Abstract: An imaging system and method for leakage detection uses schlieren imaging to locate and characterize a flow of pressurized gas with a refractive index different than ambient air. In particular, a schlieren imaging system includes a collimated light, a knife-edge spatial filter and a 4F telescopic imaging system is used to create an image of a device under test (DUT). The DUT is pressurized and monitored for leaks. When a leak is present and in the monitored plane of the DUT, contrast variation illustrates the presence, location and character of the leak. For example, a waterproof/leakproof mobile device may be evaluated for leakage between layers of modules, such as leaks in the housing of a waterproof electronics case. This detection can allow identification and characterization of the leak point via visual identification.

Abstract: A distribution unit of a particle detection system initiates a particle collection process to dislodge one or more surface particles from a surface of an article based on a stream including at least one of solid CO2 particles or CO2 droplets. The dislodged surface particles are collected on a surface of a substrate having a pre-determined initial state including initial surface particles of the substrate. A measurement indicating a particle number concentration of detectable surface particles on the substrate after the particle collection process is completed is obtained. An initial particle number concentration of the initial surface particles of the pre-determined initial state is identified. A number of particles transported away from the surface of the article is determined based on the obtained measurement and the identified initial particle concentration.

Abstract: The semiconductor failure analysis device includes: a light source configured to generate irradiation light with which the semiconductor device is irradiated; a solid immersion lens disposed on an optical path of the irradiation light; a light detection unit configured to receive reflected light and to output a detection signal according to the reflected light; an optical system 6 disposed between the light source and the solid immersion lens to emit the irradiation light to the semiconductor device via the solid immersion lens and disposed between the solid immersion lens and the light detection unit to emit the reflected light received via the solid immersion lens to the light detection unit. The light source emits the irradiation light having a center wavelength of 880 nm or more and 980 nm or less. The solid immersion lens is formed of GaAs.

Abstract: A system includes an illumination system, an optical element, and a detector. The optical system is implemented on a substrate. The illumination system includes first and second sources and first and second generators. The illumination system generates a beam of radiation. The first and second sources generate respective first and second different wavelength bands. The first and second resonators are optically coupled to respective ones of the first and second sources and narrow respective ones of the first and second wavelength bands. The optical element directs the beam toward a target structure. The detector receives radiation from the target structure and to generate a measurement signal based on the received radiation.

Abstract: A method of planning the manufacture of component carriers includes defining a set of final product parameters as a target for component carriers to be manufactured, ranking the process parameters concerning their impact on the final product parameters, selecting a subset of higher ranked process parameters, inputting the selected subset of process parameters for processing by an artificial intelligence module, and determining an action plan for the manufacturing based on an output of the artificial intelligence module, where the product parameters are influenceable by a set of process parameters settable during the manufacturing method.

Abstract: This application provides a tab image acquisition device, system, and method. The tab image acquisition device includes an image acquisition apparatus, where the image acquisition apparatus includes: a first mobile module movable in a first direction; a second mobile module movable in a second direction, where the second mobile module is installed on the first mobile module and the second direction intersects the first direction; an image acquisition module installed on the second mobile module; and a prism module installed on the first mobile module, where the prism module has a reflective surface, and the reflective surface is configured to change an angle of incident light on a tab whose image is to be acquired, so that the incident light enters the image acquisition module.

Abstract: The present disclosure provides a method for processing defect information of a product, which includes the following steps of: acquiring defect information on a current film layer and defect information on historical film layers; determining whether defect information exists at a target location of the historical film layer if defect information exists at a target location of the current film layer; if defect information exists for a corresponding location to the target location in at least one of the historical film layers, deleting the defect information detected at the target location in the current film layer; and if no defect information exists for the target location in any of the historical film layers, retaining the defect information detected at the target location in the current film layer.

Abstract: Method of inspecting hazardous area equipment (10, 110, 210). The method is a non-invasive inspection of an electrical or electronic component of the hazardous area equipment (10, 110, 210). The non-invasive inspection includes a radiographic inspection of the equipment (10, 110, 210).

Abstract: With respect to an inference method performed by at least one processor, the method includes inputting, by the at least one processor, into a learned model, second non-processed image data and second parameter data of a simulator, and inferring, by the at least one processor using the learned model, second processed image data. The learned model has been trained so that first processed image data, obtained as an output in response to first non-processed image data and first parameter data of the simulator for the first non-processed image data being input, approaches first simulator processed image data, obtained as a result of the simulator for the first non-processed image data by using the first parameter data.

Abstract: An optical sorter includes an intermittent light source configured to intermittently emit light toward a plurality of sorting targets in transit, an optical sensor configured to detect the light associated with one sorting target among the plurality of sorting targets in transit during a plurality of intermittent light scan periods, a determination part configured to determine a foreign object and/or a defective product with respect to the one sorting target based on a signal acquired by the optical sensor, and a light source control part configured to control the intermittent light source.

Abstract: Systems and methods are provided for performing photothermal dynamic imaging. An exemplary method includes: scanning a sample to produce a plurality of raw photothermal dynamic signals; receiving the raw photothermal dynamic signals of the sample; generating a plurality of second signals by matched filtering the raw photothermal dynamic signals to reject non-modulated noise; and performing an inverse operation on the second signals to retrieve at least one thermodynamic signal in a temporal domain.

Abstract: A beam of light is directed from a light source at a wafer on a chuck. The beam of light is reflected off the wafer toward a 2D imaging camera. Movable focus lenses in the path of the beam of light can independently change the illumination conjugate and the collection conjugate. A structured mask in an illumination path can be used and the beam of light can be directed through apertures in the structured mask. A gray field image of a wafer in a zone without direct illumination is generated using the 2D imaging camera and locations of defects on the wafer can be determined using the gray field image.

Abstract: A structure repair method selection system includes a repair evaluation unit that obtains an evaluation score for a structure after repair, a database that has data of a captured image of the structure and the evaluation score, an image acquisition unit that acquires a captured image of a target structure to be repaired, a damage detection unit that detects damage from the captured image, a similar damage extraction unit that extracts similar damage similar to the damage by using the database, and a repair method presentation unit that presents, based on the evaluation score, repair methods used for the similar damage. Also provided are a repair method selection method that uses the structure repair method selection system, and a repair method selection server.

Abstract: Disclosures relate to a sensor system and arrangements having different sized removable spacers. The spacers may be mixed and matched as needed or desired to compensate for misalignment conditions. Further, different spacer combinations and adjustments may be guided by a security management computing device. Variations in configurations of mounting surfaces, such as door and window assemblies, may be accommodated. Alignment of a transmitter or a receiving device, e.g., a magnetic device, with respect to a transmitter or receiving device despite misalignment of the components due to, for example, uneven surfaces of a door or a window, or a respective frame may be achieved.

Abstract: The disclosure relates to a test system for optically checking an electrical line, including a test area for arranging the electric line; a plurality of prisms surrounding the test area; a camera directed at the prisms, which is designed to optically detect the electric line arranged in the test area through the prisms from different sides; a shielding mechanism, the curved inner contour of which encloses the test area and the prisms at least in the radial direction; an air duct, which is at least indirectly connected to a nozzle directed towards the test area and which is designed to apply a cleaning air stream to at least some prism surfaces facing the test area and thereby to entrain dirt particles present on these prism surfaces; and further air ducts opening into an area of the inner contour of the shielding.

Abstract: A terahertz scanner for detecting irregularities, such as chemical or structural variations, in a sample and methods of use thereof are described. The described terahertz scanner and algorithms allow for direct, high-sensitivity, high-throughput, and non-invasive detection of irregularities that range from chemical contaminant to material defects in a variety of substrates and settings.

Abstract: A method for managing electromagnetic interference (EMI) includes: obtaining electromagnetic radiation from a device, disposed in an internal volume of a data processing device, while the internal volume is EMI isolated and after the device performs a function; making a determination that the device disposed in the internal volume has an optical state associated with the electromagnetic radiation; and performing a first action set based on the determination, in which the electromagnetic radiation is obtained through a boundary of the internal volume.

Abstract: A device for an analogue modeling experiment of a geological structure under a hypergravity field of a large-scale centrifuge is provided. A bottom plate is placed on a basket of the centrifuge and mounted with screw rod components; screw rods are arranged in parallel with the bottom plate; diverters, screw rod supporting columns, sliding guide rails and a motor are arranged on the bottom plate; output shafts at two ends of the motor are respectively connected to the two diverters; the diverters are connected with one end of the corresponding screw rod; a fixed baffle plate is connected with the screw rods and is embedded with the sliding guide rails; a detachable baffle plate is arranged at a lower part of the fixed baffle plate and has a lower part connected with a swing baffle plate through a hinge; and a curved table is arranged on the bottom plate.

Abstract: A video measurement system for measuring a test object comprising an imaging system comprising an imager having an imaging pupil, the imager arranged for viewing at least a portion of a silhouette of the test object by receiving light transmitted by the test object over a first angular extent; and an illumination system comprising (i) an illumination source; (ii) output having a second angular extent in object space that is larger than the first angular extent received by the imaging pupil; and (iii) a substrate arranged to diffuse light from the illumination source, the substrate having an axial centerline and a light obscuration element, wherein the light obscuration element is at least approximately coaxial to the axial centerline of the substrate, and wherein the pupils of the illumination and imaging systems are in at least approximately conjugate image planes.

Abstract: A spectroscopic metrology system includes a spectroscopic metrology tool and a controller. The controller generates a model of a multilayer grating including two or more layers, the model including geometric parameters indicative of a geometry of a test layer of the multilayer grating and dispersion parameters indicative of a dispersion of the test layer. The controller further receives a spectroscopic signal of a fabricated multilayer grating corresponding to the modeled multilayer grating from the spectroscopic metrology tool. The controller further determines values of the one or more parameters of the modeled multilayer grating providing a simulated spectroscopic signal corresponding to the measured spectroscopic signal within a selected tolerance. The controller further predicts a bandgap of the test layer of the fabricated multilayer grating based on the determined values of the one or more parameters of the test layer of the fabricated structure.

Abstract: Current inspection processes employed for pipeline networks data acquisition aided with manually locating and recording defects/observations, thus leading labor intensive, prone to error and a time-consuming task thereby resulting in process inefficiencies. Embodiments of the present disclosure provide systems and methods for that leverage artificial intelligence/machine learning models and image processing techniques to automate log and data processing, reports and insights generation thereby reduce dependency on manual analysis, improve annual productivity of survey meterage and bring in process and cost efficiencies into overall asset health management for utilities, thereby enhancing accuracy in defect identification, analysis, classification thereof.

Abstract: The welding operation monitoring system includes an image capturing device that is disposed on a side opposite to a side to which the plasma flow is supplied out of a pipe inside and a pipe outside of the strip-shaped steel sheet formed in a tubular shape, and is configured to capture a color image including a plasma flow over the V-shaped region; and a welding operation monitoring device that is configured to generate a specific color component image obtained by extracting a specific color component from the color image, and specifies a V-shaped display region, which is a region corresponding to the V-shaped region within the color image, on the basis of the V-shaped region shown in the specific color component image, thereby analyzing a state of the welding operation.

Abstract: A system has detectors configured to receive a beam of light reflected from a wafer. For example, three detectors may be used. Each of the detectors is a different channel. Images from the detectors are combined into a pseudo-color RGB image. A convolutional neural network unit (CNN) can receive the pseudo-color RGB image and determine a size of a defect in the pseudo-color RGB image. The CNN also can classify the defect into a size category.

Abstract: A process and apparatus for applying noise reducer elements to tyres. Each noise reducer element has an anchoring surface coated with an adhesive layer. The anchoring surface is illuminated with a reference radiation. The radiation emitted by the anchoring surface is detected; and a digital image representative of the anchoring surface is determined as a function of the emitted radiation. Each pixel of the digital image is associated with a respective brightness value representative of the amount of adhesive present in an area of the anchoring surface corresponding to such each pixel. One or more noise reducer elements are applied on the radially inner surface of a tyre.

Abstract: A structure for, and method of, forming a first optoelectronic circuitry that generates an optical signal, a second optoelectronic circuitry that receives an optical signal, and a loopback waveguide that connects the output from the first optoelectronic circuitry to the second optoelectronic circuitry on an interposer substrate are described. The connected circuits, together comprising a photonic integrated circuit, are electrically tested using electrical signals that are provided via probing contact pads on the PIC die. Electrical activation of the optoelectrical sending devices and the subsequent detection and measurement of the optical signals in the receiving devices, in embodiments, provides information on the operability or functionality of the PIC on the die at the wafer level, prior to die separation or singulation, using the electrical and optical components of the PIC circuit.

Abstract: An artificial neural network-based method for detecting a surface type of an object includes: receiving a plurality of object images, wherein a plurality of spectra of the plurality of object images are different from one another and each of the object images has one of the spectra; transforming each object image into a matrix, wherein the matrix has a channel value that represents the spectrum of the corresponding object image; and executing a deep learning program by using the matrices to build a predictive model for identifying a target surface type of the object. Accordingly, the speed of identifying the target surface type of the object is increased, further improving the product yield of the object.

Abstract: A floor panel connection system for attaching a floor panel to an airframe is disclosed. The connection system includes an offset flange insert comprising a base portion, a flange portion, and an interconnect portion. The base portion of the insert is configured to be received in a hole in an edge region of the floor panel and includes an opening that is sized to receive a fastener. The interconnect portion extends laterally from the base portion such that when the edge portion of the floor panel is overlapping a lateral edge portion of the airframe, the flange portion of the insert is beyond the lateral edge portion. The flange portion is also configured to be bonded to a bottom surface of the floor panel beyond the lateral edge portion of the airframe.

Abstract: A structure for, and method of, forming a first optoelectronic circuitry that generates an optical signal, a second optoelectronic circuitry that receives an optical signal, and a loopback waveguide that connects the output from the first optoelectronic circuitry to the second optoelectronic circuitry on an interposer substrate are described. The connected circuits, together comprising a photonic integrated circuit, are electrically tested using electrical signals that are provided via probing contact pads on the PIC die. Electrical activation of the optoelectrical sending devices and the subsequent detection and measurement of the optical signals in the receiving devices, in embodiments, provides information on the operability or functionality of the PIC on the die at the wafer level, prior to die separation or singulation, using the electrical and optical components of the PIC circuit.

Abstract: An inspection system includes a base, an array of fixtures, and a plurality of sensors or light sources. Each fixture has a first portion rotatably secured to the base and configured to rotate about a yaw axis and a second portion rotatably secured to the first portion and configured to rotate about a pitch axis. Each sensor or light source is secured to one of the fixtures and is configured to direct light at yaw and pitch angles relative to the base.

Abstract: Methods and systems for accelerated training of a machine learning based model for semiconductor applications are provided. One method for training a machine learning based model includes acquiring information for non-nominal instances of specimen(s) on which a process is performed. The machine learning based model is configured for performing simulation(s) for the specimens. The machine learning based model is trained with only information for nominal instances of additional specimen(s). The method also includes re-training the machine learning based model with the information for the non-nominal instances of the specimen(s) thereby performing transfer learning of the information for the non-nominal instances of the specimen(s) to the machine learning based model.

Abstract: The invention provides an automatic inspection process for detecting visible defects on a manufactured item. The process includes a set up mode in which images of same-type defect free items, but not images of same-type defected items, are obtained, and an inspection mode in which images of both same-type defect free items and same-type defected items, are obtained and defects are detected. Images of the same-type defect free items are analyzed and based on the analysis the process switches to the inspection mode.

Abstract: A vision inspection system includes a sorting platform having an upper surface supporting parts for inspection, wherein the parts are configured to be loaded onto the upper surface of the sorting platform in a random orientation. The vision inspection system includes an inspection station including an imaging device. The vision inspection system includes a vision inspection controller receiving images and processing the images based on an image analysis model to determine inspection results for each of the parts. The vision inspection controller has a shape recognition tool configured to recognize the parts in the field of view regardless of the orientation of the parts on the sorting platform. The vision inspection controller has an AI learning module operated to customize and configure the image analysis model based on the images received from the imaging device.

Abstract: A method for inspection of a target object, the method including irradiating a reference surface having a non-flat reference profile with radiation; determining reference response data based on detected radiation having interacted with the reference surface; irradiating a target object with radiation, the target object including a target surface having a non-flat target profile corresponding to the reference profile; determining inspection response data based on detected radiation having interacted with the target object; and determining at least one parameter of the target object based on the reference response data and the inspection response data. An alternative method; a control system for controlling an emitter system and a detector system; and an inspection system including a control system, an emitter system and a detector system, are also provided.

Abstract: This invention provides a system and method for detecting and imaging specular surface defects on a specular surface that employs a knife-edge technique in which the camera aperture or an external device is set to form a physical knife-edge structure within the optical path that effectively blocks reflected rays from an illuminated specular surface of a predetermined degree of slope values and allows rays deflected at differing slopes to reach the vision system camera sensor. The light reflected from the flat part of the surface is mostly blocked by the knife-edge. Light reflecting from the sloped parts of the defects is mostly reflected into the entrance aperture. The illumination beam is angled with respect to the optical axis of the camera to provide the appropriate degree of incident angle with respect to the surface under inspection. The surface can be stationary or in relative motion with respect to the camera.

Abstract: In one example, a distance sensor includes a camera to capture images of a field of view, a plurality of light sources arranged around a lens of the camera, wherein each light source of the plurality of light sources is configured to project a plurality of beams of light into the field of view, and wherein the plurality of beams of light creates a pattern of projection artifacts in the field of view that is visible to a detector of the camera, a baffle attached to a first light source of the plurality of light sources, wherein the baffle is positioned to limit a fan angle of a plurality of beams of light that is projected by the first light source, and a processing system to calculate a distance from the distance sensor to an object in the field of view, based on an analysis of the images.

Abstract: A system, apparatus, and method for remotely detecting defects in a structure may proceed non-destructively. A mobile sensing platform may place sensors in a desired positioning relative to the structure. The desired position may include a non-contacting relation between the sensors and structure. The mobile sensing platform may project laser beams onto the structure and sense backscattered light via the sensors. Variations in the backscattered light may correspond to motion of the structure, such as vibrations. By calculating the frequency and amplitude of the vibrations, defects in the structure may be detected. By correcting for noise, such as that associated with acceleration of the mobile sensing platform, accuracy and precision of defect detection may be enhanced.

Abstract: A semiconductor package may include a package substrate, a molded interposer package (MIP) and a first stiffener. The MIP may be arranged on the package substrate. The MIP may include an interposer, at least one first semiconductor chip and at least one second semiconductor chip molded by a molding member. The first stiffener may be attached to any one of outer surfaces of the MIP. The first stiffener may be spaced apart from the upper surface of the package substrate to suppress a warpage of the MIP. Thus, central conductive bumps between the MIP and the package substrate may not be upwardly floated to improve an electrical connection between the central conductive bumps and the package substrate. Further, a short between edge conductive bumps between the MIP and the package substrate may not be generated.

Abstract: The present invention relates to an image generation method for an objective for generating an image corresponding to a multi-frame image from image signals obtained by scanning a small number of frames are proposed.

Abstract: An example of a method of manufacturing a component from a composite prepreg includes collecting a specimen from the composite prepreg and quantifying an amount of surface resin of the specimen by submerging the specimen in a container containing a fluid to determine a fluid pickup percentage. Responsive to a determination that the fluid pickup percentage exceeds a predefined threshold value, forming a component from the composite prepreg.

Abstract: In some examples, a system receives a first image of a circuit board produced by a first production stage, and compares the first image to a second image of the circuit board acquired at a second production stage for the circuit board. The system indicates an anomaly with the circuit board based on the comparing.

Abstract: A beam of light is directed from a light source at a wafer on a chuck. The beam of light is reflected off the wafer toward a 2D imaging camera. Movable focus lenses in the path of the beam of light can independently change the illumination conjugate and the collection conjugate. A structured mask in an illumination path can be used and the beam of light can be directed through apertures in the structured mask. A gray field image of a wafer in a zone without direct illumination is generated using the 2D imaging camera and locations of defects on the wafer can be determined using the gray field image.

Abstract: A spectroscopic metrology system includes a spectroscopic metrology tool and a controller. The controller generates a model of a multilayer grating including two or more layers, the model including geometric parameters indicative of a geometry of a test layer of the multilayer grating and dispersion parameters indicative of a dispersion of the test layer. The controller further receives a spectroscopic signal of a fabricated multilayer grating corresponding to the modeled multilayer grating from the spectroscopic metrology tool. The controller further determines values of the one or more parameters of the modeled multilayer grating providing a simulated spectroscopic signal corresponding to the measured spectroscopic signal within a selected tolerance. The controller further predicts a bandgap of the test layer of the fabricated multilayer grating based on the determined values of the one or more parameters of the test layer of the fabricated structure.

Abstract: An endoscopic device includes a manipulator body and an insertion portion including opposed respective proximal and distal ends. The insertion portion is connected to the manipulator body via the proximal end. A first heat generator is configured to be attached to the manipulator body. A heat radiator is configured to be detachably attached to the manipulator body and is thermally connected to the first heat generator. The heat radiator includes at least one air inlet port through which air flows in and at least one air outlet port having an area smaller than an area of the at least one air inlet port.

Abstract: The present invention is intended to make it easier to perform positioning of a detection device when detecting surface characteristics of a sensing object. The invention includes a detection device, a processing part, a guidance information generation part and an informing part. The detection device detects reflection light from a sensing object by irradiating light onto the sensing object. The processing part calculates surface characteristics of the sensing object by processing data from the detection device. The guidance information generation part generates information about a distance and/or an attitude of the detection device relative to the sensing object. The informing part informs the information about the distance and/or the attitude generated by the guidance information generation part.

Abstract: A technology is provided in which moving objects positioned at a different place and having more than the number of the cameras are displayed on a display device. The present invention is directed to a moving object imaging device including a camera, a deflection unit, a controller configured to control the camera and the deflection unit, an imaging processing part, and an imaging display part, thereby imaging the moving object in a sequentially repeating manner and creating moving image data based upon images acquired by the image processing part to display the created moving image data on the image display part.

Abstract: A method for detecting lens cleanliness of a lens disposed in a flat-field optical path, the flat-field optical path including a light source, the lens, a camera, the light source is a narrow-band multispectral uniform surface light source, the camera's light-sensitive surface is disposed perpendicular to an optical axis of the lens and in the light position of the lens, the method including collecting the bright-field image data and dark-field image data in a plurality of spectra through the lens; for each pixel, performing a spectral differential flat-field correction operation to yield a plurality of spectral differentials; and displaying the spectral differentials in the form of a plurality of images to show a uniformity of each of the plurality of images, wherein a non-uniform area on each of the plurality of images is determined to have been caused by an impurity of the lens.

Abstract: Accuracy of detecting abnormalities on the surface of a workpiece is improved. An appearance inspection apparatus for inspecting the appearance of a workpiece is provided. The appearance inspection apparatus for inspecting the appearance of the workpiece includes a first lighting unit that irradiates the workpiece with light, a first imaging unit that images the workpiece irradiated by the first lighting unit, a first detection unit that detects a first defect from an image captured by the first imaging unit, a second lighting unit that irradiates the workpiece with light, a second imaging unit that images the workpiece irradiated by the second lighting unit, and a second detection unit that detects a second defect from an image captured by the second imaging unit. The first lighting unit uses coaxial epi-illumination, and the second lighting unit uses coaxial epi-illumination and dome illumination.

Abstract: A tire testing method includes: applying a lubrication solution to a bead part of a tire; detecting a phase of a reference point of the tire; detecting a phase of a rotation origin of a spindle at common coordinates shared with coordinates at which the phase of the reference point is indicated; detecting a singular point present on the tire by conducting a tire test while rotating the tire on the spindle, and detecting a phase from the rotation origin to the singular point; calculating a phase from the reference point to the singular point based on the phase of the reference point, the phase of the rotation origin, and the phase from the rotation origin to the singular point; storing information about the reference point and information about the rotation origin at the common coordinates; and marking the tire at a position where the singular point is present.

Abstract: A metrology tool, an aplanatic singlet lens, and a method of designing an aplanatic singlet lens are provided. The metrology tool is for determining a characteristic of a structure on a substrate. The metrology tool comprises an optical detection system for detecting radiation over a wavelength range. The optical detection system comprises an aplanatic singlet lens for focusing the radiation on to a detector. The aplanatic singlet lens has a n aplanatic wavelength which is within the wavelength range.

Abstract: A method of imaging surface features with a large (non-microscopic) field-of-view includes projecting a structured illumination pattern onto the transparent target. The surface features modify the structured illumination pattern, and an image of the modified structured illumination pattern is imaged at each of multiple different introduced phase shifts via an imaging device. The method further provides for extracting, from each of the captured phase-shifted images, image components that correspond to frequencies exceeding a cutoff frequency of the imaging device; and using the extracted image components to construct a corrected image of the surface features of the transparent target. The corrected image has a resolution that is greater than a spatially incoherent point-to-point optical resolution of the imaging device.