Abstract: A method for manufacturing a semiconductor device is provided. The method includes providing a first layout including a plurality of first features and a second layout including a plurality of second features; shifting the second layout to generate a plurality of virtual layouts; comparing a score of each of the plurality of virtual layouts and determining a modified second layout having a target score out of the plurality of virtual layouts; and outputting the modified second layout to a photomask.

Abstract: The invention provides a vibration isolation system (IS), comprising a piston (402) to carry a payload, a connecting member (410), a spring (404) and a flexible member (408). The spring is arranged to support the piston along a direction with a positive stiffness. The flexible member is arranged to apply a force to the piston along the direction via the connecting member with a negative stiffness.

Abstract: A lithography method to pattern a first semiconductor wafer is disclosed. An optical mask is positioned over the first semiconductor wafer. A first region of the first semiconductor wafer is patterned by directing light from a light source through transparent regions of the optical mask. A second region of the first semiconductor wafer is patterned by directing energy from an energy source to the second region, wherein the patterning of the second region comprises direct-beam writing.

Abstract: A changing system for a microscope includes multiple afocal enlargement changing modules of different enlargement levels that are optionally introducible into an infinite beam path running along an optical axis of the microscope. Each of the enlargement changing modules contain a light deflection system. The light deflection systems are designed to adjust the path length of the infinite beam path passing through the respective enlargement changing module in such a way that all of the enlargement changing modules, regardless of the different enlargement levels of the enlargement changing modules, map an exit pupil of a lens of the microscope onto the same location along the optical axis.

Abstract: Disclosed is a method of determining a characteristic of interest, in particular focus, relating to a structure on a substrate formed by a lithographic process, and an associated patterning device and lithographic system. The method comprises forming a modified substrate feature on the substrate using a corresponding modified reticle feature on a patterning device, the modified substrate feature being formed for a primary function other than metrology, more specifically for providing a support for a vertically integrated structure. The modified reticle feature is such that said modified substrate feature is formed with a geometry dependent on the characteristic of interest during formation. The modified substrate feature can be measured to determine said characteristic of interest.

Abstract: A method for controlling a test apparatus, the test apparatus including a test unit in which testers are arranged in columns and rows, each tester configured to test a substrate; aligners each configured to cause the substrate to be contacted with respect to a given tester from among the testers, at least one aligner provided in each row; and a controller configured to control the aligners. The method includes constraining, by the controller, operation of at least a second aligner, while alignment is performed through a first aligner from among the aligners.

Abstract: In an optical system for a projection exposure apparatus, the angle space of the illumination radiation of the projection optical unit at the reticle is twice as large in a first direction as the angle space of the illuminating radiation of the illuminating optical unit.

Abstract: An edge exposure tool may include a lens adjustment device that is capable of automatically adjusting various parameters of an edge exposure lens to account for changes in operating parameters of the edge exposure tool. In some implementations, the edge exposure tool may also include a controller that is capable of determining edge adjustment parameters for the edge exposure lens and exposure control parameters for the edge exposure tool using techniques such as big data mining, machine learning, and neural network processing. The lens adjustment device and the controller are capable of reducing and/or preventing the performance of the edge exposure tool from drifting out of tolerance, which may maintain the operation performance of the edge exposure tool and reduce the likelihood of wafer scratching, and may reduce the down-time of the edge exposure tool that would otherwise be caused by cleaning and calibration of the edge exposure lens.

Abstract: A method for correcting a mask pattern includes: providing an original mask pattern including at least one dense pattern area and at least one isolated pattern area, and the original mask pattern being divided into a first pattern and a second pattern, wherein the first pattern is formed in the isolated pattern area and extends to the dense pattern area, and the second pattern is formed in the dense pattern area; forming at least one slot on at least one section of the first pattern, and the at least one section of the first pattern is located on at least one transition area between the at least one isolated pattern area and the at least one dense pattern area; and performing an optical proximity correction operation on the first pattern formed with at least one slot and the second pattern. Using the corrected mask pattern may avoid the occurrence of necking or breaking on portion of the post-transfer pattern.

Abstract: An immersion lithography apparatus controller configured to control a positioner to move a support table to follow an exposure route and to control a liquid confinement structure, the controller configured to: predict whether liquid will be lost from an immersion space during at least one motion of the route in which an edge of the object passes under an edge of the immersion space, and if liquid loss from the immersion space is predicted, modify the fluid flow such that a first fluid flow rate into or out of an opening at a leading edge of the liquid confinement structure is different to a second fluid flow rate into or out of an opening at a trailing edge of the liquid confinement structure during the motion of predicted liquid loss or a motion of the route subsequent to the motion of predicted liquid loss.

Abstract: A method for temperature control of a component that is transferable between a first system and a second system includes: ascertaining a temperature drift of a temperature of the component that is to be expected after transfer of the component from the first system into the second system; and modifying a temperature prevailing in the first system and/or a temperature prevailing in the second system such that the temperature drift that is actually occurring after transfer of the component from the first system into the second system is reduced with respect to the expected temperature drift.

Abstract: A method of configuring a step of scanning a beam of photons or particles across a patterning device for exposing a pattern onto a substrate, wherein the method includes determining a spatial resolution of a patterning correction configured to improve quality of the exposing, and determining a spatial dimension of the beam based on the determined spatial resolution of the patterning correction.

Abstract: An optical arrangement of an imaging device for microlithography, particularly for using light in the extreme UV range, includes an optical element and a holding device for holding the optical element. The optical element includes an optical surface and defines a plane of main extension, in which the optical element defines a radial direction and a circumferential direction. The holding device includes a base element and more than three separate holding units. The holding units are connected to the base element and arranged in a manner distributed along the circumferential direction and spaced apart from one another. The holding units hold the optical element with respect to the base element. Each of the holding units establishes a clamping connection between the optical element and the base element. The clamping connection for each holding unit is separate from the clamping connections of the other holding units.

Abstract: An apparatus, a system, and a method for detecting water supply based on a vision sensor by performing big data, an artificial intelligence (AI) algorithm, and/or a machine learning algorithm in a 5G environment connected for the Internet of things is provided. The apparatus for detecting water may be used for a washing machine and includes a vision sensor mounted on a tub or in the vicinity of the tub, directed toward at least one water supply region of interest in the tub, and configured to acquire an image of the water supply region of interest, and a water supply level determiner configured to detect a water supply level through a vision algorithm based on the image information acquired by the vision sensor. The determiner may predict water supply time to the point in time at which the water supply will be completed based on models trained by machine learning.

Abstract: A method for cleaning a reflective photomask is provided. The method includes: disposing the reflective photomask in a chamber; providing hydrogen radicals to the chamber; and exposing the reflective photomask to the hydrogen radicals. A method of manufacturing a semiconductor structure and system for forming a semiconductor structure are also provided.

Abstract: A device may determine at least one metric related to a plurality of laser pulses associated with a Q-switched laser. The device may determine a statistical metric for the at least one metric related to the plurality of laser pulses. The device may determine that the statistical metric satisfies a threshold level of deviation of the at least one metric related to the plurality of laser pulses from a baseline value for the at least one metric. The device may indicate laser degradation of the Q-switched laser based on determining that the statistical metric satisfies the threshold.

Abstract: An immersion lithography apparatus is disclosed in which liquid is supplied to a space between a projection system and a substrate, and a plate structure is provided to divide the space into two parts. The plate structure has an aperture to allow transmission of the projection beam, has through holes in it to reduce the damping effect of the presence of the plate and optionally has one or more inlets and outlets to provide various flows around the aperture in the plate. An embodiment of the invention may reduce the transportation of contaminants, stray light, temperature gradients, and/or the effect of bubbles on the imaging quality.

Abstract: A membrane for EUV lithography, the membrane having a thickness of no more than 200 nm and including a stack having: at least one silicon layer; and at least one silicon compound layer made of a compound of silicon and an element selected from the group consisting of boron, phosphorous, bromine.

Abstract: An apparatus for transferring a wafer includes a main body, a first support installed in the main body, a sensor support fixed to the first support, a finger member slidably installed along the first support to transfer the wafer and positioned at a lower level than the sensor support, three sensors each including a light emitter installed on the first support and a light receiver installed on the sensor support, the three sensors respectively configured to detect three points of an edge of the wafer seated on the finger member, and a controller connected to the three sensors, wherein the controller is configured to determine whether any of the three points of the edge of the wafer is detected from a notch of the wafer based on signals received from the sensors.

Abstract: Embodiments and implementations of the present disclosure provide assistant pattern configuration methods, masks and forming methods thereof, and related devices.

Abstract: A carrying device and, a fixing method of a carrying device are provided. The carrying device includes a body and an electromagnet fixing module disposed on the body; wherein the electromagnet fixing module is configured to fix the carrying device. The present application uses the electromagnet fixing module to fix the carrying device, which can avoid downtime of an exposure machine caused by shaking of the carrying device when a robot arm of the exposure machine picks or places the mask form the carrying device so as to improve throughput.

Abstract: A localization microscope including an imaging device emitting sample light from a focal plane into an image plane, including an optical-manipulation device for depth-dependent influencing of a point-spread function of the imaging and influencing the point-spread function of the imaging such that a point emitter is imaged in the image plane into an image that is rotationally asymmetrically distorted. A form of the distortion depends on the location of the point emitter with respect to the focal plane and a wavelength of the sample light. The optical manipulation device includes first and second anisotropy elements that anisotropically influence the point spread function to produce rotational asymmetry of the point emitter image. The elements are arranged one behind the other in the imaging direction, with anisotropy axes at an angle to one another. Both elements have differing neutral wavelength at which they do not anisotropically influence the point spread.

Abstract: A microlithographic arrangement, for example using light in the extreme UV range, includes a supporting structure for supporting an optical unit, the mass of which can be 4 t to 14 t. The supporting structure includes a number of separate supporting units for supporting the optical unit. Each of the supporting units includes an air bearing unit by way of which a supporting force which counteracts the weight of the optical unit can be generated. The number of supporting units is at least four, at least two of the supporting units being coupled via a coupling device to form a supporting unit pair in such a way that the coupling device counteracts a deviation from a predeterminable ratio of the supporting forces of the two supporting units of the supporting unit pair.

Abstract: A system includes a plurality of masks and a scanner device. A pattern of a semiconductor device is defined by each of the plurality of masks in a photolithography process. A first mask of the plurality of masks includes a first identification code configured to distinguish the first mask from remaining masks of the plurality of masks. The scanner device is configured to read the first identification code to select the first mask from the plurality of mask, in order to form the pattern of the semiconductor device on a substrate according to the first mask.

Abstract: A semiconductor wafer includes chip regions; and a scribe region provided between the chip regions, the scribe region extending in a first direction in a plan view, wherein the scribe region includes a first region extending in the first direction, second regions situated on respective sides of the first region in a second direction perpendicular to the first direction in a plan view, each of the two second regions extending in the first direction, and an electrode pad provided in at least the second regions, and each of the two second regions includes one or more trench vias that are wall-shaped, the one or more trench vias extending in the first direction, and at least one trench via of the one or more trench vias having a portion overlapping with the electrode pad in a plan view.

Abstract: An optical system such as an imaging system, projecting system or combined imaging and projecting system, has complex dielectric coatings and/or reflecting polarizers to separate multiple spectral bands and/or polarizations on one or more of the system's curved mirrors.

Abstract: A lithographic apparatus is disclosed that includes a substrate table configured to support a substrate on a substrate supporting area and a heater and/or temperature sensor on a surface adjacent the substrate supporting area.

Abstract: An apparatus includes: a sprinkler configured for spraying liquid; a conduit with a nano-particle coated surface; a sensor associated with the conduit, wherein the sensor is configured to detect a signal corresponding to a film deposition on the nano-particle coated surface; and a controller coupled with the sensor and the sprinkler, wherein the controller is configured to regulate liquid spraying of the sprinkler over the nano-particle coated surface.

Abstract: A measurement system to be used in a micro-device manufacturing line is equipped with: a plurality of measurement devices which performs measurement processing on each substrate; and a controller that can control the plurality of measurement devices, and the plurality of measurement devices includes at least one first measurement device which acquires position information of a plurality of marks formed on a substrate.

Abstract: Techniques that can assist with fabricating a semiconductor package that includes a zero misalignment-via (ZMV) and/or a trace formed using a polarization process are described. The disclosed techniques can result in creation of ZMVs and/or traces between the ZMVs using a process comprising application of polarized light to one or more resist layers (e.g., a photoresist layer, etc.). One embodiment of a technique includes modulating an intensity of light applied to one or more resist layers by interaction of a light source with a photomask and at least one polarizer such that one or more patterns are created on the one or more resist layers. One embodiment of another technique includes creating patterns on one or more resist layers with different types of polarized light formed from a photomask and at least one polarizer. The disclosed techniques can assist with reducing manufacturing costs, reducing development time, and increasing I/O density.

Abstract: A system for generating pump illumination for laser sustained plasma (LSP) is disclosed. In embodiments, the system includes an illumination source and a beam shaper. The illumination source can be configured to output illumination having a first pupil power distribution. In embodiments, the beam shaper is configured to receive the illumination having the first pupil power distribution from the illumination source and is further configured to output pump illumination having a second pupil power distribution that is different from the first pupil power distribution.

Abstract: A method for removing particles from a semiconductor process chamber including at least the following steps is provided. Electrical charges having a first polarity are accumulated on a receiving surface of the substrate holder by applying a voltage to the substrate holder. The particles having a second polarity in the semiconductor process chamber are attracted to move toward the receiving surface of the substrate holder on which the electrical charges having the first polarity are accumulated, where the first polarity is opposite to the second polarity. The particles having the second polarity are removed from the semiconductor process chamber. Other methods for removing particles from a semiconductor process chamber are also provided.

Abstract: An optical scanning system, including: a radiating source that outputs a light beam, a first time varying beam reflector that reflects the light beam through a scan lens towards a transparent sample, a second time varying beam reflector that reflects the light beam reflected from the transparent sample, a focusing lens that focuses the light beam reflected from the transparent sample, a blocker, and a detector that is irradiated by the one or more selectable portions of the light beam reflected from the transparent sample that pass the blocker. The blocker can be configured to block one or more portions of the light beam reflected from the transparent sample so that one or more selectable portions of the light beam reflected from the transparent sample can pass the blocker.

Abstract: The invention relates to a lithographic apparatus comprising: an actuation system for positioning an object; a control unit (CU) for controlling the actuation system; and a cooling system for cooling the actuation system, wherein the actuation system comprises a coil assembly (CA) including one or more coils (CO) as force generating members, wherein the cooling system comprises cooling element (CE) interacting with the coil assembly for cooling the coil assembly, and wherein the control unit is configured to control a temperature of the one or more coils to keep a magnitude of cyclic stress below a predetermined value.

Abstract: A lithography apparatus includes a formation unit that forms an alignment mark on a substrate by irradiating the substrate that includes a photosensitizer with light, and a transfer unit that aligns the substrate on the basis of the position of the alignment mark and that transfers a pattern to the substrate by illuminating the photosensitizer with exposure light. The formation unit irradiates a material of a grounding of the photosensitizer with irradiation light at a wavelength that differs from that of the exposure light and forms the alignment mark on the material by processing the material with energy of the irradiation light.

Abstract: A method for obtaining one or more images of a sample using a microscope includes dividing, using a reverberation cavity, a first one of a plurality of laser pulses into a plurality of sequential sub-pulses, each of the plurality of sequential sub-pulses having a power that is less than a previous one of the plurality of sequential sub-pulses, directing, using the one or more lenses of the microscope, the plurality of sequential sub-pulses onto a portion of the sample to generate a plurality of signals, each of the plurality of signals being associated with a different depth within the sample, and detecting the plurality of signals from the sample to generate one or more images of at least a portion of the sample.

Abstract: The present disclosure provides a mask for photolithography patterning. The mask includes a substrate, a pattern layer on a surface of the substrate. The mask also includes a pellicle attached to the substrate and configured to isolate the pattern layer from ambient. The pellicle includes a membrane between the pattern layer and ambient, a frame for securing the membrane on the substrate, and an optical member disposed in the membrane. A method for manufacturing the mask is also provided.

Abstract: A method of metrology target design is described. The method includes determining a sensitivity of a parameter of a metrology target design to a perturbation of a process parameter for forming, or measuring the formation of, the metrology target, and determining a robustness of the metrology target design based on the sum of the sensitivity multiplied by the perturbation of at least one of the process parameters.

Abstract: A substrate table for an immersion lithographic apparatus is disclosed having a recess, configured to receive a substrate of a given size, and a fluid extraction system, configured to extract fluid from a gap between the edge of the substrate and the edge of the recess, the fluid extraction system configured such that the rate of flow of fluid extracted from a localized section of the gap is greater than the rate of flow of fluid extracted from another section of the gap.

Abstract: A sensor is fixed on an aircraft structure by a joining system which includes at least one enclosure in which is positioned at least one transducer, at least one passage configured to allow at least one conducting element to pass through the enclosure, at least one flexible connection connecting each transducer present in the enclosure to said enclosure and at least one binder joining together the enclosure and the structure. This joining system makes it possible to limit the spread of the deformations of the structure toward the transducer or transducers and ultimately the risks of malfunction.

Abstract: A second stage is disposed on the first stage. The second stage provides six degrees of freedom. A chuck that holds a workpiece is disposed on the second stage. Actuators that enable movement in three directions are disposed on the second stage. The first stage and the second stage move independent of each other during inspection of the workpiece on the chuck.

Abstract: A method includes supporting a wafer on a heating element, wherein the heating element is located in a baking chamber. The method further includes heating the wafer for a first duration using the heating element. The method further includes measuring a temperature of the heating element and a temperature of the wafer during the first duration to obtain temperature information. The method further includes adjusting an amount of heat provided by the heating element during the first duration, wherein the adjusting of the amount of heat includes decreasing the amount of heat provided by the heating element as a rate of change of the temperature information versus time increases.

Abstract: The present invention discloses a wireless and self-contained headset that delivers an electronic signal to a precise and self-locating position within bilateral conchae in both ears of a human user. The headset comprises an electronics housing that carries a specific waveform source. The waveform source generates the electronic signal, which is delivered simultaneously to both left and right ears of the human user. An array of silver electrodes housed within the bilateral earpieces cover with precision the location at the exact center of the relatively smooth plane of the conchae directly behind the external auditory meatus (ear opening/canal).

Abstract: The present invention provides an exposure apparatus including a forming unit configured to form a mark on a resist film on a substrate, and a control unit configured to perform an exposure process to form a latent image by projecting a pattern onto a target position on the resist film on the substrate based on a measured position of the mark, wherein the control unit causes the forming unit to perform a formation process of forming, before the exposure process is performed on a reworked substrate on which a second resist film has been formed after removing a first resist film with a first mark, a second mark on the second resist film so the second mark will be positioned at a position shifted from a position of the first mark on the reworked substrate.

Abstract: A substrate holder for use in a lithographic apparatus and configured to support a substrate, the substrate holder including a main body having a main body surface, a plurality of main burls projecting from the main body surface, wherein each main burl has a distal end surface configured to support the substrate, a first seal member projecting from the main body surface and having an upper surface, the first seal member surrounding the plurality of main burls and configured to restrict the passage of liquid between the substrate and the main body surface radially inward past the first seal member; and a plurality of minor burls projecting from the upper surface of the first seal member, wherein each minor burl has a distal end surface configured to support the substrate.

Abstract: A light source device includes a plurality of light sources configured to output a plurality of laser beams of different color components; and circuitry. A ratio in maximum output power between the plurality of laser beams output from the plurality of light sources is variable.

Abstract: The present disclosure provides an apparatus for fabricating a semiconductor structure, including an air flow redistribution member configured to receive an air flow at a first end and eject the air flow at a second end. The air flow redistribution member includes a first air flow redistribution plate and a second air flow redistribution plate between the first air flow redistribution plate and the second end.

Abstract: Disclosed herein is a processing apparatus including a processing unit, alignment unit, and controller. The controller includes a reference program storing section previously storing a reference program for use in processing a predetermined workpiece, a reference result recording section for rating the result of processing performed to the predetermined workpiece by the processing unit according to the reference program and then recording a resultant rating point as a processing reference result, and an actual result calculating section for rating the result of processing performed to substantially the same workpiece as the predetermined workpiece by the processing unit according to the reference program.

Abstract: A method localizes assembly errors during the arrangement and/or the assembly of in particular vibration-isolated structural elements, in particular of components of optical arrangements, preferably of microlithographic projection exposure apparatuses.

Abstract: A lithographic apparatus comprising includes an object table which carries an object. The lithographic apparatus may further comprise at least one include a sensor as part of a measurement system to measure a characteristic of the object table, the environment surrounding the lithographic apparatus or another component of the lithographic apparatus. The measured characteristic may be used to estimate the a deformation of the an object due to a varying loads load during operation of the lithographic apparatus, for example a varying loads load induced by a two-phase flow in a channel formed within of the object table. Additionally, or alternatively, the The lithographic apparatus comprises may include a predictor to estimate the deformation of the object based on a model. The positioning of the object table carrying the object can be controlled based on the estimated deformation.