Abstract: A laminated electronic component includes a laminate including internal electrodes and dielectric layers laminated alternately and a first main surface, an external electrode that continuously covers at least one end surface of the laminate in a longitudinal direction and a portion of the first main surface adjacent to the one end surface, and a conductive elastic structure connected to the external electrode at at least corner portions of the first main surface in a portion where the external electrode covers the first main surface. The elastic structure includes a base portion connected to the external electrode to extend along the first main surface, and a branch portion branched from the base portion and extending at a position spaced from the first main surface to connect to another electrode, and having elasticity.

Abstract: A chip capacitor and interconnecting wiring is described incorporating a metal insulator metal (MIM) capacitor, tapered vias and vias coupled to one or both of the top and bottom electrodes of the capacitor in an integrated circuit. A design structure tangibly embodied in a machine readable medium is described incorporating computer readable code defining a MIM capacitor, tapered vias, vias and wiring levels in an integrated circuit.

Abstract: A multi-layer capacitor includes a first capacitor layer and a second capacitor layer adjacent and substantially parallel to the first capacitor layer. The second capacitor layer has a surface area that is less than the surface area of the first capacitor layer.

Abstract: A substrate-type terminal includes a first major surface with a first mounting electrode and a second mounting electrode. The substrate-type terminal includes a second major surface with a first connecting electrode and a second connecting electrode. The substrate-type terminal includes a first slit located between the first mounting electrode and the first connecting electrode, as seen in a plane, and penetrating the terminal from the first major surface to the second major surface, and a second slit located between the second mounting electrode and the second connecting electrode, as seen in a plane, and penetrating the terminal from the first major surface to the second major surface.

Abstract: A monolithic capacitor includes a multilayer body including a plurality of stacked dielectric layers, first and second capacitor electrodes inside the multilayer body, and outer electrodes on at least one surface of the multilayer body. The first and second capacitor electrodes are arranged perpendicularly or substantially perpendicularly to first and second surfaces of the multilayer body. The first capacitor electrode includes a capacitor portion opposed to the second capacitor electrode with the dielectric layer interposed therebetween, a lead portion connected to one outer electrode, and an intermediate portion not opposed to the second outer electrode. The second capacitor electrode includes a capacitor portion opposed to the first capacitor electrode with the dielectric layer interposed therebetween, and a lead portion connected to the other outer electrode.

Abstract: A laminated ceramic capacitor which has a long high temperature load life, small variations in life, large capacitance, high electrical insulation property, and favorable capacitance temperature characteristics, even when high strength electric field is applied while reducing the thickness of dielectric ceramic layers uses a dielectric ceramic represented by the formula: 100(Ba1-xCax)mTiO3+aMgO+bVO5/2+cReO3/2+dMnO+eSiO2 where Re being at least one of Y, La, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, and Yb), 0.05?x?0.15, 0.01?a?0.1, 0.05?b?0.5, 1.0?c?5.0, 0.1?d?1.0, 0.5?e?2.5, and 0.990?m?1.030.

Abstract: An electronic component includes a laminated capacitor and a substrate-type terminal on which the laminated capacitor is mounted, with an viscoelastic resin located in a space between the laminated capacitor and the substrate-type terminal. The substrate-type terminal includes a substrate body, component connecting electrodes to mount the laminated capacitor are located on a component mounting surface of the substrate body, and external connecting electrodes to be connected to a circuit board are located on a substrate mounting surface of the substrate body.

Abstract: A dielectric ceramic composition includes: a base material powder BamTiO3 (0.995?m?1.010); 0.2 to 2.0 moles of a first accessory ingredient, an oxide or carbide containing at least one of Ba and Ca, based on 100 moles of the base material powder; a second accessory ingredient, an oxide containing Si or a glass compound containing Si; 0.2 to 1.5 moles of a third accessory ingredient, an oxide containing at least one of Sc, Y, La, Ac, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu, based on 100 moles of the base material powder; and 0.05 to 0.80 mole of a fourth accessory ingredient, an oxide containing at least one of Cr, Mo, W, Mn, Fe, Co, and Ni, based on 100 moles of the base material powder, a content ratio of the first accessory ingredient to the second accessory ingredient being 0.5 to 1.7.

Abstract: There are provided a conductive paste for external electrodes and a multilayer ceramic electronic component using the same. The conductive paste includes a conductive metal powder including conductive metal particles; and a conductive amorphous metal powder including amorphous metal particles having a(Si, B)-b(Li, K)-c(V, Mn) in which a+b+c=100, 20?a?60, 10?b?40, and 2?c?25 are satisfied.

Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic body including a dielectric layer; a plurality of internal electrodes disposed to face each other within the ceramic body, having the dielectric layer interposed therebetween; and external electrodes electrically connected to the internal electrodes, wherein the ceramic body includes an active layer corresponding to a capacitance forming part and a cover layer formed on at least one of an upper surface and a lower surface of the active layer and corresponding to a non-capacitance forming part, an average thickness of the cover layer is 15 ?m or less, the external electrodes include a conductive metal and a glass, and when an area of the external electrodes occupied by the glass is A and an area thereof occupied by the conductive metal is B, 0.05?A/B?0.6 is satisfied.

Abstract: A multilayer ceramic capacitor includes ceramic grains forming a dielectric layer of the multilayer ceramic capacitor, which ceramic grains contain a coarse ceramic grain SPr having a coarse grain size Dcoa that satisfies the condition of Tmin Dcoa Tmax where Tmax is the maximum thickness of the dielectric layer and Tmin is the minimum thickness of the dielectric layer. The multilayer ceramic capacitor is capable of inhibiting deterioration of capacitance and capacity-temperature characteristics even when the internal electrode layer is made thin.

Abstract: Multilayer smectite capacitor (MLSC) provided with a new dielectric film, and a first electric and second electrode formed sandwiching it and facing each other, wherein has dielectric film. The dielectric film in this capacitor is smectite, and either or both of said first electrode and second electrode contain at least one metal selected from group consisting of Cu, Ni. Thin internal conductors are each placed between the smectite dielectric layer and arranged in parallel. The smectite dielectric layers have a thickness of about 0.6 to less than 2 micrometer. The internal conductors have a thickness of about 0.2 to 0.4 micrometer.

Abstract: A laminated ceramic capacitor having high electrostatic capacitance and excellent lifetime characteristics, even when in a high electric field intensity employs a dielectric ceramic including crystal grains and crystal grain boundaries which contains, as its main constituent, a perovskite-type compound including Ba, Ca, and Ti, and further contains Mg, R (Y, La, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, and/or Yb), and Zr, such that when the laminated body is dissolved, the contents in terms of parts by mol are Ca: 3 to 15 parts by mol, Mg: 0.01 to 0.09 parts by mol, R: 2.5 to 8.4 parts by mol, and Zr: 0.05 to 3.0 parts by mol with respect to 100 parts by mol of Ti, and there is Ca at least at the centers of the crystal grains.

Abstract: A multilayer ceramic composition showing good characteristics, even when electric intensity on dielectric layers is high and a stacked number of a multilayer ceramic capacitor is increased, and an electronic device thereof. Said composition comprises: a perovskite compound ABO3, and with respect to 100 moles of said compound, 0.6 or more to 1.4 or less moles of Ra2O3 in which Ra is at least one of Dy, Gd and Tb, 0.2 or more to 0.7 or less moles of Rb2O3 in which Rb is at least one of Ho and Y, and 0.2 or more to 0.7 or less moles of Rc2O3 in which Rc is at least one of Yb and Lu, in terms of each oxide, 0.6 or more to 1.6 or less moles of Mg oxide in terms of Mg, and 0.6 or more to less than 1.2 moles of Si included compound in terms of Si.

Abstract: Disclosed herein is a multilayer ceramic device, including a device body having a plurality of dielectric sheets stacked on one another, the device body having spaced-apart sides and circumferential surfaces connecting the sides; internal electrodes formed on the dielectric sheets; an external electrode having a front portion to cover the sides and a band portion to extend from the front portion to cover parts of the circumferential surfaces; and a reinforcement pattern having a plurality of metal patterns arranged facing one another between the internal electrodes and the circumferential surfaces, wherein a distance between the metal patterns may be smaller than thicknesses of the dielectric sheets on which the internal electrodes are formed.

Abstract: In an electronic component, when L0 is a dimension of an electronic component body in a first direction, L1 is a distance between a first outer electrode and a second outer electrode on a first surface in the first direction, and L2 is a dimension of each of the first and second outer electrodes on the first surface in the first direction, 0%<L1/L0<10% and 30%<L2/L0<50% are satisfied.

Abstract: A multilayer ceramic capacitor includes a ceramic body having dielectric layers laminated therein; an active layer including first and second internal electrodes alternately exposed through end surfaces of the ceramic body having the dielectric layer interposed therebetween; upper and lower cover layers formed above and below the active layer; first and second external electrodes formed on end surfaces of the ceramic body, respectively; first and second dummy patterns extended from the first and second external electrodes into margin portions of the active layer in a length direction, respectively; and first and second dummy electrodes opposing each other in a length direction within the upper and lower cover layers, the first and second dummy electrodes being extended inwardly from the first and second external electrodes.

Abstract: Disclosed herein is a multilayer ceramic device including: a device body having side surfaces spaced apart from each other and circumferential surfaces connecting the side surfaces to each other; internal electrodes disposed in a length direction of the device body in the device body; external electrodes having a front surface portion covering the side surfaces and a band portion extended from the front surface portion and covering portions of the circumferential surfaces; and crack guide patterns disposed in the device body and guiding a progress direction of a crack generated from the circumferential surfaces so that the crack is directed toward the side surface, wherein the crack guide pattern includes: a first metal pattern; and a second metal pattern disposed to be closer to the circumferential surface as compared with the first metal pattern and having gaps.

Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic body having internal electrodes formed therein; external electrodes formed on external surfaces of the ceramic body and connected to the internal electrodes; and buffer layers formed on contact surfaces between the internal electrodes and the external electrodes, among external surfaces of the ceramic body, in an interior direction of the ceramic body, wherein when a thickness of the internal electrode is denoted by Te, a number of laminated internal electrodes is denoted by N, a thickness of the buffer layer is denoted by t, and a width of a margin of the ceramic body in a length direction of the ceramic body is denoted by L, Te?0.6 ?m, N>200, and 3 ?m?t<L, so that the occurrence of radial cracks can be prevented and thus reliability can be improved.

Abstract: There is provided a multilayer ceramic electronic component including a ceramic body having internal electrodes formed therein, external electrodes formed on external surfaces of the ceramic body and connected to the internal electrodes, and a buffer layer formed on surfaces of contact between the internal electrodes and the external electrodes among external surfaces of the ceramic body, in an interior direction of the ceramic body, wherein when a thickness of the external electrode is denoted by T, a thickness of the buffer layer is denoted by t, a thickness of an active region is denoted by TA, and a thickness of the ceramic body is denoted by Tc, T?10 ?m, TA/TC>0.8, and t?5 ?m, so that a multilayer ceramic electronic component having excellent reliability may be realized.

Abstract: There is provided a multilayer ceramic electronic component, including a ceramic body including dielectric layers; a plurality of internal electrodes stacked within the ceramic body, and external electrodes formed on external surfaces of the ceramic body and electrically connected to the internal electrodes, wherein the external electrodes include a metal layer and a conductive resin layer formed on the metal layer, the conducive resin layer containing a copper powder and an epoxy resin, the copper powder including a first copper powder having a content of 10 wt % or more and a particle diameter of 2 ?m or greater and a second copper powder having a content of 5 wt % or more and a particle diameter of 0.7 ?m or smaller, the first copper powder being a mixture of spherical powder particles and flake type powder particles.

Abstract: An electronic component and method for manufacture thereof is disclosed. A plurality of electrodes are positioned in stacked relation to form an electrode stack. The stack may include as few as two electrodes, but more may be used depending on the number of subcomponents desired. Spacing between adjacent electrodes is determined by removable spacers during fabrication. The resulting space between adjacent electrodes is substantially filled with gaseous matter, which may be an actual gaseous fill, air, or a reduced pressure gas formed through evacuation of the space. Further, adjacent electrodes are bonded together to maintain the spacing. A casing is formed to encapsulate the stack, with first and second conducting surfaces remaining exposed outside the casing. The first conducting surface is electrically coupled to a first of the electrodes, and the second conducting surface is electrically coupled to a second of the electrodes.

Abstract: In a laminated capacitor, one additional first internal electrode layer, which has its edge connected to the first external electrode as do the first internal electrode layers, is provided to one of the five first internal electrode layers so as to face one another via the second dielectric layer having a thickness smaller than the thickness of the first dielectric layer and not contributing to the formation of capacity, and one additional second internal electrode layer, which has its edge connected to the second external electrode as do the second internal electrode layers, is provided to one of the five second internal electrode layers so as to face one another via the third dielectric layer having a thickness smaller than the thickness of the first dielectric layer and not contributing to the formation of capacity.

Abstract: There are provided a conductive paste composition, a multilayer ceramic capacitor using the same, and a manufacturing method thereof. The conductive paste composition includes a conductive metal powder; a ceramic powder; and a resin, wherein the conductive paste composition has a theoretical density of 6 g/cm3 or higher and a relative density of 95% or more.

Abstract: Disclosed herein is a multilayer ceramic device. The multilayer ceramic device according to an exemplary embodiment of the present invention includes: a device body having sides which are spaced apart from each other and a circumferential surface which connects the sides; an internal electrode disposed in a longitudinal direction of the device body within the device body; an external electrode having a front part which covers the sides and a band part which extends from the front part to cover a portion of the circumferential surface; and a crack guide pattern disposed within the device body and guiding a progress direction of cracks occurring at the circumferential surface to the sides, wherein the crack guide pattern includes: a metal pattern; and an oxide layer formed on a surface of the metal pattern.

Abstract: A dielectric resin composition for a film capacitor is a mixture containing an organic material A and an organic material B. The organic material A includes at least two kinds of organic material components A1, A2, . . . having reactive groups (for example, OH, NCO) that cross-link each other. The organic material B does not have a reactive site capable of reacting with the organic material A and has a dielectric loss tan ? of 0.3% or less at a temperature of 125° C. The mixture has a glass transition temperature of 130° C. or higher and preferably 280° C. or lower.

Abstract: A conductive paste for an internal electrode of a multilayer ceramic electronic component capable of restraining a generation of cracks by reducing internal stress, and a multilayer ceramic electronic component fabricated by using the same are provided. The conductive paste for an internal electrode of a multilayer ceramic electronic component includes: 100 parts by weight of a conductive metal powder; and 0.6 to 2.4 parts by weight of an organic binder. The use of the conductive paste can reduce internal stress of a multilayer ceramic electronic component, thus restraining a generation of cracks therein in the multilayer ceramic electronic component.

Abstract: There is provided a multilayer ceramic capacitor. The capacitor includes: a multilayer body having a dielectric layer; and first and second internal electrodes disposed in the multilayer body, the dielectric layer being disposed between the first and second internal electrodes, wherein, in a cross-section taken in a width-thickness direction of the multilayer body, an offset portion is defined as a portion where adjacent first and second internal electrodes do not overlap with each other, and a ratio (t1/td) of a width t1 of the offset portion to a thickness td of the dielectric layer is 1 to 10.

Abstract: There are provided multilayer ceramic capacitor, a manufacturing method therefor, a circuit board having a multilayer ceramic capacitor embedded therein, and a polishing device for a multilayer ceramic capacitor.

Abstract: A monolithic ceramic electronic component includes a component body and outer electrodes. The component body includes a plurality of stacked ceramic layers and a plurality of inner electrodes which extend between the ceramic layers, which contain Ni, and which include exposed ends exposed on predetermined surfaces of the component body. The outer electrodes are electrically connected to the exposed ends of the inner electrodes and are formed on the predetermined surfaces of the component body by plating. The inner electrodes include Mg—Ni coexistence regions where Mg and Ni coexist.

Abstract: With a multilayer ceramic capacitor whose average grain size of the dielectric grains present at the outermost layer position P1 in the laminate is given by D1, average grain size of the dielectric grains present at the center position P2 in the laminate is given by D2, and average grain size of the dielectric grains present at the 25%-penetrated position P3 which is a position penetrated into the laminate by 25% is given by D3, growth of the dielectric grains occurring as a result of sintering is partially suppressed in such a way that the relationships of average grain sizes D1, D2, and D3 satisfy the conditions of 1.5×D1<D3 and 1.2×D2<D3. This way, a sufficient CR product can be obtained even with a dielectric thickness of 1 ?m or less.

Abstract: A multilayer ceramic capacitor includes: a ceramic body having laminated dielectric layers having an average thickness of 0.2-2.0 ?m; an active layer including first and second internal electrodes alternately exposed through end surfaces of the ceramic body having the dielectric layer interposed therebetween and contributing to capacitance formation; upper and lower cover layers respectively formed above and below the active layer, the lower cover layer being thicker than the upper cover layer; first and second external electrodes covering the end surfaces of the ceramic body, wherein a bottommost internal electrode adjacent to the lower cover layer has an oxide layer formed on at least one of top and bottom surfaces thereof, and when lengths and thicknesses of the bottommost internal electrode and the oxide layer are denoted by ‘Le,’ ‘te’ and ‘Lo,’ ‘to’, respectively, in a cross section of the ceramic body taken in length-thickness direction, 50%<Lo/Le×100 and 30%<to/te×100<80% are satisfied.

Abstract: There are provided multilayer ceramic capacitor, a manufacturing method therefor, a circuit board having a multilayer ceramic capacitor embedded therein, and a polishing device for a multilayer ceramic capacitor.

Abstract: A multilayer capacitor that achieves reduced acoustic noise includes a capacitor body including a capacitance generating portion, a first outer layer portion, and a second outer layer portion. First and second internal electrodes are provided in the capacitance generating portion. The first outer layer portion is located between the capacitance generating portion and a first principle surface. The second outer layer portion is located between the capacitance generating portion and a second principle surface. The second outer layer portion is thicker than the first outer layer portion. At least one of a concave portion and a convex portion is provided on the second principle surface.

Abstract: There is provided a multilayer ceramic capacitor including a ceramic body including dielectric layers, first and second internal electrodes formed within the ceramic body and disposed to face each other, having the dielectric layer interposed therebetween, first and second electrode layers disposed on outer surfaces of the ceramic body and electrically connected to the first and second internal electrodes, respectively, a conductive resin layer disposed on the first and second electrode layers and containing copper powder, a nickel plating layer disposed on an outer portion of the conductive resin layer, and a copper-nickel alloy layer disposed between the conductive resin layer and the nickel plating layer and having a thickness of 1 to 10 nm.

Abstract: An electrical device having at least one functional element that includes a ceramic body, on which a first electrical contact layer and a second electrical contact layer are applied to two opposite-lying side faces, respectively, and the functional element is arranged between a first contact strip and a second contact strip, wherein the first contact strip and the second contact strip comprise several contact pins, respectively, and wherein the first contact layer electrically contacts at least one contact pin of the first contact strip and the second contact layer electrically contacts at least one contact pin of the second contact strip.

Abstract: There is provided a multilayer ceramic capacitor including: a ceramic body in which a plurality of dielectric layers are stacked; a plurality of first and second internal electrodes formed on at least one surfaces of the plurality of dielectric layers and alternately exposed to both end surfaces of the ceramic body; first and second external electrodes formed on both end surfaces of the ceramic body and electrically connected to the respective first and second internal electrodes; and first and second non-conductive epoxy resin layers formed on peripheral surfaces of the first and second external electrodes except for mounting surfaces of the first and second external electrodes.

Abstract: Disclosed herein is a multi-layered capacitor, including: an element formed by alternately multi-layering a dielectric layer and an internal electrode; and external terminals disposed at both ends of the element, wherein the dielectric layer disposed at an upper end U and a lower end L of the element is formed of a paraelectric material and the dielectric layer disposed at a central part C of the element is formed of a ferroelectric material.

Abstract: A multilayer ceramic capacitor whose external electrodes are each provided with a solder non-adhesion film made of material to which solder does not adhere, in a manner continuously covering the entire surface of the end face, and optionally the entire surface of the curved face thereof. The multilayer ceramic capacitor, with certainty, allows for suppression of noise accompanying electrostriction.

Abstract: There is provided a high voltage and high capacitance multilayer ceramic electronic component having enhanced reliability, including: a ceramic body; a first layer including conductive patterns; and a second layer including a floating pattern, wherein the sum of the number of the first and second layers is 100 or more, the ceramic body has first and second external electrodes formed on outer surfaces thereof, and a ratio of a length of the floating pattern to a length of the ceramic body is 0.7 to 0.9, and a ratio of a length of the overlapped portion to the length of the floating pattern is 0.5 to 0.95, in a cross section taken in a length direction in which the first and second external electrodes are connected to and extended from the ceramic body and a stacking direction of the first and second layers.

Abstract: There is provided a conductive resin composition including 10 to 50 wt % of a gel type silicon rubber such as polydimethylsiloxane (PDMS), and 50 to 90 wt % of conductive metal powder particles.

Abstract: A capacitor structure includes a first electrode on a substrate; a TiO2 dielectric layer directly on the first electrode, wherein the TiO2 dielectric layer has substantially only rutile phase; and a second electrode on the TiO2 dielectric layer. Template layer, seed layer or pretreated layer is not required between the first electrode and the TiO2 dielectric layer. Besides, impurity doping is not required for the TiO2 dielectric layer.

Abstract: There is provided a multilayer ceramic capacitor, including: a ceramic body including dielectric layers; first and second internal electrodes disposed to face each other with the dielectric layer interposed therebetween within the ceramic body; a first external electrode electrically connected to the first internal electrodes; and a second external electrode electrically connected to the second internal electrodes, wherein the dielectric layer includes 40 to 99 wt % of barium titanate (BaTiO3) powder having an average grain size of 0.1 ?m to 0.8 ?m and 1 to 60 wt % of barium titanate zirconate (Ba(Ti1-xZrx)O3) having an average grain size of 0.2 to 2.0 ?m.

Abstract: A multilayer ceramic capacitor includes: a ceramic body having dielectric layers laminated in a thickness direction, the dielectric layers having a greater width than a length; an active layer in which capacitance is formed, by including first and second internal electrodes alternately exposed to end surfaces of the ceramic body opposite to each other in a length direction with the dielectric layer interposed therebetween; upper cover layer; lower cover layers being thicker than the upper cover layer; and first and second external electrodes, wherein, when half of thickness of the ceramic body is denoted by A, thickness of the lower cover layer is denoted by B, half of thickness of the active layer is denoted by C, and thickness of the upper cover layer is denoted by D, 1.042?(B+C)/A?1.537 is satisfied.

Abstract: A raw ceramic portion is formed on each of first and second lateral surfaces of a raw ceramic body. The raw ceramic portions contain ceramic particles and more of at least one constituent selected from Ba, Mg, Mn, and a rare-earth element between the ceramic particles than the ceramic section of the raw ceramic body in terms of total amount. The raw ceramic body is fired with the raw ceramic portions thereon. In this way, a ceramic electronic component is obtained that has a main body left after the raw ceramic body is fired with the raw ceramic portions thereon.

Abstract: There is provided an embedded multilayer ceramic electronic component including: a ceramic body including dielectric layers, having first and second lateral surfaces opposing one another, and having a thickness equal to or less than 250 ?m; a first internal electrode and a second internal electrode disposed to face one another with the dielectric layer interposed therebetween; a first external electrode formed on the first lateral surface of the ceramic body and electrically connected to the first internal electrode and a second external electrode formed on the second lateral surface and electrically connected to the second internal electrode; and metal layers formed on the first external electrode and the second external electrode, respectively, and including copper (Cu), wherein when a thickness of the metal layers is tp, tp?5 ?m may be satisfied.

Abstract: There are provided a multilayer ceramic electronic component, and a method of fabricating the same. The multilayer ceramic electronic component includes: a ceramic main body including a dielectric layer; first and second internal electrodes disposed to face each other within the ceramic main body; and a first external electrode and a second external electrode, wherein the first and second external electrodes include a conductive metal and glass, and when at least one of the first and second external electrodes is divided into three equal parts in a thickness direction, an area of the glass in a central part thereof is 35% to 80% of the total area of the central part. A multilayer ceramic electronic component having improved reliability may be implemented by enhancing chip air-tightness.

Abstract: A capacitor and a manufacturing method thereof with improved capacitance density, simplified production process, and/or improved high frequency characteristic without having to form a nano-scale pattern are provided. A capacitor element 12 includes a dielectric layer made of porous oxide substrate, first and second internal electrodes formed within holes of the porous oxide substrate, a first external electrode electrically connected to the first internal electrode, a second external electrode electrically connected to the second internal electrodes.

Abstract: There is provided a multilayer ceramic electronic component including: a ceramic body; a plurality of first internal electrodes formed within the ceramic body; a plurality of second internal electrodes alternately laminated together with the first internal electrodes with the dielectric layer interposed therebetween, insulated from the first internal electrodes, wherein a distance between the plurality of first internal electrodes 121 and the second lateral surface 2 and a distance between the plurality of second internal electrodes 122 and the second lateral surface 2 are different, and when the longest distance between the uppermost internal electrode and the lowermost electrode, among the plurality of first and second internal electrodes 121 and 122, is T1 and the shortest distance therebetween is T2, 0.76?T2/T1?0.97 is satisfied.

Abstract: There is provided a multilayer ceramic electronic component including: a ceramic body including a plurality of dielectric layers; and a plurality of first and second internal electrodes disposed to face each other with the dielectric layer interposed therebetween within the ceramic body and having different widths, wherein three or more of the plurality of first and second internal electrodes form a single block, the blocks are iteratively laminated, and when the longest distance between the uppermost internal electrode and the lowermost internal electrode, among the plurality of first and second internal electrodes 121 and 122, is T1 and the shortest distance therebetween is T2, 0.76?T2/T1?0.97 is satisfied.