Abstract: A lithographic apparatus includes an illumination system configured to condition a radiation beam and a support constructed to support a patterning device. The patterning device may be capable of imparting the radiation beam with a pattern in its cross-section to form a patterned radiation beam. The lithographic apparatus further includes a substrate table constructed to hold a substrate and a projection system configured to project the patterned radiation beam onto a target portion of the substrate. The lithographic apparatus may be provided with a composite material wherein a layer of carbon fiber and a layer of titanium is provided within the composite.

Abstract: An apparatus and method maintain immersion fluid in the gap adjacent to the projection lens during the exchange of a work piece in a lithography machine. The apparatus and method include an optical assembly that projects an image onto a work piece and a stage assembly including a work piece table that supports the work piece adjacent to the optical assembly. An environmental system is provided to supply and remove an immersion fluid from the gap between the optical assembly and the work piece on the stage assembly. After exposure of the work piece is complete, an exchange system removes the work piece and replaces it with a second work piece. An immersion fluid containment system maintains the immersion liquid in the gap during removal of the first work piece and replacement with the second work piece.

Abstract: An immersion exposure apparatus and method expose a substrate with an exposure beam via an optical assembly and via immersion liquid. A first stage on which a substrate is mounted is positioned below the optical assembly so that the immersion liquid is maintained in a space between the optical assembly and the substrate. The first stage is replaced below the optical assembly with a second stage while maintaining the immersion liquid below the optical assembly. The replacing includes arranging a movable member, which is independently movable relative to the first and second stages and away from below the optical assembly, to face the optical assembly so as to substantially maintain the immersion liquid below the optical assembly while the first and second substrate stages are away from below the optical assembly. A control system controls a drive system to move the first and second stages.

Abstract: A substrate treating apparatus includes a treating section for treating substrates, and an interface section disposed adjacent the treating section and adjacent an exposing machine provided separately from the apparatus. The interface section has a first treating-section-side transport mechanism, a second treating-section-side transport mechanism, and an exposing-machine-side transport mechanism. Each of the first and second treating-section-side transport mechanisms is arranged to receive the substrates from the treating section, pass the substrates to the exposing-machine-side transport mechanism, receive the substrates from the exposing-machine-side transport mechanism and pass the substrates to the treating section.

Abstract: Lithography processes are provided. The lithography process includes installing a reticle masking (REMA) part having a REMA open region in a lithography apparatus, loading a reticle including at least one reticle chip region in which circuit patterns are disposed into the lithography apparatus, and sequentially exposing a first wafer field, which includes a first chip region corresponding to the reticle chip region, and a second wafer field, which includes a second chip region corresponding to the reticle chip region, of a wafer to rays using the reticle and the REMA part to transfer images of the circuit patterns onto the wafer. An edge boundary of the REMA open region transferred on the first wafer field is located on a scribe lane region between the first and second chip regions while the first wafer field is exposed. Methods of manufacturing a semiconductor device using the lithography process are also provided.

Abstract: The technology disclosed relates to methods and systems that can be used to reduce visible artifacts know as mura. In particular, it relates to producing alignment marks by physically modifying appearance of a layer of exposure or radiation sensitive material on a workpiece, then using those alignment marks or transferred direct or inverted images of those marks to realign a writing coordinate system between exposure writing passes, following physical movement of the workpiece within the writing system. The physical modifications described include mechanically pressing a mark into the layer, using a laser to ash or ablate the layer, or applying an ink or other substance to the surface of the laser.

Abstract: While a wafer stage linearly moves in a Y-axis direction, a multipoint AF system detects surface position information of the wafer surface at a plurality of detection points that are set at a predetermined distance in an X-axis direction and also a plurality of alignment systems that are arrayed in a line along the X-axis direction detect each of marks at positions different from one another on the wafer. That is, detection of surface position information of the wafer surface at a plurality of detection points and detection of the marks at positions different from one another on the wafer are finished, only by the wafer stage (wafer) linearly passing through the array of the plurality of detection points of the multipoint AF system and the plurality of alignment systems, and therefore, the throughput can be improved.

Abstract: A dual-stage exchange system for a lithographic apparatus comprises a silicon chip stage (10) operating in an exposure workstation (6) and a silicon chip stage (12) operating in a pre-processing workstation (7). Each silicon chip stage (10, 12) is supported by a six-freedom micro-motion stage, respectively. The silicon chip stage (10, 12) and the six-freedom micro-motion stage form a silicon chip stage group. The two silicon chip stage groups are provided on the same rectangular base stage (1) and suspended on an upper surface (2) of the base sage by air bearings. A double-freedom driving unit (21a, 21b, 22a, 22b) is provided on each edge of the base stage (1), respectively. The six-freedom micro-motion stage of the silicon chip stage group has an upper layer driver and a lower layer driver, capable of achieving six-freedom control.

Abstract: A pellicle mounting method is provided. The method includes aligning a mounting apparatus with a top surface of a pellicle frame, the mounting apparatus having a continuous duct extending therethrough and a plurality of contact pins projecting from the mounting apparatus. The method also includes introducing a pressurizing fluid into the continuous duct that causes each of the plurality of contact pins to engage the top surface of the pellicle frame with a substantially equal force, a combined force of the plurality of contact pins urging a bottom surface of the pellicle frame against a top surface of a photomask, the combined force being adjustable based on a pressure within the continuous duct. Further, the method includes adjusting the pressure within the continuous duct until the pressure is approximately equal to a pre-determined optimal pressure.

Abstract: A chuck, chuck control system, lithographic apparatus and method of using a chuck are disclosed.

Abstract: The present invention provides a substrate processing apparatus for performing a process of reducing warpage of a substrate, comprising a substrate stage configured to hold the substrate, a pressing member including a portion formed to press a peripheral portion of the substrate against the substrate stage, an obtaining unit configured to obtain information indicating a shift between a center of a region where a pattern is formed on the substrate and a center of the substrate, and a controller configured to control relative positions of the substrate stage and the pressing member based on the information obtained by the obtaining unit, such that the portion of the pressing member presses the peripheral portion of the substrate.

Abstract: A servo control system to control a position of an object supported by a movable support includes a first measurement system to measure a position of the movable support, a comparative device to provide an error signal based on the comparison between a measured movable support position and a desired movable support position, a controller unit to provide a control signal based on the error signal, and an actuator configured to actuate the movable support based on the control signal. The servo control system further includes a slip compensation device to compensate a slip between the object and the movable support, the slip compensation device including a second measurement system to measure an object position with respect to the movable support, and an addition device to add a slip compensation signal to the measured movable support position or the error signal based on the measured object position.

Abstract: A lithographic projection apparatus is disclosed which includes a cleaning station. Several embodiments of the cleaning station are disclosed. In an embodiment, measures are taken to avoid contact of a cleaning fluid with the final element of the projection system. In an embodiment, measures are taken to avoid foaming of the cleaning fluid. The use of a thermally isolated island is also disclosed as well as its optimal position.

Abstract: Disclosed is a smaller and lighter stage device which can be applied to a device such as a length measurement SEM for inspecting and/or evaluating a semiconductor, and in which the effect of a magnetic field on an electron beam can be reduced. Linear motors 110, 111, 112, 113 are disposed on four sides of a base 104 to be distanced from an electron beam projection position (the center of the stage device), respectively. The base 104 has dimensions substantially equivalent to minimum dimensions determined by the size of a top table 101 and a movable stroke. Linear motor stators 110, 112 are configured to have a “C-shaped” structure whose opening faces outside of the stage device, respectively. Further, a movable table is coupled to the top table via linear guides 107, 109 composed of a nonmagnetic material or roller mechanisms composed of a nonmagnetic material.

Abstract: An immersion lithographic apparatus is disclosed that includes a detector to measure a distance between a substrate support structure and/or a substrate and a fluid handling system and/or to detect when an item is present between the fluid handling system and a top surface of the substrate and/or substrate support structure. The detector may use information of an electrical property of the fluid provided by the fluid handling system to measure the distance. The detector may measure variation in resistance and/or in capacitance between an electrode of the fluid handling system and an electrode of the substrate and/or substrate support structure.

Abstract: An immersion lithography apparatus is provided that includes an energy source, a projection optical system, a stage, a showerhead including an immersion liquid supply device and an immersion liquid discharge device that produces a flow of liquid within an exposure zone, and a cleaning device that cleans a portion of the projection optical system having been contacted with the immersion liquid by means of a cleaning gas. In an embodiment, the cleaning device includes an ozone generation unit produces a flow of ozone into the exposure zone. In embodiments, the apparatus includes a stage that includes a dose sensor and/or an ultra-violet light source. A method for insitu cleaning of a final lens element within an immersion lithography system having an immersion fluid showerhead that provides immersion fluid to an exposure zone of the immersion lithography system is also provided.

Abstract: A plurality of heads configuring an encoder system is arranged on a wafer table, and positional information of a wafer table in the XY plane is measured, based on an output of a head opposed to a scale plate (diffraction grating). And, a relative position (including relative attitude and rotation) of each head with the wafer table is measured herein by a measurement system arranged inside the head. Accordingly, by correcting the positional information based on the information of the relative position which has been measured, a highly precise measurement of the positional information of the wafer table becomes possible even in the case when the position (attitude, rotation) of the head changes with the movement of the wafer table.

Abstract: A lithographic apparatus is described that comprises a support structure to hold an object. The object may be a patterning device or a substrate to be exposed. The support structure comprises a chuck, on which the object is supported, and an array of shear-compliant elongated elements normal to the chuck and the stage, such that first ends of the elongated elements contact a surface of the chuck and second ends of the elongated elements contact a stage. Through using the array of elongated elements, a transfer of stress between the stage and the chuck is substantially uniform, resulting in minimization of slippage of the object relative to the surface of the chuck during a deformation of the chuck due to the stress.

Abstract: A lithographic projection apparatus includes a beam production system to provide a beam of radiation, pattern the beam of radiation, and project the patterned beam onto a target portion of a substrate, a support table including protrusions to support an article, a detector to detect height deviations of the protrusions, a material removing device arranged to modify a height of the protrusion material, a controller coupled between the detector and the material removing device, wherein material removing device includes a removal tool selected from the group consisting of a mechanical polishing device, a magneto rheological finishing tool, and a single or multipoint diamond tool.

Abstract: A method and a device are described for producing copies/replica of a volume reflection hologram wherein a holographic film (4) is guided over a drum with polygon cross-section having at least two planar (polygon) master surfaces (3) to each of which at least one master (7) is attached in the circumferential direction, where the film is brought into contact with at least one master hologram (7) and its entire surface is exposed to laser. It is essential that to at least one of the master surfaces (5) with the film guided over it, a laser exposure unit (22) is assigned which allows full exposure of the respective master surface to parallel, coherent laser beams (6), and that the at least one exposure unit (22) follows section wise the rotational movement of the drum by a splitting angle with equal velocity and exposes the corresponding master surface (5) to then be reset quickly again and perform the same angular displacement and exposure together with the next master surface.

Abstract: An apparatus for exposing a substrate to an energy in a vacuum includes a substrate stage having a mirror surface; a mirror configured to deflect a light into a Z axis direction; a measuring device configured to measure the stage position in the Z axis direction with the light in which the mirror surface is irradiated; a driving device configured to move the measuring device so that the mirror surface is irradiated with the light; an optical system configured to project the energy onto the substrate; and a cooling device including a radiation plate (arranged between the optical system and the stage in the Z axis direction and having a first opening which the energy passes and a second opening which the light passes), including a cooler configured to cool the first radiation plate, and configured to perform radiation cooling of the substrate.

Abstract: A semiconductor manufacturing apparatus according to the present embodiment includes a vacuum chamber. A stage mounts a semiconductor substrate thereon within the vacuum chamber. An electrostatic chuck fixes the semiconductor substrate onto the stage. A sensor detects a height of a surface of the semiconductor substrate fixed onto the stage by the electrostatic chuck. A processor determines whether the surface of the semiconductor substrate is distorted based on the height of the surface of the semiconductor substrate. The processor calculates correction values for a pattern transferred onto the surface of the semiconductor substrate by exposure based on the height of the surface of the semiconductor substrate when the surface of the semiconductor substrate is distorted. An exposure part exposes the surface of the semiconductor substrate to light using the correction values.

Abstract: The present disclosure provides a method that includes capturing a first image of a mask in a first exposure apparatus using a first exposure source and a first imaging sensor; capturing a second image of the mask in a second exposure apparatus using a second exposure source and a second imaging sensor; comparing the first image of the mask and the second image of the mask for a difference therebetween; and determining an action according to the difference.

Abstract: An exposure apparatus exposes a substrate through a projection optical system and a liquid immersion area formed by liquid supplied to an image plane side of the projection optical system. The apparatus includes a stage which has a substrate holding portion that holds the substrate, and which is movable with respect to the projection optical system on the image plane side of the projection optical system. The stage includes a recovery portion that recovers the liquid entered into a gap between an edge of the substrate held by the substrate holding portion and an edge of an upper surface of the stage provided outside the substrate holding portion and which contacts the liquid immersion area. The recovery portion includes a flow passage that recovers the liquid entered via the gap and a porous member or a mesh member arranged in the flow passage.

Abstract: A damping apparatus that supports and dampens a stage apparatus that positions and drives a stage to a target position is provided herein. The damping apparatus including a support plate part, a support force generating means, and a first controlling means. The support plate part supports the stage apparatus. The support force generating means exerts a damping action by applying a support force to the support plate part in the vertical directions. The first controlling means uses the acceleration of the stage, which is derived from a target track, to the target position, to control the support force generated by the support force generating means so as to compensate for forces that both occur as a result of the acceleration of the stage and cause the support plate part to tilt. The present invention controls vibration and the tilt of a base plate with high precision.

Abstract: An electrostatic clamp for use in holding an object onto a supporting table, the electrostatic clamp comprising: a multi-layer film comprising an electrode defined in an electrically conducting layer which is positioned between electrically insulating layers.

Abstract: An exposure apparatus and a fabrication method thereof include an obtaining unit configured to obtain data of a first imaging position at which light from a first pattern having, as a longitudinal direction thereof, a first direction perpendicular to an optical axis of a projection optical system forms an image via the projection optical system, and data of a second imaging position at which light from a second pattern having, as a longitudinal direction thereof, a second direction which is not parallel to the first direction and is perpendicular to the optical axis forms an image via the projection optical system, when the first pattern and the second pattern are respectively placed on an object plane of the projection optical system, and a control unit configured to control a stage so that a substrate is positioned at a target position of the substrate along the optical axis.

Abstract: A substrate table positioning device that is supported by four bearing elements is provided. The substrate table positioning device also includes a balance mass. Two of the bearing elements support the base frame in such a way that they can move in a vertical direction independently of the other bearing elements. This can be achieved by using a hinge. This structure of substrate table positioning device has a higher lowest Eigen frequency of oscillation than that of substrate table positioning devices supported by three bearing elements. As such, the balance mass is not excited by typical vibrations that occur in the lithographic apparatus. This enables better positional control of the substrate table. It also enables at least some of the dimensions of the frame elements of the balance mass to be reduced.

Abstract: During the transition from a state where one of wafer stages is located in an area below a projection optical system where a liquid immersion area is formed to a state where the other of the wafer stages is located in the area, both the wafer stages are made to be in proximity or in contact in a Y-axis direction in a state of being shifted in an X-axis direction, by making an overhang section and a stepped section that are arranged respectively on the wafer stages be engaged, and both the wafer stages are simultaneously driven in the Y-axis direction while maintaining this state. Accordingly, the liquid immersion area is delivered between the two wafer stages via the overhang section and leakage of a liquid that forms the liquid immersion area is restrained.

Abstract: A coordinate measuring machine includes a three-dimension precision transfer equipment and a measuring equipment that measures an object. The three-dimension precision transfer equipment includes a movable body, first to third driving bodies, first to third drive mechanisms that drive to move the first to third driving bodies forward and backward in a first direction, a second direction and a vertical direction that are mutually orthogonal, and first to third laser interferometers that detect a displacement of the movable body. The first to third driving bodies include first to third joints that forms a static-pressure clearance between the first to third driving bodies and the movable body. Laser paths of the first to third laser interferometers extend in a manner to respectively penetrate the first to third driving bodies and the first to third joints.

Abstract: An electrical connector comprises a high voltage pad and a high voltage plate. When connected to another electrical connector, the two plates, which are at the same voltage as the pads, form a region of high voltage in which the field is low. The pads are positioned in that region. An electrostatic clamp of an EUV lithographic apparatus may have such a pad and plate, for connecting to the electrical connector. By placing the interconnection in a low field region, triple points (points of contact between a conductor, a solid insulator and a gas) may be present in that region.

Abstract: A lithographic apparatus includes an illumination system constructed and arranged to condition a radiation beam, and a support constructed and arranged to support a patterning device. The patterning device is capable of imparting the radiation beam with a pattern in its cross-section to form a patterned radiation beam. The apparatus also includes a substrate table constructed and arranged to hold a substrate, and a projection system constructed and arranged to project the patterned radiation beam onto a target portion of the substrate. The substrate table includes a chuck having a plurality of protrusions constructed and arranged to support corresponding parts of a bottom surface of a wafer. The top surface of at least one of the protrusions includes a plurality of elements that define a reduced contact area between the substrate and the top surface of the protrusion.

Abstract: A first positional information of a wafer stage is measured using an interferometer system such as, for example, a Z interferometer. At the same time, a second positional information of the wafer stage is measured using a surface position measurement system such as, for example, two Z heads. Moving average is applied to a difference between the first positional information and the second positional information for a predetermined measurement time to set a coordinate offset, which is used to inspect the reliability of output signals of the surface position measurement system. When the output signals are confirmed to be normal, servo control of the wafer stage is performed using a sum of the first positional information and the coordinate offset. According to this hybrid method, drive control of the wafer stage which has the stability of the interferometer and the precision of the Z heads becomes possible.

Abstract: While an exposure processing is performed to a wafer held by a fine movement stage supported by a coarse movement stage in an exposure station, at least a part of a measurement processing to a wafer held by another fine movement stage supported by another coarse movement stage and an exchange of a wafer held by yet another fine movement stage on a center table is concurrently performed. Because of this, exposure with a higher throughput becomes possible, even when compared with a conventional exposure apparatus which concurrently performs an exposure processing to a wafer on a wafer stage, and processing such as wafer exchange and alignment on another stage.

Abstract: A stage assembly for positioning a device includes: (i) a stage that retains the device; (ii) a base; (iii) a mover assembly that moves the stage along a first axis, along a second axis, and along a third axis relative to the base; (iv) a magnetic sensor system that monitors the movement of the stage along the first, second and third axes, the magnetic sensor system generating a magnetic sensor signal; (v) a second sensor system that monitors the movement of the stage along the first, second and third axes, the second sensor system generating a second sensor signal; and (vi) a control system that controls the mover assembly using at least one of the magnetic sensor signal and the second sensor signal.

Abstract: The present invention provides a detection apparatus including a detector configured to detect a mark including a plurality of patterns arrayed on an object in a first direction, the apparatus comprising a support configured to support at least a part of the detector, wherein the support is configured to support the at least the part such that a displacement of the at least the part in a second direction corresponding to the first direction is smaller than a displacement of the at least the part in a third direction perpendicular to the second direction.

Abstract: An immersion lithographic apparatus has a pressure sensor configured to measure the pressure of immersion liquid in a space between the substrate and a projection system. A control system is responsive to a pressure signal generated by the pressure sensor and controls a positioner to exert a force on the substrate table to compensate for the force exerted on the substrate table by the immersion liquid.

Abstract: A lithographic apparatus is described that comprises a support structure to hold an object. The object may be a patterning device or a substrate to be exposed. The support structure comprises a chuck, on which the object is supported, and an array of shear-compliant elongated elements normal to the chuck and the stage, such that first ends of the elongated elements contact a surface of the chuck and second ends of the elongated elements contact a stage. Through using the array of elongated elements, a transfer of stress between the stage and the chuck is substantially uniform, resulting in minimization of slippage of the object relative to the surface of the chuck during a deformation of the chuck due to the stress.

Abstract: In an exposure apparatus of a liquid immersion exposure method, a liquid immersion area is formed on the upper surface of a wafer by liquid supplied in a space formed with a projection optical system, and on a moving table holding the wafer, a plurality of encoder heads is placed. Of the plurality of encoder heads, a controller measures positional information of the moving table within an XY plane using an encoder head which is outside a liquid immersion area. This allows a highly precise and stable measurement of positional information of the moving table.

Abstract: A positioning apparatus includes a moving member, an actuator, and a controller. The moving member can move in at least a first direction. The actuator is provided along the first direction. The controller controls a current applied to the actuator in order to support the weight of the moving member. The bending rigidity of the moving member in the first direction is greater than the bending rigidity of the moving member in a second direction perpendicular to the first direction.

Abstract: Provided is an interferometer system that irradiates an object to be measured with measuring light to thereby measure the position of the object to be measured. The interferometer system includes a laser light source; an interferometer configured to separate laser light emitted from an emission opening of the laser light source into the measuring light and reference light; and an optical path protecting member configured to surround an optical axis such that the laser light passes through the inside thereof and of which one opening is in contact with the emission opening.

Abstract: An exposure apparatus comprises a liquid immersion system, a first mover, and a prescribed member. The exposure apparatus exposes a substrate via an optical member and a liquid. The liquid immersion system performs supply and recovery of the liquid. The first mover can move in a first area, and can hold the liquid between itself and the optical member. The prescribed member is removed from the first mover when the first mover withdraws from a position opposing the optical member, and can hold the liquid between itself and the optical member.

Abstract: A substrate carrying mechanism includes: a base; a substrate holding member placed on the base and capable of holding a substrate and of being advanced and retracted relative to the base; four or more detecting units respectively for detecting different parts of the edge of a substrate held by the substrate holding member when the substrate holding member holding a substrate is retracted; and a controller that determines whether or not a notch formed in the edge of the substrate has been detected by one of the detecting units, on the basis of measurements measured by the four or more detecting units and corrects an error in a transfer position where the substrate is to be transferred to the succeeding processing unit on the basis of measurements measured by the detecting units excluding the one detecting unit that has detected the notch of the substrate.

Abstract: A lithographic apparatus having a table including a target and/or a sensor and a liquid displacing device to displace liquid from the target and/or sensor using a localized gas flow is disclosed. The liquid displacement device may be positioned at various positions, e.g. mounted to a liquid handling device at an exposure station, adjacent or in a transfer path between the exposure station and a measurement station, at a load/unload station or adjacent a sensor.

Abstract: An object suitable for a plasma cleaning treatment in a plasma cleaning device, the object including a first outer surface area; a second outer surface area, wherein the object is constructed and arranged to cooperate with a removable cover such that the cover is connectable to the object to cover the second outer surface area, and wherein the object connected with the removable cover is adapted to be cleaned in the plasma cleaning device such that the plasma cleaning device is not exposed to particles of the second outer surface area and wherein the first outer surface area is cleaned in the plasma cleaning device.

Abstract: An electrical field is applied through an extreme ultraviolet (EUV) photoresist layer along a direction perpendicular to an interface between the EUV photoresist layer and an underlying layer. Secondary electrons and thermal electrons are accelerated along the direction of the electrical field, and travel with directionality before interacting with the photoresist material for a chemical reaction. The directionality increases the efficiency of electron photoacid capture, reducing the required EUV dose for exposure. Furthermore, this directionality reduces lateral diffusion of the secondary and thermal electrons, and thereby reduces blurring of the image and improves the image resolution of feature edges formed in the EUV photoresist layer. The electrical field may be generated by applying a direct current (DC) and/or alternating current (AC) bias voltage across an electrostatic chuck and a conductive plate placed over the EUV photoresist layer with a hole for passing the EUV radiation through.

Abstract: A leaf spring to be mounted between two objects, the leaf spring configured to have a high stiffness in two orthogonal directions, and a relative low stiffness in other degrees of freedom, wherein the leaf spring has a substantially panel-shaped body, the leaf spring including a first mounting location at or near the center of the panel-shaped body to mount the leaf spring to a first of the two objects, wherein the leaf spring includes one or more second mounting locations at or near the circumference of the panel-shaped body to mount the leaf spring to the second of the two objects, and elongate grooves and/or slits in the panel shaped body between the first mounting location and the second mounting location, the grooves and/or slits running in at least two non-orthogonal directions in the plane of the two orthogonal directions.

Abstract: When a wafer on a fine movement stage supported by a coarse movement stage is exposed via a projection optical system with an illumination light at an exposure station, a position of the fine movement stage within an XY plane is measured with good precision by a measurement system. Further, when an alignment to a wafer on a fine movement stage supported by a coarse movement stage is performed at a measurement station, a position of the fine movement stage within an XY plane is measured with good precision by a measurement system.

Abstract: An inspection apparatus for measuring a property of a substrate (W), includes a base frame, a substrate table (51) to hold the substrate, an illumination system arranged to direct a beam of radiation onto the substrate and a sensor arranged to detect radiation reflected off the substrate. Two balanced positioning systems displace the substrate table and sensor relative to the base frame in several directions. Each balanced positioning system includes a balance mass (59, 61), a bearing arrangement (65) to movably support the balance mass and tracks effective to guide the displacement in each direction. A motor arrangement causes the displacement in each direction. The balance mass is positioned relative to the track arrangement such that the centers of gravity of each balance mass and the substrate table or the sensor are substantially aligned in the direction substantially perpendicular to the plane including the direction of displacement.

Abstract: An optical imaging arrangement includes an optical projection system and a support structure system. The optical projection system includes a group of optical elements configured to transfer, in an exposure process using exposure light along an exposure light path, an image of a pattern of a mask supported by a mask support structure onto a substrate supported by a substrate support structure. The mask support structure and the substrate support structure form a primary source of vibration. The support structure system includes a base support structure, an optical element support structure and at least one secondary vibration source support structure of a secondary vibration source other than the primary source of vibration. The optical element support structure supports the optical elements.