Abstract: A capacitor component includes a body including a dielectric layer and internal electrode layers, with the dielectric layer interposed therebetween; and an external electrode disposed on the body and connected to the internal electrode layers. Each of the internal electrode layers has a capacitance formation portion disposed to overlap an adjacent internal electrode layer, and a lead-out portion extending from the capacitance formation portion and connected to the external electrode. A ratio (H2/H1) of a height difference H2 to a height difference H1 is 0.2 or less, where the height difference H2 is a height difference between the capacitance formation portion and the lead-out portion of a lowermost internal electrode layer the height difference H1 is a height difference between the capacitance formation portion and the lead-out portion of an uppermost internal electrode layer. An average thickness of the dielectric layer is 420 nm or less.

Abstract: An electronic component includes: a multilayer capacitor including a capacitor body and a pair of external electrodes, respectively disposed on external surfaces of the capacitor body in a first direction; and an interposer disposed below the multilayer capacitor and including an interposer body, a pair of via holes penetrating through the interposer body, and a pair of via electrodes, respectively disposed in the via holes to be connected to the pair of external electrodes, respectively. 0.24T?t?0.3T, where “T” is a maximum height of the multilayer capacitor and “t” is a maximum height of the interposer.

Abstract: A ceramic electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of dielectric grains, and at least one of the plurality of dielectric grains has a core-dual shell structure having a core and a dual shell. The dual shell includes a first shell surrounding at least a portion of the core, and a second shell surrounding at least a portion of the first shell, and a concentration of a rare earth element included in the second shell is more than 1.3 times to less than 3.8 times a concentration of a rare earth element included in the first shell.

Abstract: A multilayer electronic component has a body and a non-conductive resin layer. The non-conductive resin layer includes a body cover portion disposed in a region of an external surface of the body in which an electrode layer of an external electrode is not disposed, and an extending portion extending from the body cover portion between the electrode layer and a conductive resin layer of the external electrode, to thereby suppress arc discharge, improve bending strength, and improve moisture resistance.

Abstract: Provided is a coil component and a method of manufacturing the coil component less prone to aggregation of metal fillers contained in an external electrode. The coil component includes: a base body; a conductor wound around a coil axis; and an external electrode provided on a surface of the base body and electrically connected to an end portion of the conductor, wherein the external electrode includes an electrode layer containing a plurality of first fillers, a plurality of second fillers, and a resin, wherein at least a part of the plurality of second fillers is bonded by metallic bond to at least adjacent one of the plurality of first fillers and/or at least adjacent one of the others of the plurality of second fillers, and wherein each of the plurality of second fillers has a flat shape.

Abstract: A multilayer ceramic electronic component includes a multilayer body and an external electrode on each of both end surfaces of the multilayer body. The external electrode includes an underlying electrode layer and a plating layer that is disposed on the underlying electrode layer. The underlying electrode layer includes Ni as a first metal component, Sn as a second metal component, and a ceramic material, and includes an alloy portion that is provided around the ceramic material and includes an alloyed Ni defining the first metal component and an alloyed Sn defining the second metal component.

Abstract: Prismatic polymer monolithic capacitor structure that includes multiple interleaving radiation-cured polymer dielectric layers and metal layers. Method for fabrication of same. The chemical composition of polymer dielectric and the electrode resistivity parameters are chosen to maximize the capacitor self-healing properties and energy density, and to assure the stability of the capacitance and dissipation factor over the operating temperature range. The termination electrode that extends beyond the active capacitor area and beyond the polymer dielectric layers has a thickness larger than that used industrially to provide resistance to thermomechanical stress. The glass transition temperature of the polymer dielectric is specifically chosen to avoid mechanical relaxation from occurring in the operating temperature range, which prevents high moisture permeation (otherwise increasing a dissipation factor and electrode corrosion) into the structure.

Abstract: A ceramic electronic device includes a multilayer chip in which a dielectric layer and an internal electrode layer are alternately stacked. Concentration peaks of two or more types of metals different from a main component metal of the internal electrode layer exist at different positions in a stacking direction of the dielectric layer and the internal electrode layer, between the dielectric layer and the internal electrode layer.

Abstract: A multilayer electronic component includes: a body including a dielectric layer and a plurality of internal electrodes alternately disposed with the dielectric layer; and external electrodes disposed on the body, wherein the external electrodes respectively include an electrode layer disposed on the body and connected to the plurality of internal electrodes and a conductive resin layer disposed on the electrode layer and including a first conductive particle, a second conductive particle, and a resin, wherein the first conductive particle is a Cu particle, the second conductive particle is a Cu particle having a surface on which Ag is disposed.

Abstract: A multilayer ceramic electronic component includes a multilayer body including stacked ceramic layers, internal conductive layers stacked on the ceramic layers, first and second main surfaces opposing each other in a height direction, first and second side surfaces opposing each other in a width direction perpendicular or substantially perpendicular to the height direction, and first and second end surfaces opposing each other in a length direction perpendicular or substantially perpendicular to the height direction and the width direction, and external electrodes connected to the internal conductive layers. The internal conductive layers include holes having a different area equivalent diameter. When an area equivalent diameter in which a cumulative value in a cumulative distribution of area equivalent diameters of the holes in each of the internal conductive layers becomes about 99% is defined as an area equivalent diameter D99, the area equivalent diameter D99 is about 8.0 ?m or less.

Abstract: A multilayer electronic component, in which the external electrode may be thinned to secure capacitance per unit volume, while securing the external electrode at a corner in a specific thickness or higher with improved reliability for moisture resistance.

Abstract: A multilayer ceramic capacitor includes a ceramic body including a dielectric layer, a first internal electrode and a second internal electrode, disposed to oppose each other with the dielectric layer interposed therebetween, and a first external electrode and a second external electrode. The ceramic body further includes first and second margin portions and first and second cover portions, disposed on upper and lower surfaces of a capacitance formation portion and the first and second margin portions, respectively. The first and second cover portions each include a first cover layer adjacent to an internal electrode, disposed on an outermost side among the first and second internal electrodes, and a second cover layer disposed on the first cover layer, and an interface at which the first cover layer and the second cover layer are in contact with each other.

Abstract: A ceramic electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of grains and grain boundaries disposed between adjacent grains. The grain boundary includes a secondary phase including Sn, a rare-earth element, and a first subcomponent. The rare-earth element includes at least one of Y, Dy, Ho, Er, Gd, Ce, Nd, Sm, Tb, Tm, La, Gd and Yb. The first subcomponent includes at least one of Si, Mg, and Al.

Abstract: A multilayer ceramic capacitor includes a first internal electrode, a second internal electrode, a first dielectric layer, and a second dielectric layer. The first internal electrode includes a first outer peripheral portion and a first inner electrode portion inside the first outer peripheral portion. The second internal electrode includes a second outer peripheral portion and a second inner electrode portion inside the second outer peripheral portion. The first dielectric layer includes a first high dielectric constant portion, and a first inner dielectric layer portion inside the first high dielectric constant portion. The second dielectric layer include a second high dielectric constant portion and a second inner dielectric layer portion inside the second high dielectric constant portion.

Abstract: A method of manufacturing an electronic component includes preparing an unfired multilayer body including first and second main surfaces facing each other in a stacking direction, first and second side surfaces facing each other in a width direction, and first and second end surfaces facing each other in a length direction, bonding one main surface of the unfired multilayer body to an elongated first adhesive sheet, conveying the first adhesive sheet in a first direction in which the first adhesive sheet approaches an elongated second adhesive sheet, and bonding one side surface of the unfired multilayer body to the second adhesive sheet, conveying the second adhesive sheet in a second direction different from the first direction to peel off the unfired multilayer body from the first adhesive sheet, polishing another side surface of the unfired multilayer body, and forming a first insulating layer on the polished another side surface.

Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, a first external electrode disposed on the body and connected to the first internal electrode, and a second external electrode disposed on the body and connected to the second internal electrode. The dielectric layer includes a first dielectric layer adjacent to the first internal electrode, a second dielectric layer adjacent to the second internal electrode, and a third dielectric layer disposed between the first and second dielectric layers. D1<D3 and D2<D3, in which D1 is an average particle size of dielectric grains included in the first dielectric layer, D2 is an average particle size of dielectric grains included in the second dielectric layer, and D3 is an average particle size of dielectric grains included in the third dielectric layer.

Abstract: A multilayer electronic component includes a silicon (Si) organic compound layer having a body cover portion disposed in a region, in which electrode layers are not disposed, of external surfaces of a body, and an extending portion disposed to extend from the body cover portion between an electrode layer and a conductive resin layer of an external electrode, and thus, may improve bending strength and humidity resistance reliability.

Abstract: A multilayer ceramic capacitor includes a multilayer body, a first internal electrode layer extending to opposing end surfaces of the multilayer body, a second internal electrode layer extending to opposing side surfaces of the multilayer body, first and second external electrodes connected to the first internal electrode layer and provided on the opposing end surfaces, and third and fourth external electrodes connected to the second internal electrode layer and provided on the opposing side surfaces. The second internal electrode layer includes a central section in a central portion of the dielectric layer and an extending section extending to the opposing side surfaces. The first internal electrode layer is larger in number than the second internal electrode layer, at least two first internal electrode layers are successively layered, and the extending section is larger in thickness than the central section located in the central portion of the dielectric layer.

Abstract: A multilayer ceramic capacitor includes a multilayer body, a first outer electrode on a first main surface closer to a first end surface, a second outer electrode on the first main surface closer to a second end surface, a third outer electrode on the first main surface between the first outer electrode and the second outer electrode, a first inner electrode layer connected to the first outer electrode and the second outer electrode via a first lead electrode and a second lead electrode, and a second inner electrode layer connected to the third outer electrode via a third lead electrode. When a length of the first lead electrode and a length of the second lead electrode in the length direction are each denoted by a, and a length of the third lead electrode in the length direction is denoted by b, b/a is about 0.5 to about 0.83.

Abstract: A multi-layered ceramic electronic component has a ceramic body including dielectric layers and a plurality of internal electrodes opposing each other with the dielectric layers interposed therebetween. External electrodes are disposed on an exterior of the ceramic body and are electrically connected to the internal electrodes. Each external electrode includes an electrode layer electrically connected to internal electrodes, and a conductive resin layer arranged on the electrode layer. The conductive resin layer extends to first and second surface of the ceramic body, and a ratio of a thickness (Tb) of the conductive resin layer extending onto the first surface and the second surface of the ceramic body to a length (Lm) of a length direction margin portion of the ceramic body satisfies 2 to 29%.

Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and first and second internal electrodes alternately laminated with the dielectric layer interposed therebetween; a first external electrode connected to a first internal electrode; and a second external electrode connected to a second internal electrode, wherein the first external electrode includes a first base electrode layer disposed on the ceramic body and a first resin electrode layer disposed on the first base electrode layer, wherein the second external electrode includes a second base electrode layer disposed on the ceramic body and a second resin electrode layer disposed on the second base electrode layer, and wherein the first resin electrode layer and the second resin electrode layer include a shape memory polymer (e.g., a thermosetting shape memory polymer) or a polymer having properties including a property that exhibits shape memory effect.

Abstract: A multilayer ceramic electronic component includes: a ceramic body having a capacitance formation portion, and including a dielectric layer and a first internal electrode and a second internal electrode with the dielectric layer interposed therebetween, a first margin portion disposed on the surface of the capacitance formation portion, and a second margin portion disposed on the other surface of the capacitance formation portion; a first external electrode; and a second external electrode. A following formula 1 is satisfied, [formula 1]?0.1?(Tm?Ta)/Ta, where in the formula 1, Tm is an average height of a central region of the margin portion, and Ta is an average height of an outer region of the capacitance formation portion in a second direction.

Abstract: A film capacitor that includes a capacitor element including one or more wound or laminated metallized films, each metallized film including a resin film and a metal layer on a surface of the resin film; an outer case that houses the capacitor element; and a filling resin that fills a space between the capacitor element and the outer case, wherein the outer case is made of a resin composition containing a liquid crystal polymer and an inorganic filler.

Abstract: A multilayer ceramic capacitor includes an interposer including, on a side in a length direction, a first through conductive portion that penetrates the interposer in a stacking direction, and provides electrical conduction between a first joining electrode and a first mounting electrode. The interposer includes, on the other side in the length direction, a second through conductive portion that penetrates the interposer in the stacking direction, and provides electrical conduction between a second joining electrode and a second mounting electrode. The first mounting electrode includes a first portion that covers a portion of a first interposer end surface on the one side in the length direction of the interposer. The second mounting electrode includes a second portion that covers a portion of a second interposer end surface on the other side in the length direction of the interposer.

Abstract: A multilayer ceramic capacitor includes a multilayer body including the dielectric ceramic layers and the internal electrode layers which are laminated, and external electrodes connected to the internal electrode layers. The multilayer body includes segregation including Si as a main component in a vicinity of an end of the internal electrode layer in a width direction. An average particle size of the dielectric particles in the vicinity of the end of the internal electrode layer in the width direction in the dielectric ceramic layer is smaller than an average particle size of a dielectric particles in a central portion of the internal electrode layer in the width direction in the dielectric ceramic layer.

Abstract: A multilayer ceramic electronic component includes a ceramic body; and first and second external electrodes disposed on the ceramic body, wherein the first and second external electrodes include first and second conductive layers disposed on corners of the ceramic body, and first and second base electrodes covering the first and second conductive layers, respectively, and wherein a ratio, A1/A2, of an area, A1, of the first conductive layer disposed on the fifth surface or the second conductive layer disposed on the sixth surface of the ceramic body to an area, A2, of a cross-sectional surface of the ceramic body taken in the second direction and the first direction is in a range of 0.1 to 0.3.

Abstract: A ceramic electronic device includes a multilayer chip having dielectric layers and internal electrode layers and having a first main face and a second main face that have a rectangular shape in a planar view, external electrodes each of which extends from the first main face to the second main face at each of two diagonal corners of the rectangular shape, the external electrodes being spaced from each other, each of the external electrodes being connected to a part of the internal electrode layers, and a conductor that is provided on the first main face, the second main face or both of the first main face and the second main face, is spaced from the external electrodes, and is provided in a region which includes an intersection point of perpendicular bisectors of two adjacent sides of the rectangular shape.

Abstract: A multilayer ceramic capacitor includes a capacitor main body including a multilayer body including dielectric layers and internal electrode layers alternately laminated therein, and external electrodes each at one of two end surfaces of the multilayer body and connected to the internal electrode layers, and two interposers on a surface in a lamination direction of the capacitor main body, and opposed and spaced apart from each other in a length direction connecting the two end surfaces. The two interposers each include a first recess portion on an end surface of the interposer opposed to an end surface facing the other interposer, in an area around a middle portion of the interposer in a width direction, and second recess portions on both sides in the width direction of the first recess portion, and each having a thickness of about ±10% of a half of a thickness of the interposer.

Abstract: A multilayer ceramic electronic component includes a multilayer capacitor including a capacitor body, and first and second external electrodes disposed on both side surfaces of the capacitor body, respectively; first and second metal frames disposed on both side surfaces and upper and lower surfaces of the multilayer capacitor; and an exterior insulating portion disposed to surround upper surfaces of the multilayer capacitor and the first and second metal frames. A shortest distance from an upper end of the exterior insulating portion to the external electrodes is defined as G1, a shortest distance from a lower end of the exterior insulating portion to the external electrodes is defined as G2, a maximum distance from upper ends of the external electrodes to lower ends is defined as T, and G1, G2, and T satisfy G1?G2?T/2.

Abstract: A semiconductor device comprises a wiring substrate and a semiconductor chip. In the wiring substrate, a plurality of micro-elements each comprised of a stacked structure including a power supply pattern and a ground pattern is arranged at a predetermined interval. In each of the plurality of micro-elements, the power supply pattern is formed in a wiring layer located one layer above or one layer below a wiring layer in which the ground pattern is formed. A power supply potential is to be supplied to the power supply patter, and a ground potential is to be supplied to the ground patter.

Abstract: A varistor is provided having a rectangular configuration defining first and second opposing end surfaces offset in a lengthwise direction. The varistor may include a first terminal adjacent the first opposing end surface and a second terminal adjacent the second opposing end surface. The varistor may include an active electrode layer including a first electrode electrically connected with the first terminal and a second electrode electrically connected with the second terminal. The first electrode may be spaced apart from the second electrode in the lengthwise direction to form an active electrode end gap. The varistor may include a floating electrode layer including a floating electrode. The floating electrode layer may be spaced apart from the active electrode layer in a height-wise direction to form a floating electrode gap. A ratio of the active electrode end gap to the floating electrode gap may be greater than about 2.

Abstract: Provided are a multilayer capacitor and a board for mounting the same. The multilayer capacitor includes a capacitor body including a plurality of dielectric layers and a plurality of internal electrodes and a pair of external electrodes respectively including a conductive layer disposed on opposing ends of the capacitor, a conductive resin layer covering the conductive layer, and a reduced graphene oxide (RGO) layer disposed between the conductive layer and the conductive resin layer.

Abstract: Micro-scale devices, such as transformers and capacitors, having a floating conductive layer are disclosed. A floating conductive layer may be disposed in an insulator layer and can reduce a maximum electric field between a first planar conductor and a second planar conductor of a micro-scale passive device. Reduction of a maximum electric field between a first planar conductor and a second planar conductor can reduce undesirable effects on electrical components.

Abstract: A power storage device, containing two electrodes, and a plate-like crystal structure smectite-based clay film between the electrodes.

Abstract: A multilayer ceramic capacitor includes a multilayer body and two external electrodes. The multilayer body includes a multilayer main body including an inner layer portion including dielectric layers and internal electrode layers alternately stacked, and outer layer portions on opposite sides of the inner layer portion in a stacking direction, two side gap portions on opposite sides in a width direction, main surfaces on opposite sides in the stacking direction, side surfaces on opposite sides in the width direction, and end surfaces respectively provided on opposite sides in a length direction. The two external electrodes are provided at the end surfaces, each including a foundation electrode layer in contact with the multilayer body, and a conductive resin layer on the foundation electrode layer. An end region of the internal electrode layers in contact with the foundation electrode layer is thicker than other regions of the internal electrode layers.

Abstract: A multilayer ceramic electronic component includes a ceramic body including pluralities of first and second internal electrodes alternately disposed to face each other with respective dielectric layers interposed therebetween. First and second external electrodes are disposed on external surfaces of the ceramic body and are respectively electrically connected to the first and second external electrodes. A first dummy electrode is disposed in a margin portion of the ceramic body adjacent the first internal electrode in a third direction, and a second dummy electrode is disposed in a margin portion of the ceramic body adjacent the second internal electrode in the third direction. A distance (Ld) between the first and second dummy electrodes in a second direction, and a length (Lm) of each margin portion between one of the first and second internal electrodes and an external surface of the ceramic body in the second direction, satisfy Ld?Lm.

Abstract: A ceramic electronic component includes a multilayer chip having a substantially rectangular parallelepiped shape and including a first multilayer structure and a second multilayer structure disposed on each of top and bottom faces of the first multilayer structure, the first multilayer structure including first ceramic dielectric layers having a first width in a first direction in which side faces of the multilayer chip are opposite to each other, the second multilayer structure including second internal electrode layers having a second width less than the first width in the first direction, and a pair of external electrodes formed from the respective two edge faces to at least one of side faces of the multilayer chip, wherein main components of the first and second internal electrode layers differ from a main component of the external electrodes.

Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and a plurality of internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween, and an external electrode formed outside the ceramic body. The external electrode includes an electrode layer, and a thickness T1 of the electrode layer corresponding to a central region of the ceramic body in a thickness direction is 5 ?m or more and 30 ?m or less, a thickness T2 of the electrode layer corresponding to a region in which an outermost internal electrode is located is 5 ?m or more and 15 ?m or less, and a thickness T3 of the electrode layer corresponding to a corner portion of the ceramic body is 0.1 ?m or more and 10 ?m or less.

Abstract: A Dielectric Energy Storage System (DESS), a Dielectric Energy Storage System Management System (DESS-MS), and method that stores energy for a wide variety of applications.

Abstract: A multilayer ceramic capacitor includes a multilayer body and two external electrodes. The multilayer body includes a multilayer main body including an inner layer portion including dielectric layers and internal electrode layers alternately stacked, and outer layer portions on opposite sides of the inner layer portion in a stacking direction, two side gap portions on opposite sides in a width direction, main surfaces on opposite sides in the stacking direction, side surfaces on opposite sides in the width direction, and end surfaces respectively provided on opposite sides in a length direction. The two external electrodes are provided at the end surfaces, each including a foundation electrode layer in contact with the multilayer body, and a conductive resin layer on the foundation electrode layer. An end region of the internal electrode layers in contact with the foundation electrode layer is thicker than other regions of the internal electrode layers.

Abstract: A ceramic electronic component includes a multilayer chip including a multilayer structure, which includes ceramic dielectric layers and internal electrode layers that are alternately stacked, and cover layers respectively disposed on top and bottom faces of the multilayer structure in a first direction in which the dielectric layers and the internal electrode layers are alternately stacked, wherein each of the cover layers includes a relatively high porous section and a first relatively less porous section having a pore ratio less than a pore ratio of the relatively high porous section, the relatively high porous section laterally spreading and spanning an entire length of the cover layer in a second direction orthogonal to the first direction, the pore ratio of the relatively high porous section being 1% or greater, the first relatively less porous section being interposed between the relatively high porous section and the multilayer structure.

Abstract: A dielectric substance includes a core-shell grain having a twin crystal structure. An interface of the twin crystal structure of the core-shell grain extends from a shell on one side, passes through a core, and extends to the shell on the other side.

Abstract: A multilayer capacitor includes a capacitor body including an active region having dielectric layers and internal electrodes alternately stacked therein, the capacitor body including upper and lower covers disposed on upper and lower surfaces of the active region, respectively; and an external electrode disposed on an external surface of the capacitor body. In one of the upper and lower covers, a portion thereof between a boundary surface of the active region and a boundary surface of the capacitor body is divided into a first cover region adjacent to the active region and a second cover region adjacent to the boundary surface of the capacitor body, and the first cover region includes grains having a core-shell structure doped with Sn. The first cover region includes 20% or more of Sn-doped core-shell structure grains, compared to the total of grains in the first cover region.

Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers, first inner electrodes, and second inner electrodes stacked on one another, a first outer electrode electrically connected to the first inner electrodes, and a second outer electrode electrically connected to the second inner electrodes. The multilayer body includes first and second side surfaces respectively including first and second recesses where a midsection of each of the first and second side surfaces in a length direction is recessed inward in a width direction. When the multilayer ceramic capacitor is viewed in a stacking direction, a dimension of each of the first and second recesses in the length direction is smaller on an inner side than on an outer side in the width direction.

Abstract: An inductor component comprising a laminated body having a magnetic layer containing a resin and a metal magnetic powder contained in the resin; an inductor wiring disposed in the laminated body; and an external terminal exposed from the laminated body. The external terminal includes a metal part and a resin part, and in a cross section of the external terminal, the resin part is enclosed in the metal part.

Abstract: A multilayer capacitor includes a capacitor body including first to sixth surface, and including a plurality of dielectric layers, and first and second internal electrodes; and first and second external electrodes. The first and second internal electrodes include first and second capacitance forming portion, first and second lead-out portion extending from the first and second capacitance forming portion toward the third surface of the capacitor body and connected to the first and second external electrode, and first and second dot pattern portion formed in at least one corner of the first and second capacitance forming portion. The first dot pattern portion and the second dot pattern portion have dot patterns not overlapping each other in the first direction.

Abstract: A multilayer ceramic capacitor includes: a laminate including dielectric layers and internal electrode layers; and external electrodes on the main surfaces of the laminate. The laminate further includes a first via conductor, a second via conductor, a third via conductor, and a fourth via conductor that connect the internal electrode layers and the external electrodes. The external electrodes include first external electrodes, second external electrodes, third external electrodes, and fourth external electrodes, each connected to the respective end surfaces of the via conductor. Each of the external electrodes does not extend to the side surfaces of the laminate. A ratio W/L of a dimension W in the width direction of the multilayer ceramic capacitor to a dimension L in the length direction of the multilayer ceramic capacitor is about 0.85 or more and about 1 or less. The dimension L in the length direction of the multilayer ceramic capacitor is about 750 ?m or smaller.

Abstract: An electronic component and a board having the same mounted thereon are provided. The electronic component includes an electronic component including a capacitor array in which a plurality of multilayer capacitors including a capacitor body and a pair of external electrodes, respectively disposed on both end portions of the capacitor body in a first direction, are stacked in a second direction, perpendicular to the first direction, and a length of a multilayer capacitor, disposed on a lower end in the second direction, in the first direction is less than a length of another multilayer capacitor in the first direction; and a pair of metal frames, respectively disposed to be connected to the pair of external electrodes of the multilayer capacitor disposed on the lower end.

Abstract: An electronic component includes: an ESD discharge member including a substrate having first and second surfaces opposing each other, first and second through-holes penetrating through the substrate, and first and second conductors; and a multilayer capacitor disposed on the first surface of the substrate, in which the multilayer capacitor may include: a capacitor body; and first and second external electrodes disposed outside the capacitor body and connected to the first and second conductors, respectively, and the first and second conductors may include first and second via electrodes coated on inner walls of the first and second through-holes, respectively.

Abstract: A ceramic electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of dielectric grains, and at least one of the plurality of dielectric grains has a core-dual shell structure having a core and a dual shell. The dual shell includes a first shell surrounding at least a portion of the core, and a second shell surrounding at least a portion of the first shell, and a concentration of a rare earth element included in the second shell is more than 1.3 times to less than 3.8 times a concentration of a rare earth element included in the first shell.