Abstract: A lithographic apparatus applies a device pattern at multiple fields across a substrate. A height map is decomposed into a plurality of components. A first height map component represents topographical variations associated with the device pattern. One or more further height map components represent other topographical variations. Using each height map component, control set-points are calculated according to a control algorithm specific to each component. The control set-points calculated for the different height map components are then combined and used to control imaging of the device pattern to the substrate. The specific control algorithms can be different from one another, and may have differing degrees of nonlinearity. The combining of the different set-points can be linear. Focus control in the presence of device-specific topography and other local variations can be improved.

Abstract: A lithography apparatus is provided. The lithography apparatus includes a reticle stage. The reticle stage includes a main base, an electrostatic chuck and a safety protecting device. The electrostatic chuck is disposed on the main base and configured to generate an electrostatic force for holding a reticle. The safety protecting device is connected to the main base and is configured to generate a pushing force toward the reticle when the electrostatic force generated by the electrostatic chuck is interrupted.

Abstract: A control system, of a plurality of heads, acquires grating correction information related to at least two of scales in a first grating group and scales in a second grating group, based on position information of a movable body measured using at least four heads irradiating measurement beams on at least two of the scales and scales. The grating correction information is used to control movement of the movable body using at least three heads irradiating at least two of the scales and scales.

Abstract: An immersion lithography apparatus has a controller configured to control a substrate table to move along an exposure route including in order: an entry motion in which the substrate moves from an off-substrate position at which the immersion space does not overlap the substrate to an on-substrate position at which the immersion space at least partially overlaps the substrate, a transfer motion in which the substrate table changes speed and/or direction and moves for at least a transfer time after the substrate moves to the on-substrate position, and an expose motion in which the substrate is scanned and the patterned beam is projected onto the substrate, wherein throughout the transfer motion at least a part of the immersion space overlaps the substrate and wherein the patterned beam is not projected onto the substrate during the entry motion and the transfer motion.

Abstract: The disclosure provides a device for aligning a component via a guide member. A head region of the guide member is secured at a fixing point of the component, and a foot region of the guide member is secured at a fixing point of an actuating element of an actuating facility. The actuating facility is configured to hold the guide member moveably in a movement axis for the purpose of transmitting a force to the component. An adjusting facility is provided to adjust the fixing point of the actuating element so that an angle between the movement axis and the course of the guide member between the fixing points is variable.

Abstract: The various embodiments presented herein relate to utilizing light in conjunction with an optical Fourier transform to examine and quantify roughness of a surface. The surface includes a plurality of flaked particles. The surface is illuminated with a light beam, wherein light reflected from the surface passes through an f-theta lens and is collected at a light sensitive array (LSA). The LSA comprises light sensitive pixels. For an arrangement where the flakes are conformal with the surface, a low degree of light scattering occurs at the surface. For a surface comprising tipped and/or tilted flakes, a correlating degree of scattering of the incident light beam occurs. The surface roughness is quantified based upon the distribution of angular reflections of the scattered light represented in an image formed through use of the LSA.

Abstract: An optical element assembly includes a base, and an element unit. The element unit includes (i) an optical element having an element central axis and an element perimeter; and (ii) an element connector assembly that couples the optical element to the base, the element connector assembly including a flexure assembly having an element flexure and a base flexure. A distal end of the element flexure is coupled to the optical element near the element perimeter, a distal end of the base flexure is coupled to the base, and a proximal end of the element flexure is coupled to a proximal end of the base flexure near the element central axis.

Abstract: The present disclosure generally relates to a method for performing semiconductor device fabrication, and more particularly, to improvements in lithographic overlay techniques. The method for improved overlay includes depositing a material on a substrate, heating a substrate in a chamber using thermal energy, measuring a local stress pattern of each substrate, wherein measuring the local stress pattern measures an amount of change in a depth of the deposited material on the substrate, plotting a plurality of points on a k map to determine a local stress pattern of the substrate, adjusting the thermal energy applied to the points on the k map, determining a sensitivity value for each of the points on the k map, and applying a correction factor to the applied thermal energy to adjust the local stress pattern.

Abstract: Embodiments relate to the field of image processing technologies, and in particular, to an image processing method and apparatus. In embodiments, when an image is being photographed, an exposure time that is required is first determined, and if the required exposure time is longer than a preset exposure time, the preset exposure time is used to photograph N second images, that is, and a final image is obtained by processing the N second images.

Abstract: According to various implementations, a computing device receives an image of a candidate mark and uses the image to create a profile of a feature of the mark. The computing device filters out, from the profile, all spatial frequency components except for a first band of spatial frequency components, resulting in a first filtered profile for the feature. The computing device repeats this filtering process for a second band of spatial frequency components, resulting in a second filtered profile for the feature, and may repeat this filtering process for further spatial frequency bands. The computing device compares the first filtered profile of the candidate mark with an equivalent first filtered profile of a genuine mark, and may repeat this process for further filtered profiles.

Abstract: A structured illuminating apparatus includes a branching unit branching an exit light flux from a light source into at least two branched light fluxes, an illuminating optical system making the two branched light fluxes to be respectively collected at mutually different positions on a pupil plane of an objective lens and making the two branched light fluxes to be interfered with each other to illuminate a specimen with an interference fringe of the two branched light fluxes, and an adjusting unit adjusting a height from an optical axis of the illuminating optical system to two collecting points formed on the pupil plane of the objective lens by the two branched light fluxes.

Abstract: A spatial light modulator has a plurality of mirror elements each of which is controllable into a first state in which the mirror element reflects incident light with a change in a phase thereof by a first phase and a second state in which the mirror element reflects the incident light with a change in the phase thereof by a second phase 180° different from the first phase; and a boundary portion arranged between the mirror elements, which changes the phase of the incident light by a third phase substantially (90°+k·180°) (where k is an integer) different from the first phase. In projecting a pattern with the use of the spatial light modulator, an error caused in the pattern can be reduced even if the light quantity of light passing a gap region between the optical elements in the spatial light modulator is large.

Abstract: There is provided an optical characteristic measuring method for measuring an optical characteristic of an optical system which forms, on a second plane, an image of an object arranged on a first plane, the optical characteristic measuring method including: arranging, on the first plane, a first area through which a measuring light passes or by which the measuring light is reflected; arranging a second area, through which the measuring light passes or by which the measuring light is reflected, on the second plane at a position corresponding to the first area; and detecting, via one of the first area and the second area, a light amount of the measuring light via the optical system and the other of the first area and the second area; wherein at least one of the first area and the second area has a shape such that a light amount, of the measuring light which passes or which is reflected via the optical system, is changed depending on the optical characteristic.

Abstract: A pattern is applied to a substrate by a lithographic apparatus as part of a lithographic manufacturing system. Structures are produced with feature sizes less than 10 nm. A target includes one or more gratings with a direction of periodicity. A detector captures one or more diffraction spectra, to implement small angle X-ray scattering metrology. One or more properties, such as linewidth (CD), are calculated from the captured spectra for example by reconstruction. The irradiation direction defines a non-zero polar angle relative to a direction normal to the substrate and defines a non-zero azimuthal angle relative to the direction of periodicity, when projected onto a plane of the substrate. By selecting a suitable azimuthal angle, the diffraction efficiency of the target can be enhanced by a large factor. This allows measurement time to be reduced significantly compared with known techniques.

Abstract: The present invention provides an exposure apparatus which transfers a pattern of a mask onto a substrate by exposing the substrate while scanning the mask and the substrate, the apparatus including a stage configured to hold the substrate and move, a control unit configured to control movement of the stage, a first measurement unit configured to measure a position, in a height direction, of a shot region of the substrate held by the stage before the shot region reaches an exposure area where the shot region is exposed, and a second measurement unit configured to measure the position of the shot region in the height direction prior to the first measurement unit.

Abstract: A liquid immersion exposure apparatus includes a projection system, a movable stage, an alignment system and a measurement member. The projection system has a last optical element, and projects a beam onto a substrate through an immersion liquid. The movable stage has a holder by which the substrate is held. The alignment system detects an alignment mark on the substrate not through the immersion liquid. The measurement member is provided on the movable stage, and has a reference mark to be detected by the alignment system not through the immersion liquid. The measurement member has a material to form the reference mark, the material being covered with a light-transmissive material. The movable stage is movable to a position so that the measurement member is under the projection system and a gap between the projection system and the measurement member is filled with the immersion liquid.

Abstract: The present invention provides an imprint apparatus which performs an imprint process of molding an imprint material on a substrate using a mold and forming a pattern on the substrate, the apparatus including a substrate chuck configured to hold the substrate, a protective plate configured to surround the substrate chuck, and a suction mechanism configured to suction at least a part of a gap between the substrate chuck and the protective plate, wherein while the suction mechanism suctions at least the part of the gap, the substrate chuck holds a plate which is different from the substrate on which the pattern is to be formed.

Abstract: A substrate table to support a substrate on a substrate supporting area, the substrate table having a heat transfer fluid channel at least under the substrate supporting area, and a plurality of heaters and/or coolers to thermally control the heat transfer fluid in the channel at a location under the substrate supporting area.

Abstract: An exposure device is disclosed, including: a light source (1), an illumination module (2), a mask stage (5), a projection objective module, an imaging position adjustment module (4) and a wafer stage (6), disposed sequentially along a direction of light propagation, the imaging position adjustment module (4) including a plurality of adjustment elements (410) arranged individually, the projection objective module including a plurality of projection objectives (3) each having an FoV in positional correspondence with a respective one of the plurality of adjustment elements (410). The imaging position adjustment module (4) ensures satisfactory imaging quality and FoV stitching quality of the projection objectives (3) by performing translation, magnification, focal plane and other adjustments on an image formed by the projection objective module. The projection objective module is simpler as it does not contain any component or mechanism for imaging position adjustment.

Abstract: An imprint apparatus which transfers a pattern of a mold onto a substrate is provided. The imprint apparatus includes a plurality of gas supply units each supplying a gas for substituting for air in the space between an original and the substrate. A control unit of the imprint apparatus controls the gas flow rate from each gas supply unit in accordance with the area of a portion where the original and the substrate overlap in a plan view after relatively moving the original and the substrate such that a target shot region on the substrate is positioned immediately under the pattern surface of the original.

Abstract: An immersion lithographic apparatus is provided having a substrate table including a drain configured to receive immersion fluid which leaks into a gap between an edge of a substrate on the substrate table and an edge of a recess in which the substrate is located. A thermal conditioning system is provided to thermally condition at least the portion of the recess supporting the substrate by directing one or more jets of fluid onto a reverse side of the section supporting the substrate.

Abstract: A movement area of a stage includes first-fifth areas. In the first area, three of four heads except for a first head respectively face three of four sections of a scale member except for a first section. In the second area, three of four heads except for a second head respectively face three of four sections except for a second section of the scale member. In the third area, three of four heads except for a third head respectively face three of four sections except for a third section of the scale member. In the fourth area, three of four heads except for a fourth head respectively face three of four sections of the scale member. In the fifth area, the four heads respectively face the four sections. The stage is moved from one of the first-fourth areas to another of those areas via the fifth area.

Abstract: A measurement system for a lithographic apparatus includes a sub-frame compliantly mounted on a reference frame. A measurement device, e.g. an alignment sensor, is mounted on the sub-frame. Soft mounting of the sub-frame isolates the alignment sensor from high-frequency disturbances, e.g. acoustic noise, by acting as a low-pass filter with a cut-off frequency, e.g. in the range of from 100 to 200 Hz.

Abstract: A temperature conditioning system for a lithographic apparatus. Temperature variations in an object cause object deformation which prevents the object being accurately positioned. Temperature condition systems use conduit systems, provided with fluid, in or on the object to control the temperature of the object to reduce object deformation. In this way, parts of the object can be more accurately positioned. However, acceleration of the object and the temperature conditioning system induces variation in pressure within the fluid inside the conduit system on or in the object, which may also cause object deformation. To provide an improved conduit system, the lithographic apparatus further includes a control system which is used to control the movement of the object based on measurements indicating pressure variation in the conduit.

Abstract: The invention relates to arrangements for actuating an element in a microlithographic projection exposure apparatus. In accordance with one aspect, an arrangement for actuating an element in a microlithographic projection exposure apparatus comprises a first number (nR) of degrees of freedom, wherein an adjustable force can be transmitted to the optical element in each of the degrees of freedom, and a second number (nA) of actuators, which are coupled to the optical element in each case via a mechanical coupling for the purpose of transmitting force to the optical element, wherein the second number (nA) is greater than the first number (nR). In accordance with one aspect, at least one of the actuators is arranged in a node of at least one natural vibration mode of the optical element.

Abstract: The present invention provides a measurement apparatus that measures a position of an object, the apparatus including a detector configured to detect a mark formed on the object and generate a detection signal, and a processor configured to obtain the position of the object based on the detection signal, wherein the processor is configured to obtain the position of the object based on a portion of the detection signal that is limited based on information about a tolerance regarding a measurement precision for the object.

Abstract: A coating film removing apparatus includes: a substrate holding mechanism that holds a substrate; an end surface detection mechanism that detects an end surface of the substrate; an end portion removing mechanism that removes an end portion of the coating film applied on the substrate; and a moving mechanism that moves the substrate holding mechanism or the end portion removing mechanism, wherein the end portion removing mechanism removes the end portion of the coating film applied on the substrate while the moving mechanism is relatively moving the substrate holding mechanism and the end portion removing mechanism according to the end surface of the substrate detected by the end surface detection mechanism.

Abstract: A movable body apparatus includes a base member, a movable body that is movable at least two-dimensionally, parallel to a predetermined plane, on the base member, a planar motor of a magnetic levitation method having a stator provided at the base member and a mover provided at the movable body, a measurement system that measures a position of the movable body in a direction parallel to the predetermined plane, and a controller. The controller limits movement of the movable body in the direction parallel to the predetermined plane by applying, to the movable body, a driving force generated by the planar motor, directed from the movable body to the base member in a direction intersecting the predetermined plane.

Abstract: A lithography system may include a wafer stage. The wafer stage may include a wafer mounting part configured to carry a wafer and configured to oscillate along a plane that is parallel to a top surface of the wafer in a wafer exposure process. The wafer stage may further include a driving device configured to affect an oscillatory movement of the wafer mounting part in the wafer exposure process.

Abstract: A lithographic projection apparatus is disclosed in which a space between the projection system and a sensor is filled with a liquid.

Abstract: The disclosure pertains to an optical apparatus, in particular for microlithography, that includes an optical module, a support structure and a connection apparatus. The connection apparatus includes at least one connection unit which includes a first connector part and a second connector part. The first connector part is connected to the optical module, and the second connector part is connected to the support structure.

Abstract: A lithography system includes a radiation source configured to generate an extreme ultraviolet (EUV) light. The lithography system includes a mask that defines one or more features of an integrated circuit (IC). The lithography system includes an illuminator configured to direct the EUV light onto the mask. The mask diffracts the EUV light into a 0-th order ray and a plurality of higher order rays. The lithography system includes a wafer stage configured to secure a wafer that is to be patterned according to the one or more features defined by the mask. The lithography system includes a pupil phase modulator positioned in a pupil plane that is located between the mask and the wafer stage. The pupil phase modulator is configured to change a phase of the 0-th order ray.

Abstract: Implementations disclosed herein generally relate to a light pipe, or kaleido, for homogenizing light such that the light is uniform once the light exits the light pipe. By reflecting the light inside the light pipe, light uniformity is increased. In one implementation, a light pipe for an image projection apparatus is provided. The light pipe comprises an elongated rectangular body having a refractive index that provides total internal reflection within the elongated rectangular body. The elongated rectangular body has an input face for accepting light into the elongated rectangular body. The input face disposed substantially orthogonal to a longitudinal axis of the elongated rectangular body. The elongated rectangular body has an output face for releasing light from the elongated rectangular body. The output face is disposed substantially orthogonal to the longitudinal axis. The elongated rectangular body has a twist along the longitudinal axis.

Abstract: A drive unit drives a wafer stage in a Y-axis direction based on a measurement value of an encoder that measures position information of the wafer stage in the Y-axis direction and based on information on the flatness of a scale that is measured by the encoder. In this case, the drive unit can drive the wafer stage in a predetermined direction based on a measurement value after correction in which a measurement error caused by the flatness of the scale included in the measurement value of the encoder is corrected based on the information on the flatness of the scale. Accordingly, the wafer stage can be driven with high accuracy in a predetermined direction using the encoder, without being affected by the unevenness of the scale.

Abstract: A projection objective includes at least four curved mirrors, which include a first curved mirror that is a most optically forward mirror and a second curved mirror that is a second most optically forward mirror, as defined along a light path. In addition, an intermediate lens element is disposed physically between the first and second mirrors, the intermediate lens element being a single pass type lens. The objective forms an image with a numerical aperture of at least substantially 1.0 in immersion.

Abstract: An illumination optical unit for projection lithography guides illumination light toward an object field and has a mirror array including a multiplicity of individual mirrors which are tiltable independently. A condenser optical unit transfers an arrangement plane of the mirror array into a pupil plane of the illumination optical unit. An optical hollow waveguide component of the illumination optical unit is upstream of the mirror array in the beam path of the illumination light and homogenizes and stabilizes an illumination light beam incident on the mirror array. An input coupling optical unit is upstream of the hollow waveguide component and couples an incident illumination light beam into the hollow waveguide component. A relay optical unit images a beam exit surface of the hollow waveguide component onto the mirror array. The illumination optical unit is insensitive to light source instabilities.

Abstract: A lithographic apparatus is disclosed that includes a projection system, and a liquid confinement structure configured to at least partly confine immersion liquid to an immersion space defined by the projection system, the liquid confinement structure and a substrate and/or substrate table. Measures are taken in the lithographic apparatus, for example, to reduce the effect of droplets on the final element of the projection system or to substantially avoid such droplet formation.

Abstract: A catadioptric projection objective for images an object field onto an image field via imaging radiation. The projection objective includes at least one reflective optical component and a measuring device. The reflective optical component, during the operation of the projection objective, reflects a first part of the imaging radiation and transmits a second part of the imaging radiation. The reflected, first part of the imaging radiation at least partly contributes to the imaging of the object field. The transmitted, second part of the imaging radiation is at least partly fed to a measuring device. This allows a simultaneous exposure of the photosensitive layer at the location of the image field with the imaging radiation and monitoring of the imaging radiation with the aid of the measuring device.

Abstract: A reading module includes: a light source for applying light to a document; an optical system for forming an image as image light from reflected light of the light applied from the light source to the document; and a sensor in which a plurality of sensor chips for converting the image light formed by the optical system to electric signals are disposed in adjacency to one another in a main scanning direction. The optical system includes: a mirror array in which a plurality of reflecting mirrors whose reflecting surfaces are aspheric surfaces are coupled in array in the main scanning direction; and apertures provided between the reflecting mirrors and the sensor chips, respectively, to regulate light quantity of the image light reflected by the individual reflecting mirrors. The specular-surface number of the reflecting mirrors is set to an integral multiple of the number of the sensor chips.

Abstract: The present invention provides a measurement apparatus that measures a position of an object, the apparatus including a detector configured to detect a mark formed on the object and generate a detection signal, and a processor configured to obtain the position of the object based on the detection signal, wherein the processor is configured to obtain the position of the object based on a portion of the detection signal that is limited based on information about a tolerance regarding a measurement precision for the object.

Abstract: A method and apparatus in which retroreflective materials and surfaces are used for determining the position, orientation and scale of work pieces in order to accurately place process beams thereon for the purpose of surface patterning or treatment.

Abstract: A microlithography projection exposure apparatus includes illumination optics configured to illuminate object field points of an object field in an object plane, and projection optics configured to image the object field onto an image field in an image plane. The illumination optics includes a multi-mirror array which includes a plurality of mirrors configured to adjust an intensity distribution in exit pupils associated with the object field points. The illumination optics also includes an optical system configured to produce, via an incoherent superposition of illumination rays, a temporal modification of a temporal stabilization of an illumination of the multi-mirror array. The optical system includes a mirror which includes a mirror surface. In addition, the optical system includes an actuator configured to produce a tilt of at least a portion of the mirror surface.

Abstract: A lithographic apparatus comprising a projection system, and a liquid confinement structure configured to at least partly confine immersion liquid to an immersion space defined by the projection system, the liquid confinement structure and a substrate and/or substrate table is disclosed wherein a measure is taken to reduce the effect of droplets and/or a liquid film on the last element of the projection system.

Abstract: A lithographic apparatus is described, the apparatus comprising: an illumination system configured to condition a radiation beam; a support constructed to support a patterning device, the patterning device being capable of imparting the radiation beam with a pattern in its cross-section to form a patterned radiation beam; a substrate table constructed to hold a substrate; and a projection system configured to project the patterned radiation beam onto a target portion of the substrate, wherein the apparatus further comprises an alignment system configured to perform, for one or more alignment marks that are present on the substrate: —a plurality of alignment mark position measurements for the alignment mark by applying a respective plurality of different alignment measurement parameters, thereby obtaining a plurality of measured alignment mark positions for the alignment mark; the apparatus further comprising a processing unit, the processing unit being configured to: —determine, for each of the plurality of a

Abstract: A process for use in configuring a projection optics lithography system comprising providing a determination of pupil amplitude and phase optimization for the projection optics, for use in configuring the projection optics in accordance with the determination.

Abstract: A lithographic apparatus including: a projection system with an optical axis; an enclosure with an ambient gas; and a physical component accommodated in the enclosure, wherein: the lithographic apparatus is configured to cause the physical component to undergo movement relative to the enclosure, in a predetermined direction and in a plane perpendicular to the optical axis; the lithographic apparatus is configured to let the physical component maintain a predetermined orientation with respect to the enclosure during the movement; the movement induces a flow of the ambient gas relative to the component; the physical component has a surface oriented perpendicularly to the optical axis; the component includes a flow direction system configured to direct the flow of ambient gas away from the surface.

Abstract: In one embodiment of the invention, a method for correcting a pattern placement on a substrate is disclosed. The method begins by detecting three reference points for a substrate. A plurality of sets of three die location points are detected, each set indicative of an orientation of a die structure, the plurality of sets include a first set associated with a first dies and a second set associated with a second die. A local transformation is calculated for the orientation of the first die and the second on the substrate. Three orientation points are selected from the plurality of sets of three die location points wherein the orientation points are not set members of the same die. A first global orientation of the substrate is calculated from the selected three points from the set of points and the first global transformation and the local transformation for the substrate are stored.

Abstract: Embodiments of the present disclosure generally relate to systems and methods for performing photolithography processes. In one embodiment, a photolithography system includes a plurality of image projection systems each having an extendable lens, and a plate having a plurality of openings. Each extendable lens is configured to be extended through a corresponding opening of the plurality of openings during operation. The plate includes one or more elements disposed adjacent each opening and each lens includes one or more elements formed thereon. The one or more elements formed on the plate and the one or more elements formed on the lens are utilized to measure one or more distances between the lens and the plate. Any deviation of the measured distance from a reference distance indicates that the lens has been shifted. Measures to compensate for the shifting of the lens will be performed.

Abstract: A lithographic apparatus including: a projection system to project radiation onto a substrate supported on a substrate stage, during an exposure phase; a sensing system to sense a property of the substrate on the stage during a sensing phase; and a positioning system to determine a position of the stage relative to a reference system via a radiation path between the stage and the reference system, wherein the apparatus is configured to control stage movement relative to the reference system in the sensing phase and to control other movement relative to the reference system during the exposure phase; the stage or reference system having an outlet to provide a gas curtain to reduce ingress of ambient gas into the path; and the apparatus is operative such that a characteristic of the gas curtain is different in at least part of the sensing phase compared to in the exposure phase.

Abstract: A lithographic apparatus including a fluid handling structure configured to contain immersion fluid in a space adjacent to an upper surface of the substrate table and/or a substrate located in a recess of the substrate table, a cover having a planar main body that, in use, extends around a substrate from the upper surface to a peripheral section of an upper major face of the substrate in order to cover a gap between an edge of the recess and an edge of the substrate, and an immersion fluid film disruptor, configured to disrupt the formation of a film of immersion fluid between an edge of the cover and immersion fluid contained by the fluid handling structure during movement of the substrate table relative to the fluid handling structure.