Of Electronic Circuit Chip Or Board Patents (Class 348/126)
  • Patent number: 11199503
    Abstract: A method for adjusting a condition for determining a quality of an inspection object comprises: acquiring measurement values for the structures of a plurality of inspection objects; determining whether each of the plurality of inspection objects is good or defective by comparing error values of the measurement values with respect to design values with a predetermined reference value; identifying one or more inspection objects in which determination error has occurred among the plurality of inspection objects; generating and outputting an inspection result graph including the number of inspection objects according to the error values, the reference value, and the number of the one or more inspection objects in which the determination error has occurred; updating the reference value according to a graphical input; and redetermining whether each of the plurality of inspection objects is good or defective by comparing the error values with the updated reference value.
    Type: Grant
    Filed: November 3, 2017
    Date of Patent: December 14, 2021
    Assignee: KOH YOUNG TECHNOLOGY INC.
    Inventors: Dae Sung Koo, Yong Kim, Ki Won Park
  • Patent number: 11196967
    Abstract: An image inspection device has a platform, a controlling unit, multiple image capture units, and a discharging unit. The platform has a carrier being capable of rotating for carrying products under inspection. The controlling unit is capable of controlling rotation of the carrier. The image capture units are disposed around the platform and electrically connected to the controlling unit. Each image capture unit has a zoom lens electrically connected to the controlling unit for transmitting digital information of images captured by the zoom lens to the controlling unit. The discharging unit is configured to move the products under inspection away from the carrier and electrically connected to the controlling unit.
    Type: Grant
    Filed: June 3, 2020
    Date of Patent: December 7, 2021
    Assignees: He Tong Technology Co., Ltd., Wen Chin Technology Co., Ltd.
    Inventors: Yi-Ning Lee, Ying-Nan Chen
  • Patent number: 11169872
    Abstract: Provided is a circuit device that can appropriately detect an error in a display image obtained by performing image processing, an electronic apparatus, an error detection method, and the like. A circuit device includes an image acquisition circuit configured to acquire image data, and an index acquisition circuit configured to obtain an index for performing error detection on a display image based on the image data. The index acquisition circuit obtains an index that represents the degree of dissimilarity between a foreground image, which is an image of a given region of the display image, and a background image, of the display image, corresponding to a background of the foreground image. The index is obtained based on pixel values of the display image.
    Type: Grant
    Filed: September 12, 2018
    Date of Patent: November 9, 2021
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Kumar anandabairavasamy Anand, Peter van baarsen John, Wittmeir Manfred
  • Patent number: 11162995
    Abstract: According to one embodiment, an arithmetic processor generates unknown code distribution information, for an unknown test code to which no failure mode has been specified, and determines whether labeling of the unknown code distribution information is performable. The arithmetic processor determines whether the unknown code distribution information agrees to known code distribution information, when labeling of the unknown code distribution information is performable. The arithmetic processor determines whether the unknown code satisfies a classification minimum requirement of the agreed known code. The arithmetic processor presents a content of EFA measurement that assumes a failure mode corresponding to the known code, when the unknown code distribution information agrees to the known code distribution information, and the unknown code satisfies the classification minimum requirement of the known code.
    Type: Grant
    Filed: July 23, 2018
    Date of Patent: November 2, 2021
    Assignee: Toshiba Memory Corporation
    Inventor: Yukinobu Hayashida
  • Patent number: 11156564
    Abstract: A method for detecting dirt on a screen, a device for the same, an electronic device and a computer-readable storage medium are provided. The method includes acquiring a first image of the screen when the screen is displaying a first picture, determining a dirt detection area in the first image with a mask image, and detecting a position of the dirt within the dirt detection area. With the method provided by the embodiments of the disclosure, the positon of dirt on the screen could be detected based on at most two images of the screen. The time for detecting dirt on the screen is greatly shortened, and the efficiency of detection is enhanced.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: October 26, 2021
    Assignees: Beijing BOE Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Xiaolei Liu, Yunqi Wang, Minglei Chu, Lili Chen, Hao Zhang
  • Patent number: 11151724
    Abstract: An automatic detecting method and an automatic detecting apparatus using the same are provided. The automatic detecting apparatus includes an inputting unit, a dividing unit, a contouring unit, a range analyzing unit, a boundary analyzing unit, an edge detecting unit, an expanding unit and an overlapping unit. The dividing unit is used for dividing an overlooking image into four clusters via a clustering algorithm. The contouring unit is used for obtaining a contour. The range analyzing unit is used for obtaining a detecting range. The boundary analyzing unit is used for obtaining a circular boundary in the detecting range. The edge detecting unit is used for obtaining a plurality of edges in the circular boundary. The expanding unit is used for expanding the edges to obtain a plurality of expanded edges. The overlapping unit is used for overlapping the expanded edges and the contour to obtain a defect pattern.
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: October 19, 2021
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Tzu-Ping Kao, Ching-Hsing Hsieh, Chia-Chi Chang, Ju-Te Chen, Chen-Hui Huang, Cheng-Hsien Chen
  • Patent number: 11132780
    Abstract: A target detection method comprises performing corner point feature extraction processing on an input image to obtain a pair of target corner points, generating a target frame based on the pair of target corner points, and outputting a target detection result of a target object when determining that a calibration area in the target frame comprises a target feature point.
    Type: Grant
    Filed: February 14, 2020
    Date of Patent: September 28, 2021
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Lingxi Xie, Kaiwen Duan, Qi Tian
  • Patent number: 11126089
    Abstract: A method for determining corrections to features of a mask. The method includes obtaining (i) a pattern group for a design layout, and (ii) defect inspection data of a substrate imaged using the mask used in the patterning process for the design layout; determining, based on the defect inspection data, a defect map associated with the pattern group, wherein the defect map comprises locations of assist features having a relatively higher probability of being printed on the substrate compared to other patterns of the design layout; and determining, via simulating an optical proximity correction process using data associated with the defect map, corrections to the features of the mask.
    Type: Grant
    Filed: April 14, 2020
    Date of Patent: September 21, 2021
    Assignee: ASML Netherlands B.V.
    Inventors: Wei Fang, Lingling Pu, Zhichao Chen, Haili Zhang, Pengcheng Zhang
  • Patent number: 11089229
    Abstract: Automatic exposure control of an in-vehicle camera is performed under dark driving environments such as at night. An in-vehicle camera system includes a vehicle camera mounted in a vehicle configured to capture surroundings of the vehicle, and control circuitry that controls an exposure level of an image captured by the vehicle camera, the control of the exposure level being based on brightness information of a detection area set within the image, the detection area being a portion of the captured image and configured to output the image having exposure control performed thereon to a display.
    Type: Grant
    Filed: January 27, 2020
    Date of Patent: August 10, 2021
    Assignee: SONY GROUP CORPORATION
    Inventor: Satoshi Nakayama
  • Patent number: 11079336
    Abstract: A semiconductor inspection apparatus of embodiments includes: a light source irradiating a semiconductor package, the semiconductor package including: a sealing portion having an upper surface, a lower surface, a first side surface, and a second side surface; and a first lead extending from the first side surface, the first lead having a first wide width portion and a first narrow width portion, the first wide width portion being between the first side surface and the first narrow width portion; an imaging device capturing a first image of the first lead; a first calculator calculating a first area of a first notch region located on one side of the first narrow width portion and a second area of a second notch region located on the other side of the first narrow width portion; and a second calculator calculating a ratio of the first area and the second area.
    Type: Grant
    Filed: March 4, 2020
    Date of Patent: August 3, 2021
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
    Inventor: Ikuo Motonaga
  • Patent number: 11073380
    Abstract: A system for generating a three-dimensional height image of a reflective test target includes an illumination source configured to generate a patterned illumination on the test target, an imaging system configured to acquire an image of the patterned illumination on the test target, and a variable focus optical system configured to cause the camera to image the test target with at least two distinct focus positions, the illumination source and camera being aligned relative to the test target such that the camera acquires a specular image of the patterned illumination. The system further including a controller coupled to the illumination source, the camera and the variable focus optical system, the controller being configured to generate a height image of the test target based on the acquired image of the patterned illumination using at least two distinct focal positions.
    Type: Grant
    Filed: January 24, 2019
    Date of Patent: July 27, 2021
    Assignee: CyberOptics Corporation
    Inventors: Eric P. Rudd, Carl E. Haugan, Paul R. Haugen
  • Patent number: 11067903
    Abstract: Systems and methods for measuring a critical dimension of a photoresist are described. Measuring a critical dimension of a photoresist may include obtaining intensity data, setting a plurality of unit areas, extracting the intensity data, calculating corrected intensity data, and calculating critical dimension data. Obtaining the intensity data by scanning the target substrate may include setting a first scan area and a second scan area, obtaining first intensity data, and obtaining second intensity data, and comparing the first intensity data and the second intensity data.
    Type: Grant
    Filed: April 3, 2020
    Date of Patent: July 20, 2021
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventor: Sang Heon Ye
  • Patent number: 11010888
    Abstract: A computer-implemented method is provided for image-based defect detection. The method includes performing, by a processor device, template matching and subtraction on a set of training images and at least one template image to obtain a set of difference images. The difference images have defects, if any, highlighted therein. The method further includes generating, by the hardware processor applying a binary classification model to each of the training images in the set, activation heatmaps. The method also includes identifying, by the hardware processor, rough defect areas of interest in the activation heatmaps. The method additionally includes super-imposing, by the hardware processor, the activation heatmaps onto the difference images to obtain a set of super-imposed images, and highlight, as true defect areas, any areas in the super-imposed images having the defects from the difference images that overlap with the rough defect areas of interest from the activation heatmaps.
    Type: Grant
    Filed: October 29, 2018
    Date of Patent: May 18, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Guo Qiang Hu, Jun Zhu, Peng Ji, Jing Chang Huang
  • Patent number: 10997714
    Abstract: An apparatus for inspecting components may include a processor for: determining exterior information of a first component mounted on a first printed circuit board; inspecting a mounting state of the first component by using inspection information of a second component having a first similarity value, when the first similarity value is higher than or equal to a preset reference similarity value, and updating the inspection information of the plurality of components by using the inspection information of the first component matched with the inspection information of the second component, when it is determined that the mounting state of the first component is good.
    Type: Grant
    Filed: February 13, 2018
    Date of Patent: May 4, 2021
    Assignee: KOH YOUNG TECHNOLOGY INC.
    Inventors: Seung Bum Han, Filip Lukasz Piekniewski, Dae Sung Koo, Woo Young Lim, Jin Man Kang, Ki Won Park
  • Patent number: 10958899
    Abstract: In an example, a computing device extracts a first pre-defined region of interest (ROI), a second pre-defined ROI, and a third pre-defined ROI from an image captured by the imaging device. Further, a first signal-to-noise ratio (SNR), second SNR, and a third SNR is calculated for the first, the second, and the third pre-defined ROIs respectively. The computing device computes a variance of the first SNR with respect to the second SNR and the third SNR, the second SNR with respect to the third SNR and the first SNR, and the third SNR with respect to the first SNR and the second SNR. Based on the variance, a pre-defined weight is associated with the first SNR, the second SNR, and the third SNR to obtain weighted SNR values. Based on the weighted SNR values, the computing device evaluates the dynamic range of the imaging device.
    Type: Grant
    Filed: July 26, 2017
    Date of Patent: March 23, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Yow-Wei Cheng, Emily Ann Miginnis
  • Patent number: 10923526
    Abstract: First and second images of a semiconductor die or portion thereof are generated. Generating each image includes performing a respective instance of time-domain integration (TDI) along a plurality of pixel columns in an imaging sensor, while illuminating the imaging sensor with light scattered from the semiconductor die or portion thereof. The plurality of pixel columns comprises pairs of pixel columns in which the pixel columns are separated by respective channel stops. While performing a first instance of TDI to generate the first image, a first bias is applied to electrically conductive contacts of the channel stops. While performing a second instance of TDI to generate the second image, a second bias is applied to the electrically conductive contacts of the channel stops. Defects in the semiconductor die or portion thereof are identified using the first and second images.
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: February 16, 2021
    Assignee: KLA Corporation
    Inventors: Tzi-Cheng Lai, Jehn-Huar Chem, Stephen Biellak
  • Patent number: 10872403
    Abstract: A method of predicting virtual metrology data for a wafer lot that includes receiving first image data from an imager system, the first image data relating to at least one first wafer lot, receiving measured metrology data from metrology equipment relating to the at least one first wafer lot, applying one or more machine learning techniques to the first image data and the measured metrology data to generate at least one predictive model for predicting at least one of virtual metrology data or virtual cell metrics data of wafer lots, and utilizing the at least one generated predictive model to generate at least one of first virtual metrology data or first virtual cell metrics data for the first wafer lot.
    Type: Grant
    Filed: August 10, 2018
    Date of Patent: December 22, 2020
    Assignee: Micron Technology, Inc.
    Inventors: Amitava Majumdar, Qianlan Liu, Pradeep Ramachandran, Shawn D. Lyonsmith, Steve K. McCandless, Ted L. Taylor, Ahmed N. Noemaun, Gordon A. Haller
  • Patent number: 10867382
    Abstract: A method is provided for detecting mura defects in a master panel during fabrication, the master panel containing multiple flat screen displays. The method includes preparing a combined image from image data of the master panel; enhancing the quality of the combined image, including removing artifacts from the combined image; filtering the enhanced quality combined image to detect local mura defects, the local mura defects including at least one structured pattern of defined geometric shapes; applying different candidate patterns to the filtered combined image; selecting one of the candidate patterns as a defect detection pattern, the defect detection pattern being closest to the structured pattern of defined geometric shapes of the detected local mura defects; and displaying at least a portion of the defect detection pattern on a display, together with the quality-enhanced combined image.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: December 15, 2020
    Assignee: Keysight Technologies, Inc.
    Inventors: Manuel Moertelmaier, Tomonori Ura, Yosuke Komma, Michael Dieudonne
  • Patent number: 10838191
    Abstract: A method of operating a microscope comprises recording a first image I1h of a sample, wherein the first image contains a first feature F1; recording a second image I2h of the sample, wherein the second image contains a second feature F2 arranged at a distance from the first feature; displacing the sample relative to the microscope by a displacement ; recording a third image I3h of the sample, wherein the third image contains the second feature; recording a fourth image I4h of the sample, wherein the fourth image contains a third feature F3 arranged at a distance from the second feature; and determining a position of the third feature relative to the first feature based on the first, second, third and fourth images.
    Type: Grant
    Filed: December 15, 2017
    Date of Patent: November 17, 2020
    Assignee: Carl Zeiss Microscopy GmbH
    Inventors: Susan Candell, Thomas Anthony Case, Lorenz Lechner
  • Patent number: 10824137
    Abstract: A mounting board manufacturing system includes a component placing device; a library; an operation information counter; and a corrector. The component data includes a control parameter for executing the component placing work by the component placing device, and information regarding the component. The operation information counter counts a score of the component placing work for each component data based on operation information including a result executed by the component placing device. The corrector selects correction component data that is a target to be corrected from a plurality of the component data based on the score and corrects the control parameter of the correction component data.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: November 3, 2020
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Inlin Tan, Takuya Yamazaki, Takaaki Yokoi, Narumi Atsuta, Atsushi Nakazono
  • Patent number: 10818561
    Abstract: Embodiments include process monitoring devices and methods of using such process monitoring devices. In one embodiment, the process monitoring device includes a substrate. The process monitoring device may also include a plurality of sensors formed on a support surface of the substrate. According to an embodiment, each sensor is capable of producing an output signal that corresponds to a processing condition. Furthermore, embodiments include a process monitoring device that includes a network interface device that is formed on the substrate. According to an embodiment each of the plurality of sensors is communicatively coupled to the network interface device. The network interface device allows for the output signals obtained from the sensors to be wirelessly transmitted to an external computer during processing operations.
    Type: Grant
    Filed: January 28, 2016
    Date of Patent: October 27, 2020
    Assignee: Applied Materials, Inc.
    Inventors: Leonard Tedeschi, Kartik Ramaswamy
  • Patent number: 10818000
    Abstract: Data indicative of a group of defect candidates may be obtained. The data may be indicative of a group of defect candidates and may include values of attributes for each defect candidate of the group of defect candidates. Sub-groups of defect candidates may be iteratively selected for review using a review recipe to classify the defect candidates in each selected sub-group based on the values of attributes of respective defect candidates and classification results of previously reviewed defect candidates. The sub-groups may be selected until a sampling stop condition is fulfilled to obtain a classification output for the wafer. Instructions specifying at least one of the sampling stop condition, the inspection recipe, or the review recipe may be altered and additional defect candidates in a next wafer may be classified by using the altered instructions.
    Type: Grant
    Filed: August 13, 2018
    Date of Patent: October 27, 2020
    Assignee: Applied Materials Israel Ltd.
    Inventors: Saar Shabtay, Idan Kaizerman, Amir Watchs
  • Patent number: 10782516
    Abstract: A method of operating a microscope comprises recording a first image I1h of a sample, wherein the first image contains a first feature F1; recording a second image I2h of the sample, wherein the second image contains a second feature F2 arranged at a distance from the first feature; displacing the sample relative to the microscope by a displacement ; recording a third image I3h of the sample, wherein the third image contains the second feature; recording a fourth image I4h of the sample, wherein the fourth image contains a third feature F3 arranged at a distance from the second feature; and determining a position of the third feature relative to the first feature based on the first, second, third and fourth images.
    Type: Grant
    Filed: December 15, 2017
    Date of Patent: September 22, 2020
    Assignee: Carl Zeiss Microscopy GmbH
    Inventors: Susan Candell, Thomas Anthony Case, Lorenz Lechner
  • Patent number: 10761135
    Abstract: In some examples, a device includes a main array of circuit elements representing a main measurement range of parameter values and a test array of circuit elements representing a test measurement range of parameter values, the test measurement range being less than the main measurement range. The device also includes processing circuitry configured to select a portion of the main array of circuit elements representing a partial measurement range, the partial measurement range being less than or equal to the test measurement range. The processing circuitry is also configured to test the portion of the main array of circuit elements using the test array of circuit elements.
    Type: Grant
    Filed: September 11, 2018
    Date of Patent: September 1, 2020
    Assignee: Infineon Technologies AG
    Inventor: Erwin Schmalzl
  • Patent number: 10755133
    Abstract: A system and method for identifying line Mura defects on a display. The system is configured to generate a filtered image by preprocessing an input image of a display using at least one filter. The system then identifies line Mura candidates by converting the filtered image to a binary image, counting line components along a slope in the binary image, and marking a potential candidate location when the line components along the slope exceed a line threshold. Image patches are then generated with the candidate locations at the center of each image patch. The image patches are then classified using a machine learning classifier.
    Type: Grant
    Filed: April 18, 2018
    Date of Patent: August 25, 2020
    Assignee: Samsung Display Co., Ltd.
    Inventor: Janghwan Lee
  • Patent number: 10750649
    Abstract: A component mounting system and a method for inspecting mounted components are provided. A component mounting system according to an embodiment, comprises a solder inspection apparatus comparing coordinate information of the solder, which is obtained through measurement of a substrate to which solder is applied, with reference coordinate information to generate coordinate correction data; and a first mounting inspection apparatus comparing a first measurement data obtained by measuring mounting state of a component when the component is mounted based on the coordination correction data through a component mounting apparatus, with the coordinate correction data to verify whether a component is mounted on a position corrected based on the coordinate correction data. In this manner, by adding the verification function for the performance function of the component mounting apparatus to the inspection apparatus, it is possible to monitor the operation state of the component mounting apparatus in each process step.
    Type: Grant
    Filed: November 20, 2015
    Date of Patent: August 18, 2020
    Assignee: KOH YOUNG TECHNOLOGY INC.
    Inventor: Jeongyeob Kim
  • Patent number: 10746668
    Abstract: In the measurement of properties of a wafer substrate, such as Critical Dimension or overlay a sampling plan is produced 2506 defined for measuring a property of a substrate, wherein the sampling plan comprises a plurality of sub-sampling plans. The sampling plan may be constrained to a predetermined fixed number of measurement points and is used 2508 to control an inspection apparatus to perform a plurality of measurements of the property of a plurality of substrates using different sub-sampling plans for respective substrates, optionally, the results are stacked 2510 to at least partially recompose the measurement results according to the sample plan.
    Type: Grant
    Filed: April 10, 2019
    Date of Patent: August 18, 2020
    Assignee: ASML Netherlands B.V.
    Inventors: Wouter Lodewijk Elings, Franciscus Bernardus Maria Van Bilsen, Christianus Gerardus Maria De Mol, Everhardus Cornelis Mos, Hoite Pieter Theodoor Tolsma, Peter Ten Berge, Paul Jacques Van Wijnen, Leonardus Henricus Marie Verstappen, Gerald Dicker, Reiner Maria Jungblut, Chung-Hsun Li
  • Patent number: 10718609
    Abstract: This disclosure relates to calibrating a volumetric estimation device for determining dimensions of an object. Two laser sources project two laser lines onto the object to form a rectangular calibration target. A camera captures an image of the rectangular calibration target and has a camera image plane and a camera image plane centre point. A processor measures the camera distortion effects to generate a filter to remove the distortion effects to approximate a pinhole camera. The camera image plane centre point and the points of projection of the laser sources are not collinear. The point of laser projection are not collinear with the camera image plane centre point. The processor uses locations of laser projected crosslines to determine a deviation angle from a direction perpendicular to the camera image plane and the distance between the camera image plane centre point and each laser source.
    Type: Grant
    Filed: August 10, 2016
    Date of Patent: July 21, 2020
    Assignee: Wisetech Global Limited
    Inventors: Natalia Galin, Richard White
  • Patent number: 10657412
    Abstract: An image processing apparatus includes: a first circuit which calculates values f(RPi), f(GPi) and f(BPi) by applying a function f(x) to an R grayscale value RPi, a G grayscale value GPi and a B grayscale value BPi of each pixel i of a first image; a second circuit which calculates values f(RQi), f(GQi) and f(BQi) by applying the function f(x) to an R grayscale value RQi, a G grayscale value GQi and a B grayscale value BQi of each pixel i of a second image; and a similarity calculation circuit which calculates a degree of similarity between the first and second images depending on |f(RPi)?f(RQi)|, |f(GPi)?f(GQi)| and |f(BPi)?f(BQi)| associated with each pixel i of the first and second images. The function f(x) is a convex function monotonically non-decreasing in the domain of definition.
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: May 19, 2020
    Assignee: Synaptics Japan GK
    Inventors: Hirobumi Furihata, Masao Orio, Susumu Saito, Takashi Nose, Akio Sugiyama
  • Patent number: 10591289
    Abstract: A method of measuring at least one point on an artefact to be inspected that is located within a positioning apparatus' measurement volume, the method comprising, obtaining at least two images of the artefact obtained from different perspectives and, based on a given nominal location of a predetermined point to be measured within said positioning apparatus' measurement volume, determine the location of said predetermined point in each of the at least two images.
    Type: Grant
    Filed: July 11, 2016
    Date of Patent: March 17, 2020
    Assignee: RENISHAW PLC
    Inventors: Calum Conner McLean, Ian William McLean
  • Patent number: 10572992
    Abstract: A method, apparatus and computer readable memory for solder paste inspection. A light source is configured to irradiate a sample solder joint comprising an organic material, an organic and metal material enclosed by an irregular boundary, and a metal material enclosed by a regular boundary. A first wavelength ultraviolet (UV) energy irradiates the sample to obtain first fluorescence energy, and a second wavelength UV energy irradiates the sample to obtain second fluorescence energy. A two-dimensional (2D) camera is configured to acquire a first image of the sample primarily from the first fluorescence energy and a second image of the sample primarily from the second fluorescence energy. Photo manipulation software is stored on at least one hardware processor, the photo manipulation software configured to overlay the first image and the second image to visually compare the boundary of the organic and metal material with the boundary of the metal material.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: February 25, 2020
    Assignee: Intel Corporation
    Inventors: Alireza Ashari, Curt Carboni, Jason Jones, Robert Wiedmaier, Di Xu, Wei Yan, Liang Zhang
  • Patent number: 10571413
    Abstract: The invention relates to a method for testing an electronic component for defects, by examining the electronic component in a production line by means of automatic optical inspection; determining the coordinates of regions in which an examination using automatic optical inspection is not possible; transmitting the coordinates of these regions from the production line to a computer; transporting the electronic component from the production line into an X-ray device which is arranged outside the production line, for non-destructive material testing; transmitting the coordinates of the regions from the computer to this X-ray device; examining the electronic component by means of the X-ray device only in the regions in which an examination using automatic optical inspection is not possible; transmitting the results of the examination in the X-ray device to the computer; returning the electronic component to the production line if the result indicates that it is not defective.
    Type: Grant
    Filed: April 14, 2016
    Date of Patent: February 25, 2020
    Assignee: YXLON INTERNATIONAL GMBH
    Inventors: Keith Bryant, Bernhard Murkens, Mathias Wientapper
  • Patent number: 10529053
    Abstract: A display device may include a display having a pixels and a processor. The processor may receive image data, determine a digital offset value for a pixel based on a location of the pixel, such that the digital offset value compensates for one or more non-uniformity properties of the pixel. The processor may determine a scale factor associated with the pixel based on at least two of a luminance setting for the display, a driving mode of the display, and a gray level value for the pixel. The processor may then generate correction image data by applying the scale factor to the digital offset value, generate compensated image data based on the correction image data and the image data, and provide the compensated image data to the display.
    Type: Grant
    Filed: September 21, 2017
    Date of Patent: January 7, 2020
    Assignee: Apple Inc.
    Inventors: Shengkui Gao, Hung Sheng Lin, Hyunsoo Kim, Hyunwoo Nho, Katherine W. Song, Mohammad Hajirostam, Myung-Je Cho, Rui Zhang, Sang Y. Youn, Wei H. Yao, Yafei Bi
  • Patent number: 10527559
    Abstract: An inspection system inspects points of interest on an item. A two-axis gimbal holds the item and is controlled to adjust an angle of incidence and angle of approach of a line of sight of an imaging device with respect to the point of interest. A Y-axis actuator adjusts a position of the imaging device along a Y-axis of the item, and an X-axis actuator adjusts a position of the imaging device along an X-axis of the item. A controller controls the gimbal, the Y-axis actuator and the X-axis actuator. Upon selecting a point of interest, angle of incidence, and angle of approach, the imaging device displays and/or captures an image, and the image can be inspected by a human inspector or automated inspection system.
    Type: Grant
    Filed: March 20, 2018
    Date of Patent: January 7, 2020
    Inventor: Robert Scott Simmons
  • Patent number: 10514418
    Abstract: A method for emission testing of a semiconductor device (DUT), by mounting the DUT onto an test bench of an emission tester, the emission tester having an optical detector; electrically connecting the DUT to an electrical tester; applying electrical test signals to the DUT while keeping test parameters constant; inserting an optical filters into an optical path of the emission tester and collecting emission test signal from the optical detector; removing the filter from the optical path and collecting emission test signal from the optical detector. Comparing the images obtained with and without the filter. The filter may be shortpass to obtain emission signal, a bandpass for detecting forward bias, or longpass to obtain thermal signal.
    Type: Grant
    Filed: October 5, 2016
    Date of Patent: December 24, 2019
    Assignee: FEI Company
    Inventor: Herve Deslandes
  • Patent number: 10488347
    Abstract: A defect classification method in accordance with the present invention uses two types of images output from the defect inspection device 150 (i.e., the first inspection image generated from a luminance signal sequentially output from a detector SE and the second inspection image generated from a difference of the signals from an adjacent portion in a region where the defect exists). The first inspection image includes information for discriminating unevenness of the defective shape. Also, while it is difficult to discriminate unevenness of the defective shape by the second inspection image, the second inspection image includes information on a luminance distribution emphasizing a defective section. The region of the defective section is extracted from the second inspection image to be applied to the first inspection image and thereby define an arithmetic processing area, and the image processing is performed within the arithmetic processing area to compute a feature amount.
    Type: Grant
    Filed: April 23, 2019
    Date of Patent: November 26, 2019
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Tsuneo Terasawa, Hiroshi Fukuda, Daisuke Iwai
  • Patent number: 10476543
    Abstract: A lighting device is disclosed having a plurality of LED chips mounted on a single planar flexible substrate, wherein the single planar flexible substrate is disposed in an arcuate orientation. A heat sink having an arcuate surface shaped to approximate the arcuate orientation of the flexible substrate is coupled to the flexible substrate between complementary arcuate surfaces. A luminescent coating is disposed about a top surface of the arcuate single planar flexible substrate.
    Type: Grant
    Filed: October 5, 2018
    Date of Patent: November 12, 2019
    Assignee: Alliance Sports Group, L.P.
    Inventor: Steven Cramer
  • Patent number: 10459348
    Abstract: Inspection system for a device under test (DUT) includes an image sensor, N image obtaining devices, K switches, M image processing devices, and at least one added image processing device. The image obtaining devices are connected to the image sensor, and each of the N image obtaining devices receives image data of the image of the DUT captured by the image sensor. Each of the K switches is connected to a respective one of the image obtaining devices. Each of the M image processing devices is connected to a respective one of the switches, receives the image data that is output from one of the N image obtaining devices and is distributed by one of the K switches, and generates processed image data in real-time. The added image processing device is connected to one of the switches, receives the image data, and generates additional processed image data in real-time.
    Type: Grant
    Filed: August 2, 2018
    Date of Patent: October 29, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Myung-Ho Jung, Ji-Hoon Kang, Sean Park, Sung-Won Park, Jae-Min Lee
  • Patent number: 10436720
    Abstract: Methods and systems for classifying defects detected on a specimen with an adaptive automatic defect classifier are provided. One method includes creating a defect classifier based on classifications received from a user for different groups of defects in first lot results and a training set of defects that includes all the defects in the first lot results. The first and additional lot results are combined to create cumulative lot results. Defects in the cumulative lot results are classified with the created defect classifier. If any of the defects are classified with a confidence below a threshold, the defect classifier is modified based on a modified training set that includes the low confidence classified defects and classifications for these defects received from a user. The modified defect classifier is then used to classify defects in additional cumulative lot results.
    Type: Grant
    Filed: January 8, 2016
    Date of Patent: October 8, 2019
    Assignee: KLA-Tenfor Corp.
    Inventors: Li He, Martin Plihal, Huajun Ying, Anadi Bhatia, Amitoz Singh Dandiana, Ramakanth Ramini
  • Patent number: 10438339
    Abstract: An optical verification method and mass transfer system described. In an embodiments, a mass transfer sequence may be accompanied by optical imaging and inspection to detect pick and place errors. The optical imaging and inspection techniques may be performed in-situ.
    Type: Grant
    Filed: September 5, 2017
    Date of Patent: October 8, 2019
    Assignee: Apple Inc.
    Inventors: Patrick J. Czarnota, Paul Argus Parks, Nile A. Light, Stephen P. Bathurst, John H. Higginson, Stephen R. Deming, Robert B. Martin, Tsan Y. Chan, Andreas Bibl
  • Patent number: 10422825
    Abstract: A device for detecting a connector mounting failure includes a detection unit and a connection member that interconnects the detection unit and a connector device. The connection member includes a connection connector inserted into and seated in the connector device, and a connection line unit that interconnects the connection connector and the detection unit. The connection line unit also delivers a detection value of the connection connector to the detection unit.
    Type: Grant
    Filed: April 6, 2017
    Date of Patent: September 24, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Bon-Seok Ku, Young-Kun Kwon, Jae-Ryong Han
  • Patent number: 10306248
    Abstract: A method and device for real-time generation of a multiresolution representation of a digital image for real-time generation are disclosed. A sequence of main representations of the digital image is stored at successive different main resolutions in a main memory. A part of a current main representation is loaded from the main memory into a local memory via a bus. A current main representation is processed by determining a corresponding part of an intermediate representation of the image having an intermediate resolution lying between the resolution of the current main representation and the resolution of the subsequent main representation. The loading and processing steps are repeated for other parts of the current main representation until all parts of the current main representation have been successively loaded and processed.
    Type: Grant
    Filed: October 30, 2015
    Date of Patent: May 28, 2019
    Assignees: STMicroelectronics (Rousset) SAS, STMicroelectronics (Grenoble 2) SAS
    Inventors: Jacques Talayssat, S├ębastien Cleyet-Merle, Vitor Schwambach Costa
  • Patent number: 10257427
    Abstract: An information processing method and an electronic device are provided. The method comprises: detecting a first movement parameter value of an image capture unit of the electronic device in its current movement state, the first movement parameter value being associated with the current movement state of the image capture unit; determining a first capturing frame rate corresponding to the first movement parameter value based on a correspondence between movement parameter values and capturing frame rates; and controlling the image capture unit to capture an image at the first capturing frame rate.
    Type: Grant
    Filed: June 30, 2015
    Date of Patent: April 9, 2019
    Assignee: LENOVO (BEIJING) LIMITED
    Inventor: Qian Zhao
  • Patent number: 10192300
    Abstract: A board production work method which includes a position detection process which detects an arrangement position of a detection target provided on a printed circuit board, and a work executing process which subjects the printed circuit board to predetermined production work based on the detected arrangement position, in which the position detection process includes an image acquisition step of imaging the printed circuit board under multiple imaging conditions and acquiring multiple items of original image data containing luminance values of each pixel arranged in two-dimensional coordinates, a difference calculation step of using two of the multiple items of original image data as calculation targets, calculating differences between luminance values of pixels with same coordinate values, and acquiring difference image data which is formed of luminance difference values of each of the pixels, and a position determination step of determining the arrangement position based on the difference image data.
    Type: Grant
    Filed: August 22, 2013
    Date of Patent: January 29, 2019
    Assignee: FUJI CORPORATION
    Inventors: Masafumi Amano, Kazuya Kotani
  • Patent number: 10144133
    Abstract: A system, method, and device may include software and hardware which simplify and quicken configuration of the system for testing a device, enhance testing procedures which may be performed, and provide data via which to easily discern a cause and nature of an error which may result during testing. A camera may capture still images of a display screen of a tested device and another camera may capture video images of the tested device and a partner device. A wizard may be used to generate a configuration file based on one previously generated for a similar device. A mount for a tested device may be structured so that: it is suitable for mounting thereon a plurality of differently structured devices; and adjustments in a vertical direction and a horizontal direction in a plane and adjustments of an angle of the device relative to the plane may be easily made.
    Type: Grant
    Filed: October 19, 2017
    Date of Patent: December 4, 2018
    Assignee: T-Mobile USA, Inc.
    Inventors: David Ross Jenkinson, Bobby Lee, Gavin Liaw
  • Patent number: 10127652
    Abstract: Systems and methods for classifying defects detected on a wafer are provided. One method includes detecting defects on a wafer based on output generated for the wafer by an inspection system. The method also includes determining one or more attributes for at least one of the defects based on portions of a standard reference image corresponding to the at least one of the defects. The method further includes classifying the at least one of the defects based at least in part on the one or more determined attributes.
    Type: Grant
    Filed: February 2, 2015
    Date of Patent: November 13, 2018
    Assignee: KLA-Tencor Corp.
    Inventors: Lisheng Gao, Avijit K. Ray-Chaudhuri, Raghav Babulnath, Kenong Wu
  • Patent number: 10114241
    Abstract: The present disclosure provides a method and a device for measuring mura levels of liquid crystal display devices. The method includes steps of: acquiring correspondence between standard brightness data differences and standard mura levels; acquiring a measurement brightness data difference of a test image displayed by a to-be-tested liquid crystal display device before and after the measurement; and acquiring a mura level corresponding to the measurement brightness data difference in accordance with the correspondence.
    Type: Grant
    Filed: August 11, 2016
    Date of Patent: October 30, 2018
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Yisan Zhang, Chun Wang, Junsheng Chen, Yuanhui Guo, Yan Wang
  • Patent number: 10088570
    Abstract: The invention provides a laser scanner system, which comprises two or more laser scanners installed on a movable object and a main control device, wherein the laser scanner is arranged as a TOF type which performs distance measurement by rotary projection of a pulsed light, and wherein the main control device produces a selection signal, the laser scanner, which is alternately selected based on the selection signal, performs distance measurement by emitting a pulsed light, wherein the laser scanner, which performs distance measurement at the same time, is a selected one.
    Type: Grant
    Filed: May 29, 2015
    Date of Patent: October 2, 2018
    Assignee: TOPCON Corporation
    Inventor: Kaoru Kumagai
  • Patent number: 10088434
    Abstract: An inspection system includes a detection device arranged between a connector that couples a plurality of optical fibers to a port and the port; and a determination device that determines whether there is dart between the connector and the port, based on an output from the detection device, wherein the detection device includes a plurality of diodes that convert light that is output from each of the plurality of optical fibers to an electrical signal indicating intensity and distribution of the light, and the determination device includes a processor configured to determine whether there is dart between the connector and the port, based on the intensity and distribution of the light, which are indicated by the electrical signal.
    Type: Grant
    Filed: September 7, 2017
    Date of Patent: October 2, 2018
    Assignee: FUJITSU LIMITED
    Inventor: Toshinobu Akazawa
  • Patent number: 10067072
    Abstract: A system for detecting defects on a semiconductor sample includes an illumination module for directing a nonzero-order Gaussian illumination beam towards a plurality of locations on a sample and a collection module for detecting light scattered from the sample in response to the nonzero-order Gaussian illumination beams and generating a plurality of output images or signals for each location on the sample. The system further comprises a processor system for detecting defects by (i) processing the output images or signals so as to retain filtered image or signal portions that substantially match a point spread function of the one or more nonzero-order Gaussian illumination beams, and (ii) analyzing the filtered image or signal portions to detect defects on the sample.
    Type: Grant
    Filed: July 1, 2016
    Date of Patent: September 4, 2018
    Assignee: KLA-Tencor Corporation
    Inventors: Vaibhav Gaind, Jason C. Kirkwood