Encapsulated Patents (Class 361/301.3)
  • Patent number: 11170939
    Abstract: A tantalum capacitor includes a tantalum body including tantalum powder, and having a tantalum wire exposed to one end surface; a molding portion including fifth and sixth surfaces opposed in a first direction, third and fourth surfaces opposed in a second direction, and first and second surfaces opposed in a third direction, and formed to surround the tantalum body; an anode lead frame exposed to the second surface of the molding portion, and connected to the tantalum wire; and a cathode lead frame spaced apart from the anode lead frame, and exposed to the second surface of the molding portion. The anode lead frame includes a first connection portion and a first bent portion, and the first bent portion forms an inclination angle within a range of less than 70° toward the tantalum body, based on the first connection portion.
    Type: Grant
    Filed: January 31, 2020
    Date of Patent: November 9, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hun Chol Jung, Hong Kyu Shin, Wan Suk Yang, Ji Han Seo, Young June Lee
  • Patent number: 11081289
    Abstract: A tantalum capacitor includes: a tantalum body comprising tantalum powder and a tantalum wire exposed to one end surface; an anode lead frame comprising a first electrode member and a second electrode member bent perpendicularly thereto; a cathode electrode lead frame comprising a third electrode member spaced apart from the first electrode member having the tantalum body mounted on an upper surface thereof and a fourth electrode member bent perpendicularly thereto; and a encapsulation portion covering the tantalum body so that lower surfaces of the first and third electrode members and one external surfaces of the second and fourth electrode members are exposed. The anode lead frame comprises a bend portion having a connection part of the first electrode member and the second electrode member as an axis, and an end of the bend portion is in contact with the tantalum wire.
    Type: Grant
    Filed: October 7, 2019
    Date of Patent: August 3, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hong Kyu Shin, Young June Lee, Hun Chol Jung, Yu Jin Choi
  • Patent number: 11049655
    Abstract: The present application provides a resin-molded capacitor such that heat generated by a capacitor element can be efficiently dissipated, and a power conversion device. The resin-molded capacitor includes a first bus bar and a second bus bar joined to a first capacitor electrode and a second capacitor electrode respectively of a capacitor element, an insulating member joined to at least one of the first capacitor electrode and the second capacitor electrode or at least one of the first bus bar and the second bus bar, and an electrically conductive member joined to the insulating member.
    Type: Grant
    Filed: January 23, 2019
    Date of Patent: June 29, 2021
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kengo Nishimura, Satoshi Ishibashi, Hidehito Yoshida
  • Patent number: 11011316
    Abstract: An object of the present invention is to improve the sealability of a capacitor, to maintain the sealability thereof, or to suppress any degradation of the sealability thereof. In a capacitor (2), a base (6) including an insertion through hole (18-1, 18-2) is disposed on a side of an opening sealing member (14) of a capacitor main body (4), the opening sealing member is attached to an open portion of an outer package case (10) of the capacitor main body, and a terminal lead (16-1, 16-2) of the capacitor main body penetrates through the opening sealing member and passes through the insertion through hole to be disposed on an outer side of the base. The capacitor includes a resin layer (8) between the base and the opening sealing member. The base or the opening sealing member includes a protruding portion (20, 317-1) that is adjacent to the resin layer.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: May 18, 2021
    Assignee: NIPPON CHEMI-CON CORPORATION
    Inventors: Ryuuta Inoue, Yu Miura, Kouichi Nakata
  • Patent number: 10998873
    Abstract: Embodiments of this application provide a capacitor unit, an integrated capacitor, and a resonance unit. The capacitor unit includes: a conductive cavity, where an accommodation space is set longitudinally through in the conductive cavity; and a conductive core, where a first part of the conductive core and a second part of the conductive core are connected by using a via hole, the first part of the conductive core is located above or below the conductive cavity, and the second part of the conductive core is located in the accommodation space of the conductive cavity; and the conductive cavity is isolated from the conductive core by using an oxide layer or an insulation layer. The embodiments of this application can reduce impact from the outside on the capacitor unit, and therefore stability of the capacitor unit can be improved.
    Type: Grant
    Filed: April 3, 2019
    Date of Patent: May 4, 2021
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Xun Luo, Huizhen Qian
  • Patent number: 10796852
    Abstract: A film capacitor includes a capacitor unit, and outer packaging resin covering the capacitor unit. The capacitor unit includes a capacitor group, a first bus bar, a second bus bar, and a fixation portion. The capacitor group includes a plurality of capacitor elements. The first bus bar extracts electricity from the capacitor group. The second bus bar extracts electricity from the capacitor group. The first bus bar and the second bus bar are fixed to the fixation portion. The first bus bar includes a connection terminal part formed at one end of the first bus bar, and the second bus bar includes a connection terminal part formed at one end of the second bus bar. At least one of the connection terminal part of the first bus bar and the connection terminal part of the second bus bar is coupled to the fixation portion.
    Type: Grant
    Filed: March 20, 2018
    Date of Patent: October 6, 2020
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Manato Kadomura, Eizo Fujii
  • Patent number: 10388460
    Abstract: A capacitor comprising first and second end sprays respectively located at distal ends of a capacitor cell, a positive polarity bus bar extending from a first wound conductive layer of the capacitor cell adjacent to the first end spray, a negative polarity bus bar extending from a second wound conductive layer of the capacitor cell adjacent to the second end spray, and a capacitor film wrapped around an area between the first and second conductive layers.
    Type: Grant
    Filed: May 23, 2016
    Date of Patent: August 20, 2019
    Assignee: Ford Global Technologies, LLC
    Inventors: Guangyin Lei, Xi Lu, Zhuxian Xu, Chingchi Chen
  • Patent number: 10262809
    Abstract: An electric energy storage device has an inner terminal disposed in a cylindrical metal case and connected to an electrode of a bare cell, wherein the inner terminal includes a plate-shaped terminal body having a circular outer circumference; at least one electrolyte impregnation hole formed through the terminal body in a thickness direction; a flange located at the outer circumference of the terminal body and extending perpendicular to a plane of the terminal body; and a spacer formed to protrude at a periphery of at least one impregnation hole among the impregnation holes or formed by protruding a part of the plane of the terminal body.
    Type: Grant
    Filed: September 14, 2015
    Date of Patent: April 16, 2019
    Assignee: LS MTRON LTD.
    Inventors: Ha-Young Lee, Dong-Sup Kim, Sang-Hyun Bae, Ji-Eun Kang, Dong-Il Shin, Yu-Il Yoon, Hyun-Seok Ko, Kyeong-Hoon Park
  • Patent number: 10256046
    Abstract: A solid electrolytic capacitor includes a capacitor element, an anode terminal, a cathode terminal, and a sealing resin covering the capacitor element. The anode terminal includes a support portion for supporting the capacitor element, and an anode standing portion formed upright relative to the support portion. The capacitor element includes an anode wire projecting from a porous sintered body. The anode wire is placed on the upper end face of the anode standing portion. The anode wire and the anode standing portion have parts that are exposed from the sealing resin and covered by an electrically conductive anode terminal covering layer for ensuring electrical connection between the anode wire and the anode terminal.
    Type: Grant
    Filed: March 14, 2017
    Date of Patent: April 9, 2019
    Assignee: ROHM CO., LTD.
    Inventors: Makoto Aoyama, Hideki Ando
  • Patent number: 10192687
    Abstract: The present disclosure provides a capacitor assembly having a non-symmetrical electrode structure and a capacitor seat structure thereof. The capacitor assembly includes a capacitor seat structure and a capacitor package structure. The capacitor seat structure includes a capacitor seat, a first electrode layer and a second electrode layer. The capacitor seat has a first through hole, a first groove, a second through hole and a second groove. The capacitor package structure includes a first conductive pin and a second conductive pin. The first conductive pin passes through the first through hole and is disposed inside the first groove to electrically contact the first electrode layer. The second conductive pin passes through the second through hole and is disposed inside the second groove to electrically contact the second electrode layer.
    Type: Grant
    Filed: July 10, 2017
    Date of Patent: January 29, 2019
    Assignee: APAQ TECHNOLOGY CO., LTD.
    Inventors: Ming-Tsung Chen, Hsi-Dung Lin, Ching-Feng Lin
  • Patent number: 10002712
    Abstract: Disclosed is a multi-layer capacitor package comprising: a multi-layer capacitor; connection electrodes coupled to capacitor electrodes respectively, wherein the connection electrodes in each group of the connection electrodes vertically overlap with each other, and first and second groups of the connection electrodes are horizontally spaced from each other; a package housing configured to receive therein the multi-layer capacitor; and first and second internal electrodes received in the housing to be coupled to the first and second groups of the connection electrodes respectively, wherein the first and second internal electrodes are horizontally spaced from each other.
    Type: Grant
    Filed: March 8, 2016
    Date of Patent: June 19, 2018
    Assignee: Research & Business Foundation Sungkyunkwan University
    Inventors: Su-Jeong Seo, Tae-Yoo Kim, Jung-Kab Park, Young-Il Song, Jin-Ha Shin, Jungwoo Lee, Younglae Cho, Byung-Wook Ahn, Jung-Ho Park, Sook-Young Yun, Seung-Bin Baeg, Young-il Na
  • Patent number: 9941056
    Abstract: An improved capacitor is provided with at least one anode having a dielectric on the anode and an anode lead extending from the anode. A conductive cathode layer is on the dielectric. An anode leadframe is electrically connected to the anode and a cathode leadframe is electrically connected to the cathode. An encapsulant encases the anode, a portion of the anode leadframe and a portion of the cathode leadframe such that the anode leadframe extends from the encapsulant to form an external anode leadframe and the cathode leadframe extends from the encapsulant to form an external cathode leadframe. At least one secondary electrical connection is provided wherein the secondary electrical connection is in electrical contact with the cathode and extends through the encapsulant to the external cathode leadframe or the secondary electrical contact is in electrical contact with the anode and extends through the encapsulant to the external anode leadframe.
    Type: Grant
    Filed: January 23, 2014
    Date of Patent: April 10, 2018
    Assignee: KEMET ELECTRONICS CORPORATION
    Inventors: Brandon Summey, Jeffrey Poltorak
  • Patent number: 9922769
    Abstract: Three-phase electrical can capacitor with three star-connected capacitances in a housing, characterized in that two polymer film capacitor coils (10, 12), which each have a hollow capacitor coil core (14) and are provided on the end sides with in each case one end contact layer (16, 18 and 20, 22), are arranged one above the other in the form of a column in the housing, wherein one (10) of the two polymer film capacitor coils (10, 12) has one individual capacitance and the other (12) of the two polymer film capacitor coils has two individual capacitances, and all of the individual capacitances are equal in size.
    Type: Grant
    Filed: May 15, 2012
    Date of Patent: March 20, 2018
    Assignee: FRAKO KONDENSATOREN- UND ANLAGENBAU GMBH
    Inventor: Hans-Georg Reinbold
  • Patent number: 9620266
    Abstract: An electrical device having at least one functional element that includes a ceramic body, on which a first electrical contact layer and a second electrical contact layer are applied to two opposite-lying side faces, respectively, and the functional element is arranged between a first contact strip and a second contact strip, wherein the first contact strip and the second contact strip comprise several contact pins, respectively, and wherein the first contact layer electrically contacts at least one contact pin of the first contact strip and the second contact layer electrically contacts at least one contact pin of the second contact strip.
    Type: Grant
    Filed: July 4, 2012
    Date of Patent: April 11, 2017
    Assignee: EPCOS AG
    Inventors: Markus Ortner, Michael Schossmann, Markus Koini, Günter Engel, Christian Hoffmann
  • Patent number: 9576741
    Abstract: The present invention relates to a solid electrolytic capacitor and a production method thereof. A solid electrolytic capacitor of the present invention includes: a capacitor element having an anode wire inserted in one side surface thereof; a cathode terminal disposed on one side under the capacitor element to be electrically connected to the capacitor element; an anode terminal disposed on the other side under the capacitor element and having a bending portion integrally formed to be inclined to the capacitor element for electrical connection with the anode wire; and a molding portion surrounding the outside of the capacitor element and formed to expose lower surfaces of the cathode terminal and the anode terminal.
    Type: Grant
    Filed: September 15, 2014
    Date of Patent: February 21, 2017
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Ho Kwak, Hee Sung Choi, Hun Chol Jung, Yeong Su Cho, Sung Soo Cha, Hee Dong Myung, Jeong Oh Hong
  • Patent number: 9384899
    Abstract: A tantalum capacitor may include: a capacitor body containing a tantalum powder and having a tantalum wire exposed to one end surface thereof; a positive electrode lead frame including a positive electrode terminal part, a vertical support part vertically extended from one leading edge of the positive electrode terminal part, and a positive electrode connection part extended from the vertical support part toward the positive electrode terminal part and connected to the tantalum wire; a negative electrode lead frame having the capacitor body mounted on an upper surface thereof; and a molding part formed to allow a lower surface of the positive electrode terminal part of the positive electrode lead frame and a lower surface of the negative electrode lead frame to be exposed, while enclosing the capacitor body.
    Type: Grant
    Filed: March 4, 2014
    Date of Patent: July 5, 2016
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Ho Kwak, Hun Chol Jung, Jeong Oh Hong, Sung Soo Cha, Hee Dong Myung, Hee Sung Choi
  • Patent number: 9374901
    Abstract: In a monolithic capacitor mounting structure, assuming that a portion of a first outer electrode joined with a first bonding material is a first bonding portion and a portion of a second outer electrode joined with a second bonding material is a second bonding portion, a length of each of the first and second bonding portions in a lengthwise direction of the monolithic capacitor is about 0.2 times to about 0.5 times a length of an elementary body in the lengthwise direction, and a center of each of the first and second bonding portions in the lengthwise direction is located at a position different from a center of the elementary body in the lengthwise direction. Vibration noise is changed depending on positions of outer electrodes of the monolithic capacitor, the outer electrodes being used to bond the monolithic capacitor to a mounting substrate.
    Type: Grant
    Filed: August 7, 2013
    Date of Patent: June 21, 2016
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Kazuo Hattori, Isamu Fujimoto
  • Patent number: 9355993
    Abstract: A system and method of manufacture of an integrated circuit system includes: a die having a via, the die having a top side and a bottom side; a top interconnect mounted to the via at the top side; an interconnect pillar mounted to the via at the bottom side; a device interconnect mounted to the interconnect pillar; and a base adhesive covering the interconnect pillar and the device interconnect.
    Type: Grant
    Filed: July 3, 2015
    Date of Patent: May 31, 2016
    Assignee: STATS ChipPAC Ltd.
    Inventors: Won Kyoung Choi, Pandi Chelvam Marimuthu
  • Patent number: 9293263
    Abstract: An outer insulation member made of a first resin packs a part of an anode terminal. The packed part of the anode terminal has a predetermined section. All surfaces of the predetermined section consist of a front surface, a back surface and edges connecting between the front surface and the back surface. The front surface includes a connection area. An anode lead wire is connected to the connection area while being not connected to the anode terminal other than the connection area. The all surfaces of the predetermined section are completely covered with a mask layer made of a second resin except for the connection area. The second resin is different from the first resin in at least one of composition thereof, content of an inclusion, size of an inclusion and shape of an inclusion.
    Type: Grant
    Filed: January 29, 2014
    Date of Patent: March 22, 2016
    Assignees: KEMET Electronics Corporation, NEC Tokin Corporation
    Inventors: Yanming Liu, Yuji Yoshida, Hayato Ueda, Daisuke Takada, Satoshi Iwai, Takashi Mizukoshi
  • Patent number: 9064634
    Abstract: A capacitor holder comprising a body part formed in a shape into which a tip end of a capacitor can be fitted; and a lead part which is fixed to the body part and can be soldered to a predetermined fitting location. The body part has an opening through which the tip end of the capacitor is exposed, and an end surface abutment portion which abuts a tip end surface of the capacitor in a vicinity of a pressure valve, when the tip end of the capacitor is fitted into the body part. The lead part is fixed to the body part at a position opposite to the capacitor with respect to a reference plane, which is a plane includes the tip end surface of the capacitor abutting the end surface abutment portion.
    Type: Grant
    Filed: August 23, 2011
    Date of Patent: June 23, 2015
    Assignee: Kitagawa Industries Co., Ltd.
    Inventor: Tatsuya Nakamura
  • Patent number: 9058932
    Abstract: A capacitor system and a method for producing a capacitor system. The capacitor system may be used in a power semiconductor module. In one embodiment, the capacitor system comprises a metal shaped body having a depression; a capacitor arranged at least partly in the depression; a spacer composed of electrically insulating material, the spacer being arranged at least partly between the capacitor and the metal shaped body in the depression; and an electrically insulating potting material provided in the depression, wherein the potting material fixes the capacitor in the depression so that the capacitor does not touch the metal shaped body.
    Type: Grant
    Filed: November 7, 2011
    Date of Patent: June 16, 2015
    Inventors: Frank Ebersberger, Peter Beckedahl, Hartmut Kulas, Peter Schott
  • Publication number: 20150144618
    Abstract: The present invention relates to a half bridge induction heating generator, comprising at least one power terminal (10) provided for a direct current voltage, at least one ground terminal (12), and four capacitors (C2, C3, C4, C5) forming a bridge circuit between the power terminal (10) and the ground terminal (12). The induction heating generator comprises further an induction coil (L) interconnected in the centre of said bridge circuit, two semiconductor switches (Q1, Q2) connected in each case parallel to one of the both capacitors (C4, C5) on one side of the bridge circuit, and a further capacitor (CI) interconnected between the power terminal (10) and the ground terminal (12).
    Type: Application
    Filed: May 21, 2013
    Publication date: May 28, 2015
    Inventors: Laurent Jeanneteau, Thibaut Rigolle, Alex Viroli, Andrea Fattorini
  • Patent number: 9036329
    Abstract: Disclosed herein is a multilayer capacitor comprising: a laminate in which a plurality of first sheets and second sheets are alternately laminated, wherein the first sheets and the second sheets are disposed in a direction perpendicular to a mounting surface; a first inner electrode formed on the first sheets, wherein the first electrode is exposed through upper, lower, and first lateral surfaces of the laminate; a second inner electrode that is formed on the second sheets and has a horizontally symmetrical shape with respect to the first inner electrode; a sealing portion encapsulating the first and second inner electrodes exposed through two lateral surfaces of the laminate; and an external electrode that is electrically connected to the first and second inner electrodes exposed through the upper and lower surfaces of the laminate.
    Type: Grant
    Filed: October 4, 2012
    Date of Patent: May 19, 2015
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hae Suk Chung, Jae Yeol Choi, Hyun Woo Kim, Dong Su Cho
  • Patent number: 8947850
    Abstract: A multilayer capacitor that can suppress electrostrictive vibration without material constraint and with applicability to various structures, including general-purpose structures. A multilayer capacitor has: an element body formed of dielectric ceramic; and a plurality of internal electrodes disposed inside the element body such that the internal electrodes are stacked with ceramic layers sandwiched therebetween. The multilayer capacitor is provided with a capacitor area which includes the plurality of internal electrodes and a first suppression area and a second suppression area for reducing electrostriction caused by the plurality of internal electrodes so as to suppress noise. The first suppression area is adjacent to the capacitor area and the thickness of the second suppression area is determined according to the arrangement of the plurality of internal electrodes.
    Type: Grant
    Filed: July 11, 2012
    Date of Patent: February 3, 2015
    Assignee: TDK Corporation
    Inventor: Masaaki Togashi
  • Patent number: 8934215
    Abstract: A laminated chip electronic component includes: a ceramic body including internal electrodes and dielectric layers; external electrodes covering end portions of the ceramic body in length direction; an active layer in which the internal electrodes are disposed in opposing manner, while having the dielectric layers interposed therebetween, to form capacitance; and upper and lower cover layers formed on upper and lower portions of the active layer in thickness direction, the lower cover layer thicker than the upper cover layer.
    Type: Grant
    Filed: December 13, 2012
    Date of Patent: January 13, 2015
    Assignee: Samsung Electro-Mechanics Co., Ltd
    Inventors: Hang Kyu Cho, Young Ghyu Ahn, Jae Yeol Choi, Doo Young Kim, Seok Hyun Yoon, Ji Young Park
  • Patent number: 8879234
    Abstract: In a laminated ceramic electronic component, a first functional portion and a second functional portion are disposed within a ceramic element body so as to be adjacent to each other along a height direction, first and second internal electrodes face each other through a ceramic layer in the first functional portion, and third and fourth internal electrodes whose number of laminated layers is different from the number of laminated layers of the first and second internal electrodes face each other through the ceramic layer in the second functional portion. A marking internal conductor is disposed on the same plane as the first internal electrode and/or the second internal electrode, a marking external conductor is disposed on the side surface of the ceramic element body so as to link a plurality of exposed marking internal conductors such that it is possible to recognize vertical directionality.
    Type: Grant
    Filed: July 17, 2012
    Date of Patent: November 4, 2014
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Masaki Tsukida, Atsushi Ishida
  • Patent number: 8861177
    Abstract: A metallized film capacitor includes a dielectric film and two metal vapor-deposition electrodes facing each other across the dielectric film. At least one of the metal vapor-deposition electrodes is made of substantially only aluminum and magnesium. This metallized film capacitor has superior leak current characteristics and moisture resistant performances, and can be used for forming a case mold type capacitor with a small size.
    Type: Grant
    Filed: September 10, 2013
    Date of Patent: October 14, 2014
    Assignee: Panasonic Corporation
    Inventors: Hiroki Takeoka, Hiroshi Kubota, Yukikazu Ohchi, Hiroshi Fujii, Yukihiro Shimasaki
  • Patent number: 8675336
    Abstract: Multiple wound film capacitors include a hollow core formed by a first non-conducting tubular section, and a first capacitor winding wrapped around the first non-conducting tubular section. Also included are a second non-conducting tubular section wrapped around the first capacitor winding, and a second capacitor winding wrapped around the second non-conducting tubular section. The multiple wound film capacitors may also include a third non-conducting tubular section wrapped around the second capacitor winding, and a third capacitor winding wrapped around the third non-conducting tubular section. In addition, ends of the first and second non-conducting tubular sections extend beyond ends of the first and second capacitor windings.
    Type: Grant
    Filed: January 31, 2012
    Date of Patent: March 18, 2014
    Assignee: Electronics Concepts, Inc.
    Inventors: Bernard Lavene, David Curto
  • Patent number: 8599539
    Abstract: Provided is a ceramic chip assembly configured to economically and reliably insulate an exposed portion of a metal lead wire from an environmental change. The ceramic chip assembly includes a ceramic base having electrical characteristics, a pair of external electrodes that are disposed on a pair of surfaces of the ceramic base, respectively, the surfaces of the ceramic base being opposed to each other, a pair of metal lead wires as single cores having first ends that are electrically and mechanically connected to the external electrodes, respectively, by an electrical conductive adhesive member, an insulation sealant sealing the ceramic base, the external electrodes, and the first ends of the metal lead wires to expose second ends of the metal lead wires, and an insulation polymer coating layer continuously formed on both the insulation sealant and portions of the metal lead wires exposed out of the insulation sealant.
    Type: Grant
    Filed: July 29, 2011
    Date of Patent: December 3, 2013
    Assignees: Joinset Co., Ltd.
    Inventors: Sun-Ki Kim, Seong-Jin Lee, Ki-Han Park
  • Patent number: 8559161
    Abstract: A metallized film capacitor includes a dielectric film and two metal vapor-deposition electrodes facing each other across the dielectric film. At least one of the metal vapor-deposition electrodes is made of substantially only aluminum and magnesium. This metallized film capacitor has superior leak current characteristics and moisture resistant performances, and can be used for forming a case mold type capacitor with a small size.
    Type: Grant
    Filed: October 29, 2010
    Date of Patent: October 15, 2013
    Assignee: Panasonic Corporation
    Inventors: Hiroki Takeoka, Hiroshi Kubota, Yukikazu Ohchi, Hiroshi Fujii, Yukihiro Shimasaki
  • Patent number: 8536465
    Abstract: Provided is an electrochemical device compatible with high-temperature reflow soldering using a lead-free solder. An electrical double layer capacitor 10-1 includes a package 14 that is constructed with a film or films and has sealed parts 14a1 to 14a3 formed by sealing parts, in which films are superimposed on each other, by, for example, heat sealing. The entireties of the sealed parts 14a1 to 14a3 of the package 14 are covered in a close-contact state with a support 16 that has higher rigidity than the film(s) constructing the package 14.
    Type: Grant
    Filed: March 16, 2009
    Date of Patent: September 17, 2013
    Assignee: Taiyo Yuden Co., Ltd
    Inventors: Naoto Hagiwara, Katsuei Ishida, Kazushi Yawata, Motoki Kobayashi
  • Publication number: 20130222967
    Abstract: A case mold type capacitor is formed of multiple metalized film capacitors connected together in parallel and rigidly accommodated with molding resin within a case. The multiple metalized film capacitors are divided into a first block and a second block, and P-poles of each block confront each other, and N-poles thereof also confront each other. Bus-bars including a connection terminal for external connection at an end are connected to respective P-poles and N-poles of each block. The bus-bars connected to the P-poles are coupled together, and the bus-bars connected to the N-poles are coupled together. Each one of the bus-bars includes a section located on the opening side of the case with respect to the blocks. The bus-bars connected to the P-poles overlap in part, and the bus-bars connected to the N-poles also overlap in part.
    Type: Application
    Filed: December 22, 2011
    Publication date: August 29, 2013
    Applicant: PANASONIC CORPORATION
    Inventors: Takeshi Imamura, Yoshinari Nagata, Toshiharu Saito
  • Patent number: 8456795
    Abstract: A hard start capacitor replacement unit has a plurality of capacitors in a container sized to fit in existing hard start capacitor space. The capacitors are 4 metallized film capacitors wound in a single cylindrical capacitive element. The container has a common terminal and capacitors value terminals for the plurality of capacitors, which may be connected singly or in combination to provide a selected capacitance. An electronic or other relay connects the selected capacitance in parallel with a motor run capacitor. The hard start capacitor replacement unit is thereby adapted to replace a wide variety of hard start capacitors.
    Type: Grant
    Filed: November 15, 2010
    Date of Patent: June 4, 2013
    Assignee: American Radionic Company, Inc.
    Inventor: Richard W. Stockman
  • Publication number: 20130135548
    Abstract: A transparent capacitor apparatus includes a first transparent substrate including a first patterned conductive layer having a first conductive material located over the first transparent substrate; a dielectric layer located over the first patterned conductive layer; a second patterned conductive layer including a second conductive material located over the dielectric layer, wherein the second pattern is different from the first pattern; and a second transparent substrate located over the second patterned conductive layer. Portions of the first conductive material of the first patterned conductive layer overlap portions of the second conductive material of the second patterned conductive layer. The overlapping portions of the first and second conductive materials form matching patterned electrical conductor(s) having spatially matching conducting and non-conductive areas, the non-conductive areas of the first and second patterned conductive layers having encapsulated coalesced conductive material structures.
    Type: Application
    Filed: November 29, 2011
    Publication date: May 30, 2013
    Inventors: Mitchell Stewart Burberry, Ronald Steven Cok
  • Patent number: 8451133
    Abstract: A capacitor providing a thermal alert includes a wound film capacitor for carrying a large current when coupled to an AC generator. The wound film capacitor includes a hollow core extending from one end to another end of the capacitor. Also included are an in-line thermal switch, which is disposed in the hollow core for sensing a predetermined temperature; and a light indicator, which is coupled to the thermal switch. A single housing is integrally formed from an upper cover and a lower cover for housing the capacitor, the thermal switch and the light indicator. The upper cover of the housing is formed from translucent material. The thermal switch is configured to disconnect the wound film capacitor from the AC generator upon reaching the predetermined temperature, and activate the light indicator to emit a light. The upper cover is effective in transmitting the light from inside the housing to outside of the housing.
    Type: Grant
    Filed: August 7, 2009
    Date of Patent: May 28, 2013
    Assignee: Electronic Concepts, Inc.
    Inventors: Bernard Lavene, David Curto, Alan Schach
  • Publication number: 20130083448
    Abstract: Disclosed herein is a multilayer capacitor comprising: a laminate in which a plurality of first sheets and second sheets are alternately laminated, wherein the first sheets and the second sheets are disposed in a direction perpendicular to a mounting surface; a first inner electrode formed on the first sheets, wherein the first electrode is exposed through upper, lower, and first lateral surfaces of the laminate; a second inner electrode that is formed on the second sheets and has a horizontally symmetrical shape with respect to the first inner electrode; a sealing portion encapsulating the first and second inner electrodes exposed through two lateral surfaces of the laminate; and an external electrode that is electrically connected to the first and second inner electrodes exposed through the upper and lower surfaces of the laminate.
    Type: Application
    Filed: October 4, 2012
    Publication date: April 4, 2013
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: SAMSUNG ELECTRO-MECHANICS CO., LTD.
  • Publication number: 20130057112
    Abstract: An electronic component comprises an element body, an external electrode, and an insulating resin coating layer. The element body has a pair of end faces opposed to each other, a pair of principal faces extending so as to connect the pair of end faces and opposed to each other, and a pair of side faces extending so as to connect the pair of principal faces and opposed to each other. The external electrode is formed so as to cover at least a partial region of the principal face and/or a partial region of the side face and has a plating layer comprised of Sn or an Sn alloy. The insulating resin coating layer covers at least the portion of the external electrode formed so as to cover the side face.
    Type: Application
    Filed: August 31, 2012
    Publication date: March 7, 2013
    Applicant: TDK CORPORATION
    Inventors: Yukihiko SHIRAKAWA, Kazuhiro NAKAMURA, Shintaro KON, Hiromitsu NOGIWA
  • Patent number: 8357753
    Abstract: This invention relates to compositions, and the use of such compositions for protective coatings, particularly of electronic devices. The invention concerns fired-on-foil ceramic capacitors coated with a composite encapsulant and embedded in a printed wiring board.
    Type: Grant
    Filed: June 18, 2008
    Date of Patent: January 22, 2013
    Assignee: CDA Processing Limited Liability Company
    Inventors: John D. Summers, Thomas Eugene Dueber
  • Patent number: 8315031
    Abstract: The case mold type capacitor has a capacitor element, a pair of terminals, and molding resin. Each terminal of the pair is connected to a first electrode and a second electrode of the capacitor element, respectively. The capacitor element is embedded in the molding resin in a manner that a terminal section disposed at an end of each of terminals are partially exposed to outside. The molding resin has epoxy resin containing inorganic filler and a moisture absorbent mixed in the epoxy resin.
    Type: Grant
    Filed: October 2, 2008
    Date of Patent: November 20, 2012
    Assignee: Panasonic Corporation
    Inventors: Takuya Kyouda, Makoto Tomita, Toshiharu Saito, Shigeo Okuno
  • Patent number: 8233261
    Abstract: This invention relates to compositions, and the use of such compositions for protective coatings, particularly of electronic devices. The invention concerns a fired-on-foil ceramic capacitors coated with a composite encapsulant and embedded in a printed wiring board.
    Type: Grant
    Filed: December 11, 2007
    Date of Patent: July 31, 2012
    Assignee: CDA Processing Limited Liability Company
    Inventors: John D Summers, Tsutomu Mutoh
  • Patent number: 8227320
    Abstract: The present invention relates to methods of making capacitors for use in surveillance/identification tags or devices, and methods of using such surveillance/identification devices. The capacitors manufactured according to the methods of the present invention and used in the surveillance/identification devices described herein comprise printed conductive and dielectric layers. The methods and devices of the present invention improve the manufacturing tolerances associated with conventional metal-plastic-metal capacitor, as well as the deactivation reliability of the capacitor used in a surveillance/identification tag or device.
    Type: Grant
    Filed: October 10, 2008
    Date of Patent: July 24, 2012
    Assignee: Kovio, Inc.
    Inventors: Vivek Subramanian, Patrick Smith, Vikram Pavate, Arvind Kamath, Criswell Choi, Aditi Chandra, James Montague Cleeves
  • Publication number: 20120140374
    Abstract: A laminated electronic component includes outer terminal electrodes including lower plating films including metal particles having an average size of 0.5 ?m or less, the lower plating films being formed by directly plating an outer surface of an electronic component body such that the lower plating films are electrically connected to exposed portions of inner conductors. The outer terminal electrodes may further include upper plating films formed on the lower plating films, the upper plating films being defined by one or more layers. Metal particles defining the upper plating films may have an average size of 0.5 ?m or less. The metal particles defining the lower plating films may be Cu particles.
    Type: Application
    Filed: February 3, 2012
    Publication date: June 7, 2012
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Kenichi KAWASAKI, Shunsuke TAKEUCHI, Akihiro MOTOKI, Makoto OGAWA, Toshiyuki IWANAGA
  • Patent number: 8159810
    Abstract: A system for providing selective capacitance with a bundled capacitor is described herein. The bundled capacitor can include a housing a cap, a central common terminal, a plurality of auxiliary terminals, an interrupter, an insulating spider, a plurality of individual rolled sandwich like connected capacitors, a thermal fuse, a frangible electrical connection, an insulating layer, a resin, and an expansion chamber. A single phase motor can be connected to the bundled capacitor.
    Type: Grant
    Filed: February 5, 2010
    Date of Patent: April 17, 2012
    Assignee: Direct Brand, Ltd.
    Inventors: Malcolm Gorst, Ronald E. Loving
  • Patent number: 8072732
    Abstract: A capacitor is provided having a tough surface portion which prevents cracking that tends to occur when the capacitor is built-in or surface-mounted on a wiring board. A ceramic sintered body of the capacitor includes a capacitor forming layer portion, a cover layer portion and an interlayer portion. The capacitor forming layer portion has a laminated structure wherein ceramic dielectric layers and inner electrodes connected to a peripheral portion of capacitor via conductors, are alternately laminated. The cover layer portion is exposed at a surface portion of the ceramic body and has a laminated structure wherein ceramic dielectric layers and dummy electrodes not connected to the capacitor via conductors, are alternately laminated.
    Type: Grant
    Filed: April 10, 2008
    Date of Patent: December 6, 2011
    Assignee: NGK Spark Plug Co., Ltd.
    Inventors: Motohiko Sato, Kenji Murakami, Jun Otsuka, Manabu Sato, Masahiko Okuyama, Kozo Yamazaki
  • Patent number: 8068327
    Abstract: A holding device for encased capacitors used for electric drive engineering. The inventive holding device comprises integrateable and separable lower and top holding parts. Axially protruded retaining clamps are arranged on the top holding part around each encased capacitor. The lower holding part comprises an opening for the respective capacitor and each opening is surrounded with a sealing lip. The retaining clamps are pressed against the capacitors by the internal surface of the lower holding part. Sections protruded from the respective openings of the lower holding part are embodied in the form of the capacitor sections freely extending directly to a cold air flow of a device. The sealing lip is sealingly placed on the external wall of each encased capacitor in such a way that the penetration of solid or liquid materials inside the lower holding part is prohibited, thereby preventing a high IP protection degree.
    Type: Grant
    Filed: July 25, 2006
    Date of Patent: November 29, 2011
    Assignee: Lenze Drives GmbH
    Inventors: Josef Seifert, Rudi Hueskes, Matthias Rohde, Alex Itten
  • Publication number: 20110157763
    Abstract: A capacitor comprising: a capacitor body including a plurality of laminated dielectric layers, a plurality of inner electrode layers which are respectively disposed between mutually adjacent ones of the dielectric layers, a first main surface located in a laminated direction of the dielectric layers, and a second main surface opposite to the first main surface; a first outer electrode formed on the first main surface of the capacitor body and electrically connected to the inner electrode layers; a second outer electrode formed on the second main surface of the capacitor body and electrically connected to the inner electrode layers; a first dummy electrode formed on the first main surface of the capacitor body; and a second dummy electrode formed on the second main surface of the capacitor body.
    Type: Application
    Filed: March 8, 2011
    Publication date: June 30, 2011
    Applicant: NGK SPARK PLUG CO., LTD.
    Inventors: Hiroshi YAMAMOTO, Toshitake Seki, Shinji Yuri, Masaki Muramatsu, Motohiko Sato, Kazuhiro Hayashi, Jun Otsuka, Manabu Sato
  • Publication number: 20110121820
    Abstract: A high-voltage sensing capacitor as an interface apparatus that may be used to attach an indicator unit to a high-voltage AC electrical bus and to provide safety to maintenance personnel. The high-impedance nature of the sensing capacitor effectively isolates the indicator unit from the high-voltage source to which it is connected. Multiple electrical phases can be interfaced using a plurality of such sensing capacitors. The sensing capacitor can be directly mounted to a high-voltage busbar. The indicator unit may provide visual and/or audible alerts to maintenance personnel when high voltage conditions are detected on the busbar by the sensing capacitor. The sensing capacitor is comprised of a portable, unitary capacitive structure that includes a molded insulator body encapsulating two electrodes. The electrodes of the capacitor only partially or incompletely overlap within the insulator body.
    Type: Application
    Filed: November 20, 2009
    Publication date: May 26, 2011
    Applicant: SMC Electrical Products, Inc.
    Inventors: Sam Handshoe, Bill Blankenship
  • Publication number: 20110102966
    Abstract: A molded capacitor includes a capacitor-element assembly, a package covering the capacitor-element assembly, and a supporter embedded in the package. The capacitor-element assembly includes a capacitor element having a first electrode, and a busbar joined to the electrode of the capacitor element. The busbar has a terminal. The package is made of norbornene-based resin and covers the capacitor-element assembly while exposing the terminal of the busbar. The supporter has first and second end section and is made of heat-conductive insulating material. The first end section contacts the capacitor-element assembly. The second end section is exposed from the package. This molded capacitor has high heat resistance and a small, light-weighted body, and can be manufactured inexpensively.
    Type: Application
    Filed: July 1, 2009
    Publication date: May 5, 2011
    Inventors: Hiroki Takeoka, Hiroshi Kubota, Yukihiro Shimasaki, Hiroshi Fujii, Yukikazu Ohchi
  • Patent number: 7927517
    Abstract: Disclosed herein are a coating solution for the formation of a dielectric thin film and a method for the formation of a dielectric thin film using the coating solution. The coating solution comprises a titanium alkoxide, a ?-diketone or its derivative, and a benzoic acid derivative having an electron donating group. The method comprises spin coating the coating solution on a substrate to form a thin film and drying the thin film at a low temperature to crystallize the thin film. The titanium-containing coating solution is highly stable. In addition, the coating solution enables formation of a thin film, regardless of the kind of substrates, and can be used to form dielectric thin films in an in-line mode in the production processes of PCBs.
    Type: Grant
    Filed: May 8, 2009
    Date of Patent: April 19, 2011
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jun Hee Bae, Seung Hyun Kim, Yul Kyo Chung, Won Hoon Song, Sung Taek Lim, Hyun Ju Jin
  • Publication number: 20100271748
    Abstract: Provided are an embedded capacitor, an embedded capacitor sheet using the embedded capacitor, and a method of manufacturing the same that may increase a surface area to thereby increase a capacity for each unit area and may provide an embedded capacitor in a sheet to thereby readily lay the embedded capacitor on an embedded printed circuit board. The embedded capacitor may include: a common electrode member 11 including a plurality of grooves 11a; a sealing dielectric layer 12 being formed by sealing a nano dielectric powder with a high dielectric constant in the plurality of grooves 11a formed in the common electrode member 11; a buffer dielectric layer 13 sealing and smoothing an uneven portion of the sealing dielectric layer 12 by applying a paste or a slurry including epoxy of 20 Vol % through 80 Vol % and dielectric powder of 20 Vol % through 80 Vol % with respect to the sealing dielectric layer 12; and an individual electrode member 14 being formed on the buffer dielectric layer 13.
    Type: Application
    Filed: May 18, 2009
    Publication date: October 28, 2010
    Inventors: Jung Rag Yoon, Kyung Min Lee, Jeong Woo Han