Abstract: An air wiping device for drying an elongated product that passes through the air wiping device. The air wiping device includes a housing having an internal elongated tubular passage through which the elongated product extends and including opposite one and other ends with the housing tubular passage having an inlet end and an outlet end for respectively receiving and passing the elongated product; a first set of nozzles mounted at the one end of the housing for communicating a compressed gas stream to the internal elongated tubular passage and second set of nozzles mounted at the other end of the housing for communicating a compressed gas to the internal elongated tubular passage. The first and second sets of nozzles are mounted for directing the respective gas streams obliquely to the internal elongated tubular passage.

Abstract: A process and device for drying the coating of containers made of thermoplastic material. The process involves feeding said containers through a furnace divided into two areas: in the first, most of the solvent of the coating is removed by heating the paint with infrared lamps, while the temperature of the containers is controlled through an airflow; in the second, the remaining solvent is removed using said airflow coming from the first area of the furnace.

Abstract: A wafer dryer for use in a semiconductor cleaning apparatus includes an internal bath, an external bath, a solution supply line, a solution drain line, a pump, and drying means. The solution drain line has a first drain line and a second drain line. A pump for constantly maintaining a speed of a drained solution is installed on the first drain line. The drying means has an isopropyl alcohol (IPA) nozzle, a first gas spray nozzle for spraying N2 gas, and a second spray nozzle. The second spray nozzle is installed on all inner sidewalls of the external bath and has a plurality of holes. Thus, no wave is produced at a surface of the drained solution.

Abstract: A device for the treatment of substrates has a fluid container and two substrate transport devices positionable above the fluid container. Each substrate transport device is a hood for receiving multiple substrates. Each substrate transport device has at least one substrate support device having a first position for locking the substrates and a second position for releasing the substrates. The substrate transport devices are rigidly connected to one another and linearly movable for alternatingly positioning one of the substrate transport devices above the fluid container.

Abstract: A device for performing surface treatment on semiconductor wafers has a cassette (1) for accommodating a plurality of wafers (5) in its interior (3); the wafers (5) are aligned in a first row. The wafer surfaces (51) are essentially in parallel with each other. The cassette (1) has a side-wall (10) which can be arranged essentially perpendicular with respect to the wafer surfaces (51); the side-wall (10) has openings (111′-145′) on its face (101) which is directed to the wafers (5), the openings (111′-145′) are aligned in second rows, the second rows are essentially parallel to the first row; the openings (111′-114′) are connected to respective supply channels (11′, 12′, 13′, 14′, 15′) for transporting a surface treatment medium which is fed to one (15′) of these supply channels via a feeding point (FP). The cross-section of the openings (111′-145′) is variable.

Abstract: Apparatus for cooling strip includes a path of travel for the strip and cooling apparatus having a plurality of elongated gas nozzles within which are disposed water nozzles such that the water nozzles will have a discharge outlet within the gas nozzles and discharge water in generally the same direction as said gas discharge. In a preferred embodiment, the gas enshrouds the water and establishes a cocurrent two-fluid stream which impinges upon the strip moving by the cooling apparatus. Subsequently, heat transfer is enhanced by the air and water dynamics which are provided after impingement by fluid flow fields. The gas nozzles and water nozzles may be coaxial and in one embodiment are each circular. In one embodiment, containment gas is caused to impinge on the strip at a position longitudinally displaced from the regions of impingement of the cocurrent two-fluid stream on the strip so as to resist undesired flow of water.