Abstract: The present invention relates to a laundry machine and a method for operating the same for removing wrinkles or the like from laundry by using high temperature and high humidity air instead of steam. The method for operating a laundry machine includes the steps of a course selecting step for selecting an operating course, and a high temperature and high humidity air supply step for supplying high temperature high humidity air to a drum from an air supply unit.

Abstract: Laundry machine including a selectively rotatable drum, a pump for supplying water to a steam generator and controller for determining the pump of being out of order by using a time period required for supplying water to a preset water level of the steam generator or a current to the pump, thereby realizing product safety effectively.

Abstract: The present invention relates to an exhaust structure for a clothes dryer in an apartment building. The exhaust structure includes at least one riser pipe mounted in a vertical direction crossing every floor of a building to discharge exhaust gas, a plurality of branch pipes branched from the riser pipe to a household in the every floor to guide exhaust gas from the household to the riser pipe, and a fan mounted above a top of the riser pipe and operating in proportion to the amount of exhaust gas in the riser pipe.

Abstract: A circulation-air generating unit directly generates circulation air that flows along a surface of a cleaning tank. The circulation air is applied to cleaning medium accumulated on the cleaning tank from a direction orthogonal to a direction of face of the cleaning medium to deliver and flow up the cleaning medium. The cleaning medium is flown up inside the cleaning tank by the force of the circulation air. The cleaning medium flowing inside the cleaning tank collides with a cleaning target object by high-velocity air supplied from a cleaning-medium accelerating unit to remove dust on the cleaning target object.

Abstract: An apparatus for thermally de-coating and/or drying coated and/or contaminated materials comprises a support and an oven pivotally mounted to the support. The oven has charging portion for receiving material to be treated and a changeover portion. Incorporated within the changeover portion is a heat treatment chamber through which a stream of hot gasses can be passed. The oven is pivotally moveable between a first position in which the changeover portion is higher than the charging portion and a second position in which the charging portion is higher than the changeover portion. The arrangement is such that the oven can be repeatedly moved between the first and second positions so that material within the oven falls from one portion to the other portion, passing through the stream of hot gasses in the heat treatment chamber. A method of using the apparatus is also disclosed.

Abstract: There are disclosed a heat pump device and a drying machine using the device in which abnormal water supplying into a water-cooling heat exchanger for use in water-cooling of a heat pump can be easily detected without disposing any water amount gauge particularly.

Abstract: An appliance is provided with a water dispenser. A fan or heater assembly, a hair dryer assembly, and a brush assembly are disclosed. Each of these assemblies includes a water dispenser incorporated therein.

Abstract: Dessicants employed in dehumidifying moisturized air present within a water-damaged building are themselves dehumidified to liberate collected moisture through the use of ambient air drawn over and about a heat exchanger fired by diesel fuel, with a portion of the dehumidified air being diverted to join with the ambient air in increasing the liberation of the moisture within the dessicant.

Abstract: Dessicants employed in dehumidifying moisturized air present within a water-damaged building are themselves dehumidified to liberate collected moisture through the use of ambient air drawn over and about a heat exchanger fired by diesel fuel, with portions of the air drawn through the dessicant in both directional air flow paths being used to heat the water-damaged building.

Abstract: Rotating wheel dessicants employed in dehumidifying moisturized air present within a water-damaged building are themselves dehumidified to liberate collected moisture through the use of ambient air drawn over and about a heat exchanger fired by diesel fuel, with the rotating wheel dessicant being turned by a grip notch belt stretched onto the wheel.

Abstract: Dessicants employed in dehumidifying moisturized air present within a water-damaged building are themselves dehumidified to liberate collected moisture through the use of ambient air drawn over and about a heat exchanger fired by diesel fuel and powered by a pair of separately fused electrical circuits, one of which powers a first blower drawing ambient air from outside the building over the heat exchanger and through a dessicant in a first direction, and the other of which powers a second blower drawing moisturized air from within the building through the dessicant in a second direction.

Abstract: Dessicants employed in dehumidifying moisturized air present within a water-damaged building are themselves dehumidified to liberate collected moisture through the use of ambient air drawn over and about a heat exchanger fired by diesel fuel, with the dessicants, the dehumidifying apparatus and the diesel fuel all being carried on a trailer, with the diesel fuel inside under a skid and with its own portable electric panels with ground fault interrupters aboard in bringing its own electric power to the scene of the water-damaged building.

Abstract: A drying apparatus for powdered or granular material comprising a hopper body with an electric heater in its center, housing therein a heat conducting fin formed with plural compartment walls radially projected therefrom and a carrier gas communication path provided in the conducting fin, which has an upper introduction port and a lower exhaust port, both connected with a penetrating up and down path provided in the center of the heat conducting fin. The apparatus is constructed such that carrier gas externally introduced is fed into the hopper body. According to the apparatus, powdered or granular material is uniformly heated and dried and heating source for carrier gas is not necessary, thereby achieving improvement in energy efficiency and energy saving.

Abstract: The invention provides an apparatus, methods, and compositions for dispensing a fragrance onto laundry in a dryer without substantial loss of that fragrance during the drying process. The apparatus includes an electrostatic vapor generator capable of dispensing a fragrance composition into a dryer. The invention also provides electrostatically dispensable fragrance compositions containing glycols, vegetable oils, and perfumes. The invention further provides a kit and method for enhancing residual fragrance on laundry by adding a fabric conditioning composition and a fragrance composition in separate steps during the laundering process. The invention includes embodiments wherein the dispensation of the fragrance compositions is computer controlled.

Abstract: A reactor defines a reaction chamber for processing a substrate. The reactor comprises a first inlet for providing a first reactant and to the reaction chamber and a second inlet for a second reactant to the reaction chamber. A first exhaust outlet removes gases from the reaction chamber. A second exhaust outlet removes gases from the reaction chamber. A flow control system is configured to alternately constrict flow through the first and second exhaust outlets. The reactor chamber is configured to for a diffusion barrier within the reaction chamber.

Abstract: A system, method, and apparatus for supplying a gas-liquid vapor to a process tank for performing semiconductor manufacturing. In one aspect, the invention is a method of supplying a gas-liquid vapor to a process tank comprising: supplying a gas stream through at least one hydrophobic tube; exposing the outside surface of the hydrophobic tube to a liquid so that a vapor of the liquid permeates the hydrophobic tube and enters the gas stream, forming a gas-liquid vapor inside the tube; and transporting the gas-liquid vapor to the process tank. In another aspect, the invention is an apparatus for supplying a gas-liquid vapor to a process tank comprising: at least one hydrophobic tube adapted to carry a gas; and a housing forming a chamber that surrounds the tube, the chamber adapted to receive a liquid that can permeate the tube, forming a gas-liquid vapor.

Abstract: The substrate drying apparatus has a substrate processing vessel 1, a substrate supporting section for supporting plural substrates 2 in a standing condition and lined up condition in the interior of the substrate processing vessel 1, fluid reservoir section 3 for drying provided at an upward predetermined position of the substrate processing vessel 1, a first inert gas supplying section 4 for blowing inert gas against the drying fluid 6 pooled in the fluid reservoir section 3 for drying so as to generate droplet of the drying fluid, and for guiding the droplet towards the center of the substrate processing vessel 1, and a second inert gas supplying section 5 for supplying inert gas vertically and downwardly so as to supply the generated droplet of the drying fluid towards the substrates 2, consequently safety is improved without providing special safety device, and sufficient amount of drying fluid is supplied to the dipping boundary face of the substrate and the cleaning liquid.

Abstract: A submersible gas compressor is described which has a ceramic high pressure piston in contact with a ceramic sleeve, a drive piston mounted to the ceramic high pressure piston and a crank in mechanical connection with the drive piston. The submersible gas compressor can be used as a second stage compressor in a gas delivery system that includes a first stage low pressure compressor, an absorption bed containing molecular sieve material, a second stage compressor to pressurize a gas stream to a pressure between 5000 and 10,000 psig, a cascade system for storing the pressurized gas stream between 3500 and 5000 psig, a control system, and an outlet for delivering the pressurized gas stream.

Abstract: A heat treatment apparatus for preventing quality defects of an object to be heat-treated even when sublimating components produced in heat treatment become solids and drop down in the heat treatment apparatus, wherein a gas generated when heating an object to be heat-treated, coated with a coating solution and placed on a stage is passed through a trap made of a permeable porous film and is exhausted from an exhaust port of a cover and wherein solids produced and dropping down when gas passed through the trap of the permeable porous film solidifies at a top plate of the cover are trapped by the trap.

Abstract: A delivery system and method for vaporizing and delivery of vaporized solid and liquid precursor materials at sub-atmospheric pressures between a heatable vaporization vessel and a processing tool. The system includes a pressure regulator internally positioned within the vaporization vessel and in fluid communication with a downstream mass flow controller to maintain a consistent flow of vaporized source material. The system further comprises introducing a carrier/diluent gas for diluting the vaporized source material before entry into the processing tool. A venturi is positioned directly upstream of the processing tool and provides for mixing of the carrier gas with the vaporized source material while providing the negative pressure required to open the gas pressure regulator within the vaporization vessel.

Abstract: An apparatus for controlling gas valves of a gas drier prevents gas leakage in case of ignition failure and reduces the risk of accidents accordingly.

Abstract: Disclosed is a high pressure processing method for subjecting a processing object to a high pressure processing using a high pressure fluid. In this method, the high pressure fluid is brought into collision with the surface of the processing object placed in a high pressure processing chamber, and then distributed along the surface of the processing object in an outward direction beyond the processing object.

Abstract: A system for high-pressure drying of semiconductor wafers includes the insertion of a wafer into an open vessel, the immersion of the wafer in a liquid, pressure-sealing of the vessel, pressurization of the vessel with an inert gas, and then the controlled draining of the liquid using a moveable drain that extracts water from a depth maintained just below the gas-liquid interface. Thereafter, the pressure may be reduced in the vessel and the dry and clean wafer may be removed. The high pressure suppresses the boiling point of liquids, thus allowing higher temperatures to be used to optimize reactivity. Megasonic waves are used with pressurized fluid to enhance cleaning performance. Supercritical substances are provided in a sealed vessel containing a wafer to promote cleaning and other treatment.

Abstract: An apparatus and corresponding method for heating a wafer during processing. The apparatus includes a process chamber enclosing a processing tube defining a processing area. The processing tube includes a first wall and a second wall which define a hollow cavity or passageway therebetween. The second wall includes a plurality of holes or outlets formed thereon which allow environmental communication between the hollow cavity and the processing area. The apparatus also includes a plurality of resistive heating elements positioned adjacent to the processing tube. A thermal energy output from the resistive heating elements is configured to heat a gas flowing through the hollow cavity. The gas flowing through the hollow cavity exits the hollow cavity through the plurality of holes and convectively change the temperature of the wafer disposed in the processing tube.

Abstract: A supporting apparatus for supporting a substrate in drying a substrate surface of the substrate including a supporting rod having a hollow interior portion and a groove configured to support a substrate on the supporting rod, the groove communicating to the hollow interior portion, a porous material disposed in the hollow interior portion of the supporting rod such that the porous material contacts with the substrate being supported in the groove, and a vacuum device configured to provide suction in the hollow interior portion of the supporting rod.

Abstract: An apparatus for drying a wafer includes a rotating chuck configured to rotate the wafer. A movable de-ionized water supply member and an organic solvent supply member are positioned adjacent a face of the wafer. The de-ionized water supply member supplies de-ionized water onto the wafer, and the organic solvent supply member has a plurality of solvent supply nozzles disposed to supply an organic solvent onto the wafer. The organic solvent supply member includes a first solvent supply member and a second solvent supply member. The de-ionized water supply member and the first solvent supply member move radially between a position adjacent the central portion of the wafer and the edge portion of the wafer.

Abstract: An instantaneous pressure reducing heating and drying apparatus for an object, such as a wafer, includes a pressure reducing chamber; a vacuum pump for reducing a pressure in the pressure reducing chamber to below atmospheric pressure; a drying chamber installed within the pressure reducing chamber for drying the object that is loaded in the drying chamber; a pressure regulating valve installed in a wall of the drying chamber, wherein when the pressure regulating valve is opened a pressure in the drying chamber is instantaneously reduced to the pressure of the pressure reducing chamber; and a heating means for heating the drying chamber. In operation, the vacuum pump reduces a pressure of the pressure reducing chamber to below atmospheric pressure, and the pressure regulating valve installed in a wall of the drying chamber opens thereby instantaneously reducing the pressure the drying chamber to the reduced pressure of the pressure reducing chamber.

Abstract: Heat transfer fluid mixtures and methods of making and using same are presented. The inventive heat transfer fluid mixtures consist essentially of at least one light gas, such as hydrogen, and at least one heavy fluid, such as helium wherein the mixture will not be capable of mixing with air in any proportions to produce a self-sustaining flammable or combustible mixture, or wherein a concentration of hydrogen is sufficient to reduce cost of the mixture to an amount substantially less than cost of pure helium.

Abstract: A gas conduit for a load lock chamber. The gas conduit connects to a gas source to introduce gas from the gas source into the load lock chamber of semiconductor equipment. The structure includes a filter mounted on the top surface of the load lock chamber, a pressure limitative device to maintain a preset pressure of gas source, and a gas inlet device including an inlet end connected to the pressure limitative device and an outlet end connected to the filter, wherein the gas inlet device introduces gas from the gas source into the load lock chamber with its maximum flow rate when breaching the vacuum therein.

Abstract: The invention provides a device for treatment fabrics in a tumble dryer during multiple tumble drying cycles. The device comprises: a reservoir for storing a fabric treatment composition, means to expose fabric treatment composition from the reservoir to airflow generated inside the tumble drier and/or to directly contact fabrics in the dryer, thereby transferring a portion of the fabric treatment composition into contact with fabrics in the tumble dryer during a tumble drying cycle; means for attaching the device to the inside of the tumble dryer door preferably a hook and sucker; and optionally means for indicating to a user when the fabric treatment composition is used up.

Abstract: The invention concerns an apparatus for the removal of moisture from particulized, solid food products, comprising; a housing (9); a perforated plate (2), creating two chambers (3, 4) in the housing (1), gas-inlets (5, 6), present below the perforated plate (2); an outlet (8) in the perforated plate (2), provided with a removable plug (9); heating means (15, 18) for the gases. The invention further concerns a process for the removal of moisture from solid, small particles, by subjecting these particles, while in an annular, fluidized bed to a heat treatment for a specific time.

Abstract: A wafer drying apparatus of increased efficiency in which isopropyl alcohol (IPA) supplied to a hood is activated by heat, thereby increasing its diffusion efficiency and enabling it to vaporize pure water on a wafer quickly, includes a washing tank for storing pure water, a hood positioned at an upper portion of the washing tank, an injection nozzle for ejecting IPA positioned in the hood, a storage tank for storing the IPA, a bubble maker in the storage tank to create IPA vapor, a nitrogen supplier for storing a carrier gas for transferring the IPA vapor in the storage tank to the hood, and a heater provided near the injection nozzle to heat the IPA vapor that is ejected through the injection nozzle to a predetermined temperature, thereby uniformly diffusing the IPA vapor.

Abstract: A method and apparatus for heating and cooling a substrate are provided. A chamber is provided that comprises a heating mechanism adapted to heat a substrate positioned proximate the heating mechanism, a cooling mechanism spaced from the heating mechanism and adapted to cool a substrate positioned proximate the cooling mechanism, and a transfer mechanism adapted to transfer a substrate between the position proximate the heating mechanism and the position proximate the cooling mechanism.

Abstract: An apparatus and a method for preventing a wafer mapping system of an SMIF system from being polluted by a corrosive gas remaining on wafers according to the present invention are disclosed. The wafer mapping system includes a plurality of mirrors and sensors used to detect the positions of the wafers. The apparatus of the prevent invention comprises a pipe having a plurality of holes thereon and a purge gas flowing inside the pipe, and is characterized in that the purge gas is emitted out from the plurality of holes toward the mirrors of the wafer mapping system, thereby preventing the mirrors from being polluted by the corrosive gas remaining on the wafers. The method of the prevent invention is characterized by emitting a purge gas from a pipe toward the mirrors of the wafer mapping system, thereby preventing the mirrors from being polluted by the corrosive gas remaining on the wafers.

Abstract: In an apparatus for a treatment of a wafer at elevated temperatures, the wafer is taken out of the reactor after heat treatment with the help of a mechanical transport apparatus which preferably grips the wafer around the circumference and on the under side. The transport apparatus includes a wafer surrounding ring. The wafer is placed in a floating wafer reactor where it is cooled in a controlled manner. Transport for further action or treatment then takes place.

Abstract: Methods and apparatus for processing an electronic component precursor comprising the steps of contacting a carrier gas with a process chemical stream to entrain the process chemical in the carrier gas thereby forming a fluid stream and injecting at least a portion of additional process chemical into the fluid stream to form a localized region of increased concentration of process fluid is provided. The methods and apparatus also provide injecting a portion of additional carrier gas into the fluid stream to form a diluted region of decreased concentration of process fluid is also provided. The methods and apparatus further provide controlling the concentration of process chemical in the localized region as well as in the fluid stream.

Abstract: The present invention relates to a method for subjecting a substrate on which a coating film is formed to heat processing, and the method comprises the steps of heating the substrate to a predetermined high temperature and decreasing the temperature of the substrate to a predetermined low temperature, wherein in the step of decreasing the temperature of the substrate to the low temperature, a first step of decreasing the temperature of the substrate from the predetermined high temperature to a predetermined intermediate temperature and a second step of decreasing the temperature of the substrate from the intermediate temperature to the predetermined low temperature are performed separately.

Abstract: The trays (V) are provided with identical vertical spacers (4) which enable the trays to be stacked on top of each other in a centred way, with a suitable spacing betweem them, and enable the various adjacent stacks of trays to be raised and lowered in steps, by means (BM) which act only on the bottom tray of each stack. The sides of the stacks of trays of the kiln are thus free and can be engaged by conveyors (37-37′, 77-77′, 57-57′) of the means provided for the translation of the trays between the stacks, both in the normal operating cycle and in the short operating cycle. However, the lower translation conveyors (24-24′) which transfer the trays from the stack with the unloading station (K2) to that with the loading station (K1) are positioned in the usual way under the stacks of trays and transversely with respect to the trays.

Abstract: A system for high-pressure drying of semiconductor wafers includes the insertion of a wafer into an open vessel, the immersion of the wafer in a liquid, pressure-sealing of the vessel, pressurization of the vessel with an inert gas, and then the controlled draining of the liquid using a moveable drain that extracts water from a depth maintained just below the gas-liquid interface. Thereafter, the pressure may be reduced in the vessel and the dry and clean wafer may be removed. The high pressure suppresses the boiling point of liquids, thus allowing higher temperatures to be used to optimize reactivity. Megasonic waves are used with pressurized fluid to enhance cleaning performance. Supercritical substances are provided in a sealed vessel containing a wafer to promote cleaning and other treatment.

Abstract: The present invention relates to (1) a cleaning gas for cleaning semiconductor production equipment, obtained by mixing SF6 and one or both of F2 with and NF3 with an inert gas at a specific ratio; (2) a cleaning gas for cleaning semiconductor production equipment, obtained by mixing SF6 and one or both of F2 and NF3 with an inert gas and an oxygen-containing gas at a specific ratio; (3) a method for cleaning semiconductor production equipment using the gas; and (4) a method for producing a semiconductor device including a cleaning step using the cleaning gas. By using the cleaning gas for semiconductor production equipment of the present invention which is high in the etching rate, efficient cleaning and production of semiconductor production equipment with excellent cost performance can be achieved.

Abstract: A wafer drying apparatus of increased efficiency in which isopropyl alcohol (IPA) supplied to a hood is activated by heat, thereby increasing its diffusion efficiency and enabling it to vaporize pure water on a wafer quickly, includes a washing tank for storing pure water, a hood positioned at an upper portion of the washing tank, an injection nozzle for ejecting IPA positioned in the hood, a storage tank for storing the IPA, a bubble maker in the storage tank to create IPA vapor, a nitrogen supplier for storing a carrier gas for transferring the IPA vapor in the storage tank to the hood, and a heater provided near the injection nozzle to heat the IPA vapor that is ejected through the injection nozzle to a predetermined temperature, thereby uniformly diffusing the IPA vapor.

Abstract: A device for performing surface treatment on semiconductor wafers has a cassette (1) for accommodating a plurality of wafers (5) in its interior (3); the wafers (5) are aligned in a first row. The wafer surfaces (51) are essentially in parallel with each other. The cassette (1) has a side-wall (10) which can be arranged essentially perpendicular with respect to the wafer surfaces (51) ; the side-wall (10) has openings (111′-145′) on its face (101) which is directed to the wafers (5), the openings (111′-145′) are aligned in second rows, the second rows are essentially parallel to the first row; the openings (111′-114′) are connected to respective supply channels (11′, 12′, 13′, 14′, 15′) for transporting a surface treatment medium which is fed to one (15′) of these supply channels via a feeding point (FP). The cross-section of the openings (111′-145′) is variable.

Abstract: A locomotive air dyer air discharge conduit is configured to disperse a portion of the discharge air radially through one or more air dispersion openings in the side of the discharge conduit, thereby reducing the output velocity of the discharge air.

Abstract: Heat transfer fluid mixtures and methods of making and using same are presented. The inventive heat transfer fluid mixtures consist essentially of at least one light gas, such as hydrogen, and at least one heavy fluid, such as helium wherein the mixture will not be capable of mixing with air in any proportions to produce a self-sustaining flammable or combustible mixture, or wherein a concentration of hydrogen is sufficient to reduce cost of the mixture to an amount substantially less than cost of pure helium.

Abstract: The apparatus serves for drying solid insulation of an electrical device (40) by means of the heat of condensation emitted by the vapor of a solvent. It has an evacuable autoclave (10) accommodating the solid insulation, as well as an evaporator (20) producing solvent vapor, an evacuable condenser (50), connected to the autoclave (10), for condensing a solvent led out of the autoclave (10) and a vapor mixture containing water, and a heat recuperator (30). In the heat recuperator (30), the solvent acts as heat-absorbing medium and the vapor mixture as heat-emitting medium.

Abstract: Liquid is removed from batches of substrates by apparatus and methods for drying substrates that have been wet in an elongated liquid bath. The substrates are moved relative to the bath and an elongated gas-filled volume at rates of movement selected according to the location of the batches of substrates in the bath or the volume. As an example, the substrates and the bath are separated at a controlled rate to form a thin layer of liquid on each substrate as each substrate enters the gas-filled volume. The gas-filled volume is defined by an elongated hot chamber and hot gas directed into the volume and across the substrates and out of the volume continuously transfers thermal energy to the substrates . The flow rate of the gas into the volume is related to introduction of the substrates into the bath to avoid disturbing the liquid in the bath.

Abstract: A wafer heat-treatment system for processing a wafer by a high-temperature heat-treatment process and cooling the heat-treated wafer, comprises walls surrounding a closed space placing the wafer and having a hollow sealing a gas therein, and a pressure-regulating unit connecting to the hollow for regulating pressure in the hollow. Hence, the wafer heat-treatment system reduces power consumption by heating lamps by carrying out an evacuating process before the high-temperature heat-treatment process, and shortens the time necessary for the cool down process by a pressurizing process that is carried out after the completion of the high-temperature heat-treatment process.

Abstract: A machine for processing semiconductor wafers and similar articles has an ozone remover connected to a processing chamber. The ozone remover has a light chamber surrounded by reflectors. Ozone and other processing gases and vapors flow out of the processing chamber and into the light chamber. Ultraviolet lights in the ozone remover flood the light chamber with ultraviolet light, converting ozone into oxygen. The amount of ozone released into the environment is reduced. A recirculation line receives the gases and vapors flowing out of the ozone remover. Oxygen and any remaining ozone are separated from other gas and vapor components and are recycled back to an ozone generator, to increase the ozone generator efficiency in supplying the machine with ozone.

Abstract: Thermally controlled apparatus 1 for actuating a valve opening 2, in particular a fluid valve, in particular a drip-stop valve in a steam iron, the apparatus having a bimetallic spring disc 3 fastened to a carrier element 4, the edge 5 or edge region of which disc opens or closes the valve opening depending on the curvature position of the bimetallic spring disc 3. The valve opening is formed through a cross-sectionally variable segment 6 of a tube- or pipe-like flow-through element 7, and the edge 5 or edge region of the bimetallic spring disc 3 acts directly on the cross-sectionally variable segment 6.

Abstract: A system for high-pressure drying of semiconductor wafers includes the insertion of a wafer into an open vessel, the immersion of the wafer in a liquid, pressure-sealing of the vessel, pressurization of the vessel with an inert gas, and then the controlled draining of the liquid using a moveable drain that extracts water from a depth maintained just below the gas-liquid interface. Thereafter, the pressure may be reduced in the vessel and the dry and clean wafer may be removed. The high pressure suppresses the boiling point of liquids, thus allowing higher temperatures to be used to optimize reactivity. Megasonic waves are used with pressurized fluid to enhance cleaning performance. Supercritical substances are provided in a sealed vessel containing a wafer to promote cleaning and other treatment.