Abstract: A semiconductor wafer includes chip regions; and a scribe region provided between the chip regions, the scribe region extending in a first direction in a plan view, wherein the scribe region includes a first region extending in the first direction, second regions situated on respective sides of the first region in a second direction perpendicular to the first direction in a plan view, each of the two second regions extending in the first direction, and an electrode pad provided in at least the second regions, and each of the two second regions includes one or more trench vias that are wall-shaped, the one or more trench vias extending in the first direction, and at least one trench via of the one or more trench vias having a portion overlapping with the electrode pad in a plan view.

Abstract: An optical system such as an imaging system, projecting system or combined imaging and projecting system, has complex dielectric coatings and/or reflecting polarizers to separate multiple spectral bands and/or polarizations on one or more of the system's curved mirrors.

Abstract: A lithographic apparatus is disclosed that includes a substrate table configured to support a substrate on a substrate supporting area and a heater and/or temperature sensor on a surface adjacent the substrate supporting area.

Abstract: An apparatus includes: a sprinkler configured for spraying liquid; a conduit with a nano-particle coated surface; a sensor associated with the conduit, wherein the sensor is configured to detect a signal corresponding to a film deposition on the nano-particle coated surface; and a controller coupled with the sensor and the sprinkler, wherein the controller is configured to regulate liquid spraying of the sprinkler over the nano-particle coated surface.

Abstract: A measurement system to be used in a micro-device manufacturing line is equipped with: a plurality of measurement devices which performs measurement processing on each substrate; and a controller that can control the plurality of measurement devices, and the plurality of measurement devices includes at least one first measurement device which acquires position information of a plurality of marks formed on a substrate.

Abstract: Techniques that can assist with fabricating a semiconductor package that includes a zero misalignment-via (ZMV) and/or a trace formed using a polarization process are described. The disclosed techniques can result in creation of ZMVs and/or traces between the ZMVs using a process comprising application of polarized light to one or more resist layers (e.g., a photoresist layer, etc.). One embodiment of a technique includes modulating an intensity of light applied to one or more resist layers by interaction of a light source with a photomask and at least one polarizer such that one or more patterns are created on the one or more resist layers. One embodiment of another technique includes creating patterns on one or more resist layers with different types of polarized light formed from a photomask and at least one polarizer. The disclosed techniques can assist with reducing manufacturing costs, reducing development time, and increasing I/O density.

Abstract: A system for generating pump illumination for laser sustained plasma (LSP) is disclosed. In embodiments, the system includes an illumination source and a beam shaper. The illumination source can be configured to output illumination having a first pupil power distribution. In embodiments, the beam shaper is configured to receive the illumination having the first pupil power distribution from the illumination source and is further configured to output pump illumination having a second pupil power distribution that is different from the first pupil power distribution.

Abstract: A method for removing particles from a semiconductor process chamber including at least the following steps is provided. Electrical charges having a first polarity are accumulated on a receiving surface of the substrate holder by applying a voltage to the substrate holder. The particles having a second polarity in the semiconductor process chamber are attracted to move toward the receiving surface of the substrate holder on which the electrical charges having the first polarity are accumulated, where the first polarity is opposite to the second polarity. The particles having the second polarity are removed from the semiconductor process chamber. Other methods for removing particles from a semiconductor process chamber are also provided.

Abstract: An optical scanning system, including: a radiating source that outputs a light beam, a first time varying beam reflector that reflects the light beam through a scan lens towards a transparent sample, a second time varying beam reflector that reflects the light beam reflected from the transparent sample, a focusing lens that focuses the light beam reflected from the transparent sample, a blocker, and a detector that is irradiated by the one or more selectable portions of the light beam reflected from the transparent sample that pass the blocker. The blocker can be configured to block one or more portions of the light beam reflected from the transparent sample so that one or more selectable portions of the light beam reflected from the transparent sample can pass the blocker.

Abstract: A lithography apparatus includes a formation unit that forms an alignment mark on a substrate by irradiating the substrate that includes a photosensitizer with light, and a transfer unit that aligns the substrate on the basis of the position of the alignment mark and that transfers a pattern to the substrate by illuminating the photosensitizer with exposure light. The formation unit irradiates a material of a grounding of the photosensitizer with irradiation light at a wavelength that differs from that of the exposure light and forms the alignment mark on the material by processing the material with energy of the irradiation light.

Abstract: The invention relates to a lithographic apparatus comprising: an actuation system for positioning an object; a control unit (CU) for controlling the actuation system; and a cooling system for cooling the actuation system, wherein the actuation system comprises a coil assembly (CA) including one or more coils (CO) as force generating members, wherein the cooling system comprises cooling element (CE) interacting with the coil assembly for cooling the coil assembly, and wherein the control unit is configured to control a temperature of the one or more coils to keep a magnitude of cyclic stress below a predetermined value.

Abstract: A method for obtaining one or more images of a sample using a microscope includes dividing, using a reverberation cavity, a first one of a plurality of laser pulses into a plurality of sequential sub-pulses, each of the plurality of sequential sub-pulses having a power that is less than a previous one of the plurality of sequential sub-pulses, directing, using the one or more lenses of the microscope, the plurality of sequential sub-pulses onto a portion of the sample to generate a plurality of signals, each of the plurality of signals being associated with a different depth within the sample, and detecting the plurality of signals from the sample to generate one or more images of at least a portion of the sample.

Abstract: The present disclosure provides a mask for photolithography patterning. The mask includes a substrate, a pattern layer on a surface of the substrate. The mask also includes a pellicle attached to the substrate and configured to isolate the pattern layer from ambient. The pellicle includes a membrane between the pattern layer and ambient, a frame for securing the membrane on the substrate, and an optical member disposed in the membrane. A method for manufacturing the mask is also provided.

Abstract: A method of metrology target design is described. The method includes determining a sensitivity of a parameter of a metrology target design to a perturbation of a process parameter for forming, or measuring the formation of, the metrology target, and determining a robustness of the metrology target design based on the sum of the sensitivity multiplied by the perturbation of at least one of the process parameters.

Abstract: A sensor is fixed on an aircraft structure by a joining system which includes at least one enclosure in which is positioned at least one transducer, at least one passage configured to allow at least one conducting element to pass through the enclosure, at least one flexible connection connecting each transducer present in the enclosure to said enclosure and at least one binder joining together the enclosure and the structure. This joining system makes it possible to limit the spread of the deformations of the structure toward the transducer or transducers and ultimately the risks of malfunction.

Abstract: A substrate table for an immersion lithographic apparatus is disclosed having a recess, configured to receive a substrate of a given size, and a fluid extraction system, configured to extract fluid from a gap between the edge of the substrate and the edge of the recess, the fluid extraction system configured such that the rate of flow of fluid extracted from a localized section of the gap is greater than the rate of flow of fluid extracted from another section of the gap.

Abstract: A second stage is disposed on the first stage. The second stage provides six degrees of freedom. A chuck that holds a workpiece is disposed on the second stage. Actuators that enable movement in three directions are disposed on the second stage. The first stage and the second stage move independent of each other during inspection of the workpiece on the chuck.

Abstract: A method includes supporting a wafer on a heating element, wherein the heating element is located in a baking chamber. The method further includes heating the wafer for a first duration using the heating element. The method further includes measuring a temperature of the heating element and a temperature of the wafer during the first duration to obtain temperature information. The method further includes adjusting an amount of heat provided by the heating element during the first duration, wherein the adjusting of the amount of heat includes decreasing the amount of heat provided by the heating element as a rate of change of the temperature information versus time increases.

Abstract: The present invention provides an exposure apparatus including a forming unit configured to form a mark on a resist film on a substrate, and a control unit configured to perform an exposure process to form a latent image by projecting a pattern onto a target position on the resist film on the substrate based on a measured position of the mark, wherein the control unit causes the forming unit to perform a formation process of forming, before the exposure process is performed on a reworked substrate on which a second resist film has been formed after removing a first resist film with a first mark, a second mark on the second resist film so the second mark will be positioned at a position shifted from a position of the first mark on the reworked substrate.

Abstract: A light source device includes a plurality of light sources configured to output a plurality of laser beams of different color components; and circuitry. A ratio in maximum output power between the plurality of laser beams output from the plurality of light sources is variable.

Abstract: A substrate holder for use in a lithographic apparatus and configured to support a substrate, the substrate holder including a main body having a main body surface, a plurality of main burls projecting from the main body surface, wherein each main burl has a distal end surface configured to support the substrate, a first seal member projecting from the main body surface and having an upper surface, the first seal member surrounding the plurality of main burls and configured to restrict the passage of liquid between the substrate and the main body surface radially inward past the first seal member; and a plurality of minor burls projecting from the upper surface of the first seal member, wherein each minor burl has a distal end surface configured to support the substrate.

Abstract: The present invention discloses a wireless and self-contained headset that delivers an electronic signal to a precise and self-locating position within bilateral conchae in both ears of a human user. The headset comprises an electronics housing that carries a specific waveform source. The waveform source generates the electronic signal, which is delivered simultaneously to both left and right ears of the human user. An array of silver electrodes housed within the bilateral earpieces cover with precision the location at the exact center of the relatively smooth plane of the conchae directly behind the external auditory meatus (ear opening/canal).

Abstract: Disclosed herein is a processing apparatus including a processing unit, alignment unit, and controller. The controller includes a reference program storing section previously storing a reference program for use in processing a predetermined workpiece, a reference result recording section for rating the result of processing performed to the predetermined workpiece by the processing unit according to the reference program and then recording a resultant rating point as a processing reference result, and an actual result calculating section for rating the result of processing performed to substantially the same workpiece as the predetermined workpiece by the processing unit according to the reference program.

Abstract: The present disclosure provides an apparatus for fabricating a semiconductor structure, including an air flow redistribution member configured to receive an air flow at a first end and eject the air flow at a second end. The air flow redistribution member includes a first air flow redistribution plate and a second air flow redistribution plate between the first air flow redistribution plate and the second end.

Abstract: The present invention provides an imprint apparatus that forms a pattern of an imprint material on a substrate by using a mold, the apparatus including a control unit configured to control a driving unit and a deformation unit such that parts of position control of controlling the relative positions of the mold and the substrate, and shape control of deforming at least one of the mold and the substrate are performed concurrently, wherein the control unit includes an input unit configured to give, to target position data, time-series data representing relative positions of the mold and the substrate that change at each time during which the shape control is performed in accordance with deformation in at least one of the mold and the substrate by the deformation unit.

Abstract: A method localizes assembly errors during the arrangement and/or the assembly of in particular vibration-isolated structural elements, in particular of components of optical arrangements, preferably of microlithographic projection exposure apparatuses.

Abstract: The present disclosure relates to a one-dimensional nano-chain structure including a single crystal structure as a minimum repeat unit structure.

Abstract: A method includes exposing number of fields on a substrate, obtaining data about a field and correcting exposure of the field in subsequent exposures. The method includes defining one or more sub-fields of the field based on the obtained data. Data relating to each sub-field is processed to produce sub-field correction information. A subsequent exposure of the one or more sub-fields is corrected using the sub-field correction information. By controlling a lithographic apparatus by reference to data of a particular sub-field within a field, overlay error can be reduced or minimized for a critical feature, rather than being averaged over the whole field. By controlling a lithographic apparatus with reference to a sub-field rather than only the whole field, a residual error can be reduced in each sub-field.

Abstract: A lithographic apparatus is used to manufacture a plurality of devices on a substrate. A height map is obtained representing a topographical variation across the substrate. Using the height map the apparatus controls imaging of a field pattern at multiple field locations across the substrate. The field pattern includes a plurality of individual device areas. For field locations near the substrate's edge, the height map data is used selectively so as to ignore topographical variations in one or more individual device areas. Whether a device area is to be ignored is determined at least partly based on the height map data obtained for the current exposure. Alternatively or in addition, the selection can be based on measurements made at the corresponding device area and field location on one or more prior substrates, and/or on the same substrate in a previous layer.

Abstract: An onium salt and a composition having high sensitivity and excellent pattern characteristics such as LWR, which is preferably used for a resist composition for a lithography process using two active energy rays of a first active energy ray such as an electron beam or an extreme ultraviolet and a second active energy ray such as UV.

Abstract: A chuck is provided. The chuck comprises a plurality of lands protruding from a surface of the chuck, the lands defining a series of zones; and a trenched recessed from the surface of the chuck in at least one of the zones.

Abstract: A method of performance testing working parameters of a fluid handing structure in an immersion lithographic apparatus, the method including: placing a test substrate having an upper surface with a first portion with a resist defining the upper surface and a second portion with a material different from the resist defining the rest of the upper surface on a table in the immersion lithographic apparatus, confining liquid on a region of an upper surface of the table and/or the upper surface of the test substrate by operating the fluid handing structure using the associated working parameters, moving the table such that the region moves from the second portion to the first portion, and detecting change to and/or residue on the first portion as a result of liquid being left behind on the first portion during the moving.

Abstract: There is provided a cleaning robot including a light source module, an image sensor and a processor. The light source module projects a line pattern and a speckle pattern toward a moving direction. The image sensor captures an image of the line pattern and an image of the speckle pattern. The processor calculates one-dimensional depth information according to the image of the line pattern and calculates two-dimensional depth information according to the image of the speckle pattern.

Abstract: A method including: obtaining a detected representation of radiation redirected by each of a plurality of structures from a substrate additionally having a device pattern thereon, wherein each structure has an intentional different physical configuration of the respective structure than the respective nominal physical configuration of the respective structure, wherein each structure has geometric symmetry at the respective nominal physical configuration, wherein the intentional different physical configuration of the structure causes an asymmetric optical characteristic distribution and wherein a patterning process parameter measures change in the physical configuration; and determining a value, based on the detected representations and based on the intentional different physical configurations, to setup, monitor or correct a measurement recipe for determining the patterning process parameter.

Abstract: The present disclosure is directed to a method and system for monitoring a distance between a shutter and a reference point in a processing module. For example, the method includes moving a shutter relative to a substrate support in a wafer processing module and determining a distance between the shutter and a wall of the wafer processing module with a measurement device. In response to the distance being greater than a value, the method further includes transferring a substrate to the substrate support, and in response to the distance being equal to or less than the value, the method includes resetting the shutter.

Abstract: A device performs laser-assisted processing of a material adhering to a substrate or of a substrate associated or substrate-free body or of its surface. The device has a positioning system enabling three translational and three rotational degrees of freedom and having a sample holder. The sample holder holds the substrate to which the material to be processed adheres or to which the body to be processed is associated or, in the absence of a substrate, the body to be processed. The device has a laser source emitting laser pulses and focusing optics which shape the laser pulses such that they impinge in a focal point or a focal volume in the region of the material or body to be processed in such a way that a two-photon or multi-photon polymerization takes place.

Abstract: A method for correcting misalignments is provided. An alignment for each device of a group of devices mounted on a substrate is determined. An alignment error for the group of devices mounted on the substrate is determined based on the respective alignment for each device. One or more correction factors are calculated based on the alignment error. The alignment error is corrected based on the one or more correction factors.

Abstract: A method of calibrating a projection system heating model to predict an aberration in a projection system in a lithographic apparatus, the method comprising passing exposure radiation through a projection system to expose one or more exposure fields on a substrate provided on a substrate table, making measurements of the aberration in the projection system caused by the exposure radiation, wherein the time period between measurements is less than the time period that would be taken to expose all exposure fields on the substrate.

Abstract: A liquid crystal exposure apparatus that exposes a substrate with an illumination light via a projection optical system is equipped with: a substrate holder that holds the substrate; a substrate encoder system that includes head units and scales, and acquires the position information of the substrate holder on the basis of the output of the head units; and a drive section that relatively moves one of the head units and the scales on the substrate holder with respect to the other.

Abstract: An imaging lens assembly includes a plastic barrel, a lens set and a metal retainer. The metal retainer is for fixedly disposing the lens set in the plastic barrel and includes an inner annular portion, a plurality of fixing portions and a plurality of elastic portions. The inner annular portion forms a through hole. The fixing portions directly contact the plastic barrel for the metal retainer to be fixedly disposed in the plastic barrel. At least one of the elastic portions connects the inner annular portion and at least one of the fixing portions.

Abstract: A display panel inspection system includes a camera to image respective frames of a mother substrate in a frame-by-frame manner, a stage to move the mother substrate relative to the camera, an image obtaining unit to store frames imaged by the camera, a gray level extracting unit that obtains gray level values of the frames, a frame matching unit that searches and matches two frames that match each other among the frames imaged by the camera, a correcting unit that performs correction on one of two frames matched with each other in consideration of an alignment error and an image distortion between the two frames, and a comparing unit that compares the gray level values of the two frames matched with each other, after the correction.

Abstract: The alignment mark and method for making the same are described. In one embodiment, a semiconductor structure includes a plurality of gate stacks formed on the semiconductor substrate and configured as an alignment mark; doped features formed in the semiconductor substrate and disposed on sides of each of the plurality of gate stacks; and channel regions underlying the plurality of gate stacks and free of channel dopant.

Abstract: An area scanning confocal microscope includes a pattern generation unit configured to generate or produce a line pattern comprising a plurality of lines, for example a plurality of straight parallel lines; a projection unit comprising a microscope objective configured to project the line pattern onto an object through the microscope objective, wherein the focal plane in which the line pattern is projected or imaged is tilted at a tilting angle with respect to an optical axis of the microscope, the tilting angle being equal to or greater than 0° and smaller than 90°, for example between 30° and smaller than 85°; and an imaging unit comprising a two-dimensional image detector configured to capture within one image frame of the image detector an image of the projected line pattern.

Abstract: An inspection system includes an illumination source configured to generate extreme ultraviolet (EUV) light, illumination optics to direct the EUV light to a sample within a range of off-axis incidence angles corresponding to an illumination pupil distribution, collection optics to collect light from the sample in response to the incident EUV light within a range of collection angles corresponding to an imaging pupil distribution, and a detector configured to receive at least a portion of the light collected by the collection optics. Further, a center of the illumination pupil distribution corresponds to an off-axis incidence angle along a first direction on the sample, and at least one of the illumination pupil distribution or the imaging pupil distribution is non-circular with a size along the first direction shorter than along a second direction perpendicular to the first direction.

Abstract: In order to improve the throughput performance and/or economy of a measurement apparatus, the present disclosure provides a metrology apparatus including: a first measuring apparatus; a second measuring apparatus; a first substrate stage configured to hold a first substrate and/or a second substrate; a second substrate stage configured to hold the first substrate and/or the second substrate; a first substrate handler configured to handle the first substrate and/or the second substrate; and a second substrate handler configured to handle the first substrate and/or the second substrate, wherein the first substrate is loaded from a first, second or third FOUP, wherein the second substrate is loaded from the first, second or third FOUP, wherein the first measuring apparatus is an alignment measuring apparatus, and wherein the second measuring apparatus is a level sensor, a film thickness measuring apparatus or a spectral reflectance measuring apparatus.

Abstract: A system comprising: a high index dielectric configured to: a) create a bi-periodic interference pattern of two standing sinusoidal waves on illumination by two pairs of counter-propagating sinusoidal light beams at different incident angles, wherein the incident angles are selected in accordance with the index of refraction of the high index dielectric to i) to 5 determine the spatial frequency of each counter-propagating light beam pair, and ii) cause total internal reflection, and b) generate, from the bi-periodic interference pattern, an evanescent bi-periodic standing sinusoidal wave; a light source configured to illuminate the high index dielectric with the two pairs of counter-propagating sinusoidal light beams at the different incident angles and thereby illuminate a fluorescing object positioned at the surface of the high index dielectric with the generated evanescent bi-periodic standing sinusoidal wave; and one or more delay lines configured to independently modify the initial phase of each counter

Abstract: The present invention provides an imprint apparatus which forms a pattern of an imprint material on a substrate by using a mold, the apparatus comprising: a driver configured to drive the mold and the substrate relatively; a measurement device configured to measure a relative position between the mold and the substrate; and a controller configured to, in alignment between the mold and the substrate, control the driver based on a signal obtained by combining, with a first signal according to a deviation between the relative position measured by the measurement device and a target relative position, second signals with time intervals therebetween and that momentarily increase a driving force of the driver.

Abstract: An exposure apparatus arranged to project a radiation beam onto a target portion of a substrate, the exposure apparatus having: a first substrate holder configured to hold the substrate; a second substrate holder configured to hold the substrate; a sensor holder configured to hold a sensor and/or detector; a first measurement device having a first alignment system having an alignment sensor configured to measure positions of a substrate alignment mark on the substrate; a second measurement device having a second alignment system having a further alignment sensor configured to measure positions of the substrate alignment mark on the substrate; a first scale arranged on a lower surface of the first substrate holder; and a first encoder head arranged to cooperate with the first scale, the first encoder head located beneath the first alignment system and held by a stationary support.

Abstract: A cleaning device for an apparatus for processing production substrates, the cleaning device including: a body having dimensions similar to the production substrates so that the cleaning device is compatible with the apparatus, the body having a first major surface and a second major surface facing in the opposite direction to the first major surface; a chamber within the body configured to accommodate contaminants; an inlet from the first major surface to the chamber and configured to allow contaminants to be drawn into the chamber by a flow of fluid; and an outlet from the chamber to the second major surface, the cleaning device being configured to allow the fluid to exit the chamber but to prevent a contaminant leaving the chamber.

Abstract: A lithographic apparatus including a fluid handling structure configured to contain immersion fluid in a space adjacent to an upper surface of the substrate table and/or a substrate located in a recess of the substrate table, a cover having a planar main body that, in use, extends around a substrate from the upper surface to a peripheral section of an upper major face of the substrate in order to cover a gap between an edge of the recess and an edge of the substrate, and an immersion fluid film disruptor, configured to disrupt the formation of a film of immersion fluid between an edge of the cover and immersion fluid contained by the fluid handling structure during movement of the substrate table relative to the fluid handling structure.