Below Coil Patents (Class 360/123.31)
  • Patent number: 10755847
    Abstract: A coil electronic component includes a support member and a plurality of insulating patterns supported by the support member. Each of the plurality of insulating patterns includes an innermost insulating pattern adjacent to a through-hole of the support member, an outermost insulating pattern on the opposing side of the insulating patterns, and a plurality of central insulating patterns between the innermost insulating pattern and the outermost insulating pattern. At least one of the plurality of central insulating patterns has its largest width at a lower surface thereof where it is in contact with the support member.
    Type: Grant
    Filed: November 20, 2017
    Date of Patent: August 25, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Jae Hun Kim