Abstract: An electronic substrate may be fabricated having a dielectric material, metal pads embedded in the dielectric material with co-planar surfaces spaced less than one tenth millimeter from each other, and a metal trace embedded in the dielectric material and attached between the metal pads, wherein a surface of the metal trace is non-co-planar with the co-planar surfaces of the metal pads at a height of less than one millimeter, and wherein sides of the metal trace are angled relative to the co-planar surfaces of the metal pads. In an embodiment of the present description, an embedded angled inductor may be formed that includes the metal trace. In an embodiment, an integrated circuit package may be formed with the electronic substrate, wherein at least one integrated circuit devices may be attached to the electronic substrate. Other embodiments are disclosed and claimed.

Abstract: Disclosed is a coil module that receives or transmits electric power or signals wireless by using an electromagnetic field, the coil module including a board, a coil provided on at least one surface of the board to be rotated in one direction, and a magnetic part covering at least a portion of the coil while directly contacting a surface of the coil, and that acts as an electromagnetic booster that enhances an intensity of the electromagnetic field generated on the surface of the coil, and the magnetic part decrease, among a skin effect and a proximity effect of an eddy current generated in the coil, the proximity effect by isolating electric power in a gap of the coil that is rotated in the one direction.

Abstract: A coil component in which a change in thicknesses of the winding part is prevented is provided. According to the coil component, since each of a pair of neighboring resin walls and a seed part between the pair of resin walls are separated by a predetermined distance, a plating part grown on the seed part is easy to grow uniformly between the pair of neighboring resin walls. For this reason, the winding part whose surface is gentle and in which a change in thickness is prevented is obtained by plating growth.