Abstract: A defect inspection apparatus and method includes utilizing an irradiation optical system that focuses a beam flux emitted from a laser light source and formed into a slit-shaped beam so as to irradiate the beam onto the surface of the substrate to be inspected, utilizing a detection optical system that detects light from the substrate that has been irradiated with the slit-shaped beam, and utilizing a signal processor that processes a signal output from the detection optical system. The irradiation optical system includes a cylindrical lens for focusing the beam that has been emitted from the laser light source onto the substrate to be inspected, as the slit-shaped beam, wherein the cylindrical lens is disposed so as to obtain a distance between an incidence surface or emitting surface thereof and the slit-shaped beam upon the substrate to be inspected to be equal to a focal distance of the cylindrical lens.

Abstract: A method and apparatus of inspecting a sample, in which the sample is inspected under a plurality of inspection conditions, and inspection data obtained by inspecting the sample under each of the plurality of inspection conditions and position information on the sample of the inspection date in correspondence with the respective inspection conditions, are stored. The inspection data for each of the plurality of inspection conditions is against each other by the use of the position information on the sample to determine a position to be inspected in detail, and an image of the sample at a position to be inspected in detail is obtained. The obtained image is classified, the inspection condition of the sample by the use of information of classification of the image is determined.

Abstract: The invention is directed at a method and system of detecting defects in a transparent media such as a piece of glass. The method comprises the steps of transmitting light from a light source towards the transparent media and then detecting defects in the transparent media by scanning the light as it is reflected or passes through the transparent media. The method and system may operate in any one of a dark field mode, a bright field mode for scanning or a bright field mode for inspecting.

Abstract: Methods and systems for detecting defects on a reticle are provided. One method includes printing a single die reticle in first areas of a wafer using different values of a parameter of a lithography process and at least one second area using a nominal value of the parameter. The method also includes acquiring first images of the first areas and second image(s) of the at least one second area. In addition, the method includes separately comparing the first images acquired for different first areas to at least one of the second image(s). The method further includes detecting defects on the reticle based on first portions of the first images in which variations in the first images compared to the at least one second image are greater than second portions of the first images and the first portions that are common to two or more of the first images.

Abstract: A method is provided for visual inspection of an array of interferometric modulators in various driven states. This method may include driving multiple columns or rows of interferometric modulators via a single test pad or test lead, such as test pad, and then observing the array for discrepancies between the expected optical output and the actual optical output of the array. This method may particularly include, for example, driving a set of non-adjacent rows or columns to a state different from the intervening rows or columns and then observing the optical output of the array.

Abstract: An object is to provide a flat surface inspection apparatus that can prevent sliders from being damaged and detect micro defects. A flat surface inspection apparatus includes: a measured subject; a stage that supports the measured subject; a spindle that rotates the stage; a first part having light sources applying light beam onto the measured subject, a scattered-light-detecting section, a signal processing section that converts the scattered light into information about a first defect, and a first memory section that stores therein the information about the first defect; and a second part having sliders mounted with a contact sensor that detects a second defect smaller than the first defect, a loading/unloading mechanism that flies the slider over the measured subject, a slider control section that controls the loading/unloading mechanism based on the information about the first defects and second defects.

Abstract: An optical system may include an objective having at least four mirrors including an outermost mirror with aspect ratio <20:1 and focusing optics including a refractive optical element. The objective provides imaging at numerical aperture >0.7, central obscuration <35% in pupil. An objective may have two or more mirrors, one with a refractive module that seals off an outermost mirror's central opening. A broad band imaging system may include one objective and two or more imaging paths that provide imaging at numerical aperture >0.7 and field of view >0.8 mm. An optical imaging system may comprise an objective and two or more imaging paths. The imaging paths may provide two or more simultaneous broadband images of a sample in two or more modes. The modes may have different illumination and/or collection pupil apertures or different pixel sizes at the sample.

Abstract: A spatial mask printer may be used in conjunction with an optical inspection tool. The tool can be used to obtain a Fourier image of an inspected object, and a filter mask image can be designed to block certain aspects of the object's image in the Fourier plane corresponding to repetitive aspects of the imaged object. The filter mask image can then be printed and used in the tool during the inspection process. The mask image may be designed by hand or by computer and may be stored for later use. Filters may be automatically placed into the optical path of the inspection tool by a filter wheel, or may be housed in other filter banks. The printer may be configured to operate in a clean room environment, and may be integrated into the optical inspection tool.

Abstract: According to one embodiment, a pattern measuring method includes: irradiating, from a plurality of different incident directions, electromagnetic waves on a periodical structure pattern in which a plurality of patterns are periodically arrayed and partially overlap one another; detecting the electromagnetic waves scattered by the periodical structure pattern and detecting scattering profiles of the electromagnetic waves; and measuring, based on the detected scattering profiles, a pattern shape of the periodical structure pattern. Each of the different incident directions is an incident direction in which the patterns included in the periodical structure pattern do not partially overlap each other.

Abstract: A method and apparatus of detecting a defect by inspecting a specimen in which a surface of a specimen on which plural patterns are formed is illuminated with an elongated shape light flux from one of plural directions which are different in elevation angle by switching an optical path of the light flux emitted from an illuminating light source in accordance with a kind of defect to be detected. Plural optical images of the specimen illuminated by the elongated shape light flux are captured with plural image sensors installed in different elevation angle directions by changing an enlarging magnification in accordance with a density of the pattern formed on the sample in an area irradiated with the illuminating elongated shape light flux. A defect on the specimen is detected by processing the images captured by the plural image sensors.

Abstract: When size of a defect on an increasingly miniaturized pattern is obtained by defect inspection apparatus in the related art, a value is inconveniently given, which is different from a measured value of the same defect by SEM. Thus, a dimension value of a defect detected by defect inspection apparatus needs to be accurately calculated to be approximated to a value measured by SEM. To this end, size of the defect detected by the defect inspection apparatus is corrected depending on feature quantity or type of the defect, thereby defect size can be accurately calculated.

Abstract: Methods and systems for determining the quality of a substrate are disclosed. One or more substrates may be examined to determine whether bending is present at the edge of a substrate. The substrate may be accepted if it is determined that bending is not present at the edge of the substrate. The substrate may be rejected if it is determined that bending is present at the edge of the substrate.

Abstract: There is provided a defect inspecting apparatus, which includes an irradiating optical system of irradiating a light beam on a surface of a face plate of a disk mounted on a stage to scan the surface of the face plate, a light-receiving optical system of receiving specular reflection light that has transmitted a shading filter with a shading difference that changes an amount of the specular reflection light from the face plate resulting from the light beam irradiated on the disk, and a processing unit of identifying defects on the surface of the face plate from the change in amount of the specular reflection light that has transmitted a filter, so that a size and a height of the defect can be measured with high accuracy when irregular defects are determined, which is not easily achieved by a conventional lens effect.

Abstract: An addressable micromirror array is employed in conjunction with circuit topology navigation software to rapidly wavelength sample selected measurement points in an integrated circuit region.

Abstract: An inspecting apparatus and method including first and second illuminating units for illuminating a surface of a specimen to be inspected with different incident angles and first and second detecting optical units arranged at different elevation angle directions to the surface of the specimen for detecting images of the specimen illuminated by the first and second illuminating units.

Abstract: A defect inspection apparatus is capable of inspecting an extremely small defect present on the top and edge surfaces of a sample such as a semiconductor substrate or a thin film substrate with high sensitivity and at high speed. The defect inspection apparatus has an illumination optical system, a plurality of detection optical units and a signal processor. One or more of the detection optical units receives either light diffracted from an edge portion of the sample or light diffracted from an edge grip holding the sample. The one or more of the detection optical units shields the diffracted light received by the detection optical unit based on a signal obtained by monitoring an intensity of the diffracted light received by the detection optical unit in order to inspect a sample portion located near the edge portion and a sample portion located near the edge grip.

Abstract: An inspection method is provided and includes acquiring at least one inspection data set. Each inspection data set comprises inspection data for a component. The inspection method further includes mapping the inspection data set onto a three-dimensional (3D) model of the component, to generate a 3D inspection model for the component, and validating the inspection data against the 3D model of the component using at least one validation criterion. A multi-modality inspection method is also provided and includes acquiring multiple inspection data sets corresponding to multiple inspection modalities for a component and fusing the inspection data sets to form a fused data set. The multi-modality inspection method further includes mapping the fused data set onto a 3D model of the component to generate a 3D multi-modality inspection model for the component.

Abstract: An automated object inspection system is presented. The inspection system includes an imaging system to produce at least two images of said object having different optical properties and an analyzer coupled to the imaging system to receive the images and to perform a variety of inspection operations on said images. The imaging system may produce images of the object under inspection in the visible range having varying exposure values. A vision engine included in the analyzer may combine said images through an algorithmic process into one image having high light dynamic range. Alternatively, the imaging system may produce images of the object in the visible or non-visible electromagnetic range. The analyzer may perform inspection routines on said images. An imaging system capable of producing digital video is presented, wherein each frame of video produced by said camera is composed of multiple images having different optical properties.

Abstract: A defect inspection apparatus for inspecting defects on an inspecting object includes an illuminator which irradiates a beam of light on the inspecting object, a photo-detector which detects rays of light from the inspecting object due to the irradiation of the light beam by the illuminator, a defect detector which detects a defect by processing a signal obtained through detection by the photo-detector, a characteristic quantity calculator which calculates a characteristic quantity related to a size of the defect, and a defect size calculator which uses a relation between size and characteristic quantity which is calculated by an optical simulation and calculates a size of the detected defect.

Abstract: The present invention provides an inspecting apparatus for photovoltaic devices which electrifies the photovoltaic devices in a forward direction thereof to make the photovoltaic devices emit electro-luminescence light and which has a simple-structured and cheap darkroom. The inspecting apparatus of the present invention includes a darkroom 110 provided with a flat upper surface 111, a transparent plate 112 which is provided in the upper surface of the darkroom for disposing the photovoltaic devices as an inspecting object 200, a camera 120 which is provided in the darkroom and a driving mechanism to move the camera in the darkroom.

Abstract: A defect inspection apparatus and method includes a darkfield illumination optical system which conducts darkfield illumination upon the surface of a sample with irradiation light having at least one of wavelength band, a darkfield detection optical system which includes a reflecting objective lens for converging the light scattered from the surface of the sample that has been darkfield-illuminated with the irradiation light having the at least one wavelength band, and imaging optics for imaging onto a light-receiving surface of an image sensor the scattered light that the reflecting objective lens has converged, and an image processor which, in accordance with an image signal obtained from the image sensor of the darkfield detection optical system, discriminates defects or defect candidates present on the surface of the sample.

Abstract: An inspection apparatus for containers, comprising a first illumination device which directs light having first characteristic properties onto the base of the container, a second illumination device which directs light having second characteristic properties, which differ at least partially from the first characteristic properties, onto the base of the container, and at least one image recording device which receives at least a portion of the light directed onto the base of the container and transmitted by the latter. At least the second illumination device illuminates the base of the container in an indirect manner.

Abstract: Systems and methods that process a plurality of surgical instruments for cleaning and/or packaging. A device identifies a robot-ready insert having a predetermined configuration for accepting at least one type of surgical instrument. The surgical instruments are identified and oriented according to type using an automated apparatus. Specialized tools are also provided for automatically opening and closing surgical instruments, flipping instruments and assisting in the processing and maintenance of surgical instruments. The automated apparatus then places each of the surgical instrument types in one or more predetermined areas of the insert, configured to accept a predetermined set of surgical instrument types.

Abstract: An inspection apparatus includes a wafer stage for carrying a wafer, an illumination module which irradiates an inspection beam on the wafer carried on the wafer stage, a detection module which detects scattering rays or reflection rays from the wafer on the wafer stage and outputs an image signal, a coordinates control module which stores information about the arrangement of individual inspection areas on the wafer, and an imperfect area recognition module which recognizes, on the basis of the inspection area arrangement information stored in the coordinates control module, an imperfect inspection area interfering with a wafer edge.

Abstract: Disclosed are methods and apparatus for inspecting a sub-resolution assist features (SRAF) on a reticle. A test flux measurement for a boundary area that encompasses a width and a length portion of a test SRAF is determined, and at least one reference flux measurement for one or more boundary areas of one or more reference SRAF's is determined. The test flux measurement is compared with the reference flux measurements. The comparison is used to then determine whether the test SRAF is undersized or oversized. If the test SRAF is determined to be oversized, it may then be determined whether the test SRAF is defective based on the comparison using a first threshold.

Abstract: An apparatus for creating a sub-wavelength image in the farfield. In an example embodiment, the apparatus includes a far-field superlens that is adapted to generate a sub-wavelength image or a sub-diffraction-limited image at a far field distance from a negative-index material included in the superlens. The example far-field superlens includes a positive-index material and an adjacent positive-index material. The negative-index material has an output aperture at a first surface. A second surface or interface is positioned at a far field distance from the negative-index material such that a cavity or gap is formed between the second surface and the first surface, wherein the second surface represents an imaging surface. The gap may be filled with a dielectric material or may include a vacuum or air.

Abstract: In the conventional contaminant particle/defect inspection method, if the illuminance of the illumination beam is held at not more than a predetermined upper limit value not to give thermal damage to the sample, the detection sensitivity and the inspection speed being in the tradeoff relation with each other, it is very difficult to improve one of the detection sensitivity and the inspection speed without sacrificing the other or improve both at the same time. The invention provides an improved optical inspection method and an improved optical inspection apparatus, in which a pulse laser is used as a light source, and a laser beam flux is split into a plurality of laser beam fluxes which are given different time delay to form a plurality of illumination spots. The scattered light signal from each illumination spot is isolated and detected by using a light emission start timing signal for each illumination spot.

Abstract: A surface scanning device for inspecting a product surface includes an illumination module and an image acquisition device. The illumination module is designed to illuminate the product surface with illumination of substantially uniform illuminance. The illumination module is also designed to configure a configurable range of angles of incidence of the illumination on the product surface. The image acquisition device images the illuminated area.

Abstract: An illumination device and method for inspecting objects having microscopic features is provided. The device includes an illuminator which provides a solid angle of angularly specific illumination defining an illumination angle, selected by a user from among a continuous range of possible illumination angles. The device further includes an object inspector which inspects the object illuminated by the illuminator. The illuminator may include an illumination source, a light concentrator, an illumination angle selector, disposed along a light path between the illumination source and the object inspector. The illumination angle selector may have a first position in which directly-reflected light propagates toward the object plane and a second position in which no light both selected by the illumination angle selector and directly reflected from the object plane enters the collecting lens. Rather, in the second position, only scattered light from the object plane enters the collecting lens.

Abstract: A three-dimensional profile inspecting apparatus includes at least two optical inspecting apparatuses and a tilt angle adjusting mechanism. The tilt angle adjusting mechanism is equipped with the at least two optical inspecting apparatuses so as to adjust the tilt angles of the at least two optical inspecting apparatuses. When the tilt angles of the optical inspecting apparatuses are changed, the focuses of the optical inspecting apparatuses remain at a single position and a subject to be inspected is within the fields of view of the optical inspecting apparatuses. The three-dimensional profile of the subject can be obtained by building the images collected by the two optical inspecting apparatuses.

Abstract: In a foreign matter inspection apparatus comprising: irradiating unit for irradiating inspection light to an inspection area of an article to be inspected; intensity detecting unit for detecting intensity of either reflected light or scattered light, which is generated from the inspection area by irradiating thereto the inspection light; position detecting unit for detecting a position of either the reflected light or the scattered light within the inspection area; and deciding unit for deciding whether or not a foreign matter is present within the inspection area; the foreign matter inspection apparatus is comprised of: display unit capable of displaying thereon both a threshold image in which the threshold value is indicated over an entire area of the inspection area, and a detection sensitivity image indicated by being converted from the threshold image.

Abstract: Methods of obtaining dopant and damage depth profile information are disclosed using modulated optical reflectivity (MOR) measurements. In one aspect, the depth profile is constructed using information obtained from various measurements such as the junction depth, junction abruptness and dopant concentration. In another aspect, a full theoretical model is developed. Actual measurements are fed to the model. Using an iterative approach, the actual measurements are compared to theoretical measurements calculated from the model to determine the actual depth profile.

Abstract: A method allows analyzing and describing the reflective properties of a three-dimensionally structured original surface. The topology of the original surface is determined and the topological data are stored in the form of a depth map in a first data record and evaluated with respect to the influence of the data on the reflective properties. Each surface element is assigned a reflective value in accordance with the evaluation and the value is stored in a second data record and made available to other machining or inspection systems. There, the reflection values of the second data record are divided into classes and the depth values of the first data record, assigned to the classified reflection values, are varied in accordance with the classification. Finally, the changed depth values are employed as parameters for electronically controlling a tool in order to machine the artificially produced surface.

Abstract: Apparatus for generating optical radiation includes a laser, which is configured to operate in multiple transverse modes simultaneously so as to generate an input beam, which is characterized by a first speckle contrast. The transverse modes of the input beam are optically mixed so as to generate an output beam have a second speckle contrast, which is substantially less than the first speckle contrast.

Abstract: A dark field inspection system that minimizes the speckle noise due to sample surface roughness can include a plurality of beam shaping paths for generating a composite, focused illumination line on a wafer. Each beam shaping path can illuminate the wafer at an oblique angle. The plurality of beam shaping paths can form a ring illumination. This ring illumination can reduce the speckle effect, thereby improving SNR. An objective lens can capture scattered light from the wafer and an imaging sensor can receive an output of the objective lens. Because the wafer illumination occurs at oblique angles, the objective lens can have a high NA, thereby improving optical resolution of the imaging sensor, and the resulting signal level.

Abstract: A course material that is applied to a substrate during fabrication of a composite item is inspected by a system that includes a vision assembly. The vision assembly includes an area light, a line generator, a sensor, and an image processor. The area light illuminates an area of the course material. The line generator generates a line of illumination across the area. The sensor captures an image of the area. The image processor analyzes the image. The image processor is configured to identify debris on the course material in response to the area light being activated and the image processor is configured to identify placement aberrations in response to the line generator being activated.

Abstract: A defect inspection apparatus includes a movable stage for mounting a substrate having circuit patterns as an object of inspection, an irradiation optical system which irradiates a slit-shaped light beam from an oblique direction to the circuit patterns of the substrate, a detection optical system which includes an image sensor for receiving reflected/scattered light from the substrate by irradiation of the slit-shaped light beam and converting the received light into a signal, and an image processor which processes the signal. The irradiation optical system includes a cylindrical lens and a coherency reduction optical system, which receives the light beam and emits a plurality of slit-shaped light sub-beams which are spatially reduced in coherency in a light-converging direction of the cylindrical lens. The cylindrical lens focuses the plurality of slit-shaped light sub-beams into the slit-shaped light beam irradiated to the surface of the substrate.

Abstract: A method for inspecting a region, including irradiating the region via an optical system with a pump beam at a pump wavelength. A probe beam at a probe wavelength irradiates the region so as to generate returning probe beam radiation from the region. The beams are scanned across the region at a scan rate. A detector receives the returning probe radiation, and forms an image of the region that corresponds to a resolution better than pump and probe Abbe limits of the optical system. Roles of the pump and probe beams may be alternated, and a modulation frequency of the pump beam may be changed, to produce more information. Information extracted from the probe signal can also differentiate between different materials on the region.

Abstract: The invention relates to an apparatus for determining optical surface properties of workpieces, comprising a housing, in the interior of which there is provided a carrier on which the workpiece be arranged, and comprising a radiation device which directs radiation onto the workpiece in a predefined emission direction (E). According to the invention, the housing has in at least one wall an observation opening, through which a region of the workpiece illuminated by the radiation device can be observed in a predefined observation direction (B).

Abstract: The condition of a glazing panel is investigated using a viewing device to view an illuminating electromagnetic radiation profile at a target zone. Data relating to the viewed radiation profile is compared to datum data, to produce an output related to the condition of the glazing panel at the target zone.

Abstract: A device to inspect a non-pattern wafer includes a light source to emit light that reflected from a wafer. A judgment unit converts the detected light into a quantitative measured value to determine whether the wafer is faulty. The wafer comprises a first region and a second region. The detection unit sequentially detects lights reflected from the first and second regions of the wafer, and a judgment unit converts the lights reflected from the first and second regions of the wafer into first and second quantitative measured values, respectively. The second region of the wafer is determined to be faulty by comparing the second measured value with a first reference value, wherein the first reference value is calculated using an average value between the first and second measured values, and a characteristic value that indicates distribution of the first and second measured values.

Abstract: An apparatus for detection of the existence of a film on a surface comprises a lens, a light emitter and a light sensor. The light emitter is preferably disposed in spaced relation to the lens and is configured to emit light toward the lens such that the light is incident thereupon. The light sensor is also preferably disposed in spaced relation to the lens and is mounted adjacent to the light emitter. The light sensor is configured to measure light reflected back from the lens. The presence or absence on the film on the surface is based upon the amount (i.e., intensity) of light that is reflected back from the lens. The apparatus may further comprise a temperature sensor or atmospheric sensor for measuring a temperature of the lens and atmospheric conditions in order to determine whether conditions are appropriate for the formation of ice, frost and other frozen contaminants.

Abstract: A method and system for defect localization includes: (i) receiving a test structure that includes at least one conductor that is at least partially covered by an electro-optically active material; (ii) providing an electrical signal to the conductor, such as charge at least a portion of the conductor; and (iii) imaging the test structure to locate a defect.

Abstract: A defect generated during a nano-imprint process is inspected by a scatterometry method. The scatterometry method is to illuminate the surface of a medium with light having a plurality of wave lengths by means of a first illuminator through a half mirror and an objective lens and cause light reflected on the medium to be incident on a spectrometer through the objective lens and the half mirror. A second illuminator illuminates a foreign material or scratch on the surface of the medium from an oblique direction with respect to the surface of the medium. Light is scattered from the foreign material or scratch and detected by first and second detectors. The first detector is placed in a direction defining a first elevation angle with the surface of the medium. The second detector is placed in a direction defining a second elevation angle with the surface of the medium.

Abstract: A device that is usable to inspect the surface of a material uses an inspection system which includes an optical unit. That optical unit can register the light which is reflected by the surface to be inspected. An illumination system, that uses at least two light sources, provides the light. The optical unit and the illumination system are connected to a control unit. The at least two light sources are arranged spaced at a distance from each other and both emit light directed to a recording region of the optical unit. The optical unit is oriented toward the surface to be inspected and at least one of the illumination light sources can be subdivided into several individual light sources. The control unit controls at least two of the illumination system light sources that are arranged at a distance from each other or the respective individual light sources of at least one of the illumination sources both selectively and independently of each other.

Abstract: Computer-implemented methods that include correlating a backside defect with a frontside defect detected on a specimen are provided. The defects are correlated if a portion of the backside defect on the backside of the specimen is opposite to a portion of the frontside defect on the frontside of the specimen. In particular, the defects are correlated if the portion of the backside defect is aligned with the portion of the frontside defect along an axis perpendicular to the frontside and the backside of the specimen. The method may also include altering a parameter of a process tool in response to the backside defect to reduce frontside defects on additional specimen processed in the process tool. Computer-implemented methods for analyzing data representing spatial characteristics of backside defects detected on a specimen to classify the backside defects are also provided. Analyzing the data may include spatial signature analysis of the data.

Abstract: A defect inspection device, which inspects defects such as foreign materials existing on a specimen on which a circuit pattern of wiring or the like is formed, is provided with an illumination optical system which illuminates a plurality of different areas the specimen with a plurality of linear shaped beams and an image forming optical system that forms images of the plurality of the illuminated areas on a plurality of detectors, and the detectors are configured to receive a plurality of polarization components substantially at the same time and individually, wherein the polarization components are different from each other and are contained in each of the plurality of the optical images formed by the image forming optical system, thereby detecting a plurality of signals corresponding to the polarization components and carrying out the inspection at high speed under a plurality of optical conditions.

Abstract: At least one exemplary embodiment is directed to an illuminating apparatus, configured to uniformly illuminate a surface of an object, and includes a light-guiding member configured to guide light emitted from a source to a surface to be illuminated, and a reflecting member disposed between the light-guiding member and the surface to be illuminated. The reflecting member includes a pair of reflection surfaces disposed so as to face each other in a long side direction of the surface to be illuminated, and reflects light emitted from the light-guiding member in directions having directional components parallel to a short side direction of the surface to be illuminated toward the surface to be illuminated.

Abstract: A defect inspection apparatus is capable of inspecting an extremely small defect present on the top and edge surfaces of a sample such as a semiconductor substrate or a thin film substrate with high sensitivity and at high speed. The defect inspection apparatus has an illumination optical system, a plurality of detection optical units and a signal processor. One or more of the detection optical units receives either light diffracted from an edge portion of the sample or light diffracted from an edge grip holding the sample. The one or more of the detection optical units shields the diffracted light received by the detection optical unit based on a signal obtained by monitoring an intensity of the diffracted light received by the detection optical unit in order to inspect a sample portion located near the edge portion and a sample portion located near the edge grip.

Abstract: Light from a light source becomes two illumination beams by a beam splitter. The beams are irradiated onto a semiconductor wafer from two mutually substantially orthogonal azimuthal angles having substantially equal elevation angles to form illumination spots. When the sum of scattered, diffracted, and reflected lights due to the illumination beams is detected, influence of the anisotropy which a contaminant particle and a defect existing in the wafer itself or thereon have with respect to an illumination direction, can be eliminated.