Abstract: A multilayer ceramic capacitor includes a multilayer body including the dielectric ceramic layers and the internal electrode layers which are laminated, and external electrodes connected to the internal electrode layers. The multilayer body includes segregation including Si as a main component in a vicinity of an end of the internal electrode layer in a width direction. An average particle size of the dielectric particles in the vicinity of the end of the internal electrode layer in the width direction in the dielectric ceramic layer is smaller than an average particle size of a dielectric particles in a central portion of the internal electrode layer in the width direction in the dielectric ceramic layer.

Abstract: In a multilayer ceramic capacitor, when a dimension in a length direction between a first end surface and a second end surface of a multilayer body is defined as l, a dimension in a width direction between a first lateral surface and a second lateral surface of the multilayer body is defined as w, and a dimension in a height direction between a first main surface and a second main surface of the multilayer body is defined as t, a dimensional relationship of w>l>t is satisfied, and a fourth surface portion and a fifth surface portion of the first external electrode, and a ninth surface portion and a tenth surface portion of the second external electrode each include an opening portion at which a surface of the multilayer body is exposed.

Abstract: A multilayer electronic component includes a body having a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween. The body has a hexahedral shape. A first external electrode includes a first connection portion disposed on a third surface, and first and third band portions extending from the first connection portion respectively onto a portion of a first and a second surface. A second external electrode includes a second connection portion disposed on a fourth surface, and second and fourth band portions extending from the second connection portion respectively onto a portion of the first and second surfaces. An insulating layer including an oxide containing hafnium is disposed on the first and second connection portions and covers the second surface and the third and fourth band portions. First and second plating layers are disposed respectively on the first and second band portions.

Abstract: A multilayer capacitor includes a body including a dielectric layer and a plurality of internal electrodes stacked on each other interposing the dielectric layer therebetween, and external electrodes disposed externally on the body, respectively including a first layer connected to the internal electrode and a second layer covering the first layer, wherein the first layer includes a metal particle including an element A and a Z-A-O phase formed in the metal particle, and here, the element Z is an alkali metal.

Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers laminated alternately on each other, and external electrode layers provided on opposing end surfaces of the multilayer body in a length direction orthogonal or substantially orthogonal to a lamination direction, and each connected with the internal electrode layers, in which the dielectric layers each include at least one of Ca, Zr, or Ti, the internal electrode layers each include Cu, and when a dimension in the lamination direction of the multilayer body is defined as T0, a dimension in the length direction of the multilayer body is defined as L0, and a dimension in a width direction orthogonal or substantially orthogonal to the lamination direction and the length direction is defined as W0, a relationship of L0<W0<T0 is satisfied.

Abstract: A dielectric nanolayer capacitor comprises a nanoscale dielectric layer between a cathode layer and an anode layer. When exposed to a high electric field of at least about 0.5 GV/m at a temperature of about 200 K or less, the nanoscale dielectric layer includes an amount of trapped charge sufficient to form a Coulomb barrier for suppressing leakage current. A method of charging a dielectric nanolayer capacitor includes cooling a nanolayer capacitor comprising a nanoscale dielectric layer between a cathode layer and an anode layer to a temperature of about 200 K or less, and applying a high electric field of at least about 0.5 GV/m to the nanolayer capacitor to inject electrons into the nanoscale dielectric layer. While the nanolayer capacitor remains cooled to the temperature, the electrons are trapped in the nanoscale dielectric layer and form a Coulomb barrier to suppress leakage current.

Abstract: A multilayer electronic component includes a body including a plurality of dielectric layers, and a capacitance formation portion including first and second internal electrodes alternately disposed in a third direction with the dielectric layer interposed therebetween, the body including first and second surfaces opposing in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing in the third direction, external electrodes disposed on the body, and a dummy electrode disposed to penetrate through the capacitance formation portion in the third direction.

Abstract: One aspect of the present invention is a multilayer ceramic capacitor including a plurality of dielectric layers composed of a dielectric ceramic containing grains whose main component is barium titanate having a core-shell structure made up of a core part and a shell part, and grains whose main component is calcium titanate having a core-shell structure made up of a core part and a shell part; and a plurality of internal electrodes stacked alternately with each of the plurality of dielectric layers.

Abstract: A multilayer ceramic capacitor includes a multilayer body, and two external electrodes. The multilayer body includes a multilayer body main portion including an inner layer portion including dielectric layers and internal electrode layers that are stacked, and two outer layer portions on opposite sides of the inner layer portion in a stacking direction, two side gap portions on opposite sides of the multilayer main body in a width direction, two main surfaces on opposite sides in the stacking direction, two side surfaces on opposite sides in the width direction, and two end surfaces on opposite sides in a length direction. Each of the two external electrodes are at an end surface of the multilayer body, and extend from the end surface to a portion of the main surface. An end of the side gap portion on a side of the main surface protrudes farther than the multilayer main body.

Abstract: A multilayer ceramic electronic component includes a multilayer body and external electrodes provided on opposing end surfaces of the multilayer body. Each external electrode includes an underlying electrode layer including metal components and ceramic components, and plating layers on the underlying electrode layer. A metal of the plating layer on the underlying electrode layer diffuses into the underlying electrode layer, and exists at an interface where the metal components included in the underlying electrode layer are in contact with each other and an interface where the metal component and the ceramic component included in the underlying electrode layer are in contact with each other.

Abstract: In a multilayer capacitor, when a distance between a surface of a first external electrode at an apex position of the first external electrode and a curved surface is defined as Ht, and a distance between the apex position and an apex position of the main surface in a facing direction of the pair of main surfaces is defined as Y, 0<Y<Ht is satisfied for each of the pair of first external electrodes at least on the curved surface side, and a distance between a surface of the second external electrode at an apex position of the second external electrode and the main surface is defined as Hs, Ht>Hs is satisfied for each of the pair of second external electrodes on both sides of the pair of main surfaces.

Abstract: There are provided an electronic component and a board including the same. The electronic component includes: a capacitor body; a pair of external electrodes respectively disposed on both ends of the capacitor body; and a pair of metal frames including a pair of connection portions connected to the pair of external electrodes, respectively, and a pair of mounting portions connected to the pair of connection portions, respectively. A bottom surface of one of the pair of mounting portions has roughness.

Abstract: An electronic component includes a main body including first and second end surfaces opposed to each other in a length direction, first and second side surfaces opposed to each other in a width direction, and first and second main surfaces opposed to each other in a thickness direction and that has a rectangular substantially rectangular parallelepiped shape, a first outer electrode provided at a first end side in the length direction of the main body, and a second outer electrode provided a second end side in the length direction of the main body. Each of the first and second outer electrodes includes first through fourth protrusions.

Abstract: A multilayer ceramic electronic component includes a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer in a first direction; and an external electrode disposed on the body and connected to the internal electrode, wherein the internal electrode includes a plurality of Ni crystal grains, and a composite layer including Ni and In is provided at a grain boundary of each of the plurality of Ni crystal grains.

Abstract: A low inductance component may include a multilayer, monolithic device including a first active termination, a second active termination, at least one ground termination, and a pair of capacitors connected in series between the first active termination and the second active termination. The lead(s) may be coupled with the first active termination, second active termination, and/or the at least one ground termination. The lead(s) may have respective length(s) and maximum width(s). A ratio of the length(s) to the respective maximum width(s) of the lead(s) may be less than about 20.

Abstract: A multilayer capacitor includes a body including a stack structure in which a plurality of dielectric layers are stacked and a plurality of internal electrodes stacked with respective dielectric layers interposed therebetween, external electrodes disposed on external surfaces of the body and connected to the internal electrodes, and an insulating layer covering a surface of the body. One of the external electrodes includes a metal layer connected to the insulating layer, and the insulating layer includes an oxide of a metal component of the metal layer.

Abstract: A multilayer ceramic electronic component includes: a ceramic body and first and second external electrodes on external surfaces of the ceramic body. The ceramic body includes first and second internal electrodes facing each other with dielectric layers interposed therebetween. The ceramic body includes an active portion in which capacitance is formed and cover portions on upper and lower surfaces of the active portion, respectively. The ratio of the thickness of the first and second external electrodes to the thickness of the cover portion is proportional to the inverse of the cube root of the ratio of the Young's Modulus of each of the first and second external electrodes to the Young's modulus of the cover portion.

Abstract: A ceramic electronic device includes: a multilayer structure; and a cover layer, wherein a concentration of Mn of the cover layer with respect to a main component ceramic is larger than a concentration of Mn of the dielectric layers with respect to a main component ceramic in a capacity section, wherein an average crystal grain diameter of a first dielectric layer is smaller than that of a second dielectric layer, and a concentration of Mn of the first dielectric layer with respect to the main component ceramic is larger than a concentration of Mn of the second dielectric layer with respect to the main component ceramic, in the capacity section.

Abstract: A multilayer ceramic capacitor includes a capacitor main body, and two interposers on both sides in a length direction of a surface of the capacitor main body. When a distance between a side surface of one interposer on one side in the length direction, and a side surface of the capacitor main body is defined as X1, a distance between another side surface of the one interposer, and another side surface of the capacitor main body is defined as X4, a distance between a side surface of another interposer on another side in the length direction, and the side surface of the capacitor main body is defined as X2, and a distance between another side surface of the other interposer on the other side in the length direction, and the other side surface of the capacitor main body is defined as X3; X2>X3 and X1>X4 are satisfied.

Abstract: A multilayer capacitor includes a body including a plurality of dielectric layers and a plurality of internal electrodes laminated in a first direction, and external electrodes. The body includes an active portion, in which the plurality of internal electrodes are disposed to form capacitance, corresponding to a region between internal electrodes disposed on an outermost side in the first direction, among the plurality of internal electrodes, a cover portion covering the active portion in the first direction, and a side margin portion covering the active portion in a second direction, perpendicular to the first direction, and 1.49<A1/A2<2.50 where A1 is an average grain size of the dielectric layer in a central region of the active portion, and A2 is an average grain size of the dielectric layer in an active-cover boundary portion, adjacent to the cover portion, of the active portion.

Abstract: A ceramic electronic component includes an element body having a first inner electrode exposed at a first end face of the element body, and a second inner electrode exposed at a second end face of the element body. The ceramic electronic component also includes a first outer electrode formed on the first end face and its neighboring faces of the element body. The first outer electrode includes two side portions and a middle portion on each of top and bottom faces of the element body such that the middle portion extends inwardly towards a center of the element body more than the two side portions from the first end face. The ceramic electronic component also includes a second outer electrode having the same dimensions as the first outer electrode on the second end face and its neighboring faces of the element body.

Abstract: A ceramic electronic device includes an element body and an external electrode. The element body includes a ceramic layer and an internal electrode layer. The external electrode is formed on an end surface of the element body and electrically connected to a part of the internal electrode layer. The ceramic layer includes a perovskite compound represented by ABO3 as a main component. The external electrode includes a baked electrode layer having a first region and a second region. The first region is contacted with the end surface of the element body and located near a joint boundary with the element body. The second region is located outside the first region and constitutes an outer surface of the baked electrode layer. The first region includes a glass frit including at least B and Si. The second region includes an Al based oxide mainly including Al.

Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers alternately laminated therein, first and second main surfaces opposing each other in a lamination direction, first and second end surfaces opposing each other in a length direction which intersects the lamination direction, and first and second side surfaces opposing each other in a width direction which intersects the lamination direction and the length direction, and external electrodes on the first and second end surfaces, and each electrically connected to the internal electrode layers, wherein the multilayer body includes a slit in at least one of the first side surface, the second side surface, and the second main surface defining and functioning as a board-mounting surface.

Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric ceramic layers and internal electrode layers laminated alternately in a lamination direction, and a pair of external electrodes on both end portions in the length direction of the multilayer body and respectively connected to the internal electrode layers. The pair of external electrodes each include a base region covering at least each of the first and second end surfaces and connected to the internal electrode layers, and a cover region on the base region to cover the base region. The cover region includes maximum thickness portions each including a maximum thickness in the cover region, in a region corresponding to the ranges of about ±10 ?m in the lamination direction centered around internal electrode layers at both outermost ends in the lamination direction among the internal electrode layers.

Abstract: An electronic component includes: a multilayer capacitor including a capacitor body and a pair of external electrodes, respectively disposed on external surfaces of the capacitor body in a first direction; and an interposer disposed below the multilayer capacitor and including an interposer body, a pair of via holes penetrating through the interposer body, and a pair of via electrodes, respectively disposed in the via holes to be connected to the pair of external electrodes, respectively. 0.24T?t?0.3T, where “T” is a maximum height of the multilayer capacitor and “t” is a maximum height of the interposer.

Abstract: A capacitor component includes a body including a dielectric layer and internal electrode layers, with the dielectric layer interposed therebetween; and an external electrode disposed on the body and connected to the internal electrode layers. Each of the internal electrode layers has a capacitance formation portion disposed to overlap an adjacent internal electrode layer, and a lead-out portion extending from the capacitance formation portion and connected to the external electrode. A ratio (H2/H1) of a height difference H2 to a height difference H1 is 0.2 or less, where the height difference H2 is a height difference between the capacitance formation portion and the lead-out portion of a lowermost internal electrode layer the height difference H1 is a height difference between the capacitance formation portion and the lead-out portion of an uppermost internal electrode layer. An average thickness of the dielectric layer is 420 nm or less.

Abstract: A ceramic electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of dielectric grains, and at least one of the plurality of dielectric grains has a core-dual shell structure having a core and a dual shell. The dual shell includes a first shell surrounding at least a portion of the core, and a second shell surrounding at least a portion of the first shell, and a concentration of a rare earth element included in the second shell is more than 1.3 times to less than 3.8 times a concentration of a rare earth element included in the first shell.

Abstract: A multilayer electronic component has a body and a non-conductive resin layer. The non-conductive resin layer includes a body cover portion disposed in a region of an external surface of the body in which an electrode layer of an external electrode is not disposed, and an extending portion extending from the body cover portion between the electrode layer and a conductive resin layer of the external electrode, to thereby suppress arc discharge, improve bending strength, and improve moisture resistance.

Abstract: Provided is a coil component and a method of manufacturing the coil component less prone to aggregation of metal fillers contained in an external electrode. The coil component includes: a base body; a conductor wound around a coil axis; and an external electrode provided on a surface of the base body and electrically connected to an end portion of the conductor, wherein the external electrode includes an electrode layer containing a plurality of first fillers, a plurality of second fillers, and a resin, wherein at least a part of the plurality of second fillers is bonded by metallic bond to at least adjacent one of the plurality of first fillers and/or at least adjacent one of the others of the plurality of second fillers, and wherein each of the plurality of second fillers has a flat shape.

Abstract: A multilayer electronic component includes: a body including a dielectric layer and a plurality of internal electrodes alternately disposed with the dielectric layer; and external electrodes disposed on the body, wherein the external electrodes respectively include an electrode layer disposed on the body and connected to the plurality of internal electrodes and a conductive resin layer disposed on the electrode layer and including a first conductive particle, a second conductive particle, and a resin, wherein the first conductive particle is a Cu particle, the second conductive particle is a Cu particle having a surface on which Ag is disposed.

Abstract: Prismatic polymer monolithic capacitor structure that includes multiple interleaving radiation-cured polymer dielectric layers and metal layers. Method for fabrication of same. The chemical composition of polymer dielectric and the electrode resistivity parameters are chosen to maximize the capacitor self-healing properties and energy density, and to assure the stability of the capacitance and dissipation factor over the operating temperature range. The termination electrode that extends beyond the active capacitor area and beyond the polymer dielectric layers has a thickness larger than that used industrially to provide resistance to thermomechanical stress. The glass transition temperature of the polymer dielectric is specifically chosen to avoid mechanical relaxation from occurring in the operating temperature range, which prevents high moisture permeation (otherwise increasing a dissipation factor and electrode corrosion) into the structure.

Abstract: A ceramic electronic device includes a multilayer chip in which a dielectric layer and an internal electrode layer are alternately stacked. Concentration peaks of two or more types of metals different from a main component metal of the internal electrode layer exist at different positions in a stacking direction of the dielectric layer and the internal electrode layer, between the dielectric layer and the internal electrode layer.

Abstract: A multilayer ceramic electronic component includes a multilayer body and an external electrode on each of both end surfaces of the multilayer body. The external electrode includes an underlying electrode layer and a plating layer that is disposed on the underlying electrode layer. The underlying electrode layer includes Ni as a first metal component, Sn as a second metal component, and a ceramic material, and includes an alloy portion that is provided around the ceramic material and includes an alloyed Ni defining the first metal component and an alloyed Sn defining the second metal component.

Abstract: A multilayer ceramic electronic component includes a multilayer body including stacked ceramic layers, internal conductive layers stacked on the ceramic layers, first and second main surfaces opposing each other in a height direction, first and second side surfaces opposing each other in a width direction perpendicular or substantially perpendicular to the height direction, and first and second end surfaces opposing each other in a length direction perpendicular or substantially perpendicular to the height direction and the width direction, and external electrodes connected to the internal conductive layers. The internal conductive layers include holes having a different area equivalent diameter. When an area equivalent diameter in which a cumulative value in a cumulative distribution of area equivalent diameters of the holes in each of the internal conductive layers becomes about 99% is defined as an area equivalent diameter D99, the area equivalent diameter D99 is about 8.0 ?m or less.

Abstract: A multilayer electronic component, in which the external electrode may be thinned to secure capacitance per unit volume, while securing the external electrode at a corner in a specific thickness or higher with improved reliability for moisture resistance.

Abstract: A multilayer ceramic capacitor includes a ceramic body including a dielectric layer, a first internal electrode and a second internal electrode, disposed to oppose each other with the dielectric layer interposed therebetween, and a first external electrode and a second external electrode. The ceramic body further includes first and second margin portions and first and second cover portions, disposed on upper and lower surfaces of a capacitance formation portion and the first and second margin portions, respectively. The first and second cover portions each include a first cover layer adjacent to an internal electrode, disposed on an outermost side among the first and second internal electrodes, and a second cover layer disposed on the first cover layer, and an interface at which the first cover layer and the second cover layer are in contact with each other.

Abstract: A ceramic electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of grains and grain boundaries disposed between adjacent grains. The grain boundary includes a secondary phase including Sn, a rare-earth element, and a first subcomponent. The rare-earth element includes at least one of Y, Dy, Ho, Er, Gd, Ce, Nd, Sm, Tb, Tm, La, Gd and Yb. The first subcomponent includes at least one of Si, Mg, and Al.

Abstract: A multilayer ceramic capacitor includes a first internal electrode, a second internal electrode, a first dielectric layer, and a second dielectric layer. The first internal electrode includes a first outer peripheral portion and a first inner electrode portion inside the first outer peripheral portion. The second internal electrode includes a second outer peripheral portion and a second inner electrode portion inside the second outer peripheral portion. The first dielectric layer includes a first high dielectric constant portion, and a first inner dielectric layer portion inside the first high dielectric constant portion. The second dielectric layer include a second high dielectric constant portion and a second inner dielectric layer portion inside the second high dielectric constant portion.

Abstract: A method of manufacturing an electronic component includes preparing an unfired multilayer body including first and second main surfaces facing each other in a stacking direction, first and second side surfaces facing each other in a width direction, and first and second end surfaces facing each other in a length direction, bonding one main surface of the unfired multilayer body to an elongated first adhesive sheet, conveying the first adhesive sheet in a first direction in which the first adhesive sheet approaches an elongated second adhesive sheet, and bonding one side surface of the unfired multilayer body to the second adhesive sheet, conveying the second adhesive sheet in a second direction different from the first direction to peel off the unfired multilayer body from the first adhesive sheet, polishing another side surface of the unfired multilayer body, and forming a first insulating layer on the polished another side surface.

Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, a first external electrode disposed on the body and connected to the first internal electrode, and a second external electrode disposed on the body and connected to the second internal electrode. The dielectric layer includes a first dielectric layer adjacent to the first internal electrode, a second dielectric layer adjacent to the second internal electrode, and a third dielectric layer disposed between the first and second dielectric layers. D1<D3 and D2<D3, in which D1 is an average particle size of dielectric grains included in the first dielectric layer, D2 is an average particle size of dielectric grains included in the second dielectric layer, and D3 is an average particle size of dielectric grains included in the third dielectric layer.

Abstract: A multilayer electronic component includes a silicon (Si) organic compound layer having a body cover portion disposed in a region, in which electrode layers are not disposed, of external surfaces of a body, and an extending portion disposed to extend from the body cover portion between an electrode layer and a conductive resin layer of an external electrode, and thus, may improve bending strength and humidity resistance reliability.

Abstract: A multilayer ceramic capacitor includes a multilayer body, a first internal electrode layer extending to opposing end surfaces of the multilayer body, a second internal electrode layer extending to opposing side surfaces of the multilayer body, first and second external electrodes connected to the first internal electrode layer and provided on the opposing end surfaces, and third and fourth external electrodes connected to the second internal electrode layer and provided on the opposing side surfaces. The second internal electrode layer includes a central section in a central portion of the dielectric layer and an extending section extending to the opposing side surfaces. The first internal electrode layer is larger in number than the second internal electrode layer, at least two first internal electrode layers are successively layered, and the extending section is larger in thickness than the central section located in the central portion of the dielectric layer.

Abstract: A multilayer ceramic capacitor includes a multilayer body, a first outer electrode on a first main surface closer to a first end surface, a second outer electrode on the first main surface closer to a second end surface, a third outer electrode on the first main surface between the first outer electrode and the second outer electrode, a first inner electrode layer connected to the first outer electrode and the second outer electrode via a first lead electrode and a second lead electrode, and a second inner electrode layer connected to the third outer electrode via a third lead electrode. When a length of the first lead electrode and a length of the second lead electrode in the length direction are each denoted by a, and a length of the third lead electrode in the length direction is denoted by b, b/a is about 0.5 to about 0.83.

Abstract: A multi-layered ceramic electronic component has a ceramic body including dielectric layers and a plurality of internal electrodes opposing each other with the dielectric layers interposed therebetween. External electrodes are disposed on an exterior of the ceramic body and are electrically connected to the internal electrodes. Each external electrode includes an electrode layer electrically connected to internal electrodes, and a conductive resin layer arranged on the electrode layer. The conductive resin layer extends to first and second surface of the ceramic body, and a ratio of a thickness (Tb) of the conductive resin layer extending onto the first surface and the second surface of the ceramic body to a length (Lm) of a length direction margin portion of the ceramic body satisfies 2 to 29%.

Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and first and second internal electrodes alternately laminated with the dielectric layer interposed therebetween; a first external electrode connected to a first internal electrode; and a second external electrode connected to a second internal electrode, wherein the first external electrode includes a first base electrode layer disposed on the ceramic body and a first resin electrode layer disposed on the first base electrode layer, wherein the second external electrode includes a second base electrode layer disposed on the ceramic body and a second resin electrode layer disposed on the second base electrode layer, and wherein the first resin electrode layer and the second resin electrode layer include a shape memory polymer (e.g., a thermosetting shape memory polymer) or a polymer having properties including a property that exhibits shape memory effect.

Abstract: A multilayer ceramic electronic component includes: a ceramic body having a capacitance formation portion, and including a dielectric layer and a first internal electrode and a second internal electrode with the dielectric layer interposed therebetween, a first margin portion disposed on the surface of the capacitance formation portion, and a second margin portion disposed on the other surface of the capacitance formation portion; a first external electrode; and a second external electrode. A following formula 1 is satisfied, [formula 1]?0.1?(Tm?Ta)/Ta, where in the formula 1, Tm is an average height of a central region of the margin portion, and Ta is an average height of an outer region of the capacitance formation portion in a second direction.

Abstract: A film capacitor that includes a capacitor element including one or more wound or laminated metallized films, each metallized film including a resin film and a metal layer on a surface of the resin film; an outer case that houses the capacitor element; and a filling resin that fills a space between the capacitor element and the outer case, wherein the outer case is made of a resin composition containing a liquid crystal polymer and an inorganic filler.

Abstract: A multilayer ceramic capacitor includes an interposer including, on a side in a length direction, a first through conductive portion that penetrates the interposer in a stacking direction, and provides electrical conduction between a first joining electrode and a first mounting electrode. The interposer includes, on the other side in the length direction, a second through conductive portion that penetrates the interposer in the stacking direction, and provides electrical conduction between a second joining electrode and a second mounting electrode. The first mounting electrode includes a first portion that covers a portion of a first interposer end surface on the one side in the length direction of the interposer. The second mounting electrode includes a second portion that covers a portion of a second interposer end surface on the other side in the length direction of the interposer.

Abstract: A multilayer ceramic capacitor includes a multilayer body including the dielectric ceramic layers and the internal electrode layers which are laminated, and external electrodes connected to the internal electrode layers. The multilayer body includes segregation including Si as a main component in a vicinity of an end of the internal electrode layer in a width direction. An average particle size of the dielectric particles in the vicinity of the end of the internal electrode layer in the width direction in the dielectric ceramic layer is smaller than an average particle size of a dielectric particles in a central portion of the internal electrode layer in the width direction in the dielectric ceramic layer.

Abstract: A multilayer ceramic electronic component includes a ceramic body; and first and second external electrodes disposed on the ceramic body, wherein the first and second external electrodes include first and second conductive layers disposed on corners of the ceramic body, and first and second base electrodes covering the first and second conductive layers, respectively, and wherein a ratio, A1/A2, of an area, A1, of the first conductive layer disposed on the fifth surface or the second conductive layer disposed on the sixth surface of the ceramic body to an area, A2, of a cross-sectional surface of the ceramic body taken in the second direction and the first direction is in a range of 0.1 to 0.3.