Abstract: According to the present invention, for a pattern inspection apparatus that compares images in corresponding areas of two patterns that are identical and that determines an unmatched portion between the images is a defect, a plurality of detection systems and a plurality of corresponding image comparison methods are provided. With this configuration, the affect of uneven brightnesses for a pattern that occurs due to differences in film thicknesses can be reduced, a highly sensitive pattern inspection can be performed, a variety of defects can be revealed, and the pattern inspection apparatus can be applied for processing performed within a wide range. Furthermore, the pattern inspection apparatus also includes a unit for converting the tone of image signals of comparison images for a plurality of different processing units, and when a difference in brightness occurs in the same pattern of the images, a defect can be correctly detected.

Abstract: A camera module includes a sensor chip having a backside surface and a main surface including a sensor forming region and a sensor peripheral region surrounding the sensor forming region, in which a light receiving portion is disposed in the sensor forming region; a lens chip having a non-lens forming surface and a lens forming surface including a lens forming region and a lens peripheral region surrounding the lens forming region, in which a lens portion disposed in the lens forming region; a spacer portion for bonding the sensor peripheral region to the lens peripheral region with a specific space in between so that the light receiving portion faces the lens portion; and a cover including an opening portion for passing light from outside toward the lens portion and the light receiving portion.

Abstract: A pulsed thermography defect detection apparatus including active and passive infrared (IR) thermography for non-destructive testing (NDT) of powdermetallic (P/M) components for on-line and off-line inspection.

Abstract: First, a pattern inspection apparatus detects the first edge from an image of a pattern to-be-inspected. Next, the pattern inspection apparatus conducts matching of the image of the pattern to-be-inspected and the first reference pattern by comparing the first edge and an edge of the first reference pattern. Since, as a result of the matching, a shift quantity S1 can be obtained, and then the first reference pattern is shifted by this shift quantity S1. Subsequently the pattern to-be-inspected is inspected by comparing the first edge and the edge of the first reference pattern so shifted. In this first inspection, pattern deformation quantities are obtained and defects are detected. A shift quantity S2 can be obtained as one of the pattern deformation quantities. Next, in order to detect the second edge from the pattern image to-be-inspected, the corresponding second reference pattern is shifted by a shift quantity S1+S2.

Abstract: A device for inspecting a tyre (10), in particular by means of an interferometric measuring method, is provided with a measuring head (20), which is used to scan the tyre (10) in order to produce a measured result (70, 71, 72). The device is also equipped with a location element (30), which allows the measuring head (20) to be located and aligned in a monitoring position. In addition, the device is provided with a control and display unit (40), which allows the location element to be controlled and the measured result (70, 71, 72) to be displayed. To achieve the simple control of the measuring head (20) and a reliable evaluation of the measured result (70, 71, 72), the control and display unit (40) has at least one display field (44, 45, 62) for displaying the monitoring position or the monitoring direction of the measuring head (20) in relation to the tyre (10).

Abstract: This invention comprises a system and a method for inspecting the inside of delayed petroleum coking vessels to determine deformations, detect and determine the severity of other defects and visually observe the inside of the inspected vessel.

Abstract: An abnormality detecting apparatus for an imaging apparatus that detects a presence of abnormalities in imaging apparatuses mounted on a vehicle to capture vehicle surroundings, which includes: a luminance variance value calculating device that calculates a luminance variance value of each image from the imaging apparatuses using the luminance value of each image from the imaging apparatuses obtained by the imaging apparatuses; and an abnormality detecting device that detects the presence of abnormalities in any of the imaging apparatuses in accordance with the luminance variance values calculated by the luminance variance value calculating device.

Abstract: There have been disclosed a surface inspection method and a surface inspection apparatus for inspecting the surface of an article, the surface being almost flat and continuous and having non-flat parts with convex shapes and concave shapes provided based on specifications, capable of inspecting for defective parts in the non-flat parts without detecting the non-flat parts as defective parts. The surface inspection apparatus comprises an image pickup device, a correction data calculation unit for calculating non-flat part correction data for making the image of the non-flat part into one equivalent to the image of the flat part based on the difference between the image of the non-flat part and the image of the flat part, a non-flat correction unit for correcting the image of the non-flat part based on the non-flat part correction data, and a defect detection unit for detecting defects on the article surface by processing the image of the article surface after correcting the image of the non-flat part.

Abstract: A system, method, and device may include software and hardware which simplify and quicken configuration of the system for testing a device, enhance testing procedures which may be performed, and provide data via which to easily discern a cause and nature of an error which may result during testing. A camera may capture still images of a display screen of a tested device and another camera may capture video images of the tested device and a partner device. A wizard may be used to generate a configuration file based on one previously generated for a similar device. A mount for a tested device may be structured so that: it is suitable for mounting thereon a plurality of differently structured devices; and adjustments in a vertical direction and a horizontal direction in a plane and adjustments of an angle of the device relative to the plane may be easily made.

Abstract: The present invention relates to a high-sensitivity inspection method and apparatus adapted for the fine-structuring of patterns, wherein defect inspection sensitivity is improved using the following technologies: detection optical system is improved in resolution by filling the clearance between an objective lens 30 and a sample 1, with a liquid, and increasing effective NA (Numerical Aperture); and when a transparent interlayer-insulating film is formed on the surface of the sample, amplitude splitting at the interface between the liquid and the insulating film is suppressed for reduction in the unevenness of optical images in brightness due to interference of thin-film, by immersing the clearance between the objective lens and the sample, with a liquid of a refractive index close to that of the transparent film.

Abstract: A highly reliable defect automatic classifying method and apparatus capable of flexibly coping with a request for classifying a defect given by each user without having to collect lots of teach data items. A classifying class arrangement is defined by a user by combining classes supplied by the system itself or classes defined by the user and, further, a priori knowledge on the defect class is given by the user as a restriction so as to carry out restricted learning.

Abstract: A screen printing apparatus and method for printing deposits of material onto a workpiece, the apparatus comprising an inspection station for determining a positional relationship of features on upper and lower surfaces of the workpiece. The inspection station comprises an imaging system for determining a positional relationship of features on upper and lower surfaces of the workpiece. The imaging system comprises at least two spaced imaging units for imaging features on an upper surface of the workpiece and at least two spaced imaging units for imaging features on a lower surface of the workpiece. A processing unit determines a positional relationship of the imaged features on the upper and lower surfaces of the workpiece. A printing station prints deposits of material onto the workpiece. Also described are a transport mechanism and an alignment system.

Abstract: A monitoring system for use with a sewing machine. The monitoring system includes a camera assembly mounted to a base of the sewing machine with a camera that collects images from a bottom side of the fabric. The camera assembly delivers images of the back side of the fabric to a monitor assembly that includes a display device. The display device displays the images collected by the camera. The monitor can be mounted to an upper or arm portion of the sewing machine for convenient viewing by the operator during use of the sewing machine.

Abstract: A wind turbine monitoring system having a central monitoring device and one or more wind turbines. The central monitoring device is capable of receiving signals from one or more wind turbines. The wind turbines each include one or more cameras arranged and disposed to provide visual signals transmittable to the central monitoring device. The visual signals generated by the cameras provide sufficient information to the central monitoring device to determine whether maintenance to the wind turbine is required. A method for providing maintenance to a wind turbine is also disclosed.

Abstract: A method and system for optimizing a data structure for manipulation of matrices in a parallel environment limits computational branching. The data structure further is further optimized for linear data storage and synchronization among multiple processing threads.

Abstract: A pattern formation device includes a conveyance table, a pair of guide rails, a carriage, a plurality of droplet discharge heads, an inspection camera, a camera base, a linear motor, a motor housing case, a moving cable, and a cable housing case. The motor housing case is disposed along the guide rails to accommodate the linear motor and has a guide opening configured and arranged to guide the camera base. The cable housing case is disposed along the motor housing case to accommodate the moving cable and has a window section through which a distal end of the moving cable follows a reciprocal operation of the inspection camera. The cable housing case or one of the guide rails has an exhaust vent to discharge air around the carriage by suction through the window section of the cable housing case or the guide opening of the motor housing case.

Abstract: A machine comprises an enclosure; a plurality of parts within the enclosure; and a visual conduit for providing a view inside of the enclosure for detection of visible signs of failure of the machine. The concept of a visual conduit encompasses a broad variety of devices including cameras inside the enclosure that provide images of the interior of the enclosure and alternatively selective transparency or translucence of the enclosure relative to at least some of the parts of the machine housed within the enclosure.

Abstract: A system and method for capturing debug information are disclosed. In one aspect, a method comprises connecting a portable test device having a memory and no processor to a television, the test device having stored therein a debug program configured to be executed by a control unit of the television to capture debug information from the television and store the captured debug information on the test device.

Abstract: An automated system for analyzing mask defects in a semiconductor manufacturing process is presented. This system combines results from an inspection tool and design layout data from a design data repository corresponding to each mask layer being inspected with a computer program and a predetermined rule set to determine when a defect on a given mask layer has occurred. Mask inspection results include the presence, location and type (clear or opaque) of defects. Ultimately, a determination is made as to whether to scrap, repair or accept a given mask based on whether the defect would be likely to cause product failure. Application of the defect inspection data to the design layout data for each mask layer being inspected prevents otherwise acceptable wafer masks from being scrapped when the identified defects are not in critical areas of the mask.

Abstract: An automated system for analyzing mask defects in a semiconductor manufacturing process is presented. This system combines results from an inspection tool and design layout data from a design data repository corresponding to each mask layer being inspected with a computer program and a predetermined rule set to determine when a defect on a given mask layer has occurred. Mask inspection results include the presence, location and type (clear or opaque) of defects. Ultimately, a determination is made as to whether to scrap, repair or accept a given mask based on whether the defect would be likely to cause product failure. Application of the defect inspection data to the design layout data for each mask layer being inspected prevents otherwise acceptable wafer masks from being scrapped when the identified defects are not in critical areas of the mask.

Abstract: The present invention relates to a defect detection or observation method that detects fine defects in the course of defect inspection and observation, does not detect locations not constituting defects, or classifies a defect candidate as a grain phenomenon or other phenomenon that does not affect a product.

Abstract: A display device is mounted in a working vehicle equipped with a camera that monitors areas around the working vehicle. The display device includes: a monitor screen; first display means for displaying information about the working vehicle; second display means for displaying an image captured by the camera; first switching means for switching displayed image information; malfunction detection means for detecting a malfunction occured in the working vehicle; warning display means for displaying warning information; operation detecting means for detecting whether the working vehicle is working; and second switching means for automatically switching the image information displayed to the image information input by the first display means, where each referenced display is on the monitor screen. Thus, even if a malfunction occurs in the working vehicle, an operator is made aware of the malfunction in the working vehicle without being hindered from undertaking work while checking the safety.

Abstract: The present invention is an image pickup device provided with a CMOS camera which is provided with a telecentric lens to photograph a sample put in a levitation state at the center inside an electrostatic levitation furnace, a metal halide light source which is positioned on the opposite side of the sample from the CMOS camera to irradiate light with a wavelength of 400 to 450 nm toward the sample, and a digital signal processor which performs image processing for enhancing an edge of an image captured by the CMOS camera in real time to output a position of center of gravity of the sample put in the levitation state, where a blue filter is attached to the CMOS camera. Even if the sample becomes incandescent due to a high temperature, contrast of the sample against a background can be obtained by the image pickup device.

Abstract: A method is provided for the detection of defects on a semiconductor wafer by checking individual pixels on the wafer, collecting the signature of each pixel, defined by the way in which it responds to the light of a scanning beam, and determining whether the signature is that of a faultless pixel or of a pixel that is defective or suspect to be defective. An apparatus is also provided for the determination of such defects, which comprises a stage for supporting a wafer, a laser source generating a beam that is directed onto the wafer, collecting optics and photoelectric sensors for collecting the laser light scattered by the wafer in a number of directions and generating corresponding analog signals, an A/D converter deriving from the signals digital components defining pixel signatures, and selection systems for identifying the signatures of suspect pixels and verifying whether the suspect pixels are indeed defective.

Abstract: A method for inspecting a marine vessel underdeck utilizes a video camera such as a digital video camera with a magnifying or telephoto lens. The method produces a magnified image on a monitor for viewing by an inspector that appears to be no more than about 24 inches (61 cm) away. The method includes the step of filming the underdeck of a distance of about 40-70 feet (12-21 m). The lens provides a focal length of between about 15 feet (4.6 m) and 150 feet (46 m). Thus the method is conducted at a workable focal range of between about 15 feet (4.6 m) and 150 feet (46 m). The lens preferably has a focal length of between 30 feet (9 m) and 75 feet (23 m). The method includes the step of scanning the suspect area of the underdeck of a speed of about 1 inch (2.54 cm) per second to three feet (91.4 cm) per second. The preferred method contemplates scanning of the suspect area of a rate of between about 0.5-1 foot (15.2-30.5 cm) per second.

Abstract: An exemplary method includes identifying defects in a first image among a series of images, by identifying a first portion of the first image at a first location in the first image, wherein a brightness of the first portion is different from a second portion at the first location in a previous image and a third portion at the first location in a subsequent image, by an amount exceeding a first threshold value, determining whether a first region of the first image that includes the first portion, matches a second region of the previous image and a third region of the subsequent image, wherein the second and third regions are at second and third locations displaced from the first location, and characterizing the first portion as a defect when the first region does not match the second and third regions.

Abstract: A method for inspecting a component. The method includes generating a scan plan of a component to be inspected, coupling a side-mount probe to an eddy current inspection system, inducing an eddy current into the component, measuring the eddy current in the component to generate a plurality of scan data, and analyzing the scan data to generate at least one image of the component being inspected.

Abstract: A method and an apparatus to accept line-scan data sets at a camera rate from a line-scan camera and resample the line-scan data sets to produce resampled line image data sets at a desired sampling distance. Each line-scan data set is of an object imaged for a fixed exposure time and moving at a relative speed in relation to the line-scan camera. The method includes accepting the line-scan data sets at the camera rate from the line-scan camera, accepting a measure of the relative speed between the line-scan camera and the object being imaged by the line-scan camera, and resampling the line-scan data sets to produce resampled line image data sets at the desired sampling distance. The resampling is a function of the camera rate, the measure of relative speed and the desired sampling distance. The resampling adjusts for the variations in relative speed to produce faithfully exposed data.

Abstract: The present invention relates to a defect detection or observation method that detects fine defects in the course of defect inspection and observation, does not detect locations not constituting defects, or classifies a defect candidate as a grain phenomenon or other phenomenon that does not affect a product.

Abstract: An inspection system includes a CMOS integrated circuit having integrally formed thereon an at least two dimensional array of photosensors and providing an inspection output representing an object to be inspected. A defect analyzer is operative to receive the inspection output and to provide a defect report.

Abstract: The present invention provides an image processing device, an image processing method, and a recording medium that enable various defect portions to be accurately corrected. R, G, B, and IR are respectively read in an image recorded on a photographic film and transverse chromatic aberration correction is performed on each of the R, G, B, and IR image data. Subsequently, defect portions in the image being processed are detected based on the IR data, and predetermined feature amounts are calculated for the image portion being processed. Based on the results of this calculation, either one of the interpolation method or brightness adjustment method is selected as the correction method for the defect portion being processed, or the ranges in which each of these correction methods is to be applied are decided. Consequently, either one of the two correction methods or both correction methods are applied and the correction values decided, and the final correction values are then determined.

Abstract: An inspection apparatus of an electric junction box is provided, by which improper mounting of electric parts can be detected. The inspection apparatus 1 has a CCD camera 5, an image-processing device 7 and a control device 8. The CCD camera picks up images of fuse 14 in the electric junction box 12 as a subject of the inspection. The image-processing device 7 stores an image consulting data 60. The image consulting data 60 includes a plurality of images of each fuse 14 having the same item symbol with regard to every item symbol, the fuses 14 being used in the electric junction box 12. The control device 8 stores normal data indicating the proper item symbol of the fuse 14 to be mounted on a corresponding mount 13. The image-processing device 7 extracts the image most analogous to the image picked up by the CCD camera 5 from the images in the image consulting data. The control device 8 judges the quality of the item symbol of the fuse 14 having the most analogous image on the basis of the normal data.

Abstract: A web inspection system provides detection of web flaws along the machine direction and cross direction of a web. The detectable percent contrast between good web material and bad web material in one embodiment approaches noise level. The web inspection system utilizes a multiple of smart cameras connected to a host computer via an ethernet hub. Each smart camera includes a line scan camera for producing digital pixels, a means for lighting and pixel correction on a pixel by pixel basis, a web edge detector for monitoring the edges of a web, a multi-pipeline flaw detection pre-processor for detecting very small changes in the web material, a run length encoder for generating data regarding the location of each group of potential flaws in a cross direction, a 2D blob detector and analyzer for generating data regarding the location of block flaws along a machine direction, and an inspect/reject analysis for determining the actual flaw data from the potential flaw data.

Abstract: A method for inspecting a substrate for defects, including: (a) obtaining an inspected pixel and a reference pixel; (b) calculating an inspected value and a reference value, the inspected value representative of the inspected pixel and the reference value representative of the reference pixel; (c) selecting a threshold in response to a selected value out of the inspected value and the reference value; and (d) determining a relationship between the selected threshold, the reference value and the inspected value to indicate a presence of a defect.

Abstract: A method is disclosed for generating data relating to the quality of product in a bulk stream product during its passage through a monitoring station. An inspection of at least a portion of product in the monitoring station is conducted at intervals while the stream is owing. The inspectors identities individual product pieces in the portion being inspected by using one or more of various techniques. Those individual pieces are then examined according to chosen criteria, and a measure is established of the quantity or proportion of such individual product pieces that fail to meet those criteria. The data generated by these inspections can be analysed to provide an indication of the quality of the bulk stream.

Abstract: A method for inspecting a slider having a substantially rectangular parallelepiped shape is provided. The method has: a lifting step of lifting said slider upward and stopping said slider at an inspecting position while supporting said slider at an undersurface of said slider, wherein said undersurface is a surface that is other than a first surface, said first surface being an air bearing surface or a surface that is to be formed in said air bearing surface; and an inspection step of simultaneously inspecting said first surface and a second surface of said slider, said second surface being a surface that is other than said first surface and said undersurface, wherein said first surface is inspected by a first camera and said second surface is inspected by a second camera, said first and second cameras being arranged in advance such that an optical axis thereof passes through said inspecting position.

Abstract: A method and system is disclosed to improve the ability of a machine vision system to distinguish desired features of a target by taking images of the target under different one or more lighting conditions and using image analysis to extract information of interest about the target. Ultraviolet light is used alone or in connection with direct on-axis and/or low angle lighting to highlight different features of the target. One or more filters disposed between the target and the camera help to filter out unwanted light from the one or more images taken by the camera. The images may be analyzed by conventional image analysis techniques and the results recorded or displayed on a computer display device.

Abstract: In an image processing device capable of collectively estimating an object based upon results of plural times of inspection, regions (1(1)) and (1(2)) to be photographed are defined on opposite end portions of an object (w). When an image of the left end portion of the object (w) is captured in response to a first trigger, the image processing device acquires corresponding image data, and the length (x1) of a projection extending in the x-direction at the left end of the object (w). When an image of the right end portion of the object (2) is next captured in response to a second trigger, the image processing device captures corresponding image data and measures the length (x2) of a projection extending in the x-direction at the right end of the work (w). Thereafter, the device finds the sum (x1+x2) of the lengths (x1, x2) inside, and outputs a result externally.

Abstract: An image input can be executed without any influence of physical conditions of an inspection object and environment such as installation area by utilizing a cordless type image pickup apparatus in the excellent portability combining a lighting apparatus to a digital camera. On the occasion of picking up an image of such inspection object, marks of the shape such as the rectangular shape, circular shape and linear line shape and marks of the shape combining the linear lines (plus sign (+), capital letter L or cross (+)) of known size are allocated within the same image and these marks are extracted simultaneously. Thereby, compensation process for the magnifying factor, position and tilt is conducted using the marks allocated in the image with the equal interval. Input data is continuously applied depending on the inspection object to generate a total inspection map by combining such input data.

Abstract: A method of inspecting a defect on a surface of a printed matter includes a step of applying a gray scale erosion filter to a non-defect surface of a printed matter to prepare a gray scale erosion filter applied image and then adding a predetermined density value to the gray scale erosion filter applied image, thereby preparing a reference image, a step of subtracting a captured image of the surface of the printed matter to be inspected from the reference image, thereby preparing a differential image, and a step of applying a density compensation process to the differential image to prepare a density compensated image, then applying an edge detection filter to the density compensated image to prepare an edge detection filter applied image and then converting the edge detection filter applied image into binary data according to a predetermined threshold value.

Abstract: An automated system for analyzing mask defects in a semiconductor manufacturing process is presented. This system combines results from an inspection tool and design layout data from a design data repository corresponding to each mask layer being inspected with a computer program and a predetermined rule set to determine when a defect on a given mask layer has occurred. Mask inspection results include the presence, location and type (clear or opaque) of defects. Ultimately, a determination is made as to whether to scrap, repair or accept a given mask based on whether the defect would be likely to cause product failure. Application of the defect inspection data to the design layout data for each mask layer being inspected prevents otherwise acceptable wafer masks from being scrapped when the identified defects are not in critical areas of the mask.

Abstract: A computer system for relieving an operator's fatigue includes an input device, an image processing circuit, a fatigue determination circuit, and an information generator circuit. The computer system also includes an output device, a response information storage device, and a fatigue degree criteria storage device. The operator's face is captured to create a model image of the face, which is analyzed to determine the fatigue degree of the operator. The response information corresponding to the fatigue degree is output to notify the operator.

Abstract: A control unit of an image data management system receives image information and information regarding the image information, which are associated with each other, from an image photographing device via a communication unit, and stores the received information in a storage unit. The control unit receives an acquisition request for acquiring the image information and the information regarding the image information, which are associated with each other, from a terminal device via the communication unit, reads out the image information and the information regarding the image information, which are associated with each other and stored in the storage unit, in accordance with the acquisition request, and sends the read-out information to the terminal device which has sent the acquisition request via the communication unit.

Abstract: An image pickup camera is arranged, so that a plurality of components are adapted to be sequentially imaged by corresponding image pickup device with a timing whereby light for imaging is prevented from affecting the other image pickup operation while the components are let to pass above the image pickup camera. The hold posture of each of the plurality of components can be imaged separately without decreasing the cycle time.

Abstract: A method for inspecting electrical circuits, and a system for carrying out the method, generating a representation of boundaries of elements in an image of an electrical circuit which is under inspection, and analyzing at least some locations of at least some boundaries in the representation of boundaries of elements to identify defects in the electrical circuit.

Abstract: A method is provided for detecting spot defects on an object when an allowable variation (called the “background”) in the appearance of the object can be modeled. Methods are also provided for measuring and classifying detected spot defects. An alignment model is used to align the image of the object, a background model is then used to estimate the (possibly different) background in each region, and each background is substantially removed from the image so as to form a foreground image on which blob analysis can be applied to detect spot defects, the blob analysis using a threshold image that accommodates different noise statistics for each region. The method facilitates robust spot defect inspection of fiber optic end faces, or of any object with different object regions. The method also allows use of blob analysis over a larger range of conditions, including conditions that make simple blob analysis infeasible.

Abstract: A semiconductor processing device includes a processing section to process a semiconductor substrate in accordance with job information which is used to process the semiconductor substrate. An imaging section takes an image of a processed portion of the semiconductor substrate for each time of processing by the processing section. An image-processing section converts any one and another of the images to image data which are different from each other in data volume, and associates a result of processing from the processing section, the job information and the image data with each other in each processing. An input/output section outputs at least the result of processing and the image data.

Abstract: The invention provides a method and an apparatus for determining a height of a point on a wire loop. A height gauge device is positioned over the point on the wire loop to be measured. Incident light is projected from the height gauge device for illuminating the point. The height gauge device receives reflected light produced from the incident light and a processor coupled to the height gauge device determines from a characteristic of the reflected light the height of the said point relative to a reference surface. Further methods and apparatus for finding a position and height of a highest point on the wire loop are also provided.

Abstract: An inspection system includes a CMOS integrated circuit having integrally formed thereon an at least two dimensional array of photosensors and providing an inspection output representing an object to be inspected. A defect analyzer is operative to receive the inspection output and to provide a defect report.

Abstract: A method and apparatus for inspecting a wafer in which a focused charged particle beam is irradiated onto a surface of a wafer on which patterns are formed through a semiconductor device fabrication process, a secondary charged particle image of a desired area of the wafer is obtained by detecting secondary charged particles emitted from the surface of the wafer, and information about image feature amount of each pattern within the desired area from the obtained secondary charged particle beam image. The information about image feature amount is compared with a preset value, and on the basis of a result of the comparison, a quality of patterns which have been formed around the desired area is estimated, and information of a result of the estimation is outputted.