Abstract: Each of a plurality of internal electrodes is electrically connected to a corresponding external electrode of a plurality of external electrodes. A plurality of auxiliary internal electrodes are disposed in the same layer as the plurality of internal electrodes to be located between each of a pair of side surfaces and the plurality of internal electrodes. Each of the plurality of external electrodes includes a pair of side surface electrode portions disposed on the pair of side surfaces and including a conductive resin layer. Each of the plurality of auxiliary internal electrodes is electrically connected to the external electrode to which the internal electrode located in the same layer is not electrically connected, and is located between the conductive resin layer to which the internal electrode located in the same layer is not electrically connected and the internal electrode located in the same layer.

Abstract: Provided is a coil component less prone to aggregation of metal fillers contained in an external electrode. The coil component includes: a base body; a conductor wound around a coil axis; and an external electrode provided on a surface of the base body and electrically connected to an end portion of the conductor, wherein the external electrode includes an electrode layer containing a plurality of first fillers, a plurality of second fillers, and a resin. Each of the plurality of second fillers has a flat shape. One end of each of said at least one of the plurality of second fillers is in direct contact with and bonded by metallic bond to said at least adjacent one of the plurality of first fillers and/or said at least adjacent one of the plurality of second fillers.

Abstract: A ceramic electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of grains and grain boundaries disposed between adjacent grains. The grain boundary includes a secondary phase including Sn, a rare-earth element, and a first subcomponent. The rare-earth element includes at least one of Y, Dy, Ho, Er, Gd, Ce, Nd, Sm, Tb, Tm, La, Gd and Yb. The first subcomponent includes at least one of Si, Mg, and Al.

Abstract: The present disclosure relates to a dielectric composite-based power reduction device. The power reduction device of the present disclosure is a dielectric composite-based power reduction device capable of high-efficiency power reduction via parallel connection to an input power supply. The power reduction is achieved by reactive power reduction based on a capacitor bank principle, a harmonic wave reduction by inductance, and an increase in active power efficiency. Disclosed are a composite electrode structure capable of achieving all of those, and an improvement in a performance based on a development of the composite.

Abstract: A multilayer ceramic capacitor includes a capacitor main body, and two interposers on both sides in a length direction of a surface of the capacitor main body. When a distance between a side surface of one interposer on one side in the length direction, and a side surface of the capacitor main body is defined as X1, a distance between another side surface of the one interposer, and another side surface of the capacitor main body is defined as X4, a distance between a side surface of another interposer on another side in the length direction, and the side surface of the capacitor main body is defined as X2, and a distance between another side surface of the other interposer on the other side in the length direction, and the other side surface of the capacitor main body is defined as X3; X2>X3 and X1>X4 are satisfied.

Abstract: A multilayer ceramic electronic component includes: a ceramic body including a dielectric layer having a main component represented by (Ba1-xCax)(Ti1-y (Zr, Hf)y)O3 (where, 0?x?1, 0?y?0.5), and including first and second internal electrodes alternately stacked with the dielectric layer interposed therebetween; a first external electrode connected to the first internal electrode; and a second external electrode connected to the second internal electrode, wherein at least one of the dielectric layer and the internal electrode includes Sn or Dy. If Sn, an average content of Sn at an interface between the dielectric layer and the internal electrode is within a range of 5 at % or more and 20 at % or less. If Dy, an average content of Dy at an interface between the dielectric layer and the internal electrode is within a range of 1 at % or more and 5 at % or less.

Abstract: A multilayer electronic component includes: a body including a capacitance forming portion in which dielectric layers and internal electrodes are alternately disposed in a first direction, and cover portions disposed on an upper surface and a lower surface of the capacitance forming portion, respectively, in the first direction; and external electrodes disposed on the body, wherein the cover portion includes a plurality of dielectric grains and a plurality of pores, and Gn/Pn is more than 10 and less than 30, in which Gn is the number of dielectric grains included in the cover portion and Pn is the number of pores included in the cover portion.

Abstract: A multilayer ceramic capacitor includes a laminate and an external electrode connected to the internal electrode layer. The laminate includes a central layer portion in which an internal electrode layer and a dielectric ceramic layer are alternately laminated, and a covering portion covering an outer surface of the central layer portion in the lamination direction and the width direction. A region where the main surface meets the lateral surface in the laminate is defined as a corner portion that is rounded, and a distance from the corner portion to an internal electrode closest to the corner portion is about 20 ?m or less.

Abstract: A multilayer ceramic electronic component includes a multilayer body and an external electrode on each of both end surfaces of the multilayer body. The external electrode includes an underlying electrode layer and a plating layer that is disposed on the underlying electrode layer. The underlying electrode layer includes Ni as a first metal component, Sn as a second metal component, and a ceramic material, and includes an alloy portion that is provided around the ceramic material and includes an alloyed Ni defining the first metal component and an alloyed Sn defining the second metal component.

Abstract: A multilayer ceramic capacitor includes a stacked body and external electrodes. The stacked body includes stacked dielectric layers and internal electrodes. The external electrodes are disposed on lateral surfaces of the stacked body and are connected to the internal electrodes. A ratio of min to max is not less than about 36% and not more than about 90%, where A1, A2, A3, and A4 respectively denote the surface areas of first, second, third, and fourth external electrodes that are located on the first or second main surface of the stacked body.

Abstract: A film capacitor that includes a capacitor element including one or more wound or laminated metallized films, each metallized film including a dielectric resin film and a metal layer on one surface of the dielectric resin film; a cover covering an outer surface of the capacitor element in a direction in which layers of the dielectric resin film are laminated with the metal layer therebetween; and an exterior body covering an outer periphery of the capacitor element and an outer surface of the cover. In a first aspect, the dielectric resin film contains a curable resin as a main component thereof, and the cover is made of a thermoplastic resin.

Abstract: A multilayer ceramic capacitor includes a capacitor main body including a multilayer body including dielectric layers and internal electrode layers alternately laminated therein, and external electrodes each at one of two end surfaces of the multilayer body and connected to the internal electrode layers, and two interposers on a surface in a lamination direction of the capacitor main body, and opposed and spaced apart from each other in a length direction connecting the two end surfaces. The two interposers each include a first recess portion on an end surface of the interposer opposed to an end surface facing the other interposer, in an area around a middle portion of the interposer in a width direction, and second recess portions on both sides in the width direction of the first recess portion, and each having a thickness of about ±10% of a half of a thickness of the interposer.

Abstract: A multilayer ceramic electronic component includes a ceramic body including a capacitance formation portion including a dielectric layer and first and second internal electrodes with the dielectric layer interposed therebetween; and first and second external electrodes disposed on the first and second surfaces of the ceramic body, respectively, and including first and second base electrodes connected to the first and second internal electrodes and first and second conductive layers disposed to cover the first and second base electrodes. When a thickness of the first and second conductive layers in a central portion of the first and second surfaces of the ceramic body is ‘a’, and a thickness of the first and second conductive layers at an end of the capacitance formation portion is ‘b’, ‘b/a’ is 0.07 or more.

Abstract: A multilayer electronic component includes a body including a plurality of dielectric layers, a side margin portion disposed on the body, and external electrodes disposed on the body. The body includes an active portion having internal electrodes alternately arranged with the dielectric layer interposed therebetween in the first direction and a cover portion disposed on both end surfaces of the active portion in a first direction, the active portion. The cover portion, and the side margin portion include molybdenum (Mo). A Mo content in an interfacial portion, a region of the active portion, adjacent to one of the cover portion or the side margin portion, is higher than a Mo content in a central portion of the active portion. A Mo content in the one of the cover portion and the side margin portion is higher than the Mo content in the interfacial portion.

Abstract: A multilayer capacitor includes a body including a laminate structure in which at least one first internal electrode and at least one second internal electrode are alternately stacked in a first direction with at least one dielectric layer therebetween, and first and second external electrodes spaced apart on the body, to be connected to at least one first internal electrode and at least one second internal electrode, respectively. The body includes, in a larger molar content, at least one selected from the group consisting of Dy, Tb, Y, Sm, Ho, Gd, Er, Ce, La and Nd in a capacitance formation region including a region between at least one first internal electrode and at least one second internal electrode than in a margin region including a region between a boundary line of at least one first internal electrode and at least one second internal electrode and a surface of the body.

Abstract: A multilayer ceramic capacitor includes a multilayer body including the dielectric ceramic layers and the internal electrode layers which are laminated, and external electrodes connected to the internal electrode layers. The multilayer body includes segregation including Si as a main component in a vicinity of an end of the internal electrode layer in a width direction. An average particle size of the dielectric particles in the vicinity of the end of the internal electrode layer in the width direction in the dielectric ceramic layer is smaller than an average particle size of a dielectric particles in a central portion of the internal electrode layer in the width direction in the dielectric ceramic layer.

Abstract: In a multilayer ceramic capacitor, when a dimension in a length direction between a first end surface and a second end surface of a multilayer body is defined as l, a dimension in a width direction between a first lateral surface and a second lateral surface of the multilayer body is defined as w, and a dimension in a height direction between a first main surface and a second main surface of the multilayer body is defined as t, a dimensional relationship of w>l>t is satisfied, and a fourth surface portion and a fifth surface portion of the first external electrode, and a ninth surface portion and a tenth surface portion of the second external electrode each include an opening portion at which a surface of the multilayer body is exposed.

Abstract: A multilayer electronic component includes a body having a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween. The body has a hexahedral shape. A first external electrode includes a first connection portion disposed on a third surface, and first and third band portions extending from the first connection portion respectively onto a portion of a first and a second surface. A second external electrode includes a second connection portion disposed on a fourth surface, and second and fourth band portions extending from the second connection portion respectively onto a portion of the first and second surfaces. An insulating layer including an oxide containing hafnium is disposed on the first and second connection portions and covers the second surface and the third and fourth band portions. First and second plating layers are disposed respectively on the first and second band portions.

Abstract: A multilayer capacitor includes a body including a dielectric layer and a plurality of internal electrodes stacked on each other interposing the dielectric layer therebetween, and external electrodes disposed externally on the body, respectively including a first layer connected to the internal electrode and a second layer covering the first layer, wherein the first layer includes a metal particle including an element A and a Z-A-O phase formed in the metal particle, and here, the element Z is an alkali metal.

Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers laminated alternately on each other, and external electrode layers provided on opposing end surfaces of the multilayer body in a length direction orthogonal or substantially orthogonal to a lamination direction, and each connected with the internal electrode layers, in which the dielectric layers each include at least one of Ca, Zr, or Ti, the internal electrode layers each include Cu, and when a dimension in the lamination direction of the multilayer body is defined as T0, a dimension in the length direction of the multilayer body is defined as L0, and a dimension in a width direction orthogonal or substantially orthogonal to the lamination direction and the length direction is defined as W0, a relationship of L0<W0<T0 is satisfied.

Abstract: A dielectric nanolayer capacitor comprises a nanoscale dielectric layer between a cathode layer and an anode layer. When exposed to a high electric field of at least about 0.5 GV/m at a temperature of about 200 K or less, the nanoscale dielectric layer includes an amount of trapped charge sufficient to form a Coulomb barrier for suppressing leakage current. A method of charging a dielectric nanolayer capacitor includes cooling a nanolayer capacitor comprising a nanoscale dielectric layer between a cathode layer and an anode layer to a temperature of about 200 K or less, and applying a high electric field of at least about 0.5 GV/m to the nanolayer capacitor to inject electrons into the nanoscale dielectric layer. While the nanolayer capacitor remains cooled to the temperature, the electrons are trapped in the nanoscale dielectric layer and form a Coulomb barrier to suppress leakage current.

Abstract: One aspect of the present invention is a multilayer ceramic capacitor including a plurality of dielectric layers composed of a dielectric ceramic containing grains whose main component is barium titanate having a core-shell structure made up of a core part and a shell part, and grains whose main component is calcium titanate having a core-shell structure made up of a core part and a shell part; and a plurality of internal electrodes stacked alternately with each of the plurality of dielectric layers.

Abstract: A multilayer electronic component includes a body including a plurality of dielectric layers, and a capacitance formation portion including first and second internal electrodes alternately disposed in a third direction with the dielectric layer interposed therebetween, the body including first and second surfaces opposing in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing in the third direction, external electrodes disposed on the body, and a dummy electrode disposed to penetrate through the capacitance formation portion in the third direction.

Abstract: A multilayer ceramic capacitor includes a multilayer body, and two external electrodes. The multilayer body includes a multilayer body main portion including an inner layer portion including dielectric layers and internal electrode layers that are stacked, and two outer layer portions on opposite sides of the inner layer portion in a stacking direction, two side gap portions on opposite sides of the multilayer main body in a width direction, two main surfaces on opposite sides in the stacking direction, two side surfaces on opposite sides in the width direction, and two end surfaces on opposite sides in a length direction. Each of the two external electrodes are at an end surface of the multilayer body, and extend from the end surface to a portion of the main surface. An end of the side gap portion on a side of the main surface protrudes farther than the multilayer main body.

Abstract: A multilayer ceramic electronic component includes a multilayer body and external electrodes provided on opposing end surfaces of the multilayer body. Each external electrode includes an underlying electrode layer including metal components and ceramic components, and plating layers on the underlying electrode layer. A metal of the plating layer on the underlying electrode layer diffuses into the underlying electrode layer, and exists at an interface where the metal components included in the underlying electrode layer are in contact with each other and an interface where the metal component and the ceramic component included in the underlying electrode layer are in contact with each other.

Abstract: There are provided an electronic component and a board including the same. The electronic component includes: a capacitor body; a pair of external electrodes respectively disposed on both ends of the capacitor body; and a pair of metal frames including a pair of connection portions connected to the pair of external electrodes, respectively, and a pair of mounting portions connected to the pair of connection portions, respectively. A bottom surface of one of the pair of mounting portions has roughness.

Abstract: In a multilayer capacitor, when a distance between a surface of a first external electrode at an apex position of the first external electrode and a curved surface is defined as Ht, and a distance between the apex position and an apex position of the main surface in a facing direction of the pair of main surfaces is defined as Y, 0<Y<Ht is satisfied for each of the pair of first external electrodes at least on the curved surface side, and a distance between a surface of the second external electrode at an apex position of the second external electrode and the main surface is defined as Hs, Ht>Hs is satisfied for each of the pair of second external electrodes on both sides of the pair of main surfaces.

Abstract: An electronic component includes a main body including first and second end surfaces opposed to each other in a length direction, first and second side surfaces opposed to each other in a width direction, and first and second main surfaces opposed to each other in a thickness direction and that has a rectangular substantially rectangular parallelepiped shape, a first outer electrode provided at a first end side in the length direction of the main body, and a second outer electrode provided a second end side in the length direction of the main body. Each of the first and second outer electrodes includes first through fourth protrusions.

Abstract: A multilayer ceramic electronic component includes a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer in a first direction; and an external electrode disposed on the body and connected to the internal electrode, wherein the internal electrode includes a plurality of Ni crystal grains, and a composite layer including Ni and In is provided at a grain boundary of each of the plurality of Ni crystal grains.

Abstract: A low inductance component may include a multilayer, monolithic device including a first active termination, a second active termination, at least one ground termination, and a pair of capacitors connected in series between the first active termination and the second active termination. The lead(s) may be coupled with the first active termination, second active termination, and/or the at least one ground termination. The lead(s) may have respective length(s) and maximum width(s). A ratio of the length(s) to the respective maximum width(s) of the lead(s) may be less than about 20.

Abstract: A multilayer capacitor includes a body including a stack structure in which a plurality of dielectric layers are stacked and a plurality of internal electrodes stacked with respective dielectric layers interposed therebetween, external electrodes disposed on external surfaces of the body and connected to the internal electrodes, and an insulating layer covering a surface of the body. One of the external electrodes includes a metal layer connected to the insulating layer, and the insulating layer includes an oxide of a metal component of the metal layer.

Abstract: A multilayer ceramic electronic component includes: a ceramic body and first and second external electrodes on external surfaces of the ceramic body. The ceramic body includes first and second internal electrodes facing each other with dielectric layers interposed therebetween. The ceramic body includes an active portion in which capacitance is formed and cover portions on upper and lower surfaces of the active portion, respectively. The ratio of the thickness of the first and second external electrodes to the thickness of the cover portion is proportional to the inverse of the cube root of the ratio of the Young's Modulus of each of the first and second external electrodes to the Young's modulus of the cover portion.

Abstract: A ceramic electronic device includes: a multilayer structure; and a cover layer, wherein a concentration of Mn of the cover layer with respect to a main component ceramic is larger than a concentration of Mn of the dielectric layers with respect to a main component ceramic in a capacity section, wherein an average crystal grain diameter of a first dielectric layer is smaller than that of a second dielectric layer, and a concentration of Mn of the first dielectric layer with respect to the main component ceramic is larger than a concentration of Mn of the second dielectric layer with respect to the main component ceramic, in the capacity section.

Abstract: A multilayer capacitor includes a body including a plurality of dielectric layers and a plurality of internal electrodes laminated in a first direction, and external electrodes. The body includes an active portion, in which the plurality of internal electrodes are disposed to form capacitance, corresponding to a region between internal electrodes disposed on an outermost side in the first direction, among the plurality of internal electrodes, a cover portion covering the active portion in the first direction, and a side margin portion covering the active portion in a second direction, perpendicular to the first direction, and 1.49<A1/A2<2.50 where A1 is an average grain size of the dielectric layer in a central region of the active portion, and A2 is an average grain size of the dielectric layer in an active-cover boundary portion, adjacent to the cover portion, of the active portion.

Abstract: A multilayer ceramic capacitor includes a capacitor main body, and two interposers on both sides in a length direction of a surface of the capacitor main body. When a distance between a side surface of one interposer on one side in the length direction, and a side surface of the capacitor main body is defined as X1, a distance between another side surface of the one interposer, and another side surface of the capacitor main body is defined as X4, a distance between a side surface of another interposer on another side in the length direction, and the side surface of the capacitor main body is defined as X2, and a distance between another side surface of the other interposer on the other side in the length direction, and the other side surface of the capacitor main body is defined as X3; X2>X3 and X1>X4 are satisfied.

Abstract: A ceramic electronic component includes an element body having a first inner electrode exposed at a first end face of the element body, and a second inner electrode exposed at a second end face of the element body. The ceramic electronic component also includes a first outer electrode formed on the first end face and its neighboring faces of the element body. The first outer electrode includes two side portions and a middle portion on each of top and bottom faces of the element body such that the middle portion extends inwardly towards a center of the element body more than the two side portions from the first end face. The ceramic electronic component also includes a second outer electrode having the same dimensions as the first outer electrode on the second end face and its neighboring faces of the element body.

Abstract: A ceramic electronic device includes an element body and an external electrode. The element body includes a ceramic layer and an internal electrode layer. The external electrode is formed on an end surface of the element body and electrically connected to a part of the internal electrode layer. The ceramic layer includes a perovskite compound represented by ABO3 as a main component. The external electrode includes a baked electrode layer having a first region and a second region. The first region is contacted with the end surface of the element body and located near a joint boundary with the element body. The second region is located outside the first region and constitutes an outer surface of the baked electrode layer. The first region includes a glass frit including at least B and Si. The second region includes an Al based oxide mainly including Al.

Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers alternately laminated therein, first and second main surfaces opposing each other in a lamination direction, first and second end surfaces opposing each other in a length direction which intersects the lamination direction, and first and second side surfaces opposing each other in a width direction which intersects the lamination direction and the length direction, and external electrodes on the first and second end surfaces, and each electrically connected to the internal electrode layers, wherein the multilayer body includes a slit in at least one of the first side surface, the second side surface, and the second main surface defining and functioning as a board-mounting surface.

Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric ceramic layers and internal electrode layers laminated alternately in a lamination direction, and a pair of external electrodes on both end portions in the length direction of the multilayer body and respectively connected to the internal electrode layers. The pair of external electrodes each include a base region covering at least each of the first and second end surfaces and connected to the internal electrode layers, and a cover region on the base region to cover the base region. The cover region includes maximum thickness portions each including a maximum thickness in the cover region, in a region corresponding to the ranges of about ±10 ?m in the lamination direction centered around internal electrode layers at both outermost ends in the lamination direction among the internal electrode layers.

Abstract: An electronic component includes: a multilayer capacitor including a capacitor body and a pair of external electrodes, respectively disposed on external surfaces of the capacitor body in a first direction; and an interposer disposed below the multilayer capacitor and including an interposer body, a pair of via holes penetrating through the interposer body, and a pair of via electrodes, respectively disposed in the via holes to be connected to the pair of external electrodes, respectively. 0.24T?t?0.3T, where “T” is a maximum height of the multilayer capacitor and “t” is a maximum height of the interposer.

Abstract: A capacitor component includes a body including a dielectric layer and internal electrode layers, with the dielectric layer interposed therebetween; and an external electrode disposed on the body and connected to the internal electrode layers. Each of the internal electrode layers has a capacitance formation portion disposed to overlap an adjacent internal electrode layer, and a lead-out portion extending from the capacitance formation portion and connected to the external electrode. A ratio (H2/H1) of a height difference H2 to a height difference H1 is 0.2 or less, where the height difference H2 is a height difference between the capacitance formation portion and the lead-out portion of a lowermost internal electrode layer the height difference H1 is a height difference between the capacitance formation portion and the lead-out portion of an uppermost internal electrode layer. An average thickness of the dielectric layer is 420 nm or less.

Abstract: A ceramic electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of dielectric grains, and at least one of the plurality of dielectric grains has a core-dual shell structure having a core and a dual shell. The dual shell includes a first shell surrounding at least a portion of the core, and a second shell surrounding at least a portion of the first shell, and a concentration of a rare earth element included in the second shell is more than 1.3 times to less than 3.8 times a concentration of a rare earth element included in the first shell.

Abstract: A multilayer electronic component has a body and a non-conductive resin layer. The non-conductive resin layer includes a body cover portion disposed in a region of an external surface of the body in which an electrode layer of an external electrode is not disposed, and an extending portion extending from the body cover portion between the electrode layer and a conductive resin layer of the external electrode, to thereby suppress arc discharge, improve bending strength, and improve moisture resistance.

Abstract: Provided is a coil component and a method of manufacturing the coil component less prone to aggregation of metal fillers contained in an external electrode. The coil component includes: a base body; a conductor wound around a coil axis; and an external electrode provided on a surface of the base body and electrically connected to an end portion of the conductor, wherein the external electrode includes an electrode layer containing a plurality of first fillers, a plurality of second fillers, and a resin, wherein at least a part of the plurality of second fillers is bonded by metallic bond to at least adjacent one of the plurality of first fillers and/or at least adjacent one of the others of the plurality of second fillers, and wherein each of the plurality of second fillers has a flat shape.

Abstract: A multilayer electronic component includes: a body including a dielectric layer and a plurality of internal electrodes alternately disposed with the dielectric layer; and external electrodes disposed on the body, wherein the external electrodes respectively include an electrode layer disposed on the body and connected to the plurality of internal electrodes and a conductive resin layer disposed on the electrode layer and including a first conductive particle, a second conductive particle, and a resin, wherein the first conductive particle is a Cu particle, the second conductive particle is a Cu particle having a surface on which Ag is disposed.

Abstract: A ceramic electronic device includes a multilayer chip in which a dielectric layer and an internal electrode layer are alternately stacked. Concentration peaks of two or more types of metals different from a main component metal of the internal electrode layer exist at different positions in a stacking direction of the dielectric layer and the internal electrode layer, between the dielectric layer and the internal electrode layer.

Abstract: Prismatic polymer monolithic capacitor structure that includes multiple interleaving radiation-cured polymer dielectric layers and metal layers. Method for fabrication of same. The chemical composition of polymer dielectric and the electrode resistivity parameters are chosen to maximize the capacitor self-healing properties and energy density, and to assure the stability of the capacitance and dissipation factor over the operating temperature range. The termination electrode that extends beyond the active capacitor area and beyond the polymer dielectric layers has a thickness larger than that used industrially to provide resistance to thermomechanical stress. The glass transition temperature of the polymer dielectric is specifically chosen to avoid mechanical relaxation from occurring in the operating temperature range, which prevents high moisture permeation (otherwise increasing a dissipation factor and electrode corrosion) into the structure.

Abstract: A multilayer ceramic electronic component includes a multilayer body and an external electrode on each of both end surfaces of the multilayer body. The external electrode includes an underlying electrode layer and a plating layer that is disposed on the underlying electrode layer. The underlying electrode layer includes Ni as a first metal component, Sn as a second metal component, and a ceramic material, and includes an alloy portion that is provided around the ceramic material and includes an alloyed Ni defining the first metal component and an alloyed Sn defining the second metal component.

Abstract: A multilayer ceramic electronic component includes a multilayer body including stacked ceramic layers, internal conductive layers stacked on the ceramic layers, first and second main surfaces opposing each other in a height direction, first and second side surfaces opposing each other in a width direction perpendicular or substantially perpendicular to the height direction, and first and second end surfaces opposing each other in a length direction perpendicular or substantially perpendicular to the height direction and the width direction, and external electrodes connected to the internal conductive layers. The internal conductive layers include holes having a different area equivalent diameter. When an area equivalent diameter in which a cumulative value in a cumulative distribution of area equivalent diameters of the holes in each of the internal conductive layers becomes about 99% is defined as an area equivalent diameter D99, the area equivalent diameter D99 is about 8.0 ?m or less.

Abstract: A multilayer electronic component, in which the external electrode may be thinned to secure capacitance per unit volume, while securing the external electrode at a corner in a specific thickness or higher with improved reliability for moisture resistance.