Of Electronic Circuit Chip Or Board Patents (Class 348/126)
  • Patent number: 10306248
    Abstract: A method and device for real-time generation of a multiresolution representation of a digital image for real-time generation are disclosed. A sequence of main representations of the digital image is stored at successive different main resolutions in a main memory. A part of a current main representation is loaded from the main memory into a local memory via a bus. A current main representation is processed by determining a corresponding part of an intermediate representation of the image having an intermediate resolution lying between the resolution of the current main representation and the resolution of the subsequent main representation. The loading and processing steps are repeated for other parts of the current main representation until all parts of the current main representation have been successively loaded and processed.
    Type: Grant
    Filed: October 30, 2015
    Date of Patent: May 28, 2019
    Assignees: STMicroelectronics (Rousset) SAS, STMicroelectronics (Grenoble 2) SAS
    Inventors: Jacques Talayssat, Sébastien Cleyet-Merle, Vitor Schwambach Costa
  • Patent number: 10257427
    Abstract: An information processing method and an electronic device are provided. The method comprises: detecting a first movement parameter value of an image capture unit of the electronic device in its current movement state, the first movement parameter value being associated with the current movement state of the image capture unit; determining a first capturing frame rate corresponding to the first movement parameter value based on a correspondence between movement parameter values and capturing frame rates; and controlling the image capture unit to capture an image at the first capturing frame rate.
    Type: Grant
    Filed: June 30, 2015
    Date of Patent: April 9, 2019
    Assignee: LENOVO (BEIJING) LIMITED
    Inventor: Qian Zhao
  • Patent number: 10192300
    Abstract: A board production work method which includes a position detection process which detects an arrangement position of a detection target provided on a printed circuit board, and a work executing process which subjects the printed circuit board to predetermined production work based on the detected arrangement position, in which the position detection process includes an image acquisition step of imaging the printed circuit board under multiple imaging conditions and acquiring multiple items of original image data containing luminance values of each pixel arranged in two-dimensional coordinates, a difference calculation step of using two of the multiple items of original image data as calculation targets, calculating differences between luminance values of pixels with same coordinate values, and acquiring difference image data which is formed of luminance difference values of each of the pixels, and a position determination step of determining the arrangement position based on the difference image data.
    Type: Grant
    Filed: August 22, 2013
    Date of Patent: January 29, 2019
    Assignee: FUJI CORPORATION
    Inventors: Masafumi Amano, Kazuya Kotani
  • Patent number: 10144133
    Abstract: A system, method, and device may include software and hardware which simplify and quicken configuration of the system for testing a device, enhance testing procedures which may be performed, and provide data via which to easily discern a cause and nature of an error which may result during testing. A camera may capture still images of a display screen of a tested device and another camera may capture video images of the tested device and a partner device. A wizard may be used to generate a configuration file based on one previously generated for a similar device. A mount for a tested device may be structured so that: it is suitable for mounting thereon a plurality of differently structured devices; and adjustments in a vertical direction and a horizontal direction in a plane and adjustments of an angle of the device relative to the plane may be easily made.
    Type: Grant
    Filed: October 19, 2017
    Date of Patent: December 4, 2018
    Assignee: T-Mobile USA, Inc.
    Inventors: David Ross Jenkinson, Bobby Lee, Gavin Liaw
  • Patent number: 10127652
    Abstract: Systems and methods for classifying defects detected on a wafer are provided. One method includes detecting defects on a wafer based on output generated for the wafer by an inspection system. The method also includes determining one or more attributes for at least one of the defects based on portions of a standard reference image corresponding to the at least one of the defects. The method further includes classifying the at least one of the defects based at least in part on the one or more determined attributes.
    Type: Grant
    Filed: February 2, 2015
    Date of Patent: November 13, 2018
    Assignee: KLA-Tencor Corp.
    Inventors: Lisheng Gao, Avijit K. Ray-Chaudhuri, Raghav Babulnath, Kenong Wu
  • Patent number: 10114241
    Abstract: The present disclosure provides a method and a device for measuring mura levels of liquid crystal display devices. The method includes steps of: acquiring correspondence between standard brightness data differences and standard mura levels; acquiring a measurement brightness data difference of a test image displayed by a to-be-tested liquid crystal display device before and after the measurement; and acquiring a mura level corresponding to the measurement brightness data difference in accordance with the correspondence.
    Type: Grant
    Filed: August 11, 2016
    Date of Patent: October 30, 2018
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Yisan Zhang, Chun Wang, Junsheng Chen, Yuanhui Guo, Yan Wang
  • Patent number: 10088434
    Abstract: An inspection system includes a detection device arranged between a connector that couples a plurality of optical fibers to a port and the port; and a determination device that determines whether there is dart between the connector and the port, based on an output from the detection device, wherein the detection device includes a plurality of diodes that convert light that is output from each of the plurality of optical fibers to an electrical signal indicating intensity and distribution of the light, and the determination device includes a processor configured to determine whether there is dart between the connector and the port, based on the intensity and distribution of the light, which are indicated by the electrical signal.
    Type: Grant
    Filed: September 7, 2017
    Date of Patent: October 2, 2018
    Assignee: FUJITSU LIMITED
    Inventor: Toshinobu Akazawa
  • Patent number: 10088570
    Abstract: The invention provides a laser scanner system, which comprises two or more laser scanners installed on a movable object and a main control device, wherein the laser scanner is arranged as a TOF type which performs distance measurement by rotary projection of a pulsed light, and wherein the main control device produces a selection signal, the laser scanner, which is alternately selected based on the selection signal, performs distance measurement by emitting a pulsed light, wherein the laser scanner, which performs distance measurement at the same time, is a selected one.
    Type: Grant
    Filed: May 29, 2015
    Date of Patent: October 2, 2018
    Assignee: TOPCON Corporation
    Inventor: Kaoru Kumagai
  • Patent number: 10067072
    Abstract: A system for detecting defects on a semiconductor sample includes an illumination module for directing a nonzero-order Gaussian illumination beam towards a plurality of locations on a sample and a collection module for detecting light scattered from the sample in response to the nonzero-order Gaussian illumination beams and generating a plurality of output images or signals for each location on the sample. The system further comprises a processor system for detecting defects by (i) processing the output images or signals so as to retain filtered image or signal portions that substantially match a point spread function of the one or more nonzero-order Gaussian illumination beams, and (ii) analyzing the filtered image or signal portions to detect defects on the sample.
    Type: Grant
    Filed: July 1, 2016
    Date of Patent: September 4, 2018
    Assignee: KLA-Tencor Corporation
    Inventors: Vaibhav Gaind, Jason C. Kirkwood
  • Patent number: 10056304
    Abstract: An automated optical inspection (AOI) system can comprise aligning a wafer comprising a plurality of unit specific patterns. A plurality of unique reference standards can be created as a plurality of electrical nets by generating with a computer an electrical net for each of the unit specific patterns, each of the plurality of electrical nets comprising a start point and an end point. An image of each of the plurality of unit specific patterns can be captured with a camera. The image can be processed with the computer to provide a plurality of extracted boundaries of contiguous electrically conductive regions. Defects in the plurality of unit specific patterns, if present, can be detected by comparing each of the extracted boundaries of contiguous electrically conductive regions to a corresponding one of the plurality of unique reference standards. An output of known good die can be created.
    Type: Grant
    Filed: May 18, 2017
    Date of Patent: August 21, 2018
    Assignee: DECA Technologies Inc
    Inventors: Craig Bishop, Vaibhav Joga Singh Bora, Christopher M. Scanlan, Timothy L. Olson
  • Patent number: 10049441
    Abstract: A method for classifying defects of a wafer, the method is executed by a computerized system, the method may include obtaining defect candidate information about a group of defect candidates, wherein the defect candidate information comprises values of attributes per each defect candidate of the group; selecting, by a processor of the computerized system, a selected sub-group of defect candidates in response to values of attributes of defect candidates that belong to at least the selected sub-group; classifying defect candidates of the selected sub-group to provide selected sub-group classification results; repeating, until fulfilling a stop condition: selecting an additional selected sub-group of defect candidates in response to (a) values of attributes of defect candidates that belong to at least the additional selected sub-group; and (b) classification results obtained from classifying at least one other selected sub-group; and classifying defect candidates of the additional selected sub-group to provide a
    Type: Grant
    Filed: February 9, 2016
    Date of Patent: August 14, 2018
    Assignee: APPLIED MATERIALS ISRAEL LTD.
    Inventors: Saar Shabtay, Idan Kaizerman, Amir Wachs
  • Patent number: 10043694
    Abstract: Surface image data of a non-defective sample substrate is acquired, and surface image data of a substrate to be inspected is acquired. Differences between gradation values are calculated for pixels of the surface image data of the substrate to be inspected and corresponding pixels of the surface image data of the sample substrate. A constant value is added to the difference between gradation values of each pixel. In the case where the value acquired by addition is in a predetermined allowable range, it is determined that there is no defect for the substrate to be inspected. In the case where the value acquired by addition is outside of the allowable range, it is determined that the substrate to be inspected is defective. A defect in appearance on the substrate to be inspected is detected based on a pixel of which the value is outside of the allowable range.
    Type: Grant
    Filed: April 22, 2016
    Date of Patent: August 7, 2018
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Tomohiro Matsuo, Koji Nakagawa
  • Patent number: 10026166
    Abstract: A method of detecting defects of a photomask includes measuring registration errors of the photomask, correcting the measured registration errors using a registration control process with a laser beam, extracting deformation data of the photomask deformed by the registration control process, reflecting the extracted deformation data in defect detection parameters to obtain compensated defect detection parameters, and detecting defects of the photomask using the compensated defect detection parameters.
    Type: Grant
    Filed: January 5, 2016
    Date of Patent: July 17, 2018
    Assignee: SK hynix Inc.
    Inventor: Goo Min Jeong
  • Patent number: 9881534
    Abstract: Provided is a lighting fixture, which belongs to the technical field of display equipment detection and can be used for solving the problem that an existing lighting fixture is liable to damage a detection probe in a detection process. The lighting fixture includes a work load platform, a lifting unit and a lighting test unit, wherein the work load platform is used for loading a display panel to be subjected to lighting test; the lifting unit is connected with the lighting test unit and used for driving the lighting test unit to ascend and descend; and the lighting test unit is provided with a plurality of probes and is driven by the lifting unit to contact the probes with a circuit test point on the display panel, in order to carry out the lighting test on the display panel. The lighting fixture is intelligent, flexile and strong in adaptability.
    Type: Grant
    Filed: April 1, 2016
    Date of Patent: January 30, 2018
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.
    Inventors: Jie Liu, Junxin Yue, Yi Qu, Jun Wang, Jiamian Sun
  • Patent number: 9846760
    Abstract: In one embodiment, a writing data verification method is for verifying a conversion error due to data conversion from first writing data in a vector format based on design data to second writing data in a pixel format. The method includes converting the second writing data to third writing data in a vector format, performing an exclusive OR operation on the first writing data and the third writing data, enlarging a graphic of the first writing data to obtain an enlarged graphic and generating a tolerance region graphic from a difference between the enlarged graphic and the graphic of the first writing data, and detecting a defect by performing a mask process on a graphic generated by the exclusive OR operation with the tolerance region graphic.
    Type: Grant
    Filed: August 6, 2015
    Date of Patent: December 19, 2017
    Assignee: NuFlare Technology, Inc.
    Inventor: Kenichi Yasui
  • Patent number: 9848132
    Abstract: Video clips and images captured by one device (e.g., a camera) are associated with one or more synchronization labels such as synchronization device labels and synchronization time labels determined by the device. Synchronization device labels can be used to identify devices that are synchronized. Synchronization time labels indicate relative timing between the devices that are synchronized. When a device is on, it transmits a synchronization signal and receives another synchronization signal transmitted by another device in response to receiving the synchronization signal it has transmitted. The two devices each calculate a synchronization device label and a synchronization time label using the synchronization signals and associate the synchronization device label and synchronization time label with video frames and images captured. Video clips and images can subsequently be aligned using the associated synchronization device labels and the synchronization time labels.
    Type: Grant
    Filed: November 24, 2015
    Date of Patent: December 19, 2017
    Assignee: GoPro, Inc.
    Inventors: David A. Newman, Phil Johnston, II
  • Patent number: 9811883
    Abstract: An image processing method includes acquiring a feature defining a distribution of similar forms in a first image; and restoring a hole included in a second image based on the feature. The feature may include structure information on a background included in the first image. The restoring may include determining, based on the feature, candidate blocks corresponding to a restoration block and restoring the restoration block based on the candidate blocks. The restoration block may include at least a portion of the hole.
    Type: Grant
    Filed: November 12, 2015
    Date of Patent: November 7, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yang Ho Cho, Dong Kyung Nam
  • Patent number: 9811895
    Abstract: Providing an equipment manufacture supporting technique in which a plurality of departments that cooperate with one another can unify management of components constituting equipment.
    Type: Grant
    Filed: September 5, 2013
    Date of Patent: November 7, 2017
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Hisayoshi Fukai, Hidemitsu Hohki, Sachi Minami, Masashi Nishiyama
  • Patent number: 9791851
    Abstract: The present invention provides a quick processing system and method for SMT equipment, that is: firstly read PCB design files and BOM files inputted, and generate core data including text data and graphic data of all components to be assembled; then search the component data matched with each component to be assembled in the local database on basis of the core data, and link the found component information with the corresponding component to be assembled, and mark the component information as an available component, and create component information on basis of the core data of the component to be assembled, and stored to the local database, then mark the component information as an available component, and recover the component information on basis of the graphic data in the core data as an error is checked out; finally output the validated component information to the SMT equipment system.
    Type: Grant
    Filed: January 30, 2013
    Date of Patent: October 17, 2017
    Assignee: VAYO (SHANGHAI) TECHNOLOGY CO., LTD.
    Inventors: Shengjie Qian, Yongjian Qu, Fengshou Liu, Zhongliang Zhu
  • Patent number: 9786043
    Abstract: A method of inspecting a unit under test containing brazed dielectric to metal bond, includes providing at least one image of the bond and determining a characteristic of the bond based on at least one of a presence and size of a glassy phase in or adjacent to the bond.
    Type: Grant
    Filed: October 1, 2015
    Date of Patent: October 10, 2017
    Assignee: BLOOM ENERGY CORPORATION
    Inventors: Michael Petrucha, Jerome A. Mack
  • Patent number: 9778283
    Abstract: There is provided an electronic component handling apparatus which can be reduced in size or can improve the throughput when the number of contact arms is increased. A handler comprises: a plurality of contact arms which are arrayed along a first direction, each of the plurality of contact arms including a holding part which holds a DUT and including an adjustment unit which moves the holding part relative to a base part of each contact arm; an imaging unit capable of imaging the DUT and the holding part; an operation unit which operates the adjustment unit; and a moving unit which moves the imaging unit and the operation unit along an X direction. The adjustment unit adjusts the relative position of the holding part according to an operation of the operation unit.
    Type: Grant
    Filed: October 21, 2013
    Date of Patent: October 3, 2017
    Assignee: ADVANTEST CORPORATION
    Inventor: Aritomo Kikuchi
  • Patent number: 9774828
    Abstract: A method for mounting an electronic component (180) onto a component carrier (179) is described.
    Type: Grant
    Filed: February 9, 2015
    Date of Patent: September 26, 2017
    Assignee: ASM ASSEMBLY SYSTEMS GMBH & CO. KG
    Inventor: Norbert Heilmann
  • Patent number: 9756313
    Abstract: A triangulation system comprising an area camera, a communication interface, a first image processing module, a second image processing module; wherein the area camera is arranged to obtain, at an acquisition rate, a stream of images of illuminated regions of an object; wherein the area camera is prevented from performing height calculations; wherein the communication interface is arranged to convey, in real time thereby in correspondence to the acquisition rate, the stream of images from the area camera to the first image processing module; wherein the first image processing module is arranged to process, in real time, the stream of images to provide first compressed information; wherein the second image processing module is arranged to process, at a non-real time image processing rate, the first compressed information to provide height information indicative of heights of at least the illuminated regions of the object.
    Type: Grant
    Filed: May 22, 2014
    Date of Patent: September 5, 2017
    Assignee: CAMTEK LTD.
    Inventors: Shimon Koren, Eldad Langmans, Menachem Regensburger, Uri Weinar
  • Patent number: 9738032
    Abstract: A controller in a printer operates one or more printheads in the printer with reference to a predetermined height of material above a surface of a member and a height of a top layer of material above the surface of the member. The height of the top layer is identified with reference to a first sensor that generates data corresponding to a height of a face of one of the printheads above the surface of the member and a second sensor that generates data corresponding to a distance between the face of one of the printheads and the top layer of material.
    Type: Grant
    Filed: June 6, 2014
    Date of Patent: August 22, 2017
    Assignee: Xerox Corporation
    Inventors: Jeffrey J. Folkins, Patricia J. Donaldson
  • Patent number: 9697597
    Abstract: Correction of an initial three-dimensional image of a deformed object comprises the provision of a model of the undeformed object comprising first zones, the determination in the initial three-dimensional image of second zones corresponding to the first zones, the determination of a first geometric transformation which maps the second zones to the first zones and the determination of a three-dimensional image corrected on the basis of the first geometric transformation and of the initial three-dimensional image.
    Type: Grant
    Filed: April 9, 2014
    Date of Patent: July 4, 2017
    Assignee: VIT
    Inventors: François Duplaix, Mathieu Perriollat, Romain Roux
  • Patent number: 9685906
    Abstract: Methods for fast and accurate mapping of passivation defects in a silicon wafer involve capturing of photoluminescence (PL) images while the wafer is moving, for instance, when the wafer is transported on a belt in a fabrication line. The methods can be applied to in-line diagnostics of silicon wafers in solar cell fabrication. Example embodiments include a procedure for obtaining the whole wafer images of passivation defects from a single image (map) of photoluminescence intensity, and can provide rapid feedback for process control.
    Type: Grant
    Filed: June 26, 2014
    Date of Patent: June 20, 2017
    Assignee: Semilab SDI LLC
    Inventors: Jacek Lagowski, Marshall D. Wilson, Ferenc Korsos, György Nádudvari
  • Patent number: 9665803
    Abstract: A dictionary for detection of an object is created from an image obtained by performing an image process, which depends on a first image process parameter, on the training image of the detection target object. The dictionary created based on the image process depending on the first image process parameter is determined, based on a result of detecting the object from an image obtained by performing an image process, which depends on the first image process parameter, on a photographed image based on the dictionary. A second image process parameter is determined, based on a result of detecting the object from an image obtained by performing an image process, which depends on the second image process parameter, on the photographed image using the determined dictionary.
    Type: Grant
    Filed: January 10, 2014
    Date of Patent: May 30, 2017
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Masato Aoba, Takayuki Saruta
  • Patent number: 9626755
    Abstract: In a mask inspection apparatus, an optical image acquisition unit acquires an optical image of a pattern in a mask by irradiating light. A reference image generation unit generates a corresponding reference image. A defect detection unit detects a defect of the pattern by comparing the two images. A misplacement data processing unit obtains a misplacement amount of the pattern from the images, and generates misplacement data. A misplacement map processing unit generates and outputs the map to the defect detection unit. The defect detection unit includes, a first comparison unit for comparing the images, a threshold value reconfiguring unit for specifying a portion of the map corresponding to the defect detected, reconfiguring a threshold value according to the shape of the defect and the misplacement direction of the optical image of the specified portion, and a second comparison unit for re-comparing both images using the reconfigured threshold value.
    Type: Grant
    Filed: July 17, 2015
    Date of Patent: April 18, 2017
    Assignee: NuFlare Technology, Inc.
    Inventors: Hideo Tsuchiya, Nobutaka Kikuiri, Ikunao Isomura
  • Patent number: 9591744
    Abstract: A display device includes an upper substrate on a lower substrate, a driver integrated chip (IC) on the lower substrate, the driver IC and upper substrate contacting different parts of the lower substrate, a plurality of bumper units along edges of the driver IC, and a deformation preventing bumper unit between the bumper units, the deformation preventing bumper unit being configured to prevent the driver IC from being deformed.
    Type: Grant
    Filed: December 12, 2012
    Date of Patent: March 7, 2017
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Joon-Sam Kim, Jong-Hwan Kim, Sang Won Yeo, Sang-Urn Lim, Suk-Ho Choi
  • Patent number: 9581521
    Abstract: Systems and methods for inspecting wound optical fiber to detect and characterize defects are disclosed. The method includes illuminating the wound optical fiber with light from a light source and capturing a digital image based on measurement light that is redirected by the wound optical fiber to a digital camera. The method also includes processing the digital image with a computer to detect and characterize the defects. The types of defects that can be detected using the systems and methods disclosed herein include bubbles, abrasions, punctures, scratches, surface contamination, winding errors, periodic dimensional errors, aperiodic dimensional errors and dents.
    Type: Grant
    Filed: August 7, 2014
    Date of Patent: February 28, 2017
    Assignee: Corning Incorporated
    Inventor: Igor Rafaelyevich Mejouev
  • Patent number: 9552636
    Abstract: Methods and systems for detecting defects on a wafer using defect-specific and multi-channel information are provided. One method includes acquiring information for a target on a wafer. The target includes a pattern of interest (POI) formed on the wafer and a known defect of interest (DOI) occurring proximate to or in the POI. The method also includes detecting the known DOI in target candidates by identifying potential DOI locations based on images of the target candidates acquired by a first channel of an inspection system and applying one or more detection parameters to images of the potential DOI locations acquired by a second channel of the inspection system. Therefore, the image(s) used for locating potential DOI locations and the image(s) used for detecting defects can be different.
    Type: Grant
    Filed: July 28, 2015
    Date of Patent: January 24, 2017
    Assignee: KLA-Tencor Corp.
    Inventors: Kenong Wu, Lisheng Gao, Grace Hsiu-Ling Chen, David W. Shortt
  • Patent number: 9542740
    Abstract: Provided is a method of detecting a defect of a pattern using vectorization to increase accuracy and efficiency in OPC modeling and OPC verification. The method includes acquiring a target layout image associated with a target pattern, acquiring a pattern image associated with a pattern formed on a substrate, extracting an edge image from the pattern image, producing a first vector form based on the target layout image, producing a second vector form based on the edge image, and comparing the first vector form with the second vector form.
    Type: Grant
    Filed: July 15, 2014
    Date of Patent: January 10, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ki-Hyun Kim, Kai-Yuan Chi, Dmitry Vengertsev, Seung-Hune Yang
  • Patent number: 9483707
    Abstract: A method for recognizing a known object in a field of view of a three-dimensional (3D) vision system includes capturing a bitmap image file of the field of view and executing a first feature extraction to generate appearance features including a color histogram and an edge direction histogram. A reduced search space is identified based upon the appearance features including the color histogram and the edge direction histogram. A second feature extraction of the bitmap image file is executed to identify geometric features including a viewpoint feature histogram and an ensemble of shape functions. The appearance features and the geometric features are fused with contents of the reduced search space. The fused appearance features, geometric features and contents of the reduced search space are compared with a plurality of predetermined partial views of a plurality of known objects to recognize one of the known objects.
    Type: Grant
    Filed: February 4, 2015
    Date of Patent: November 1, 2016
    Assignee: GM Global Technology Operations LLC
    Inventor: Zhichao Chen
  • Patent number: 9426429
    Abstract: A scanning projective lensless microscope device comprises a specimen surface, a scanning illumination source with a light element, a light detector outside the specimen surface, and a processor. The scanning illumination source scans the light element to a plurality of scanning locations to provide illumination to an object on the specimen surface. The light detector samples a sequence of sub-pixel shifted projection object images corresponding to the plurality of scanning locations. The processor constructs a high resolution image of the object based on the sequence of sub-pixel shifted projection images and a motion vector of the projections at a plane of interest.
    Type: Grant
    Filed: October 25, 2011
    Date of Patent: August 23, 2016
    Assignee: California Institute of Technology
    Inventors: Guoan Zheng, Samuel Yang, Seung Ah Lee, Changhuei Yang
  • Patent number: 9417688
    Abstract: A measurement device includes an image capturing unit which includes a photoelectric unit and captures multiple images corresponding to different photoelectric areas of the photoelectric unit, multiple reflecting units arranged at different positions and configured to reflect light traveling from a projection area, changing units which change image capture angles of the reflecting units, a light condensing unit which condenses the light reflected off the different reflecting units to the different photoelectric areas, an obtaining unit which obtains the captured images corresponding to the photoelectric areas and corresponding image capture angles of the reflecting units, a selection unit which selects, from the captured images, two or more images in each of which a measurement subject is captured, and a calculation unit which calculates a position of the measurement subject in a 3D space from the selected captured images and the image capture angles corresponding to the captured images.
    Type: Grant
    Filed: January 21, 2015
    Date of Patent: August 16, 2016
    Assignee: RICOH COMPANY, LTD.
    Inventors: Junichi Hara, Kei Oyamada, Taeko Ishizu
  • Patent number: 9401313
    Abstract: A method of automated optical inspection (AOI) for a plurality of unique semiconductor packages can comprise providing a plurality of semiconductor die formed as a reconstituted wafer. A plurality of unit specific patterns can be formed by forming a unit specific pattern over each of the plurality of semiconductor die, wherein each of the unit specific patterns is customized to fit its respective semiconductor die. A plurality of images can be acquired by acquiring an image for each of the plurality of unit specific patterns. A plurality of unique reference standards can be created by creating a unique reference standard for each of the plurality of unit specific patterns. Defects can be detected in the plurality of unit specific patterns by comparing one of the plurality of unique reference standards to a corresponding one of the plurality of images for each of the plurality of unit specific patterns.
    Type: Grant
    Filed: November 19, 2015
    Date of Patent: July 26, 2016
    Assignee: DECA Technologies, Inc.
    Inventors: Craig Bishop, Vaibhav Joga Singh Bora, Christopher M. Scanlan, Timothy L. Olson
  • Patent number: 9380223
    Abstract: A device for fault detecting passive routing substrates. Thermal behavior differences before and after a passive routing substrate is damaged are used. A batch of passive routing substrates is fault detected without running a functional test. In addition, the passive routing substrates are not contacted and are not damaged on detection. The device provides superior and precise detection before stacking the passive routing substrates.
    Type: Grant
    Filed: December 10, 2013
    Date of Patent: June 28, 2016
    Assignee: NATIONAL TSING HUA UNIVERSITY
    Inventors: Jui-Hung Chien, Hao Yu, Ruei-Siang Hsu, Hsueh-Ju Lin, Shih-Chieh Chang
  • Patent number: 9322786
    Abstract: An inspection apparatus 1 for solar cells 100 includes: a visible light source 11 adapted to irradiate visible light; a CCD camera 15 adapted to measure a reflection image based on the visible light reflected by an antireflective film of a solar cell 100; an infrared light source 13 adapted to irradiate the solar cell 100 with infrared light; and a CCD camera 16 adapted to measure a transmission image based on the infrared light transmitting through the solar cell 100. In the inspection apparatus 1, as a result of comparing the reflection image and the transmission image with each other, of areas respectively appearing as bright spots in the reflection image, an area appearing as a dark spot in the transmission image is determined as an area including a particle, whereas of the areas respectively appearing as the bright spots in the reflection image, an area other than the area determined as the area including the particle is determined as an area including a pinhole.
    Type: Grant
    Filed: February 10, 2012
    Date of Patent: April 26, 2016
    Assignee: SHIMADZU CORPORATION
    Inventor: Yoshio Takami
  • Patent number: 9244010
    Abstract: A device and a method for detecting scattered light signals is specified. A light source exposes a scattered light area in which particles may be present to light. With the objective of reducing costs and improving detection accuracy, the device comprises a plurality of optical sensors for detecting scattered light and an evaluation unit for evaluating the signals detected by the optical sensors, wherein the sensors are each arranged at a sensor angle relative to the incident axis of the incident light so as to detect scattered light from the scattered light area, wherein one of the plurality of optical sensors is a reference sensor, and wherein the evaluation unit is designed to relate the signal profiles of the other optical sensors to the signal profile of the reference sensor, wherein the signal profiles of the optical sensors serve in classifying any particles which may be present in the scattered light area.
    Type: Grant
    Filed: September 6, 2013
    Date of Patent: January 26, 2016
    Assignee: AMRONA AG
    Inventors: Ernst Werner Wagner, Andreas Siemens
  • Patent number: 9141730
    Abstract: A computer creates a recipe for a manufacturing tool based on design data. The computer obtains the design data, which includes basic elements and hierarchical levels corresponding to the basic elements. The computer selects one or more basic elements of interest and generates one or more sets of simple array cells corresponding to a level of interest. The computer uses the sets of simple array cells to identify periodical areas in level-of-interest coordinates to enable automated recipe creation. The periodical areas are identified with respect to one or more basic elements.
    Type: Grant
    Filed: September 12, 2011
    Date of Patent: September 22, 2015
    Assignee: Applied Materials Israel, Ltd.
    Inventors: Mark Geshel, Avishai Bartov
  • Publication number: 20150138341
    Abstract: A component inspection process includes positioning a component (e.g., a semiconductor component or other object) such that component sidewalls are disposed along an optical path corresponding to sidewall beam splitters configured for receiving sidewall illumination provided by a set of sidewall illuminators, and transmitting this sidewall illumination therethrough, toward and to component sidewalls. Sidewall illumination incident upon component sidewalls is reflected from the component sidewalls back toward the sidewall beam splitters, which reflect or redirect this reflected sidewall illumination along an optical path corresponding to an image capture device for sidewall image capture to enable component sidewall inspection.
    Type: Application
    Filed: November 20, 2014
    Publication date: May 21, 2015
    Inventor: Ajharali AMANULLAH
  • Publication number: 20150116701
    Abstract: A defect inspection apparatus is disclosed that includes a stage, a photosensitive element, and a controller. The stage can support a semiconductor element that has a plurality of complete dies and partial dies surrounding the complete dies. The photosensitive element is located above the stage. The controller is electrically connected to the photosensitive element to drive the photosensitive element to inspect the defects of the complete dies and the partial dies.
    Type: Application
    Filed: October 24, 2013
    Publication date: April 30, 2015
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chun-Yen HO, Tsung-Hsien Lee, Han-Tang Lo
  • Publication number: 20150109435
    Abstract: When a size of a block on a wafer is equal to or smaller than an optical resolution of imaging optics, room for improvement in a signal-to-noise ratio has not been sufficiently considered in a conventional technique. One feature of the defect determination of the present invention is to include a filter processing for setting a predetermined partial area serving as a predetermined matrix for a first difference image, scanning the first difference image in the partial area, and outputting a second difference image, and a first threshold processing using a first threshold value for the second difference image. As a result, highly sensitive defect detection can be achieved.
    Type: Application
    Filed: October 16, 2014
    Publication date: April 23, 2015
    Inventors: Masaaki ITO, Hisashi HATANO
  • Publication number: 20150109434
    Abstract: An imaging device includes multiple sensor pixels that are arranged in a predetermined direction, each sensor pixel having multiple sensor pixel borders defining an outer edge part of the sensor pixel, among which at least one of a pair of sensor pixel borders that are opposed in the arrangement direction is oblique to a passage direction of a defect image that is vertical to the predetermined direction. This can provide an inspection tool enabling high sensitivity inspection and/or having improved detection reproducibility of a defect.
    Type: Application
    Filed: April 8, 2013
    Publication date: April 23, 2015
    Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION
    Inventor: Takahiro Jingu
  • Patent number: 9007456
    Abstract: Semiconductor wafer inspection device comprising a wager transport arm provided with at least one wafer support element, a wafer gripper, the gripper having two distant branches designed to take hold of the opposed edges of the wafer, the gripper being mounted so as to rotate on a shaft in order to be able to rotate the wafer between an approximately horizontal position and an approximately vertical position, and at least two inspection systems placed on one side of the wafer and on the other, in an approximately vertical position symmetrically with respect to the plane passing through the wafer.
    Type: Grant
    Filed: May 11, 2009
    Date of Patent: April 14, 2015
    Assignee: Altatech Semiconductor
    Inventors: Philippe Gastaldo, François Berger, Cleonisse Serrecchia
  • Patent number: 8994815
    Abstract: The present invention is intended to provide a contour extraction method and a contour extraction device with an objective of either suppression of unnecessary contouring processings or selective contouring of necessary portions. To attain the objective, provided are a contour extraction method, and a device, with which contours of pattern edges on an image formed based on charged particles emitted from a sample are extracted and, when contouring of a pattern located in an overlapping region provided in connecting images of plural image-capturing regions to form a synthesized image is performed, either areas of the pattern in the plurality of image-capturing regions, or a pre-set measurement portion is found, and selective contour extraction of the pattern with respect to an image of an image-capturing region is carried out either on a side where the area is large, or on a side where a measurement portion regarding the pattern is located.
    Type: Grant
    Filed: January 20, 2011
    Date of Patent: March 31, 2015
    Assignee: Hitachi High—Technologies Corporation
    Inventors: Hiroaki Mito, Ryoichi Matsuoka
  • Publication number: 20150070487
    Abstract: A method and a device are described that implement electroluminescence inspection, photoluminescence inspection or both of an object capable of luminescence. During the inspection, the object is excited by the application of a voltage, by the irradiation of light or both so as to transmit electromagnetic radiation. The electromagnetic radiation is registered by an optical recording device and is outputted as an image. The image undergoes an evaluation, and possible faults of the object are determined in the image evaluation. Provision is made for the registration of the electromagnetic radiation by the recording device to be undertaken in at least two images in different spectral ranges.
    Type: Application
    Filed: April 30, 2013
    Publication date: March 12, 2015
    Inventor: Okan Agbuga
  • Publication number: 20150062329
    Abstract: A visual inspection apparatus 10 performing a visual inspection of an electronic component 13 including opposing sides 11, 11a and opposing sides 12, 12a, the apparatus 10 including an optical-path adjusting means 30 changing a traveling direction of a light and setting an appearance of the side 11a of the electronic component 13 temporarily stopped at a first inspection point in an image of the side 11 of the electronic component 13 captured by a first imaging means 31, and an optical-path adjusting means 34 setting an appearance of the side 12a of the electronic component 13 temporarily stopped at a second inspection point in an image of the side 12 of the electronic component 13 captured by a second imaging means 35, thereby performing a visual inspection of the sides 11, 11a, 12, 12a.
    Type: Application
    Filed: August 6, 2014
    Publication date: March 5, 2015
    Applicant: UENO SEIKI CO., LTD.
    Inventor: Kazunari Shiraishi
  • Patent number: 8957962
    Abstract: Provided is a defect correcting device for an electronic circuit pattern, which is capable of making a defect seed obvious, and normalizing a pixel or forming a pixel into a semi-black spot. A defect correcting device for an electronic circuit pattern includes: an imaging unit for irradiating a defective portion of the electronic circuit pattern with irradiation light having a wavelength of a visible light region and a wavelength of an infrared light region, and receiving reflected light having the wavelength of the visible light region and the wavelength of the infrared light region from the electronic circuit pattern; a signal processing unit for extracting the defective portion from a picked-up image, and determining a correcting method; a laser irradiating unit for irradiating the defective portion with laser light; and a correction determining unit for determining success or failure of defect correction before and after laser irradiation.
    Type: Grant
    Filed: May 21, 2010
    Date of Patent: February 17, 2015
    Assignees: Japan Display Inc., Panasonic Liquid Crystal Display Co., Ltd.
    Inventors: Takeshi Arai, Nobuaki Nakasu
  • Patent number: 8953868
    Abstract: A defect inspection method comprising: picking up an image of a subject under inspection to thereby acquire an inspection image; extracting multiple templates corresponding to multiple regions, respectively from design data of the subject under inspection; finding a first misregistration amount between the inspection image and the design data using a first template as any one template selected from among the plural templates; finding a second misregistration amount between the inspection image and the design data using a second template other than the first template, the second template being selected from among the plural templates, and the first misregistration-amount; and converting the design data, misregistration thereof being corrected using the first misregistration-amount, and the second misregistration-amount, into a design data image, and comparing the design data image with the inspection image to thereby detect a defect of the subject under inspection.
    Type: Grant
    Filed: May 30, 2013
    Date of Patent: February 10, 2015
    Assignee: Hitachi High-Technologies Corporation
    Inventors: Shinya Murakami, Chie Shishido, Takashi Hiroi, Taku Ninomiya, Tsuyoshi Minakawa, Atsushi Miyamoto