Abstract: A liquid immersion lithography apparatus includes a projection system having a final optical element and a nozzle member having a first opening disposed on a first side of the final optical element and from which an immersion liquid is supplied, a second opening disposed on a second side of the final optical element and from which the immersion liquid is recovered, and a liquid recovery portion disposed to surround a path of an exposure beam and from which the immersion liquid is recovered. A tank is fluidicly connected to the liquid recovery portion of the nozzle member. During exposure of a substrate to the exposure beam, an upper surface of the substrate faces the liquid recovery portion, and the immersion liquid is supplied from the first opening while performing liquid recovery from the second opening and the liquid recovery portion.

Abstract: An exposure apparatus and method exposes a substrate via a projection optical system and a liquid supplied to an immersion region below the projection optical system. First and second holding members move below the projection optical system and each can hold a substrate in a hole of an upper surface thereof. A controller is arranged to control a drive system such that, when one holding member of the first and second holding members is arranged opposite to the projection optical system, the other holding member of the first and second holding members comes close to the one holding member, and such that the close first and second holding members are moved relative to a liquid immersion member so that the other holding member is arranged opposite to the projection optical system in place of the one holding member while the immersion region is substantially maintained below the projection optical system.

Abstract: An edge exposure apparatus includes: an imaging unit that images a front surface of a substrate; a substrate holding unit; an exposure unit that exposes an edge portion of the substrate held on the substrate holding unit; a first moving mechanism that moves and rotates the substrate holding unit; a second moving mechanism that moves the exposure unit; and a control unit that controls the first moving mechanism and the second moving mechanism, wherein the first moving mechanism and the second moving mechanism are controlled so as to acquire array information of shots of a pattern on the substrate from a substrate image of a substrate, which has already been subjected to pattern exposure, imaged by the imaging unit, and expose the edge portion of the substrate, based on the acquired array information.

Abstract: A self-balancing optical position sensitive detector includes a pair of spaced apart, parallel, longitudinally extending doped regions on a first surface on a front side of a substrate 16 of opposite doping type with contact pads on the front side at respective ends of a first doped region of the pair. A voltage source applies a potential difference between the contact pads of the first doped region. On the front side, a contact pad of the second doped region of the pair provides an analog output signal representative of a longitudinal position of a center of gravity of an incident light pattern along the doped regions without external circuitry processing the output signal to obtain a readout of the longitudinal position. A resistive line may directly overly, abut and be in contact with at least a portion of the first doped region. A conductive line may directly overly, abut and be in contact with at least a portion of the second doped region.

Abstract: A substrate stage is used in a lithographic apparatus. The substrate stage includes a substrate table constructed to hold a substrate and a positioning device for in use positioning the substrate table relative to a projection system of the lithographic apparatus. The positioning device includes a first positioning member mounted to the substrate table and a second positioning member co-operating with the first positioning member to position the substrate table. The second positioning member is mounted to a support structure. The substrate stage further comprises an actuator that is arranged to exert a vertical force on a bottom surface of the substrate table at a substantially fixed horizontal position relative to the support structure.

Abstract: The present disclosure provides a lithography system comprising a radiation source and an exposure tool including a plurality of exposure columns densely packed in a first direction. Each exposure column includes an exposure area configured to pass the radiation source. The system also includes a wafer carrier configured to secure and move one or more wafers along a second direction that is perpendicular to the first direction, so that the one or more wafers are exposed by the exposure tool to form patterns along the second direction. The one or more wafers are covered with resist layer and aligned in the second direction on the wafer carrier.

Abstract: A method for measuring lens distortion, comprising: providing a test card having a dot matrix pattern of K×N dots, wherein the K and the N are both natural numbers (110); obtaining a distorted image of the test card after being distorted by a lens (120); establishing a planar coordinate system for the distorted image by using a dot at an upper left corner of the distorted image as a coordinate origin, a rightward direction from the origin as a positive direction of axis X, and a downward direction from the origin as a positive direction of axis Y (130); positioning a center dot of the distorted image and all non-center dots by scanning and searching, and determining coordinate values of the center dot and all the non-center dots in the planar coordinate system (140); and calculating a distortion amount of the distorted image by using the coordinate values of the center dot and all the non-center dots according to a distortion amount calculation equation for the distorted image, thereby obtaining a distortion

Abstract: An optical imaging apparatus includes an optical element support sub-structure and an auxiliary support sub-structure. The optical element support sub-structure is configured to support an optical element and has a first temporary support interface arrangement. The optical element is configured to form part of a group of optical elements of the optical imaging apparatus configured to transfer, in an exposure process using exposure light, an image of a pattern of a mask onto a substrate. The auxiliary support sub-structure is configured to support an auxiliary component and has a second temporary support interface arrangement. The auxiliary component is configured to execute, during the exposure process, an auxiliary function of the exposure process other than transferring the image of the pattern onto the substrate.

Abstract: An illumination optical system including one or more light sources each including a solid-state light-emitting device and an optical member. The optical member includes an integrator including a first fly-eye lens on which light from the solid-state light-emitting device is incident and a second fly-eye lens on which light from the first fly-eye lens is incident, and uniformizing a luminance distribution of light in a predetermined illumination region illuminated with light incident from the solid-state light-emitting device. A major-axis direction of a luminance distribution shape of light incident on an incident plane of the first fly-eye lens is different from arrangement directions of the cells in the first fly-eye lens.

Abstract: A modular illumination system is capable of producing a light beam having a wide field of view—e.g., in excess of ninety degrees—while maintaining a high collection efficiency as well as a high degree of beam homogeneity. The illumination system comprises an elementary unit having a linear array of light sources. Light from the light sources is collimated using a corresponding array of catadioptric lenses, and the collimated light is homogenized in the tangential plane using two cylindrical lens arrays set in tandem to one another. The homogenized light is then collimated in the sagittal plane using a cylindrical lens that is set perpendicular to the lenses of the two cylindrical lens arrays to yield a wide linear beam. To produce an area beam, the linear array of light sources can be replaced with a two-dimensional array, and the cylindrical lenses can be replaced with spherical lenses.

Abstract: An exposure apparatus including a substrate transporting unit configured to transport a substrate in a first direction, and including a first measuring part; and an exposure part disposed over the substrate transporting unit configured to irradiate the substrate with ultraviolet rays. The first measuring part is configured to measure an intensity of the ultraviolet rays before the substrate is irradiated.

Abstract: A method of patterning substrates using a lithographic apparatus. The method comprising providing a beam of radiation using an illumination system, using a patterning device to impart the radiation beam with a pattern in its cross-section, and using a projection system to project the patterned radiation beam onto target portions of a lot of substrates, wherein the method further comprises performing a radiation beam aberration measurement after projecting the patterned radiation beam onto a subset of the lot of substrates, performing an adjustment of the projection system using the results of the radiation beam aberration measurement, then projecting the patterned radiation beam onto a further subset of the lot of substrates.

Abstract: A method of reducing image placement errors in a microlithographic projection exposure apparatus includes providing a mask, a light sensitive layer and a microlithographic projection exposure apparatus which images features of the mask onto the light sensitive surface using projection light. Subsequently, image placement errors associated with an image of the features formed on the light sensitive surface are determined either by simulation or metrologically. Then an input state of polarization of the projection light is changed to an elliptical output state of polarization which is selected such that the image placement errors are reduced.

Abstract: An object table to support an object, the object table having a support body, an object holder to hold an object, an opening adjacent an edge of the object holder, and a channel in fluid communication with the opening via a passageway, wherein the channel is defined by a first material which is different to a second material defining the passageway.

Abstract: A liquid immersion lithography apparatus includes a projection system including an optical member of which an incidence side has a convex lens shape, the projection system being configured to project an image through a liquid on a workpiece, and a liquid immersion member arranged below the optical member, the liquid immersion member having a plurality of openings through which the liquid is allowed to flow. A material of which the optical member is made is more resistant to the liquid than a material of which the liquid immersion member is made.

Abstract: An illumination optical apparatus illuminates a pattern on a mask with illumination light. The illumination optical apparatus includes an optical integrator arranged in an optical path of the illumination light, a deflecting member arranged in the optical path on an incidence side of the optical integrator, which deflects the illumination light, a lens element arranged in the optical path between the deflecting member and the optical integrator, which distributes the illumination light in a region, on a pupil plane of the illumination optical apparatus, away from an optical axis of the illumination optical apparatus, and a polarization member arranged in the optical path between the lens element and the optical integrator, which changes a polarization state of the illumination light so that a polarization direction of the illumination light in the region is substantially coincident with a circumferential direction about the optical axis.

Abstract: Exposure apparatus exposes a substrate by irradiating the substrate with exposure light via a projection optical system and a liquid. The exposure apparatus is provided with a liquid immersion mechanism for supplying the liquid and recovering the liquid. The liquid immersion mechanism has an inclined surface, which is opposite to a surface of the substrate and is inclined with respect to the surface of the substrate, and a liquid recovering port of the liquid immersion mechanism is formed in the inclined surface. A flat portion is provided between the substrate and the projection optical system. A liquid immersion area can be maintained to be small.

Abstract: A control system provides centralized active noise control (ANC) and active vibration control (AVC) through a digital network. The control system includes a controller, an audio sub-system, and a vibration sub-system. The audio-sub system includes at least one sound monitoring component and at least one sound outputting component. The vibration sub-system includes at least one vibration monitoring component and at least one vibration actuating component. The controller and the sub-systems are interconnected through the digital network. The controller controls the sub-systems through the digital network to perform the ANC and AVC functions in a holistic approach.

Abstract: The disclosure pertains to an optical apparatus, in particular for microlithography, that includes an optical module, a support structure and a connection apparatus. The connection apparatus includes at least one connection unit which includes a first connector part and a second connector part. The first connector part is connected to the optical module, and the second connector part is connected to the support structure.

Abstract: A phase-contrast x-ray imaging device is particularly suited for the medical field. The device includes an x-ray source for generating an x-radiation field and an x-ray detector having a one-dimensional or two-dimensional arrangement of pixels. A phase-contrast differential amplifier is positioned between the x-ray source and the x-ray detector. The phase-contrast differential amplifier amplifies spatial phase differences in the x-radiation field during operation.

Abstract: An edge-dominant alignment method for use in an exposure scanner system is provided. The method includes the steps of: providing a wafer having a plurality of shot areas, wherein each shot area has a plurality of alignment marks; determining a first outer zone of the wafer, wherein the first outer zone includes a first portion of the shot areas along a first outer edge of the wafer; determining a scan path according to the shot areas of the first outer zone; and performing an aligning process to each shot area of the first outer zone according to the scan path and an alignment mark of each shot area of the first outer zone.

Abstract: The invention relates to a method for forming a structuring at surfaces of components using a laser beam. In the invention, a laser beam is directed onto a diffractive optical element. The diffractive optical element is configured such that the laser beam is split into at least two part beams and the part beams are directed at an angle ? with respect to the optical axis of the laser beam onto at least one further optical element which is transparent for the laser radiation. The further optical element(s) has/have a first surface and a second surface which is inclined at an angle to the optical axis of the laser beam at which the beam direction of the part beams is changed by optical refraction.

Abstract: A scanner routing method for particle removal is disclosed. A dummy wafer coated with a viscosity builder is provided. The dummy wafer is moved, shot by shot, with an immersion scanner. The moving includes moving edge shots in a direction from the outside of the dummy wafer toward the inside of the same. The scanner routing method of the invention is beneficial to remove unnecessary particles or chemicals in the immersion liquid and therefore improve the performance of the product wafer which is subsequently run after the dummy wafer.

Abstract: The present invention provides a lithography apparatus which performs a process of forming a pattern on a substrate conveyed from a coating apparatus which coats the substrate with a resist, the lithography apparatus including an obtaining unit configured to obtain, from the coating apparatus, first specifying information which specifies a processing target substrate conveyed from the coating apparatus to the lithography apparatus, out of a plurality of substrates which are coated with the resist by the coating apparatus and on which the process is to be performed, and a processing unit configured to select offset correction information corresponding to the processing target substrate from a plurality of pieces of offset correction information respectively corresponding to the plurality of substrates based on the first specifying information and perform the process on the processing target substrate by using the selected offset correction information.

Abstract: A method for operating a target processing system for processing a target (23) on a chuck (13), the method comprising providing at least a first chuck position mark (27) and a second chuck position mark (28) on the chuck (13); providing an alignment sensing system (17) arranged for detecting the first and second chuck position marks (27, 28), the alignment sensing system (17) comprising at least a first alignment sensor (61) and a second alignment sensor (62); moving the chuck (13) to a first position based on at least one measurement of the alignment sensing system (17); and measuring at least one value related to the first position of the chuck.

Abstract: An alignment adjusting device is provided for an optical focal plane assembly, wherein the optical focal plane assembly has a detector with a detector plane and is adapted to be mounted to an optics assembly having an optical focal plane. The alignment adjusting device is adapted for allowing an alignment of the detector plane representing an image area and the optical focal plane. The alignment adjusting device includes a detector support for receiving the detector; a plurality of members, wherein a first member of the plurality of the members is connected to the detector support and a second member is connected to a flange that is adapted to be connected to the optics assembly. The first member, the second member and the remaining number of the members are pairwise moveable connected to each other by a number of springs and/or supporting elements.

Abstract: An exposure apparatus including a substrate transporting unit configured to transport a substrate in a first direction, and including a first measuring part; and an exposure part disposed over the substrate transporting unit configured to irradiate the substrate with ultraviolet rays. The first measuring part is configured to measure an intensity of the ultraviolet rays before the substrate is irradiated.

Abstract: A holding apparatus includes a holding portion that includes a first member which contacts a portion of an object, a second member which at least a portion thereof is fixed to a base, and a connection member which is configured to connect the first and second members, and a driving unit which drives the holding portion to change at least a posture of the first member, wherein a relative positional relationship between the first member and the second member is changed via the connection member.

Abstract: A platen assembly for use in an additive manufacturing system, which includes a platen plate that is preferably secured to a gantry mechanism of the additive manufacturing system, and having a top surface, and one or more magnets secured to the platen plate and configured to generate one or more magnetic fields at the top surface of the platen plate. The platen gantry is configured to magnetically couple interchangeable and replaceable build sheets to the top surface of the platen plate due to the one or more generated magnetic fields, and where the magnetically-coupled build sheets are configured to receive the printed layers from the printing mechanism.

Abstract: The present invention provides an exposure apparatus which performs a scanning exposure of each of a plurality of shot regions on a substrate, comprising a measuring device including a first detector configured to perform detection with respect to a measurement point on the substrate and a second detector configured to perform detection with respect to the measurement point prior to detection by the first detector, and configured to measure a height of the substrate based on an output from the first detector and an output from the second detector, and a processor configured to determine, based on measurement obtained based on an output from the first detector along with a scanning exposure of a first shot region, a first measurement point where the measuring device performs measurement first based on an output from the second detector with respect to a second shot region.

Abstract: An immersion lithographic apparatus is disclosed that includes a fluid handling system configured to confine immersion liquid to a localized space between a final element of a projection system and a substrate and/or table and a gas supplying device configured to supply gas with a solubility in immersion liquid of greater than 5×10?3 mol/kg at 20° C. and 1 atm total pressure to an area adjacent the space.

Abstract: A display device capable of displaying both a 3D image and a 2D image is provided. The display device includes a plurality of optical filter regions where light-blocking panels for producing binocular disparity are arranged in matrix. The light-blocking panel can select whether to transmit light emitted from a display panel in each of the plurality of optical filter regions. Thus, in the display device, some regions where binocular disparity is produced can be provided. Consequently, the display device can display both a 3D image and a 2D image.

Abstract: A method for determining an offset between a center of a substrate and a center of a depression in a chuck includes providing a test substrate to the depression, the test substrate having a dimension smaller than a dimension of the depression, measuring a position of an alignment mark of the test substrate while in the depression, and determining the offset between the center of the substrate and the center of the depression from the position of the alignment mark.

Abstract: A focus detection unit to adjust a focal point of an image, of an object, formed by an optical system includes a first output section, a second output section, and a projection optical system. The first output section includes a first light modulation element configured to generate a first pattern image based on incident light and is configured to output the generated first pattern image. The second output section includes a second light modulation element configured to generate a second pattern image based on incident light and is configured to output the generated second pattern image. The projection optical system is configured to project the output first pattern image and the output second pattern image such that the output first pattern image and the output second pattern image have a predetermined positional relationship at an in-focus position of the optical system.

Abstract: A synthetic controlled variable is obtained by obtaining a synthetic quantity using measurement results of a first and a second measuring instruments and corresponding gains (or transfer function) and synthesizing the synthetic quantity and one of the measurement results of the first and the second measuring instruments, respectively, via a high pass filter and a low pass filter. A feedback control system is structured that obtains a control input using a synthetic controlled variable and a desired value, and gives a plant the control input. This makes adding of a high pass filter for removing offset of installation position of the first and the second measuring instruments no longer necessary, and allows a driving system which controls robust driving in a high bandwidth of a plate stage regardless of bandwidth in which resonance appears to be designed.

Abstract: Methods include: directing test light and reference light along different optical paths, where a test object is in a path of the test light; forming an image of the test object on a multi-element detector by directing test light from the test object to the detector; overlapping the reference light with the test light on the detector; detecting an intensity of the overlapped test and reference light with the detector, the intensity being detected at a frame rate; and modulating an optical path difference (OPD) between the test and reference light at the detector while detecting the light intensity. The OPD is modulated at a rate and amplitude sufficient to reduce a contrast of fringes in a spatial interference pattern formed by the light at the detector over a frame of the detector. Accordingly, fringe-free images may be acquired real-time.

Abstract: An alignment exposure method and a method for fabricating a display substrate are disclosed. The alignment exposure method includes a first alignment exposure process and a second alignment exposure process. Multiple groups of alignment marks are provided at an edge of at least one side of the substrate in the first alignment exposure process. At least one group of mark structures are provided at an edge of at least one side of a mask employed in the second alignment exposure process. In multiple mask alignment processes in the second alignment exposure process, each group of the at least one group of the mark structures of the mask are aligned with groups of the alignment marks at a corresponding side of the substrate group by group. The alignment exposure method is employed to realize alignment exposure of a substrate with a size larger than a size of a mask.

Abstract: A first drive system of a first stage and a second drive system of a second stage are controlled based on measurement information of a first encoder system and a second encoder system, respectively, and so that a mask and a substrate are moved relative to illumination light in scanning exposure of the substrate. To move the second stage in another second area, one head of the second encoder system, different from two heads, of three heads used in one second area is switched to another head so that drive control of the second stage by three heads, including the another head and the two heads, that are used in the another second area is performed, instead of drive control of the second stage by the three heads used in the one second area. The switching is performed while the second stage is in a first area.

Abstract: An apparatus for doping impurities includes: a bath reserving liquid containing impurity elements; a liquid transport device transporting the liquid on a surface of a semiconductor substrate; a laser optical system which scans and irradiates light pulses of laser onto the surface of the semiconductor substrate; an X-Y manipulator moving the semiconductor substrate; and an arithmetic and control unit which controls the liquid transport device and X-Y manipulator. Flow rate of the liquid and scanning velocity of the light pulses are determined, by a characteristic dimension of the irradiation area along the flow direction of the liquid, an overlapping ratio of the irradiation area, and the radius of a bubble generated in the liquid. The impurity elements are doped into a part of the inside of the semiconductor substrate at the determined flow rate and scanning velocity.

Abstract: A lithographic apparatus includes a driven object having compliant dynamics; a plurality of actuators configured to act on the driven object, wherein the plurality of actuators are over-determined in an actuator degree of freedom; a control system including a transformation matrix configured to generate controller output signals for each of the plurality of actuators in response to a setpoint, wherein the transformation matrix is configured such that the controller output signals do not excite the compliant dynamics of the driven object in at least one degree of freedom.

Abstract: Support elements for an optical element and a method for supporting an optical element are disclosed. The disclosure can be used in connection with arbitrary optical apparatuses or optical imaging methods. In particular, the disclosure can be used in connection with the microlithography employed in the manufacture of microelectronic circuits.

Abstract: A lithography apparatus includes a plurality reticle edge masking assemblies (REMAs), wherein each REMA of the plurality of REMAs is positioned to receive one of a plurality of light beams, and each REMA of the plurality of REMAs comprises a movable slit for passing the received light beam therethrough. The lithography apparatus includes a controller for controlling a speed of the movable slit based on a size of the movable slit, an intensity of the one or more collimated light beams, or a material to be patterned. The lithography apparatus further includes a single mask having a single pattern, wherein the mask is configured to receive light from every REMA of the plurality of REMAs. The lithography apparatus includes a projection lens configured to receive light transmitted through the single mask, wherein the lithography apparatus is configured to introduce an immersion liquid into a space adjacent to the projection lens.

Abstract: A method of, and associated apparatuses for, determining an overlay error resultant from structure defects such as asymmetry. The method comprises measuring scattering properties of a first target comprising a first structure and a second structure, constructing a model of the first structure using the measured scattering properties, the model comprising a first model structure corresponding to the first structure, modifying the model by overlaying the first model structure with an intermediate model structure, further modifying the model by replacing the intermediate model structure with a second model structure, corresponding to the second structure, calculating a second defect-induced overlay error between the first model structure and the second model structure, the first and second model structures being overlaid with respect to each other in the further modified model and determining an overlay error in a second target using the calculated second defect-induced overlay error.

Abstract: A method for measuring an optical symmetry property on a microlithographic projection exposure apparatus (10) together with a microlithographic projection exposure apparatus and an associated microlithographic measurement mask are disclosed. The method includes arranging at least one measurement structure (60; 66) in an exposure beam path (32) of the projection exposure apparatus, wherein the measurement structure includes a pinhole stop (62) and a diffraction grating (64) arranged within an aperture (63) of the pinhole stop. Furthermore, the method includes measuring an intensity of a diffracted radiation generated at the diffraction grating (64) after interaction of the radiation with at least one optical element (22) of the projection exposure apparatus.

Abstract: A projection exposure system (10) for microlithography which includes: a mask holding device (14) holding a mask (18) with mask structures (20) disposed on the mask, a substrate holding device (36) holding a substrate (30), projection optics (26) imaging the mask structures (20) onto the substrate (30) during an exposure process, and a measurement structure (48) disposed in a defined position with respect to a reference element (16) of the projection exposure system (10), which defined position is mechanically uncoupled from the position of the mask holding device (14). The projection exposure system (10) also includes a detector (52) arranged to record an image of the measurement structure (48) imaged by the projection optics (26). The projection exposure system (10) is configured such that during operation of the projection exposure system (10) the imaging of the mask structures (20) and the imaging of the measurement structure (48) take place at the same time by the projection optics (26.

Abstract: Lithography apparatus and device manufacturing methods are disclosed in which means are provided for reducing the extent to which vibrations propagate between a first element of a projection system and a second element of a projection system. Approaches disclosed include the use of plural resilient members in series as part of a vibration isolation system, plural isolation frames for separately supporting first and second projection system frames, and modified connection positions for the interaction between the first and second projection system frames and the isolation frame(s).

Abstract: A projection exposure system and a method for operating a projection exposure system for microlithography with an illumination system are disclosed. The illumination system includes at least one variably adjustable pupil-defining element. The illumination stress of at least one optical element of the projection exposure system is determined automatically in the case of an adjustment of the at least one variably adjustable pupil-defining element. From the automatically determined illumination stress, the maximum radiant power of the light source is set or determined and/or in which an illumination system is provided with which different illumination settings can be made. Usage of the projection exposure system is recorded and, from the history of the usage, at least one state parameter of at least one optical element of the projection exposure system is determined.

Abstract: An optical apparatus and a manufacturing method using the optical apparatus are disclosed. The optical apparatus includes a stage supporting a substrate, first optical systems providing a first light onto the substrate, a gantry supporting the first optical systems to transfer them on the stage, and second optical systems disposed between the gantry and the stage and detecting displacement of the first optical systems. Each of the second optical systems includes a beam source generating a second light different with the first light, and sensor arrays for sensing the second light provided to the first optical systems to detect displacement of the first optical systems.

Abstract: A sensor system to measure a physical quantity, the system including a parallel detection arrangement with multiple detectors to allow measurements in parallel at different spatial locations, wherein the multiple detectors share a noise source, wherein the sensor system is configured such that the multiple detectors each output a signal as a function of the physical quantity, and wherein the sensor system is configured such that at least one detector responds differently to noise originating from the shared noise source than the one or more other detectors.

Abstract: While a wafer stage moves linearly in a Y-axis direction, surface position information of a wafer surface at a plurality of detection points set at a predetermined interval in an X-axis direction is detected by a multipoint AF system, and by a plurality of alignment systems arranged in a line along the X-axis direction, marks at different positions on the wafer are each detected, and a part of a chipped shot of the wafer is exposed by a periphery edge exposure system. This allows throughput to be improved when compared with the case when detection operation of the marks, detection operation of the surface position information (focus information), and periphery edge exposure operation are performed independently.