Abstract: There is provided a multilayer ceramic capacitor including: a ceramic body including a dielectric layer; a first internal electrode having a first non-pattern portion and a first pattern portion having one end exposed to one or more of surfaces of the ceramic body; a second internal electrode having an overlap region with the first pattern portion with the dielectric layer interposed therebetween and having a second non-pattern portion and a second pattern portion having one end exposed to one or more of surfaces of the ceramic body; and first and second external electrodes electrically connected to the first and second internal electrodes, respectively, wherein the first and second pattern portions have a metal oxide region having a predetermined width from an exposed end portion of a region thereof not connected to the first or the second external electrode, among exposed end portions, toward a central portion thereof, respectively.

Abstract: Disclosed herein are a dielectric composition including a compound represented by the following Chemical Formula A5-xB10O30-x (A necessarily includes Ba, and a portion of Ba is substituted by at least one selected from Sr and Ca; B necessarily includes Nb, and a portion of Nb is substituted by at least one selected from Ta and V; and x satisfies the following equation: 1<x<5) as a main component and a multilayered ceramic capacitor including the same as a dielectric layer.

Abstract: There is provided a multilayer ceramic capacitor including: a ceramic body; a plurality of first and second internal electrodes including first and second body portions and first and second lead out portions, respectively; first and second external electrodes formed on one surface of the ceramic body, respectively; and an insulating layer formed on one surface of the ceramic body and covering exposed portions of the first and second lead out portions, wherein inner connection portions between the first and second body portion and the first and second lead out portions may have a concave curved surface, respectively.

Abstract: A multilayer ceramic electronic component achieves a high electrostatic capacitance and includes an Al inner electrode superior in smoothness and conductivity. The multilayer ceramic electronic component includes a multilayer body including a plurality of stacked ceramic layers and a plurality of inner electrodes arranged along certain interfaces between the ceramic layers and containing Al as a main component, and an outer electrode located on an outer surface of the multilayer body. A surface of the inner electrode is covered with a layer including a noble metal or Ti as a main component.

Abstract: A capacitor forming method includes forming an electrically conductive support material over a substrate, with the support material containing at least 25 at % carbon. The method includes forming an opening through at least the support material where the opening has an aspect ratio of at least 20:1 within a thickness of the support material. After forming the opening, the method includes processing the support material to effect a reduction in conductivity, and forming a capacitor structure in the opening.

Abstract: A capacitive device includes a first capacitor including a first wiring layer, a first dielectric film, a first conductive layer, a first insulating layer on the first capacitor, a second capacitor on the first insulating layer including a second conductive layer, a second dielectric film, and a third conductive layer, a second insulating layer on the second capacitor, a second wiring layer on the second insulating layer including first and second connection wires, a first via connecting the first wiring layer to the second conductive layer, a second via connecting the third conductive layer to the second wiring layer, a third via connecting the first connection wire to the first conductive layer, and a fourth via connecting the second connection wire to the first wiring layer.

Abstract: Provided is a flexible multilayer thin film capacitor using a flexible metal substrate, including: a metal substrate; a metal oxide layer formed on the whole surface of the metal substrate; a plurality of first internal electrode layers selectively applied on a first surface of the metal substrate using a metal material; a plurality of dielectric layers formed to be sequentially multi-layered on the whole surface of the first internal electrode layers using a dielectric material; a plurality of second internal electrode layers selectively applied on the dielectric layers using a metal material; a protecting layer applied on a surface of one of the plurality of second internal electrode layers; and a single pair of external electrodes connected to contact with the plurality of first internal electrode layers and the plurality of second internal electrode layers, respectively, and soldered on conductive inter-layer pads of a printed circuit board.

Abstract: There is provided a multilayer ceramic capacitor including: a ceramic body; an active layer including a plurality of first and second internal electrodes formed to be alternately exposed to both end surfaces of the ceramic body, disposed vertically on upper and lower surfaces of the ceramic body and forming capacitance; an upper cover layer formed upwardly of the active layer; a lower cover layer formed downwardly of the active layer and having a thickness greater than that of the upper cover layer; and first and second external electrodes covering both end surfaces of the ceramic body, wherein the active layer includes a first block in which a first region I and a second region II formed, and a second block in which a third region III, and a fourth region IV formed.

Abstract: A multilater ceramic capacitor includes: a ceramic body in which a plurality of dielectric layers are laminated; and an active layer including a plurality of first and second internal electrodes formed to be alternately exposed to both end surfaces of the ceramic body with the dielectric layer interposed therebetween, and forming capacitance. An upper cover layer is formed on an upper portion of the active layer; a lower cover layer is formed on a lower portion of the active layer and having a thickness greater than that of the upper cover layer. First and second external electrodes cover both end surfaces of the ceramic body. Specific sizing of ceramic body and electrodes is defined.

Abstract: There is provided a multilayered ceramic capacitor including: a ceramic body; a plurality of first and second internal electrodes having first and second lead-out portions overlapped with each other, respectively, and exposed to one surface of the ceramic body; first and second external electrodes formed on one surface of the ceramic body and electrically connected to the first and second lead-out portions, respectively; and an insulating layer formed on one surface of the ceramic body to cover exposed portions of the first and second lead-out portions, wherein the first lead-out portion has a first overlap increase part of which a forward edge has an inclined surface, and the second lead-out portion has a second overlap increase part of which a forward edge has an inclined surface.

Abstract: A multilayer polymer dielectric film includes a stack of coextruded, alternating first dielectric layers and second dielectric layers that receive electrical charge. The first dielectric layers include a first polymer material and the second dielectric layers include a second polymer material different from the first polymer material. The first polymer material has a permittivity greater than the second polymer material. The second polymer material has a breakdown strength greater than the first polymer material. Adjoining first dielectric layers and second dielectric layers define an interface between the layers that delocalizes electrical charge build-up in the layers. The stack has substantially the crystallographic symmetry before and during receiving electrical charge.

Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic body having first and second main surfaces, first and second side surfaces, and first and second end surfaces; a first block including first and second internal electrodes having overlap regions which form a capacitance part; one or more second blocks each including third and fourth internal electrodes having overlap regions which form a capacitance part; a first external electrode connected to the first and third lead out portions and a second external electrode connected to the second and fourth lead out portions; and an insulating layer formed on the first side surface of the ceramic body, wherein the second blocks are disposed on upper and lower parts of the first block.

Abstract: An improved capacitor utilizing stacked MLCC's is provided. The capacitor comprising at least one MLCC sandwiched between a first lead and a second lead. Each lead comprises at least one integral lead crimp.

Abstract: A multilayer ceramic electronic component including: a ceramic main body including a dielectric layer and having first and second main surfaces opposing one another, first and second lateral surfaces opposing one another, and first and second end surfaces opposing one another; a first internal electrode formed within the ceramic main body, including a capacitance formation part having an overlap region to form capacitance and a first lead out portion extending from the capacitance formation part so as to be exposed to the first lateral surface; a second internal electrode alternately laminated together with the first internal electrode, having a second lead out portion extending from the capacitance formation part so as to be exposed to the first lateral surface; first and second external electrodes; and insulating layers.

Abstract: A multilayer ceramic capacitor includes a ceramic body; first and second internal electrodes including first and second body parts overlapped with each other and first and second lead-out parts having an overlap region and exposed to one surface of the ceramic body; first and second external electrodes formed on one surface of the ceramic body; and an insulating layer formed on one surface of the ceramic body, wherein first and second connection surfaces extended from end portions of the first and second body parts to end portions of the first and second lead-out parts are inclined, and when half of length of the internal electrode is defined as A and length from a center of the ceramic body to a starting point of the connection surface is defined as B, B/A satisfies 0.03?B/A?0.90.

Abstract: There is provided a multilayer ceramic capacitor including: a ceramic body in which a plurality of dielectric layers are stacked; a plurality of first and second internal electrodes alternately formed on the plurality of dielectric layers and including first and second lead-out parts having an overlap area exposed to one surface of the ceramic body, respectively; first and second external electrodes formed on one surface of the ceramic body and electrically connected to the first and second lead-out parts, respectively; and a first insulating layer formed on one surface of the ceramic body to cover exposed portions of the first and second lead-out parts, wherein the first and second lead-out parts are formed to have concave-convex portions alternating with each other in the overlap area therebetween.

Abstract: Disclosed herein is a multilayer ceramic device including a device body having lateral surfaces and circumferential surfaces connecting the lateral surfaces, an internal electrode disposed in a length direction of the device body within the device body, an external electrode having a front portion covering the lateral surface and a band portion extending from the front portion to cover a portion of the circumferential surface, and a reinforcement pattern extending from the lateral surface toward the interior of the device body and having a length longer than a width of the band portion.

Abstract: There is provided a stacked-type multilayer ceramic electronic component including: a ceramic body, a plurality of first and second internal, and first and second external electrodes formed on both surfaces of the ceramic element opposing one another; and first and second metal frames disposed to face one another and allowing the first and second external electrodes of the ceramic body to be attached thereto, respectively, wherein two or more ceramic bodies are attached between the first and second metal frames in a length direction of the first and second metal frames with an interval therebetween, and the respective ceramic bodies have different levels of capacitance.

Abstract: There is provided a multilayer ceramic electronic component, including a ceramic body including dielectric layers, and having first and second main surfaces, first and second side surfaces and first and second end surfaces; first and second internal electrodes having overlap regions forming a capacitance part, the first internal electrodes having a first lead out portion to be exposed to the first side surface, and being alternately laminated with the second internal electrodes while being insulated therefrom, the second internal electrodes having a second lead out portion; first and second external electrodes connected to the first and second lead out portions, respectively; and an insulating layer formed on the first side surface, wherein a length of the first lead out portion is longer than that of the second lead out portion and the capacitance part has different distances from the first side surface.

Abstract: There is provided a multilayer ceramic capacitor, and a method of manufacturing the same, the multilayer ceramic capacitor including: a ceramic body; a first internal electrode; a second internal electrode; a first external electrode; a second external electrode; and an insulating layer.

Abstract: A laminated ceramic capacitor that includes a laminated body that has dielectric ceramic layers including crystal grains and crystal grain boundaries and has internal electrode layers; and external electrodes on the surface of the laminated body and electrically connecting the internal electrode layers exposed at the surfaces of the laminated body. When a direct-current voltage is applied to the laminated ceramic capacitor, the voltage/current curve has a critical point dividing the curve into a first area on the lower-voltage side and a second area on the higher-voltage side, an electric field obtained by dividing the critical voltage at the critical point by the thickness of one of the dielectric ceramic layers when the voltage (V)/current (I) characteristics are measured at 25° C. is 10 V/?m or more, and the voltage/current curve has a slope of 3 or less in the second area.

Abstract: A monolithic capacitor includes a laminated body including stacked dielectric layers and substantially in the shape of a rectangular parallelepiped, and including a first surface being a mounting surface, a second surface opposite to the first surface, opposing third and fourth surfaces orthogonal to the first and second surfaces, and opposing fifth and sixth surfaces orthogonal to the first to fourth surfaces; capacitor electrodes disposed in the laminated body and each including a capacitive portion and a lead portion extending therefrom to at least one surface of the laminated body, the capacitive portions facing each other with dielectric layers interposed therebetween; and first and second outer electrodes disposed on at least one surface of the laminated body and connected to the lead portions. A gap between the first surface and the capacitive portions is greater than a gap between the second surface and the capacitive portions.

Abstract: There is provided an embedded multilayer ceramic electronic component, including: a ceramic body including dielectric layers; first and second internal electrodes facing each other with the dielectric layers interposed therebetween; a first external electrode and a second external electrode formed on external surfaces of the ceramic body, the first external electrode being electrically connected to the first internal electrodes and the second external electrode being electrically connected to the second internal electrodes; and a plating layer formed on the first external electrode and the second external electrode, wherein a surface roughness of the ceramic body is 500 nm or greater and not greater than a thickness of a ceramic cover sheet and a surface roughness of the plating layer is 300 nm or greater and not greater than a thickness of the plating layer.

Abstract: There is provided a multi-layered ceramic electronic component including: a ceramic body including a dielectric layer and having first and second main surfaces, first and second side surfaces, and first and second end surfaces; a first internal electrode having an overlapping region to form a capacitance formation part and exposed to the first and second side surfaces, and including a first lead-out part; a second internal electrode alternately multi-layered with the first internal electrode to be exposed to the first and second side surfaces, and insulated from the first internal electrode, and including the second lead-out part; first and second external electrodes; and insulation layers formed on the first and second side surfaces, the first and second lead-out parts being regions in which the first and second internal electrodes are not overlapped with each other.

Abstract: A laminated chip electronic component includes: a ceramic body including internal electrodes and dielectric layers; external electrodes formed to cover both end portions of the ceramic body in a length direction; an active layer in which the internal electrodes are disposed in an opposing manner, while having the dielectric layers interposed therebetween, to form capacitance; and upper and lower cover layers formed on upper and lower portions of the active layer in a thickness direction, the lower cover layer having a thickness greater than that of the upper cover layer.

Abstract: There is provided a multilayered ceramic capacitor including: a ceramic body in which a plurality of dielectric layers are stacked; an active layer including a plurality of first and second internal electrodes formed to be alternately exposed to both end surfaces of the ceramic body, having the dielectric layer interposed therebetween, to form capacitance; an upper cover layer formed above the active layer, a lower cover layer formed below the active layer and being thicker than the upper cover layer; and first and second external electrodes formed to cover both end surfaces of the ceramic body, wherein a ratio of an area Y of a region overlapped between the first and second internal electrodes to a total area X of the active layer and the upper cover layer on a cross section of the ceramic body in length-thickness (L-T) directions is in a range of 0.5 to 0.9.

Abstract: In a multilayer ceramic electronic component, when a region of a ceramic body in layers where neither of a first internal electrode and a second internal electrode is provided as viewed in a direction in which a plurality of ceramic layers are stacked on one another is defined as a non-effective layer region, a dummy lead-through conductor is arranged in the non-effective layer region so as to lead to at least two locations on portions of superficies of the ceramic body and be electrically connected to a second external electrode. When a conductive medium is brought into contact with one of a plurality of exposed edges of the dummy lead-through conductor, a current is also applied to the other exposed edges.

Abstract: There is provided a multilayered ceramic capacitor, including a ceramic body, an active layer including a plurality of first and second internal electrodes alternately exposed through both end surfaces of the ceramic body while having the dielectric layer therebetween, to form capacitance; upper and lower cover layers formed above and below the active layer; first and second external electrodes covering both end surfaces of the ceramic body; a plurality of first and second dummy electrodes extended from the first and second external electrodes; and a plurality of piezoelectric members connecting the first internal electrode and the first dummy electrode or the second internal electrode and the second dummy electrode, inside the active layer, the piezoelectric members having a higher dielectric constant than the dielectric layer.

Abstract: Multilayer ceramic electronic component includes: a ceramic body including dielectric layers and having first and second main surfaces, first and second side surfaces, and first and second end surfaces; a first internal electrode including a capacitance forming portion having an overlap region for forming capacitance and a first lead-out portion extended from the capacitance forming portion to be exposed to the first side surface; a second internal electrode alternately stacked with the first internal electrode, having the dielectric layer interposed therebetween, insulated from the first internal electrode, and having a second lead-out portion extended from the capacitance forming portion to be exposed to the first side surface; first and second external electrodes connected to the first and second lead-out portions, respectively; an insulation layer.

Abstract: There is provided a multi-layered ceramic electronic component including a ceramic body including a dielectric layer, first and second internal electrodes disposed within the ceramic body so as to face each other, having the dielectric layer interposed therebetween, and a first external electrode electrically connected to the first internal electrodes and a second external electrode electrically connected to the second internal electrodes, wherein the first and second external electrodes include a conductive metal and glass and further include a second phase material occupying an area of 1 to 80% with respect to an area of glass in the first and second external electrodes.

Abstract: This disclosure provides (a) methods of making an oxide layer (e.g., a dielectric layer) based on titanium oxide, to suppress the formation of anatase-phase titanium oxide and (b) related devices and structures. A metal-insulator-metal (“MIM”) stack is formed using an ozone pretreatment process of a bottom electrode (or other substrate) followed by an ALD process to form a TiO2 dielectric, rooted in the use of an amide-containing precursor. Following the ALD process, an oxidizing anneal process is applied in a manner is hot enough to heal defects in the TiO2 dielectric and reduce interface states between TiO2 and electrode; the anneal temperature is selected so as to not be so hot as to disrupt BEL surface roughness. Further process variants may include doping the titanium oxide, pedestal heating during the ALD process to 275-300 degrees Celsius, use of platinum or ruthenium for the BEL, and plural reagent pulses of ozone for each ALD process cycle.

Abstract: There is provided a multilayered ceramic capacitor, including: a ceramic body having a plurality of dielectric layers laminated therein; an active layer including a plurality of internal electrodes having the respective dielectric layers interposed therebetween; an upper cover layer; a lower cover layer; external electrodes; and a plurality of dummy electrodes, wherein, when A is defined as ½ of an overall thickness of the ceramic body, B is defined as the thickness of the lower cover layer, C is defined as ½ of an overall thickness of the active layer, and D is defined as the thickness of the upper cover layer, a ratio of deviation between a center portion of the active layer and a center portion of the ceramic body, (B+C)/A, satisfies 1.063?(B+C)/A?1.745.

Abstract: There is provided an array type multilayer ceramic electronic component, including: a ceramic element having a plurality of dielectric layers laminated therein; first and second external electrodes spaced apart from each other in a length direction on one surface and the other surface opposing the one surface of the ceramic element; and a plurality of internal electrode laminated parts including a plurality of first and second internal electrodes opposing each other within the ceramic element and connected to the first and second external electrodes, wherein a portion of the internal electrode laminated parts is different from other internal electrode laminated parts thereof in terms of the number of laminations of the first and second internal electrodes.

Abstract: An method of forming a metal foil coated ceramic and a metal foil capacitor is provided in a method of making a metal foil coated ceramic comprising providing a metal foil; applying a ceramic precursor to the metal foil wherein the ceramic precursor comprises at least one susceptor and a high dielectric constant oxide and an organic binder, and sintering the ceramic precursor with a high intensity, high pulse frequency light energy to form the metal foil ceramic.

Abstract: An element body has a substantially rectangular parallelepiped shape whose length in a longitudinal direction and length in a width direction are larger than a length in a height direction. The element body has first and second principal faces opposed to each other in the height direction, first and second side faces opposed to each other in the width direction, and third and fourth side faces opposed to each other in the longitudinal direction. A plurality of internal electrodes are alternately arranged in the element body so as to be opposed to each other in the height direction. Each internal electrode has a main electrode portion and a leading portion. Each of a plurality of terminal electrodes has a first electrode portion arranged on the first principal face, and a second electrode portion arranged on the first side face and connected to the leading portion of each corresponding internal electrode.

Abstract: An electrical component includes a ceramic base body. The ceramic base body includes several ceramic layers including a function layer and a composite layer bordering the function layer. The composite layer can include a zirconium oxide-glass filler mixture.

Abstract: A multilayer electrical component is presented having at least one base body, which includes a stack of dielectric layers and electrode layers arranged one upon the other, wherein the multilayer component additionally has a resistor and a decoupling layer, wherein the decoupling layer chemically isolates the resistor from at least one portion of a multilayer element.

Abstract: Improved flow through capacitors (FTC) and methods for purifying aqueous solutions are disclosed. For example, FTC electrodes that are activated with a poly-electrolyte are disclosed.

Abstract: There is provided a multilayered ceramic capacitor, including: a ceramic body; an active layer including a plurality of first and second internal electrodes; an upper cover layer; a lower cover layer, the lower cover layer being thicker than the upper cover layer; a dummy electrode formed inside at least one of the upper and lower cover layers; and first and second external electrodes, wherein, when A is defined as ½ of an overall thickness of the ceramic body, B is defined as a thickness of the lower cover layer, C is defined as ½ of an overall thickness of the active layer, and D is defined as a thickness of the upper cover layer, a ratio of deviation between a center of the active layer and a center of the ceramic body, (B+C)/A, satisfies 1.063?(B+C)/A?1.745.

Abstract: In a monolithic ceramic electronic component, given that an interval between outer-layer dummy conductors adjacent to each other in an outer layer portion is d1, and that an interval between first and second inner electrodes adjacent to each other in an inner layer portion is d2, 1.7d2?d1 is satisfied. By reducing a density of the outer-layer dummy conductors in the outer layer portion on that condition, pressing of the inner electrodes through the outer-layer dummy conductors is relieved in a pressing step before firing. As a result, a distance between the inner electrodes can be prevented from being locally shortened. It is hence possible to effectively reduce and prevent degradation of reliability of the monolithic ceramic electronic component, e.g., a reduction of BDV.

Abstract: A method of manufacturing an embedded passive device for a microelectronic application comprises steps of providing a substrate (110, 210, 310), nanolithographically forming a first section (121, 221, 321) of the embedded passive device over the substrate, and nanolithographically forming subsequent sections (122, 222, 322) the embedded passive device adjacent to the first section. The resulting embedded passive device may contain features less than approximately 100 nm in size.

Abstract: There is provided a multilayered ceramic electronic component including: a ceramic body including dielectric layers having an average thickness of 0.6 ?m or less; and first and second internal electrodes, wherein the ceramic body includes a capacitance formation part and a non-capacitance formation part provided on at least one surface of upper and lower surfaces of the capacitance formation part, and when the capacitance formation part is divided into three regions in a thickness direction of the ceramic body, in a central region among the three regions, dielectric grains have an average particle size of 150 nm or less, and the number of dielectric grains per layer is 4 or more, and in upper and lower regions, dielectric grains have an average particle size of 200 nm or less, respectively, and the number of dielectric grains per layer is 3 or more.

Abstract: In a multilayer ceramic electronic component, dummy electrodes are located in margin regions. In a region between an extension line of a side of a facing portion of an internal electrode facing a side surface of an element body and a side of an extending portion of the internal electrode facing the side surface, the dummy electrode is arranged not to extend to the extension line of the side facing the side surface. The dummy electrode includes a plurality of electrode pieces linearly extending in the direction parallel or substantially parallel to the side surface.

Abstract: A ceramic multilayer surface-mount capacitor with inherent crack mitigation void patterning to channel flex cracks into a safe zone, thereby negating any electrical failures.

Abstract: There is provided a capacitor, including: a first substrate: a first capacitance generation part formed on the first substrate; a protective layer formed on the first capacitance generation part; a second capacitance generation part formed on the protective layer; and a second substrate formed on the second capacitance generation part.

Abstract: The present invention relates to a multilayer ceramic capacitor and a printed circuit board including the same that can minimize thickness deviations of an external electrode and a multilayer ceramic. A multilayer ceramic capacitor according to an embodiment of the present invention includes a multilayer ceramic and external electrodes formed on both sides of the multilayer ceramic, wherein |Tmax?Tmin| may be less than 10 ?m, and |CTmax?CTmin| may be less than 20 ?m. (Here, Tmax is a maximum thickness of the external electrodes in a via processing area, Tmin is a minimum thickness of the external electrodes in the via processing area, CTmax is a maximum thickness of the multilayer ceramic capacitor in the via processing area, and CTmin is a minimum thickness of the multilayer ceramic capacitor in the via processing area.

Abstract: A multilayered ceramic electronic component includes: a ceramic element having a plurality of dielectric layers laminated therein; first inner electrodes formed on the dielectric layers disposed in upper and lower portions in the ceramic element, the width of a portion of each of the first inner electrodes exposed from one end face of the ceramic element being less than that of a portion thereof disposed within the ceramic element; and second inner electrodes formed on the dielectric layers disposed in the middle portion in the ceramic element, the width of a portion of each of the second inner electrodes exposed from one end face of the ceramic element being equal to that of a portion thereof disposed within the ceramic element.

Abstract: The application discloses novel internal structures of energy conditioners, assemblies of external structures of energy conditioners and mounting structure, and novel circuits including energy conditioners having A, B, and G master electrodes.

Abstract: An element array and a footprint layout for an element array are disclosed. The element array can have a rectangular configuration defining two side surfaces and two end surfaces. The element array can include a plurality of stacked dielectric-electrode layers. One dielectric-electrode layer can include a plurality of element electrodes, such as eight element electrodes. Each of the plurality of element electrodes forms a part of an individual element for the element array. The element array device can further include a common electrode. The common electrode is used as part of each of the individual elements for the element array. The common electrode can include a lead for termination to one of the two end surfaces of the element array or, in a particular embodiment, to one of the two side surfaces of the element array.

Abstract: There are provided a dielectric composition and a multilayer ceramic electronic component manufactured using the same, the dielectirc composition including dielectric grains having a perovskite structure represented by ABO3, a portion of the dielectric grains having a core-shell structure, wherein dielectric grains having an average length of a core equal to or less than 250 nm and a ratio of the average length of the core to an average length of the dielectric grain below 0.8 may be 50% or more of the portion of dielectric grains having a core-shell structure, so that the multilayer ceramic electronic component manufactured using the dielectric composition can have excellent reliability and secure a high dielectric constant.