Thickness Patents (Class 356/630)
  • Patent number: 10365212
    Abstract: The disclosure provides an optical calibration device for in-chamber calibration of optical signals associated with a processing chamber, a characterization system for plasma processing chambers, methods of characterizing plasma processing chambers, and a chamber characterizer. In one example, the optical calibration device includes: (1) an enclosure, (2) an optical source located within the enclosure and configured to provide a source light having a continuous spectrum, and (3) optical shaping elements located within the enclosure and configured to form the source light into a calibrating light that approximates a plasma emission during an operation within the processing chamber.
    Type: Grant
    Filed: November 2, 2017
    Date of Patent: July 30, 2019
    Assignee: Verity Instruments, Inc.
    Inventors: Andrew Weeks Kueny, Mike Whelan, Mark Anthony Meloni, John D. Corless, Rick Daignault, Sean Lynes
  • Patent number: 10295330
    Abstract: A method includes introducing light into a glass article such that at least a portion of the introduced light is emitted from an edge of the glass article. The light emitted from an edge of the glass article is detected. An intensity profile of the emitted light is an intensity of the emitted light as a function of axial position. A first intensity boundary of the intensity profile and a second intensity boundary of the intensity profile are determined. A thickness of a layer of the glass article is determined based on an axial distance between the first intensity boundary and the second intensity boundary.
    Type: Grant
    Filed: June 4, 2015
    Date of Patent: May 21, 2019
    Assignee: CORNING INCORPORATED
    Inventors: Chong Pyung An, Sang-Mook Lee, James Patrick Trice
  • Patent number: 10241058
    Abstract: Quality control of a periodic structure is performed using the damping rate of acoustic waves generated in the periodic structure. In this technique, an excitation light beam illuminates the first layer in the periodic structure to excite an acoustic wave. Possible irregularities in the periodic structure can scatter the acoustic wave, thereby increasing the damping rate of the acoustic wave. A sequence of probe light beams illuminates the periodic structure to measure the acoustic wave as a function of time to generated a temporal signal representing the damping rate of the acoustic signal. The acquired damping rate is employed to evaluate the quality of the periodic structure.
    Type: Grant
    Filed: July 5, 2017
    Date of Patent: March 26, 2019
    Assignee: Massachusetts Institute of Technology
    Inventors: Alexei Maznev, Keith A. Nelson, Abdelhak Bensaoula, Jateen S. Gandhi, Donna Washington Stokes, Rebecca Lynne Forrest, Hyun Doug Shin
  • Patent number: 10241051
    Abstract: Methods and systems are presented for analyzing semiconductor materials as they progress along a production line, using photoluminescence images acquired using line-scanning techniques. The photoluminescence images can be analyzed to obtain spatially resolved information on one or more properties of said material, such as lateral charge carrier transport, defects and the presence of cracks. In one preferred embodiment the methods and systems are used to obtain series resistance images of silicon photovoltaic cells without making electrical contact with the sample cell.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: March 26, 2019
    Assignee: BT IMAGING PTY LTD
    Inventors: Thorsten Trupke, Juergen Weber
  • Patent number: 10222255
    Abstract: A linearly-overlapping light measurement system “measurement head” having one or more linearly-overlapping modular light sources each having individual light sources arranged in a geometric pattern, the light sources being single- or multi-wavelength and programmable to generate light that is transmitted through and/or reflected from a work piece to be detected by linearly-overlapping modular light detectors having individual light detectors arranged in a geometric pattern. The “measurement head” also has linearly-overlapping modular light detectors arranged in a geometric pattern to receive light emitted by the light sources. A computer controller coordinating the operation of the light source array and light detector array to automatically sense and record the light transmittance and/or reflectance of one or more spectral ranges in real time from the work piece and then adjust the work being performed on the work piece to attain pre-determined standards.
    Type: Grant
    Filed: August 16, 2017
    Date of Patent: March 5, 2019
    Inventors: John P Waszak, Stephen J Waszak
  • Patent number: 10184784
    Abstract: The invention relates to a device serving for the combined measurement of the width and thickness of a flat object, in particular a plate, a belt, or a web. The device comprises a measurement apparatus which has at least one contactless sensor, which is for width measurement on the object and which is movable crosswise to the longitudinal direction or conveying direction of the object. According to the invention, on the opposite side of the object, there is a second sensor opposite the first sensor which, together with the first sensor, serves for thickness measurement on the object, wherein the two sensors can travel above and below the object, that is, on opposite sides of the object.
    Type: Grant
    Filed: May 3, 2016
    Date of Patent: January 22, 2019
    Assignee: MICRO-EPSILON Messtechnik GmbH & Co. KG
    Inventors: Achim Sonntag, Herbert Fuellmeier, Gerhard Kirschner
  • Patent number: 10184786
    Abstract: A wear amount measuring apparatus includes a light source, a light transmission unit, a first and a second irradiation unit, a spectroscope and an analysis unit. The light transmission unit splits a low-coherence light from the light source into a first and a second low-coherence light. The first and the second irradiation units irradiate the first and the second low-coherence light to the component to receive reflected lights from the component. The light transmission unit transmits the reflected lights received by the first irradiation unit and the second irradiation unit to the spectroscope. The spectroscope configured to detect intensity distribution of the reflected lights from the first and the second irradiation unit. The analysis unit calculates a thickness difference between a thickness of the component at the first measuring point and that at the second measuring point by performing Fourier transform on the intensity distribution.
    Type: Grant
    Filed: December 15, 2014
    Date of Patent: January 22, 2019
    Assignee: TOKYO ELECTRON LIMITED
    Inventor: Tatsuo Matsudo
  • Patent number: 10168142
    Abstract: An optical characteristic measuring apparatus includes an optical system, a detector, and an analysis unit. The optical system collects detection light incident from a sample. The detector spectrally disperses the detection light in plural times to generate plural pieces of detection data, the plural pieces of detection data indicating their respective spectra of detection light incident from the sample to the optical system with an optical distance between the sample and the optical system being different from each other. The analysis unit analyzes the spectrum indicated by the detection data to measure a predetermined optical characteristic of the sample. The analysis unit specifies a piece of the detection data to be used for measuring the optical characteristic based on intensity of the detection light in the plural pieces of detection data, and measures the optical characteristic based on the specified piece of the detection data.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: January 1, 2019
    Assignee: OTSUKA ELECTRONICS CO., LTD.
    Inventors: Sota Okamoto, Yuki Sasaki, Seon Heum Na
  • Patent number: 10160088
    Abstract: A method for polishing a polishing pad includes detecting a presence of a defect formed on a groove of a polishing pad; removing the defect from the groove of the polishing pad; after removing the defect, measuring a remaining depth of the groove; and based on the measured remaining depth of the groove, applying a polishing condition on the groove.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: December 25, 2018
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Che-Liang Chung, Chun-Kai Tai, Shich-Chang Suen, Wei-Chen Hsiao
  • Patent number: 9804025
    Abstract: A printer incorporating a spectrometry device includes a spectroscope that includes a light receiving optical system including a light receiver which receives reflected light from a range of measurement in a medium, a distance sensor that detects the distance between the medium and the spectroscope, and a reflecting mirror driver and an optical path adjuster that adjust the optical path of the reflected light which is incident on the light receiving optical system from the range of measurement according to the distance detected by the distance sensor.
    Type: Grant
    Filed: March 4, 2016
    Date of Patent: October 31, 2017
    Assignee: Seiko Epson Corporation
    Inventors: Masashi Kanai, Naoki Kuwata
  • Patent number: 9802292
    Abstract: A method for polishing a polishing pad includes detecting, by a first sensor, a presence of a defect formed on a groove of a polishing pad; removing, by a polishing disc, the defect from the groove of the polishing pad; after removing the defect, measuring, by a second sensor, a remaining depth of the groove; and based on the measured remaining depth of the groove, applying, through the polishing disc, a polishing condition on the groove.
    Type: Grant
    Filed: February 19, 2016
    Date of Patent: October 31, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Che-Liang Chung, Shich-Chang Suen, Chun-Kai Tai, Wei-Chen Hsiao
  • Patent number: 9720333
    Abstract: The present invention provides a scan-type exposure apparatus comprising an aperture stop provided with at least one of a mask stage and a substrate stage and configured to reduce an influence of flare light, wherein an opening of the aperture stop includes a first opening portion corresponding to one shot region on a substrate, and a serrated second opening portion including a plurality of first openings that protrude in a second direction parallel to the scanning direction from a side of the first opening portion along a first direction perpendicular to the scanning direction, and a length of each of the plurality of first openings in the first direction decreases outward in the second direction from the side of the first opening portion along the first direction.
    Type: Grant
    Filed: June 11, 2015
    Date of Patent: August 1, 2017
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Ryo Koizumi, Daisuke Kobayashi
  • Patent number: 9709386
    Abstract: Disclosed are methods and apparatus for measuring a characteristics of a through-silicon via (TSV) structure. A beam profile reflectivity (BPR) tool is used to move to a first xy position having a TSV structure. The BPR tool is then used to obtain an optimum focus of at the first xy position by adjusting the z position to a first optimum z position for obtaining measurements at the first xy position. Via the BPR tool, reflectivity measurements for a plurality of angles of incidence are obtained at the first xy position. One or more film thicknesses for the TSV structure are determined based on the reflectivity measurements. A z position can also be recorded and used to determine a height of such TSV structure, as well as one or more adjacent xy positions.
    Type: Grant
    Filed: April 5, 2016
    Date of Patent: July 18, 2017
    Assignee: KLA-Tencor Corporation
    Inventors: Lena Nicolaides, Timothy Goodwin, Raul V. Tan, Shifang Li
  • Patent number: 9562798
    Abstract: A deposition rate measuring apparatus, including a crystal sensor facing a specific deposition source among a plurality of deposition sources in a deposition apparatus; a deposition-preventing bracket in a front portion of the crystal sensor, the deposition-preventing bracket having an opening that assists inflow of a specific deposition material, the deposition-preventing bracket extending from the opening, and the deposition-preventing bracket surrounding the crystal sensor to prevent interference due to at least one deposition material from at least one adjacent deposition source adjacent to the specific deposition source; and one or more cover portions spaced apart from the opening inward of the deposition-preventing bracket by a predetermined length.
    Type: Grant
    Filed: June 30, 2015
    Date of Patent: February 7, 2017
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventor: Hee Dok Choi
  • Patent number: 9563844
    Abstract: A tool computes fitness values for a first generation of a first sub-population of a plurality of sub-populations. A population of candidate solutions for an optimization problem was previously divided into the plurality of sub-populations. The population of candidate solutions was created for an iterative computing process in accordance with an evolutionary algorithm to identify a most fit candidate solution for the optimization problem. The tool determines a speculative ranking of the first generation of the first sub-population prior to the fitness values being computed for all candidate solutions in the first generation of the first sub-population. The tool generates a next generation of the first sub-population based, at least in part, on the speculative ranking prior to completion of computation of the fitness values for the first generation of the first sub-population.
    Type: Grant
    Filed: June 30, 2011
    Date of Patent: February 7, 2017
    Assignee: International Business Machines Corporation
    Inventor: Jason F. Cantin
  • Patent number: 9523771
    Abstract: A detector for optical detection of location within a volume, comprises a beam source for shining a structured light pattern on the volume and a digital detector having detection pixels of a given size. The light pattern, when shone into the volume and reflected back to the detection pixels, has a brightness distribution with a peak and a surrounding brightness structure. Now often the peak may be smaller than the pixel size although the overall distribution of the brightness extends over multiple pixels. The system includes an electronic processor for assessing a distribution of brightness among the neighboring pixels to infer a location of the peak within a region smaller than the size of the central pixel on which it falls, thus giving sub-pixel resolution.
    Type: Grant
    Filed: January 13, 2015
    Date of Patent: December 20, 2016
    Assignee: Facebook, Inc.
    Inventors: Nitay Romano, Nadav Grossinger, Emil Alon, Yair Alpern
  • Patent number: 9511386
    Abstract: A coating system comprises: a coating apparatus connected to a syringe filled with a coating agent and having a nozzle for discharging the coating agent of the connected syringe; a robot which moves an object to be coated, held by a robot hand, to a coating position; and a control unit, wherein the coating apparatus comprises a plurality of syringes respectively filled with different coating agents, the nozzles connected to the respective syringes, and a rotary table for rotationally moving together the syringes and the connected nozzles, and the control unit controls to select the syringe filled with the coating agent to be applied to the object, move the nozzle connected to the selected syringe to a position facing the coating position by the rotation of the rotary table, move the object held by the robot hand to the coating position, and discharge the coating agent from the nozzle.
    Type: Grant
    Filed: January 16, 2014
    Date of Patent: December 6, 2016
    Assignee: Canon Kabushiki Kaisha
    Inventors: Kazuo Kuroda, Hiroaki Iwai
  • Patent number: 9513188
    Abstract: According to an embodiment of the invention, a load estimation apparatus which estimates a load added to a laser light irradiation apparatus is provided. In the load estimation apparatus, a focal length adjustment unit adjusts the focal length in accordance with a distance from a light source to a light irradiation position in a recording medium, the apparatus comprising: an obtaining unit which obtains control data in which the light irradiation position is instructed with a coordinate; an operation amount detection unit which analyzes the coordinate of the control data to detect an operation amount of the focal distance adjustment unit; a load value calculation unit which accumulates load value information of the focal length adjustment unit in response to results of comparing the threshold and the operation amount when the operation amount is detected.
    Type: Grant
    Filed: March 16, 2015
    Date of Patent: December 6, 2016
    Assignee: RICOH COMPANY, LTD.
    Inventors: Takahiro Furukawa, Daisuke Tezuka
  • Patent number: 9360659
    Abstract: Selected properties of a microplate comprising a plurality of sample wells are obtained by repetitively performing focusing functions to determine sequentially a well surface z-position and then a plate bottom z-position for a corresponding current x-y position based on an intensity indicative of a best focus of the well surface and the plate bottom respectively. The well surface z-position and the plate bottom z-position corresponding to each of the plurality of x-y positions are determined by repeating the steps of positioning the objective lens, performing the focusing function to determine the well surface z-position, and performing the focusing function for the plate bottom z-position. The well surface z-positions and the plate bottom z-positions at the plurality of x-y positions are used to generate data to determine the selected properties of the microplate.
    Type: Grant
    Filed: August 9, 2012
    Date of Patent: June 7, 2016
    Assignee: Molecular Devices, LLC
    Inventor: Loren Alan Stauffer
  • Patent number: 9347886
    Abstract: An apparatus for monitoring deposition rate, an apparatus including the same, for depositing an organic layer, a method of monitoring deposition rate, and a method of manufacturing an organic light emitting display apparatus using the same, are provided. The deposition rate monitoring apparatus for measuring deposition rate of a deposition material discharged from a deposition source, includes: a light source for irradiating light having a wavelength within a photoexcitation bandwidth of the deposition material; a first optical system for irradiating the light emitted from the light source toward the discharged deposition material; a second optical system for collecting the light emitted from the deposition material; and a first light sensor for detecting the amount of the light which is emitted from the deposition material and collected in the second optical system.
    Type: Grant
    Filed: November 13, 2013
    Date of Patent: May 24, 2016
    Assignee: Samsung Display Co., Ltd.
    Inventors: Alexander Voronov, Dmitry Maslov, Gyoo-Wan Han
  • Patent number: 9322778
    Abstract: An optical sensing apparatus and a method for detecting characteristics of a sample.
    Type: Grant
    Filed: April 23, 2015
    Date of Patent: April 26, 2016
    Assignees: THE CHINESE UNIVERSITY OF HONG KONG, CITY UNIVERSITY OF HONG KONG
    Inventors: Ho Pui Ho, Shu Yuen Wu, Chi-Man Lawrence Wu, Siu Pang Ng, Siu Kai Kong
  • Patent number: 9296084
    Abstract: A method of controlling polishing includes storing a sequence of default values, polishing a substrate, monitoring the substrate during polishing with an in-situ monitoring system, generating a sequence of measured values from measurements from the in-situ monitoring system, combining the sequence of measured values with the sequence of default values to generate a sequence of modified values, fitting a function to the sequence of modified values, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the function.
    Type: Grant
    Filed: July 19, 2012
    Date of Patent: March 29, 2016
    Assignee: Applied Materials, Inc.
    Inventors: Jimin Zhang, Zhihong Wang, Harry Q. Lee, Wen-Chiang Tu
  • Patent number: 9289875
    Abstract: During polishing of a substrate at a first platen and prior to a first time, a first sequence of values is obtained for a first zone of the first substrate and a second sequence of values is obtained for a different second zone of the substrate with an in-situ monitoring system. A first function is fit to a portion of the first sequence of values obtained prior to the first time, and a second function is fit to a portion of the second sequence of values obtained prior to the second time. At least one polishing parameter is adjusted based on the first fitted function and the second fitted function so as to reduce an expected difference between the zones. A second substrate is polished on the first platen using an adjusted polishing parameter calculated based on the first fitted function and the second fitted function.
    Type: Grant
    Filed: April 25, 2012
    Date of Patent: March 22, 2016
    Assignee: Applied Materials, Inc.
    Inventors: Jeffrey Drue David, Jun Qian, Harry Q. Lee
  • Patent number: 9285204
    Abstract: To measure a film thickness of a coating film (25a) of a flux (25) serving as a bonding paste formed on a transfer stage (24) of a paste transfer unit (7), the film thickness of the coating film (25a) in a transfer area (26) is measured through a light-transmitting member (51) by a light interference method and by an optical type film thickness measuring sensor (53) which is arranged below the transfer stage (24). Thus, it is possible to automatically and accurately measure the film thickness of the flux (25) in the transfer area (26) without requiring any complicated measurement work.
    Type: Grant
    Filed: December 19, 2013
    Date of Patent: March 15, 2016
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Masanori Ikeda, Yousuke Hassaku, Satoshi Furuichi, Masahiro Taniguchi, Michinori Tomomatsu
  • Patent number: 9244020
    Abstract: An inspection process for detecting defects of thin type, on transparent containers for a series of inspection points distributed over an inspection region superposed according to a determined height of the container taken according to central axis thereof, and according to the circumference of the container comprising: sending a light beam so as to recover on a light sensor the reflected beams by the internal and external faces of the wall of the container, measuring at each inspection point the thickness of the wall as a function of separation at the level of the light sensor between the reflected beams by the internal and external faces, processing the thickness measurements by analyzing their distribution over the inspection region to extract therefrom geometric characteristics, and comparing these geometric characteristics to reference values to determine if the container has a material distribution defect.
    Type: Grant
    Filed: February 16, 2012
    Date of Patent: January 26, 2016
    Assignee: MSC & SGCC
    Inventors: Marc Leconte, Guillaume Bathelet
  • Patent number: 9199810
    Abstract: A sheet supply apparatus includes: a tray on which a stack of sheets can be placed, an air blowing section that blows air towards the stack of sheets to float at least a topmost sheet, a sucking and conveying section, above the tray, that sucks said floating sheet(s) and conveys said sheet(s) in a prescribed direction, and a first light source that emits a first stripshaped slit light having a vertically extending component such that the slit light crosses at least a first edge of a first floating sheet and a second edge of a second floating sheet. An image capture section captures an image of the first slit light, a calculating section calculates a vertical clearance between the first and second sheets, and an air amount adjusting section adjusts an amount of air to be blown by the air blowing section based on the calculated vertical clearance.
    Type: Grant
    Filed: July 22, 2014
    Date of Patent: December 1, 2015
    Assignee: KONICA MINOLTA, INC.
    Inventors: Atsuhiko Shimoyama, Noboru Oomoto, Hiroaki Umemoto, Hiroshi Mizuno, Ryo Oshima
  • Publication number: 20150129392
    Abstract: A system that measures a thickness of an object includes a conveyor to convey the object and an engagement member movable in response to the thickness of the object. The system further includes a lever connected to the engagement member, the lever movable with the movement of the engagement member, and a measurement device to measure the thickness of the object based on a measured position of the lever.
    Type: Application
    Filed: November 8, 2013
    Publication date: May 14, 2015
    Inventor: Herbert S. Taylor, III
  • Patent number: 9030674
    Abstract: A device according to the invention (1) for monitoring the safety of at least one robot (2), having a non-contact detection apparatus (3A, 3B) for monitoring a working space (A) of at least one robot (2) in a monitoring mode (FIG. 1), is characterized by a switching means (1) for switching the detection apparatus into a measuring mode (FIG. 2) to measure at least one robot (2).
    Type: Grant
    Filed: October 12, 2011
    Date of Patent: May 12, 2015
    Assignee: KUKA Roboter GmbH
    Inventor: Uwe Bonin
  • Publication number: 20150102085
    Abstract: A translatable media height sensor assembly for measuring a media stack in an imaging forming device. The assembly includes a support and drive and insertion assemblies mounted thereon. Insertion assembly includes a translatable plunger having mounted thereon a sensor and a translatable probe. At a home position, the sensor is actuated by a flag on the support placing sensor output in a first state. During measurement, drive assembly translates insertion assembly toward a media stack and the sensor output changes to a second state and a counter is started. The probe initially encounters the media stack and stops while plunger continues to translate. As the plunger reaches the media stack, the probe engages the sensor causing the sensor output to again change state and stops the counter. The insertion assembly retracts back to the home position where the flag actuates the sensor causing the sensor output to change state.
    Type: Application
    Filed: October 16, 2013
    Publication date: April 16, 2015
    Applicant: Lexmark International, Inc.
    Inventors: Dale Bryan Cuesta Balili, Michael Villanueva Caneza, Roel Firmeza Pantonial, Jake Tia Pia, Marvin Aliviado Rodriquez, Donald Norman Spitz
  • Patent number: 9007589
    Abstract: Dual mounting head scanners measure the thickness of flexible moving porous webs and employ an air clamp on the operative surface of the lower head to maintain the web in physical contact with a measurement surface. As the web is held firmly by the clamp, the vacuum level that is established is indicative of the porosity of the membrane. As compressed air is supplied to a vacuum generator at a given operational pressure, the rate of airflow through the web can be inferred from the vacuum pressure measurements. The rate of airflow through the membrane and therefore the porosity of the membrane are related to the vacuum level. It is not necessary to measure the airflow through the membrane. From the vacuum pressure measurements, the membrane's permeability can also be determined by correlation to empirical data. Thickness measurements are effected by optical triangulation and inductive proximity measurements.
    Type: Grant
    Filed: September 16, 2013
    Date of Patent: April 14, 2015
    Assignee: Honeywell ASCa Inc.
    Inventors: Michael Kon Yew Hughes, Sebastien Tixier, Stuart James Heath
  • Publication number: 20150097126
    Abstract: One embodiment relates to a device that senses alignment and height of a work piece. The device may include both an alignment sensor and a height sensor. The alignment sensor generates a first illumination beam that illuminates an alignment mark on the work piece so as to create a first reflected beam, and determines the alignment of the work piece using the first reflected beam. The height sensor generates a second illumination beam that is directed to a surface of the work piece at an oblique angle so as to form a second illumination spot and images the second illumination spot to determine the height of the work piece. Other embodiments, aspects and features are also disclosed.
    Type: Application
    Filed: September 9, 2014
    Publication date: April 9, 2015
    Inventors: Mark A. McCORD, Joseph DiREGOLO
  • Publication number: 20150092201
    Abstract: A method including measuring a first distance to a surface of an integrated circuit substrate or a portion of an integrated circuit package by measuring an angle to it from two known points; introducing a material onto the surface; measuring a second distance to a surface of the film from the two known points; and determining a thickness of the introduced material by subtracting the second distance from the first distance.
    Type: Application
    Filed: September 27, 2013
    Publication date: April 2, 2015
    Inventors: Nilanjan Ghosh, Zhiyong Wang, Yu-Chun Chen, Shuhong Liu
  • Patent number: 8982362
    Abstract: Described herein is a method and apparatus for measuring the thickness of a deposited semiconductor material. A colorimeter has an optical source that illuminates a portion of a deposited semiconductor material with optical radiation, a sensor that collects and measures color information related to reflected radiation from the deposited semiconductor material, and a processor that receives the color information related to the reflected radiation from the sensor and calculates a thickness of the semiconductor material. The processor may control a semiconductor material deposition apparatus.
    Type: Grant
    Filed: October 4, 2012
    Date of Patent: March 17, 2015
    Assignee: First Solar, Inc.
    Inventor: Erel Milshtein
  • Patent number: 8976370
    Abstract: An measuring apparatus includes: a storage unit configured to store a relationship, regarding an irradiation condition predetermined based on a correlation between a characteristic of each of beams of reflected light obtained from a plurality of patterns different from one another in a thickness of a residual layer in a recessed portion and the thickness of the residual layer of each of the plurality of patterns, between the characteristic of the reflected light from each pattern and the thickness of the residual layer of the pattern; and a processing unit configured to, based on a characteristic of reflected light from a pattern formed on a substrate irradiated with light under the irradiation condition and the relationship stored in the storage unit, obtain a thickness of a residual layer in a recessed portion of the pattern formed on the substrate.
    Type: Grant
    Filed: November 21, 2013
    Date of Patent: March 10, 2015
    Assignee: Canon Kabushiki Kaisha
    Inventors: Takahiro Miyakawa, Kazuhiro Sato, Ken Minoda, Hideki Ina
  • Patent number: 8976369
    Abstract: A method for evaluating a thin-film-formed wafer, being configured to calculate a film thickness distribution of a thin film of the thin-film-formed wafer having the thin film on a surface of a substrate, wherein light having a single wavelength ? is applied to a partial region of a surface of the thin-film-formed wafer, reflected light from the region is detected, reflected light intensity for each pixel obtained by dividing the region into many pieces is measured, a reflected light intensity distribution in the region is obtained, and the film thickness distribution of the thin film in the region is calculated from the reflected light intensity distribution. The method enables a film thickness distribution of the micro thin film (an SOI layer) that affects a device to be measured on the entire wafer surface at a low cost with a sufficient spatial resolution in a simplified manner.
    Type: Grant
    Filed: March 29, 2011
    Date of Patent: March 10, 2015
    Assignee: Shin-Etsu Handotai Co., Ltd.
    Inventor: Susumu Kuwabara
  • Patent number: 8964178
    Abstract: A method and system are presented for use in characterizing properties of an article having a structure comprising a multiplicity of sites comprising different periodic patterns, where method includes providing a theoretical model of prediction indicative of optical properties of different stacks defined by geometrical and material parameters of corresponding sites, said sites being common in at least one of geometrical parameter and material parameter; performing optical measurements on at least two different stacks of the article and generating optical measured data indicative of the geometrical parameters and material composition parameters for each of the measured stacks; processing the optical measured data, said processing comprising simultaneously fitting said optical measured data for the multiple measured stacks with said theoretical model and extracting said at least one common parameter, thereby enabling to characterize the properties of the multi-layer structure within the single article.
    Type: Grant
    Filed: December 24, 2013
    Date of Patent: February 24, 2015
    Assignee: Nova Measuring Instruments Ltd.
    Inventors: Yoel Cohen, Boaz Brill
  • Publication number: 20150049348
    Abstract: A method for optically measuring height profiles of surfaces, in which an image of the height profile is recorded using an optical recording system, is characterized in that the image is a differential interference contrast image and height gradients within the height profile are represented by intensity gradients, which are quantitatively or qualitatively evaluatable. The surfaces can have structures having a defined profile, in which intensity gradients in the differential interference contrast image, which assume, within a specified tolerance and within a specified range, a value which deviates from a predetermined value or assume a selected value from within a specified tolerance and within a specified range, indicate a defect.
    Type: Application
    Filed: August 9, 2012
    Publication date: February 19, 2015
    Inventors: Christine Schmidt, Bernd Srocka, Ralf Langhans
  • Patent number: 8953177
    Abstract: A thickness measuring device for measuring an object includes a thickness measuring component and a sensing determining means. The thickness measuring component includes a plurality of measuring members provided respectively in correspondence with a plurality of the objects and a holding member. The measuring member is a probe and the holding member includes a plurality of channels. Each measuring member is held by each channel so that each measuring member is operated by the holding member to respectively measure one object by moving itself along an extending direction and/or by irradiating a light to the object. The sensing determining means retrieves an image of the measuring member and/or an image of the light reflected from the object to further obtain and display a thickness value of the object. The thickness measuring device of the present invention is more effective and inexpensive.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: February 10, 2015
    Assignee: Jeteazy System Co., Ltd.
    Inventor: Cheng-Hsin Tsai
  • Publication number: 20150029494
    Abstract: A local purging tool for purging a portion of a surface of a wafer with purging gas is disclosed. The purging tool includes a purging chamber configured to contain purging gas within a cavity of the purging chamber, a permeable portion of a surface of the purging chamber configured to diffuse purging gas from the cavity of the chamber to a portion of a surface of a wafer, and an aperture configured to transmit illumination received from an illumination source to a measurement location of the portion of the surface of the wafer and further configured to transmit illumination reflected from the measurement location to a detector.
    Type: Application
    Filed: August 1, 2014
    Publication date: January 29, 2015
    Inventors: Hidong Kwak, Ward Dixon, Torsten R. Kaack, Ning-Yi Neil Wang, Jagjit Sandhu
  • Publication number: 20150029517
    Abstract: Methods for measuring a thickness of an object including acquiring at least one of a wavelength domain spectrum for an amplitude ratio (?) and a phase difference (?) of reflected light from a film material, converting the wavelength domain spectrum into a 1/wavelength domain spectrum, acquiring a resulting spectrum by performing fast fourier transform (FFT) on the 1/wavelength domain spectrum, and measuring a thickness of the film material from the resulting spectrum may be provided.
    Type: Application
    Filed: May 23, 2014
    Publication date: January 29, 2015
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jang-Ik PARK, Il-Hwan NAM, Kwan-Woo RYU
  • Publication number: 20150017880
    Abstract: A film-thickness measuring apparatus and a film-thickness measuring method capable of improving an accuracy of the film-thickness measurement are disclosed. The film-thickness measuring apparatus includes a substrate stage configured to support a substrate horizontally, a rinsing water supply structure configured to supply rinsing water onto an entire surface of the substrate on the substrate stage, a film-thickness measuring head configured to transmit light to a measurement area of the surface of the substrate on the substrate stage, produce a spectrum of reflected light from the measurement area, and determine a film thickness of the substrate from the spectrum, and a fluid supply structure configured to form a flow of a gas on a path of the light and supply the flow of the gas onto the measurement area.
    Type: Application
    Filed: July 9, 2014
    Publication date: January 15, 2015
    Inventors: Toshikazu NOMURA, Takeshi IIZUMI, Katsuhide WATANABE, Yoichi KOBAYASHI
  • Publication number: 20150016071
    Abstract: An electronic component thickness measurement method includes extracting, from a plurality of second reference lines in first image data and a plurality of second reference lines in second image data, only a second reference line at which a difference in intensity peak between respective second reference lines at a same position in the first image data and the second image data is smallest, and forming third image data including a first reference line and the extracted second reference line, and calculating a thickness of the electronic component from a distance between the first reference line and the second reference line in the third image data.
    Type: Application
    Filed: July 8, 2014
    Publication date: January 15, 2015
    Inventors: Yoshinao NISHIOKA, Masayoshi HARUKI
  • Patent number: 8930013
    Abstract: A method of controlling polishing includes polishing a substrate having a second layer overlying a first layer, detecting exposure of the first layer with an in-situ monitoring system, receiving an identification of a selected spectral feature and a characteristic of the selected spectral feature to monitor during polishing, measuring a sequence of spectra of light from the substrate while the substrate is being polished, determining a first value for the characteristic of the feature at the time that the first in-situ monitoring technique detects exposure of the first layer, adding an offset to the first value to generate a second value, and monitoring the characteristic of the feature and halting polishing when the characteristic of the feature is determined to reach the second value.
    Type: Grant
    Filed: April 20, 2011
    Date of Patent: January 6, 2015
    Assignee: Applied Materials, Inc.
    Inventors: Jeffrey Drue David, Harry Q. Lee, Thian Choi Lim, Gary Ka Ho Lam
  • Patent number: 8922790
    Abstract: An optical film thickness measuring device, enabling direct measurement of a film thickness of a product in real time accurately without a monitor substrate, includes: a projector, a light receiver, inner beam splitters disposed in a base substrate holder to reflect a measurement beam to a base substrate, an inner optical reflector that totally reflects a measurement beam from the closest inner beam splitter, external beam splitters the measurement beam from the inner beam splitters toward the light receiver, and an outer optical reflector that reflects the measurement beam from the optical reflector toward the light receiver. The measurement beam reflected by the inner beam splitters and the inner optical reflector is passed through the base substrate and then reflected by the external beam splitters and the outer optical reflector to be guided to the light receiver, so that the measurement beam is received by the light receiver.
    Type: Grant
    Filed: February 15, 2012
    Date of Patent: December 30, 2014
    Assignee: Shincron Co., Ltd.
    Inventors: Kyokuyo Sai, Yousong Jiang, Kenji Ozawa
  • Publication number: 20140362359
    Abstract: The present disclosure relates to a photolithography system having an ambulatory projection and/or detection gratings that provide for high quality height measurements without the use of an air gauge. In some embodiments, the photolithography system has a level sensor having a projection source that generates a measurement beam that is provided to a semiconductor substrate via a projection grating. A detector is positioned to receive a measurement beam reflected from the semiconductor substrate via a detection grating. An ambulatory element selectively varies an orientation of the projection grating and/or the detection grating to improve the measurement of the level sensor. By selectively varying an orientation of the projection and/or detection gratings, erroneous measurements of the level sensor can be eliminated.
    Type: Application
    Filed: June 10, 2013
    Publication date: December 11, 2014
    Inventors: Kuo-Hung Chao, Heng-Hsin Liu, Jui-Chun Peng
  • Publication number: 20140363293
    Abstract: A wind turbine comprising an elongated blade body, a system for detecting an ice layer on the blade body, the system comprising a light source for emitting a light beam; a light splitting optical element optically connected to the light source so as to receive the light beam emitted from the light source, the optical element adapted to split the light beam received from the light source into a reference light beam and a detecting light beam, a boundary area which is arranged at the blade body so as to be exposed to the outer surroundings of the blade body and which is optically connected to the light splitting optical element such as to receive the detecting light beam and to reflect an internal reflected part of the detecting light beam at the boundary area and to transmit a transmitting part of the detecting light beam to the outer surroundings of the blade body through the boundary area and to allow an external reflected part of the transmitting part of the detecting light beam, which has been reflected fr
    Type: Application
    Filed: December 19, 2012
    Publication date: December 11, 2014
    Inventors: Whye Ghee Kim, Kok Leong Chong, Yun Chong Gabriel Chang, Li Hong Idris Lim
  • Patent number: 8908161
    Abstract: Approaches for substantially removing bulk aluminum nitride (AlN) from one or more layers epitaxially grown on the bulk AlN are discussed. The bulk AlN is exposed to an etchant during an etching process. During the etching process, the thickness of the bulk AlN can be measured and used to control etching.
    Type: Grant
    Filed: August 25, 2011
    Date of Patent: December 9, 2014
    Assignee: Palo Alto Research Center Incorporated
    Inventors: Brent S. Krusor, Christopher L. Chua, Thomas Wunderer, Noble M. Johnson, Bowen Cheng
  • Publication number: 20140355009
    Abstract: A measuring apparatus includes a supporting column, a securing assembly, and a pair of measuring elements. The securing assembly is movably located on the supporting column at a predetermined height. The pair of measuring elements is secured on the securing assembly opposite to each other. The measuring elements receive a workpiece and transmit lasers to the workpiece respectively.
    Type: Application
    Filed: January 16, 2014
    Publication date: December 4, 2014
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: KUEI-YANG LIN, MING-SHAN CAO, FAN-JIAN ZENG, BAO-FENG QU
  • Patent number: 8879073
    Abstract: Methods and systems for enhancing metrology sensitivity to particular parameters of interest are presented. Field enhancement elements (FEEs) are constructed as part of a specimen to enhance the measurement sensitivity of structures of interest present on the specimen. The design of the FEEs takes into account measurement goals and manufacturing design rules to make target fabrication compatible with the overall device fabrication process. Measurement of opaque materials, high-aspect ratio structures, structures with low-sensitivity, or mutually correlated parameters is enhanced by the addition of FEEs. Exemplary measurements include critical dimension, film thickness, film composition, and optical scatterometry overlay. In some examples, a target element includes different FEEs to improve the measurement of different structures of interest. In other examples, different target elements include different FEEs.
    Type: Grant
    Filed: February 19, 2013
    Date of Patent: November 4, 2014
    Assignee: KLA-Tencor Corporation
    Inventors: Jonathan M. Madsen, Andrei V. Shchegrov, Michael Bakeman, Thaddeus Gerard Dziura, Alexander Kuznetsov, Bin-Ming (Benjamin) Tsai
  • Publication number: 20140320867
    Abstract: The invention provides a method for processing a wafer by inserting the wafer into a holding hole of a carrier to hold the wafer, and interposing the carrier holding the wafer between an upper turn table and a lower turn table to process both surfaces of the wafer simultaneously, including: before processing the wafer, detecting a height position of the upper turn table by a laser displacement sensor while interposing the carrier holding the wafer between the upper turn table and the lower turn table; and determining that the wafer is not normally held to redo the holding of the wafer if a difference between the detected height position and a reference position exceeds a threshold. The method can automatically detect accurately a failure in holding the wafer before processing to prevent the wafer from breaking and eliminate the necessity of operator's inspection using touch to improve operation efficiency.
    Type: Application
    Filed: August 30, 2012
    Publication date: October 30, 2014
    Applicant: SHIN-ETSU HANDOTAI CO., LTD.
    Inventor: Shinya Kanno