance. The water level in the tub is measured by measuring the voltage drop across the strip. The resistance of the strip can be compared to the resistance across a variable resistance or resistor to indicate that the water has reached a desired level. A comparator output can be used to control the water level and washer motor operation via a control circuit which operates the water supply valves and motor switch. A second PTC resistive element is also provided for sensing overfill.

Abstract: A flat resistance for a blower control unit of an automobile air conditioner, and a blower control unit using the same. The flat resistance includes: a porcelain enameled metallic substrate including a flat head portion, having an edge and one surface, and parallel terminal supporting portions projecting outwardly from the edge of the head; a resistance circuit printed on the one surface of the head portion, the resistance circuit including a plurality of resistances electrically connected in series; a temperature fuse, interposed in the resistance circuit, for being tripped to break the resistance circuit when the porcelain enameled metallic substrate becomes overheated; and terminals, printed on both the head portion and the terminal supporting portions, each terminal being connected to one end of a corresponding one of the resistances.

Abstract: A resistor comprises iridium and at least one metal selected from the group consisting of silicon, bismuth, lead, tin, aluminum, boron, titanium, zirconium, calcium and barium. A process for producing the resistor comprises the steps of coating a solution of an iridium containing organometallic material onto a substrate and subsequently firing the coated solution. The resistor is used as a heating resistor of a thermal head.

Abstract: An end terminated high power chip resistor-printed circuit board assembly (9) suitable for use in applications requiring miniature surface mount resistors capable of high power dissipation. An end terminated high power chip resistor (8) is constructed by coating a portion of the bottom of an end terminated chip resistor with a conductive plate (12). The end terminated high power chip resistor (8) is mounted to a printed circuit board having at least one via (23) lined with metal (20) wherein the conductive plate (12) is positioned above the via (23) lined with metal (20). A heat sink (16) is mounted to the printed circuit board opposite to the side to which the end terminated high power chip resistor (8) is mounted and is in contact with the metal (20) lining via (23).

Abstract: In a thick film water track, irrespective of track thickness or the material of which the track is constructed, the optimum track width is found to be in the range of from 1.2 mm to 2.1 mm. Further, for a given resistance, the track is longer and may be conformed to a pattern to give improved temperature distribution. Additionally disclosed is a heating element having a number of thick film electrically resistive tracks applied to the surface of an electrically insulative substrate and a switch for selectively connecting one or more of the tracks to a power supply. The resistance and hence the operating temperature of the heating element may be varied by changing the track or tracks connected to the switch.

Abstract: Via resistor structures in a hybrid multilayer circuit having a plurality of insulating layers. One via resistor structure includes a plurality of resistive via fills in vias in respective adjacent insulating layers, a plurality of conductive elements for electrically contacting predetermined tops and bottoms of the resistive via fills, and conductive via fills for providing external electrical connection to selected ones of the conductive elements at locations on the outside the unitized multilayer circuit structure. A further via resistor structure includes a resistive via fill formed in a via in one of the insulating layers, and one or more thermally conductive via fills for thermally conducting heat from said resistive via fill to the outside of the unitized multilayer circuit structure.

Abstract: A high pressure discharge lamp having a thick film resistor comprising a plurality of resistive elements. A first resistive element is included in a starting circuit for the lamp and a second resistive element is in series with the arc tube during lamp operation for flicker elimination. The integral thick film resistor facilitates mounting and connection of the resistor elements within the lamp envelope.

Abstract: A thin high temperature heater includes an adhesive layer of Ti disposed an insulating substrate and a resistor layer of a Ti compound disposed the adhesive layer.

Abstract: An ink jet head is provided which includes an electrothermal converting body having a heat generating registor which generates, upon energization, heat energy to be directly applied to ink on a heat acting face to discharge the ink. The ink jet head is characterized in that the heat generating resistor is formed from a non-single crystalline substance substantially composed of Ir, Ta and Al and containing the Ir, Ta and Al at the following respective composition rates:28 atom percent.ltoreq.Ir.ltoreq.90 atom percent,5 atom percent.ltoreq.Ta.ltoreq.65 atom percent, and1 atom percent.ltoreq.Al.ltoreq.45 atom percent.

Abstract: An ink jet head is provided which includes an electrothermal converting body having a heat generating resistor which generates, upon energization, heat energy to be directly applied to ink on a heat acting face to discharge the ink. The ink jet head is characterized in that the heat generating resistor is formed from a non-single crystalline substance substantially composed of Ir and Ta and containing the Ir and Ta at the following respective composition rates:35 atom percent .ltoreq.Ir.ltoreq.77 atom percent, and23 atom percent .ltoreq.Ta.ltoreq.65 atom percent.

Abstract: R.F. sputtered nickel in silica films containing 64 to 70 atomic percent nickel are employed as electrical resistance elements in a resistance thermometer for measuring temperatures of 50.degree. K and less.

Abstract: A digitizer screen and method of making. A coated conductive plastic film is perforated and is used in conjunction with a glass or other panel to provide a screen which may be used in an electronic digitizer for converting the position and movement of a stylus or other device on the screen to electrical signals representative of such positioning and movement. The perforated coated conductive plastic film may be laminated to the glass panel to form an integrated structure which does not require the use of masking and etching or similar processes to produce a desired apertured matrix pattern in the plastic film. Various arrangements of the plastic film are disclosed which facilitate the connection of the apertured portion of the plastic film to associated electronic components.

Abstract: A superconductive magneto-resistive device includes superconductive ceramic films having a magneto-resistive effect. In the superconductive magneto-resistive device, the superconductive ceramic films are laminated one by one, and the adjacent superconductive ceramic films are insulated by each electrical insulation film, respectively, except for one portion of each of the adjacent superconductive ceramic films, resulting in that the superconductive ceramic films are connected in series. Furthermore, a pair of electrodes is arranged on the upper-most and lower-most superconductive ceramic films.

Abstract: In an electronic circuit that normally includes a high-value resistor, the resistive function may be usefully provided by a thin dielectric layer. Electric current is transported through the layer by quantum tunneling. In one embodiment, a resistor useful for VLSI applications is provided, requiring only a single contact window.

Abstract: A resistor film formed by applying onto a substrate a homogeneous mixture solution of metal organic compounds including metals selected from the element group of silicon (Si), bismuth (Bi), lead (Pb), aluminum (Al), zirconium (Zr), calcium (Ca), tin (Sn), boron (B), titanium (Ti), barium (Ba), and the like, and a metal selected from the group of iridium (Ir) and ruthenium (Ru) and burning the homogeneous mixture solution. The homogeneous mixture solution is burned at a temperature of 700.degree. C. or more in an atmosphere of oxygen.

Abstract: A radiant heater is provided, which can be in the form of an overlay on an existing incubator hood or integrated in an incubator hood. The heater has an optically transparent, radiotransparent and phototherapy transparent electrically conductive coating, preferably indium tin oxide.

Abstract: A high temperature low density operating element includes a porous high temperature operating element film formed into a predetermined configuration and disposed on one surface of an insulating member with good heat conductivity, a resistive film with a high melting point and good heat conductivity having a higher density than the high temperature operating element film, formed into a predetermined configuration on a second surface of the insulating member with good heat conductivity, a lead wire connected to the resistive film, an insulating protective film disposed on the insulating member covering the resistive film.

Abstract: The chip form electrical resistance is designed to be soldered notably on a printed circuit card or on an hybrid circuit substratum. It includes an electrically insulating substratum (1) of the ceramic type, to which is attached by a layer of adhesive organic resin (2) a sheet of metal or of resistive alloy (3) which is engraved to provide a sinuous resistance. The layer of resin (6) leaves in the area of the two opposite sides of the substratum (1), two free areas (5), at the extremities of the engraved resistive sheet (3).

Abstract: A sliding electric part includes a set of two sliding members, wherein one of the sliding members is composed of a diamond substrate with an electric conductive portion formed by ion implanation or by the deposition of boron-doped p-type diamond on the sliding surface which slides along the other sliding member, and the other sliding member has an electric conductive portion formed on the sliding surface which slides along the one sliding member.

Abstract: A detection element including a cylindrical base body, an electric resistor formed on an outer peripheral surface of the base body, and lead wires attached to ends of the base body. The lead wires are electrically connected to the electric resistor. An electrically thick film is provided over end faces of the base body, an inner peripheral surface and an outer peripheral surface of the base body near each of the opposite ends of the base body, and the lead wires are electrically connected to the resistor at least through the electrically conductive thick film.

Abstract: A planar film resistor is trimmable by a laser beam. A pair of electrodes are spaced apart on a substrate and make contact with a film of resistive material disposed therebetween. The resistive material includes a laser produced trim region disposed internally to all boundaries of the resistive material, and extends through the thickness of said film. The trim region has an elongated dimension which is orthogonal to the most direct current path between the electrodes. In a preferred embodiment, the resistive material is covered by a passivating layer and is trimmed after the passivating layer is in place.

Abstract: A substrate for an ink jet recording head comprises a support and an electrothermal transducer provided on said support and comprising a heat-generating resistor member and electrodes electrically connected to said heat-generating resistor member, wherein said heat-generating resistor member is comprised of a complex compound comprising a metal boride, silicon and nitrogen.

Abstract: A resistor device includes a thick-film resistor which includes a mixture of electrical conductive material and glass, and which has the electrical conductive material at a surface portion exposed; and electrodes which are deposited on the thick-film resistor to be connected to the exposed electrical conductive material.

Abstract: First terminals are equally spaced on a substantially uniformly resistive thin film at or near a first side edge of the film at progressive positions downwardly from the top of the film. Near the bottom of the film, second terminals are preferably equally spaced progressively inwardly from the first side edge of the film. An energizing potential is applied to the film either at the corner defined by the top and the first side edge of the film or in a curved pattern of positions near such corner. A reference potential (e.g. ground) is applied to the film near the otherside of the film and near the bottom edge of the film. Voltages are thus produced at the successive ones of the first terminals with an exponential relationship with respect to such terminal positions and at the successive ones of the second terminals with a linear relationship with respect to such terminal positions. The disposition of the second terminals may be compensated for deviations in a logarithmic response in an output member (e.g.

Abstract: This application discloses a novel method to integrate thermal drop on demand ink jet devices and related pulse driver circuitry for chips used in thermal ink jet printers. This integrated printhead chip is made by first fabricating on the substrate the driver pulse circuitry through the last level of metallization. Once complete, a low temperature (<400 C.) CVD oxide is deposited and planarized. It is of sufficient thickness (3 to 4 microns) to insure a good thermal barrier between the pulse circuitry and the thermal inkjet devices. After planarization, the resistor material is deposited and patterned. Openings are then patterned to the inputs and outputs of the pulse driver circuitry. Aluminum copper metallurgy is deposited and patterned to connect the resistor to the pulse driver output and define the heater resistor areas. Inorganic and organic barrier layers are applied and patterned to protect the resistor material and interconnecting metallurgy from the corrosive effects of the ink.

Abstract: A thin film resistor and method of making employs tungsten or tungsten titanium alloy as an alectrically conductive diffusion barrier between the nickel chromium resistor and the gold conductor. A solution of cupric sulfate, ammonium hydroxide, glycerol and deionized water is used to remove the unwanted diffusion barrier without damaging the thin film resistor materials, thereby preserving precision resistance values.

Abstract: A relatively large dimensioned sputter coated resistive laminate providing uniform laminate dimensions and resistance tolerances over the surface area thereof and a method for making the laminate from a foil, including a platten support step and a sputter etching or cleaning step. The laminate comprises a sputter coated metal foil which is isostatically bonded to an insulative, epoxy resin substrate. In a preferred construction a nickel-chrome-aluminum-silicon resistive layer is applied to a copper foil.

Abstract: A method of forming an electrical heating element in the form of an electrically non-conductive supporting body onto which an electrically resistive material is deposited, the method comprising the steps of preparing a dry metal powder of irregularly shaped metal particles of widely varying sizes, in the range 20-150 microns, roughening the surface of a supporting body onto which a heating element is to be formed, pre-heating said surface of the supporting body to a temperature within the range of 150.degree.-250.degree. C. and flame spraying the dry metal powder onto said heated surface of the supporting body in a plurality of passes over the supporting body. The effective resistivity of the flame sprayed deposit is predetermined by adjusting the amount of oxidation on the surfaces of the metallic particles sprayed onto the supporting body.

Abstract: A low-resistance nickel-chromium-based thin film resistor and method for forming same. A nickel-chromium alloy film is coated on at least one side with a layer of gold, the resulting gold-coated alloy film is heated at a temperature and for a time effective to cause diffusion of sufficient gold into the nickel-chromium film to lower its resistance to a desired value, and the gold layer is then removed, to leave a nickel-chromium-gold composite film resistor.

Abstract: This is a structure of, and method for preparation of, molybdenum resistors in a superconductor integrated circxuit. It utilizes a pattern superconductor film; applying a titanium film on the patterned superconductor film; and then applying a molybdenum film on the titanium film to provide a titanium-molybdenum, etch-stop interface; applying a patterned resist film on the molybdenum film; etching the exposed molybdenum film to expose a portion of the titanium-molybdenum, etch-stop interface; and oxidizing the exposed titanium-molybdenum, etch-stop interface. The titanium-molybdenum etch stop interface protects the patterned superconductor film and the support (including any other underlayers) and increases processing margins for the etch time.

Abstract: A gas detecting device includes a substrate and a plurality of gas sensitive elements supported by the substrate. A plurality of predetermined temperatures at which gases are detected are provided. The gas detecting device also includes a plurality of pairs of electrode leads supported by the substrate, each of the plurality of pairs of electrodes being connected to a corresponding one of the gas sensitive elements, and heater leads that are supported by the substrate and heat the plurality of gas sensitive elements so that each of the gas sensitive elements is set at a corresponding one of the plurality of predetermined temperatures.

Abstract: Device comprising a substrate and a metallized sensor/heater element having a temperature coefficient of resistance of at least 2000 parts per million. Methods of fabricating the devices are also disclosed.

Abstract: A thin film resistor for a strain gauge prepared by physical or chemical vapor deposition. The resistor contains 60 to 98 atomic % of chromium, 2 to 30 atomic % of oxygen, and 0 to 10 atomic % of a metal or semiconductor. These constituents are uniformly distributed. The thickness of the film is between 0.01 and 10 .mu.m. The metal is at least one of Al, Ti, Ta, Zr and In, and the semiconductor is at least one of silicon, germanium and boron. The thin film resistor has excellent resistance-strain characteristics and resistance-temperature characteristics, as well as high sensitivity and mechanical strength.

Abstract: A flat resistance for a blower control unit of an automobile air conditioner, and a blower control unit using the same. The flat resistance includes: a porcelain enameled metallic substrate including a flat head portion, having an edge and one surface, and parallel terminal supporting portions projecting outwardly from the edge of the head; a resistance circuit printed on the one surface of the head portion, the resistance circuit including a plurality of resistances electrically connected in series; a temperature fuse, interposed in the resistance circuit, for being tripped to break the resistance circuit when the porcelain enameled metallic substrate becomes overheated; and terminals, printed on both the head portion and the terminal supporting portions, each terminal being connected to one end of a corresponding one of the resistances.

Abstract: A highly accurate resistor for audio/video signal circuits is disclosed, and includes a substantially cylindrical substrate composed of dielectric material, such as ceramics, and a film layer of resistive material, such as tantalum with high purity. The film layer is arranged exclusively on the outer peripheral surface of the substrate such that the dielectric material is exposed on both end surfaces of the substrate. Undesirable eddy currents are prevented or suppressed from being induced on the end surfaces of the substrate as audio/video signal current is supplied to and conducted through the resistor, realizing a significant improvement in the high fidelity or definition of the reproduced sound/picture image.

Abstract: A process for fabricating an electronic device on a non-conductive polymer substrate, particularly from the family of polyaniline, comprises applying a covalent doping agent, such as an R.sup.+ donor compound, where R is an organic group, e.g., methyl iodide, to a preselected portion of a base-type non-conductive polymer substrate containing carbon-nitrogen linkages, and converting such preselected portion of the polymer substrate to an electrically conductive polymer portion, by covalent linkage of the R groups of such donor compound, to nitrogen atoms of the non-conductive polymer substrate. Electronic devices, such as resistors, capacitors, inductors, printed circuits and the like, can be provided by the invention process, in the form of light-weight polymers containing no metal, and which are stable and wherein the conductive portions are non-diffusing.

Abstract: A two-layered metal oxide film resistor having a ceramic substrate which has on its surface a first thin (0.1-5 .mu.m) metal oxide film that is based on tin oxide and which has a minor proportion of at least one auxiliary component selected from iron, indium, nickel, phosphorus, zinc, cadmium and antimony, and a second thin (0.003-1 .mu.m) metal oxide film superposed on the first film that is also based on tin oxide but which contains a minor proportion of at least one auxiliary component selected from antimony, nickel, chromium, fluorine, phosphorus, arsenic, iron, manganese, barium, bismuth, cobalt, zinc, copper, boron, cadmium and vanadium.

Abstract: An under floorcovering heating systems for positioning below a floorcovering is provided. The systems include pads having a heat conducting substrate within which is positioned solid conductor resistance heating wires in a serpentine manner for heating the substrate. The wire is covered by at least one layer of material providing electrical insulation and strong mechanical strength, jacketed by an electrically conductive "self-healing" ("self-curing") strong layer of material for the purposes of grounding and protecting the system. Also provided are electrical connecting mechanisms for connecting the resistance wire to a source of electricity including mechanisms connected to the jacketed conductive material for grounding the system.

Abstract: A thermal recording head comprises at least one set of a heat-generating resistance layer and at least one pair of electrodes connected electrically to said heat-generating resistance layer formed on a substrate, wherein said heat-generating resistance layer comprises an amorphous material containing halogen atoms and hydrogen atoms in a matrix of carbon atoms.

Abstract: In a printhead die-bonded to a substrate, a recess, in a preferred embodiment, is formed in the substrate and layers of resistive material separated by a dielectric layer are formed in the recess by a thick film screen print process. The recess underlies the printhead which remains bonded to the substrate along the edges of the recess. This arrangement provides good proximity of the heater and the temperature sensor to the printhead enabling measurements to be made and sent to a control circuit which regulates heater operation to maintain the printhead within a desired operating range. The configuration also allows precise positioning of the printhead with the metal surface as a reference.

Abstract: A printed circuit board has a base made from fibers (e.g., ceramic) and an inorganic coating (e.g., silicon carbide) covering the fibers to provide the base with inorganic properties. The base may have a particular coefficient of thermal expansion (CTE) as by providing the fibers with particular characteristics in the plane of, and perpendicular to, the base. The base may be isotropic thermally as by disposing the fibers in two adjacent transverse layers. An inorganic material (e.g. copper) on the base provides a radio frequency barrier. An inorganic material (e.g., silicon dioxide) on the RF barrier constitutes a dielectric insulator. An electrically conductive layer (eg. copper) partially covers the dielectric layer in a pattern defining an electrical circuit. A dielectric material (eg., silicon dioxide) fills the remaining space in this layer in a flush relationship with the conductive layer.

Abstract: A thermal print head including a glass layer disposed at the edge of a heat resistant substrate, a heat generating element on the glass layer and an electrode for driving the heat generating element disposed both under the glass layer and on the heat generating element is provided. The glass layer is formed of a lower layer of crystallized glass on the electrode and an upper noncrystallized glass portion under the heat generating element. The electrode under the glass layer is formed by print burning a thick conductive film on the substrate from a metal paste having a higher burning temperature than the burning temperature of the glass layers.

Abstract: A liquid jet head having: a discharge port for discharing liquid; a liquid path communicating with the discharge port; and a plurality of electro-thermal converting elements for generating thermal energy used for discharging the liquid, wherein each of said electro-thermal converting elements has heat resistive layer and at least one pair of electrodes electrically connected to the heat resistive layer, and the heat resistive layers are laminated together with intermediate layers of insulator to form a laminate in a direction perpendicular to a direction at which the liquid is supplied to a heat acting surface of the electro-thermal converting elements.

Abstract: An electrical resistor is formed upon the substrate. The substrate is laser scribed, preformed, or notched in such a way as to control accurately the breakage of the substrate dependent upon the thermal stress load produced by the resistor. By varying the position of the scribe or notch, the device can be programmed to repeatably shatter at an infinite number of time-load points. The method for applying this technique is also described for other substates or configurations.

Abstract: A resistor composition containing no boride powder is obtained by mechanical grinding of at least one of silicon, silicon monoxide and higher oxidation state precursor of silicon monoxide; and a borosilicate glass containing at least one of zirconium oxide, vanadium pentoxide, chromium oxide, tungsten trioxide, molybdenum trioxide, manganese oxide, titanium oxide, niobium pentoxide and tantalum pentoxide, which are capable of being reduced with silicon, silicon monoxide or higher oxidation state precursor of silicon monoxide. In a sintering step in a non-oxidizing atmosphere, boron oxide and at least one another oxide contained in the borosilicate glass are reduced by silicon, silicon monoxide, higher oxidation state precursor of silicon monoxide or silicide, and metal elements of the oxides contained in the glass combine with each other, so that fine particles of boride are precipitated around glass particles to form a graze resistor.

Abstract: A reversible resistant device having the property of being normally non-conductive, but being adapted to being converted to the conductive state. This change in conductive state is achieved by subjecting the device to a high voltage or high electric field. The essence of the device is a normally non-conductive film located between conductive layers, the film being formed by metal oxide coated metal particles embedded in a binder. When subjected to a high a potential, the metal oxide coating loses its dielectric properties and renders the film conductive.

Abstract: An improved process for fabricating thick film hybrid microcircuits that produces thick film resistors having electrical characteristics consistent with the microcircuit design tolerances, in areas proximate a dielectric build-up. The process includes, establishing by printing and firing a plurality of first conductor traces including the cross-under conductors to a substrate. Next, the resistive elements are printed and fired on the substrate and a dielectric glaze printed and fired over the resistive elements. At least one dielectric layer is then printed and fired over the cross-under conductors. A plurality of second conductor traces are next printed and fired on the substrate, including the cross-over conductors which are printed over the dielectric layer. Finally, a dielectric glaze is printed and fired over the cross-over conductors.

Abstract: A resistor card for a fuel tank level sensor configured to reduce wear between an electrical contact wiper and metalized conductor pads formed on a substrate, by the deposition of thick film resistive material on the individual pads. The resistive material forms a protective coating on the pads to protect the metalized pads from excessive wiper wear.

Abstract: MnO.sub.2-x thin films (12) exhibit irreversible memory switching (28) with an "OFF/ON" resistance ratio of at least about 10.sup.3 and the tailorability of "ON" state (20) resistance. Such films are potentially extremely useful as a "connection" element in a variety of microelectronic circuits and arrays (24). Such films provide a pre-tailored, finite, non-volatile resistive element at a desired place in an electric circuit, which can be electrically turned OFF (22) or "disconnected" as desired, by application of an electrical pulse. Microswitch structures (10) constitute the thin film element, contacted by a pair of separate electrodes (16a, 16b) and have a finite, pre-selected ON resistance which is ideally suited, for example, as a programmable binary synaptic connection for electronic implementation of neural network architectures. The MnO.sub.