Abstract: A capacitor comprises a body of dielectric material in which an anode and a cathode are arranged in a stack. A capacitance-forming layer of the dielectric material is arranged between the anode and the cathode. The capacitor further comprises an electro-mechanical connection, which comprises a hole which extends into the body in the direction of the stack. The hole includes an electrical connector. The electrical connector is in electrical contact with either the anode or the cathode, comprises a compliant element, and is suitable for holding a contact pin. The compliant element is configured to decouple the body from mechanical forces applied to the contact pin. The compliant element reduces mechanical stresses experienced by the body of the capacitor. Also provided is a capacitor assembly comprising two or more such capacitors; a kit for assembling such capacitors, and the use of an electrical termination to protect a capacitor from stress.

Abstract: A ceramic electronic device includes: a multilayer chip in which each of internal electrode layers and each of dielectric layers are alternately stacked, wherein the multilayer chip has a first capacity region having a first electrostatic capacity C1 and a first inductance L1 and a second capacity region having a second electrostatic capacity C2 and a second inductance L2, wherein the first electrostatic capacity C1, the first inductance L1, the second electrostatic capacity C2 and the second inductance L2 satisfy (C1·L1)/(C2·L2)<0.5 or 1.9<(C1·L1)/(C2·L2).

Abstract: A ceramic electronic device includes: a multilayer chip in which each of internal electrode layers and each of dielectric layers are alternately stacked, wherein the multilayer chip has a first capacity region having a first electrostatic capacity C1 and a first inductance L1 and a second capacity region having a second electrostatic capacity C2 and a second inductance L2, wherein the first electrostatic capacity C1, the first inductance L1, the second electrostatic capacity C2 and the second inductance L2 satisfy (C1·L1)/(C2·L2)<0.5 or 1.9<(C1·L1)/(C2·L2).

Abstract: A DC link capacitor includes a plurality of wound capacitors, each having a first connection pole and a second connection pole, a first current-tapping element by which the first connection poles are contacted, and a second current-tapping element by which the second connection poles are contacted. First wound capacitors, of the plurality of wound capacitors, are arranged in a first row and oriented such that the first connection poles are arranged on a first side of the DC link capacitor and the second connection poles are arranged on a second side of the DC link capacitor. Second wound capacitors of the plurality of wound capacitors are arranged in a second row, where the first and second rows are arranged parallel to each other in a common plane, and where the second wound capacitors are oriented such that the first connection poles are arranged on the second side of the DC link capacitor and the second connection poles are arranged on the first side of the DC link capacitor.

Abstract: A multilayer ceramic electronic component includes an element body, a via-hole electrode, and a terminal electrode. The element body includes internal electrode layers and insulation layers alternately laminated in a lamination direction. The via-hole electrode penetrates from an upper surface of the element body thereinto and is connected with at least one of the internal electrode layers. The terminal electrode is formed on the upper surface of the element body and connected with the via-hole electrode. The via-hole electrode is embedded in a via hole formed on the element body so that a predetermined clearance space is formed in the via hole.

Abstract: An electric power conversion apparatus includes at least one semiconductor module, a capacitor, a pair of positive and negative busbars and an insulator. The positive busbar includes a positive busbar base protruding from the capacitor in a Y direction and at least one positive busbar terminal extending perpendicular to an X direction. The negative busbar includes a negative busbar base protruding from the capacitor in the Y direction and at least one negative busbar terminal extending perpendicular to the X direction. The positive and negative busbar bases are arranged to have their major surfaces facing each other in a Z direction. The positive and negative busbar terminals at least partially overlap each other in the X direction with the insulator interposed therebetween. The at least one semiconductor module has a pair of positive and negative power terminals connected respectively to the positive and negative busbar terminals.

Abstract: A brush assembly includes a circuit board, at least two brushes, power connecting terminals for connecting with an external power supply, and a power supply branch circuit connected in series between a corresponding one of the power connecting terminals and a corresponding one of the brushes. The brush assembly further comprises an EMI suppressor connected between the power supply branch circuit and ground. The EMI suppressor is an axial capacitor formed by a conductor core, a cover, and a filling medium. The cover is attached around the conductor core, and the filling medium is filled between the conductor core and the cover. A motor utilizing the brush assembly is also provided.

Abstract: An electronic component package includes: an electronic component that includes a body, the body having a first main surface that is convexly curved along a longitudinal direction, and a second main surface that is concavely curved along the longitudinal direction, a distance between the first main surface and the second main surface being 50 ?m or less; a housing portion that includes a plurality of recesses, each of the recesses including a take-out opening and housing the electronic component with the first main surface facing toward the take-out opening; and a sealing portion that covers the take-out openings of the plurality of recesses.

Abstract: A power conversion apparatus includes a capacitor and a heat dissipation member for cooling the capacitor. The capacitor and the heat dissipation member are pressed in an arranging direction in which the capacitor and the heat dissipation member are arranged. The capacitor includes a capacitor element which includes a dielectric body and a metal layer formed on a surface of the dielectric body, an electrode part connected to the metal layer and a bus bar connected to the electrode part. Part of the bus bar is interposed in the arranging direction between the heat dissipation member and the capacitor element.

Abstract: A packaging structure and method for surface mount integrated circuits reduces electrochemical migration (ECM) problems by including one or more cleaning channels to effectively and efficiently remove flux residue that may otherwise remain lodged in gaps between the surface mount package and the printed circuit board. A cleaning channel may be formed along a bottom surface of the surface mount package (i.e., the surface facing the printed circuit board), or along a portion of a top surface of the printed circuit board. In either case, the inclusion of a cleaning channel enlarges the gap between the bottom surface of the surface mount package and the printed circuit board and creates a path for contaminants to be flushed out during a cleaning process.

Abstract: A circuit structure that includes a plurality of stacked conductor layers separated from each other by respective dielectric layers. The conductor layers may include a first set of conductor layers made of a first type conductor material and a second set of conductor layers made of a second type conductor material different from the first. A pair of conductor posts may traverse the stacked conductor layers. A first post may be electrically connected to the first set of conductor layers and electrically insulated from the second set of conductor layers. A second post electrically connected to the second set of conductor layers and electrically insulated from the first set of conductor layers.

Abstract: A capacitor is provided, which allows a user to readily change or adjust its capacitance value. The capacitor includes a dielectric film, which includes first and second conductor layers disposed on opposite surfaces thereof, and which is wound into a rod shape. First and second electrodes are led out from the first and second conductor layers, respectively. At least one of the first and second conductor layers includes an area-changeable conductor pattern, which is disposed (e.g., exposed) on an outer circumference side of the capacitor wound into the rod shape to receive physical treatment (e.g., cutting, connecting) from outside to thereby change the size of a conductor area of the at least one of the first and second conductor layers. Thus, the physical treatment changes the conductor area of the conductor layers, to thereby selectively set or adjust the capacitance value of the capacitor.

Abstract: An electric storage battery including a jelly roll type electrode assembly having a mandrel. The mandrel includes a positive portion, a negative portion and a removable portion. The mandrel can be planar, having two faces with grooves on the positive and negative portions. The grooves are dimensioned to accommodate positive and negative feedthrough pins. The mandrel is welded to the feedthrough pins by using a laser beam incident on the opposite face of the mandrel from the face on which the grooves and pins are located. The laser beam melts the mandrel such that molten mandrel material fills the grooves welding the feedthrough pins in place. Electrodes are wrapped around the mandrel using the removable portion to wind the mandrel. The removable portion can be detached. The mandrel allows tighter wrapping of the jelly roll assembly and increasing battery miniaturization.

Abstract: A system and method for sealing a capacitor bottom in a filtered feedthrough. The feedthrough comprises a ferrule, a capacitor, at least one terminal pin and a support structure. The support structure includes at least one projection that extends into an aperture of the capacitor. The projection includes an opening through which the at least one terminal pin extends such that, in an assembled state, the terminal pin extends through the opening of the projection and the aperture of the capacitor.

Abstract: A design for an improved metal-on-metal capacitor design is described. The design includes a substantially diagonal feedline (411, 412, 413) in each metal layer. Each metal layer (21, 22, 23) comprises two sets of metal fingers which are interleaved. Each set of fingers comprises two subsets of fingers and the subsets of fingers are arranged at right angles to each other. Fingers in a first of the two sets are all connected to the diagonal feedline, while fingers in the other set are connected together via fingers at the periphery of the device. The design is repeated in adjacent layers, where the design may be identical or rotated (e.g by 180°) between adjacent metal layers.

Abstract: A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.

Abstract: An electrical component includes a main body, a metallic contact structure, which is in direct contact with the main body, and an electrically insulating passivation layer provided with an opening. The metallic contact structure is connected to an external contact-making element through the opening. Furthermore, the external contact-making element is covered and enclosed by a flexible metal composite layer. A method for producing an electrical component is also specified.

Abstract: A method of making a sintered article in which a solid object is embedded includes forming a green body of compressed particles with the solid body is partially embedded. The green body includes an opening across which the solid body extends. The green body is sintered to form a sintered body and the opening permits deformation of the solid body in response to stress applied during the sintering process. A sintered article in which a solid body is at least partially embedded includes an opening. The solid body extends across the opening so that the solid body can deform within the opening. The opening in the solid body prevents distortion of the sintered body from a planar configuration during sintering, even when the green body is relatively thin.

Abstract: A feedthrough of an electrolyte or other capacitor, in particular for use in a medical-electronic implant, is provided having a terminal pin which has a section which can be soft soldered at least in the interior of the electrolyte capacitor, an aluminum flange enclosing the terminal pin, and a glass solder plug which hermetically seals the terminal pin in relation to the aluminum flange.

Abstract: A modular EMI filtered terminal assembly for an active implantable medical device (AIMD) includes a hermetic terminal subassembly having at least one conductor extending through an insulator in non-conductive relation with the AIMD housing, and a feedthrough capacitor subassembly disposed generally adjacent to the hermetic terminal assembly. The feedthrough capacitor subassembly includes a conductive modular cup conductively coupled to the AIMD housing, and a feedthrough capacitor disposed within the modular cup. A first electrode plate or set of electrode plates is conductively coupled to the conductor, and a second electrode plate or set of electrode plates is conductively coupled to the modular cup.

Abstract: A connector assembly for an implantable medical device includes a plurality of feedthroughs mounted in a conductive array plate, each feedthrough in the plurality of feedthroughs including a feedthrough pin electrically isolated from the conductive array plate by an insulator and an electronic module assembly including a plurality of conductive strips set in a non-conductive block. The plurality of conductive strips is in physical and electrical contact with the feedthrough pins at an angle of less than 135 degrees. The connector assembly further includes at least one circuit, the circuit including a plurality of conductors corresponding to the plurality of feedthroughs. The plurality of conductors of the circuit is in physical and electrical contact with a corresponding one of the conductive strips of the plurality of conductive strips of the electronic module assembly at an angle of less than 135 degrees.

Abstract: Capacitive circuits are implemented with desirable quality factors in various implementations. According to an example embodiment, a fringe capacitor includes two capacitive circuits (e.g., plates), respectively having a plurality of capacitive fingers extending from an end structure, and respectively having a connecting pin that is adjacent the connecting pin of the other capacitive circuit, on a common side fringe capacitor. The capacitive fingers are arranged in stacked layers, with vias connecting the fingers in different layers back to the connecting pins.

Abstract: The disclosure relates generally to capacitor structures and more particularly, to capacitor structures having interdigitated metal fingers. Metal finger capacitors may have at least one layer, the at least one layer including: a first set of fingers, wherein each finger of the first set includes an end integrally connected to a bus segment of a first bus; a second set of fingers interdigitated with the first set of fingers, wherein each finger of the second set includes an end integrally connected to a bus segment of a second bus; an in port integrally connected to the first bus and an out port integrally connected to the second bus; and wherein a width of the first and second bus is non-uniform across a length of the first and second bus.

Abstract: A capacitor is provided having an outer shell. A capacitor film member is disposed within the outer shell. A conductor member is disposed within the outer shell in thermal contact with the capacitor film member. A collet member is slidingly coupled to the conductor member.

Abstract: A capacitive element that can efficiently reduce high-frequency noise generated in a circuit is provided. A capacitive element 1 includes a capacitive formation portion 100, which is formed in the shape of a loop to separate the inside from the outside. The capacitive formation portion 100 includes an electrode 110, an opposite electrode 111, and a dielectric layer 120. One or more outgoing terminals (one or more outer circumference outgoing terminals 140, and one or more internal circumference outgoing terminals 130) are provided at the outer and inner circumferences of the electrode 110, respectively. A printed wiring board is made by mounting the capacitive element inside the board or on the surface of the board. A semiconductor package is made by putting the capacitive element 1 on a target semiconductor circuit portion. Moreover, a semiconductor circuit is made by placing the capacitive element on a target functional circuit portion 301.

Abstract: A system and method for sealing a capacitor bottom in a filtered feedthrough. The feedthrough comprises a ferrule, a capacitor, at least one terminal pin and a support structure. The support structure includes at least one projection that extends into an aperture of the capacitor. The projection includes an opening through which the at least one terminal pin extends such that, in an assembled state, the terminal pin extends through the opening of the projection and the aperture of the capacitor.

Abstract: A filtered feedthrough assembly includes a capacitor comprising a top portion, a bottom portion, an outer diameter portion and an inner diameter portion. The inner diameter portion defines at least one aperture extending from the top portion to the bottom portion. A conductive annular member is placed onto the top portion around the at least one aperture. A feedthrough pin extends through each of the apertures and is soldered to the inner diameter portion of the capacitor by application of a solder preform upon the conductive pad of conductive material.

Abstract: A feed-through capacitor is constructed in a printed wiring board using alternating layers of metal capacitive layers and plastic dielectric layers of the printed wiring board. The large number of layers, the avoidance of ceramic layers and the flexible geometry of this device allow it to be used in many applications, particularly in those involving high power high current. Also, because it utilizes a printed wiring board, the capacitor can be made in numerous sizes and shapes.

Abstract: Disclosed are a semiconductor integrated circuit chip, a multilayer chip capacitor, and a semiconductor integrated circuit chip package. The semiconductor integrated circuit chip includes a semiconductor integrated circuit chip body, an input/output terminal disposed on the outside of the semiconductor integrated circuit chip body, and a decoupling capacitor disposed at a side face of the semiconductor integrated circuit chip body and electrically connected to the input/output terminal. The semiconductor integrated circuit chip cab be obtained, which can maintain an impedance of a power distribution network below a target impedance in a wide frequency range, particularly at a high frequency, by minimizing an inductance between a decoupling capacitor and a semiconductor integrated circuit chip.

Abstract: An electromagnetic bandgap structure and a printed circuit board that solve a mixed signal problem are disclosed. In accordance with embodiments of the present invention, the electromagnetic bandgap structure includes a first metal layer; a first dielectric layer, stacked in the first metal layer; a second metal layer, stacked in the first dielectric layer, and having a holed formed at a position of the second dielectric layer; a second dielectric layer, stacked in the second metal layer; a metal plate, stacked in the second dielectric layer; a first via, penetrating the hole formed in the second metal layer and connecting the first metal layer and the metal plate; a third dielectric layer, stacked in the metal plate and the second dielectric layer; a third metal layer, stacked in the third dielectric layer; and a second via, connecting the second metal layer to the third metal layer.

Abstract: A feedthrough capacitor assembly for attachment to a mount having an opening is disclosed. The assembly includes a feedthrough terminal adapted for insertion through said opening for coupling a signal from a first side of the mount to a second side of the mount. The assembly includes a first conductive region extending about and electrically coupled to the feedthrough terminal and a second conductive region extending about the first conductive region. A plurality of capacitors are electrically coupled between the first conductive region and the second conductive region. The plurality of capacitors are arranged about the feedthrough terminal with each capacitor having about the same capacitance as each of the other capacitors.

Abstract: A capacitor includes a pair of electrically conductive layers; a plurality of substantially or nearly tubular dielectric materials disposed between the pair of electrically conductive layers formed of anodic oxide of metal; first electrodes which are filled in hollow portions of the dielectric materials and connected to one of the electrically conductive layers; and a second electrode that is filled in voids between the respective dielectric materials and connected to the other electrically conductive layer.

Abstract: A capacitor includes a first terminal having a first polarity, a second terminal having a second polarity opposed to the first polarity, and a plurality of columnar portions for connecting the first terminal to the second terminal. Each of the plurality of columnar portions includes a first conductor bar electrically connected to the first terminal, a second conductor bar electrically connected to the second terminal, and a dielectric layer between the first and second conductor bars.

Abstract: A capacitor includes a dielectric material that is formed of anodic metal oxide; a pair of substantially comb-shaped surface electrodes formed on the same principal surface of the dielectric material; and plural substantially columnar internal electrodes whose one ends are connected to the respective comb-shaped portions of the pair of the surface electrodes and whose other ends extend in the thickness direction of the dielectric material.

Abstract: A capacitive element for an implantable medical device feedthrough element includes a bore, to receive a feedthrough member, or pin of the filtered feedthrough element, an external surface extending laterally outward from a first opening of the bore, and a recessed area formed in the external surface and extending about an outer perimeter thereof. The recessed area may provide a location on which to apply a conductive material to form a joint that electrically couples the capacitive element to a ferrule of the filtered feedthrough element.

Abstract: A first internal conductor has a first portion. A second internal conductor has a lead portion and a main electrode portion. The second internal conductor is arranged in the same layer as the first internal conductor. A third internal conductor has a lead portion and a main electrode portion. The third internal conductor is arranged so as to be adjacent to the second internal conductor in a laminate direction. A fourth internal conductor has a lead portion and a main electrode portion. The fourth internal conductor is arranged so as to be adjacent to the third internal conductor in the laminate direction. When the laminate body is viewed from the laminate direction, the main electrode portion of the third internal conductor overlaps with the main electrode portions of the second and fourth internal conductors.

Abstract: A capacitor includes a capacitor body made of a dielectric, a first internal electrode, a second internal electrode, a first signal terminal, a second signal terminal, and a grounding terminal. The first and second signal terminals are connected to the first internal electrode. The grounding terminal is disposed on the outer surface of the capacitor body so as to be connected to the second internal electrode. The grounding terminal is connected to the ground potential. The grounding terminal includes a plating layer which is disposed on the capacitor body and which is connected to the second internal electrode.

Abstract: A method of forming a filtering capacitor feedthrough assembly for an implantable active medical device includes inserting a terminal pin into an aperture of a capacitor, the capacitor configured to be electrically grounded to an electrically conductive feedthrough ferrule or housing of the implantable active medical device, then disposing an electrically conductive continuous coil within the aperture between the terminal pin and the capacitor and then fixing the continuous coil to the terminal pin or the capacitor. The continuous coil includes an inner diameter defined by a plurality of coils, the terminal pin extending through the inner diameter of the continuous coil so that the plurality of coils circumferentially surround the terminal pin. The electrically conductive continuous coil mechanically secures and electrically couples the terminal pin to the capacitor.

Abstract: A solder joint between a capacitive element and a ferrule of a filtered feedthrough assembly for an implantable medical device is formed from a solder pre-form mounted on a portion of an external surface of the capacitive element, which portion of the external surface may be overlaid with a layer including a noble metal. Another solder joint may be formed between the capacitive member and each feedthrough pin; and, for an assembly including a plurality of feedthrough pins, each of the other solder joints may be formed from a solder pre-form mounted onto the external surface of the capacitive element by inserting each pin through a corresponding ring of a plurality of rings connected together to form the solder pre-form.

Abstract: To provide a thin film capacitor having a device structure for suppressing peeling between an insulating film and a substrate. A thin film capacitor 100 has a laminate structure that is formed by laminating a lower electrode 20, a dielectric film 30, and an upper electrode 40 in sequence on a substrate 10. An adhesion layer 41 is formed on a side surface of the lower electrode 20 via the dielectric film 30, and an insulating film 50 in contact with the adhesion layer 41 covers the laminate structure. According to this device structure, the adhesion layer 41 having excellent adhesiveness to the insulating film 50 is disposed between the insulating film 50 and the dielectric film 30, so that peeling of the insulating film 50 can be suppressed.

Abstract: A filtered feedthrough assembly having at least one terminal pin therethrough is provided. The feedthrough assembly comprises a ferrule having a cavity therethrough for receiving the terminal pin, and insulating structure having an upper surface. The insulating structure is disposed within the cavity and around the terminal pin for electrically isolating the pin from the ferrule. A capacitor is disposed around the pin and electrically coupled thereto. The capacitor has a lower surface that is disposed proximate the upper surface, and at least one washer is disposed between the upper surface and the lower surface. To attach the capacitor to the insulating structure, a body of epoxy is substantially confined between the upper surface and the lower surface by the ferrule, the insulating structure, the capacitor, and the at least one washer.

Abstract: A filtering capacitor feedthrough assembly for an implantable active medical device is disclosed. The filtering capacitor feedthrough assembly includes a capacitor having an aperture, the capacitor is electrically grounded to an electrically conductive feedthrough ferrule or housing of the implantable active medical device. A terminal pin extends into the aperture and an electrically conductive continuous coil is disposed within the aperture and between the terminal pin and the capacitor. The electrically conductive continuous coil mechanically secures and electrically couples the terminal pin to the capacitor.

Abstract: A multilayer chip capacitor includes: a capacitor body having a plurality of dielectric layers laminated therein and comprising first and second capacitor units; and first to fourth external electrodes formed on an outer surface of the capacitor body, wherein the first capacitor unit comprises first and second internal electrodes facing each other with the dielectric layer interposed therebetween, connected to the first and second external electrodes, and having different polarities, each pair of first and second internal electrodes being laminated one or more times to discriminate a plurality of capacitors with a certain capacitance, the second capacitor unit comprises third and fourth internal electrodes facing each other with the dielectric layer interposed therebetween, connected to the third and fourth external electrodes, and having the same polarities as those of the first and second internal electrodes, each pair of third and fourth internal electrodes being laminated one or more times to discriminate

Abstract: A multi-layer capacitor includes several electrically insulating layers that are stacked on top of one another. Parallel electrode plates are arranged between the insulating layers alternately one on top of the other, with each of the plates being separated by an intervening insulating layer. At least one first connecting line which extends perpendicularly through the layers is connected to one set of electrode plates and is insulated in relation to the other set of second electrode plates. Similarly, second connecting lines extend perpendicularly through the layers and are connected to the other set of plates and are insulated in relation to the one set of plates. The first connecting line extends centrally through the stacked electrode plates and is designed to carry a high-frequency signal.

Abstract: A capacitor having improved surface breakdown voltage performance and a method for applying laser marking to capacitors which does not reduce capacitor surface breakdown voltage, can be applied using existing laser marking technologies and apparatus, and which results in a mark that is legible and clear, is disclosed. In a first exemplary embodiment a capacitor includes a laser mark which is located near one of the capacitor terminals. The exact location is not critical as long as the mark does not make physical contact with the terminal. Conventional laser marking technologies and apparatus may be used to fix the mark in the new location. In a second embodiment the laser mark is oriented so that a flat portion of the mark is is oriented closest to the adjacent terminal.

Abstract: A first internal electrode includes a main electrode portion whose longer-side direction agrees with a longer-side direction of first and second principal faces, and a lead portion extending from an end of the main electrode portion on the first end face side toward a first side face and connected to a first terminal electrode. A second internal electrode includes a main electrode portion whose longer-side direction agrees with the longer-side direction of the first and second principal faces, and a lead portion extending from an end of the main electrode portion on the first end face side toward a second side face and connected to a second terminal electrode. A third internal electrode includes a main electrode portion whose longer-side direction agrees with the longer-side direction of the first and second principal faces, and a lead portion extending from an end of the main electrode portion on the second end face side toward the first side face and connected to the first terminal electrode.

Abstract: A method of manufacturing a sensor for in vivo applications includes the steps of providing two wafers of an electrically insulating material. A recess is formed in the first wafer, and a capacitor plate is formed in the recess of the first wafer. A second capacitor plate is formed in a corresponding region of the second wafer, and the two wafers are affixed to one another such that the first and second capacitor plates are arranged in parallel, spaced-apart relation.

Abstract: A multilayer ceramic electronic component includes a multilayer body, a first internal electrode provided in the multilayer body, and a second internal electrode provided in the multilayer body and facing the first internal electrode. The multilayer body includes a first ceramic layer, a second ceramic layer provided on a first surface of the first ceramic layer, and a third ceramic layer provided on a second surface of the first ceramic layer opposite to the first surface. The first and second internal electrodes are connected to the first ceramic layer. The first ceramic layer contains mainly ZnO and 0 to 15 mol % of SiO2. The second ceramic layer contains mainly ZnO and 15 to 50 mol % of SiO2. The third ceramic layer contains mainly ZnO and 15 to 50 mol % of SiO2; The multilayer ceramic component has a low varistor voltage and a small capacitance.

Abstract: A multilayer capacitor is provided that includes a dielectric body, an internal layer portion, an external layer portion and a first terminal electrode and a second terminal electrode to be set at different electric potentials from each other and formed at least on a side face parallel to stacking direction Z of side faces of the dielectric body. Each of the first terminal electrodes are connected with at least one of the first internal conductor layer and a plurality of the first external conductor layers and each of the second terminal electrodes are connected with at least one of the second internal conductor layer and a plurality of the second external conductor layers. The dielectric layer positioned at the external layer portions comprises a plurality of pin hole conducting portions.

Abstract: A tantalum capacitor includes: sintered bodies which are disposed at intervals and respectively have first surfaces forming the same surface; and electrode rods which respectively extend into the tantalum sintered bodies and project from the first surfaces of the tantalum sintered bodies. The tantalum capacitor further includes: layers composed of an oxide film layer, a functional polymer layer or a manganese layer, and a carbon layer which are sequentially laminated on surfaces of each of the tantalum sintered bodies excluding the first surface; a conductive layer which covers outside surfaces of the tantalum sintered bodies excluding the first surfaces; and an electrode plate having openings respectively formed at positions corresponding to the first surfaces of the tantalum sintered bodies so that the electrode rods are exposed through the openings. The electrode plate is connected to the conductive layer and spreads across the first surfaces of the tantalum sintered bodies.