Protective Patents (Class 347/64)
  • Patent number: 6950117
    Abstract: A thermal head includes a heat insulating layer made up of an electrically-conductive multiple low oxide ceramic layer of low thermal conductivity made of a chemical compound of Si, plural transition metals and oxygen. A first insulating layer made up of an insulated multiple high nitride ceramic layer of low thermal conductivity made of a chemical compound of at least Si, plural transition metals and nitrogen is formed on the heat insulating layer, and a second insulating layer made up of an SiO2 layer of high insulation characteristics or an Al2O3 layer is formed on the first insulating layer.
    Type: Grant
    Filed: May 22, 2004
    Date of Patent: September 27, 2005
    Assignee: Alps Electric Co., Ltd.
    Inventors: Takashi Shirakawa, Satoshi Kubo, Masahisa Jumonji
  • Patent number: 6926390
    Abstract: The invention includes a method of forming mixed-phase compressive tantalum thin films using nitrogen residual gas. The method of the present invention may include selecting a pressure of nitrogen residual gas during plasma sputtering corresponding to a predefined ratio of beta- to alpha-tantalum. The method may be performed at substrate temperatures less than 300° C. Mixed-phase compressive tantalum thin films and fluid ejection devices are also disclosed.
    Type: Grant
    Filed: February 5, 2003
    Date of Patent: August 9, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Arjang Fartash
  • Patent number: 6902261
    Abstract: A bonding apparatus and method thereof to bond the bonding portions of an FPC cable to pads of a print head die in order to electrically connect the print head die of an ink jet print head assembly include a stage and a bonding tool. The print head die includes resistive heaters, signal lines connected to the resistive heaters, and electrical pads to connect the signal lines to an outside of the print head die to the FPC cable having conductors having bonding portions facing the pads. The print head die is supported on the stage with the pads facing upward. The bonding tool includes a tip that press bonding portions of the FPC cable against corresponding pads of the print head die placed on the stage, and heats the bonding portions in contact with the pads to bond the bonding portion to the pads.
    Type: Grant
    Filed: March 17, 2003
    Date of Patent: June 7, 2005
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jeong-seon Kim, Seo-hyun Cho, Dae-woo Son, Sa-yoon Kang, Myung-song Jung
  • Patent number: 6893116
    Abstract: A fluid ejection device is disclosed. The fluid ejection device may include a substrate including a heating element and a passivation layer in contact with the heating element. The fluid ejection device may further include a buffer layer in contact with the passivation layer and a compressive alpha-tantalum layer in contact with, and lattice matched to, the buffer layer.
    Type: Grant
    Filed: April 29, 2003
    Date of Patent: May 17, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Arjang Fartash
  • Patent number: 6890062
    Abstract: A heater chip has a plurality of heaters each having a length, width and thickness. The length multiplied by the width (heater area) is in a range from about 50 to about 500 micrometers squared while the thickness is in a range from about 500 to about 5000 or 6000 angstroms. The energy required to jet or emit a single drop of ink from the heater during use is in a range from about 0.007 to about 0.99 or 1.19 microjoules. The heater chip is formed as a plurality of thin film layers on a substrate. Energy ranges are taught for all heaters having an area from about 50 to about 4000 micrometers squared and thicknesses ranging from about 500 to about 16,000 angstroms. Printheads containing the heater chip and printers containing the printheads are also disclosed.
    Type: Grant
    Filed: July 15, 2003
    Date of Patent: May 10, 2005
    Assignee: Lexmark International, Inc.
    Inventors: Byron Vencent Bell, Robert Wilson Cornell, Yimin Guan
  • Patent number: 6848770
    Abstract: A liquid dispenser includes a substrate and a plurality of liquid-dispensing portions, arranged on the substrate, including at least one liquid chamber for storing liquid, one nozzle, and one heating element, wherein the heating elements are energized to heat liquid stored in the corresponding liquid chambers to eject a droplet of the liquid from the corresponding nozzles; the heating elements and the liquid chambers have a protective layer and an insulating layer therebetween; each heating element, the insulating layer, the protective layer, and each liquid chamber are arranged in that order; the insulating layer isolates the protective layer from the heating elements; and the protective layer comprises an inorganic material, protects the heating elements, has a strip shape so as to cover some of the plurality of heating elements adjacent to each other, and has slits each disposed between the heating elements. A printer includes such a liquid dispenser.
    Type: Grant
    Filed: April 10, 2003
    Date of Patent: February 1, 2005
    Assignee: Sony Corporation
    Inventors: Takaaki Miyamoto, Manabu Tomita, Shogo Ono, Minoru Kohno, Osamu Tateishi
  • Patent number: 6846068
    Abstract: An ink-jet printhead and a method of manufacturing the same include utilizing a substrate on which at least one heater and a passivation layer protecting the at least one heater are formed, a passage plate which forms an ink chamber corresponding to the at least one heater, and a nozzle plate in which an orifice corresponding to the ink chamber is formed. The passage plate and the nozzle plate are formed of photoresist, and an adhesion layer formed of silicon-family low-temperature deposition material at a temperature limited by the characteristics of the passage plate is disposed between the passage plate and the nozzle plate.
    Type: Grant
    Filed: April 16, 2003
    Date of Patent: January 25, 2005
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Yun-gi Kim
  • Patent number: 6834941
    Abstract: A heater chip has a plurality of heaters each having a length, width and thickness. The length multiplied by the width (heater area) is in a range from about 50 to about 500 micrometers squared while the thickness is in a range from about 500 to about 5000 or 6000 angstroms. The energy required to jet or emit a single drop of ink from the heater during use is in a range from about 0.007 to about 0.99 or 1.19 microjoules. The heater chip is formed as a plurality of thin film layers on a substrate. Energy ranges are taught for all heaters having an area from about 50 to about 4000 micrometers squared and thicknesses ranging from about 500 to about 16,000 angstroms. Printheads containing the heater chip and printers containing the printheads are also disclosed.
    Type: Grant
    Filed: July 15, 2003
    Date of Patent: December 28, 2004
    Assignee: LExmark International, Inc.
    Inventors: Byron Vencent Bell, Robert Wilson Cornell, Yimin Guan
  • Patent number: 6830318
    Abstract: There is disclosed an ink jet printhead which comprises a plurality of nozzles 3 and one or more heater elements 10 in a bubble forming chamber 7 corresponding to each nozzle 3. Each heater element 10 is configured to heat a bubble forming liquid 11 in the printhead to a temperature above its boiling point to form a gas bubble 12 therein. The generation of the bubble 12 causes the ejection of a drop 16 of an ejectable liquid (such as ink) through an ejection aperture 5 in each nozzle 3, to effect printing. The transient rise in pressure within the bubble forming chamber when the bubble forms is less than 20 MPa. Keeping the transient pressures relatively low, the strength requirements of the printhead structures are reduced. Accordingly the dimensions of the components can reduced for more compact design and easier manufacture.
    Type: Grant
    Filed: February 9, 2004
    Date of Patent: December 14, 2004
    Assignee: Silverbrook Research PTY LTD
    Inventor: Kia Silverbrook
  • Patent number: 6824246
    Abstract: There is disclosed an ink jet printhead which comprises a plurality of nozzles and one or more heater elements corresponding to each nozzle. Each heater element is configured to heat a bubble forming liquid in the printhead to a temperature above its boiling point to form a gas bubble therein. The generation of the bubble causes the ejection of a drop of an ejectable liquid (such as ink) through the respective corresponding nozzle, to effect printing. The printhead includes a structure which is less than 10 microns thick, on which the nozzles are incorporated.
    Type: Grant
    Filed: November 23, 2002
    Date of Patent: November 30, 2004
    Inventor: Kia Silverbrook
  • Patent number: 6820967
    Abstract: There is disclosed an ink jet printhead which comprises a plurality of nozzles and one or more heater elements corresponding to each nozzle. Each heater element is configured to heat a bubble forming liquid in the printhead to a temperature above its boiling point to form a gas bubble therein. The generation of the bubble causes the ejection of a drop of an ejectable liquid (such as ink) through the respective corresponding nozzle, to effect printing. Each heater element is formed of solid material, more than 90% of which, by atomic proportion, is constituted by at least one element, from the periodic table of elements, having an atomic number below 50.
    Type: Grant
    Filed: November 23, 2002
    Date of Patent: November 23, 2004
    Assignee: Silverbrook Research PTY LTD
    Inventor: Kia Silverbrook
  • Patent number: 6814430
    Abstract: A fluid controlling apparatus having a multi-layer structure that includes a top layer having a yield strength of less than about 500 megapascals, a middle layer having a yield strength of greater than about 1000 megapascals, and a bottom layer having a yield strength of less than about 500 megapascals.
    Type: Grant
    Filed: May 21, 2003
    Date of Patent: November 9, 2004
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Julie J. Cox, John A. Compton
  • Patent number: 6811715
    Abstract: A method for producing an ink jet recording head, comprising steps of forming, on a substrate, a solid layer composed of soluble resin and having a pattern for constituting a liquid flow path; forming an inorganic film by low temperature film formation so as to cover the solid layer; forming a layer of a head forming material so as to cover the inorganic film; removing a part of the inorganic film for forming a discharge port; and removing the solid film thereby forming a liquid flow path communicating with the discharge port.
    Type: Grant
    Filed: February 22, 2002
    Date of Patent: November 2, 2004
    Assignee: Canon Kabushiki Kaisha
    Inventor: Toshio Suzuki
  • Publication number: 20040207697
    Abstract: A method for manufacturing an ejection head (10) or ejector suitable for ejecting in the form of droplets (16) a liquid (14) conveyed inside the ejection head (10), comprising a step of producing, from a silicon wafer, a nozzle plate (12) having at least one ejection nozzle (13); a step of producing, from another silicon wafer, a substrate (11) having at least one actuator (15) for activating the ejection of the droplets of liquid through the nozzle (13); and a step of joining the nozzle plate (12) and the substrate (11) together to form the ejection head, wherein this joining step comprises the production of a junction (25), made by means of the anodic bonding technology, between the substrate (11) and the nozzle plate (12), in such a way that, in the area of this junction (25), the ejection head (10) does not present structural discontinuities, and also possesses a resistance to chemical corrosion by the liquid (14) contained in the ejection head (10) at least equal to that of the silicon constituting both
    Type: Application
    Filed: April 27, 2004
    Publication date: October 21, 2004
    Applicant: Olivetti Tecnost S.P.A.
    Inventor: Renato Conta
  • Patent number: 6805431
    Abstract: An inkjet printhead heater chip has a silicon substrate with a heater stack formed of a plurality of thin film layers thereon for ejecting an ink drop during use. The thin film layers include: a thermal barrier layer on the silicon substrate; a resistor layer on the thermal barrier layer; a doped diamond-like carbon layer on the resistor layer; and a cavitation layer on the doped diamond-like carbon layer. The doped diamond-like carbon layer preferably includes silicon but may also include nitrogen, titanium, tantalum, combinations thereof or other. When it includes silicon, a preferred silicon concentration ranges from 20 to 25 atomic percent. A preferred cavitation layer includes an undoped diamond-like carbon, tantalum or titanium layer. The doped diamond-like carbon layer ranges in thickness from 500 to 3000 angstroms. The cavitation layer ranges from 500 to 6000 angstroms. Inkjet printheads and printers are also disclosed.
    Type: Grant
    Filed: December 30, 2002
    Date of Patent: October 19, 2004
    Assignee: Lexmark International, Inc.
    Inventors: Frank Edward Anderson, Byron V Bell, Yimin Guan, George Keith Parish, Robert Cornell
  • Publication number: 20040196335
    Abstract: A fluid ejection device comprises a substrate having a first surface; a fluid ejector formed over the first surface; and a cover layer defining a firing chamber formed about the fluid injector, and defining a nozzle over the firing chamber. The cover layer is formed by at least two SU8 layers.
    Type: Application
    Filed: April 14, 2004
    Publication date: October 7, 2004
    Inventors: Joe E. Stout, Thomas R. Strand, Jeremy H. Donaldson, Paul Benning
  • Patent number: 6799839
    Abstract: A structure having a base plate, such as silicon, provided with a through hole makes it possible to curtail the process numbers at the time of manufacture, while enhancing the reliability thereof. When the through hole is provided by anisotropic etching from the backside of the base plate, a silicon nitride film, which becomes membrane on the surface side of the base plate is formed so as not to allow etching solution from leaking to the surface side of the base plate. It is preferable to form the silicon nitride film using plasma CVD method to make the inner stress of the silicon nitride film a compression stress of 3×108 Pa or less.
    Type: Grant
    Filed: October 18, 2002
    Date of Patent: October 5, 2004
    Assignee: Canon Kabushiki Kaisha
    Inventors: Yukihiro Hayakawa, Genzo Momma
  • Patent number: 6799838
    Abstract: The invention provides a liquid discharge head, a substrate for the head, a liquid discharge method, and a liquid discharge apparatus, in which a high gradation can be easily obtained and simplification of a circuit formation and miniaturization of a recording head can be achieved. According to the present invention, a liquid discharge head comprises a heat generating element for generating thermal energy which is used for discharging liquid from a discharge port, and a protective layer for protecting the heat generating element, provided on the heat generating element. In the discharge head, the protective layer has a first region with a substantially uniform and desired thickness and a second region with a substantially uniform thickness thinner than said desired thickness, the volume of liquid droplets discharged from the discharge port is changed by changing electric energy applied to the heat generating element.
    Type: Grant
    Filed: August 30, 1999
    Date of Patent: October 5, 2004
    Assignee: Canon Kabushiki Kaisha
    Inventors: Masahiko Kubota, Masaru Iketani
  • Patent number: 6785956
    Abstract: A fluid-jet printhead has a substrate having at least one layer defining a fluid chamber for ejecting fluid. The printhead also includes a resistive layer disposed between the fluid chamber and the substrate wherein the fluid chamber has a smooth planer surface between the fluid chamber and the substrate. The printhead has a conductive layer disposed between the resistive layer and the substrate wherein the conductive layer and the resistive layer are in direct parallel contact. The conductive layer forms at least one void creating a planar resistor in the resistive layer. The planar resistor is aligned with the fluid chamber.
    Type: Grant
    Filed: May 13, 2002
    Date of Patent: September 7, 2004
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Genbao Xu, Zhizang Chen, Mark Alan Johnstone, John P. Whitlock
  • Patent number: 6786575
    Abstract: An ink jet heater chip having improved thermal. The chip includes a semiconductor substrate, a first metal resistive, a second metal conductive layer on a first portion of the resistive layer and on a second portion of the resistive layer defining a heater resistor element. A passivation layer having a thickness defined by a deposition process is deposited on the second metal conductive layer and heater resistor element. A cavitation layer is deposited on the passivation layer and etched. A dielectric layer is deposited and etched to provide a dielectric layer overlying the first portion of the resistive layer. An electrical conduit via is etched in the dielectric layer. A third metal conductive layer is deposited in the via for electrical contact with the second metal conductive layer. Separately deposited dielectric and passivation layers enable independent control of the thickness of the dielectric and passivation layers.
    Type: Grant
    Filed: December 17, 2002
    Date of Patent: September 7, 2004
    Assignee: Lexmark International, Inc.
    Inventors: Frank Edward Anderson, George Keith Parish
  • Publication number: 20040155942
    Abstract: An emission device for ejecting a liquid drop, and methods of operating and manufacturing same are provided. The device includes a structure defining a chamber volume adapted to receive a liquid and has a nozzle orifice through which a drop of received liquid can be emitted. The chamber volume defining structure includes a membrane portion having a plurality of individually deformable portions. A controller is adapted to selectively actuate at least one of the plurality of individually deformable portions of the membrane.
    Type: Application
    Filed: February 6, 2003
    Publication date: August 12, 2004
    Applicant: Eastman Kodak Company
    Inventors: Constantine N. Anagnostopoulos, Michael N. Debar, Edward P. Furlani
  • Patent number: 6773091
    Abstract: The present invention relates to a liquid discharge device, and a method of manufacturing the liquid discharge device. Particularly, the present invention relates to a liquid discharge device in a system in which droplets are ejected by heating with a heating element, and which is capable of effectively avoiding deterioration in reliability due to damage to a protecting layer. In the present invention, heat treatment is performed for stabilizing the connection between the heating element and a wiring pattern, and then an anti-cavitation layer is formed.
    Type: Grant
    Filed: December 2, 2002
    Date of Patent: August 10, 2004
    Assignee: Sony Corporation
    Inventors: Takaaki Miyamoto, Shogo Ono, Osamu Tateishi, Toshimitsu Sato
  • Patent number: 6767081
    Abstract: A thermal head includes a heat insulating layer made up of an electrically-conductive multiple low oxide ceramic layer of low thermal conductivity made of a chemical compound of Si, plural transition metals and oxygen. A first insulating layer made up of an insulated multiple high nitride ceramic layer of low thermal conductivity made of a chemical compound of at least Si, plural transition metals and nitrogen is formed on the heat insulating layer, and a second insulating layer made up of an SiO2 layer of high insulation characteristics or an Al2O3 layer is formed on the first insulating layer.
    Type: Grant
    Filed: November 25, 2002
    Date of Patent: July 27, 2004
    Assignee: Alps Electric Co., Ltd.
    Inventors: Takashi Shirakawa, Satoshi Kubo, Masahisa Jumonji
  • Patent number: 6767474
    Abstract: A fluid ejector head, includes a fluid definition layer defining a chamber, the fluid definition layer having a substantially planar passivation surface. In addition, the fluid ejector head includes a sacrificial material filling the chamber that is planarized to the plane formed by the passivation surface. Further, the fluid ejector head includes a passivation layer, having substantially planar opposed major surfaces, formed on the planar passivation surface; and a resistive layer having substantially planar opposed major surfaces in contact with the passivation layer.
    Type: Grant
    Filed: July 19, 2002
    Date of Patent: July 27, 2004
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Kenneth E Trueba, Ronnie J. Yenchik, Ronald A. Hellekson
  • Publication number: 20040130600
    Abstract: To ensure satisfactory reliability even if the wiring pattern is formed of a wiring material having an enhanced electromigration resistance, by providing a protective layer for protecting heating elements from dry etching for forming a wiring pattern, on the ink chamber side or other liquid chamber side of each heating element.
    Type: Application
    Filed: October 8, 2003
    Publication date: July 8, 2004
    Inventors: Takaaki Miyamoto, Minoru Kohno
  • Publication number: 20040125174
    Abstract: An inkjet printhead heater chip has a silicon substrate with a heater stack formed of a plurality of thin film layers thereon for ejecting an ink drop during use. The thin film layers include: a thermal barrier layer on the silicon substrate; a resistor layer on the thermal barrier layer; a doped diamond-like carbon layer on the resistor layer; and a cavitation layer on the doped diamond-like carbon layer. The doped diamond-like carbon layer preferably includes silicon but may also include nitrogen, titanium, tantalum, combinations thereof or other. When it includes silicon, a preferred silicon concentration ranges from 20 to 25 atomic percent. A preferred cavitation layer includes an undoped diamond-like carbon, tantalum or titanium layer. The doped diamond-like carbon layer ranges in thickness from 500 to 3000 angstroms. The cavitation layer ranges from 500 to 6000 angstroms. Inkjet printheads and printers are also disclosed.
    Type: Application
    Filed: December 30, 2002
    Publication date: July 1, 2004
    Inventors: Frank Edward Anderson, Byron V. Bell, Yimin Guan, George Keith Parish, Robert Cornell
  • Patent number: 6719406
    Abstract: There is disclosed an ink jet printhead which comprises a plurality of nozzles and one or more heater elements corresponding to each nozzle. Each heater element is configured to heat a bubble forming liquid in the printhead to a temperature above its boiling point to form a gas bubble therein. The generation of the bubble causes the ejection of a drop of an ejectable liquid (such as ink) through the respective corresponding nozzle, to effect printing. Each heater element is substantially covered by a conformal protective coating which has been applied to all sides of the heater element simultaneously so that the coating is seamless.
    Type: Grant
    Filed: November 23, 2002
    Date of Patent: April 13, 2004
    Assignee: Silverbrook Research Pty Ltd
    Inventors: Kia Silverbrook, Angus John North
  • Patent number: 6719407
    Abstract: In a thermal head capable of performing printing of high quality while preventing foreign matters such as dirt or the like from accumulating in a portion, on which a heat reserving layer is formed, at the time of printing, the heat reserving layer comprising a projection formed by partially projecting a surface of the layer and having a top, the projection being provided on a surface thereof with heating elements, the projection being shaped in cross section in a direction perpendicular to a direction of arrangement of the heating elements to form an inclined surface on one surface side, which is formed to be lower than the other surface side. The projection is formed so that a height thereof from the one surface side is 5 to 50 &mgr;m.
    Type: Grant
    Filed: November 25, 2002
    Date of Patent: April 13, 2004
    Assignee: Alps Electric Co., Ltd.
    Inventor: Hiroshi Kobayashi
  • Patent number: 6715859
    Abstract: A passivation layer for a thermal ink jet printhead is provided. The material of the passivation layer can be a Co-based alloy with 25-30 wt % Cr or an Fe-based alloy with ≦10 wt. % Co, ≦20 wt. % Cr, ≦10 wt. % Mn. The passivation layer is amorphous and the surface is substantially atomically smooth or has a controlled surface roughness. The passivation layer displays resistance to cavitation and chemical corrosion and is conformally disposed over a resistor by sputtering or other physical vapor deposition techniques.
    Type: Grant
    Filed: June 6, 2001
    Date of Patent: April 6, 2004
    Assignee: Hewlett -Packard Development Company, L.P.
    Inventor: Alfred I-Tsung Pan
  • Patent number: 6704996
    Abstract: The invention provides a method for reducing ink corrosion of exposed metal layers on a chip surface of a semiconductor chip for an ink jet printhead. The method includes depositing a protective layer in a plasma process to the chip surface, the protective layer being deposited adjacent ink ejectors so that the protective layer substantially circumscribes an ink via in the chip. A thick film layer is applied to the protective layer and chip, whereby the protective layer and thick film layer are sufficient to promote increased adhesion between the thick film layer and a nozzle plate attached to the thick film layer thereby substantially reducing a tendency for the nozzle plate and thick film layer to delaminate from one another during printhead manufacture or use and interrupting contact between ink and the exposed metal layers on the chip surface.
    Type: Grant
    Filed: February 3, 2003
    Date of Patent: March 16, 2004
    Assignee: Lexmark International, Inc.
    Inventors: Jim Michael Mrvos, George Keith Parish, Kristi Maggard Rowe
  • Publication number: 20040027424
    Abstract: An ink-jet printhead and a method of manufacturing the same include utilizing a substrate on which at least one heater and a passivation layer protecting the at least one heater are formed, a passage plate which forms an ink chamber corresponding to the at least one heater, and a nozzle plate in which an orifice corresponding to the ink chamber is formed. The passage plate and the nozzle plate are formed of photoresist, and an adhesion layer formed of silicon-family low-temperature deposition material at a temperature limited by the characteristics of the passage plate is disposed between the passage plate and the nozzle plate.
    Type: Application
    Filed: April 16, 2003
    Publication date: February 12, 2004
    Applicant: SAMSUNG Electronics Co., Ltd.
    Inventor: Yun-Gi Kim
  • Patent number: 6688730
    Abstract: A method of preserving a recording head which includes an ink flow path by which the ink is supplied and a discharge port in communication with the ink flow path to discharge the ink supplied into the ink flow path; is connected to an ink tank in the recording apparatus in such a way to be removably attached to or detached from the ink tank, to allow the ink to be discharged from the discharge port; and uses a reactive ink as the recording ink containing a colorant and reactive component reactive with another ink, comprises a step of examining discharging conditions of the recording head using an ink for examination of a composition free of the reactive component, which is supplied into the ink flow path, and a step of step of preserving the recording head for preservation by replacing the ink for examination remaining in the ink flow path in the recording head by an ink for preservation containing neither the colorant nor reactive component, after the step of examining discharging conditions is over.
    Type: Grant
    Filed: August 31, 2001
    Date of Patent: February 10, 2004
    Assignee: Canon Kabushiki Kaisha
    Inventors: Noriyasu Asaki, Hiroyuki Kigami, Teruo Ozaki, Hiroki Tajima
  • Publication number: 20040017437
    Abstract: In a substrate for an ink jet head used for an ink jet head recording apparatus, electrostatic breakdown of a diode sensor functional as a substrate temperature sensing element is prevented. A protective element is electrically connected between a diode sensor and an input/output pad for the diode sensor.
    Type: Application
    Filed: July 17, 2003
    Publication date: January 29, 2004
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Takaaki Yamaguchi, Yoshiyuki Imanaka, Takuya Hatsui, Muga Mochizuki, Souta Takeuchi, Kousuke Kubo
  • Patent number: 6682187
    Abstract: An ink-jet recording a water-based ink from an ink chamber through a nozzle hole, wherein the ink chamber contacting with the water-based ink is constructed by jointing plural construction members with an epoxy adhesive, and the water-based in contains a coloring material, a first organic solvent, and a second organic solvent each having properties of a specific organicity and inorganicity. This method enables to enhance the stability of ejection of ink droplets without shortening the life of the head.
    Type: Grant
    Filed: September 12, 2001
    Date of Patent: January 27, 2004
    Inventors: Tomomi Yoshizawa, Yasuhiko Kawashima
  • Publication number: 20040012654
    Abstract: An ink jet recording head and an ink jet recording apparatus using the ink jet recording head are disclosed. The adhesion between a substrate and a discharge port forming member can be improved. In order to further reduce the size of the substrate by further optimizing the arrangement of an inspection pad, at least a recording element protecting section covers the upper part of a recording element row with a conductivity, and at least an electrical circuit element protecting section covers the upper part of an electrical circuit element row with a conductivity. An inspection electrode pad is electrically connectable with the recording element protecting section and the electrical circuit element protecting section.
    Type: Application
    Filed: July 14, 2003
    Publication date: January 22, 2004
    Applicant: Canon Kabushiki Kaisha
    Inventors: Souta Takeuchi, Yoshiyuki Imanaka, Takuya Hatsui, Muga Mochizuki, Takaaki Yamaguchi, Kousuke Kubo
  • Patent number: 6663228
    Abstract: A base member for an ink jet head, the base member comprising a substrate, a heat generating resistor provided between electrodes which constitute a pair on the substrate an upper protection layer provided on an insulation layer which in turn is provided on the heat generating resistor, the upper protection layer having a contact surface contactable to ink, the improvement residing in that the upper protection layer is made of amorphous alloy having a following composition formula: Ta&agr;Fe&bgr;Ni&ggr;Cr&dgr;  where 10 atomic %≦&agr;≦30 atomic %, &agr;+&bgr;<80 atomic % &agr;<&bgr;, &dgr;>&ggr; and, &agr;+&bgr;+&ggr;+&dgr;=100 atomic %, and, at least the contact surface of the upper protection layer contains an oxide of a constituent component.
    Type: Grant
    Filed: September 25, 2002
    Date of Patent: December 16, 2003
    Assignee: Canon Kabushiki Kaisha
    Inventors: Ichiro Saito, Masahiko Ogawa, Teruo Ozaki, Masahiko Kubota, Muga Mochizuki
  • Patent number: 6644790
    Abstract: To provide an ink-jet head substrate enabling both highly koge. characteristic ink and corrosive ink to be used, an ink-jet head using the same basis and an ink-jet recording apparatus equipped with the same head. The ink-jet head substrate includes: heat generating resistors forming heat generating sections on a base; electrode wires electrically connected to the heat generating resistors; and anti-cavitation films installed via an insulator protective layer on the heat generating resistors and the electrode wires, in which the anti-cavitation film is formed of materials varying with individual given areas on the base.
    Type: Grant
    Filed: July 30, 2001
    Date of Patent: November 11, 2003
    Assignee: Canon Kabushiki Kaisha
    Inventors: Teruo Ozaki, Masami Kasamoto, Shuji Koyama, Junichiro Iri
  • Publication number: 20030202050
    Abstract: The invention provides a method for reducing ink corrosion of exposed metal layers on a chip surface of a semiconductor chip for an ink jet printhead. The method includes depositing a protective layer in a plasma process to the chip surface, the protective layer being deposited adjacent ink ejectors so that the protective layer substantially circumscribes an ink via in the chip. A thick film layer is applied to the protective layer and chip, whereby the protective layer and thick film layer are sufficient to promote increased adhesion between the thick film layer and a nozzle plate attached to the thick film layer thereby substantially reducing a tendency for the nozzle plate and thick film layer to delaminate from one another during printhead manufacture or use and interrupting contact between ink and the exposed metal layers on the chip surface.
    Type: Application
    Filed: February 3, 2003
    Publication date: October 30, 2003
    Inventors: Jim Michael Mrvos, George Keith Parish, Kristi Maggard Rowe
  • Patent number: 6637866
    Abstract: The present invention is directed toward an improved heater chip for an ink jet printer. The heater chip has a diamond-like-carbon coating that functions as the cavitation and passivation layers of the heating elements on the heater chip. To improve the efficiency of the heater chip, the diamond-like-carbon coating is surrounded by a material that has a lower thermal conductivity than diamond. This surrounding layer limits thermal diffusion from the heating elements into the heater chip. A smoothing layer of tantalum is deposited over the diamond-like-carbon layer to insure that vaporization of the ink occurs at the ink's superheat limit. The diamond-like-carbon layer is preferably less than 8700 Angstroms in thickness such that less than 1 microjoule of energy is required to expel of ink droplet having a mass between 2-4 nanograms.
    Type: Grant
    Filed: June 7, 2002
    Date of Patent: October 28, 2003
    Assignee: Lexmark International, Inc.
    Inventors: Robert Wilson Cornell, George Keith Parish, James Harold Powers
  • Patent number: 6619779
    Abstract: An ink-jet printer head includes a base plate having ink channels penetrating through the base plate, through which ink is supplied, a hollow heat driving section formed in the base plate and encircling an exit of the ink channels, an ink chamber barrier stacked on the base plate for serving as a side wall of an ink chamber where ink is reserved, and a nozzle plate stacked on the ink chamber barrier and having a nozzle which communicates with the ink channels and the ink chamber coaxially. Accordingly, an area occupied by the unit nozzle can be reduced, and ink flow in the ink chamber is easily controlled, thereby enhancing a printing speed and a print quality.
    Type: Grant
    Filed: September 28, 2001
    Date of Patent: September 16, 2003
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Chan-bong Jeon, Chang-Youl Moon, Min-soo Kim
  • Patent number: 6607264
    Abstract: A fluid controlling apparatus having a multi-layer structure that includes a top layer having a yield strength of less than about 500 megapascals, a middle layer having a yield strength of greater than about 1000 megapascals, and a bottom layer having a yield strength of less than about 500 megapascals.
    Type: Grant
    Filed: June 18, 2002
    Date of Patent: August 19, 2003
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Julie J. Cox, John A. Compton
  • Publication number: 20030151646
    Abstract: The present invention relates to a liquid discharge device, and a method of manufacturing the liquid discharge device. Particularly, the present invention relates to a liquid discharge device in a system in which droplets are ejected by heating with a heating element, and which is capable of effectively avoiding deterioration in reliability due to damage to a protecting layer. In the present invention, heat treatment is performed for stabilizing the connection between the heating element and a wiring pattern, and then an anti-cavitation layer is formed.
    Type: Application
    Filed: December 2, 2002
    Publication date: August 14, 2003
    Inventors: Takaaki Miyamoto, Shogo Ono, Osamu Tateishi, Toshimitsu Sato
  • Publication number: 20030142172
    Abstract: An adhesive joint with an ink trap is provided. The joint may be employed in a cartridge for an inkjet printer. The cartridge includes a headland region attached to a printhead assembly by an adhesive layer. The adhesive joint between the headland region and the printhead assembly include notches for retaining additional adhesive in order to reduce degradation of adhesive due to ink penetration. A method of assembling the printer cartridge to include an ink trap in the adhesive joint is also provided.
    Type: Application
    Filed: January 31, 2002
    Publication date: July 31, 2003
    Inventors: Charles G. Schmidt, Joseph R. Elliot, James E. Clark
  • Patent number: 6598961
    Abstract: A bubble-jet type ink-jet printhead, includes a substrate, a nozzle plate, a wall, and a heater, wherein the heater is interposed between the substrate and the nozzle plate to divide an ink chamber into a main ink chamber and a secondary ink chamber, wherein a main bubble and a secondary bubble are generated. The printhead may further include an ink channel for introducing ink into the secondary ink chamber for supplying the ink to the main ink chamber. The printhead according to the present invention consumes less energy, prevents a backflow of ink, and operates at increased speed.
    Type: Grant
    Filed: November 29, 2001
    Date of Patent: July 29, 2003
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Keon Kuk, Doo-jin Maeng, Yong-soo Oh
  • Patent number: 6575563
    Abstract: An ink jet printer forms printed images by ejecting droplets of ink onto a print medium at a stable velocity. The printer includes an ink jet print head having nozzles through which the droplets of ink are ejected. The print head includes a heater chip having heating elements, each of which is associated with a corresponding one of the nozzles. Each heating element transfers heat into adjacent ink at a predetermined rate sufficient to maintain the stable velocity of the droplets of ink, where the predetermined rate of heat transfer is accomplished when a predetermined minimum power level is applied to the heating element. Each heating element includes a heater resistor and a protective layer having a protective layer thickness. Each heater resistor has a heater resistor area and a heater resistor thickness, and is operable to provide a predetermined minimum power density per unit area when the predetermined minimum power level is applied.
    Type: Grant
    Filed: August 5, 2002
    Date of Patent: June 10, 2003
    Assignee: Lexmark International, Inc.
    Inventor: Robert Wilson Cornell
  • Publication number: 20030103113
    Abstract: In a thermal head capable of performing printing of high quality while preventing foreign matters such as dirt or the like from accumulating in a portion, on which a heat reserving layer is formed, at the time of printing, the heat reserving layer comprising a projection formed by partially projecting a surface of the layer and having a top, the projection being provided on a surface thereof with heating elements, the projection being shaped in cross section in a direction perpendicular to a direction of arrangement of the heating elements to form an inclined surface on one surface side, which is formed to be lower than the other surface side. The projection is formed so that a height thereof from the one surface side is 5 to 50 &mgr;m.
    Type: Application
    Filed: November 25, 2002
    Publication date: June 5, 2003
    Applicant: Alps Electric Co., Ltd.
    Inventor: Hiroshi Kobayashi
  • Publication number: 20030103112
    Abstract: In the present invention, with an aim of providing a thermal head capable of being driven with reduced power requirements by preventing the thermal efficiency from being deteriorated due to thermal diffusion, the first embodiment is characterized in that on top of a substrate, there is formed a heat insulating layer made up of an electrically-conductive multiple low oxide ceramic layer of low thermal conductivity made of a chemical compound of Si, plural transition metals and oxygen; and that there are stacked and formed, on top of the heat insulating layer, a first insulating layer made up of an insulated multiple high nitride ceramic layer of low thermal conductivity made of a chemical compound of at least Si, plural transition metals and nitrogen, and on top of the first insulating layer, a second insulating layer made up of an SiO2 layer of high insulation characteristics or an Al2O3 layer.
    Type: Application
    Filed: November 25, 2002
    Publication date: June 5, 2003
    Applicant: Alps Electric Co., Ltd.
    Inventors: Takashi Shirakawa, Satoshi Kubo, Masahisa Jumonji
  • Patent number: 6567251
    Abstract: This present invention is embodied in a system and a method for protecting an electrically-inactive component of a microsystem from an ESD event. The invention includes embodiments that protect the microsystem from ESD events that directly strike an electrically-inactive component and that are external to the electrically-inactive component. These embodiments include an ESD dissipation device having a connected chain of electrically-inactive components that are electrically floating as well as embodiments whereby the electrically-inactive components are held at the same potential as an electrical component. Furthermore, these embodiments include a sacrificial ESD breakdown device that provides a preferential ESD breakdown site away from the protected component and embodiments that provide a capacitively coupled thin-film layers that provide shielding to an electrically-inactive component.
    Type: Grant
    Filed: August 30, 1999
    Date of Patent: May 20, 2003
    Assignee: Hewlett-Packard Development Company
    Inventors: Donald W. Schulte, Robert W. Shreeve
  • Publication number: 20030081070
    Abstract: A driver transistor structure of an inkjet print head chip and the method for making the same. Having several body contacts distributed all over the source of an active region of a large area MOSFET (Metal Oxide Semiconductor Field Effect Transistor), an equivalent RB from the MOSFET channel to the body contact is greatly diminished as the distance between them is reduced, thereby preventing the occurrence of a secondary breakdown. Since the body contact is installed inside the active region without defining in advance a body contact region and making the body contact in the field oxide layer outside the active region, about 20% of the driver transistor structure can be saved to lower the average manufacturing cost of each chip.
    Type: Application
    Filed: January 8, 2002
    Publication date: May 1, 2003
    Inventors: Chien-Hung Liu, Jian-Chiun Liou, Charles C. Chang, Je-Ping Hu, Chun-Jung Chen
  • Publication number: 20030071877
    Abstract: In one embodiment of the present invention, a passivation layer of a fluid ejection device is formed by an atomic layer epitaxy process.
    Type: Application
    Filed: October 16, 2001
    Publication date: April 17, 2003
    Inventor: Ulrich E. Hess