Abstract: In a control unit of an electronic component mounting apparatus, when an imaging form of a component imaging unit is set to a first mode, a component recognition unit recognizes a first electronic component based on an imaged image due to a first imaging element of the component imaging unit, and recognizes a second electronic component based on an imaged image due to a second imaging element of the component imaging unit. Meanwhile, when the imaging form is set to a second mode, the component recognition unit recognizes the electronic components based on an image in which the imaged image by the first imaging element is combined with the imaged image by the second imaging element.

Abstract: A component imaging unit of an electronic component mounting apparatus has three area cameras, and each of visual fields are common to each other regardless of the area cameras. When the imaging form of the component imaging unit is set to a first mode, a component recognition unit recognizes the electronic components held by the holding unit, based on an image imaged by one area camera. Meanwhile, when the imaging form is set to a second mode, in the component imaging unit, the component recognition unit recognizes the electronic component held by the holding unit, based on each of images, each of which is imaged by three area cameras.

Abstract: A control unit of an electronic component mounting apparatus controls a component imaging unit so as to move an electronic component that is held by the holding unit, when the holding unit is moved in a direction, which is oblique to a conveyance direction of a substrate and is close to the substrate, by a movement mechanism unit.

Abstract: A Time Delay and Integration (TDI) imaging system utilizing variable voltage readout clock signals having progressively increasing amplitudes defined as a function of pixel row location, where pixel rows positioned to receive/collect/transfer image-related charges at the start of the TDI imaging process are controlled using lower amplitude readout clock signals than pixel rows positioned to receive/collect/transfer image-related charges near the end of the TDI process. The clock signal amplitude for each pixel row is determined by the expected maximum amplitude needed to hold and transfer image charges by the pixels of that row. Multiple (e.g., three) primary phase signals are generated that are passed through splitters to provide multiple identical secondary phase signals, and then drivers having gain control circuitry are utilized to produce voltage readout clock signals having the same phases as the primary phase signals, but having two or more different voltage amplitudes.

Abstract: A focus height sensor in an optical system for inspection of semiconductor devices includes a sensor beam source that emits a beam of electromagnetic radiation. A reflector receives the beam of electromagnetic radiation from the sensor beam source and directs the beam toward a surface of a semiconductor device positioned within a field of view of the optical system. The reflector is positioned to receive at least a portion of the beam back from the surface of the semiconductor device to direct the returned beam to a sensor. The sensor receives the returned beam and outputs a signal correlating to a position of the surface within the field of view along an optical axis of the optical system.

Abstract: A triangulation system comprising an area camera, a communication interface, a first image processing module, a second image processing module; wherein the area camera is arranged to obtain, at an acquisition rate, a stream of images of illuminated regions of an object; wherein the area camera is prevented from performing height calculations; wherein the communication interface is arranged to convey, in real time thereby in correspondence to the acquisition rate, the stream of images from the area camera to the first image processing module; wherein the first image processing module is arranged to process, in real time, the stream of images to provide first compressed information; wherein the second image processing module is arranged to process, at a non-real time image processing rate, the first compressed information to provide height information indicative of heights of at least the illuminated regions of the object.

Abstract: Disclosed herein are a calibration block for measuring warpage, a warpage measuring apparatus using the same, and a method thereof. The calibration block includes a substrate having one planar surface; and a stepped part forming a step at the center of the other surface of the substrate.

Abstract: An image transmission method, from an image sensor which collects a fixed number of pixel data items obtained by a plurality of imaging elements into a data block, and outputs the pixel data items, including a transmission region setting step of setting an interest region by using a unit lower than the fixed number, a region extension step of extending the interest region to obtain an extension interest region in which the data block is represented as a unit and obtaining extension ranges from the interest region to the extension interest region, an imaging step of performing imaging with the image sensor, an output step of outputting the data block included in the extension interest region from the image sensor, and an extension range erasing step of erasing pixel data of the extension ranges from the output data block so as to obtain an image of the interest region.

Abstract: A ready for rotation state detection device is configured to detect a state in which a substrate, which is placed on a concave portion formed in a surface of a turntable, will not fly out of the concave portion when the turntable is rotated in a chamber. The ready for rotation state detection device includes a ready for rotation state detection unit configured to detect that a height of a surface of an end of the substrate is equal to or lower than a predetermined value indicating that the turntable is rotatable, upon receiving the substrate on the concave portion.

Abstract: To effectively utilize the polarization property of an inspection subject for obtaining higher inspection sensitivity, for the polarization of lighting, it is necessary to observe differences in the reflection, diffraction, and scattered light from the inspection subject because of polarization by applying light having the same elevation angle and wavelength in the same direction but different polarization. According to conventional techniques, a plurality of measurements by changing polarizations is required to cause a prolonged inspection time period that is an important specification of inspection apparatuses.

Abstract: A system for sensing a three-dimensional topology of a circuit board is provided. An illumination source generates patterned illumination from a first point of view. At least one camera acquires an image of the patterned illumination from a second point of view. A controller is coupled to the source, and to the at least one camera. The controller generates a height topology of the circuit board based on images acquired from first and second image detectors of the patterned illumination. The characteristics of the pattern illumination are modified based on knowledge of the circuit board to enhance the dynamic range of the sensor and to reject image defects caused by multipath reflections.

Abstract: A router module is arranged in a housing of a smart television. The router module is externally connected to a modem for surfing the Internet. The router module is electrically connected to a micro processing unit of the smart television. Therefore, the smart television is connected to the Internet through the router module. A wireless transmission chip of the router module is configured to process Internet signals. An antenna module is configured to wirelessly transmit the Internet signals, so that wireless network is shared to outside.

Abstract: A handler for testing semiconductor device is disclosed. The handler for testing semiconductor device includes a socket plate having a test socket to be electrically connected to a tester, a device feeder configured to feed a semiconductor device to the test socket or recover the semiconductor device from the test socket, a camera obtaining an image of the test socket, a sensor sensing an exposing moment that at least one photographing area among photographing areas on the test socket is exposed to the camera, while the device feeder moves, and a controller configured to operate the camera to take a photograph at the exposing moment and to determine whether a semiconductor device remains in the test socket, using the image obtained by the camera.

Abstract: The work, visual inspection device 30 composes a conveyance table 2 which holds and conveys works W1 and W2 and camera units 8, 9, 10, 11, 12 and 13 which capture images of the works conveyed by the conveyance table, The camera 91/101 of the camera units 9 and 10 includes a first body tube 91C/101C including an imaging lens 911/101L and a second body tube 91Ca/101a attached to the front end of the first body tube 91C/101C.

Abstract: An alignment method for assembling substrates in different spaces without fiducial mark and its system are provided, and the alignment method has steps of: pre-defining partially standard character regions of two substrates; capturing at least two partially actual images of two substrates in different waiting spaces, respectively; comparing to obtain at least two partially actual character regions of the two substrates, respectively; building actual coordinate systems of the two substrates, respectively; comparing the actual coordinate systems of the two substrates with each other to obtain a set of offset values; moving the two substrates from the different waiting spaces to an alignment-and-installation space based on the set of offset values and a predetermined movement value, respectively; and stacking the two substrates with each other to finish the alignment and installation in the alignment-and-installation space.

Abstract: A substrate position detection method includes rotating the susceptor so that the substrate receiving portion is moved into an image taking area of a imaging apparatus; detecting first two position detection marks provided in the process chamber so that the first two position detection marks are within the image taking area, wherein a first perpendicular bisector of the first two position detection marks passes through a rotational center of the susceptor; detecting second two position detection marks provided in the susceptor so that the second two position detection marks can be within the image taking area, wherein a second perpendicular bisector of the second two position detection marks passes through the rotational center of the susceptor and a center of the substrate receiving portion; and determining whether the substrate receiving portion is positioned in a predetermined range in accordance with the detected first two and second two position detection marks.

Abstract: The present technology relates to a transmitter apparatus, an information processing method, a program, and a transmitter system capable of easily transmitting a wideband signal. The transmitter apparatus includes: a first acquisition unit that obtains first transmission control information; a second acquisition unit that obtains second transmission control information similar to information input to another transmitter apparatus; and a generating unit that processes transmission target data based on a parameter contained in the first transmission control information and generates data including the processed transmission target data and the second transmission control information. The present technology can be applied to a transmitter apparatus that transmits a DVB-C2 signal.

Abstract: A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities.

Abstract: A pick-and-place machine and method includes use of a passive component feeder cartridge including a feeder gear. Rotation of the feeder gear causes a component-bearing tape to be fed through the feeder cartridge. A pickup head includes a vacuum nozzle to pick up the components from the tape and a rack gear to engage and drive the feeder gear of the feeder cartridge via translational motion of the pickup head when operatively disposed with respect to a selected feeder cartridge.

Abstract: A system and method for monitoring a manufacturing process of a fan-out wafer, the method may include acquiring a first set of images of dies after a completion of a first manufacturing stage of a manufacturing process of the fan-out wafer; processing the first set of images to detect defects; performing at least one corrective operation in response to at least one defect detected by processing the first set of images; acquiring a second set of images of dies after a completion of a second manufacturing stage of the manufacturing process of the fan-out wafer, the second manufacturing process follows the first manufacturing process; processing the second set of images to detect defects; and performing at least one corrective operation in response to at least one defect detected by processing the second set of images.

Abstract: A chamber for an extreme ultraviolet light generation apparatus is a chamber into which droplets are sequentially outputted, and may include an image capturing unit configured to repeatedly capture images of the droplets during an image capturing time set so that images of two adjacent droplets that have been outputted do not overlap.

Abstract: This invention provides a parameter determination assisting device and a parameter determination assisting program enabling a more rapid and easy determination of a parameter to be set in a processing device, which obtains a processing result by performing a process using a set of parameters defined in advance on image data obtained by imaging a measuring target object. A user can easily select an optimum parameter set when a determination result and a statistical output are displayed in a list for each of a plurality of trial parameter candidates. For instance, while trial numbers “2”, “4”, and “5”, in which the number of false detections is zero, can perform a stable process, the parameter set of the trial number “2” is comprehensively assumed as optimum since the trial number “2” can perform the process in the shortest processing time length.

Abstract: To enable image recognition of a component at a high degree of accuracy in a stable manner over a long term with a component recognizing device configured to take an image of a component by moving a scan unit having an imaging device using a linear motor, and a surface mounting machine and a component testing machine each equipped with the component recognizing device. The component recognizing device includes permanent magnets (732) that are fixed to a head unit (6) in a state where surfaces (732a) opposing a coil portion (733) are faced downward. The coil portion (733) is disposed at a position directly below the permanent magnets (732). An attraction force (FM) induced between the coil portion (733) and the permanent magnets (732) therefore acts on linear guides (72) in an upward direction (+Z direction) via a bottom frame (731). On the contrary, the own weights (Fig) of a scan unit (71) and the like act in a downward direction.

Abstract: Disclosed is monitoring device of monitoring a state of a substrate processing process in a substrate processing apparatus. The monitoring device includes: an imaging unit configured to image a processing state of the substrate processing process; a storage unit; a storage control unit configured to store a moving picture imaged by the imaging unit after adding a time stamp to the moving picture; a group classification unit configured to group a plurality of moving pictures stored in the storage unit into moving pictures of a normal group and moving pictures of a group other than the normal group; and a threshold generation unit configured to generate a threshold for detecting an abnormal moving picture based on the moving pictures of the normal group grouped by the group classification unit.

Abstract: A device for applying conductive glue and assembling a glued photoelectric element on a substrate operates a vacuum-lift nozzle, a driver, a first camera module, a second camera module, and a third camera module. The first, second, and third camera modules take images of the photoelectric element on a supply tray, check for absence of tilt during a dipping into the conductive glue, and supervise the accurate positioning of the photoelectric element onto a substrate on an output tray.

Abstract: An inspection method and apparatus comprising, a step of reflecting linearly-polarized light having a predetermined wavelength using an non-polarizing beam splitter after transmitting the linearly-polarized light through a half-wave plate, irradiating a sample with the linearly-polarized light having a polarization plane of a predetermined angle, causing the light reflected by the sample to be incident to an image capturing sensor through a lens, the non-polarizing beam splitter, and an analyzer, and acquiring an optical image of a pattern formed on the sample; acquiring a plurality of optical images by changing an angle of the analyzer or the half-wave plate, and obtaining an angle of the analyzer or the half-wave plate such that a value of (?/?A) becomes a minimum; and a step of inspecting whether a defect of the pattern exists, wherein the pattern is a repetitive pattern having a period at a resolution limit or less.

Abstract: There are provided a susceptor having a recessed wafer mounting section, in which a semiconductor wafer is mounted and which is configured to include a circular bottom portion and a side wall portion, on an upper surface, a reaction chamber in which the susceptor is provided, an imaging unit that is provided above the reaction chamber and images the semiconductor wafer and the wafer mounting section, and an image analysis unit that analyzes the deviation of the semiconductor wafer from the wafer mounting section on the basis of an image captured by the imaging unit.

Abstract: A method of operating a chip mounter is provided, comprising: preparing an electronic part on a part supply unit and a printed circuit board on a main body; gripping the electronic part using a part conveyor unit to move the electronic part along a part moving path on the part supply unit and the main body; photographing the electronic part when the electronic part is located at a part recognition region within the part moving path without stoppage and during the movement of the electronic part; transmitting a photographed image of the electronic part to a controller using the image processing unit; comparing the photographed image with a reference image using the controller; and displaying the photographed image to the exterior using the controller; wherein the part recognition region is set by at least one coordinate in the controller to be located on a light source of the processing unit.

Abstract: Controlled amount of heat is injected into a stacked die using a light beam, and the propagated heat is measuring with LIT camera from the other side of the die. The thermal image obtained can be characterized so that it can be used to calibrate the phase shift from a given stack layer, or can be used to identify defects in the stacked die. The process can be repeated for each die in the stack to generate a reference for future testing. The thermal image can be investigated to detect faults, such as voids in vias, e.g., TSV.

Abstract: A system for measuring solder paste stencil aperture positions and sizes is provided. The system includes at least one camera configured to acquire images of the stencil and an alignment target. A motion system generates relative motion between the at least one camera and the stencil. A controller is coupled to and controls the motion system. The controller is configured to analyze the images to generate aperture information relative to the stencil. The aperture information is provided to automatically program a solder paste inspection system. Other features and benefits that characterize embodiments of the present invention will be apparent upon reading the following detailed description and review of the associated drawings.

Abstract: A component presence/absence judging apparatus judges the presence/absence of a component through a registration step and an inspection step. The registration step comprises an ante-mounting color information acquisition step, a post-mounting color information acquisition step and an inspection area determination step. Ante-mounting color information is acquired from an ante-mounting image taken at a predetermined portion on an ante-mounting board. Post-mounting color information is acquired from a post-mounting image taken at the predetermined portion on a post-mounting board. Then, a section having a large difference between both color information of the ante-mounting image and the post-mounting image is identified and is determined as an inspection area. At the inspection step, the presence/absence of the component at a predetermined place on each inspection board to be inspected is judged in dependence on the color information on the determined inspection area.

Abstract: Disclosed herein are a system for measuring a warpage and a method for measuring a warpage. The system for measuring a warpage includes: a heating plate portion heating the sample; and a reference gating portion disposed between the sample and the camera so as to be spaced apart from the sample by a predetermined distance, wherein the reference grating portion includes a plurality of wires that are each spaced apart from each other by a predetermined interval, thereby accurately measuring the warpage without being affected by the fume generated from the sample.

Abstract: Provided is a panorama image synthesis technique using a scanning charged-particle microscope and capable of obtaining a panorama image synthesis that is robust against contamination and the imaging shift and distortion of an image in a wide-field imaging region (EP) for semiconductor fine patterns. The panorama image synthesis technique in the wide-field imaging region (EP) using the scanning charged-particle microscope is characterized in that the layout of each adjustment point, each local imaging region, and an imaging sequence comprising the imaging order of the each adjustment point are optimized and created as an imaging recipe.

Abstract: A substrate position detecting apparatus detects a position of a substrate inside a chamber from an image of a target inside the chamber. The apparatus includes an image pickup device to pick up the image of the target inside the chamber through a window, an illumination device to irradiate light upwards, an illumination reflecting plate provided above the illumination device and including a reflecting surface to reflect the light from the illumination device towards the window, and a reflection restricting part provided on the reflecting surface to form a shadow in a predetermined region that includes the target inside the chamber.

Abstract: A three dimensional shape measurement apparatus includes an illumination section and a grating transfer unit. The illumination section includes a light source unit generating a light and a grating unit changing the light generated by the light source unit into a grating pattern light having a grating pattern. The illumination section illuminates the grating pattern light onto a measurement target in a predetermined direction. The grating transfer unit transfers the grating unit in a predetermined inclination direction with respect to an extension direction of the grating pattern and an arrangement direction of the grating pattern. Thus, manufacturing cost may be reduced, and the three dimensional shape measurement apparatus may be easily managed.

Abstract: The recognition and mounting apparatus including a zoom lens capable of changing imaging magnification, a chip camera, having a plurality of imaging pixels, capable of capturing an image an IC chip having a plurality of bumps arranged at at least one interval, through the zoom lens, a storage unit for storing shape information of the IC chip including at least information indicating an arrangement interval between the plurality of bumps, and a signal processor adjusting imaging magnification of the zoom lens based on a length of the imaging pixel and the information indicating the arrangement interval stored in the storage unit, and recognizing a position of the bump based on a plurality of pixel values in the image captured by the chip camera may be provided.

Abstract: In order to decrease the time needed to correct misalignment when holding an object with positional accuracy and transport the object, provided is a correction apparatus that corrects misalignment of a transported object at a transport destination, comprising a first sensor that is secured to a transporting section transporting the object; and a correction control section that detects a first offset between the transporting section and the first sensor, while the object transported to the transport destination is positioned at the transport destination, by using the first sensor to detect a position of a first reference point provided to correspond to a target position at the transport destination. Also provided is a probe apparatus and a test apparatus.

Abstract: The disclosure provides an interposer testing device for testing an interposer and a method thereof which includes a heat source, a thermal image capturing device and a comparing device. The heat source is adapted for heating an area to be tested on the interposer. The thermal image capturing device is adapted for capturing a thermal image of the interposer after the interposer is heated. The comparing device is adapted for comparing the thermal image with a standard thermal image to output a comparison result.

Abstract: A detection system and method for detecting if of a plurality of electrical elements on a printed circuit board (PCB) is loaded inversely are provided. The system includes a setting module to receive a standard image of a standard PCB and select one or more of the electrical elements from the standard image by a user. A storage module stores a reference image. A capturing module captures an image of the PCB to be detected. A comparison module compares the image with the reference image to determine if any of the electrical elements having polarities is inversely loaded. A processing module reads a comparison result of the comparison module and makes a determination.

Abstract: An apparatus for recognizing an object may include a lens, a camera and a signal-processing unit. The lens may include two cross sections having different focal lengths. The camera may be configured to photograph the object having a first part through the lens. The first part may have a first shape. The signal-processing unit may be configured to recognize a height of the first part based on deviations of the first shape in an image obtained from the camera. Thus, the apparatus may only include the cylindrical lens interposed between the object and the camera except for the softwares for processing the signals. As a result, the apparatus may have a simple structure without a structure of a laser irradiation.

Abstract: A substrate processing apparatus includes: a holding unit holding a substrate; a rotation driving unit rotating the substrate held on the holding unit; a moving mechanism moving the holding unit between a delivery position and an edge exposure position; an exposure unit provided on the edge exposure position side and exposing an edge portion of a coating film above the substrate held on the holding unit; an image capturing unit provided on the edge exposure position side and above the exposure unit and capturing an image of the substrate held on the holding unit; and a direction change unit changing a direction of an optical path formed between the substrate held on the holding unit and the image capturing unit. The direction change unit includes a first reflecting mirror, a second reflecting mirror, and a third reflecting mirror.

Abstract: The present invention relates to lighting apparatus for measuring an electronic material-processed part and the test apparatus using the same. The lighting apparatus includes a dome reflection plate 12 disposed over the subject of measurement and configured to have a dome form, have a light inflow window 11 through which coaxial illumination enters or exits formed at a central part of a highest end of the dome reflection plate 12, and have incident light reflected in all directions within the dome; a plurality of dome illumination lamps 13 disposed at lower edge portions of the dome reflection plate 12 and configured to illuminate the inside of the dome; and a camera 20 disposed right over the light inflow window 11 for the coaxial illumination of the dome reflection plate 12. The lighting apparatus illuminates a processing part, that is, the subject of measurement.

Abstract: Methods and apparatuses for detecting the presence and/or location of any conductive coating on a non-conductive medium surface are described.

Abstract: A die bonder comprises a storage unit which stores the image of the wafer taken by an imaging unit, a recognition pattern included the outline of a die formed on the wafer, and a recognition program, and a monitor-processing unit which gets the position on the wafer, of the die whose map data indicates normal, in the way that the die is matched with the recognition pattern by executing the recognition program, and that the center position of the die is gotten. Thus, the die bonder can recognize the position of the die without regard to the condition of dies on the wafer.

Abstract: An inspection device for inspecting the interior of an overlapped substrate produced by bonding one substrate and another substrate, comprising: a first holding unit configured to hold the rear surface of the overlapped substrate and include a cutout formed to expose a portion of the rear surface of the overlapped substrate when viewed from the top; a second holding unit configured to hold and rotate the overlapped substrate; an infrared irradiator configured to irradiate the rear surface or front surface exposed from the cutout of the overlapped substrate held on the first holding unit with an infrared ray; and an image pickup unit configured to receive the infrared ray emitted from the infrared irradiator and image the overlapped substrate held on the first holding unit in division for each of regions exposed from the cutout.

Abstract: A semiconductor component mounting apparatus includes an image sensing unit, electrode detection unit, and determination unit. The image sensing unit is configured to obtain image data of a plurality of electrodes arranged on a mounting surface of a semiconductor component. The electrodes are divided into a plurality of groups based upon functions of the electrodes. The electrode detection unit is configured to identify the electrodes in each of the groups, and to detect, for each of the electrodes, whether the electrode is lacking or not by using the image data. Each of the groups has a preset permissible number of lacking electrodes. The determination unit is configured to determine, based on the number of the lacking electrodes detected by the electrode detection unit and the permissible number of lacking electrodes preset to the group, whether the semiconductor component is a defective or a non-defective.

Abstract: A device for evaluating the appearance of the surface of a tire (P) comprising a color linear camera (1) comprising means (14, 15, 16) for separating the light beam (F) reflected by the surface of said tire (P) and entering the camera (1) into at least two base colors (R, G, B) of given wavelength, so as to direct the light beam to as many sensors (11, 12, 13) capable of obtaining a basic image in gray level (41, 42, 43) for each of the base colors, as many lighting means (21, 22, 23) as base colors, said lighting means being oriented so as to light the surface to be evaluated at different angles, characterized in that each of the lighting means (21, 22, 23) emits a colored light (R, G, B) that differs from that of the other lighting means, and the wavelength of which corresponds substantially to the wavelength of one of the base colors selected by the camera.

Abstract: An imaging method for imaging an image on a substrate at an accurate position while relatively moving the substrate and the imaging unit. The imaging method includes the steps of taking an image while relatively moving the substrate and a camera, predicting a shift amount of the imaging position and the position of the actual imaging when generating an imaging trigger without a correction, based on the relative moving speed and moving distance of the substrate and camera, and correcting the imaging trigger for shifting the timing of generating the imaging trigger only for the time corresponding to the predicted shift amount.

Abstract: A defect inspection device for a silicon wafer comprises: an infrared light illumination which illuminates the silicon wafer with a light power that has been adjusted in accordance with a specific resistance value of the silicon wafer; and an imaging unit constituted by a line sensor array that is sensitive to infrared light, which captures the silicon wafer.

Abstract: An inspection system for inspecting a surface of a wafer/mask/reticle can include a modular array. The modular array can include a plurality of time delay integration (TDI) sensor modules, each TDI sensor module having a TDI sensor and a plurality of localized circuits for driving and processing the TDI sensor. At least one of the localized circuits can control a clock associated with the TDI sensor. At least one light pipe can be used to distribute a source illumination to the plurality of TDI sensor modules. The plurality of TDI sensor modules can be positioned capture a same inspection region or different inspection regions. The plurality of TDI sensor modules can be identical or provide for different integration stages. Spacing of the modules can be arranged to provide 100% coverage of the inspection region in one pass or for fractional coverage requiring two or more passes for complete coverage.