Abstract: This application relates to a method of inspection and an inspection system for the film deposition process for substrates that includes glass and wafer. The inspection system includes multiple camera modules positioned in a load lock unit of a process chamber, such as the camera modules that can capture images of the substrate in the load lock. The images are analyzed by a control unit of the inspection system to determine the accuracy of robots in handling the substrate, calibration of the robots based on the analysis, and defects in the substrate caused during the handling and deposition process.

Abstract: A manufacturing method for an integrated chip is used for forming and processing an electrode structure of the integrated chip. The method includes step S1 and step S2. In step S1, a light-emitting portion is manufactured, and the light-emitting portion includes multiple light-emitting unit groups distributed in the form of a matrix. In step S2, conductive terminals multiple first electrodes and conductive terminals of multiple second electrodes of the light-emitting portion are electrically led out to form multiple first pin electrodes and multiple second pin electrodes. The first pin electrodes and the second pin electrodes are used for being electrically connected to a circuit substrate.

Abstract: A liquid-droplet-like semiconductor chip ink 200 contains a liquid 50 and semiconductor chips 40, each of which has a first electrode and a second electrod on the upper surface and the lower surface and is configured such that the second electrode side is more strongly attracted to a magnetic field. The semiconductor chip ink 200 is supplied to a chip joining part on a lower electrode 420 which is formed on a mounting substrate 400, the second electrode side of the semiconductor chips 40 in the semiconductor chip ink 200 are attracted by a magnetic force by an external magnetic field so as to make contact with the chip joining part, and thereafter is electrically and mechanically joined to the chip joining part by using soldering and the like.

Abstract: A display panel (11) with a low signal transmission power and large cabling space, and a semiconductor display apparatus including the display panel (11) are provided. The display panel (11) includes pixel areas (DB) that are of N rows and M columns and that are connected in a matrix, each pixel area (DB) includes pixel drive modules that are of Q rows and P columns and that are connected in a matrix, each pixel drive circuit (PD) is connected to at least one pixel unit (P), and the pixel drive circuit (PD) drives, based on to-be-displayed image data, the pixel unit (P) to emit light to display an image. All pixel areas (DB) in any column of the pixel areas (DB) are connected to data interfaces (DI) in a same group, and pixel areas (DB) in different columns are connected to data interfaces (DI) in different groups.

Abstract: An edge alignment method includes (a) calculating coordinates of points having a possibility of corresponding to an edge of the workpiece, (b) forming an approximate circle by using a least squares method on all the coordinates, (c) calculating deviations between the approximate circle and respective ones of all the points, and if plural ones of the points have deviations greater than or equal to a preset threshold, respectively, then determining the point, the deviation of which is greatest, to be a false detection position, and excluding from consideration candidates the point determined to be the false detection position, and (d) estimating a position of the edge of the workpiece from the coordinates of three or more of the points still remaining without exclusion, and based on the estimated position of the edge, deriving a machining area at the outer peripheral portion of the workpiece.

Abstract: An image processing unit including: a pad region extraction unit that executes pad region extraction processing of extracting a substantially rectangular pad region surrounding a plurality of pads from an image of an inspection target object; an imaginary straight line setting unit that executes imaginary straight line setting processing of setting an imaginary first straight line parallel to a side extending in an X direction of the pad region and setting an imaginary second straight line parallel to a side extending in a Y direction of the pad; and a reference point setting unit that executes reference point setting processing of setting an intersection between the first straight line and the second straight line as the reference point.

Abstract: An apparatus for manufacturing a semiconductor device includes a bonding head configured to adsorb and hold a mounting component at a pick-up position, to move between the pick-up position and a mounting position, and to mount the mounting component on a substrate that is on a bonding stage; a camera configured to move together with the bonding head and to capture an image of the mounting component and an image of the substrate; an optical system configured to transmit light between the mounting component and the camera; a fiducial mark configured to move together with the camera in a capturing range of the camera; and a controller configured to correct a positional relationship between the mounting component and the substrate based on a first image including the fiducial mark and the mounting component and a second image including the fiducial mark and the substrate.

Abstract: The present disclosure provides a display panel and a display device. The display panel includes: a display substrate, an IC chip, and a circuit board. The display substrate includes a first bonding portion including a first detection pin and a second detection pin, a second bonding portion connected to the first bonding portion and including a first connection pin and second connection pin which are connected by a connection wire included by the circuit board, a first connection line connecting the first detection pin to the first connection pin and including a first crack detection line, and a second connection line connecting the first detection pin to the second connection pin. The IC chip is bonded to the first bonding portion and configured to determine cracks on an edge of the display substrate according to electric signals of the first detection pin and the second detection pin.

Abstract: A teaching method for a transfer mechanism is provided. The teaching method includes (a) placing a first substrate or an edge ring on a fork of the transfer mechanism, transferring the first substrate or the edge ring to a target position, and placing the first substrate or the edge ring onto the target position; (b) placing a second substrate having a position detection sensor on the fork, and transferring the second substrate to a position directly above or below the target position; (c) detecting an amount of deviation between the first substrate or the edge ring and the target position using the position detection sensor of the second substrate; and (d) correcting transfer position data of the transfer mechanism for the first substrate or the edge ring to be transferred next, based on the detected amount of deviation.

Abstract: A metrology system includes one or more through-focus imaging metrology sub-systems communicatively coupled to a controller having one or more processors configured to receive a plurality of training images captured at one or more focal positions. The one or more processors may generate a machine learning classifier based on the plurality of training images. The one or more processors may receive one or more target feature selections for one or more target overlay measurements corresponding to one or more target features. The one or more processors may determine one or more target focal positions based on the one or more target feature selections using the machine learning classifier. The one or more processors may receive one or more target images captured at the one or more target focal positions, the target images including the one or more target features of the target specimen, and determine overlay based thereon.

Abstract: The present disclosure is directed to a metrology system having 3-dimensional sensors for thickness measurements of semiconductor elements, and methods for taking the thickness measurements. In an aspect, the 3-dimensional sensor may be a single or dual 3-dimensional profiler that may scan across the top and bottom surfaces of an element to obtain a thickness measurement. In another aspect, the method may be used to measure a gap between elements that have assembled together.

Abstract: A method of inspection and an inspection system for the film deposition process for substrates that includes glass and wafer are disclosed. The inspection system includes multiple camera modules positioned in a load lock unit of a process chamber, such as the camera modules that can capture images of the substrate in the load lock. The images are analyzed by a controller of the inspection system to determine the accuracy of robots in handling the substrate, calibration of the robots based on the analysis, and defects in the substrate caused during the handling and deposition process.

Abstract: An electronic device includes a substrate, a spacer, a first element and a second element. A spacer is disposed on the substrate and has a first opening, a second opening and a third opening arranged in a first direction. The second opening is located between the first opening and the third opening. A distance between the first opening and the second opening is less than a distance between the second opening and the third opening in the first direction. A first element is located in at least one of the first opening and the second opening. A second element is located in the third opening.

Abstract: This application relates to a method of inspection and an inspection system for the film deposition process for substrates that includes glass and wafer. The inspection system includes multiple camera modules positioned in a load lock unit of a process chamber, such as the camera modules that can capture images of the substrate in the load lock. The images are analyzed by a control unit of the inspection system to determine the accuracy of robots in handling the substrate, calibration of the robots based on the analysis, and defects in the substrate caused during the handling and deposition process.

Abstract: A display device includes a substrate; a plurality of pixels on the substrate; a light emitting element in each of the plurality of pixels; a first electrode electrically coupled with the light emitting element; a transistor on the substrate and electrically coupled with the first electrode; and a coupling layer between the first electrode and the light emitting element in a direction perpendicular to the substrate and containing a plurality of first conductive nanoparticles.

Abstract: A processing apparatus includes a holding section that holds a processing target, an imaging section that is positionally fixed with respect to the holding section, and images a surface of the processing target, and a control section that controls the imaging section to image the surface of the processing target in a state in which the holding section holds the processing target.

Abstract: Disclosed is a method of, and associated apparatus for, determining an edge position relating to an edge of a feature comprised within an image, such as a scanning electron microscope image, which comprises noise. The method comprises determining a reference signal from said image; and determining said edge position with respect to said reference signal. The reference signal may be determined from the image by applying a 1-dimensional low-pass filter to the image in a direction parallel to an initial contour estimating the edge position.

Abstract: Disclosed are a micro LED group substrate provided with a plurality of micro LEDs, a method of manufacturing the same, a micro LED display panel, and a method of manufacturing the same. More particularly, disclosed are a micro LED group substrate provided with a plurality of micro LEDs, a method of manufacturing the same, a micro LED display panel, and a method of manufacturing the same, wherein the need for a micro LED replacement process is eliminated.

Abstract: A backplane, a manufacturing method thereof, a backlight module and a display panel are provided. The backplane includes a base substrate; a first conductive layer located on the base substrate and including a wire; a first protection layer located at a side of the first conductive layer facing away from the base substrate; a second conductive layer located on the first protection layer and including a conductive sub-layer, the conductive sub-layer penetrating the first protection layer to be connected with the wire; a second protection layer located at a side of the second conductive layer facing away from the base substrate; a micro light-emitting diode (LED) penetrating the second protection layer to be connected with the conductive sub-layer; and a metallic reflective layer, located on the second protection layer and configured to reflect light irradiated onto the metallic reflective layer from the micro LED.

Abstract: This disclosure provides an image shooting apparatus and a mobile terminal. The image shooting apparatus includes: a support base, an image shooting circuit board, a first image shooting assembly, and a second image shooting assembly. The support base is provided with an accommodating chamber. The image shooting circuit board is disposed in the accommodating chamber, and divides the accommodating chamber into a first accommodating chamber and a second accommodating chamber. The first image shooting assembly is disposed in the first accommodating chamber, and the second image shooting assembly is disposed in the second accommodating chamber. The first image shooting assembly includes a first lens and a first image sensor. The second image shooting assembly includes a second lens and a second image sensor.

Abstract: A metrology system includes one or more through-focus imaging metrology sub-systems communicatively coupled to a controller having one or more processors configured to receive a plurality of training images captured at one or more focal positions. The one or more processors may generate a machine learning classifier based on the plurality of training images. The one or more processors may receive one or more target feature selections for one or more target overlay measurements corresponding to one or more target features. The one or more processors may determine one or more target focal positions based on the one or more target feature selections using the machine learning classifier. The one or more processors may receive one or more target images captured at the one or more target focal positions, the target images including the one or more target features of the target specimen, and determine overlay based thereon.

Abstract: A method of inspection and an inspection system for the film deposition process for substrates that includes glass and wafer are disclosed. The inspection system includes multiple camera modules positioned in a load lock unit of a process chamber, such as the camera modules that can capture images of the substrate in the load lock. The images are analyzed by a controller of the inspection system to determine the accuracy of robots in handling the substrate, calibration of the robots based on the analysis, and defects in the substrate caused during the handling and deposition process.

Abstract: An arbitrary curved-surface display device which has unit display pixels including active inorganic micro-light emitting diode unit chips, wherein each active inorganic micro-light emitting diode unit chip comprises an inorganic light-emitting diode unit device and a field-effect transistor. Conducting wires are on a substrate of the arbitrary-curved surface, and the conducting wires connect to each active inorganic micro-light emitting diode unit chip.

Abstract: An illustrative volumetric processing system generates a plurality of point clouds each representing an object from a different vantage point. Based on the plurality of point clouds, the volumetric processing system consolidates point cloud data corresponding to a surface of the object. Based on the consolidated point cloud data for the object, the volumetric processing system generates a voxel grid representative of the object. Based on the voxel grid, the volumetric processing system generates a set of rendered patches each depicting at least a part of the surface of the object. Corresponding methods and systems are also disclosed.

Abstract: Head-mountable devices can include adjustment mechanisms to achieve optimal alignment of optical components during and/or after assembly thereof within the head-mountable device. The alignment mechanisms can be integrated into the head-mountable device itself. A light projecting display element can be adjustable based on operation of one or more actuators within the head-mountable device (e.g., within an arm) to adjust a position and/or orientation of the light projecting display element relative to the waveguide onto which it projects light. The adjustment mechanisms can adjust the display element during initial assembly and/or be operated by actuators that actively adjust the alignment as needed over time.

Abstract: A captured image of a pattern and a reference image of the pattern may be received. A contour of interest of the pattern may be identified. One or more measurements of a dimension of the pattern may be determined for each of the reference image and the captured image with respect to the contour of interest of the pattern. A defect associated with the contour of interest may be classified based on the determined one or more measurements of the dimension of the pattern for each of the reference image and the captured image.

Abstract: A three-dimensional shape measuring apparatus includes a photoreceptor that receives measuring light which is reflected by a workpiece illuminated by an illuminator, and provides light-reception signals representing a light reception amount; and a processor that generates a set of shape data representing three-dimensional shape of a part of the workpiece which is included in the field of view at a particular position of the stage based on the signals, repeats movement of the stage by using a movement controller based on the generated data corresponding to the part of the workpiece to obtain a set of data corresponding to other part of the workpiece which is located in proximity to the part of the workpiece and the generation of a set of data of the workpiece at the position where the stage is moved, and generates combined data including the entire shape of the workpiece by combining the repeatedly obtained sets of data.

Abstract: A method of manufacturing light emitting diode (LED) devices is provided. In one example, the method comprises: forming a plurality of LED dies on a starter substrate, each of the plurality of LED dies including a device-side bump; moving, using a pick up tool (PUT), the starter substrate and the plurality of LED dies towards a backplane, the backplane including a plurality of backplane-side bumps; establishing the conductive bonds between the device-side bumps of the plurality of LED dies and the backplane-side bumps of the backplane at the plurality of contact locations; and operating the PUT to release the starter substrate to enable transferring of the plurality of LED dies to the backplane.

Abstract: A reflective LCD panel includes a color filter substrate, an array substrate, a liquid crystal layer and a polarizing film. The array substrate and the color filter substrate are disposed oppositely. The liquid crystal layer is disposed between the color filter substrate and the array substrate and has an alignment direction. The polarizing film is disposed on the color filter substrate, and color coordinates of the polarizing film in the CIE1976 color space are (a, b), wherein 0.05?a?0.2 and ?5?b?0. The liquid crystal layer has a birefringence difference ?n, the liquid crystal layer has a thickness (d), when the reflective LCD panel is in a white frame, 2?n*d=?? is satisfied, ?? is the optical path difference obtained when a forward light vertically enters the liquid crystal layer and is reflected by the array substrate, and 120 nm??n*d?170 nm.

Abstract: A computer-implemented method executed by at least one processor for detecting tattoos on a human body is presented. The method includes inputting a plurality of images into a tattoo detection module, selecting one or more images of the plurality of images including tattoos with at least three keypoints, the at least three keypoints having auxiliary information related to the tattoos, manually labeling tattoo locations in the plurality of images including tattoos to create labeled tattoo images, increasing a size of the labeled tattoo images identified to be below a predetermined threshold by padding a width and height of the labeled tattoo images, training two different tattoo detection deep learning models with the labeled tattoo images defining tattoo training data, and executing either the first tattoo detection deep learning model or the second tattoo detection deep learning model based on a performance of a general-purpose graphical processing unit.

Abstract: An embodiment of an electronic processing system may include a 2D frame which corresponds to a projection of a 360 video space, and a component predictor to predict an encode component for a first block of a 2D frame based on encode information from a neighboring block which is neighboring to the first block of the 2D frame only in the 360 video space, a prioritizer to prioritize transmission for a second block of the 2D frame based on an identified region of interest, and/or a format detector to detect a 360 video format of the 2D frame based on image content. A 360 video capture device may include a contextual tagger to tag 360 video content with contextual information which is contemporaneous with the captured 360 video content. Other embodiments are disclosed and claimed.

Abstract: An integrated circuit for driving a display panel and an anti-interference method are provided. The integrated circuit includes a source driving circuit and an anti-interference circuit. The source driving circuit includes a receiving circuit configured to receive an input signal including image data and process the input signal based on at least one operation parameter to generate output data. The anti-interference circuit is coupled to the receiving circuit. The anti-interference circuit is configured to adjust the at least one operation parameter of the receiving circuit from at least one normal parameter to at least one anti-interference parameter when an interference event occurs to the input signal. The anti-interference circuit is configured to maintain the at least one operation parameter of the receiving circuit at the at least one normal parameter when the interference event does not occur.

Abstract: According to one embodiment, in a defect inspection apparatus, a controller acquires an image of a second actual pattern in a first shot region which corresponds to a design pattern identical to a design pattern corresponding to a first actual pattern, which is consistent in a first comparison process, and which is consistent in a second comparison process. The controller replaces the image of one actual pattern of the first actual pattern and the second actual pattern in the first shot region with the image of the other actual pattern so as to generate a reference image of the first shot region. The controller compares the reference image and the image of the second shot region so as to perform a defect inspection of the second shot region.

Abstract: An X-ray apparatus includes a mount, an X-ray source, a detector, an optical gauge and a motor. The mount is configured to hold a planar sample having a first side, which is smooth, and a second side, which is opposite the first side and on which a pattern has been formed. The X-ray source is configured to direct a first beam of X-rays toward the first side of the sample. The detector is positioned on the second side of the sample so as to receive at least a part of the X-rays that have been transmitted through the sample and scattered from the pattern. The optical gauge is configured to direct a second beam of optical radiation toward the first side of the sample, to sense the optical radiation that is reflected from the first side of the sample, and to output a signal, in response to the sensed optical radiation, that is indicative of a position of the sample. The motor is configured to adjust an alignment between the detector and the sample in response to the signal.

Abstract: An example of a printed structure comprises a target substrate and a structure protruding from a surface of the target substrate. A component comprising a component substrate separate and independent from the target substrate is disposed in alignment with the structure on the surface of the target substrate within 1 micron of the structure. An example method of making a printed structure comprises providing the target substrate with the structure protruding from the target substrate, a transfer element, and a component adhered to the transfer element. The component comprises a component substrate separate and independent from the target substrate. The transfer element and adhered component move vertically toward the surface of the target substrate and horizontally towards the structure until the component physically contacts the structure or is adhered to the surface of the target substrate. The transfer element is separated from the component.

Abstract: A component mounter for holding a component and for mounting the component on a surface of a board includes a head, a horizontal moving device, a vertical moving device, a mounting control device, and an imaging device. The imaging device is configured to image an imaging target by receiving incident light from the imaging target on an imaging element via an optical system. The optical system includes a first optical system configured to guide incident light from a direction of a side surface of a nozzle tip to a first region of the imaging element, and a second optical system configured to guide incident light from a direction of the surface of the board to a second region of the imaging element. The imaging device is configured to image an image via the first optical system and the second optical system.

Abstract: This invention provides a system and method for finding multiple line features in an image. Two related steps are used to identify line features. First, the process computes x and y-components of the gradient field at each image location, projects the gradient field over a plurality subregions, and detects a plurality of gradient extrema, yielding a plurality of edge points with position and gradient. Next, the process iteratively chooses two edge points, fits a model line to them, and if edge point gradients are consistent with the model, computes the full set of inlier points whose position and gradient are consistent with that model. The candidate line with greatest inlier count is retained and the set of remaining outlier points is derived. The process then repeatedly applies the line fitting operation on this and subsequent outlier sets to find a plurality of line results. The process can be exhaustive RANSAC-based.

Abstract: A scalable driving architecture for large size display includes a display; a low voltage integrated circuit configured to: receive a high-speed input signal; process the input signal; and output uncompressed pixel data based on the processed input signal; and a first high voltage integrated circuit configured to drive pixels in the display based on the uncompressed pixel data; wherein the low voltage integrated circuit is configured to provide the uncompressed pixel data to the first high voltage integrated circuit via a first low-to-high (L2H) interface, and wherein the low voltage integrated circuit and the first high voltage integrated circuit are assembled on a film.

Abstract: A low power architecture for mobile displays includes a display, a low voltage integrated circuit configured to: receive a high speed input signal; process the input signal; and output uncompressed pixel data based on the processed input signal; and a high voltage integrated circuit configured to drive pixels in the display based on the uncompressed pixel data; wherein the low voltage integrated circuit is configured to provides the uncompressed pixel data to the high voltage integrated circuit via a timing-to-driver (T2D) interface.

Abstract: A method of transferring different types of micro devices is provided. The method includes: assembling a first detachable transfer plate with first type micro devices thereon to an alignment assistive mechanism which is substantially above a receiving substrate, wherein the first type micro devices face the receiving substrate; aligning the first type micro devices on the first detachable transfer plate with positions of first sub-pixels respectively of pixels on the receiving substrate by the alignment assistive mechanism; transferring the first type micro devices to the first sub-pixels on the receiving substrate; replacing the first detachable transfer plate with a second detachable transfer plate with second type micro devices thereon, wherein the second type micro devices face the receiving substrate; and transferring the second type micro devices to second sub-pixels respectively of the pixels on the receiving substrate.

Abstract: In a video image generation device connected to a peripheral device via a video image relay device, a version acquisition unit acquires from the video image relay device information related to version of firmware installed in the video image relay device. If the version of the firmware installed in the video image relay device is older than version of firmware requested by basic software installed in the video image generation device, an update request unit supplies the video image relay device with firmware for the relay device included in the basic software in order to update accordingly the firmware installed in the video image relay device.

Abstract: A method of operating an ultrasonic bonding machine is provided. The method includes the steps of: (a) imaging at least one of (i) a semiconductor element supported by a substrate, and (ii) a clamping structure adapted for securing the substrate during a bonding operation; and (b) determining if a relative position of the semiconductor element and the clamping structure is acceptable using predetermined criteria and information from step (a).

Abstract: A component mounting machine mounts components having a component mark for positioning on an upper face on a circuit board. The component mounting machine has a first suction nozzle that sucks a component, a transfer head that mounts the component on a circuit board, an optical path conversion device disposed above a suction surface and converts the optical path of light from the upper face of the component to the side, a camera that receives light that is changed in an optical path, a camera moving device that moves the camera, and a control device controlling operation of the transfer head and the camera moving device. The camera moving device moves the camera in a first direction orthogonal to an optical axis of the camera, and an imaging region of the camera moves in a second direction when the camera moves in the first direction.

Abstract: An information handling system operating a wearable headset IR emitter saturation correction system may comprise an infrared emitter emitting IR light, a camera capturing a calibration image and a first session image of the IR light reflected from a landmark, and a SLAM engine generating a first session SLAM frame. A processor may execute code instructions to compare the measured calibration pixel brightness value for each pixel associated with the landmark in a calibration image with a measured first session pixel brightness value for each pixel associated with the landmark in the first session image to determine whether the first session SLAM frame is over or under saturated, and determine an adjusted brightness if the first session SLAM frame is over or under saturated. The infrared emitter may emit light according to the adjusted brightness.

Abstract: To inspect a board, first, a measurement area is set on the board and a reference data of the measurement area is obtained. Then, a measurement data of the measurement area is obtained per colors, and a lighting condition is set using the reference data of the measurement area and the measurement data obtained per colors. Next, a feature object in the measurement area is set, and a distortion quantity between the reference data and the measurement data is obtained by comparing the reference data corresponding to the feature object and the measurement data corresponding to the feature object obtained under the lighting condition. Then, an inspection area is set by compensating the distortion quantity. Therefore, it is possible to compensate the distortion and set precisely the inspection area.

Abstract: A method for image composition is disclosed, including: acquiring a plurality of images to be processed for a scene, and brightness information of each of the plurality of images to be processed respectively; acquiring difference information for the each of the plurality of images to be processed based on the brightness information of the each of the plurality of images to be processed; obtaining a reference image from the plurality of images to be processed based on the difference information for the each of the plurality of images to be processed; acquiring a weight of the each of the plurality of images to be processed respectively based on feature information of the reference image and feature information of the plurality of images to be processed; and compositing the plurality of images to be processed based on the weight of the each of the plurality of images to be processed. A device and a nonvolatile computer readable storage medium are also disclosed.

Abstract: A surface covering layout system includes a processing circuit configured to receive image data regarding one or more images associated with a surface to be covered with a surface covering, and generate a surface covering layout based on the image data, the surface covering layout providing an indication of a pattern of a plurality of covering members included in the surface covering.

Abstract: A reel holding device is provided. The device includes: a case which accommodates the plurality of component supply reels to be aligned in a direction of a reel axial line; outer circumferential support members which are built between two sides walls of the case, and support outer circumferences of the multiple component supply reels to be rotatable; and a deviation preventing member which prevents the component supply reels from deviating from the outer circumferential support members. At least one of the outer circumferential support members and the deviation preventing member is an integrated rod-like member which is built between the two side walls.

Abstract: According an embodiment, an imaging apparatus includes an image acquiring unit which acquires a judgment image showing arranged judgment targets, and an interval judging unit which judges whether the interval between the judgment targets is proper on the basis of figures of the judgment targets shown in the judgment image.

Abstract: This working apparatus for a component or a board includes a head unit and a control portion. The control portion performs control of calculating a rotation angle in a horizontal plane of the head unit from displacement of the center of a first imaging portion and displacement of the center of a second imaging portion and correcting the center position of a working mechanism portion on the basis of the amount of rotation-induced displacement of the center of the working mechanism portion due to the rotation angle, a first amount of displacement in a first direction in the horizontal plane being not induced by rotation of the center of the working mechanism portion, and a second amount of displacement in a second direction in the horizontal plane being not induced by the rotation of the center of the working mechanism portion when moving the head unit.