Abstract: The present disclosure generally relates to a magnetic recording device having a magnetic recording head comprising a spintronic device. The spintronic device is disposed between a main pole and a trailing shield at a media facing surface. The spintronic device comprises a spin torque layer (STL) and a multilayer seed layer disposed in contact with the STL. The spintronic device may further comprise a field generation layer disposed between the trailing shield and the STL. The multilayer seed layer comprises an optional high etch rate layer, a heat dissipation layer comprising Ru disposed in contact with the optional high etch rate layer, and a cooling layer comprising Cr disposed in contact with the heat dissipation layer and the main pole. The high etch rate layer comprises Cu and has a high etch rate to improve the shape of the spintronic device during the manufacturing process.

Abstract: A coil electronic component includes a magnetic body having an internal coil part embedded therein, in which the internal coil part includes an insulating substrate, a first insulator, a coil conductor, and a second insulator. The first insulator is disposed on at least one of first and second main surfaces of the insulating substrate and has a groove formed therein. The coil conductor is formed inside the groove. The second insulator encloses the insulating substrate, the first insulator, and the coil conductor. The first insulator may be formed to a thickness larger than (and no more than 40 ?m thicker than) a thickness of the coil conductor on the insulating substrate. The first insulator may be formed to a width of 3 ?m to 50 ?m. Further, the second insulator may extend to a thickness 1 ?m to 20 ?m larger than that of the first insulator on the insulating substrate.

Abstract: A coil component includes a body, including a coil and a support member supporting the coil, and an external electrode disposed on an external surface of the body. The coil component includes a machined surface formed on a boundary surface between a portion of the support member, removed in the vicinity of a junction portion between the external electrode and the coil, and the remainder of the support member. A cavity, from which the portion of the support member has been removed, is filled with a magnetic material, or an insulating layer is disposed in the cavity.

Abstract: An apparatus, according to one embodiment, includes a substrate and a closure above the substrate. A gap is positioned between the closure and the substrate, the gap having an array of magnetic transducers extending therealong and unpatterned films. The gap further includes a first layer of a first material having a bulk modulus of elasticity lower than the unpatterned films in the gap. An apparatus according to another embodiment includes a plurality of magnetic transducers arranged in a linear array, and a layer of an expansion material between each adjacent pair of magnetic transducers in the array. An encapsulant is positioned between each layer of the expansion material and the adjacent magnetic transducers. The expansion material has a greater coefficient of thermal expansion than the encapsulant.

Abstract: A coil electronic component includes a magnetic body having an internal coil part embedded therein, in which the internal coil part includes an insulating substrate, a first insulator, a coil conductor, and a second insulator. The first insulator is disposed on at least one of first and second main surfaces of the insulating substrate and has a groove formed therein. The coil conductor is formed inside the groove. The second insulator encloses the insulating substrate, the first insulator, and the coil conductor. The first insulator may be formed to a thickness larger than (and no more than 40 ?m thicker than) a thickness of the coil conductor on the insulating substrate. The first insulator may be formed to a width of 3 ?m to 50 ?m. Further, the second insulator may extend to a thickness 1 ?m to 20 ?m larger than that of the first insulator on the insulating substrate.

Abstract: A device for manipulating magnetic particles, and the method of fabricating and use thereof. The device includes a substrate; a conductive element formed onto the substrate in a pattern shaped to enhance a magnetic field generated in response to an applied current; an insulating layer to isolate the conductive element from a magnetic element; and a magnetic element formed onto the insulating layer to enhance a magnetic force resulting from the magnetic field generated by the conductive element. The magnetic element can be shaped similarly to the conductive element, and edges of the magnetic element are substantially aligned with edges of the conductive element. During fabrication, the substrate and the conductive element can be heated to cause the substrate to shrink thereby resulting in a wrinkled structure at the conductive element. The device can be used to manipulate the magnetic particles within a biological sample, such as cells and/or biomolecules.

Abstract: Methods of fabricating magnetic core inductors for an integrated voltage regulator are disclosed. In some methods, an insulating layer is attached upon a carrier layer, and the insulating layer is patterned to form a core area and a trench area. A conductive inner core is formed in the core area. A magnetic winding coil is formed in the trench area.

Abstract: A manufacturing method for a thin-film magnetic head including first and second magnetic layers, a gap layer, a thin-film coil, and a coil insulating layer for insulating neighboring ones of turns of the thin-film coil. The manufacturing method includes the steps of: forming the first magnetic layer; forming the gap layer on the first magnetic layer; forming the second magnetic layer on the gap layer; forming the thin-film coil; and forming the coil insulating layer. The coil insulating layer is formed by stacking a plurality of insulating films formed by chemical vapor deposition.

Abstract: The present invention relates to a magnetic head and particularly to improvement of its recording element. The recording element includes a first magnetic film, a second magnetic film, a coil film, and an insulating film. The first magnetic film has a first pole portion. The second magnetic film has a second pole portion opposed to the first pole portion with a magnetic gap film therebetween and is joined to the first magnetic film at a back gap portion that is located in a rearward position with respect to a medium facing surface. The coil film extends around the back gap portion, and the insulating film encloses the coil film. Moreover, the second magnetic film entirely covers the insulating film.

Abstract: A thin-film magnetic head which suppresses the TPTP phenomenon due to the environment temperature is provided. The thin-film magnetic head includes, an electromagnetic coil element having a coil layer and coil-insulating layer, and an overcoat layer. A width of the coil-insulating layer in a track-width direction is larger than a width that is needed to insulate the whole coil layer, and is at least 46 ?m, and a length of the coil-insulating layer in a direction perpendicular to the track-width direction is larger than a length that is needed to insulate the whole coil layer, and is at least 75 ?m. In addition, a heat expansion coefficient of the coil-insulating layer is larger than or equal to 30×10?6/K, and a Young's modulus of the coil-insulating layer is larger than or equal to 1 GPa and smaller than or equal to 4 GPa.

Abstract: A method for fabricating a magnetic write head with a coil with a high aspect ratio using a Chemical Vapor Deposition process such as Atomic Layer Deposition (ALD), High Speed ALD, Plasma Enhanced ALD (PEALD), Plasma Enhanced Chemical Vapor Deposition (PECVD) or Low Pressure Chemical Vapor Deposition (LPCVD) to form encapsulating films over the coils without voids is disclosed. Materials which can be used for encapsulation include Al2O3, SiO2, AlN, Ta2O5, HfO2, ZrO2, and YtO3. The use of an ultra-conformal deposition process allows the pitch of the coils to be smaller than it is possible in the prior art. The method also allows materials with a smaller coefficient of thermal expansion than hardbake photoresist to be used with resulting improvements in thermal protrusion characteristics.

Abstract: An electrically conductive etch stop layer is formed over a first electrically conductive layer. An electrically conductive diffusion barrier layer is then formed over the etch stop layer, followed by the formation of an insulator layer over the diffusion barrier layer. Utilizing an etching process with a patterned photoresist in place, insulator materials in a central region are removed to form a via which exposes electrically conductive materials in the central region. Finally, a second electrically conductive layer is formed within the via over the electrically conductive materials in the central region.

Abstract: A magnetic head structure has a coil and a magnetic pole allowing a magnetic flux generated by the coil to be transmitted therethrough and forming a magnetic gap. An insulating layer surrounds the coil, and a protective layer covers the insulating layer and the magnetic pole. The insulating layer has a volume equal to or greater than a value which is determined with respect to a thickness of the protective layer. It is preferable to increase the volume of the insulating layer as the thickness of the protective layer is made greater. By increasing the volume of the insulating layer, the protrusion of a portion of a floating surface of the magnetic head slider near the magnetic pole, toward the disk, is reduced.