On Patterned Or Topographical Surface (e.g., Wafer, Mask, Circuit Board) Patents (Class 356/237.4)
  • Patent number: 11474438
    Abstract: An inspection apparatus for inspecting an object such as a pellicle for use in an EUV lithographic apparatus, the inspection apparatus including: a vacuum chamber; a load lock forming an interface between the vacuum chamber and an ambient environment; and a stage apparatus configured to receive the object from the load lock and displace the object inside the vacuum chamber, wherein the vacuum chamber includes a first parking position and a second parking position for temporarily storing the object.
    Type: Grant
    Filed: October 17, 2019
    Date of Patent: October 18, 2022
    Assignee: ASML Netherlands B.V.
    Inventors: Pawel Safinowski, Derk Servatius Gertruda Brouns
  • Patent number: 11448601
    Abstract: A method and a system for obtaining information from a sample. The system may include (i) a spatial filter that includes a blocking element and an aperture; (ii) an illumination unit; and (iii) an optical unit that includes an optical objective assembly. The illumination unit may be configured to illuminate the optical objective assembly with oblique radiation. The optical objective assembly may be configured to (a) focus the oblique radiation onto the sample, (b) collect radiation from the sample to provide collected radiation, and (c) reflect the oblique radiation to provide back reflected radiation. The optical unit may be configured to (a) focus the collected radiation to provide focused collected radiation, (b) direct the focused collection radiation towards the aperture, (c) focus the back reflected radiation to provide focused back reflected radiation, and (d) direct the focused back reflected radiation towards the blocking element.
    Type: Grant
    Filed: May 28, 2020
    Date of Patent: September 20, 2022
    Assignee: Applied Materials Israel Ltd.
    Inventors: Boris Golberg, Roman Naidis
  • Patent number: 11416979
    Abstract: A defect displaying method is provided in the disclosure. The method comprises acquiring defect group information from an image of a wafer, wherein the defect group information includes a set of correlations between a plurality of defects identified from the image and one or more corresponding assigned defect types and displaying at least some of the plurality of defects according to their corresponding assigned defect types.
    Type: Grant
    Filed: January 18, 2018
    Date of Patent: August 16, 2022
    Assignee: ASML Netherlands B.V.
    Inventors: Wei Fang, Cho Huak Teh, Ju Hao Chien, Yi-Ying Wang, Shih-Tsung Chen, Jian-Min Liao, Chuan Li, Zhaohui Guo, Pang-Hsuan Huang, Shao-Wei Lai, Shih-Tsung Hsu
  • Patent number: 11361951
    Abstract: A photomultiplier tube (PMT) detector assembly includes a PMT and an analog PMT detector circuit. The PMT includes a photocathode configured to emit an initial set of photoelectrons in response to an absorption of photons. The PMT includes a dynode chain with a plurality of dynodes. The dynode chain is configured to receive the initial set of photoelectrons, generate at least one amplified set of photoelectrons, and direct the at least one amplified set of photoelectrons. The PMT includes an anode configured to receive the at least one amplified set of photoelectrons, with a digitized image being generated based on a measurement of the final amplified set of photoelectrons. The digitized image is corrected by applying an output of the signal measured by the analog PMT detector circuit to the digitized image.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: June 14, 2022
    Assignee: KLA Corporation
    Inventor: Derek Mackay
  • Patent number: 11294170
    Abstract: A method for removing a foreign substance according to an embodiment includes: a step of preparing a Fabry-Perot interference filter in which a gap is formed between a portion of a first laminate at least including a first mirror portion and a portion of a second laminate at least including a second mirror portion facing each other so that a distance between the first mirror portion and the second mirror portion facing each other varies by an electrostatic force; a step of detecting a foreign substance adhering to a surface of the second laminate; and a step of blowing air in which an airflow peak position is adjusted on the basis of a position of the detected foreign substance onto the surface of the second laminate and thereby removing the foreign substance from the surface of the second laminate.
    Type: Grant
    Filed: November 9, 2018
    Date of Patent: April 5, 2022
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Masaki Hirose, Katsumi Shibayama, Takashi Kasahara, Toshimitsu Kawai, Hiroki Oyama, Yumi Kuramoto
  • Patent number: 11244444
    Abstract: The present invention provides a method and apparatus for analyzing a semiconductor wafer for analyzing a defect distribution pattern on a semiconductor wafer to be tested. The method comprises: obtaining a defect distribution map of the semiconductor wafer to be tested, the defect distribution map indicating a defect distribution within a surface of the semiconductor wafer to be tested; establishing a three-dimensional model to be tested according to the defect distribution map, wherein an XY plane of the three-dimensional model to be tested corresponds to the surface of the semiconductor wafer to be tested, and a Z-axis of the three-dimensional model to be tested corresponds to the number of defects in each grid unit in the XY plane.
    Type: Grant
    Filed: November 13, 2019
    Date of Patent: February 8, 2022
    Assignee: Shanghai Huali Integrated Circuit Mfg. Co. Ltd.
    Inventors: Xiao Chen, Jianye Song, Guangzhi He
  • Patent number: 11203299
    Abstract: A view system (100A, 100B) for a vehicle (1) has at least one image capture unit (10A, 10B) for capturing image data of an area around the vehicle (1), wherein the image capture unit (10A, 10B) has an image sensor (11A, 11B) and an optical element (12A, 12B), at least one image processing unit (20A, 20B) for processing the image data captured by the image capture unit, and at least one light source (40, 40.1, 40.2) for illuminating the optical element (12A, 12B). The view system is configured to highlight the recognizability of a foreign particle (S, T), which is located on the optical element (12A, 12B), on the image sensor (11A, 11B) of the image capture unit (10A, 10B) by means of the illumination of the optical element (12A, 12B).
    Type: Grant
    Filed: April 29, 2020
    Date of Patent: December 21, 2021
    Assignee: MEKRA LANG GMBH & CO. KG
    Inventors: Werner Lang, Stefan Centmayer, Christian Traub
  • Patent number: 11199505
    Abstract: A method for machine learning enhanced optical-based screening for in-line wafer testing includes receiving optical spectra data for a wafer-under-test by performing scatterometry on the wafer-under-test, performing predictive model screening by applying a predictive model based on the optical spectra data, determining whether a device associated with the wafer-under-test is defective based on the predictive model screening, and if the device is determined to be defective, dynamically modifying a yield map associated with the wafer-under-test, including reassigning at least one die.
    Type: Grant
    Filed: August 23, 2018
    Date of Patent: December 14, 2021
    Assignee: International Business Machines Corporation
    Inventors: Robin Hsin Kuo Chao, Mary Breton, Huai Huang, Dexin Kong, Lawrence A. Clevenger
  • Patent number: 11187662
    Abstract: A device and a method for simultaneously inspecting defects of a surface and a subsurface of an optical element are provided. Combined with laser-induced ultrasound and laser scattering inspection technologies, through generating acoustic sound waves on the surface and the subsurface of the optical element to be tested by lasers, a static light scattering effect of subsurface defects under modulation of the acoustic sound wave is observed and analyzed; through analyzing amplitude and phase changes of scattered light intensity and reflected light intensity, inspection for the defects of the surface and the subsurface of the optical element is realized. The present invention can be applied in quality inspection of precise optical elements, especially in finished product inspection of ultra-precise optical elements having strict requirements on the subsurface defects.
    Type: Grant
    Filed: August 2, 2019
    Date of Patent: November 30, 2021
    Assignee: ZHEJIANG UNIVERSITY
    Inventors: Anyu Sun, Zhihong Li, Bingfeng Ju, Chuanyong Wang, Xiaoyu Yang, Zeqing Sun, Huilin Du
  • Patent number: 11175220
    Abstract: A surface defect measuring apparatus and method by microscopic scattering polarization imaging is provided. The apparatus mainly comprises a laser, a first converging lens, a rotary diffuser, a second converging lens, a diaphragm, a third converging lens, a pinhole, a fourth converging lens, a polarizer, a half-wave plate, a polarizing beam splitter, an X-Y translation stage, a sample, a microscope lens, a quarter-wave plate, a micro-polarizer array, a camera and a computer. The micro-polarizer array is adopted to realize real-time microscopic scattering polarization imaging of the surface defects; a polarization-degree image is calculated to improve the sensitivity for detecting the surface defects of the ultra-smooth element, and the effective detection of the surface defects of a high-reflective coating element is also realized, and the requirement for rapid detection of the surface defects of a meter-scale large-aperture ultra-smooth element can be met.
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: November 16, 2021
    Assignee: Shanghai Institute of Optics And Fine Mechanics, Chinese Academy of Sciences
    Inventors: Jianda Shao, Shijie Liu, Kaizao Ni, Shenghao Wang, You Zhou, Weiwei Wang, Tianzhu Xu, Qi Lu
  • Patent number: 11119051
    Abstract: A system for processing a substrate is provided. The system includes a process chamber including one or more sidewalls enclosing a processing region; and a substrate support. The system further includes a passageway connected to the process chamber; and a first particle detector disposed at a first location along the passageway. The first particle detector includes an energy source configured to emit a first beam; one or more optical devices configured to direct the first beam along one or more paths, where the one or more paths extend through at least a portion of the passageway. The first particle detector further includes a first energy detector disposed at a location other than on the one or more paths. The system further includes a controller configured to communicate with the first particle detector, wherein the controller is configured to identify a fault based on signals received from the first particle detector.
    Type: Grant
    Filed: October 2, 2020
    Date of Patent: September 14, 2021
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Todd Egan, Mehdi Vaez-Iravani, Samer Banna, Kyle Tantiwong, Gregory Kirk, Abraham Ravid, Yaoming Shen
  • Patent number: 11105839
    Abstract: An apparatus, a method and a computer program product for defect detection in work pieces is disclosed. At least one light source is provided and the light source generates an illumination light of a wavelength range at which the work piece is transparent. A camera images the light from at least one face of the work piece on a detector of the camera by means of a lens. A stage is used for moving the work piece and for imaging the at least one face of the semiconductor device completely with the camera. The computer program product is disposed on a non-transitory, computer readable medium for defect detection in work pieces. A computer is used to execute the various process steps and to control the various means of the apparatus.
    Type: Grant
    Filed: November 2, 2020
    Date of Patent: August 31, 2021
    Assignee: KLA Corporation
    Inventors: Tom Marivoet, Carl Truyens, Christophe Wouters
  • Patent number: 11022554
    Abstract: A method of detecting a presence of foreign material in a ply is disclosed. A source of foreign material is marked with a fluorescent indicator. The source of foreign material is separated from the ply. An illumination source is provided for illuminating the ply at a different wavelength than the fluorescent indicator fluoresces so that the ply reflects light at a different wavelength. A sensor detects illumination of the ply and fluorescent indicator included in the foreign material disposed upon the ply. Differences in light reflected from the ply and fluorescence of the indicator disposed in the foreign material are detected thereby identifying existence of the foreign material in the ply.
    Type: Grant
    Filed: April 5, 2019
    Date of Patent: June 1, 2021
    Assignee: VIRTEK VISION INTERNATIONAL ULC
    Inventor: Kurt D. Rueb
  • Patent number: 11002688
    Abstract: An apparatus and method are disclosed for actinic inspection of semiconductor masks intended for extended ultraviolet (EUV) lithography, or similar objects, with feature sizes less than 100 nm. The approach uses a coherent light source with wavelength less than 120 nm. Inside a vacuum system, an optical system directs the light to an object, i.e., the mask or mask blank, and directs the resulting reflected or transmitted light to an imaging sensor. A computational system processes the imaging sensor data to generate phase and amplitude images of the object. The preferred imaging modality, a form of digital holography, produces images of buried structures and phase objects, as well as amplitude or reflectance images, with nanometer resolution less than or equal to the feature size of the mask.
    Type: Grant
    Filed: July 9, 2019
    Date of Patent: May 11, 2021
    Inventor: Steven M. Ebstein
  • Patent number: 10976152
    Abstract: A method for defect inspection of a transparent substrate comprises (a) providing an optical system for performing a diffraction process of object wave passing through a transparent substrate, (b) interfering and wavefront recording for the diffracted object wave and a reference wave to reconstruct the defect complex images (including amplitude and phase) of the transparent substrate, (c) characteristics analyzing, features classifying and sieving for the defect complex images of the transparent substrate, and (d) creating defect complex images database based-on the defect complex images for comparison and detection of the defect complex images of the transparent substrate.
    Type: Grant
    Filed: May 9, 2017
    Date of Patent: April 13, 2021
    Assignee: NATIONAL TAIWAN NORMAL UNIVERSiTY
    Inventors: Chau-Jern Cheng, Chin-Yu Liu, Xin-Ji Lai
  • Patent number: 10943804
    Abstract: The present disclosure describes a method for controlling a wet processing system includes dispensing one or more chemicals into a processing chamber according to one or more process parameters. The method also includes injecting one or more illumination markers into the processing chamber and obtaining images representing locations of the one or more illumination markers. The method further includes determining a trajectory of an illumination marker of the one or more illumination markers based on the images and determining whether the determined trajectory is outside a predetermined trajectory range. In response to the determined trajectory being outside the predetermined trajectory range, the method further includes adjusting the one or more process parameters.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: March 9, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Bo-Chen Chen, Sheng-Wei Wu, Yung-Li Tsai
  • Patent number: 10887500
    Abstract: Optical inspection system detects defects of an object, such as an electronic device during manufacturing. The optical inspection system includes a first linear light source that irradiates a first light beam on a top surface of the object along a scan line across the width of the object. A second linear light source forms an angle with the first linear light source and irradiates a second light beam on a side surface of the object. A camera receives scattered light from the top surface and the side surface of the object and captures a subimage of the object along the scan line. An image processing system receives each subimage from the camera, stitches the subimages, and detects defects on the top surface and the side surface of the object.
    Type: Grant
    Filed: January 24, 2017
    Date of Patent: January 5, 2021
    Assignee: Hong Kong Applied Science and Technology Research Institute Co., Ltd.
    Inventors: Changli Wu, Ying Liu
  • Patent number: 10868403
    Abstract: A laser apparatus of the present disclosure includes: a master oscillator configured to emit a laser beam; a laser amplifier disposed on an optical path of the laser beam; a propagation optical system disposed on an optical path between the laser amplifier and a target supplied into an EUV chamber in which EUV light is generated; and a polarization isolator disposed on an optical path between the laser amplifier and the propagation optical system. The polarization isolator includes: a polarizer configured to emit, selecting from the laser beam incident on the polarizer, a laser beam linearly polarized in a predetermined polarization direction; and a reflection retarder disposed on an optical path between the polarizer and the propagation optical system to convert, through reflection, the laser beam linearly polarized in the predetermined polarization direction into an elliptically polarized laser beam having retardation that reduces retardation occurring at the propagation optical system.
    Type: Grant
    Filed: July 3, 2019
    Date of Patent: December 15, 2020
    Assignee: Gigaphoton Inc.
    Inventor: Yasufumi Kawasuji
  • Patent number: 10868418
    Abstract: In accordance with one example, the electronic switch has a load current path operably coupled to a load via a wire; the electronic switch is configured to connect or disconnect a load current supply node and the load via the wire dependent on a drive signal. Further, the electronic fuse circuit includes a monitoring circuit configured to receive a current sense signal representing the load current passing through the wire and to determine a first protection signal based on the current sense signal and at least one wire parameter. The first protection signal is indicative of whether to disconnect the load current supply node from the load. Moreover, the electronic fuse circuit includes a logic circuit configured to receive at least one selection signal and to set the at least one wire parameter based on the at least one selection signal.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: December 15, 2020
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Christian Djelassi-Tscheck, Robert Illing, Cosimo Lamacchia, Mario Tripolt
  • Patent number: 10845317
    Abstract: A system for processing a substrate is provided. The system includes a process chamber including one or more sidewalls enclosing a processing region; and a substrate support. The system further includes a passageway connected to the process chamber; and a first particle detector disposed at a first location along the passageway. The first particle detector includes an energy source configured to emit a first beam; one or more optical devices configured to direct the first beam along one or more paths, where the one or more paths extend through at least a portion of the passageway. The first particle detector further includes a first energy detector disposed at a location other than on the one or more paths. The system further includes a controller configured to communicate with the first particle detector, wherein the controller is configured to identify a fault based on signals received from the first particle detector.
    Type: Grant
    Filed: May 23, 2017
    Date of Patent: November 24, 2020
    Assignee: Applied Materials, Inc.
    Inventors: Todd Egan, Mehdi Vaez-Iravani, Samer Banna, Kyle Tantiwong, Gregory Kirk, Abraham Ravid, Yaoming Shen
  • Patent number: 10732130
    Abstract: An inspection system may include an illumination source to generate an illumination beam, illumination optics to direct the illumination beam to a sample. The system may further include a first collection channel to collect light from the sample within a first range of solid angles and at a first selected polarization. The system may further include a second collection channel to collect light from the sample within a second angular range, the second range of solid angles and at a second selected polarization. The system may further include a controller to receive two or more scattering signals. The scattering signals may include signals from the first and second collection channels having selected polarizations. The controller may further determine depths of defects in the sample based on comparing the two or more scattering signals to training data including data from a training sample having known defects at known depths.
    Type: Grant
    Filed: October 19, 2018
    Date of Patent: August 4, 2020
    Assignee: KLA-Tencor Corporation
    Inventors: Haiping Zhang, Gang Yu
  • Patent number: 10712287
    Abstract: An inspection device according to the present disclosure includes a detector for inspection that includes a plurality of pixels arranged on a light receiving surface and acquires image data by transferring charge produced by light received by the plurality of pixels in a transfer direction at a specified transfer timing, a light source that emits illumination light including pulsed light, a pulse enable circuit that controls emission timing for the light source to emit the illumination light based on the transfer timing, an illumination optical system that illuminates an object to be inspected with the illumination light, a condensing optical system that condenses, on the detector for inspection, light from the object to be inspected illuminated with the illumination light, and a processing unit that inspects the object to be inspected by using the image data of the object to be inspected.
    Type: Grant
    Filed: March 7, 2019
    Date of Patent: July 14, 2020
    Assignee: LASERTEC CORPORATION
    Inventors: Masayasu Nishizawa, Haruhiko Kusunose, Tomohiro Suzuki
  • Patent number: 10712289
    Abstract: Various embodiments for detecting defects on a wafer are provided. One method includes acquiring output generated by an inspection system for a wafer during an inspection process that is performed after at least first and second process steps have been performed on the wafer. The first and second process steps include forming first and second portions, respectively, of a design on the wafer. The first and second portions of the design are mutually exclusive in space on the wafer. The method also includes detecting defects on the wafer based on the output and determining positions of the defects with respect to the first and second portions of the design. In addition, the method includes associating different portions of the defects with the first or second process step based on the positions of the defects with respect to the first and second portions of the design.
    Type: Grant
    Filed: July 27, 2015
    Date of Patent: July 14, 2020
    Assignee: KLA-Tencor Corp.
    Inventors: Oksen Toros Baris, Raghav Babulnath
  • Patent number: 10695804
    Abstract: Embodiments described herein relate to a cleaning device and methods for cleaning an object. In one embodiment, the object is cleaned by moving a clean head along a surface of the object. Supercritical carbon dioxide fluid is delivered by supercritical carbon dioxide fluid vessel to the surface of the object. The supercritical carbon dioxide fluid and contamination material are removed from the object by a vacuum pump to a detector. One or more measurements of the contamination material are determined by the detector. Samples of the contamination material are collected by a collector. A contamination level of the surface of the object is determined by an analyzer.
    Type: Grant
    Filed: January 25, 2018
    Date of Patent: June 30, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Roman M. Mostovoy, Suketu Arun Parikh, Todd Egan
  • Patent number: 10663286
    Abstract: Methods and systems disclosed herein can measure thin film stacks, such as film on grating and bandgap on grating in semiconductors. For example, the thin film stack may be a 1D film stack, a 2D film on grating, or a 3D film on grating. One or more effective medium dispersion models are created for the film stack. Each effective medium dispersion model can substitute for one or more layers. A thickness of one or more layers can be determined using the effective medium dispersion based scatterometry model. In an instance, three effective medium dispersion based scatterometry models are developed and used to determine thickness of three layers in a film stack.
    Type: Grant
    Filed: November 1, 2017
    Date of Patent: May 26, 2020
    Assignee: KLA-Tencor Corporation
    Inventors: Houssam Chouaib, Zhengquan Tan
  • Patent number: 10656534
    Abstract: Methods and apparatuses for measuring a plurality of structures formed on a substrate are disclosed. In one arrangement, a method includes obtaining data from a first measurement process. The first measurement process including individually measuring each of the plurality of structures to measure a first property of the structure. A second measurement process is used to measure a second property of each of the plurality of structures. The second measurement process includes illuminating each structure with radiation having a radiation property that is individually selected for that structure using the measured first property for the structure.
    Type: Grant
    Filed: May 31, 2019
    Date of Patent: May 19, 2020
    Assignee: ASML Netherlands B.V.
    Inventors: Nitesh Pandey, Jin Lian, Samee Ur-Rehman, Martin Jacobus Johan Jak
  • Patent number: 10573534
    Abstract: A method for monitoring a rapid heating process to which a semiconductor wafer is subjected includes performing the heating process for a region of the semiconductor wafer, irradiating the semiconductor wafer with a laser beam, detecting light of the laser beam that is reflected from the semiconductor wafer, creating haze data based on the detected light and determining heated regions and/or transition regions between heated and non-heated regions of the semiconductor wafer on the basis of the haze data.
    Type: Grant
    Filed: February 15, 2017
    Date of Patent: February 25, 2020
    Assignee: GLOBALFOUNDRIES Inc.
    Inventors: Jan Holub, Kay Wendt
  • Patent number: 10545099
    Abstract: Disclosed are apparatus and methods for detecting defects on a semiconductor sample. An optical inspector is first used to inspect a semiconductor sample with an aggressively predefined threshold selected to detect candidate defect and nuisance sites at corresponding locations across the sample. A high-resolution distributed probe inspector includes an array of miniature probes that are moved relative to the sample to scan and obtain a high-resolution image of each site to detect and separate the candidate defect sites from the nuisance sites. A higher-resolution probe is then used to obtain a higher-resolution image of each candidate site to obtain a high-resolution image of each site to separate real defects that adversely impact operation of any devices on the sample from the candidate defects.
    Type: Grant
    Filed: February 11, 2019
    Date of Patent: January 28, 2020
    Assignee: KLA-Tencor Corporation
    Inventors: Grace Chen, Lawrence Muray
  • Patent number: 10534274
    Abstract: Metrology apparatus and methods for inspecting a substrate are disclosed. A source beam of radiation emitted by a radiation source is split into a measurement beam and a reference beam. A first target on the substrate is illuminated with the measurement beam. A second target separated from the substrate is illuminated with the reference beam. First scattered radiation collected from the first target and second scattered radiation collected from the second target are delivered to the detector. The first scattered radiation interferes with the second scattered radiation at the detector. The first target comprises a first pattern. The second target comprises a second pattern, or a pupil plane image of the second pattern. The first pattern is geometrically identical to the second pattern, the first pattern and the second pattern are periodic and a pitch of the first pattern is identical to a pitch of the second pattern, or both.
    Type: Grant
    Filed: October 3, 2017
    Date of Patent: January 14, 2020
    Assignee: ASML Netherlands B.V.
    Inventors: Teunis Willem Tukker, Amandev Singh, Gerbrand Van Der Zouw
  • Patent number: 10537020
    Abstract: A printed circuit board according to an embodiment of the present invention includes a base film having an insulating property and a conductive pattern disposed on at least one surface of the base film. The conductive pattern includes a copper particle bond layer which is fixed to the base film, and a lightness L* of a conductive pattern non-formed region of the base film is 60 or less. The base film may include a modified layer on one surface side thereof.
    Type: Grant
    Filed: August 1, 2016
    Date of Patent: January 14, 2020
    Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    Inventors: Kohei Okamoto, Kousuke Miura, Hiroshi Ueda, Takashi Kasuga, Kazuhiro Miyata
  • Patent number: 10497658
    Abstract: In one embodiment of the invention, a method for correcting a pattern placement on a substrate is disclosed. The method begins by detecting three reference points for a substrate. A plurality of sets of three die location points are detected, each set indicative of an orientation of a die structure, the plurality of sets include a first set associated with a first dies and a second set associated with a second die. A local transformation is calculated for the orientation of the first die and the second on the substrate. Three orientation points are selected from the plurality of sets of three die location points wherein the orientation points are not set members of the same die. A first global orientation of the substrate is calculated from the selected three points from the set of points and the first global transformation and the local transformation for the substrate are stored.
    Type: Grant
    Filed: September 17, 2018
    Date of Patent: December 3, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Tamer Coskun, Jang Fung Chen
  • Patent number: 10488348
    Abstract: Systems configured to inspect a wafer are provided. One system includes an illumination subsystem configured to direct pulses of light to an area on a wafer; a scanning subsystem configured to scan the pulses of light across the wafer; a collection subsystem configured to image pulses of light scattered from the area on the wafer to a sensor, wherein the sensor is configured to integrate a number of the pulses of scattered light that is fewer than a number of the pulses of scattered light that can be imaged on the entire area of the sensor, and wherein the sensor is configured to generate output responsive to the integrated pulses of scattered light; and a computer subsystem configured to detect defects on the wafer using the output generated by the sensor.
    Type: Grant
    Filed: January 29, 2018
    Date of Patent: November 26, 2019
    Assignee: KLA-Tencor Corp.
    Inventors: Anatoly Romanovsky, Ivan Maleev, Daniel Kavaldjiev, Yury Yuditsky, Dirk Woll, Stephen Biellak, Mehdi Vaez-Iravani, Guoheng Zhao
  • Patent number: 10469782
    Abstract: A time delay and integration charge coupled device includes an array of pixels and a clock generator. The array of pixels is distributed in a scan direction and a line direction perpendicular to the scan direction in which at least some of the pixels of the array include three or more gates aligned in the scan direction. The clock generator provides clocking signals to transfer charge along the scan direction between two or more pixel groups including two or more pixels adjacent in the scan direction. The clocking signals include phase signals to transfer the charge to an adjacent pixel group along the scan direction at a rate corresponding to the velocity of the target by driving the gates of the two or more pixel groups and generating a common potential well per pixel group for containing charge generated in response to incident illumination.
    Type: Grant
    Filed: September 22, 2017
    Date of Patent: November 5, 2019
    Assignee: KLA-Tencor Corporation
    Inventor: David L. Brown
  • Patent number: 10379064
    Abstract: A substrate inspection device for inspecting a flexible printed board to determine whether the transparent adhesive material is properly applied thereto comprises: a substrate reading device which irradiates the flexible printed board with visible light to acquire image data; an adhesive material position determination unit which determines a position of adhesive material CAD data corresponding to the transparent adhesive material with respect to blue color image data among the image data corresponding to blue light which is readily absorbed by polyimide, to create adhesive material alignment data in which the adhesive material CAD data is superposed; an edge enhancing unit which performs processing, on the blue color image data, to enhance an edge of the transparent adhesive material; and a straight line determination unit which determines whether the edge of the transparent adhesive material is present in edge enhanced data in which the edge of the transparent adhesive material is enhanced.
    Type: Grant
    Filed: December 16, 2016
    Date of Patent: August 13, 2019
    Assignee: NIPPON MEKTRON, LTD.
    Inventor: Kenichi Mishima
  • Patent number: 10346964
    Abstract: An apparatus and method are disclosed for actinic inspection of semiconductor masks intended for extended ultraviolet (EUV) lithography, or similar objects, with feature sizes less than 100 nm. The approach uses a coherent light source with wavelength less than 120 nm. Inside a vacuum system, an optical system directs the light to an object, i.e., the mask or mask blank, and directs the resulting reflected or transmitted light to an imaging sensor. A computational system processes the imaging sensor data to generate phase and amplitude images of the object. The preferred imaging modality, a form of digital holography, produces images of buried structures and phase objects, as well as amplitude or reflectance images, with nanometer resolution less than or equal to the feature size of the mask.
    Type: Grant
    Filed: February 2, 2017
    Date of Patent: July 9, 2019
    Inventor: Steven M. Ebstein
  • Patent number: 10330609
    Abstract: A method and an apparatus of inspecting a substrate with a component mounted thereon, which are capable of inspecting whether the component is properly mounted or not without additional setting or changing inspection condition, are provided. The method comprises measuring a three-dimensional shape by irradiating the pattern image toward the substrate through at least one illumination unit and by taking a reflected image through an imaging unit, extracting a shield region from the three-dimensional shape, and inspecting a component mounting defect in an area excluding the shield region in the three-dimensional shape.
    Type: Grant
    Filed: December 16, 2015
    Date of Patent: June 25, 2019
    Assignee: KOH YOUNG TECHNOLOGY INC.
    Inventor: Joong-Ki Jeong
  • Patent number: 10324044
    Abstract: An apparatus, a method and a computer program product for defect detection in work pieces is disclosed. At least one light source is provided and the light source generates an illumination light of a wavelength range at which the work piece is transparent. A camera images the light from at least one face of the work piece on a detector of the camera by means of a lens. A stage is used for moving the work piece and for imaging the at least one face of the semiconductor device completely with the camera. The computer program product is disposed on a non-transitory, computer readable medium for defect detection in work pieces. A computer is used to execute the various process steps and to control the various means of the apparatus.
    Type: Grant
    Filed: July 1, 2016
    Date of Patent: June 18, 2019
    Assignee: KLA-Tencor Corporation
    Inventors: Tom Marivoet, Carl Truyens, Christophe Wouters
  • Patent number: 10310389
    Abstract: Methods and apparatuses for measuring a plurality of structures formed on a substrate are disclosed. In one arrangement, a method includes obtaining data from a first measurement process. The first measurement process including individually measuring each of the plurality of structures to measure a first property of the structure. A second measurement process is used to measure a second property of each of the plurality of structures. The second measurement process includes illuminating each structure with radiation having a radiation property that is individually selected for that structure using the measured first property for the structure.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: June 4, 2019
    Assignee: ASML Netherlands B.V.
    Inventors: Nitesh Pandey, Jin Lian, Samee Ur Rehman, Martin Jacobus Johan Jak
  • Patent number: 10254214
    Abstract: Systems, devices, and methods for combined wafer and photomask inspection are provided. In some embodiments, chucks are provided, the chucks comprising: a removable insert, wherein the removable insert is configured to support a wafer so that an examination surface of the wafer lies within a focal range when the chuck is in a first configuration, wherein the removable insert is inserted into the chuck in the first configuration; and a first structure forming a recess that has a depth sufficient to support a photomask so that an examination surface of the photomask lies within the focal range when the chuck is in a second configuration, wherein the removable insert is not inserted into the chuck in the second configuration.
    Type: Grant
    Filed: February 20, 2018
    Date of Patent: April 9, 2019
    Assignee: Nanotronics Imaging, Inc.
    Inventors: Randolph E. Griffith, Jeff Andresen, Scott Pozzi-Loyola, Michael Moskie, Steve Scranton, Alejandro S. Jaime, John B. Putman
  • Patent number: 10249518
    Abstract: According to one embodiment, a polishing device includes a stage holding a wafer, a polishing part polishing a film formed on a circumferential edge portion of the wafer, a detector detecting a residual portion of the film on the circumferential edge portion, a first movable part moving the detector along a surface of the circumferential edge portion; and a controller controlling the polishing part based on a state of the circumferential edge portion detected by the detector.
    Type: Grant
    Filed: September 3, 2015
    Date of Patent: April 2, 2019
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Masayoshi Adachi, Jun Takayasu
  • Patent number: 10161886
    Abstract: A device implements a method for detecting contamination of an FTIR-based panel. The apparatus generates projection signals representing detection lines that have propagated on a plurality of propagation paths by total internal reflection (TIR) inside a transmissive panel such that contamination on the panel surface causes attenuation (frustration) of at least one of the projection signals. The device generates a transmission value for each detection line in the transmissive panel, and determines the presence of contamination on the surface of the panel by comparing the transmission values according to at least one of the presented comparison techniques.
    Type: Grant
    Filed: June 22, 2015
    Date of Patent: December 25, 2018
    Assignee: FlatFrog Laboratories AB
    Inventors: Nicklas Ohlsson, Tomas Christiansson
  • Patent number: 10151705
    Abstract: The present invention relates to a method for generating a compensation matrix during a substrate inspection.
    Type: Grant
    Filed: September 11, 2014
    Date of Patent: December 11, 2018
    Assignee: KOH YOUNG TECHNOLOGY INC.
    Inventors: Seungwon Jung, Jongjin Choi, Heewook You
  • Patent number: 10094787
    Abstract: An optical inspector includes a time varying beam reflector, a radiating source that irradiates the time varying beam reflector, a telecentric scan lens configured to direct the radiation reflected by the time varying beam reflector onto a first surface of a transparent sample, a first detector that receives at least a portion of top surface specular reflection, a second detector that receives at least a portion of the bottom surface specular reflection. A turning mirror may also be included. The turning mirror is a switchable mirror that can be adjusted to a first position where the turning mirror reflects the top and bottom surface specular reflection, and can be adjusted to a second position where the turning mirror does not reflect the top or the bottom surface specular reflection. A first and second polarizing element may also be included to detect additional types of defects on either surface.
    Type: Grant
    Filed: May 19, 2016
    Date of Patent: October 9, 2018
    Assignee: KLA-TENCOR CORPORATION
    Inventors: Steven W. Meeks, Rusmin Kudinar, Ronny Soetarman, Hung P. Nguyen
  • Patent number: 10067417
    Abstract: The present disclosure provides a mask plate, a mask exposure device and a mask exposure method, belongs to the field of display technology. The mask plate includes a tray with at least one mask locating slot, and a mask is arranged in each mask locating slot. By the mask plate, the mask exposure device and the mask exposure method provided by the present disclosure, an effective mask with a closed-loop shaped opening may be provided, thereby improving a quality of a film formed on a substrate.
    Type: Grant
    Filed: July 20, 2015
    Date of Patent: September 4, 2018
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Seiji Fujino, Song Zhang, Tao Wang, Jing Gao, Xiaobo Du
  • Patent number: 10062612
    Abstract: Generally, the present disclosure is directed to a method for forming a FinFET device that may be used in designs that include both tight and relaxed fin pitches. The method for forming the fins includes: forming a first layer of doped silicate glass above a semiconductor wafer and within a plurality of recesses located adjacent the fins; forming a first layer of nitride above the first doped silicate glass layer; and forming a conformal oxide layer above the first nitride layer, substantially filling relatively narrow recesses between fins having a tight pitch and lining relatively wide recesses between fins having a relaxed pitch.
    Type: Grant
    Filed: October 7, 2016
    Date of Patent: August 28, 2018
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: David Paul Brunco, Daniel Jaeger
  • Patent number: 10041873
    Abstract: Methods and systems for performing optical measurements of the porosity of geometric structures filled with a fill material by a capillary condensation process are presented herein. Measurements are performed while the structure under measurement is treated with a flow of purge gas that includes a controlled amount of vaporized fill material. A portion of the fill material condenses and fills openings in the structural features such as pores of a planar film, spaces between structural features, small volumes such as notches, trenches, slits, contact holes, etc. In one aspect, the desired degree of saturation of vaporized material in the gaseous flow is determined based on the maximum feature size to be filled. In another aspect, measurement data is collected when a structure is unfilled and when the structure is filled. The collected data is combined in a multi-target model based measurement to estimate values of porosity and critical dimensions.
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: August 7, 2018
    Assignee: KLA-Tencor Corporation
    Inventor: Shankar Krishnan
  • Patent number: 9978588
    Abstract: Approaches for protecting a semiconductor device (e.g., a fin field effect transistor device (FinFET)) using a nitride spacer are provided. Specifically, a nitride spacer is formed over an oxide and a set of fins of the FinFET device to mitigate damage during subsequent processing. The nitride spacer is deposited before the block layers to protect the oxide on top of a set of gates in an open area of the FinFET device uncovered by a photoresist. The oxide on top of each gate will be preserved throughout all of the block layers to provide hardmask protection during subsequent source/drain epitaxial layering. Furthermore, the fins that are open and uncovered by the photoresist or the set of gates remain protected by the nitride spacer. Accordingly, fin erosion caused by amorphization of the fins exposed to resist strip processes is prevented, resulting in improved device yield.
    Type: Grant
    Filed: March 2, 2016
    Date of Patent: May 22, 2018
    Assignee: GLOBALFOUNDRIES INC.
    Inventor: Michael Ganz
  • Patent number: 9952269
    Abstract: A method and system of a method of measuring complex dielectric constant and permeability includes directing two polarizations onto a material under test and measuring one or more values of reflection coefficients. Further, the method includes integrating a p-wave reflection coefficient and a s-wave reflection coefficient and calculating, based on the measured one or more values of the reflection coefficients in association with a Brewster's angle, one or more of a complex dielectric constant and permeability.
    Type: Grant
    Filed: May 20, 2016
    Date of Patent: April 24, 2018
    Inventor: Kerim Akel
  • Patent number: 9952151
    Abstract: Provided herein is an apparatus, including a photon emitter configured to emit photons onto a surface of an article at a number of azimuthal angles; and a processing element configured to process photon-detector-array signals corresponding to photons scattered from surface features of the article and generate one or more surface features maps for the article from the photon-detector-array signals corresponding to the photons scattered from the surface features of the article.
    Type: Grant
    Filed: October 13, 2016
    Date of Patent: April 24, 2018
    Assignee: Seagate Technology LLC
    Inventors: David M. Tung, Joachim W. Ahner
  • Patent number: 9921169
    Abstract: A method for detecting defects includes directing a scanning beam to a location on a surface of a transparent sample, measuring top and bottom surface specular reflection intensity, and storing coordinate values of the first location and the top and bottom surface specular reflection intensity in a memory. The method may further include comparing the top surface specular reflection intensity measured at each location with a first threshold value, comparing the bottom surface specular reflection intensity measured at each location with a second threshold value, and determining if a defect is present at each location and on which surface the defect is present. The method may further include comparing the top surface specular reflection intensity measured at each location with a first intensity range, comparing the bottom surface specular reflection intensity measured at each location with a second intensity range, and determining on which surface the defect is present.
    Type: Grant
    Filed: May 19, 2016
    Date of Patent: March 20, 2018
    Assignee: ZETA INSTRUMENTS, INC.
    Inventors: Steven W. Meeks, Rusmin Kudinar, Ronny Soetarman, Hung P. Nguyen