Of Light Permeable Material Patents (Class 356/632)
  • Patent number: 10261015
    Abstract: A solution for measuring a suspension which contains wood fibres. The consistency of the suspension is changed in a consistency range. Optical radiation is directed at the suspension and the intensity of optical radiation interacted with the suspension is measured at different consistencies in the consistency range. The maximum intensity of the optical radiation is determined within the consistency range. At least one of the following properties of the suspension are determined based on the determined maximum intensity: kappa number, brightness.
    Type: Grant
    Filed: November 14, 2017
    Date of Patent: April 16, 2019
    Assignee: VALMET AUTOMATION OY
    Inventors: Pasi Kärki, Matti Törmänen
  • Patent number: 10163669
    Abstract: A method for thickness measurement includes forming an implantation region in a semiconductor substrate. A semiconductor layer is formed on the implantation region of the semiconductor substrate. Modulated free carriers are generated in the implantation region of the semiconductor substrate. A probe beam is provided on the semiconductor layer and the implantation region of the semiconductor substrate with the modulated free carriers therein. The probe beam reflected from the semiconductor layer and the implantation region is detected to determine a thickness of the semiconductor layer.
    Type: Grant
    Filed: January 29, 2016
    Date of Patent: December 25, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ying-Chieh Hung, Ming-Hua Yu, Yi-Hung Lin, Jet-Rung Chang
  • Patent number: 10139263
    Abstract: An analytical system includes a laser disposed to direct light toward a microfluidic feature disposed in a feature layer of a multiple layer test cartridge, a sensor to receive reflections from capping layers disposed about the microfluidic feature in the feature layer, and a controller to determine a depth of the microfluidic feature as a function of the received reflections.
    Type: Grant
    Filed: March 11, 2013
    Date of Patent: November 27, 2018
    Assignee: Honeywell International Inc.
    Inventor: Tzu-Yu Wang
  • Patent number: 10090201
    Abstract: A semiconductor device manufacturing method includes forming a silicon layer by epitaxial growth over a semiconductor substrate having a first area and a second area; forming a first gate oxide film by oxidizing the silicon layer; removing the first gate oxide film from the second area, while maintaining the first gate oxide film in the first area; thereafter, increasing a thickness of the first gate oxide film in the first area and simultaneously forming a second gate oxide film by oxidizing the silicon layer in the second area; and forming a first gate electrode and a second gate electrode over the first gate oxide film and the second gate oxide film, respectively, wherein after the formation of the first and second gate electrodes, the silicon layer in the first area is thicker than the silicon layer in the second area.
    Type: Grant
    Filed: March 16, 2017
    Date of Patent: October 2, 2018
    Assignee: FUJITSU SEMICONDUCTOR LIMITED
    Inventors: Makoto Yasuda, Taiji Ema, Mitsuaki Hori, Kazushi Fujita
  • Patent number: 9588030
    Abstract: In the dihedral sensor system, two flat plates are secured to a dihedron so that the distance (L) between the edge and the meniscus and the spacing between the plates (a) on the meniscus will be a function of the dihedron tangent (?). Thus, for pure water the tension (?) is equal to the potential (T) and given by T=?2?/[L tg(?)], wherein ? is the water surface tension. In order to measure water tension in the soil, the system is coupled to porous elements, while the sensor edge is pressed directly against roots and other plant organs. Water potential, instead, is measured with the edge positioned at a few micrometers from the sample and the response takes place after the exchange of a few picoliters of water, when the condition of balance of temperature and water vapor is approached. Visually, with a sliding gauge, one measures water tensions between zero and 0.3 MPa, while with the aid of a microscope the reading extends up to 3.0 MPa. The water activity corresponding to water potentials lower than ?3.
    Type: Grant
    Filed: January 3, 2011
    Date of Patent: March 7, 2017
    Assignee: EMBRAPA-EMPRESA BRASILEIRA DE PESQUISA AGROPECUARIA
    Inventor: Adonai Gimenez Calbo
  • Patent number: 9157729
    Abstract: A light sensor-containing apparatus for detecting the thickness of inserts placed within a mailer including a picker arm, movable picker jaw that pivots during an insert gripping process, a target plate having a light reflective surface and secured to the picker arm end that moves when gripping an insert, and a light sensor mounted to the picker arm that emits a light beam and receives a reflected light beam that is reflected back from the light reflective surface to establish the thickness of the insert as controlled by associated computer programming is presented.
    Type: Grant
    Filed: January 10, 2014
    Date of Patent: October 13, 2015
    Assignee: DST OUTPUT WEST, LLC
    Inventors: Adam Bergeron, Fladorik Hima, Joel Lund
  • Patent number: 9147102
    Abstract: A method and device for measuring a height of a microscopic structure such as solder bumps. For simplicity of explanation, the invention is described with respect to phase information and amplitude information wherein phase detection and calculation algorithms are being used.
    Type: Grant
    Filed: January 2, 2012
    Date of Patent: September 29, 2015
    Assignee: CAMTEK LTD.
    Inventors: Shimon Koren, Or Shur, Gilad Golan
  • Patent number: 9130113
    Abstract: A method and system provide for depositing a TCO, transparent conductive oxide, film in one chamber of a manufacturing tool then irradiating the TCO film with light energy in another chamber of the same tool. The TCO film is used in a solar cell and formed on a solar cell substrate in some embodiments. The method includes irradiating the TCO film for a time and energy to reduce resistance of the TCO film without reducing transmittance. One or multiple light sources are used in the light irradiation chamber. Light in the infrared range, visible light range and ultraviolet light range are used either individually or in combination.
    Type: Grant
    Filed: December 14, 2012
    Date of Patent: September 8, 2015
    Assignee: TSMC Solar Ltd.
    Inventors: Yung-Sheng Chiu, Chun-Heng Chen, Tzu-Huan Cheng, Chien-Yao Huang
  • Publication number: 20150138568
    Abstract: A lithographic mask has a substrate substantially transmissive for radiation of a certain wavelength, the substrate having a radiation absorbing material in an arrangement, the arrangement configured to apply a pattern to a cross-section of a radiation beam of the certain wavelength, wherein the absorbing material has a thickness which is substantially equal to the certain wavelength divided by a refractive index of the absorbing material.
    Type: Application
    Filed: January 28, 2015
    Publication date: May 21, 2015
    Applicant: ASML NETHERLANDS B.V.
    Inventor: Jozef Maria FINDERS
  • Publication number: 20150017887
    Abstract: A polishing apparatus capable of achieving a highly-precise polishing result is disclosed. The polishing apparatus includes an in-line film-thickness measuring device configured to measure a film thickness of the substrate in a stationary state, and an in-situ spectral film-thickness monitor having a film thickness sensor disposed in a polishing table, the in-situ spectral film-thickness monitor being configured to subtract an initial film thickness, measured by the in-situ spectral film-thickness monitor before polishing of the substrate, from an initial film thickness, measured by the in-line film-thickness measuring device before polishing of the substrate, to determine a correction value, add the correction value to a film thickness that is measured when the substrate is being polished to obtain a monitoring film thickness, and monitor a progress of polishing of the substrate based on the monitoring film thickness.
    Type: Application
    Filed: July 9, 2014
    Publication date: January 15, 2015
    Inventors: Yoichi KOBAYASHI, Katsuhide WATANABE, Yoichi SHIOKAWA, Keita YAGI, Masaki KINOSHITA
  • Publication number: 20150009509
    Abstract: Provided are a transparent substrate monitoring apparatus and a transparent substrate monitoring method. The transparent substrate monitoring apparatus includes a light emitting unit emitting light; a double slit disposed on a plane defined in a first direction and a second direction intersecting a propagation direction of incident light and includes a first slit and a second slit spaced apart from each other in the first direction to allow the light to pass therethrough; an optical detection unit measuring an intensity profile or position of an interference pattern formed on a screen plane; and a signal processing unit receiving a signal from the optical detection unit to calculate an optical phase difference or an optical path difference.
    Type: Application
    Filed: September 19, 2014
    Publication date: January 8, 2015
    Inventors: Jae-Wan KIM, Jong-Ahn KIM, Jong-Han JIN, Chu-Shik KANG, Tae-Bong EOM
  • Patent number: 8922790
    Abstract: An optical film thickness measuring device, enabling direct measurement of a film thickness of a product in real time accurately without a monitor substrate, includes: a projector, a light receiver, inner beam splitters disposed in a base substrate holder to reflect a measurement beam to a base substrate, an inner optical reflector that totally reflects a measurement beam from the closest inner beam splitter, external beam splitters the measurement beam from the inner beam splitters toward the light receiver, and an outer optical reflector that reflects the measurement beam from the optical reflector toward the light receiver. The measurement beam reflected by the inner beam splitters and the inner optical reflector is passed through the base substrate and then reflected by the external beam splitters and the outer optical reflector to be guided to the light receiver, so that the measurement beam is received by the light receiver.
    Type: Grant
    Filed: February 15, 2012
    Date of Patent: December 30, 2014
    Assignee: Shincron Co., Ltd.
    Inventors: Kyokuyo Sai, Yousong Jiang, Kenji Ozawa
  • Patent number: 8917398
    Abstract: An apparatus arranged to analyze a multi-layer optical material structure, the apparatus constituted of: a control unit, a light source outputting light; and a light receiver arranged to receive the light from the light source after interaction with the target structure, the control unit arranged to: detect the amplitude of the received light as a function of wavelength; perform a transform of a function of the detected amplitudes to the optical thickness domain; determine, responsive to a planned composition of the target multi-layer structure, optical thickness and amplitude of expected peaks of the performed transform to the optical thickness domain which correspond with interactions with single interface between layers; identify actual peaks of the performed transform to the optical thickness domain which correspond with interfaces between layers; and determine at least one physical characteristic of the target structure responsive to the determined peaks.
    Type: Grant
    Filed: August 28, 2011
    Date of Patent: December 23, 2014
    Assignee: G & D Innovative Analysis Ltd.
    Inventor: Gustavo E. Aizenberg
  • Patent number: 8913254
    Abstract: An optical wall-thickness measuring device for transparent articles. This invention may be practiced with any transparent material, amorphous or crystalline, which has two surfaces in close proximity to each other, and has flat or positively curved shape. As used herein, transparent means clear, translucent or partially transmitting such that a discernible image of the second surface reflection can be formed and detected at some wavelength of electromagnetic radiation.
    Type: Grant
    Filed: March 30, 2011
    Date of Patent: December 16, 2014
    Inventor: Clifton George Daley
  • Patent number: 8902436
    Abstract: A method is provided for determining a thickness L of a chiral slab that refracts incident linearly polarized light into right (+) and left (?) circularly polarized beams. The method includes disposing the slab in an achiral medium, determining values of translation coefficients ?±, determining values for refraction angle differences (?+???), selecting pre- and post selection states |?i and |?j, projecting an emitted light beam through said achiral medium into the chiral slab a small established angle of incidence ?0, varying slab egress phase angles ?±, determining said pointer mean value x, calculating weak value Aw, and calculating the thickness as L = ? x ? Re ? ? A w . The achiral medium has an established index of refraction n0. The translation coefficients ?± establish refraction translation differences (?+???). The pre-selection state |?i establishes pre-selection alignment angle to satisfy ?=?/4.
    Type: Grant
    Filed: June 27, 2011
    Date of Patent: December 2, 2014
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventor: Allen D. Parks
  • Publication number: 20140333937
    Abstract: A system for inspecting specimens such as semiconductor wafers is provided. The system provides scanning of dual-sided specimens using a diffraction grating that widens and passes nth order (n>0) wave fronts to the specimen surface and a reflective surface for each channel of the light beam. Two channels and two reflective surfaces are preferably employed, and the wavefronts are combined using a second diffraction grating and passed to a camera system having a desired aspect ratio. The system preferably comprises a damping arrangement which filters unwanted acoustic and seismic vibration, including an optics arrangement which scans a first portion of the specimen and a translation or rotation arrangement for translating or rotating the specimen to a position where the optics arrangement can scan the remaining portion(s) of the specimen. The system further includes means for stitching scans together, providing for smaller and less expensive optical elements.
    Type: Application
    Filed: July 22, 2014
    Publication date: November 13, 2014
    Inventors: Dieter Mueller, Rainer Schierle, Daniel Ivanov Kavaldjiev
  • Patent number: 8818755
    Abstract: Various embodiments are directed to systems and methods for measuring a thickness of a container. For example, a control device may receive data indicating a surface topology of the container and based on the surface topology of the container, instruct a multi-axis positioning system to position a sensor relative to a first point of the container such that: a distance from the sensor to a surface at the first point is about equal to a predetermined distance; and the sensor direction is about normal to the surface at the first point. Data indicating the thickness at the first point may be received from the sensor.
    Type: Grant
    Filed: October 12, 2011
    Date of Patent: August 26, 2014
    Assignee: AGR International, Inc.
    Inventors: Georg V. Wolfe, William E. Schmidt, Jeffery A. Peterson, Edward J. Fisher
  • Patent number: 8810786
    Abstract: A device for detecting the level of a liquid in a container, includes an optical structure facing at least partly the region inside the container in a position corresponding to a predefined level of the liquid and having a main surface, a first side surface and a second side surface which are inclined at about 45° with respect to the main surface and about 90° relative to each other; and an emitter and a receiver facing the main surface of the optical structure and able to send a radiation beam towards the first side surface and, respectively, receive a radiation beam emitted by the emitter and reflected by the first and second side surfaces, when the level of the liquid inside the container is lower than the predefined level. The structure extends mainly outside the container and faces the region inside the container only opposite the first side surface.
    Type: Grant
    Filed: March 24, 2010
    Date of Patent: August 19, 2014
    Assignee: Elbi International S.p.A.
    Inventors: Giuseppe Marone, Marco Musso
  • Patent number: 8797607
    Abstract: A recording media deciding apparatus has: a light radiating portion which radiates light having a uniform light amount on a range corresponding to an image capturing range of a first surface of a bundle of recording media; a light detecting portion which captures an image of light emitted from a second surface different from the first surface of the bundle of the recording media; and a controller which decides on a type of the recording media based on an output of the light detecting portion.
    Type: Grant
    Filed: June 23, 2011
    Date of Patent: August 5, 2014
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Tec Kabushiki Kaisha
    Inventors: Hiromichi Hayashihara, Masataka Shiratsuchi
  • Publication number: 20140185061
    Abstract: A method and system for real-time, in-line measurements of thicknesses of semiconductor layers of photovoltaic devices is provided. The method and system include taking ex-situ optical data measurements after deposition of the semiconductor layers. The measurements are then used to calculate the thicknesses of the layers in real-time using optical modeling software.
    Type: Application
    Filed: December 19, 2013
    Publication date: July 3, 2014
    Applicant: FIRST SOLAR, INC
    Inventors: Benyamin Buller, David Hwang, Benjamin Milliron, Dale Roberts, Rui Shao, Zhibo Zhao
  • Publication number: 20140186975
    Abstract: A method and system for real-time, in-line calculations of opto-electronic properties and thickness of the layers of multi-layered transparent conductive oxide stacks of photovoltaic devices is provided. The method and system include taking measurements of each layer of the stack during deposition thereof. The measurements are then used to calculate the opto-electronic properties and thicknesses of the layers in real-time.
    Type: Application
    Filed: December 19, 2013
    Publication date: July 3, 2014
    Applicant: FIRST SOLAR, INC
    Inventors: Benyamin Buller, Douglas Dauson, David Hwang, Scott Mills, Dale Roberts, Rui Shao, Zhibo Zhao
  • Patent number: 8736851
    Abstract: A film thickness measuring device includes a spectroscopic sensor and a data processor, wherein the spectroscopic sensor measures spectroscopic data of a film coated on a substrate and the data processor obtains measured color characteristic variables from the measured spectroscopic data, compares the measured color characteristic variables with plural sets of theoretical color characteristic variables corresponding to plural sets of values, each set including one of plural values of thickness and one of plural values of index of refraction of the film, determines index of refraction of the film using the set of values corresponding to the set of theoretical color characteristic variables which minimizes a difference between the set of theoretical color characteristic variables and the measured color characteristic variables, and determines thickness of the film using the index of refraction of the film.
    Type: Grant
    Filed: September 25, 2013
    Date of Patent: May 27, 2014
    Assignee: Nireco Corporation
    Inventors: Takeo Yamada, Takeshi Yamamoto, Shingo Kawai
  • Publication number: 20140029019
    Abstract: An inspection process for detecting defects of thin type, on transparent containers for a series of inspection points distributed over an inspection region superposed according to a determined height of the container taken according to central axis thereof, and according to the circumference of the container comprising: sending a light beam so as to recover on a light sensor the reflected beams by the internal and external faces of the wall of the container, measuring at each inspection point the thickness of the wall as a function of separation at the level of the light sensor between the reflected beams by the internal and external faces, processing the thickness measurements by analysing their distribution over the inspection region to extract therefrom geometric characteristics, and comparing these geometric characteristics to reference values to determine if the container has a material distribution defect.
    Type: Application
    Filed: February 16, 2012
    Publication date: January 30, 2014
    Applicant: MSC & SGCC
    Inventors: Marc Leconte, Guillaume Bathelet
  • Publication number: 20140022564
    Abstract: A film thickness measuring device includes a spectroscopic sensor and a data processor, wherein the spectroscopic sensor measures spectroscopic data of a film coated on a substrate and the data processor obtains measured color characteristic variables from the measured spectroscopic data, compares the measured color characteristic variables with plural sets of theoretical color characteristic variables corresponding to plural sets of values, each set including one of plural values of thickness and one of plural values of index of refraction of the film, determines index of refraction of the film using the set of values corresponding to the set of theoretical color characteristic variables which minimizes a difference between the set of theoretical color characteristic variables and the measured color characteristic variables, and determines thickness of the film using the index of refraction of the film.
    Type: Application
    Filed: September 25, 2013
    Publication date: January 23, 2014
    Applicant: NIRECO CORPORATION
    Inventors: Takeo YAMADA, Takeshi YAMAMOTO, Shingo KAWAI
  • Publication number: 20140016139
    Abstract: An optical film thickness measuring device, enabling direct measurement of a film thickness of a product in real time accurately without a monitor substrate, includes: a projector, a light receiver, inner beam splitters disposed in a base substrate holder to reflect a measurement beam to a base substrate, an inner optical reflector that totally reflects a measurement beam from the closest inner beam splitter, external beam splitters the measurement beam from the inner beam splitters toward the light receiver, and an outer optical reflector that reflects the measurement beam from the optical reflector toward the light receiver. The measurement beam reflected by the inner beam splitters and the inner optical reflector is passed through the base substrate and then reflected by the external beam splitters and the outer optical reflector to be guided to the light receiver, so that the measurement beam is received by the light receiver.
    Type: Application
    Filed: February 15, 2012
    Publication date: January 16, 2014
    Applicant: SHINCRON CO., LTD.
    Inventors: Kyokuyo Sai, Yousong Jiang, Kenji Ozawa
  • Publication number: 20130050687
    Abstract: An apparatus arranged to analyze a multi-layer optical material structure, the apparatus constituted of: a control unit, a light source outputting light; and a light receiver arranged to receive the light from the light source after interaction with the target structure, the control unit arranged to: detect the amplitude of the received light as a function of wavelength; perform a transform of a function of the detected amplitudes to the optical thickness domain; determine, responsive to a planned composition of the target multi-layer structure, optical thickness and amplitude of expected peaks of the performed transform to the optical thickness domain which correspond with interactions with single interface between layers; identify actual peaks of the performed transform to the optical thickness domain which correspond with interfaces between layers; and determine at least one physical characteristic of the target structure responsive to the determined peaks.
    Type: Application
    Filed: August 28, 2011
    Publication date: February 28, 2013
    Applicant: G & D INNOVATIVE ANALYSIS LTD.
    Inventor: Gustavo E. AIZENBERG
  • Patent number: 8384915
    Abstract: A method and test block for controlling weld penetration depth in a work piece are disclosed. The test block simulates a work piece relative to a welding process of the work piece. The test block includes a test welding path. The test welding path replicates a production welding path on a weld surface of the work piece. The test block includes a melt-thru surface that underlies the test welding path. The melt-thru surface is spaced apart from the test welding path by a spacing that decreases along a length of the test welding path. The spacing varies from more than a standard weld penetration depth to less than the standard weld penetration depth.
    Type: Grant
    Filed: October 1, 2010
    Date of Patent: February 26, 2013
    Assignee: Rosemount Inc.
    Inventors: Eric P. Petersen, Daniel S. Sampson
  • Patent number: 8379227
    Abstract: One or more parameters of a sample that includes a textured substrate and one or more overlying films is determined using, e.g., an optical metrology device to direct light to be incident on the sample and detecting light after the incident light interacts with the sample. The acquired data is normalized using reference data that is produced using a textured reference sample. The normalized data is then fit to simulated data that is associated with a model having an untextured substrate and one or more variable parameters. The value(s) of the one or more variable parameters from the model associated with the simulated data having the best fit is reported as measurement result.
    Type: Grant
    Filed: October 28, 2009
    Date of Patent: February 19, 2013
    Assignee: Nanometrics Incorporated
    Inventor: Ira Naot
  • Publication number: 20130033698
    Abstract: The present invention is a film thickness measurement apparatus including a light source, a first optical path, a first condenser lens, a spectrometry unit, a second optical path, a second condenser lens, and a data processing unit. The light source emits measurement light having a predetermined wavelength range. The first optical path guides to an object to be measured the measurement light. The first condenser lens condenses the measurement light. The spectrometry unit obtains a wavelength distribution characteristic of reflectance or transmittance. The second optical path guides to the spectrometry unit the light reflected by or transmitted through the object. The second condenser lens condenses light at an end of the second optical path. The data processing unit analyzes the wavelength distribution characteristic obtained in the spectrometry unit to obtain a film thickness of the object.
    Type: Application
    Filed: June 29, 2012
    Publication date: February 7, 2013
    Applicant: Otsuka Electronics Co., Ltd.
    Inventor: Tadayoshi FUJIMORI
  • Patent number: 8310686
    Abstract: A method and means for determining the thickness, or curvature, of a thin film or stack of thin films disposed on the surface of a substrate having a curvature comprising generating a beam of radiation, focusing the beam through the one or more films onto a surface of the substrate, measuring the intensity across the reflected beam as a function of the angle of incidence of a plurality of rays derived from the focussed beam, determining the path of each of the plurality of rays and determining the thickness, or curvature of the film, or films, from the angular dependent intensity measurement.
    Type: Grant
    Filed: March 28, 2008
    Date of Patent: November 13, 2012
    Assignee: Nightingale-EOS Ltd
    Inventor: Stephen Morris
  • Patent number: 8292693
    Abstract: A method of controlling the polishing of a substrate includes polishing a substrate on a first platen using a first set of parameters, obtaining first and second sequences of measured spectra from first and second regions of the substrate with an in-situ optical monitoring system, generating first and second sequences of values from the first and second sequences of measured spectra, fitting first and second linear functions to the first and second sequences of values, determining a difference between the first linear function and the second linear function, adjusting at least one parameter of the first set of parameters based on the difference, and polishing the second substrate on the first platen using the adjusted parameter.
    Type: Grant
    Filed: November 24, 2009
    Date of Patent: October 23, 2012
    Assignee: Applied Materials, Inc.
    Inventors: Jeffrey Drue David, Harry Q. Lee, Boguslaw A. Swedek, Dominic J. Benvegnu, Zhize Zhu, Wen-Chiang Tu
  • Patent number: 8279453
    Abstract: There is provided a method of measuring a physical thickness of each of layers of a multilayer film, based on an optical thickness thereof. The method includes: (a) setting refractive indexes of the layers; (b) calculating a coefficient matrix using the refractive indexes; (c) providing light to the multilayer film so as to measure the optical thickness based on the light reflected by the multilayer film; and (d) calculating the physical thickness, based on the optical thickness and the coefficient matrix.
    Type: Grant
    Filed: October 29, 2010
    Date of Patent: October 2, 2012
    Assignee: Yokogawa Electric Corporation
    Inventor: Kazufumi Nishida
  • Publication number: 20120133958
    Abstract: The present invention provides apparatus for a non-contact method of obtaining accurate three-dimensional measurements of a dry contact lens, more specifically, using dry lens metrology to know the exact thickness of a contact lens.
    Type: Application
    Filed: November 28, 2011
    Publication date: May 31, 2012
    Inventors: Michael F. Widman, John B. Enns, P. Mark Powell, Peter W. Sites, Christopher Wildsmith
  • Publication number: 20120127487
    Abstract: Methods and apparatuses for determining a thickness of a glass substrate are disclosed. The method includes conveying the glass substrate past an optical measurement head and determining a measurement separation distance dm between a first surface plane of the glass substrate and the optical measurement head. A position of the optical measurement head relative to the first surface plane of the glass substrate is adjusted based on the measurement separation distance dm between the first surface plane of the glass substrate and the optical measurement head such that the glass substrate is within a working range of the optical measurement head as the glass substrate is conveyed past the optical measurement head. A thickness Tm of the glass substrate is measured with the optical measurement head as the glass substrate is conveyed past the optical measurement head.
    Type: Application
    Filed: November 18, 2010
    Publication date: May 24, 2012
    Inventor: Sergey Potapenko
  • Patent number: 8184303
    Abstract: Objects are to reduce the burden on an operator and to improve fabrication efficiency. A transparent conductive film or a transparent optical film formed on a substrate W is irradiated with line illumination light by means of a line illumination device 3, line reflected light reflected at the transparent conductive film or the transparent optical film is detected with a camera, a color evaluation value of the detected reflected light is measured, and a film thickness corresponding to the measured color evaluation value is obtained using a film-thickness characteristic in which the color evaluation value is associated with the film thickness.
    Type: Grant
    Filed: October 31, 2007
    Date of Patent: May 22, 2012
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Satoshi Sakai, Yoichiro Tsumura, Masami Iida, Kohei Kawazoe
  • Publication number: 20120094401
    Abstract: A method of inspecting a semiconductor substrate having a back surface and including at least one piece of metal embedded in the substrate comprises directing measuring light towards the back surface of the substrate and detecting a portion of the measuring light received back from the substrate. The method also includes determining a distance between the piece of metal and the back surface based upon the detected measuring light received back from the substrate.
    Type: Application
    Filed: April 18, 2011
    Publication date: April 19, 2012
    Applicants: IMEC, Nanda Technologies GmbH
    Inventors: Lars Markwort, Pierre-Yves Guittet, Sandip Halder, Anne Jourdain
  • Patent number: 8139234
    Abstract: A method of measuring the extinction of light in a coating including the steps of: directing a light beam to a substrate to be coated at an angle of incidence for which the beam undergoes nominal total internal reflection; depositing a coating on the substrate such that the light beam will be waveguided in the coating thus reducing internal reflection for a period of deposition time; measuring a reduction of the internal reflection during deposition; and calculating an extinction value of the light beam in the deposited layer corresponding to the measured drop in internal reflection.
    Type: Grant
    Filed: October 26, 2006
    Date of Patent: March 20, 2012
    Inventor: George Dubé
  • Patent number: 8125635
    Abstract: Apparatus for performing Raman analysis may include a laser source module, a beam delivery and signal collection module, a spectrum analysis module, and a digital signal processing module. The laser source module delivers a laser beam to the beam delivery and signal collection module. The beam delivery and signal collection module delivers the laser source beam to a sample, collects Raman scattered light scattered from the sample, and delivers the collected Raman scattered light to the spectrum analysis module. The spectrum analysis module demultiplexes the Raman scattered light into discrete Raman bands of interest, detects the presence of signal energy in each of the Raman bands, and produces a digital signal that is representative of the signal energy present in each of the Raman bands. The digital signal processing module is adapted to perform a Raman analysis of the sample.
    Type: Grant
    Filed: June 21, 2011
    Date of Patent: February 28, 2012
    Assignee: PD-LD, Inc.
    Inventors: Vladimir Sinisa Ban, Boris Leonidovich Volodin, Neal R. Stoker
  • Patent number: 8116853
    Abstract: The attenuation and other optical properties of a medium are exploited to measure a thickness of the medium between a sensor and a target surface. Disclosed herein are various mediums, arrangements of hardware, and processing techniques that can be used to capture these thickness measurements and obtain three-dimensional images of the target surface in a variety of imaging contexts. This includes general techniques for imaging interior/concave surfaces as well as exterior/convex surfaces, as well as specific adaptations of these techniques to imaging ear canals, human dentition, and so forth.
    Type: Grant
    Filed: July 24, 2009
    Date of Patent: February 14, 2012
    Assignee: Massachusetts Institute of Technology
    Inventors: Douglas P. Hart, Federico Frigerio, Davide M. Marini
  • Patent number: 8112146
    Abstract: The attenuation and other optical properties of a medium are exploited to measure a thickness of the medium between a sensor and a target surface. Disclosed herein are various mediums, arrangements of hardware, and processing techniques that can be used to capture these thickness measurements and obtain three-dimensional images of the target surface in a variety of imaging contexts. This includes general techniques for imaging interior/concave surfaces as well as exterior/convex surfaces, as well as specific adaptations of these techniques to imaging ear canals, human dentition, and so forth.
    Type: Grant
    Filed: July 24, 2009
    Date of Patent: February 7, 2012
    Assignee: Massachusetts Institute of Technology
    Inventors: Douglas P. Hart, Federico Frigerio, Davide M. Marini
  • Publication number: 20110299098
    Abstract: One embodiment of the present invention is a method for measuring a coating amount in the case where a microcapsule coating liquid including a microcapsule in which a pigment is encapsulated and dispersed is coated on a microcapsule coating substrate, the method including steps of: detecting a transmission light intensity in the case where the microcapsule coating substrate on which the microcapsule coating liquid is in a wet state is irradiated with illuminating light; and calculating a thickness of a microcapsule display layer from the transmission light intensity, the microcapsule display layer formed by drying the microcapsule coating liquid.
    Type: Application
    Filed: August 16, 2011
    Publication date: December 8, 2011
    Applicant: Toppan Printing Co., Ltd.
    Inventor: Norifumi Furuya
  • Patent number: 8059282
    Abstract: A reflective film thickness measurement method includes reading an original spectral image of a thin film measured by a broadband light source passing through a measurement system, transforming the original spectral image into a broadband reflectance wavelength function and then into a broadband frequency-domain function, dividing the broadband frequency-domain function by a single-wavelength frequency-domain function to obtain an ideal frequency-domain function, inverse-transforming the ideal frequency-domain function into an ideal reflectance wavelength function, and performing a curve fitting on the ideal reflectance wavelength function and a reflectance wavelength thickness general expression, so as to obtain a thickness of the thin film. A spectral image spatial axis direction processing method is performed to eliminate optical aberration in a deconvolution manner, so as to obtain spectral images of high spatial resolution.
    Type: Grant
    Filed: August 27, 2008
    Date of Patent: November 15, 2011
    Assignee: Industrial Technology Research Institute
    Inventor: Fu-Shiang Yang
  • Publication number: 20110170097
    Abstract: Reflectance systems and methods are described that under-fill the collection fiber of a host spectrometer both spatially and angularly. The under-filled collection fiber produces a response of fiber-based spectrometers that is relatively insensitive to sample shape and position.
    Type: Application
    Filed: January 11, 2011
    Publication date: July 14, 2011
    Inventor: Scott A. Chalmers
  • Publication number: 20110102812
    Abstract: There is provided a method of measuring a physical thickness of each of layers of a multilayer film, based on an optical thickness thereof. The method includes: (a) setting refractive indexes of the layers; (b) calculating a coefficient matrix using the refractive indexes; (c) providing light to the multilayer film so as to measure the optical thickness based on the light reflected by the multilayer film; and (d) calculating the physical thickness, based on the optical thickness and the coefficient matrix.
    Type: Application
    Filed: October 29, 2010
    Publication date: May 5, 2011
    Applicant: YOKOGAWA ELECTRIC CORPORATION
    Inventor: Kazufumi NISHIDA
  • Publication number: 20110079178
    Abstract: A thickness measuring device for measuring the thickness of a layer on a substrate surface of a substrate is provided, including multiple piezoelectric crystal elements, which are arranged in an array corresponding to multiple positions on the substrate surface and which are adapted to monitor the deposition rate of a vapor to be deposited on the substrate surface.
    Type: Application
    Filed: October 9, 2009
    Publication date: April 7, 2011
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Sven SCHRAMM, Philipp MAURER
  • Patent number: 7920257
    Abstract: Disclosed are systems and methods for determining the shape of a glass sheet during and/or after the forming process. In one example, a system for determining the shape of a glass sheet defining an interior bulk can include a light source, an image capture device and a processor that are configured to calculate the location of an energy centroid within a selected portion of the bulk of the glass sheet.
    Type: Grant
    Filed: August 27, 2008
    Date of Patent: April 5, 2011
    Assignee: Corning Incorporated
    Inventors: Chong Pyung An, Philip Robert LeBlanc, James Arthur Smith, James Patrick Trice, Dale Alan Webb, Piotr Janusz Wesolowski
  • Publication number: 20110032523
    Abstract: An apparatus and method for measurement of the stress in and thickness of the walls of glass containers is disclosed that uses fluorescence to quickly and accurately ascertain both the thickness of the stress layers and the wall thickness in addition to the stress curve in glass containers. The apparatus and method may be used to quickly and accurately measure both the stress in and the thickness of the side walls of glass containers throughout the circumference of the glass containers. The apparatus and method are adapted for large scale glass container manufacturing, and are capable of high speed measurement of the stress in and the thickness of the side walls of glass containers.
    Type: Application
    Filed: August 5, 2009
    Publication date: February 10, 2011
    Inventors: William J. Furnas, Sarath K. Tennekoon, Gary C. Weber
  • Publication number: 20100319866
    Abstract: Optical radiation sources functioning on different optical bands radiate on different optical bands and focus optical radiation on a region in a web surface as pulses in such a manner that illumination areas of the pulses overlap on the plane of the web. At most one optical radiation band is focused on the web from the direction of the normal. The spatial intensity distribution of at least one optical band differs from the uniform distribution and the intensity distributions of at least two different optical bands differ from one another in a predetermined manner. A camera forms still images of the web surface region on each optical radiation band. An image-processing unit determines the surface topography of the web on the basis of the images. In addition, a controller may control the paper manufacturing process on the basis of the determined surface topography.
    Type: Application
    Filed: December 30, 2008
    Publication date: December 23, 2010
    Applicant: Metso Automation OY
    Inventors: Marko Avikainen, Petri Niemi, Heikki Kettunen, Markku Mantyla, Heimo Keranen
  • Patent number: 7835018
    Abstract: A method of determining the rate of change of optical thickness of a thin-film during deposition comprising the steps of illuminating the thin-film with electromagnetic radiation having a range of wavelengths, measuring the transmission spectrum of the thin-film at least twice during the deposition process to determine the wavelength ?t or turning points in the transmission spectrum, and using the measurements to determine the rate to change of optical thickness of the thin-film as a function of time. The method further comprises the steps of predicting a time T in the growth process at which the wavelength ?t of the turning point in the transmission spectrum of the thin-film will be substantially equal to the wavelength ?d of the turning point in the transmission spectrum of thin-film at its optical design thickness, and interrupting the growth process such that growth ceases at time T.
    Type: Grant
    Filed: February 12, 2007
    Date of Patent: November 16, 2010
    Assignee: Qinetiq Limited
    Inventor: Colin James Flynn
  • Publication number: 20100249664
    Abstract: There is described a method for determining a quantitative parameter of a compound in an analysis sample, comprising: providing a scattering medium in physical contact with the analysis sample, the scattering medium having at least one layer, an index of refraction of the scattering medium being superior to an index of refraction of the analysis sample; propagating, in the scattering medium, an incident beam of light having a wavelength substantially corresponding to an absorption wavelength of the compound such that an evanescent wave is generated at an interface between the scattering medium and the analysis sample; taking n intensity measurements of a reflected beam of light for the analysis sample, n being superior to one; and determining the quantitative parameter of the compound using the n intensity measurements for the analysis sample.
    Type: Application
    Filed: November 10, 2008
    Publication date: September 30, 2010
    Applicant: THE ROYAL INSTITUTION FOR THE ADVANCEMENT OF LEARN
    Inventors: David H. Burns, Fabiano Pandozzi