Abstract: A method including a) forming a through-hole in a dummy substrate including a surface by radiating a laser to the surface of the dummy substrate in a state where the dummy substrate is moved relative to the laser along a direction parallel to the surface of the dummy substrate, b) determining an angle ? (?90°<?<+90°) of the through-hole relative to a line perpendicular to the surface of the dummy substrate, and c) forming a through-hole in the insulating substrate with the same conditions as step a) except for radiating a laser at an angle ? relative to a line perpendicular to a surface of the insulating substrate. The angle ? is set to be line symmetric with the angle ? relative to the line perpendicular to the surface of the insulating substrate and satisfy a relationship of ?=??.

Abstract: According to one embodiment, a stabilizer includes a jaw portion which contacts a bottom of an apparatus, a fastener to fasten the stabilizer to a lateral side of the apparatus, and a foot portion extending from the bottom of the apparatus toward far side and in obliquely downward.

Abstract: A method for overlay monitoring and control is introduced in the present disclosure. The method comprises forming resist patterns on one or more wafers in a lot by an exposing tool; selecting a group of patterned wafers in the lot using a wafer selection model; selecting a group of fields for each of the selected group of patterned wafers using a field selection model; selecting at least one point in each of the selected group of fields using a point selection model; measuring overlay errors of the selected at least one point on a selected wafer; forming an overlay correction map using the measured overlay errors on the selected wafer; and generating a combined overlay correction map using the overlay correction map of each selected wafer in the lot.

Abstract: A substrate treating apparatus according to the present invention includes: an index unit having an index robot and a port on which a container containing a substrate is placed; a process treating unit having a development treating unit in which a first development treating chamber and a second development treating chamber for performing a substrate development process are arranged in divided layers; and a first path unit arranged between the development treating unit and the index unit, wherein the first development treating chamber includes a development module, a first heating module, and a first main transport robot arranged in a movement passage accessible to the development module and the first heating module, wherein the first path unit includes a second heating module, a first buffer module, a cooling module, a second buffer module, and a first buffer transport robot arranged in a movement passage accessible to the second heating module, the first buffer module, the cooling module and the second buffe

Abstract: In one embodiment, a coating and developing apparatus includes a processing block having two early-stage coating unit blocks, two later-stage coating unit blocks and two developing unit blocks, each unit blocks being vertically stacked on each other. The apparatus has at least two operation modes M1 and M2 adapted for abnormality. In mode M1 the processing module that processed the abnormal substrate in the developing unit blocks is identified, and subsequent substrates are transported to the processing module or modules, of the same type as the identified processing module, other than the identified processing module. In mode M2, the developing unit block that processed the abnormal substrate is identified, and subsequent substrates are transported to the developing unit block other than the identified developing unit block.

Abstract: A coating and developing apparatus includes: first and second transfer mechanisms for transferring a substrate from a first mount module to a second mount module, one of the first and second transfer mechanisms being selected each time when the substrate transfer should be performed; first and second processing modules for performing substrate processing, for which the transfer of substrates is performed by the first and second transfer mechanisms, respectively; and a control unit. The control unit controls the transfer mechanisms for the substrate transfer by determining a delay time, representing a delay caused by the transfer of the substrate to the second mount module to the timing of transfer of a substrate from the first/second processing module, in regard to each of the first and second transfer mechanisms and selecting one of the first and second transfer mechanisms whose delay time is the shortest.

Abstract: A coating and developing apparatus forms a coating film including a resist film on a substrate and performs developing on the substrate after exposure and a plurality of unit blocks performing the same processing each includes plural kinds of processing modules. A control unit outputs a control signal to perform preparing individual conveying schedules for the one substrate according to the condition when the one substrate distributed into unit blocks is conveyed in the unit blocks, respectively, obtaining a residence time until the one substrate is conveyed in each unit block and is then conveyed out; and conveying the one substrate in the unit block having the shortest residence time and conveying the substrate based on the individual conveying schedules.

Abstract: A photolithographic apparatus for use with a photo-resist comprises a first component that generates a first chemical substance and produces a chemical amplification action and a second component that generates a second chemical substance. The photolithographic apparatus comprises a first exposure subsystem for selectively illuminating a surface of the photo-resist using a light of a first wavelength band such that the first component generates the first chemical substance and a second exposure subsystem for uniformly illuminating the surface using a light of a second wavelength band such that the second component generates the second chemical substance. The second chemical substance reacts with the first chemical substance to reduce the mass concentration of the first chemical substance in the photo-resist and improves the contrast of a latent image of the first chemical substance formed in the photo-resist.

Abstract: A photoresist pattern used for forming a pattern of a block copolymer is formed on a substrate, and then an acid solution is supplied and an alkaline solution is further supplied to the photoresist pattern so as to slim and smooth the photoresist pattern. A block copolymer solution is applied to the substrate on which the smoothed photoresist pattern has been formed, to form a film of the block copolymer, and the film is heated.

Abstract: A developing apparatus includes: a substrate holder that hold a substrate horizontally; a developer nozzle that supplies a developer onto the substrate to form a liquid puddle; a turning flow generation mechanism including a rotary member that rotates about an axis perpendicular to the substrate while the rotary member is being in contact with the liquid puddle thereby to generate a turning flow in the liquid puddle of the developer formed on the substrate; and a moving mechanism for moving the turning flow generation mechanism along a surface of the substrate. The line-width uniformity of a pattern can be improved by forming turning flows in a desired region of the substrate and stirring the developer.

Abstract: A developing method includes: horizontally holding an exposed substrate by a substrate holder; forming a liquid puddle on a part of the substrate, by supplying a developer from a developer nozzle; rotating the substrate; spreading the liquid puddle on a whole surface of the substrate, by moving the developer nozzle such that a supply position of the developer on the rotating substrate is moved in a radial direction of the substrate; bringing, simultaneously with the spreading of the liquid puddle on the whole surface of the substrate, a contact part into contact with the liquid puddle, the contact part being configured to be moved together with the developer nozzle and having a surface opposed to the substrate which is smaller than the surface of the substrate. According to this method, an amount of liquid falling down to the outside of the substrate can be inhibited. In addition, since the rotating speed of the substrate can be decreased, spattering of the developer can be inhibited.

Abstract: A coating mechanism disposes a liquid (e.g., polymer) thin film onto a conveyor surface (e.g., roller or belt) that is moved by a suitable motor to convey the thin film into a precisely controlled gap (or nip) region where applied potentials generate an electric field that causes the liquid to undergo Electrohydrodynamic (EHD) patterning deformation, whereby the liquid forms patterned micro-scale features. A curing mechanism (e.g., a UV laser) is used to solidify (e.g., cross-link) the patterned liquid features inside or immediately after exiting the gap region, thereby forming micro-scale patterned structures that are either connected by an intervening web as part of a sheet, or separated into discrete micro-scale structures. Nanostructures (e.g., nanotubes or nanowires) disposed in the liquid become vertically oriented during the EHD patterning process. Segmented electrodes and patterned charges are utilized to provide digital patterning control.

Abstract: A developing method including a developing step in which, while a wafer horizontally held by a spin chuck is being rotated, the wafer is developed by supplying a developer onto a surface of the wafer, wherein provided before the developing step is a pre-wetting step in which, simultaneously with the developer being supplied from a first nozzle that is located on a position near a central part of the surface of the rotating wafer, a deionized water as a second liquid is supplied from a second nozzle that is located on a position nearer to an outer peripheral part of the wafer than the first nozzle, to thereby spread out the developer in the rotating direction of the wafer by a wall that is formed by the deionized water flowing to the outer peripheral side of the wafer with the rotation of the wafer.

Abstract: A method of forming patterns includes (a) coating a substrate with a resist composition for negative development to form a resist film, wherein the resist composition contains a resin capable of increasing the polarity by the action of the acid and becomes more soluble in a positive developer and less soluble in a negative developer upon irradiation with an actinic ray or radiation, (b) forming a protective film on the resist film with a protective film composition after forming the resist film and before exposing the resist film, (c) exposing the resist film via an immersion medium, and (d) performing development with a negative developer.

Abstract: The present invention is a substrate treatment apparatus for performing solution treatment on a substrate, performing post-treatment in a treatment module subsequent to the solution treatment, including: a solution treatment section including a plurality of nozzles prepared for respective kinds of treatment solutions corresponding to lots of substrates; a transfer mechanism for transferring the substrate; a monitoring section monitoring whether there is a failure in discharge of the treatment solution in the nozzle; and a control unit outputting a control signal to prohibit the solution treatment in the solution treatment section for a substrate scheduled to be treated using a nozzle determined to have a failure by the monitoring section and to perform the solution treatment in the solution treatment section for a substrate scheduled to be treated using a nozzle other than the nozzle determined to have a failure.

Abstract: In one embodiment, a coating and developing apparatus is provided with transfer units, provided between a stack of early-stage processing unit blocks and a stack of later-stage processing unit blocks to transfer a substrate between the transport mechanisms of laterally-adjacent unit blocks, and a vertically-movable auxiliary transfer mechanism for transporting a substrate between the transfer units. A stack of first developing unit blocks is stacked on the stack of early-stage processing unit blocks, and a stack of second developing unit blocks is stacked on the stack of later-stage processing unit blocks.

Abstract: A conductive pattern formation method of the present invention includes a first exposure step of radiating active light in a patterned manner to a photosensitive layer including a photosensitive resin layer provided on a substrate and a conductive film provided on a surface of the photosensitive resin layer on a side opposite to the substrate; a second exposure step of radiating active light, in the presence of oxygen, to some or all of the portions of the photosensitive layer not exposed at least in the first exposure step; and a development step of developing the photosensitive layer to form a conductive pattern following the second exposure step.

Abstract: The present disclosure provides an apparatus for fabricating a semiconductor device. The apparatus includes a lithography tool. The lithography tool includes: a first nozzle configured to dispense a developer solution to a wafer; a second nozzle configured to dispense a cleaning solution to the first nozzle; and a controller configured to operate the second nozzle according to a predefined program. The present disclosure also provides a method of fabricating a semiconductor device. The method includes performing a developing process, wherein the performing the developing process includes dispensing a developer solution on a wafer using a first nozzle. The method also includes cleaning the first nozzle with a second nozzle, wherein the cleaning the first nozzle is executed according to one of a plurality of program recipes that each specify a sequence and a duration for which the first nozzle and the second nozzle are to be selectively activated.

Abstract: A method of forming patterns includes (a) coating a substrate with a resist composition for negative development to form a resist film having a receding contact angle of 70 degrees or above with respect to water, wherein the resist composition for negative development contains a resin capable of increasing the polarity by the action of an acid and becomes more soluble in a positive developer and less soluble in a negative developer upon irradiation with an actinic ray or radiation, (b) exposing the resist film via an immersion medium, and (c) performing development with a negative developer.

Abstract: The present invention provides a resist coating and developing apparatus, a resist coating and developing method, a resist-film processing apparatus, and a resist-film processing method, capable of reducing a line width roughness by planarizing a resist pattern. The resist coating and developing apparatus comprises: a resist-film forming part configured to coat a resist onto a substrate to form a resist film thereon; a resist developing part configured to develop the exposed resist film to obtain a patterned resist film; and a solvent-gas supply part configured to expose the resist film, which has been developed and patterned by the resist developing part, to a first solvent of a gaseous atmosphere having a solubility to the resist film. A solvent supply part supplies, to the resist film which has been exposed to the first solvent, a second solvent in a liquid state having a solubility to the resist film.

Abstract: In the present invention, photolithography processing is performed on a substrate to form a resist pattern over the substrate, and a treatment agent is caused to enter a side surface of the resist pattern and metal is caused to infiltrate the side surface of the resist pattern via the treatment agent, the formed resist pattern has a high etching selection ratio with respect to a film to be treated on the substrate so as to suppress a so-called pattern collapse, therefore.

Abstract: The present invention includes: a resist film forming step of forming a resist film over a substrate; an exposure step of exposing the resist film into a predetermined pattern; a metal treatment step of causing a treatment agent to enter an exposed portion exposed in the exposure step of the resist film and causing metal to infiltrate the exposed portion via the treatment agent; and a resist film removing step of removing an unexposed portion not exposed in the exposure step of the resist film to form a resist pattern over the substrate.

Abstract: In order to determine whether an exposure apparatus is outputting the correct dose of radiation and its projection system is focusing the radiation correctly, a test pattern is used on a mask for printing a specific marker onto a substrate. This marker is then measured by an inspection apparatus, such as a scatterometer, to determine whether there are errors in focus and dose and other related properties. The test pattern is configured such that changes in focus and dose may be easily determined by measuring the properties of a pattern that is exposed using the mask. The test pattern may be a 2D pattern where physical or geometric properties, e.g., pitch, are different in each of the two dimensions. The test pattern may also be a one-dimensional pattern made up of an array of structures in one dimension, the structures being made up of at least one substructure, the substructures reacting differently to focus and dose and giving rise to an exposed pattern from which focus and dose may be determined.

Abstract: In one embodiment, a coating and developing apparatus is provided with transfer units, provided between a stack of early-stage processing unit blocks and a stack of later-stage processing unit blocks to transfer a substrate between the transport mechanisms of laterally-adjacent unit blocks, and a vertically-movable auxiliary transfer mechanism for transporting a substrate between the transfer units. A stack of first developing unit blocks is stacked on the stack of early-stage processing unit blocks, and a stack of second developing unit blocks is stacked on the stack of later-stage processing unit blocks.

Abstract: A multi-spectrum screen exposure system for curing printing emulsions, including an enclosure with a platen that is transmissive to at least some ultraviolet wavelengths of light, a cover shiftable between an open orientation wherein the platen is accessible to an operator and a closed orientation wherein the platen is covered and inaccessible to the operator, a light emitting diode illumination (LED) light source assembly supported within the enclosure and oriented to direct illumination toward the platen, the light emitting diode illumination light source assembly emitting at least some light in the ultraviolet wavelengths, and a control unit operably coupled to the light emitting diode illumination light source assembly by which the light emitting diode illumination light source assembly can be operated in a controlled fashion.

Abstract: There is provided an illumination optical system for illuminating an illumination objective surface. The illumination optical system includes a first spatial light modulator which has a plurality of optical elements arranged on a first plane, a polarizing member which is arranged in an optical path on an illumination objective surface side with respect to the first plane and which gives a polarization state change to a first light beam passes through a first area in a plane intersecting an optical axis of the illumination optical system, the polarization state change being different from a polarization state change given to a second light beam passes through a second area in the intersecting plane, and a second spatial light modulator which has a plurality of optical elements controlled individually and arranged on a second plane, and which variably forms a light intensity distribution on an illumination pupil of the illumination optical system.

Abstract: Disclosed is an apparatus and method for yield enhancement of making a semiconductor device. The apparatus for yield enhancement of making a semiconductor device comprises: a semiconductor device comprising an epitaxial layer in which a defect is included, and a photo-resistor on the epitaxial layer and covering the defect; an image recognition system to detect and identify a location of the defect; and an exposing module comprising a first light source to expose a part of the photo-resistor substantially corresponding to the detected defect identified by the image recognition system.

Abstract: Apparatus for processing substrates according to a predetermined photolithography process includes a loading station in which the substrates are loaded, a coating station in which the substrates are coated with a photoresist material, an exposing station in which the photoresist coating is exposed to light through a mask having a predetermined pattern to produce a latent image of the mask on the photoresist coating, a developing station in which the latent image is developed, an unloading station in which the substrates are unloaded and a monitoring station for monitoring the substrates with respect to predetermined parameters of said photolithography process before reaching the unloading station.

Abstract: A system and method of manufacturing a semiconductor device lithographically and an article of manufacture involving a lithographic double patterning process having a dye added to either the first or second lithographic pattern are provided. The dye is used to detect the location of the first lithographic pattern and to directly align the second lithographic pattern to it. The dye may be fluorescent, luminescent, absorbent, or reflective at a specified wavelength or a given wavelength band. The wavelength may correspond to the wavelength of an alignment beam. The dye allows for detection of the first lithographic pattern even when it is over coated with a radiation sensitive-layer (e.g., resist).

Abstract: Provided is a method of a substrate treatment. The method includes providing an operation module with substrates contained in a lot and performing an operation treatment thereon and performing a test treatment on the substrates completed with the operation treatment in a test module. The performing of the test treatment includes determining a substrate to be tested, which is provided to the test module, to allow the test treatment to be completed within an operation treatment time for the substrates in a unit lot.

Abstract: A coating and developing apparatus includes a processing block having at least one coating film-forming unit block stack and a vertically stacked developing unit block stack. Each unit block stack includes vertically stacked unit blocks, and each unit block includes processing modules containing liquid processing modules and heating modules. Each unit block includes a transport mechanism moveable along a transport passage from a carrier block side to an interface block side, to transport a substrate between the processing modules belonging to the unit block. Transfer units are provided on the carrier block sides of the coating film-forming unit blocks and the developing unit blocks respectively, for transferring a substrate to and from the transport mechanism of the associated coating film-forming or developing unit blocks. A first transfer mechanism transfers a substrate removed from a carrier to one of the transfer units associated with the coating film-forming unit blocks.

Abstract: A method includes receiving a substrate having a material feature embedded in the substrate, wherein receiving the substrate includes receiving a first leveling data and a first overlay data generated when forming the material feature, deposing a resist film on the substrate, and exposing the resist film using a predicted overlay correction data to form a resist pattern overlying the material feature on the substrate, wherein using the predicted overlay correction data includes generating a second leveling data and calculating the predicted overlay correction data using the first leveling data, the first overlay data, and the second leveling data.

Abstract: A processing apparatus configured to conduct a prescribed processing on an object to be processed in a specific environment, the processing apparatus comprising: a chamber configured to have an aperture and an interior accommodated to a specific environment; a mechanism of which at least a portion is contained within the chamber interior, while a remaining portion passes through the aperture without contacting the chamber; at least one support member configured to support the mechanism; a sealing member that configures a boundary of the specific environment and an atmospheric environment by connecting one end to the aperture and connecting the other end to the support member; and a rotary member configured to allow relative rotation around a vertical axis between the support member and a structure that supports the support member.

Abstract: The present invention is a developing treatment apparatus for performing development by supplying a developing solution to a substrate having a front surface coated with a positive resist or a negative resist and then subjected to exposure wherein a movable cup is raised to introduce one of scattering developing solutions for the positive and negative resists into an inner peripheral flow path of a cup and the movable cup is lowered to introduce the other of scattering developing solutions for the positive and negative resists into an outer peripheral flow path of the cup, and the developing solution introduced into the inner peripheral flow path and the developing solution introduced into the outer peripheral flow path are separately drained.

Abstract: The present disclosure involves a method of fabricating a semiconductor device. The method includes providing a substrate having a material layer formed thereon; depositing a photoresist layer on the material layer, the photoresist layer having a vertical dimension; exposing a region of the photoresist layer to radiation, the exposed region having a horizontal dimension, wherein a first ratio of the vertical dimension to the horizontal dimension exceeds a predetermined ratio; and developing the photoresist layer to remove the exposed region at least in part through applying a developer solution containing a first chemical and a second chemical, wherein: the first chemical is configured to dissolve the exposed region of the photoresist layer through a chemical reaction; the second chemical is configured to enhance flow of the first chemical that comes into contact with the photoresist layer; and an optimized second ratio exists between the first chemical and the second chemical.

Abstract: An apparatus measures properties, such as overlay error, of a substrate divided into a plurality of fields. The apparatus includes a radiation source configured to direct radiation onto a first target of each field of the substrate. Each first target (T4G) has at least a first grating and a second grating having respective predetermined offsets, the predetermined offset (+d) of the first grating being in a direction opposite the predetermined offset (?d) of the second grating. A detector is configured to detect the radiation reflected from each first target and to obtain an asymmetry value for each first target from the detected radiation.

Abstract: A developing apparatus comprises: a photodetection unit, which emits detecting light toward the development area of the substrate to be developed within a scheduled time after the substrate to be developed is immersed into the developer solution; and a processing unit electrically coupled with the photodetection unit for determining the time interval which it takes for development to occur in the development area by means of the detecting light, and for determining that the developer solution is failed if the development time interval is determined to be out of the preset time range. A method for monitoring the developer solution is also provided.

Abstract: An underlayer is formed to cover the upper surface of a substrate and a guide pattern is formed on the underlayer. A DSA film constituted by two types of polymers is formed in a region on the underlayer where the guide pattern is not formed. Thermal processing is performed while a solvent is supplied to the DSA film on the substrate. Thus, a microphase separation of the DSA film occurs. As a result, patterns made of the one polymer and patterns made of another polymer are formed. Exposure processing and development processing are performed in this order on the DSA film after the microphase separation such that the patterns made of another polymer are removed.

Abstract: A coating and developing apparatus includes a processing block having at least one coating film-forming unit block stack and a vertically stacked developing unit block stack. Each unit block stack includes vertically stacked unit blocks, and each unit block includes processing modules containing liquid processing modules and heating modules. Each unit block includes a transport mechanism moveable along a transport passage from a carrier block side to an interface block side, to transport a substrate between the processing modules belonging to the unit block. Transfer units are provided on the carrier block sides of the coating film-forming unit blocks and the developing unit blocks respectively, for transferring a substrate to and from the transport mechanism of the associated coating film-forming or developing unit blocks. A first transfer mechanism transfers a substrate removed from a carrier to one of the transfer units associated with the coating film-forming unit blocks.

Abstract: A liquid immersion lithography apparatus and method exposes a substrate with light via a projection system and a liquid. A table assembly has a top surface and is movable relative to the projection system while supporting the substrate. The table assembly top surface has a first opening portion, and a top surface of a sensor is arranged inside of the first opening portion. The sensor top surface is positionable opposite the projection system by the table assembly such that a gap, in which the liquid can be maintained, is formed between the projection system and the sensor top surface. The table assembly and sensor top surfaces are apposed on a substantially same plane, or are substantially co-planar.

Abstract: A position measuring apparatus configured to measure a position of an measured object using a plate-like scale including a grating pattern, includes a supporting unit configured to be arranged between a structure and the scale and to support the scale, in which the supporting unit includes a spring element that reduces vibration transferred from the structure to the scale in a plate thickness direction.

Abstract: The present invention provides a method and apparatus for forming a printing form from a photosensitive element to form a relief pattern. The method and apparatus thermally develop the photosensitive element by heating a composition layer of the element to cause a portion of the layer to liquefy and providing a development medium to the element to remove the liquefied composition. A conformable layer is disposed between the photosensitive element and a base support, which improves the compressibility and the contact between the photosensitive element and the development medium. The method and apparatus improve the efficiency of the removal of liquefied portions from the photosensitive element and the uniformity of the relief pattern formed.

Abstract: In an entire region exposure unit, a platform section and a local transfer mechanism are arranged in one direction. The local transfer mechanism is provided with a local transfer hand. A substrate on which a resist film having a predetermined pattern is formed is held by the local transfer hand. A light-emitting device is attached to the upper portion of the local transfer mechanism. Strip-shaped light is emitted from the light-emitting device toward below. The local transfer mechanism operates such that the local transfer hand is moved relative to the light-emitting device. At this time, the light-emitting device irradiates one surface of the substrate that is moving horizontally with the strip-shaped light. The resist film is modified by the light.

Abstract: A method for producing flexographic printing plates, using a photopolymerizable flexographic printing element having, arranged one atop another, a dimensionally stable support, a photopolymerizable, relief-forming layer, an elastomeric binder, an ethylenically unsaturated compound, and a photoinitiator, and optionally a rough, UV-transparent layer, a particulate substance, and digitally imagable layer. The method includes: (a) producing a mask by imaging the digitally imagable layer, (b) exposing the photopolymerizable, relief-forming layer through the mask with actinic light, and photopolymerizing the image regions of the layer, and (c) developing the photpolymerized layer by washing out the unphotopolymerized regions of the relief-forming layer with an organic solvent, or by thermal development.

Abstract: A coating and developing apparatus includes a processing block having at least one coating film-forming unit block stack and a vertically stacked developing unit block stack. Each unit block stack includes vertically stacked unit blocks, and each unit block includes processing modules containing liquid processing modules and heating modules. Each unit block includes a transport mechanism moveable along a transport passage from a carrier block side to an interface block side, to transport a substrate between the processing modules belonging to the unit block. Transfer units are provided on the carrier block sides of the coating film-forming unit blocks and the developing unit blocks respectively, for transferring a substrate to and from the transport mechanism of the associated coating film-forming or developing unit blocks. A first transfer mechanism transfers a substrate removed from a carrier to one of the transfer units associated with the coating film-forming unit blocks.

Abstract: A method of developing a substrate including rotating the substrate and supplying a developing liquid from a discharge port of a developer nozzle onto the surface of the substrate, while moving the developer nozzle, disposed above the substrate, from a central portion towards a peripheral portion of the substrate, and supplying a first rinse liquid from a discharge port of a first rinse nozzle onto the surface of the substrate, while moving the first rinse nozzle, disposed above the substrate, from the central portion towards the peripheral portion of the substrate. The supplying of the developing liquid and the first rinse liquid are performed concurrently, with the first rinse nozzle being maintained nearer to a center of the substrate than the developer nozzle.

Abstract: The present invention provides a resist coating and developing apparatus, a resist coating and developing method, a resist-film processing apparatus, and a resist-film processing method, capable of reducing a line width roughness by planarizing a resist pattern. The resist coating and developing apparatus comprises: a resist-film forming part configured to coat a resist onto a substrate to form a resist film thereon; a resist developing part configured to develop the exposed resist film to obtain a patterned resist film; and a solvent-gas supply part configured to expose the resist film, which has been developed and patterned by the resist developing part, to a first solvent of a gaseous atmosphere having a solubility to the resist film. A solvent supply part supplies, to the resist film which has been exposed to the first solvent, a second solvent in a liquid state having a solubility to the resist film.

Abstract: A system for determining at least two properties of a substrate, including a supporting plate configured to support the substrate, and a measurement device coupled to the supporting plate, including an illumination system configured to direct light toward a surface of the substrate, and a detection system coupled to the illumination system and configured to detect light propagating from the surface of the substrate, wherein the measurement device is configured to generate one or more output signals in response to the detected light, and a control unit coupled to the measurement device and configured to determine a first property and a second property of the substrate from the one or more output signals, wherein the first property comprises a presence of macro defects on the substrate, and wherein the second property comprises overlay misregistration in the substrate.

Abstract: An edge exposure unit includes a projector, a projector holding unit, a substrate rotating unit, an outer edge detecting unit and a surface inspection processing unit. Each component of the projector holding unit operates to move the projector in an X direction and a Y direction. The projector irradiates a peripheral portion of a substrate with light transmitted from a light source for exposure through a light guide. Edge sampling processing is performed based on distribution of an amount of light received in a CCD line sensor of the outer edge detecting unit. Surface inspection processing is performed based on distribution of an amount of light received in a CCD line sensor of the surface inspection processing unit.

Abstract: A method for forming a pattern on a substrate is described. The method includes providing a substrate, forming a photosensitive layer over the substrate, exposing the photosensitive layer to a first exposure energy through a first mask, exposing the photosensitive layer to a second exposure energy through a second mask, baking the photosensitive layer, and developing the exposed photosensitive layer. The photosensitive layer includes a polymer that turns soluble to a developer solution, at least one photo-acid generator (PAG), and at least one photo-base generator (PBG). A portion of the layer exposed to the second exposure energy overlaps with a portion exposed to the first exposure energy.