Abstract: A multi-layer ceramic electronic component includes a plurality of layered internal electrodes and a first crystal grain. The plurality of layered internal electrodes are disposed at intervals in a first direction and each include a pore. The first crystal grain has a larger diameter in the first direction than the interval and has a part disposed in the pore.

Abstract: A ceramic electronic component includes a ceramic body and first and second outer electrodes. The first and second outer electrodes respectively include first and second resin-containing electrode layers and first and second Ni plating layers. The first and second Ni plating layers are respectively provided on the first and second resin-containing electrode layers. When a thickness of the first or second Ni plating layer is t1 and a distance by which a portion of the first or second Ni plating layer that is in contact with the second principal surface extends in the length direction is t2, t2/t1 is less than about 1.

Abstract: A multilayer ceramic capacitor has a cuboid or substantially cuboid multilayer body including a stack of dielectric layers, inner-electrode layers alternating with the dielectric layers and exposed at end surfaces of the multilayer body, and outer electrodes on the end surfaces and coupled to the inner-electrode layers. The dielectric layers are primarily made of barium titanate. At the interfaces between the dielectric and inner-electrode layers, protective layers containing calcium zirconate cover the inner-electrode layers.

Abstract: A multilayer capacitor includes a capacitor body having first and second surfaces, third and fourth surfaces connected to the first and second surfaces, and a fifth surface and a sixth surface connected to the first and second surfaces and the third and fourth surfaces, the capacitor body including a dielectric layer and internal electrodes having one ends exposed through the third and fourth sides, respectively, and first and second external electrodes including first and second connection portions disposed on the third and fourth surfaces, respectively, and first and second band portions extending from the first and second connection portions to portions of the fifth and sixth surfaces respectively. A first distance, along one of the fifth and sixth surfaces, between the first and second external electrodes, is less than a second distance, along one of the first and second surfaces, between the first and second external electrodes.

Abstract: A multi-layered ceramic electronic component has a ceramic body including dielectric layers and a plurality of internal electrodes opposing each other with the dielectric layers interposed therebetween. External electrodes are disposed on an exterior of the ceramic body and are electrically connected to the internal electrodes. Each external electrode includes an electrode layer electrically connected to internal electrodes, and a conductive resin layer arranged on the electrode layer. The conductive resin layer extends to first and second surface of the ceramic body, and a ratio of a thickness (Tb) of the conductive resin layer extending onto the first surface and the second surface of the ceramic body to a length (Lm) of a length direction margin portion of the ceramic body satisfies 2 to 29%.

Abstract: An element body of a rectangular parallelepiped shape includes a principal surface arranged to constitute a mounting surface, a pair of side surfaces opposing each other and adjacent to the principal surface, and a pair of end surfaces opposing each other and adjacent to the principal surface and the pair of side surfaces. An external electrode includes a sintered metal layer disposed on an end portion of the element body, and a conductive resin layer including a portion positioned on the principal surface and a portion positioned on the sintered metal layer. An end edge of the sintered metal layer is positioned closer to the end surface than a maximum thickness position of the portion positioned on the principal surface. A thickness of the conductive resin layer gradually decreases from the maximum thickness position to the portion positioned on the sintered metal layer.

Abstract: A multilayer ceramic capacitor includes: a multilayer structure in which each of dielectric layers and each of internal electrode layers are alternately stacked, a main component of the dielectric layers being ceramic, wherein: a second-phase has an average diameter of 150 nm or less and is in at least one of interfaces between the dielectric layers and the internal electrode layers; and at least one of the internal electrode layers includes a grain of which a main component is ceramic.

Abstract: A multilayer ceramic capacitor that includes outer electrodes and a multilayer body having stacked inner electrode layers and dielectric layers. The dielectric layers in an effective section contain, relative to 100 parts by mole of Ti, 0.7 to 1.2 parts by mole of Si, 0.9 to 1.1 parts by mole of Dy, 0.24 to 0.34 parts by mole of Mg, 0.17 to 0.23 parts by mole of Al, 0.09 to 0.11 parts by mole of Mn, and 0.04 to 0.06 parts by mole of V. The dielectric layers have a Ba/Ti molar ratio of 1.0073 to 1.0083.

Abstract: An electronic device includes a plurality of chip components, an intermediate metal terminal, and an outer metal terminal. The intermediate metal terminal connects end surfaces of terminal electrodes of the chip components. The outer metal terminal is connectable to the terminal electrode positioned opposite to the terminal electrode connectable to the intermediate metal terminal.

Abstract: A pressure-sensitive chip, a pressure sensor, and a pressure monitoring system. In an embodiment, a pressure-sensitive chip and a signal processing module are packaged to form a pressure sensor. The pressure sensor and a display instrument are connected to form a pressure monitoring system. A pressure-sensitive chip is a ceramic body made of eight green ceramic sheets by stacking and sintering, and includes two capacitors. In another embodiment, a pressure signal of a measurement area is obtained by a method including the following steps: sensing a pressure in a measurement area by the pressure-sensitive chip; generating a capacitance signal by the pressure-sensitive chip; converting the capacitance signal to a voltage signal by the signal processing module; and converting the voltage signal into the pressure signal by the display instrument.

Abstract: A thin film capacitor includes a first electrode layer (10), a dielectric layer (20) stacked on the first electrode layer (10), and a second electrode layer (30) stacked on the dielectric layer (20), wherein the dielectric layer (20) includes a layered void aggregation region (22) which extends in a direction orthogonal to a stacking direction.

Abstract: An evaluation method for an electronic device provided with an insulating film between a pair of electrode layers includes preparing a sample that has a tunnel barrier insulating film as the insulating film; irradiating the sample with electron beams from a plurality of angles to acquire a plurality of images; and performing image processing using the plurality of images to reconstruct a stereoscopic image and generate a cross-sectional image of the sample from the stereoscopic image.

Abstract: An inductor includes first and second external electrodes spaced apart from each other, a substrate disposed between the first and second external electrodes and having a first surface and a second surface opposing each other, and a conductive structure electrically connected to the first and second external electrodes. The conductive structure includes a first conductive pattern disposed on the first surface of the substrate, a second conductive pattern disposed on the second surface of the substrate, and at least one reinforcing portion. The first conductive pattern has a first side facing the first external electrode, the second conductive pattern has a second side facing the second external electrode, and the at least one reinforcing portion is electrically connected to at least one of the first and second sides and is interposed between the substrate and at least one of the first and second external electrodes.

Abstract: A multi-layered ceramic electronic component includes: a ceramic body including a dielectric layer, and a plurality of internal electrodes facing each other with the dielectric layer interposed therebetween; and an external electrode disposed on an external surface of the ceramic body and electrically connected to the first internal electrodes or the second internal electrodes. The external electrode includes a first electrode layer electrically connected to the internal electrodes and a second electrode layer disposed on the first electrode layer, and a ratio (t1/BW) of a thickness (t1) of a region of the first electrode layer disposed on the third surface or the fourth surface of the ceramic body to a distance (BW) from one end of the first electrode layer to the other end of the first electrode layer disposed on the first surface or the second surface of the ceramic body satisfies 20% or less.

Abstract: A multi-layer ceramic electronic component includes a ceramic body including: a multi-layer unit including a capacitance forming unit including ceramic layers laminated in a first direction and internal electrodes disposed therebetween, a side surface facing in a second direction orthogonal to the first direction, an end surface facing in a third direction orthogonal to the above directions, a drawn portion extending from the capacitance forming unit in the third direction, the internal electrodes being drawn to the end surface, and a cover that covers the capacitance forming unit and the drawn portion in the first direction; and a side margin that covers the side surface. The drawn portion includes a first region and a second region disposed between the cover and the first region, an end portion of each internal electrode in the second region being positioned inward in the second direction relative to that in the first region.

Abstract: A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and having first and second surfaces opposing each other, third and fourth surfaces connecting the first and second surfaces to each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other; a plurality of internal electrodes disposed in the ceramic body, exposed to the first and second surfaces, and having one ends exposed to the third or fourth surface; and a first side margin portion and a second side margin portion disposed, respectively, on side portions of the internal electrodes exposed to the first and second surfaces. A thickness of each of the first and second side margin portions is 10 ?m or more and less than 45 ?m.

Abstract: A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and having first and second surfaces opposing each other, third and fourth surfaces connecting the first and second surfaces to each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other; a plurality of internal electrodes disposed in the ceramic body, exposed to the first and second surfaces, and having one ends exposed to the third or fourth surface; and a first side margin portion and a second side margin portion disposed, respectively, on side portions of the internal electrodes exposed to the first and second surfaces. A thickness of each of the first and second side margin portions is 10 ?m or more and less than 45 ?m.

Abstract: A composite electronic component includes: a composite body including a multilayer ceramic capacitor coupled to a ceramic chip, the multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with each of the dielectric layers interposed therebetween are stacked and first and second external electrodes disposed on opposite end portions of the first ceramic body in a length direction, respectively, and the ceramic chip including a second ceramic body including ceramic and first and second terminal electrodes, wherein a ratio of a length of the ceramic chip to a length of the multilayer ceramic capacitor is 0.7 to 1.0, and a ratio of a sum of a length of the first terminal electrode and a length of the second terminal electrode to the length of the ceramic chip is 0.3 to 0.6.

Abstract: The present invention is directed to a multilayer ceramic capacitor comprising a first external terminal disposed along a first end, a second external terminal disposed along a second end that is opposite the first end, and an active electrode region containing alternating dielectric layers and active electrode layers. At least one of the electrode layers comprises a first electrode and a second electrode. The first electrode is electrically connected with the first external terminal and has a first electrode arm comprising a main portion and a step portion. The main portion has a lateral edge extending from the first end of the multilayer capacitor and the step portion has a lateral edge offset from the lateral edge of the main portion. The second electrode is electrically connected with the second external terminal.

Abstract: A multi-layer ceramic electronic component includes a multi-layer unit and a side margin. The multi-layer unit includes ceramic layers laminated in a first direction, internal electrodes disposed between the ceramic layers, a main surface that faces in the first direction, and a side surface that faces in a second direction orthogonal to the first direction, the internal electrodes being exposed from the side surface. The side margin includes a side-surface-covering portion that is disposed on the side surface, and an end portion that extends from the side-surface-covering portion to an upper side of the main surface, the end portion having a lower porosity than a porosity of the side-surface-covering portion, the end portion being rounded.

Abstract: A multilayer ceramic electronic component includes: a ceramic body having a dielectric layer, and a plurality of first and second internal electrodes facing each other with the dielectric layer interposed therebetween; and first and second external electrodes disposed on an outer surface of the ceramic body, respectively. The ceramic body includes an active portion including a plurality of internal electrodes facing each other with the dielectric layer interposed therebetween to form capacitance, and cover portions formed on upper and lower portions of the active portion. A buffer region is disposed between at least one pair of first and second internal electrodes among the plurality of first and second internal electrodes disposed inside the active portion, and satisfies the relation 0<tb<150 ?m+td, where td is a thickness of the dielectric layer, and tb is a thickness of the buffer region.

Abstract: An element body of a rectangular parallelepiped shape includes a first principal surface arranged to constitute a mounting surface, a second principal surface opposing the first principal surface in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction. An external electrode is disposed on the element body. The external electrode includes a conductive resin layer. The conductive resin layer continuously covers one part of the first principal surface, one part of the end surface, and one part of each of the pair of side surfaces. A length of the conductive resin layer in the first direction is smaller than a length of the conductive resin layer in the third direction.

Abstract: A multilayer ceramic electronic component includes a laminated body, and first and second external electrodes respectively provided on first and second end surfaces of the laminated body. The laminated body includes an inner layer portion in which the first and second internal electrode layers oppose each other with the dielectric ceramic layers interposed therebetween, and outer layer portions sandwiching the inner layer portion in the lamination direction and a side margin portion sandwiching the inner layer portion and the outer layer portions in the width direction. The side margin portion is defined by ceramic layers laminated in the width direction, and includes, as the ceramic layers, an inner layer on an innermost side of the laminated body and an outer layer on an outermost side of the laminated body.

Abstract: A ceramic electronic device includes: a multilayer structure having a parallelepiped shape in which each of dielectric layers and each of internal electrode layers are alternately stacked and are alternately exposed to two end faces; and a cover layer provided on at least one of an upper face and a lower face of the multilayer structure, a main component of the cover sheet being same as the main component of the plurality of dielectric layers, wherein tensile stress remains along a first direction on a surface of the cover layer, wherein the first direction is a direction in which the two end faces face with each other, wherein the tensile stress on a center side in a second direction is larger than the tensile stress on the two side faces side, wherein the second direction is a direction in which the two side faces face with each other.

Abstract: A method for manufacturing a multilayer ceramic capacitor includes: producing a plurality of dielectric green sheets; producing therefrom a plurality of internal electrode-printed green sheets; producing therefrom a plurality of individually cut unsintered laminates by stacking some of the plurality of dielectric green sheets, as cover layers, and the plurality of internal electrode-printed green sheets together; producing therefrom element body precursors by applying a ceramic paste to side faces of the unsintered laminates for forming side margins thereon, wherein an application thickness of the ceramic paste is adjusted in a manner such that a thickness of the side margins is greater than a thickness of the cover layers in the final product; producing therefrom element bodies by sintering; and forming external electrodes on at least one of principal faces and on both end faces of the element bodies.

Abstract: A multilayer capacitor includes a capacitor body including an active region having a plurality of dielectric layers and a plurality of first and second internal electrodes, and upper and lower cover layers, the capacitor body having first to six surfaces, one ends of the plurality of first and second internal electrodes being exposed through the third and fourth surfaces, respectively; first and second external electrodes; and a plurality of dummy electrodes disposed on each of the plurality of dielectric layers in the active region, to be exposed through corners of the dielectric layers. Each of the plurality of dummy electrodes has a width of 60% or less of a distance between the first internal electrode and the fourth surface or a distance between the second internal electrode and the third surface, the width being in a direction from the third surface to the fourth surface.

Abstract: A chip electronic component includes spacers that each have a predetermined thickness direction dimension on a mounting surface in a direction perpendicular to the mounting surface. The spacers each contain, as a main component, an intermetallic compound containing at least one high-melting-point metal selected from Cu and Ni, and Sn defining a low-melting-point metal.

Abstract: An element body of a rectangular parallelepiped shape includes a first principal surface arranged to constitute a mounting surface, a second principal surface opposing the first principal surface in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction. An external electrode is disposed on the element body. The external electrode includes a conductive resin layer. The conductive resin layer continuously covers one part of the first principal surface, one part of the end surface, and one part of each of the pair of side surfaces. A length of the conductive resin layer in the third direction is smaller than a length of the conductive resin layer in the first direction.

Abstract: A multilayer ceramic electronic component includes: a ceramic body and first and second external electrodes on external surfaces of the ceramic body. The ceramic body includes first and second internal electrodes facing each other with dielectric layers interposed therebetween. The ceramic body includes an active portion in which capacitance is formed and cover portions on upper and lower surfaces of the active portion, respectively. The ratio of the thickness of the first and second external electrodes to the thickness of the cover portion is proportional to the inverse of the cube root of the ratio of the Young's Modulus of each of the first and second external electrodes to the Young's modulus of the cover portion.

Abstract: A multilayer ceramic capacitor is disclosed including a first external terminal disposed along a first end of the capacitor, a second external terminal disposed along a second end of the capacitor opposite the first end, an active electrode region containing alternating dielectric layers and active electrode layers, and a shield electrode region including at least two shield electrodes that are spaced apart by a shield layer gap in the longitudinal direction. The distance from the active electrode region to the shield electrode region may range from about 4% to about 20% of a thickness of the capacitor between a top surface and a bottom surface opposing the top surface. The shield layer gap may range from about 3% to about 60% of an external terminal gap between the first external terminal and second external terminal in the longitudinal direction on at least one of the top or bottom surfaces.

Abstract: A multilayer ceramic capacitor includes a ceramic body including a dielectric layer, a first surface and a second surface opposing each other, a third surface and a fourth surface connecting the first surface and the second surface, respectively; internal electrodes disposed inside the ceramic body and exposed to the first and second surfaces, and having one ends exposed to the third surface or the fourth surface; a first side margin portion and a second side margin portion disposed on sides of the internal electrodes exposed to the first and second surfaces; and adhesive layers disposed between the first surface of the ceramic body and the first side margin portion and between the first surface of the ceramic body and the second side margin portion, respectively. An average thickness of each of the first and second side margin portions is 2 ?m or more and 10 ?m or less.

Abstract: A capacitor component includes a body including dielectric layers and internal electrodes alternately arranged with the dielectric layers; and external electrodes including electrode layers disposed on the body and connected to the internal electrodes, first conductive resin layers disposed on the electrode layers, and second conductive resin layers disposed on the first conductive resin layers, wherein the first and second conductive resin layers include a metal powder and a base resin, the first conductive resin layers have a lower metal powder content than the second conductive resin layers, the metal powder includes one or more of flake-type powder particle and spherical-type powder particle, and a weight ratio of the flake-type powder particle in the metal powder contained in the first conductive resin layers is 60% or more, and a weight ratio of the spherical-type powder particle in the metal powder contained in the second conductive resin layers is 50% or more.

Abstract: A multi-layer ceramic capacitor includes a multi-layer unit and a side margin. The multi-layer unit includes ceramic layers laminated in a first direction, internal electrodes disposed between the ceramic layers, a main surface oriented in the first direction, a surface layer portion in a range from the main surface to a predetermined depth, and a center portion adjacent to the surface layer portion in the first direction. The side margin covers the multi-layer unit from a second direction orthogonal to the first direction. The ceramic layers have an average dimension in the first direction that is 0.4 ?m or less. Each of the internal electrodes includes an oxidized region adjacent to the side margin. The oxidized region in the surface layer portion has a dimension in the second direction that is equal to or more than two times the average dimension of the ceramic layers in the first direction.

Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and a plurality of internal electrodes disposed to face each other with each of the dielectric layers interposed therebetween; and external electrodes disposed on external surfaces of the ceramic body and electrically connected to the internal electrodes, respectively, wherein the external electrode includes an electrode layer electrically connected to the internal electrodes and a conductive resin layer disposed on the electrode layer, and a sum of thicknesses of the electrode layer and the conductive resin layer in a cross section of the ceramic body in the first and second directions is 12 ?m or more.

Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and first and second internal electrodes; and first and second external electrodes, wherein the first and second external electrodes include first and second base electrode layers being at least partially in contact with the first and second external surfaces of the ceramic body, first and second nickel plating layers disposed to cover the first and second base electrode layers, and first and second tin plating layers disposed to cover the first and second nickel plating layers, respectively, and wherein a thickness of a center portion of each of the first and second tin plating layers exceeds 5 ?m.

Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and a plurality of internal electrodes disposed to face each other with each of the dielectric layers interposed therebetween; and external electrodes disposed on external surfaces of the ceramic body and electrically connected to the internal electrodes, respectively, wherein the external electrode includes an electrode layer electrically connected to the internal electrodes and a conductive resin layer disposed on the electrode layer, and a sum of thicknesses of the electrode layer and the conductive resin layer in a cross section of the ceramic body in the first and second directions is 12 ?m or more.

Abstract: The present invention provides a substrate assembly includes at least two ceramic layers, at least two layers of one or more electrodes, at least one high dielectric constant layer, two or more holes, electrically conductive structures formed in the two or more holes, and the electrically conductive structure is physically connected to at least one of the electrodes, thereby forming a set, wherein each of the sets if physically separated from at least one of the other sets. A process includes cutting ceramic sheets, removing material from the ceramic sheets to form holes, depositing a metallic material into the holes, depositing the metallic material to form electrodes, selectively depositing a thin layer of high dielectric constant material, and firing the ceramic sheets, the metallic material, the high dielectric constant material layer, and the electrodes.

Abstract: An electronic component includes a capacitor array including a plurality of multilayer capacitors disposed in a vertical direction, among the multilayer capacitors, adjacent multilayer capacitors including opposing external electrodes, including band portions bonded to each other, the external electrodes being disposed in such a manner that a band portion disposed on a bonding surface has an area relatively larger than an area of a band portion disposed on a further surface, and a pair of metal frames, each including a vertical portion bonded to a head portion of an external electrode of a lowermost multilayer capacitor and a mounting portion bent at a lower end of the vertical portion to extend.

Abstract: A multilayer ceramic capacitor includes a multilayer body which includes stacked dielectric layers, first and second principal surfaces facing each other, first and second end surfaces facing each other, first inner electrode layers alternately stacked with the dielectric layers and exposed on the first end surface, second inner electrode layers alternately stacked with the dielectric layers and exposed on the second end surface, a first outer electrode connected to the first inner electrode layers and disposed on the first end surface, and a second outer electrode connected to the second inner electrode layers and disposed on the second end surface.

Abstract: A multilayer capacitor includes a body including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately exposed to opposing surfaces of the body in a length direction with respective dielectric layers interposed therebetween, and first and second external electrodes disposed at opposing ends of the body in the length direction and connected to the first and second internal electrodes, respectively. The plurality of first and second internal electrodes include nickel (Ni) and antimony (Sb) or germanium (Ge).

Abstract: A multilayer capacitor includes a capacitor body including an active region, and upper and lower cover regions disposed on upper and lower portions of the active region, respectively. First and second external electrode are disposed on both ends of the capacitor body, respectively. The active region includes a plurality of first dielectric layers, first and second internal electrodes alternately disposed with the first dielectric layer interposed therebetween, and first and second auxiliary electrodes disposed on the first dielectric layers on which the first and second internal electrodes are disposed, respectively. The upper and lower cover regions each include a plurality of second dielectric layers having a thickness less than that of each of the first dielectric layers, and a dummy electrode disposed on the second dielectric layers.

Abstract: A capacitor component includes a body including a dielectric layer, and a first internal electrode and a second internal electrode opposing each other in a first direction of the body with the dielectric layer interposed therebetween, and having first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction of the body, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction of the body, and first and second external electrodes disposed in the body and connected to the first and second internal electrodes, respectively. The body has edges having a rounded shape.

Abstract: A multilayer ceramic capacitor includes a laminated body, and an external electrode on both end surfaces of the laminated body. The external electrode includes a base electrode layer, a conductive resin layer on the base electrode layer, and a plating layer on the conductive resin layer. The amount of a curvature radius along a boundary portion between the base electrode layer and the conductive resin layer the boundary between the base electrode layer and the conductive resin layer at the ridge line of the laminated body is about 296.6 ?m or more, the long side length in terms of flattened powder value is about 10.3 ?m or more, the solid content concentration of PVC in the conductive resin layer is about 45 vol % or higher and about 60 vol % or lower, and the thickness of the conductive resin layer located at the ridge line is about 11.7 ?m or more.

Abstract: In an embodiment, a multilayer ceramic capacitor 10 has supplementary dielectric layers 11d, each having a first cover part 11d1 that covers the space between two first base conductor films 11c on each of both height-direction faces, and second cover parts 11d2 that connect to the first cover part 11d1 and also cover parts of the first base conductor films 11c, respectively, in the length direction. External electrodes 12, 13 each have a second base conductor film 12a, 13a attached to a one length-direction face and to one length-direction edges of two first base conductor films 11c on the respective height-direction faces, and a surface conductor film 12b, 13b attached continuously to the surface of the second base conductor film 12a, 13a and also to the parts of the surfaces of the two first base conductor films 11c not covered by the second cover parts 11d2.

Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and a plurality of internal electrodes disposed to face each other with each of the dielectric layers interposed therebetween; and external electrodes disposed on external surfaces of the ceramic body and electrically connected to the internal electrodes, respectively, in which the external electrode each include an electrode layer electrically connected to the internal electrodes and a plating layer disposed on the electrode layer, and a thickness of the electrode layer in a cross section of the ceramic body in first and second directions is 10 ?m or more.

Abstract: A ceramic electronic device includes multiple chip components and a pair of metal terminal portions. The chip components consist of a pair of chip end surfaces and four chip side surfaces. Terminal electrodes are formed on the pair of chip end surfaces. The pair of metal terminal portions is arranged correspondingly with the pair of chip end surfaces. Each of the pair of metal terminal portions includes an electrode face portion, multiple pairs of engagement arm portions, and a mount portion. The electrode face portion faces the chip end surface. The multiple pairs of engagement arm portions extend from the electrode face portion toward the chip side surface and sandwich and hold the chip components. The mount portion extends from one of terminal second sides toward the chip components and is partially substantially vertical to the electrode face portion.

Abstract: An electronic device includes a chip component and a metal terminal. The chip component includes a terminal electrode formed on an element body. The metal terminal is connectable with the terminal electrode of the chip component. The metal terminal includes a terminal body and a pair of holding pieces. The terminal body faces an end surface of the terminal electrode of the chip component. The pair of holding pieces is formed on the terminal body. One of the pair of holding pieces is formed at one end of the terminal body. An adjustment portion is formed in a boundary region between the holding piece and the end of the terminal body.

Abstract: A multilayer ceramic electronic part includes a body portion including an internal electrode and a dielectric layer, a first electrode layer disposed on at least one surface of the body portion and electrically connected to the internal electrode, and a conductive resin layer disposed on the first electrode layer and including a first conductivity-type metal particle, a second conductivity-type metal, and a base resin. The second conductivity-type metal has a melting point lower than a curing temperature of the base resin.

Abstract: An electronic component includes: a capacitor body; first and second external electrodes disposed on a mounting surface of the capacitor body to be spaced apart from each other; and first and second connection terminals including an insulator, electrically connected to the first and second external electrodes, respectively, through land patterns each disposed on upper and lower surfaces thereof and electrically connected to each other, and having first and second bridge portions protruding so as to face each other in the length direction of the capacitor body, respectively.

Abstract: A multilayer ceramic capacitor includes a ceramic body including an active portion including dielectric layers and internal electrodes that are alternately stacked and a margin portion disposed on outer surfaces of the active portion; and external electrodes disposed on outer surfaces of the ceramic body. The margin portion includes an inner half adjacent to the active portion and an outer half adjacent to the edge of the ceramic body, and a porosity of the inner half is greater than a porosity of the outer half.