Piezoelectric Adjuster Patents (Class 360/294.4)
  • Patent number: 8559138
    Abstract: A dual stage actuator (DSA) suspension has a single microactuator such as a PZT element on one side of central longitudinal axis of the suspension, and a pseudo symmetry structure formed or affixed on the other side of the central longitudinal axis opposite the PZT. The pseudo symmetry structure has mass and stiffness that mirrors the PZT, thus keeping the suspension mechanically balanced and symmetric about the longitudinal axis for improved suspension performance especially in a shock environment.
    Type: Grant
    Filed: June 22, 2012
    Date of Patent: October 15, 2013
    Assignee: Magnecomp Corporation
    Inventors: Peter Hahn, Wei Keat Chai, Kuen Chee Ee
  • Patent number: 8559137
    Abstract: A piezoelectric actuator includes an actuator base that supports a load beam and has an opening accommodating a piezoelectric element, a receiver member that is laid on and fixed to the actuator base and forms a receiver that faces the opening and receives the piezoelectric element, an adhesive part formed of a liquid adhesive that is filled in a space defined by the piezoelectric element, an inner circumference of the opening, and the receiver and adheres the piezoelectric element to the inner circumference of the opening and the receiver, and a suppressing zone that is formed along an overlapping area where the actuator base and receiver member overlap each other and suppresses penetration of the liquid adhesive due to a capillary phenomenon into the overlapping area.
    Type: Grant
    Filed: September 8, 2011
    Date of Patent: October 15, 2013
    Assignee: NHK Spring Co., Ltd.
    Inventor: Shogo Imuta
  • Patent number: 8542465
    Abstract: A novel suspension assembly includes a suspension assembly mounting plate, a microactuator mounting structure extending from the suspension assembly mounting plate, a load beam extending from the microactuator mounting structure, and a laminated flexure attached to the load beam. The laminated flexure includes a tongue that has a read head bonding surface. The suspension assembly includes a stainless steel surface having a gold coating, and a piezoelectric microactuator attached to the microactuator mounting structure and electrically connected to the gold coating.
    Type: Grant
    Filed: March 17, 2010
    Date of Patent: September 24, 2013
    Assignee: Western Digital Technologies, Inc.
    Inventors: Yanning Liu, Wing C. Shum, John E. Scura
  • Patent number: 8533935
    Abstract: An auxiliary tool, for assembling a number of voice coil motors, includes a number of trays, a rod member, and two limiting members. Each of the trays includes a main portion and a plurality of support arms extending away from the main portion. The main portion includes a top surface and a bottom surface. The support arms and the main portion cooperatively define two receiving spaces respectively on the top surface and the bottom surface. Each voice coil motor is received in two receiving spaces of two neighboring trays and clamped by the two neighboring trays. The rod member passes through trays and the voice coil motors. The two limiting members are sleeved over the rod member at two ends of the rod member. The trays and the voice coil motors are limited between the two limiting members.
    Type: Grant
    Filed: December 14, 2011
    Date of Patent: September 17, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Tzu-Nan Chou
  • Patent number: 8526142
    Abstract: A dual stage actuated (DSA) suspension includes a dam-like structure that holds epoxy along the outside lateral side of the PZT microactuators while that epoxy hardens. In the illustrative embodiment, the dam-like structure is in the form of a wing rail that is integrally formed with the suspension base plate, and extends parallel to the outside face of the PZT. The wing rail has an upturned edge to help contain the epoxy while it hardens. The wing rail has springs at its fore and aft ends so that the rail does not unduly limit movement of the PZTs and hence microactuator stroke length. The wing rail does not touch the PZT electrodes. The encapsulation dam allows epoxy to be dispensed after the PZT has been located on the suspension, so as to substantially cover all sides of the PZT and thus prevent the shedding of contaminating particles during operation.
    Type: Grant
    Filed: July 14, 2011
    Date of Patent: September 3, 2013
    Assignee: Magnecomp Corporation
    Inventors: Kongsak Dejkoonmak, Johnathan Phu
  • Patent number: 8508889
    Abstract: An electrical connection structure connects a piezoelectric element to a flexure with a conductive adhesive. An electrode surface is formed on the piezoelectric element, and a terminal surface is formed on the wiring member and is smoother than the electrode surface. A gold plate layer is formed on the terminal surface and is connected to the electrode surface with the conductive adhesive. At least one recess is formed by laser processing on the conductive terminal surface layer. The electrical connection structure substantially equalizes the surface roughness of the terminal surface with the gold plate layer to that of the electrode surface, improves a bonding strength on the terminal surface nearly to that on the electrode surface, enhances the reliability of electrical connection between the electrode surface and the terminal surface, maintains electrical characteristics of the terminal surface, and prevents contamination around the terminal surface.
    Type: Grant
    Filed: April 6, 2011
    Date of Patent: August 13, 2013
    Assignee: NHK Spring Co., Ltd.
    Inventor: Tatsuhiro Kin
  • Patent number: 8498082
    Abstract: In a dual stage actuated (DSA) suspension, a PZT microactuator is electrically and mechanically bonded to the rest of the suspension by non-conductive epoxy on the front and rear bottom faces of the PZT, by conductive epoxy that bridges a gap between the top face of the PZT which defines the ground electrode and an adjacent metallic and grounded portion of the suspension, and further by additional non-conductive epoxy that bridges the gap and which at least partly overlies the conductive epoxy. The additional non-conductive epoxy increases the effective stroke length of the PZT.
    Type: Grant
    Filed: March 23, 2011
    Date of Patent: July 30, 2013
    Assignee: Magnecomp Corporation
    Inventors: Jason Padeski, Amaninder Singh Dhillon
  • Patent number: 8493692
    Abstract: A magnetic head-positioning system to accurately test a magnetic disk and a magnetic head, comprises a plurality of hinges attached on an end portion of a linear driving element and disposed on both sides of a center line of the linear driving element, which is in parallel with an extension-shrinkage direction of the linear driving element, and an arm having a length longer than a distance between a plurality of hinge joint portions, the plurality of the hinge joint portions each of which join the hinge with a root portion of the arm and which are disposed on both sides of a center line of the arm which is in parallel with a longitudinal direction of the arm. The arm has an extremity portion on which a head gimbal assembly is detachably attached and this head gimbal assembly is positioned.
    Type: Grant
    Filed: February 18, 2010
    Date of Patent: July 23, 2013
    Assignee: Hitachi High-Technologies Corporation
    Inventors: Shigeo Nakamura, Yasuhiro Matsuda, Toshinori Sugiyama
  • Patent number: 8488281
    Abstract: A disk drive includes a suspension assembly that includes a load beam and a laminated flexure. The laminated flexure includes a structural layer, a dielectric layer, and an electrically conductive layer. The electrically conductive layer includes a plurality of flexure bond pads. The structural layer includes a tongue and a flexure bond pad shelf. The flexure bond pad shelf underlies each of the plurality of flexure bond pads. The flexure bond pad shelf is separate from the tongue in the structural layer so that the structural layer nowhere connects the flexure bond pad shelf to the tongue. A fine actuator may be disposed on and bonded to the tongue to produce relative motion between the head and the tongue. With the flexure bond pads bonded to the plurality of head bond pads, the fine actuator may also produce relative motion between the flexure bond pad shelf and the tongue.
    Type: Grant
    Filed: September 13, 2011
    Date of Patent: July 16, 2013
    Assignee: Western Digital (Fremont), LLC
    Inventor: Tzong-Shii Pan
  • Patent number: 8456780
    Abstract: An actuator arm for a hard-disk drive (HDD) is disclosed. A piezoelectric element is disposed within a well of an actuator arm. The piezoelectric element is aligned with a neutral axis of the actuator arm.
    Type: Grant
    Filed: February 10, 2012
    Date of Patent: June 4, 2013
    Assignee: HGST Netherlands B.V.
    Inventor: Oscar Ruiz
  • Patent number: 8457794
    Abstract: Embodiments of the present invention provide improved accuracy of displacement control by using a multi-segment transformation of an actuator's non-linear response. The present invention may set intermediate points to effectively divide the actuator response into multiple segments. Each segment may be assigned a transform function that represents the actuator's response in that particular segment. The present invention may operate in two modes, a calibration mode and a normal operations mode. During calibration mode, the intermediate points and the segment transforms may be set. During normal operations mode, a drive signal may be generated according to the calibrated set values.
    Type: Grant
    Filed: December 22, 2009
    Date of Patent: June 4, 2013
    Assignee: Analog Devices, Inc.
    Inventors: Christian Jimenez, Eoin English, José Ibañez-Climent, Javier Calpe-Maravilla
  • Patent number: 8441762
    Abstract: In a magnetic head suspension according to the present invention, each of paired right and left connecting beams that are positioned on both sides of an open section, with which paired piezoelectric elements are at least partially overlapped in a plan view, in a suspension width direction and connect a proximal end section that is directly or indirectly connected to a main actuator and a distal end section to which the load bending part is connected includes proximal-side and distal-side beams. The distal-side beam is inclined with respect to the proximal-side beam in a plan view such that a connection point between the proximal-side and distal-side beams is located closer to a suspension longitudinal center line relative to a virtual line connecting the proximal end of the proximal-side beam and the distal end of the distal-side beam.
    Type: Grant
    Filed: April 25, 2012
    Date of Patent: May 14, 2013
    Assignee: Suncall Corporation
    Inventors: Yasuo Fujimoto, Satoru Takasugi
  • Patent number: 8437100
    Abstract: Systems and methods for flexure based shock and vibration sensor for head suspensions in hard disk drives. Specifically, this invention deals with operational shock and vibration management within a hard disk drive. In one implementation, the assembly includes a circuit embedded optical waveguide sensor that includes a flexible electrical circuit board with a configuration of either a single or multi layers of conductor traces, a thin flexure gimbal for carrying and flying a HDD slider, a consecutive sensing layer constructed by an optical core and by clad construction with a configuration of either a single core array or a plural core array, an optical loop formed by light input and an output core, optical grating disposed on the consecutive sensing layer forming an optical grating waveguide sensor, a light emitter for injecting light into the optical core, and a receiver receiving the output light from the optical core.
    Type: Grant
    Filed: April 18, 2012
    Date of Patent: May 7, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Martin John McCaslin, Visit Thaveeprungsriporn, Szu-Han Hu
  • Patent number: 8432643
    Abstract: Devices for reading or writing electromagnetic information include a wafer substrate piece disposed between an electromagnetic transducer and an electrostrictive or piezoelectric actuator. The substrate piece is shaped as a rigid body adjoining the transducer and as a flexible element connecting the body and the actuator. To fabricate, at least one electrostrictive layer and many transducers are formed on opposite sides of a wafer that is then cut into rows containing plural transducers. The rows are processed from directions generally normal to the wafer surface upon which the transducers were formed, by removing material to form a head, flexures and a media-facing surface on the head. Conductive leads are formed on a back surface of flexures connecting the transducer with drive electronics. The flexures are aligned with forces arising from interaction with the media surface and from seeking various tracks, reducing torque and dynamic instabilities and increasing actuator access time.
    Type: Grant
    Filed: February 6, 2012
    Date of Patent: April 30, 2013
    Inventor: Mark A. Lauer
  • Patent number: 8416536
    Abstract: A head suspension has a base, a piezoelectric element, a load beam, and a wiring member to supply electric power to the piezoelectric element so that the piezoelectric element deforms to move the load beam relative to the base. The wiring member has a conductive base layer, an insulating layer, and a wiring layer layered in this order. The wiring layer has a wiring electrode. The piezoelectric element has an element electrode. A through hole is formed through the conductive base layer and insulating layer, to expose the wiring electrode to the element electrode. A projection is formed on at least one of the wiring electrode and element electrode, to face the other electrode through the through hole. The projection brings the electrodes into contact with each other and a conductive adhesive joins the electrodes and together.
    Type: Grant
    Filed: December 15, 2010
    Date of Patent: April 9, 2013
    Assignee: NHK Spring Co., Ltd.
    Inventors: Hideki Fuchino, Sachie Yamada
  • Patent number: 8405934
    Abstract: A microactuator element as an example of an electrical component is disposed on a metallic, electrically conductive plate member. A conductive resin member is disposed on a current-carrying part of the conductive plate member and a conduction part of the microactuator element. A thin porous plating layer of thickness 100 nm or less includes a large number of gold particles is formed in a region of a surface of the conductive plate member which covers the current-carrying part. The conductive resin member is secured to the conductive plate member through the thin porous gold plating layer and electrically connected to the conductive plate member.
    Type: Grant
    Filed: March 30, 2011
    Date of Patent: March 26, 2013
    Assignee: NHK Spring Co., Ltd.
    Inventor: Hideki Fuchino
  • Patent number: 8390960
    Abstract: A head suspension has a piezoelectric element that deforms in response to an applied voltage, a base plate provided with an opening to which the piezoelectric element is attached, and a load beam fixed to the base plate so that a front end of the load beam moves in a sway direction according to deformation of the piezoelectric element. The head suspension includes an adhesive applied to a gap between the piezoelectric element and the opening, to attach the piezoelectric element to the opening. The adhesive has a thixotropic characteristic and is sol when applied to the gap.
    Type: Grant
    Filed: September 11, 2009
    Date of Patent: March 5, 2013
    Assignee: NHK Spring Co., Ltd.
    Inventor: Osamu Okawara
  • Patent number: 8390961
    Abstract: In a magnetic head suspension according to the present invention, each of paired right and left connecting beams that are positioned on both sides of an open section, with which paired piezoelectric elements are at least partially overlapped in a plan view, in a suspension width direction and connect a proximal end section that is directly or indirectly connected to a main actuator and a distal end section to which the load bending part is connected includes proximal-side and distal-side beams. The distal-side beam is inclined with respect to the proximal-side beam in a plan view such that a connection point between the proximal-side and distal-side beams is located closer to a suspension longitudinal center line relative to a virtual line connecting the proximal end of the proximal-side beam and the distal end of the distal-side beam.
    Type: Grant
    Filed: March 26, 2010
    Date of Patent: March 5, 2013
    Assignee: Suncall Corporation
    Inventors: Yasuo Fujimoto, Satoru Takasugi
  • Patent number: 8369047
    Abstract: A flexure metal plate includes distal and proximal end side-center-support plate forming regions that are positioned on distal and proximal sides within an open section. To a distal end section of a supporting part that is positioned on a distal side of the open section, first and second-distal side-metal plates are fixed so as to be positioned on an outer side of the distal end side-center-support plate forming region in a width direction, and to a proximal end section of the supporting part that is positioned on a proximal side of the open section, first and second-proximal side-metal plates are fixed so as to be positioned on an outer side of the proximal end side-center-support plate forming region in the width direction. The first and second-distal side-metal plates form a distal end side-support plate in cooperation with the distal end side-center-support plate forming region.
    Type: Grant
    Filed: April 7, 2011
    Date of Patent: February 5, 2013
    Assignee: Suncall Corporation
    Inventors: Yasuo Fujimoto, Satoru Takasugi, Kenji Mashimo
  • Patent number: 8363361
    Abstract: An element accommodation portion is formed in an electrically conductive plate member which constitutes a part of a suspension. A microactuator element comprising a piezoelectric element is located in the element accommodation portion. An electrically conductive resin member is disposed in a region covering junctions for electrically connecting the conductive plate member and the microactuator element. A pit is formed in the junction of the conductive plate member by partial-etching. A part of the conductive resin member is in the pit. A part of an outer peripheral edge of the conductive resin member is located inside an edge of the pit. The conductive resin member is covered by a cover layer.
    Type: Grant
    Filed: September 9, 2010
    Date of Patent: January 29, 2013
    Assignee: NHK Spring Co., Ltd.
    Inventors: Masao Hanya, Tatsuhiro Kin, Isamu Kuchiwaki
  • Patent number: 8351160
    Abstract: First and second piezoelectric element overlapped portions of an insulating layer of a flexure part is formed with first and second connecting openings, respectively. There are provided on an upper surface of the insulating layer, first and second lower conductive adhesive agents that electrically connect lower electrode layers of first and second piezoelectric elements to a voltage supply wiring through the first and second connecting openings, and a surrounding insulative adhesive agent that is arranged so as to surround the first and second lower conductive adhesive agents in a plan view.
    Type: Grant
    Filed: May 12, 2011
    Date of Patent: January 8, 2013
    Assignee: Suncall Corporation
    Inventor: Yasuo Fujimoto
  • Patent number: 8335054
    Abstract: The piezoelectric actuator of a head suspension has an actuator base and at least a piezoelectric element, the actuator base connected to the base part of the load beam of the suspension and having at least an opening, the piezoelectric element attached to the opening and deforming in response to a voltage applied thereto to effect displacement of the front end of the load beam. A nonconductive filler is fitted into a circumferential channel defined between a circumferential edge of an opening in the actuator base and a circumferential side face of the piezoelectric element facing the circumferential edge of the opening to maintain a width of the circumferential channel. A nonconductive adhesive part is formed in the circumferential channel and joins the circumferential edge of the opening and the circumferential side face of the piezoelectric element together.
    Type: Grant
    Filed: March 30, 2010
    Date of Patent: December 18, 2012
    Assignee: NHK Spring Co., Ltd.
    Inventor: Hideki Kashima
  • Patent number: 8335055
    Abstract: A head suspension has a load beam and a piezoelectric actuator, the actuator base being connected to the base part of the load beam and having at least an opening. A nonconductive adhesive applied at least between the circumferential edge of the opening and a circumferential side face of the piezoelectric element and between a bottom receiver and the bottom face of the piezoelectric element is configured to adhere the piezoelectric element to the opening.
    Type: Grant
    Filed: March 30, 2010
    Date of Patent: December 18, 2012
    Assignee: NHK Spring Co., Ltd.
    Inventors: Masao Hanya, Toshiki Ando
  • Patent number: 8330330
    Abstract: A piezoelectric actuator includes a supporting substrate, a main body having a first piezoelectric laminate, a second piezoelectric laminate, and a displacement portion, and a first elastic layer. The first elastic layer is fixed to the main body so as to connect a lower surface of the first piezoelectric laminate, a lower surface of the second piezoelectric laminate, a side surface of the first piezoelectric laminate, and a side surface of the second piezoelectric laminate. A first region to fourth region of the first elastic layer is fixed to the principal surface of the supporting substrate by a first to fourth bonding portions. A non-bonding surface is not fixed to the principal surface of the supporting substrate.
    Type: Grant
    Filed: June 1, 2010
    Date of Patent: December 11, 2012
    Assignees: TDK Corporation, SAE Magnetics (H.K.) Ltd.
    Inventor: Kenjiro Hata
  • Patent number: 8331061
    Abstract: A head suspension has a base plate, a load beam, and a piezoelectric element that is centrally located and deforms in response to applied power to precisely move a front end of the load beam. The head suspension includes an opening formed in the base plate to receive the piezoelectric element and a support member joined with the base plate, partly protruding into the opening, and configured to support an electrode of the piezoelectric element. The support member includes a pair of integral supports to support the electrode, and a pair of integral support links to connect the supports to each other outside the piezoelectric element.
    Type: Grant
    Filed: February 12, 2010
    Date of Patent: December 11, 2012
    Assignee: NHK Spring Co., Ltd.
    Inventors: Masao Hanya, Toshiki Ando
  • Patent number: 8331060
    Abstract: An electrode structure of a piezoelectric element is provided. The piezoelectric element 23a (23b) constitutes a piezoelectric actuator 19 attached to an attaching part 30 of an object, to minutely move a movable part 15 of the object relative to a base part 13 of the object according to deformation occurring on the piezoelectric element in response to a power applied state of the piezoelectric element. The electrode structure includes an electrode 41a formed on one of a pair of electrode forming faces 31a and 31b of the piezoelectric element on an inner side of a peripheral zone 31a1, the peripheral zone being defined along the periphery of the electrode forming face 31a on which the electrode is formed. The electrode structure also includes a non-electrode part 51 formed in the peripheral zone. Even if the peripheral zone 31a1 of the electrode forming face 31a having a short-circuit causing possibility touches the attaching part 30, no short circuit occurs.
    Type: Grant
    Filed: February 1, 2010
    Date of Patent: December 11, 2012
    Assignee: NHK Spring Co., Ltd.
    Inventor: Hideki Kashima
  • Patent number: 8310790
    Abstract: A gimbal assembly of a dual-stage microactuator is provided with a remotely-located piezoelectric transducer (PZT) and at least one actuation strut connecting an asymmetrical amplification structure supporting the PZT to a tongue supporting a slider, such that the movement of the PZT over the asymmetrical amplification structure is amplified by the asymmetrical amplification structure and at least one actuation strut into rotation of the tongue and slider. A plurality of actuation struts connect opposing sides of the asymmetrical amplification structure with opposing sides of the tongue, which causes the tongue to rotate about a central portion of the tongue upon which a dimple of a supporting loadbeam contacts the tongue.
    Type: Grant
    Filed: June 11, 2011
    Date of Patent: November 13, 2012
    Assignee: NHK Spring Co., Ltd
    Inventor: Edmund B Fanslau, Jr.
  • Patent number: 8307538
    Abstract: A method for manufacturing an head gimbal assembly (HGA) according to the present invention is comprised of: a step for preparing a thin film piezoelectric actuator including a first piezoelectric laminate having a first piezoelectric layer, and a second piezoelectric laminate having a second piezoelectric layer; a step for preparing a suspension; a fixing step for fixing the thin film piezoelectric actuator to the suspension; a first repolarization treatment step for performing repolarization treatment to the first piezoelectric layer after the fixing step; and a second repolarization treatment step for performing repolarization treatment to the second piezoelectric layer after the fixing step.
    Type: Grant
    Filed: March 1, 2010
    Date of Patent: November 13, 2012
    Assignees: TDK Corporation, SAE Magnetics (H.K.) Ltd.
    Inventor: Kenjiro Hata
  • Publication number: 20120281317
    Abstract: In a magnetic head suspension according to the present invention, each of paired right and left connecting beams that are positioned on both sides of an open section, with which paired piezoelectric elements are at least partially overlapped in a plan view, in a suspension width direction and connect a proximal end section that is directly or indirectly connected to a main actuator and a distal end section to which the load bending part is connected includes proximal-side and distal-side beams. The distal-side beam is inclined with respect to the proximal-side beam in a plan view such that a connection point between the proximal-side and distal-side beams is located closer to a suspension longitudinal center line relative to a virtual line connecting the proximal end of the proximal-side beam and the distal end of the distal-side beam.
    Type: Application
    Filed: July 17, 2012
    Publication date: November 8, 2012
    Applicant: SUNCALL CORPORATION
    Inventors: Yasuo FUJIMOTO, Satoru TAKASUGI
  • Publication number: 20120281316
    Abstract: In a magnetic head suspension according to the present invention, each of paired right and left connecting beams that are positioned on both sides of an open section, with which paired piezoelectric elements are at least partially overlapped in a plan view, in a suspension width direction and connect a proximal end section that is directly or indirectly connected to a main actuator and a distal end section to which the load bending part is connected includes proximal-side and distal-side beams. The distal-side beam is inclined with respect to the proximal-side beam in a plan view such that a connection point between the proximal-side and distal-side beams is located closer to a suspension longitudinal center line relative to a virtual line connecting the proximal end of the proximal-side beam and the distal end of the distal-side beam.
    Type: Application
    Filed: July 17, 2012
    Publication date: November 8, 2012
    Applicant: SUNCALL CORPORATION
    Inventors: Yasuo FUJIMOTO, Satoru Takasugi
  • Patent number: 8300364
    Abstract: A head suspension including a base plate, a load beam, an actuator element to be deformed to move the load beam relative to the base plate, and a jumper having a first end electrically connected to the actuator element, an intermediate part extending over a base plate edge of the base plate, and a second end electrically connected to a flexure, to supply power from the flexure to the actuator element. The jumper is composed of an insulating cover layer, a conductor layer, an insulating layer, and a metal layer that are laid one on another. The conductor layer is diverged in a direction in which the layers of the jumper are laid one on another, to form an escape recess to avoid an edge of the base plate edge to protect the insulating cover layer of the jumper from being abraded by an edge of the base plate.
    Type: Grant
    Filed: January 6, 2010
    Date of Patent: October 30, 2012
    Assignee: NHK Spring Co., Ltd.
    Inventor: Hidenori Ogawa
  • Patent number: 8276256
    Abstract: A method of assembling a head stack assembly (HSA) includes securing a flex cable to an actuator including an actuator arm having a side slot with a slot end. A first head gimbal assembly (HGA) is attached to the actuator arm. The first HGA includes a first laminated flexure having a first flexure tail with a first raised region that includes an out-of-plane bend. The first raised region is squeezed while inserting the first flexure tail partially within the side slot with the first raised region adjacent the slot end. The first raised region is allowed to expand into contact with the side slot adjacent the slot end. The first flexure tail is electrically connected to the flex cable.
    Type: Grant
    Filed: October 20, 2011
    Date of Patent: October 2, 2012
    Assignee: Western Digital Technologies, Inc.
    Inventors: Yiduo Zhang, Tzong-Shii Pan, Yih-Jen D. Chen
  • Patent number: 8264797
    Abstract: A novel head gimbal assembly (HGA) includes a piezoelectric microactuator having a first side and an opposing second side. The first side includes a plurality of anchor regions that extend radially from a center point and are bonded to the gimbal tongue. The first side also includes a first plurality of non-bonded regions lying between the anchor regions. The second side includes a plurality of link regions that extend radially from the center point and are bonded to a top surface of the read head. The second side also includes a second plurality of non-bonded regions lying between the link regions. Each of the plurality of link regions is angularly spaced between two of the plurality of anchor regions.
    Type: Grant
    Filed: December 21, 2009
    Date of Patent: September 11, 2012
    Assignee: Western Digital (Fremont), LLC
    Inventor: Nathan C. Emley
  • Patent number: 8254065
    Abstract: For a piezoelectric actuator in which, upon receiving electric power, a piezoelectric element causes a shear deformation to minutely move a movable member of the actuator relative to a base member of the actuator, a power supply includes a wiring member having an insulating layer, a wiring connector, a hole through at least the wiring member insulating layer, and a contact in the through hole. The wiring member has a conductive base layer, the insulating layer, and a conductor layer, the connector base layer having an insular part and a main part that is electrically isolated from the insular part. The wiring connector has a first face joined with an electrode of the piezoelectric element and a second face joined with the insular part. The contact electrically connects the conductor layer of the wiring member to the wiring connector and to the piezoelectric element.
    Type: Grant
    Filed: August 31, 2010
    Date of Patent: August 28, 2012
    Assignee: NHK Spring Co., Ltd.
    Inventors: Masaru Inoue, Shogo Imuta
  • Patent number: 8254062
    Abstract: A suspension assembly with reduced total vertical thickness is provided for a data transducing system that includes a dual-stage actuation system for positioning a data transducer. A first structural element of the suspension assembly includes a plate portion and a boss tower that is connectable to a main actuator of the dual-stage actuation system. A second structural element of the suspension assembly includes a recess that receives the plate portion of the first structural element, an opening through which the boss tower extends for connection to the main actuator of the dual-stage actuation system, and a flexible region to which a microactuator element of the dual-stage actuation system is connected.
    Type: Grant
    Filed: June 25, 2009
    Date of Patent: August 28, 2012
    Assignee: Seagate Technology LLC
    Inventor: Michael Allen Greminger
  • Patent number: 8248736
    Abstract: A microactuator mounting section is disposed between a base section and a load beam. A microactuator element formed of a piezoelectric element is contained in an element accommodation portion in a plate portion. The plate portion has a stationary part secured to the base section and a movable part secured to the load beam. The stationary part and the movable part are connected to each other by a pair of arm portions. Each arm portion comprises a first extending portion and a second extending portion. The first extending portion extends longitudinally relative to the load beam from a front end of the stationary part toward the movable part. The second extending portion extends transversely inward relative to the plate portion from the first extending portion so as to be continuous with the movable part.
    Type: Grant
    Filed: September 7, 2010
    Date of Patent: August 21, 2012
    Assignee: NHK Spring Co., Ltd.
    Inventors: Masao Hanya, Toshiki Ando, Ryoichi Tazawa
  • Patent number: 8248731
    Abstract: An electrical connecting structure for a piezoelectric element enables wiring to the piezoelectric element to be carried out without deteriorating the productivity and reliability of the piezoelectric element. The electrical connecting structure is formed by facing a common electrode of the piezoelectric element to a terminal that supplies power to the common electrode and by injecting a conductive adhesive into a through hole, which is formed substantially at the center of the piezoelectric element, from an opening of the through hole that is on the opposite side of the common electrode, thereby securing electrical connection between the terminal and the common electrode of the piezoelectric element.
    Type: Grant
    Filed: December 22, 2009
    Date of Patent: August 21, 2012
    Assignee: NHK Spring Co., Ltd.
    Inventor: Hideki Fuchino
  • Patent number: 8248734
    Abstract: A wiring connecting structure for a piezoelectric actuator includes a terminal 57-1, a through hole 67 formed through the terminal 57-1, a first liquid stopper 69-1 arranged around the through hole 67 in a gap between the terminal 57-1 and a common electrode 19 of a piezoelectric element 13 of the piezoelectric actuator, and a liquid trap 73 arranged adjacent to the first liquid stopper 69-1. The terminal 57-1 faces the common electrode 19 with an electric insulating layer 61 being on the piezoelectric element 13 side and the first liquid stopper 69-1 being in the gap between the common electrode 19 and the terminal 57-1. A liquid conductive adhesive 79 is filled in the through hole 67. If there is an excess of the liquid adhesive 79, the excess is guided into a trapping space 77 of the liquid trap 73, to prevent the excess from oozing out.
    Type: Grant
    Filed: December 3, 2009
    Date of Patent: August 21, 2012
    Assignee: NHK Spring Co., Ltd.
    Inventor: Hideki Fuchino
  • Patent number: 8248735
    Abstract: In a magnetic head suspension, a piezoelectric element is disposed within a supporting part's open section so that at least a part of its distal-side end surface faces a distal-side wall surface of the supporting part's distal end section forming a distal-side gap between the distal-side end surface and the distal-side wall surface and at least a part of its proximal-side end surface faces a proximal-side wall surface of the supporting part's proximal end section forming a proximal-side gap between the proximal-side end surface and the proximal-side wall surface in a state where the piezoelectric element's upper and lower electrode layers do not face the supporting part and any rigid members that are fixed to the supporting part. The piezoelectric element is fixed to the supporting part by a distal-side insulative adhesive agent and a proximal-side insulative adhesive agent.
    Type: Grant
    Filed: August 27, 2010
    Date of Patent: August 21, 2012
    Assignee: Suncall Corporation
    Inventors: Yasuo Fujimoto, Satoru Takasugi, Kenji Mashimo
  • Patent number: 8233244
    Abstract: In a magnetic head suspension according to the present invention, each of paired right and left connecting beams that are positioned on both sides in a suspension width direction of an open section, with which piezoelectric elements are at least partially overlapped in a plan view, and connect a proximal end section directly or indirectly connected to a main actuator and a distal end section to which a load bending part is connected includes a convex portion projecting in a thickness direction that is perpendicular to the disk surface. The configuration makes it possible to improve the impact resistance and raise the resonance frequency of a magnetic head suspension capable of performing micro motion of a magnetic head slider by the piezoelectric elements.
    Type: Grant
    Filed: April 23, 2010
    Date of Patent: July 31, 2012
    Assignee: Suncall Corporation
    Inventor: Yasuo Fujimoto
  • Patent number: 8233245
    Abstract: A piezoelectric element with electrode is capable of preventing an assembling error. The piezoelectric element includes a piezoelectric body configured to deform according to polarity in response to a voltage applied thereto, electrodes formed on surfaces of the piezoelectric body, respectively, a non-electrode part formed on at least one of the surfaces of the piezoelectric body, the non-electrode part continuing to the one electrode that is on the at least one surface of the piezoelectric body, and a boundary between the non-electrode part and the one electrode. The boundary has a pattern to indicate the polarity of the piezoelectric element.
    Type: Grant
    Filed: May 20, 2010
    Date of Patent: July 31, 2012
    Assignee: NHK Spring Co., Ltd.
    Inventors: Jun Soga, Masao Hanya, Toshiki Ando, Hideki Kashima
  • Patent number: 8228642
    Abstract: A dual stage actuator (DSA) suspension has a single microactuator such as a PZT element on one side of central longitudinal axis of the suspension, and a pseudo symmetry structure formed or affixed on the other side of the central longitudinal axis opposite the PZT. The pseudo symmetry structure has mass and stiffness that mirrors the PZT, thus keeping the suspension mechanically balanced and symmetric about the longitudinal axis for improved suspension performance especially in a shock environment.
    Type: Grant
    Filed: February 16, 2010
    Date of Patent: July 24, 2012
    Assignee: Magnecomp Corporation
    Inventors: Peter Hahn, Wei Keat Chai, Kuen Chee Ee
  • Patent number: 8223461
    Abstract: A pure rotary microactuator comprising a spring assembly etched within a silicon substrate is disclosed. A first piezoelectric device is coupled with a first portion of the spring assembly and a second piezoelectric device coupled with a second portion of the spring assembly. The first piezoelectric device changes shape in response to an electrical input signal, and this change in shape provides a first push force to the first portion of the spring assembly in a first direction. The second piezoelectric device also changes shape in response to the electrical input signal, and this change in shape provides a second push force to the second portion in a second direction, which is different from the first direction. The combination of the first and the second push forces rotates the spring assembly with respect to the silicon substrate.
    Type: Grant
    Filed: September 28, 2007
    Date of Patent: July 17, 2012
    Assignee: Hitachi Global Storage Technologies, Netherlands B.V.
    Inventors: Fu-Ying Huang, Jifang Tian
  • Patent number: 8213128
    Abstract: A head-gimbal assembly (HGA). The HGA includes a deformable plate affixed to a load beam, a piezoelectric element affixed to the deformable plate, and a base plate affixed to the deformable plate. The deformable plate includes: a hole; a first section in front of the hole and affixed to the load beam; a second section behind the hole and affixed to the base plate; and, first and second spring members that join the first section and the second section, can deform in a front-back direction, and are positioned to sandwich the hole in a left-right direction. The piezoelectric element is affixed between the first section and the second section. The base plate includes projection members on a front edge of the plate and projecting out toward the first section. The front edges of the projection member are positioned further to a front edge than a back edge of the hole.
    Type: Grant
    Filed: August 27, 2010
    Date of Patent: July 3, 2012
    Assignee: Hitachi Global Storage Technologies, Netherlands B.V.
    Inventors: Eiji Soga, Hiroyasu Tsuchida
  • Patent number: 8213127
    Abstract: Embodiments of the present invention help to suppress reduction of the operation quantity of a microactuator. According to one embodiment, a microactuator comprises a silicon substrate and a piezoelectric element. The silicon substrate has some rigidity and provides elastic counter force to the piezoelectric element. In the piezoelectric element, a secondary piezoelectric layer is laminated on a primary piezoelectric layer opposite from the silicon substrate. The contraction force of the secondary piezoelectric layer acts on the primary piezoelectric layer so that it bends toward the secondary piezoelectric layer opposite from the silicon substrate. When the primary piezoelectric layer expands, the contraction force of the secondary piezoelectric layer acts on the primary piezoelectric layer so that it warps against the primary piezoelectric layer.
    Type: Grant
    Filed: September 19, 2008
    Date of Patent: July 3, 2012
    Assignee: Hitachi Global Storage Technologies, Netherlands B.V.
    Inventors: Haruhide Takahashi, Toshiki Hirano
  • Patent number: 8199442
    Abstract: A piezoelectric element 13 has a common electrode 19 that receives electricity from a terminal 57. The terminal 57 has a through hole 67 and an electric insulating layer 61. The piezoelectric element 13 is arranged so that the common electrode 19 faces the electric insulating layer 61 of the terminal 57. A liquid stopper 69 is formed around the through hole 67 so as to come between the common electrode 19 and the terminal 57 when the common electrode 19 and terminal 57 are set to face each other. A liquid conductive adhesive 71 is injected into the through hole 67 to fill a gap defined by the liquid stopper 69 between the terminal 57 and the common electrode 19 and secure electric connection between the terminal 57 and the common electrode 19. This configuration improves the reliability of wiring to the piezoelectric element and prevents the piezoelectric element from being damaged.
    Type: Grant
    Filed: September 8, 2009
    Date of Patent: June 12, 2012
    Assignee: NHK Spring Co., Ltd.
    Inventors: Osamu Okawara, Toshiki Ando, Naoki Moriya
  • Patent number: 8199441
    Abstract: A head suspension 31 has a piezoelectric element 13 that deforms in response to a voltage applied thereto, a base plate 33 having an opening 43 into which the piezoelectric element 13 is fitted, and a load beam 35 that is fixed to the base plate 33 so that a front end of the load beam 35 moves in a sway direction according to the deformation of the piezoelectric element 13. The head suspension 31 includes an electric insulating layer 51 formed at the opening 43 by vapor-depositing and polymerizing electrically insulative high polymer materials at the opening 43. The piezoelectric element 13 is fitted into the opening 43 through at least the electric insulating layer 51. The head suspension 31 satisfies a miniaturization requirement.
    Type: Grant
    Filed: September 11, 2009
    Date of Patent: June 12, 2012
    Assignee: NHK Spring Co., Ltd.
    Inventor: Akira Nojima
  • Patent number: 8191233
    Abstract: According to one embodiment, a head stack assembly incorporating device connects a head stack assembly to the base of a magnetic disk device by screwing a connector on the bottom surface of the rotational shaft of the head stack assembly and a connector on the base of the magnetic device together. The head stack assembly incorporating device includes a chuck and a driving-force transmitter. The chuck pinches the rotational shaft of the head stack assembly from the upper surface of the head stack assembly to be fixed to the rotational shaft. The chuck is rotatable around the central axis of the rotational shaft. The driving-force transmitter transmits a rotational force to the chuck.
    Type: Grant
    Filed: March 18, 2010
    Date of Patent: June 5, 2012
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Ryousuke Naide, Takeshi Kurumizawa
  • Patent number: 8194359
    Abstract: A piezoelectric element comprises a first laminated structure body and a second laminated structure body. Side surfaces of the first and the second laminated structure bodies that are parallel to a laminating direction both have at least a portion etched to form a recess so that a step distance is formed between sides of the two adjacent electrode layers that are parallel to the laminating direction. The design of the step distance increases insulation resistance between the two adjacent electrode layers on the opposite surfaces of the piezoelectric layer, and lowers reject rate. The first and the second laminated structure bodies are symmetrically laminated and bonded together, thus optimizing force balancing performance. The present invention also discloses a method of manufacturing a PZT element, a HGA with the PZT element and a disk drive unit having such HGA.
    Type: Grant
    Filed: May 21, 2008
    Date of Patent: June 5, 2012
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: MingGao Yao, Yu Sun
  • Patent number: 8189301
    Abstract: A microactuator assembly for a hard disk drive head suspension has an expandable base of stainless steel sheet material defining a negative lead affixed to the negative electrode on the bottom surface of a piezoelectric element, and a piece of stainless steel sheet material defining a positive lead attached to the positive electrode on the top surface of the piezoelectric element. The leads may be affixed directly to the piezoelectric element via conductive adhesive. The microactuator assembly can be assembled separately, and then laser welded into place on a suspension. A bond pad made of stainless steel sheet material extends from the flexible circuit, is electrically connected to the microactuator driving voltage conductor within the flexible circuit through a via, and is electrically isolated from the suspension substrate by an insulating film. The microactuator unit positive lead is mechanically and electrically connected to the bond pad via laser welding.
    Type: Grant
    Filed: April 24, 2009
    Date of Patent: May 29, 2012
    Assignee: Magnecomp Corporation
    Inventor: Christopher Schreiber