Abstract: Medical devices provide metallic connector enclosures. The metallic connector enclosures may be constructed with relatively thin walls in comparison to polymer connector enclosures to aid in miniaturizing the medical device. The metallic connector enclosures may be constructed with interior surfaces that deviate less from an ideal inner surface shape in comparison to polymer connector enclosures to allow for better concentricity of electrical connectors. The metallic connector enclosures may include a panel that allows access to the cavity of the connector enclosure where set screw blocks, lead connectors, spacers, seals, and the like may be located. Furthermore, the lead connectors within the metallic connector enclosures may be separated from the metallic connector enclosure by being positioned within non-conductive seals that reside within features included in cavity walls of the connector enclosure.

Abstract: An electronic component includes: a capacitor body; a pair of external electrodes disposed on opposite end surfaces of the capacitor body, respectively; and a pair of metal frames respectively including a pair of connected portions connected to the pair of external electrodes, respectively, and a pair of mounted portions bent at and extending from one ends of the pair of connected portions, respectively, wherein corners of end portions of the pair of mounted portions facing each other have a curved surface.

Abstract: An electrolytic capacitor includes a capacitor main body. The capacitor main body includes an exterior member and a pair of lead members. The exterior member includes a case and a closing part. The case has a hollow column shape. The case includes an opening part at an end in an axial direction of the hollow column shape. The closing part closes the opening part. The pair of lead members each include a drawn part exposed from the closing part. The drawn part has a bar shape. When viewed in the axial direction, a width of the drawn part is 0.1 times or more of a diameter of the exterior member.

Abstract: The present disclosure relates to a coaxial lead structure and method for radiating a GIS partial discharge UHF signal outward. The structure includes a GIS cavity, a circular hole provided on the GIS cavity, a medium cylinder provided at the circular hole and sealing the circular hole, a thin cylindrical metal lead that extends into and is fixed to the medium cylinder, and a ground lead connected to the thin cylindrical metal lead. According to the present disclosure, a relatively strong signal may be obtained outside a coaxial lead structure, and detection of a partial discharge UHF signal at this position may increase the detection sensitivity by one time compared with the detection methods of built-in and external disc insulators.

Abstract: A ceramic electronic component includes external electrodes having conductive resin layers thereinside on respective two ends opposed to each other in a rectangular parallelepiped ceramic component body. Each of the external electrodes includes an underlying metal layer, an intermediate metal layer, a conductive resin layer, an external metal layer. A tip angle ? between an outer face of a tip portion of the wraparound portion of the underlying metal layer and a surface of the ceramic component body is 20° or smaller, and a tip angle ? between an outer face of a tip portion of the wraparound portion of the intermediate metal layer and a surface of the ceramic component body is 20° or smaller.

Abstract: A semiconductor device is disposed below an inductor. The semiconductor device includes a metal-oxide-semiconductor capacitor structure and a patterned shielding structure. The metal-oxide-semiconductor capacitor structure includes a polysilicon layer, an oxide definition layer, and a first metal layer. The first metal layer is connected to the polysilicon layer and the oxide definition layer. The patterned shielding structure is disposed over the metal-oxide-semiconductor capacitor structure and includes a second metal layer.

Abstract: A capacitor bank structure includes a plurality of capacitors, a protection material, a first dielectric layer and a plurality of first pillars. The capacitors are disposed side by side. Each of the capacitors has a first surface and a second surface opposite to the first surface, and includes a plurality of first electrodes and a plurality of second electrodes. The first electrodes are disposed adjacent to the first surface for external connection, and the second electrodes are disposed adjacent to the second surface for external connection. The protection material covers the capacitors, sidewalls of the first electrodes and sidewalls of the second electrodes, and has a first surface corresponding to the first surface of the capacitor and a second surface corresponding to the second surface of the capacitor. The first dielectric layer is disposed on the first surface of the protection material, and defines a plurality of openings to expose the first electrodes.

Abstract: An electronic device comprising: a body having a first portion and a second portion located below the first portion, wherein a bottom surface of the first portion and a side surface of the second portion forms an opening under the bottom surface of the first portion, wherein at least one portion of an electrode is disposed on the bottom surface of the first portion of the body, and at least one portion of the second portion of the body is disposed in an opening of a circuit board with the electrode being disposed on and electrically connected with the circuit board.

Abstract: An electronic component includes an element body, a pair of external electrodes respectively disposed at both ends of the element body in a first direction, and a pair of metal terminals respectively connected to the pair of external electrodes with solder. Each metal terminal includes a connection opposing the corresponding external electrode in the first direction and formed with a plurality of grooves and includes a leg extending from the connection. The connection includes a pair of end edges separated from each other in a third direction intersecting with a second direction where the leg extends from the connection. The grooves extend in a direction different from the second direction and intersecting with the third direction so that the grooves are separated from one of the pair of end edges. A surface included in the connection and defining each of the grooves is in contact with the solder.

Abstract: A multilayer ceramic electronic component includes a rectangular parallelepiped stacked body having first and second main surfaces and first and second end surfaces, and first and second external electrodes. The first external electrode is provided on a portion of the second main surface and on the first end surface, and the second external electrode is provided on a portion of the second main surface and on the second end surface. A semiconductor layer is provided at the interface between the stacked body and a portion of the first external electrode that is located on the portion of the second main surface, and a semiconductor layer is provided at the interface between the stacked body and a portion of the second external electrode that is located on the portion of the second main surface.

Abstract: A metal-insulator-metal (MIM) capacitor and a process of forming the same are disclosed. The process includes steps of: forming a lower electrode that provides a lower layer and an upper layer; forming an opening in the upper layer; forming a supplemental layer on the lower layer exposed in the opening; heat treating the lower electrode and the supplemental layer; covering at least the upper layer of the lower electrode with an insulating film; and forming an upper electrode in an area on the insulating film, where the area is not overlapped with the supplemental layer and within 100 ?m at most from the supplemental layer. A feature of the MIM capacitor is that the supplemental layer is made of a same metal as a metal contained in the lower layer of the lower electrode.

Abstract: A capacitor component includes a body including a dielectric layer, and a first internal electrode and a second internal electrode disposed to oppose each other in a first direction with the dielectric layer interposed therebetween; a first external electrode and a second external electrode disposed on the body, and respectively connected to the first internal electrode; and a third external electrode and a fourth external electrode disposed on the body, and respectively connected to the second internal electrode, wherein the first and second external electrodes include a connection metal layer, a ceramic layer, a metal layer, and a plated layer, respectively, sequentially disposed on the body, wherein the plated layer is extended and disposed to contact end surfaces of the connection metal layer, the ceramic layer, and the metal layer in the first direction, respectively.

Abstract: An electronic component includes a body portion and an external electrode. The external electrode is provided on a surface of the body portion. The external electrode includes a base electrode layer, a first Ni plated layer, and an upper plated layer. The first Ni plated layer is provided on the base electrode layer. The upper plated layer is provided above the first Ni plated layer. The first Ni plated layer includes Ni particles having an average particle size of not more than about 52 nm.

Abstract: An electronic component includes a body portion and an external electrode. The external electrode is provided on a surface of the body portion. The external electrode includes a base electrode layer, a first Ni plated layer, and an upper plated layer. The first Ni plated layer is provided on the base electrode layer. The upper plated layer is provided above the first Ni plated layer. The first Ni plated layer includes Ni particles having an average particle size of not more than about 52 nm.

Abstract: A coil component includes an element body, a coil provided in the element body, and an outer electrode provided in the element body and electrically connected to the coil. The outer electrode is embedded in one surface of the element body such that a protruding portion, which is a portion of the outer electrode, protrudes from the one surface of the element body. Also, a thickness of an embedded portion, which is a portion of the outer electrode and is embedded in the one surface of the element body, is larger than a thickness of the protruding portion of the outer electrode protruding from the one surface of the element body in thickness in a direction perpendicular to the one surface of the element body.

Abstract: A metallic nanodendrite electrode and methods are shown. In one example, the metallic nanodendrite is coated with ruthenium oxide and is used as an electrode in a capacitor.

Abstract: A mounting structure minimizes the influence of displacements, along a length direction of a resistor, in mounting positions of capacitor electrodes on the electrical characteristics of a circuit including a parallel circuit composed of a capacitor and the resistor. The capacitor has first and second electrodes, which respectively include first and second side surface portions disposed in parallel to a length direction of the resistor. The resistor has a first resistance body corresponding to the first side surface portions and a second resistance body corresponding to the second side surface portions that are separately disposed along the length direction and connected in series via a wire, and is mounted so that the first resistance body is positioned directly facing the first side surface portions and the second resistance body is positioned directly facing the second side surface portions.

Abstract: A method of manufacturing a ceramic electronic component includes forming a dielectric layer including a plurality of ceramic nanosheets on a first electrode, treating the dielectric layer with an acid, and forming a second electrode on the dielectric layer, a ceramic electronic component, and an electronic device.

Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer, and a first internal electrode and a second internal electrode facing each other with the dielectric layer interposed therebetween, and a first external electrode electrically connected to the first internal electrode, and a second external electrode electrically connected to the second internal electrode, disposed in an outer portion of the ceramic body, the first and second external electrodes comprise a first electrode layer including a conductive metal, a first plating layer disposed on the first electrode layer and including nickel (Ni), and a second plating layer disposed on the first plating layer and including tin (Sn), and a ratio (t1/t2) is within a range from 1.0 to 9.0, where t1 is a thickness of the first plating layer including nickel (Ni), and t2 is a thickness of the second plating layer including tin (Sn).

Abstract: An electronic device assembly includes a first electronic device, a second electronic device, and a connection member. The first electronic device includes a first metal terminal configured to hold a first chip component. The second electronic device includes a second metal terminal configured to hold a second chip component. The connection member connects the first electronic device and the second electronic device.

Abstract: A multilayer element includes a multilayer body defined by stacking base layers, inductor electrodes, a capacitor electrode on an outer portion, and outer terminals. Inductors are defined using the inductor electrodes. The inductors are connected between the outer terminals, and the inductors are connected to the capacitor electrode. The multilayer element may be easily used to make an LC filter by placing a metal shield opposite a capacitor electrode to define a capacitance between the capacitor electrode and the metal shield.

Abstract: Relatively low noise capacitors are provided for surface mounted applications. Electro-mechanical vibrations generate audible noise, which are otherwise relatively reduced through modifications to MLCC device structures, and/or their mounting interfaces on substrates such as printed circuit boards (PCBs). Different embodiments variously make use of flexible termination compliance so that surface mounting has reduced amplitude vibrations transmitted to the PCB. In other instances, side terminal and transposer embodiments effectively reduce the size of the mounting pads relative to the case of the capacitor, or a molded enclosure provides standoff, termination compliance and clamping of vibrations.

Abstract: A shielded metal-oxide-metal (MOM) capacitor includes a substrate, a lower shielding plate disposed on the substrate and in parallel with a major surface of the substrate, an upper shielding plate situated above the lower shielding plate and in parallel with the lower shielding plate, and a middle plate sandwiched between the lower shielding plate and the upper shielding plate. The middle plate includes two parallel first connecting bars extending along a first direction, a plurality of first fingers extending between the two parallel first connecting bars along a second direction, and an electrode strip spaced apart from and surrounded by the two parallel first connecting bars and the first fingers.

Abstract: Chamferless via structures and methods of manufacture are provided. The method includes: forming at least one non-self-aligned via within at least dielectric material; plugging the at least one non-self-aligned via with material; forming a protective sacrificial mask over the material which plugs the at least one non-self-aligned via, after a recessing process; forming at least one trench within the dielectric material, with the protective sacrificial mask protecting the material during the trench formation; removing the protective sacrificial mask and the material within the at least one non-self-aligned via to form a wiring via; and filling the wiring via and the at least one trench with conductive material.

Abstract: A package and method of manufacturing a package is disclosed. In one example, the package includes an electronic chip and a dielectric structure comprising a highly filled cross-linked thermoplastic material.

Abstract: A multilayer ceramic electronic component includes first and second electronic component bodies and first and second metal terminals. The first and second electronic component bodies are vertically stacked with a gap therebetween. The first metal terminal includes terminal joining portions, a first inter-component extending portion, a first extending portion, and a first mounting portion. The second metal terminal includes terminal joining portions, a second inter-component extending portion, a second extending portion, and a second mounting portion. The first and second inter-component extending portions are disposed in the gap between the first electronic component body and the second electronic component body.

Abstract: A method of manufacturing an electronic device includes preparing a chip component with a terminal electrode. A terminal plate is prepared. A connection member is placed between an end surface of the terminal electrode and an inner surface of the terminal plate. The terminal plate and the terminal electrode are joined using the connection member by bringing a press head into contact with an outer surface of the terminal plate and pressing and heating the terminal plate against the terminal electrode.

Abstract: An electrical device with a soldered joint is disclosed. In an embodiment, an electrical device includes at least one soldered joint having a first wire soldered at one end to the device, wherein the first wire bears with a bearing surface on the device, and wherein the first wire has at least one bend in a region of the bearing surface of the first wire on the device.

Abstract: In a method for manufacturing an electronic component, a step of providing an outer electrode includes a step of providing a sintered layer including a sintered metal, a step of providing a reinforcement layer not containing Sn but including Cu or Ni, a step of providing an insulation layer, and a step of providing a Sn-containing layer. The sintered layer extends from each end surface of an element assembly onto at least one main surface thereof to cover Bich. The reinforcement layer covers the sintered layer entirely. The insulation layer is directly provided on the reinforcement layer at each end surface of the element assembly and defines a portion of a surface of the outer electrode. The Sn-containing layer covers the reinforcement layer except for a portion of the reinforcement layer that is covered by the insulation layer, and defines another portion of the surface of the outer electrode.

Abstract: An electrical storage capacitor provides a primary electrode is in electrical communication with a primary conducting layer having thickness in the range of 20 nm to 100 micron, a secondary electrode is in electrical communication with a secondary conducting layer having thickness in the range of 20 nm to 1 micron, a high energy density dielectric layer having relative dielectric permittivity greater than ?R?70 and thickness less than 1 micron that is formed between the primary electrode and the secondary electrode, wherein the high energy density dielectric has a dielectric polarization response that is determined solely by orbital deformations of the atomic species forming said high energy density dielectric.

Abstract: A multilayer electronic component includes: a first frame terminal including a first side frame, a first bottom frame and a first top frame; a second frame terminal including a second side frame, a second bottom frame and a second top frame; an electronic component including first and second external electrodes, and disposed between the first and second side frames; a first conductive adhesive disposed between the first external electrode and an upper portion of the first frame terminal; and a second conductive adhesive disposed between the second external electrode and an upper portion of the second frame terminal, wherein space portions are provided between the first and second external electrodes and lower portions of the first and second side frames and between the first and second external electrodes and the first and second bottom frames, respectively.

Abstract: A method of manufacturing a ceramic electronic component includes forming a dielectric layer including a plurality of ceramic nanosheets on a first electrode, treating the dielectric layer with an acid, and forming a second electrode on the dielectric layer, a ceramic electronic component, and an electronic device.

Abstract: The present invention provides a lead-free piezoelectric material having a high piezoelectric constant over a wide operating temperature region. Therefore, the present invention relates to a piezoelectric material including a perovskite-type metal oxide represented by general formula (1) below as a main component, wherein the average valence, of Sn contained in the general formula (1) lies between 2 and 4. (BavCawSnxTiyZrz)O3 (where 0.620?v?0.970,0.010?w?0.200,0.030?x?0.230,0.865?y?0.990,0?z?0.085, and 1.986?v+w+x+y+z?2.

Abstract: A multilayer ceramic electronic component includes: a body part including dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween; and external electrodes disposed on an outer surface of the body part and electrically connected to the internal electrodes. The dielectric layer includes grains including: a semiconductive or conductive grain core region containing a base material represented by ABO3, where A is at least one of Ba, Sr, and Ca, and B is at least one of Ti, Zr, and Hf, and a doping material including a rare earth element; and an insulating grain shell region enclosing the grain core region.

Abstract: An electronic device includes a chip component and an external terminal. The chip component includes a terminal electrode formed on an end surface of a ceramic element body containing an internal electrode. The external terminal includes a first end electrically connected with the terminal electrode and a second end disposed opposite to the first end and connected with a mounting surface. The external terminal includes a first metal and a second metal different from the first metal. The first metal and the second metal are alternately exposed on a surface of the external terminal.

Abstract: An electronic component, a board having the same, and a method of manufacturing a metal frame for the electronic component. The electronic component includes a multilayer ceramic capacitor including a plurality of external electrodes formed on opposing surfaces of a capacitor body, respectively; and metal frames bonded to the external electrodes, respectively, wherein each of the metal frames includes an inner support portion, an outer support portion disposed on an outer surface of the inner support portion, and a connecting portion connecting portions of the inner support portion and the outer support portion to each other.

Abstract: A capacitor includes a body, first and second external electrodes, and first and second auxiliary external electrodes. The body includes first and second internal electrodes each having first and second lead portions exposed to one surface of the body. The first and second external electrodes are disposed on the one surface of the body and electrically connected to the first and second internal electrodes, respectively. The first and second auxiliary external electrodes are electrically connected to the first and second external electrodes, respectively, and cover portions of surfaces of the body connected to the one surface of the body.

Abstract: In an embodiment, an electronic component with metal terminals includes: an electronic component 10 having a component body 11 of roughly rectangular solid shape, as well as external electrodes 12 provided on the ends thereof in the first direction d1, respectively; and metal terminals 20 provided in sets of two on each external electrode 12. Each metal terminal 20 has a first planar part 21 and a second planar part 23 oriented differently from the first planar part 21; the first planar part 21 is connected to each external electrode 12 in a manner facing one face of the component body 11; and the second planar part 23 is positioned in a manner facing at least partially, across a clearance 24, another face adjoining the one face of the component body 11, while being fixed to the component body 11 by an adhesive 40 provided in the clearance 24.

Abstract: A multilayer ceramic capacitor includes a laminate and first and second external electrodes that each include first and second underlying electrode layers, first and second conductive resin layers, and first and second plating layers. The first underlying electrode layer includes a portion not covered with the first conductive resin layer on an end surface of the laminate, and the first plating layer is disposed on a surface of the portion of the first underlying electrode layer. The second underlying electrode layer includes a portion not covered with the second conductive resin layer on an end surface of the laminate, and the second plating layer is disposed on a surface of the portion of the second underlying electrode layer.

Abstract: Capacitors having form factors (e.g., dimensions and functionality) comparable with traditional single layer capacitors, but with considerably higher capacitance and methods of their manufacture are provided. Capacitors and methods that implement capacitors where at least one of the dielectric layers is reduced in thickness post firing to produce a device robust enough for automated handling and provide a stable surface for wire-bonding are also provided. Capacitors and methods that implement an internal electrode between at least two layers of pre-fired ceramic dielectric are also provided. Capacitors and methods that implement the integration of multiple dielectric types in a single device producing high frequency performance characteristics are also provided. Capacitors and dielectrics that implement the combination of a multi-layer capacitor with a thin single layer capacitor to further increase operating frequency and capacitance are also provided.

Abstract: An image sensor includes: a light reception unit; first transfer lines; a constant current source; second transfer lines; a reading unit; a control unit; a dielectric interposed between the first and second transfer lines formed in pairs; a first chip including at least the light reception unit, the plurality of first transfer lines, and the constant current source, each being mounted on the first chip; and a second chip including at least the second transfer lines mounted on the second chip. The first chip is configured such that the second chip is stacked on a back surface of a light receiving surface of the light reception unit, and each of the second transfer lines is arranged at a position facing one of the first transfer lines with the dielectric interposed between the first and second transfer lines.

Abstract: A multilayer electronic component includes a first capacitor including a first multilayer body having a structure in which a plurality of internal electrodes and a plurality of dielectric layers are alternately stacked, a second capacitor including a second multilayer body disposed adjacent the first multilayer body, the second multilayer body connected to the first multilayer body in parallel, and the second multilayer body having a structure in which a plurality of internal electrodes and a plurality of dielectric layers are alternately stacked, a fixing member fixing the first and second multilayer bodies, a first lead terminal connected to a first end portion of the fixing member, and a second lead terminal connected to a second end portion of the fixing member.

Abstract: A multilayer ceramic capacitor includes: a multilayer structure having an internal electrode and a dielectric layer alternately stacked; external electrodes provided on a first and second faces of the multilayer structure, wherein t12×L1/N is equal to or more than 0.1, when a distance between a first edge positioned at outermost of edges of the plurality of internal electrodes that are not connected to the first external electrode or the second external electrode in an array direction of the first external electrode and the second external electrode and a second edge positioned at innermost of edges of the plurality of internal electrodes that are not connected to the first external electrode or the second external electrode in the array direction is L1 (mm), each thickness of the plurality of dielectric layers is t1 (?m), and a stack number of the plurality of dielectric layers is N.

Abstract: A substrate module includes capacitors, a first coupling conductor, and a mounting substrate. The first coupling conductor couples two of the capacitors together. The mounting substrate includes a first power supply layer and a second power supply layer. The capacitors each include a first electrode, a second electrode, a first terminal conductor, a second terminal conductor, and a third terminal conductor. The first terminal conductor is coupled to the first electrode and to the first power supply layer. The second terminal conductor is coupled to the second electrode and to the second power supply layer. The third terminal conductor is coupled to the first coupling conductor. The third terminal conductor is coupled to the first electrode at a coupling position that is different from a coupling position of the first terminal conductor.

Abstract: A multilayer ceramic electronic component includes a multilayer ceramic capacitor, first and second metal frames, and an insulating cover. The multilayer ceramic capacitor includes a ceramic body having a plurality of dielectric layers stacked together and first and second internal electrodes alternately disposed between pairs of adjacent dielectric layers, and external electrodes disposed on two end surfaces of the ceramic body opposite each other in a length direction orthogonal to the stacking direction. The first and second metal frames are each disposed along a respective one of two end surfaces of the multilayer ceramic capacitor opposite each other in the length direction, and are each disposed along upper and lower surfaces of the multilayer ceramic capacitor. The insulating cover is disposed to enclose the multilayer ceramic capacitor and upper surfaces of the first and second metal frames. A board can have the multilayer ceramic electronic component mounted thereon.

Abstract: An electronic device includes a plurality of chip components and an external terminal. The chip components are provided with a terminal electrode formed on an end surface of a ceramic element body. The external terminal is electrically connected with the terminal electrodes to support the plurality of chip components adjacently in a first direction. The external terminal includes a terminal electrode connection part arranged to face the terminal electrode and a mounting connection part connectable with a mounting surface. The terminal electrode connection part is provided with a plurality of convex portions protruding toward the terminal electrode. At least one of the plurality of convex portions is respectively connected with each terminal electrode of the plurality of chip components.

Abstract: A capacitor component includes a body, a plurality of internal electrodes disposed in the body, connection electrodes extended in a thickness direction of the body and electrically connected to the plurality of internal electrodes, upper electrodes disposed on an upper surface of the body and electrically connected to the connection electrodes, and lower electrodes disposed on a lower surface of the body and electrically connected to the connection electrodes A thickness of the upper electrodes is different from that of the lower electrodes, and an area of contact between the upper electrodes and the body is different from an area of contact between the lower electrodes and the body.

Abstract: A ceramic electronic component includes a multilayer body, an electronic component main body including first and second outer electrodes on the surface of multilayer body, a first substrate connection terminal bonded to at least one of the first outer electrode and the multilayer body by a bonding material that is electrically insulating, and a first metal terminal electrically connecting the first outer electrode and the first substrate connection terminal, in which, while the first metal terminal maintains an elastically deformed state, a first end portion thereof is bonded to the first outer electrode by an electrically conductive bonding material, and a second end portion thereof is bonded to the first substrate connection terminal by a bonding section with a different melting point from that of the bonding material.

Abstract: Disclosed herein are a multilayer capacitor, a method for manufacturing the same, and an electronic device using the same. A multilayer capacitor including internal electrodes stacked in a dielectric so as to be spaced apart from each other, alternately connected to external electrodes formed on both sides of the dielectric, and formed so that width sizes of connection sections connected to the external electrodes are decreased as compared with those of overlapped sections overlapped with each other while vertically neighboring to each other in at least portions of a stacked structure is suggested. In addition, an electronic device using the multilayer capacitor and a method for manufacturing the multilayer capacitor are suggested.

Abstract: A transmission line portion of a flat cable includes first regions and second regions connected alternately. In the first region, the transmission line portion is a flexible tri-plate transmission line including a dielectric element including a signal conductor, a first ground conductor including opening portions, and a second ground conductor which is a solidly filled conductor. In the second region, the transmission line portion is a hard tri-plate transmission line including a wide dielectric element including a meandering conductor, and a first ground conductor and a second ground conductor which are solidly filled conductors. A variation width of the characteristic impedance in the second region is larger than a variation width of the characteristic impedance in the first region.