Details Of Electrical Connection Means (e.g., Terminal Or Lead) Patents (Class 361/306.1)
  • Patent number: 10285271
    Abstract: A multilayer ceramic electronic component includes a multilayer ceramic capacitor, first and second metal frames, and an insulating cover. The multilayer ceramic capacitor includes a ceramic body having a plurality of dielectric layers stacked together and first and second internal electrodes alternately disposed between pairs of adjacent dielectric layers, and external electrodes disposed on two end surfaces of the ceramic body opposite each other in a length direction orthogonal to the stacking direction. The first and second metal frames are each disposed along a respective one of two end surfaces of the multilayer ceramic capacitor opposite each other in the length direction, and are each disposed along upper and lower surfaces of the multilayer ceramic capacitor. The insulating cover is disposed to enclose the multilayer ceramic capacitor and upper surfaces of the first and second metal frames. A board can have the multilayer ceramic electronic component mounted thereon.
    Type: Grant
    Filed: July 22, 2016
    Date of Patent: May 7, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Heung Kil Park, Jong Hwan Park, Young Ghyu Ahn
  • Patent number: 10283277
    Abstract: A substrate module includes capacitors, a first coupling conductor, and a mounting substrate. The first coupling conductor couples two of the capacitors together. The mounting substrate includes a first power supply layer and a second power supply layer. The capacitors each include a first electrode, a second electrode, a first terminal conductor, a second terminal conductor, and a third terminal conductor. The first terminal conductor is coupled to the first electrode and to the first power supply layer. The second terminal conductor is coupled to the second electrode and to the second power supply layer. The third terminal conductor is coupled to the first coupling conductor. The third terminal conductor is coupled to the first electrode at a coupling position that is different from a coupling position of the first terminal conductor.
    Type: Grant
    Filed: February 27, 2018
    Date of Patent: May 7, 2019
    Assignee: TDK CORPORATION
    Inventor: Tatsuya Fukunaga
  • Patent number: 10242805
    Abstract: An electronic device includes a plurality of chip components and an external terminal. The chip components are provided with a terminal electrode formed on an end surface of a ceramic element body. The external terminal is electrically connected with the terminal electrodes to support the plurality of chip components adjacently in a first direction. The external terminal includes a terminal electrode connection part arranged to face the terminal electrode and a mounting connection part connectable with a mounting surface. The terminal electrode connection part is provided with a plurality of convex portions protruding toward the terminal electrode. At least one of the plurality of convex portions is respectively connected with each terminal electrode of the plurality of chip components.
    Type: Grant
    Filed: March 28, 2017
    Date of Patent: March 26, 2019
    Assignee: TDK CORPORATION
    Inventors: Sunao Masuda, Katsumi Kobayashi
  • Patent number: 10186380
    Abstract: A capacitor component includes a body, a plurality of internal electrodes disposed in the body, connection electrodes extended in a thickness direction of the body and electrically connected to the plurality of internal electrodes, upper electrodes disposed on an upper surface of the body and electrically connected to the connection electrodes, and lower electrodes disposed on a lower surface of the body and electrically connected to the connection electrodes A thickness of the upper electrodes is different from that of the lower electrodes, and an area of contact between the upper electrodes and the body is different from an area of contact between the lower electrodes and the body.
    Type: Grant
    Filed: April 12, 2017
    Date of Patent: January 22, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Taek Jung Lee, Hyo Youn Lee, Won Young Lee, Sung Kwon An, Jae Yeol Choi, Jin Kyung Joo
  • Patent number: 10115523
    Abstract: A ceramic electronic component includes a multilayer body, an electronic component main body including first and second outer electrodes on the surface of multilayer body, a first substrate connection terminal bonded to at least one of the first outer electrode and the multilayer body by a bonding material that is electrically insulating, and a first metal terminal electrically connecting the first outer electrode and the first substrate connection terminal, in which, while the first metal terminal maintains an elastically deformed state, a first end portion thereof is bonded to the first outer electrode by an electrically conductive bonding material, and a second end portion thereof is bonded to the first substrate connection terminal by a bonding section with a different melting point from that of the bonding material.
    Type: Grant
    Filed: September 20, 2017
    Date of Patent: October 30, 2018
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Teppei Akiyoshi
  • Patent number: 10109425
    Abstract: Disclosed herein are a multilayer capacitor, a method for manufacturing the same, and an electronic device using the same. A multilayer capacitor including internal electrodes stacked in a dielectric so as to be spaced apart from each other, alternately connected to external electrodes formed on both sides of the dielectric, and formed so that width sizes of connection sections connected to the external electrodes are decreased as compared with those of overlapped sections overlapped with each other while vertically neighboring to each other in at least portions of a stacked structure is suggested. In addition, an electronic device using the multilayer capacitor and a method for manufacturing the multilayer capacitor are suggested.
    Type: Grant
    Filed: April 3, 2018
    Date of Patent: October 23, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Sung Woo Kim
  • Patent number: 10079417
    Abstract: A transmission line portion of a flat cable includes first regions and second regions connected alternately. In the first region, the transmission line portion is a flexible tri-plate transmission line including a dielectric element including a signal conductor, a first ground conductor including opening portions, and a second ground conductor which is a solidly filled conductor. In the second region, the transmission line portion is a hard tri-plate transmission line including a wide dielectric element including a meandering conductor, and a first ground conductor and a second ground conductor which are solidly filled conductors. A variation width of the characteristic impedance in the second region is larger than a variation width of the characteristic impedance in the first region.
    Type: Grant
    Filed: June 6, 2017
    Date of Patent: September 18, 2018
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Noboru Kato, Satoshi Ishino, Jun Sasaki, Kuniaki Yosui, Takahiro Baba, Nobuo Ikemoto
  • Patent number: 10068707
    Abstract: A stacked MLCC capacitor is provided wherein the capacitor stack comprises multilayered ceramic capacitors wherein each multilayered ceramic capacitor comprises first electrodes and second electrodes in an alternating stack with a dielectric between each first electrode and each adjacent second electrode. The first electrodes terminate at a first side and the second electrodes second side. A first transient liquid phase sintering conductive layer is the first side and in electrical contact with each first electrode; and a second transient liquid phase sintering conductive layer is on the second side and in electrical contact with each second electrode.
    Type: Grant
    Filed: October 28, 2015
    Date of Patent: September 4, 2018
    Assignee: KEMET Electronics Corporation
    Inventors: John E. McConnell, Garry L. Renner, John Bultitude, Allen Hill
  • Patent number: 10056320
    Abstract: An electronic component is provided with improved thermal stability. The electronic component comprises at least one capacitive element wherein the capacitive element comprises internal electrodes of alternating polarity separated by a dielectric. External terminations with a first external termination of the external terminations are in electrical contact with internal electrodes of a first polarity and a second external termination of the external terminations are in electrical contact with internal electrodes of a second polarity. A first external lead frame is in electrical contact with the first external termination with a conductive bond there between wherein the first external lead frame comprises at least one feature selected from the group consisting of a perforation, a protrusion and an edge indentation.
    Type: Grant
    Filed: October 28, 2014
    Date of Patent: August 21, 2018
    Assignee: KEMET Electronics Corporation
    Inventors: Jeffrey S. Murrell, Lonnie G. Jones, Jeffrey W. Bell
  • Patent number: 10056194
    Abstract: A capacitor provides a plurality of selectable capacitance values, by selective connection of six capacitor sections of a capacitive element each having a capacitance value. The capacitor sections are provided in a plurality of wound cylindrical capacitive elements. Two vertically stacked wound cylindrical capacitance elements may each provide three capacitor sections. There may be six separately wound cylindrical capacitive elements each providing a capacitor section. The capacitor sections have a common element terminal.
    Type: Grant
    Filed: June 27, 2016
    Date of Patent: August 21, 2018
    Assignee: American Radionic Company, Inc.
    Inventor: Robert M. Stockman
  • Patent number: 10057977
    Abstract: A wiring board includes a first wire, a second wire, a third wire and a fourth wire formed over a substrate and extending in a first direction respectively, the second wire being adjacent to the first wire in the first direction, and the third wire being adjacent to the first wire in a second direction orthogonal to the first direction, and the fourth wire being adjacent to the second wire in the second direction, a pair of fifth wires, a pair of sixth wires, a pair of seventh wires and a pair of eighth wires formed in the substrate and extending in the second direction respectively, a pair of ninth signal vias, a pair of tenth signal vias, a pair of eleventh signal vias and a pair of twelfth signal vias formed in the substrate and extending in a third direction orthogonal to a surface of the substrate respectively.
    Type: Grant
    Filed: March 21, 2017
    Date of Patent: August 21, 2018
    Assignee: FUJITSU LIMITED
    Inventor: Kenichi Kawai
  • Patent number: 9997296
    Abstract: A multilayer ceramic electronic component includes a ceramic body having a stacked plurality of dielectric layers and first and second end portions and a plurality of lateral surfaces. A plurality of internal electrodes stacked in the ceramic body face each other with respective dielectric layers interposed therebetween and exposed to first and second lateral surfaces of the ceramic body opposing each other through respective lead portions thereof. At least two first external electrodes and at least two second external electrodes are provided on the first and second lateral surfaces to be connected to the respective lead portions, respectively. An insulation layer is provided on the first and second lateral surfaces of the ceramic body except for the first and second external electrodes.
    Type: Grant
    Filed: November 16, 2015
    Date of Patent: June 12, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Kwon Oh, Jae Wook Lee, Min Sung Choi, Jae Yeol Choi
  • Patent number: 9950965
    Abstract: A ceramic element includes: a ceramic body; a first coating layer disposed on a first part of a front surface of the ceramic body; and a second coating layer disposed on a second part of a back surface of the ceramic body. The first coating layer continuously extends from the front surface to a first region of a side surface of the ceramic body, the side surface being a machined surface, and the first region being a front side region of the side surface. The second coating layer continuously extends from the back surface to a second region of the side surface of the ceramic body, the second region being a back side region of the side surface. In the machined surface, one of the first and second coating layers is disposed at least partially on the other of the first and second coating layers.
    Type: Grant
    Filed: January 13, 2014
    Date of Patent: April 24, 2018
    Assignee: NGK Insulators, Ltd.
    Inventors: Masayuki Uetani, Masaki Hattori
  • Patent number: 9916929
    Abstract: A first metal terminal includes a first connection portion connected to an electrode portion of a second external electrode, and a first leg portion extending from the first connection portion. A second metal terminal includes a second connection portion connected to a conductor portion of a connection conductor, and a second leg portion extending from the second connection portion. A multilayer capacitor and an overcurrent protection device are disposed in such a manner that a first principal surface and a third side surface oppose each other. An electrode portion of a first external electrode and an electrode portion of a fourth external electrode are connected to each other.
    Type: Grant
    Filed: April 29, 2016
    Date of Patent: March 13, 2018
    Assignee: TDK CORPORATION
    Inventors: Norihisa Ando, Sunao Masuda, Masahiro Mori, Kayou Kusano
  • Patent number: 9842699
    Abstract: A multilayer ceramic capacitor may include: ceramic body including a plurality of dielectric layers and a plurality of internal electrodes, external electrodes including a connecting portion and band portion, terminal electrodes including upper and lower horizontal portion and vertical portion connecting end portion of the upper and lower horizontal portion and the conductive adhesive layers disposed to the upper surface of the band portion and upper horizontal portion.
    Type: Grant
    Filed: August 4, 2015
    Date of Patent: December 12, 2017
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Heung Kil Park, Sang Soo Park
  • Patent number: 9805866
    Abstract: A laminated ceramic electronic component includes a ceramic body, first and second inner electrodes within the ceramic body and including opposed portions opposed to each other in the thickness direction of the ceramic body, a first terminal electrode electrically connected to the first inner electrode, and a second terminal electrode electrically connected to the second inner electrode. The widthwise distance between first widthwise edges and second widthwise edges of the first and second terminal electrodes are smaller, in plan view, than widths of the first and second inner electrodes at the opposed portions.
    Type: Grant
    Filed: May 4, 2015
    Date of Patent: October 31, 2017
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Shunsuke Takeuchi, Masashi Nishimura
  • Patent number: 9805865
    Abstract: A ceramic electronic component has a ceramic element assembly, external electrodes, and metal terminals. The external electrodes are arranged on the surface of the ceramic element assembly. The external electrodes contain a sintered metal. The metal terminals are electrically connected to the external electrodes, respectively. The external electrode and the metal terminal are directly diffusion-bonded by diffusion of metal in the metal terminals into the external electrodes. The above arrangement provides a ceramic electronic component having highly reliable metal particle bonding and a method for manufacturing the same.
    Type: Grant
    Filed: November 2, 2011
    Date of Patent: October 31, 2017
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hideki Otsuka, Kazuhiro Yoshida, Jun Sonoyama, Yoji Itagaki, Akihiko Nakata
  • Patent number: 9796636
    Abstract: Disclosed herein is a method of: placing between a cooling element and an opposing surface a slurry of: a dielectric powder containing barium titanate, a dispersant, a binder, and water; maintaining the cooling element at a temperature below the opposing surface to cause the formation of ice platelets perpendicular to the surface of the cooling element and having the powder between the platelets; subliming the ice platelets to create voids; sintering the powder to form the dielectric material; and filling the voids with the polymeric material. The process can produce a composite having: a sintered dielectric material of barium titanate and platelets of a polymeric material embedded in the dielectric material. Each of the platelets is perpendicular to a surface of the composite.
    Type: Grant
    Filed: May 10, 2016
    Date of Patent: October 24, 2017
    Assignee: The United States of America, as represented by the Secretary of the Navy
    Inventors: Edward P. Gorzkowski, III, Ming-Jen Pan
  • Patent number: 9666371
    Abstract: A multilayer ceramic capacitor has a laminate comprising dielectric layers stacked alternately with internal electrode layers of different polarities, wherein: the dielectric layers contain ceramic grains whose primary component is BaTiO3; the ceramic grains contain at least one type of donor element (D) selected from the group that includes Nb, Mo, Ta, and W, and at least one type of acceptor element (A) selected from the group that includes Mg and Mn; and the ratio of the concentration of the donor element (D) and that of the acceptor element (A) (D/A) is greater than 1 at the center parts of the ceramic grains, while the D/A ratio is less than 1 at the outer edge parts of the ceramic grains (if A=0, then D/A=? and D=A=0 never occurs).
    Type: Grant
    Filed: January 20, 2016
    Date of Patent: May 30, 2017
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Koichiro Morita, Chie Kawamura, Minoru Ryu, Katsuya Taniguchi, Kazumichi Hiroi, Yoshiki Iwazaki
  • Patent number: 9655249
    Abstract: A substrate with a built-in capacitor includes an insulating base material layer, a build-up layer formed on the insulating base material layer and including a conductor layer and an insulating layer, and a multilayer ceramic capacitor positioned in an opening of the base material layer and including internal electrodes, ceramic dielectric layers and a pair of external electrodes. The ceramic capacitor has a cuboid shape having long sides and short sides, the pair of external electrodes is formed on opposing long-side sides such that the external electrodes are separated by a distance in range of 30 ?m to 200 ?m and that each external electrode includes a conductive paste layer connected to a respective group of the internal electrodes and a copper plated layer covering the conductive paste layer, and the conductive paste layer includes Ni paste or Cu paste including glass component in range of 5% to 40%.
    Type: Grant
    Filed: March 11, 2015
    Date of Patent: May 16, 2017
    Assignees: IBIDEN CO., LTD., MURATA MANUFACTURING CO., LTD.
    Inventors: Toyotaka Shimabe, Masahiro Kaneko, Toshiki Furutani, Takeshi Tashima, Yasuyuki Shimada, Naoki Shimizu
  • Patent number: 9614522
    Abstract: The operating device, such as a human-machine interface, in particular for a vehicle component, is provided with a front wall having a front side that has several fixed symbol fields and having a rear side, a capacitive sensor system that has individual electrodes associated with the symbol fields, which electrodes are arranged on the rear side of the front wall, and a carrier plate that faces the rear side of the front wall and is arranged at a distance from the front wall.
    Type: Grant
    Filed: September 18, 2012
    Date of Patent: April 4, 2017
    Assignee: Behr-Hella Thermocontrol GmbH
    Inventors: Holger Kleine-Hollenhorst, Bernd Stich, Rainer Siebert
  • Patent number: 9607964
    Abstract: Embodiments describe a semiconductor package that includes a substrate, a die bonded to the substrate, and a solder paste overmold layer formed over a top surface of the die. In an embodiment, the solder paste comprises a high-melting point metal, a solder matrix, intermetallic compounds and a polymer. The overmold layer has a high elastic modulus, a coefficient of thermal expansion similar to the substrate, and reduces the warpage of the package. In an embodiment, interconnects of a semiconductor package are formed with a no-slump solder paste that includes vents. Vents may be formed through a conductive network formed by the high-melting point metal, solder matrix and intermetallic compounds. In an embodiment, vents provide a path through the interconnect that allows for moisture outgassing. In an embodiment, a mold layer may be mechanically anchored to the interconnects by the vents, thereby providing improved mechanical continuity to the mold layer.
    Type: Grant
    Filed: March 28, 2014
    Date of Patent: March 28, 2017
    Assignee: Intel Corporation
    Inventors: Omkar G. Karhade, Nitin A. Deshpande, Jr., Aditya Sundoctor Vaidya, Nachiket R. Raravikar, Eric J. Li
  • Patent number: 9595391
    Abstract: A ceramic electronic component that includes a ceramic element, and baked electrodes on a surface of the ceramic element. A resin film is formed at boundary sites between the ceramic element and the baked electrodes. The resin film includes a resin, and a cationic element that is a constituent element of the glass component in the baked electrodes.
    Type: Grant
    Filed: July 21, 2015
    Date of Patent: March 14, 2017
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Mitsunori Inoue, Naoko Nishimura, Tomohiko Mori
  • Patent number: 9589728
    Abstract: A multilayer ceramic capacitor includes a ceramic body including dielectric layers; first and second internal electrode groups disposed to be misaligned by a predetermined interval in the length direction, having the dielectric layers interposed therebetween; first and second external electrodes extended from at least one of the first and second side surfaces to at least one of the first and second main surfaces; and an insulating layer covering portions of the first and second external electrodes formed on the at least one of the first and second side surfaces, wherein the first internal electrode group includes first and second internal electrodes including first and second pattern parts and first and second lead parts, respectively, and the second internal electrode group includes third and fourth internal electrodes including third and fourth pattern parts and third and fourth lead parts, respectively.
    Type: Grant
    Filed: November 22, 2013
    Date of Patent: March 7, 2017
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yu Na Kim, Jae Yeol Choi, Jong Ho Lee, Sang Huk Kim, Doo Young Kim, Sung Woo Kim
  • Patent number: 9576730
    Abstract: A dielectric ceramic composition contains a base material main ingredient and an accessory ingredient. The base material main ingredient includes a first base material main ingredient containing BaTiO3 and a second base material main ingredient containing (Na1-yKy)NbO3. The base material main ingredient is represented by (1?x)BaTiO3-x(Na1-yKy)NbO3, in which x and y satisfy 0.005?x?0.5 and 0.3?y?1.0, respectively.
    Type: Grant
    Filed: October 8, 2015
    Date of Patent: February 21, 2017
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yun Jung Park, Seok Hyun Yoon, Chang Hoon Kim, Song Je Jeon, No Hoon Park, Soo Kyong Jo
  • Patent number: 9552977
    Abstract: Embodiments of systems, devices, and methods to minimize warping of ultrathin IC packaged products are generally described herein. In some embodiments, an apparatus includes an IC mounted on a package substrate, and a capacitive stiffener subassembly mounted on the package substrate. The capacitive stiffener subassembly includes a plurality of capacitive elements electrically connected to contacts of the IC.
    Type: Grant
    Filed: December 10, 2012
    Date of Patent: January 24, 2017
    Assignee: Intel Corporation
    Inventors: Mihir K Roy, Mathew J Manusharow
  • Patent number: 9536665
    Abstract: A high capacitance single layer ceramic capacitor having a ceramic dielectric body containing one or more internal electrodes electrically connected to a metallization layer applied to the side and a top or bottom surface and a metallization pad electrically isolated from the metallization side and the top or bottom surface by a castellation or a via or separated by a dielectric insulating band positioned between the electrodes around the perimeter of the ceramic body and separating the top and bottom surfaces.
    Type: Grant
    Filed: September 21, 2015
    Date of Patent: January 3, 2017
    Assignee: Knowles Capital Formation, Inc.
    Inventors: Ali Moalemi, Euan Patrick Armstrong
  • Patent number: 9520234
    Abstract: A multilayer ceramic capacitor and manufacturing method therefor, in which the capacitor includes a ceramic body including dielectric layers and internal electrodes; electrode layers connected to the internal electrodes; and a conductive resin layer formed on the electrode layers and including a first conductor, a second conductor having a fiber shape, and a base resin.
    Type: Grant
    Filed: December 6, 2013
    Date of Patent: December 13, 2016
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sim Chung Kang, Seung Hee Yoo, Jun Hyeong Kim, Eun Joo Choi, Kyu Ha Lee
  • Patent number: 9520235
    Abstract: A clad metal bus bar for a film capacitor may include a clad metal layer including: an aluminum layer; a first copper layer stacked on one surface of the aluminum layer; and a second copper layer stacked on the other surface of the aluminum layer.
    Type: Grant
    Filed: November 17, 2014
    Date of Patent: December 13, 2016
    Assignee: HYUNDAI MOBIS CO., LTD.
    Inventors: Deuk Kyu Hwang, Yong Chun, Kee Yang Lee
  • Patent number: 9466429
    Abstract: A capacitor assembly is provided with a plurality of wound capacitor elements aligned horizontally in a longitudinally extended housing, whereby the largest capacitor element solely occupies a tier in the housing, another tier in the housing is solely occupied by two of the capacitor elements, and wherein the capacitor elements are configurable to provide various capacitance values.
    Type: Grant
    Filed: February 4, 2015
    Date of Patent: October 11, 2016
    Assignee: Cornell Dubilier Marketing, Inc.
    Inventors: Hector Arsenio Casanova, Rui Miguel Batista, Brian L Padelford
  • Patent number: 9458063
    Abstract: A dielectric ceramic composition may include a base material main ingredient and an accessory ingredient. The accessory ingredient contains one or more selected from a group consisting of oxides and carbonates of one or more elements among Bi, Li, and Cu. When the accessory ingredient contains Bi, a content of Bi may be 0.1 to 1.0 part by mole, based on 100 parts by mole of the base material main ingredient, when the accessory ingredient contains Li, a content of Li may be 0.1 to 1.0 part by mole, based on 100 parts by mole of the base material main ingredient, and when the accessory ingredient contains Cu, a content of Cu may be 0.1 to 1.0 part by mole, based on 100 parts by mole of the base material main ingredient.
    Type: Grant
    Filed: October 6, 2014
    Date of Patent: October 4, 2016
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seok Hyun Yoon, Jae Sung Park, Chang Hoon Kim, Doo Young Kim
  • Patent number: 9460852
    Abstract: A laminated ceramic capacitor having a laminated body composed of a plurality of ceramic layers for inner layers; a plurality of internal electrodes at the interfaces between the plurality of ceramic layers for inner layers; and a plurality of ceramic layers for outer layers, provided on the top and bottom so as to sandwich the plurality of ceramic layers for inner layers. The ceramic layers for inner layers are composed of a material containing a multiple oxide including an alkaline-earth metal. The ceramic layers for outer layers respectively have TiO2 ceramic layers containing TiO2 as their main constituent for certain layers including the outermost layers, and multiple oxide ceramic layers containing a multiple oxide including an alkaline-earth metal for the other layers.
    Type: Grant
    Filed: March 14, 2014
    Date of Patent: October 4, 2016
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hiroyuki Wada, Kohei Shimada, Kenji Takagi, Tomomi Koga, Tomotaka Hirata, Hitoshi Nishimura, Hiroki Awata, Sui Uno
  • Patent number: 9396877
    Abstract: A high voltage capacitor comprises a columnar capacitor element body, made of a dielectric material, having a pair of principal surfaces opposing each other; a pair of electrodes arranged on the respective principal surfaces; a pair of terminal metal fittings connected to the respective electrodes; a case; and a resin part. The case contains a resin material and has a bottom part formed with an opening for exposing the terminal metal fitting and a trunk part extending from an edge of the bottom part in a direction intersecting the bottom part. The bottom part and trunk part define a space for containing the capacitor element body. The resin part is made of an insulating material and arranged within the case so as to seal the capacitor element body within the case. The case has a degree of hardness lower than that of the resin part.
    Type: Grant
    Filed: December 13, 2013
    Date of Patent: July 19, 2016
    Assignee: TDK CORPORATION
    Inventors: Iwao Miura, Hitoshi Kudo, Masato Sakakibara
  • Patent number: 9384891
    Abstract: Methods and systems for a metal finger capacitor with a triplet repeating sequence incorporating a metal underpass may comprise repeating triplet capacitors integrated on a semiconductor die. The capacitors may comprise a first set of interconnected metal fingers comprising a first terminal of a first capacitor, a second set of interconnected metal fingers comprising a first terminal of a second capacitor, and a third set of interconnected metal fingers comprising a common node that surrounds the first and second sets of interconnected metal fingers. The common node may comprise a second terminal of the capacitors. A repeating pattern of fingers may be: (third set/second set/third set/first set . . . ). The repeating pattern of metal fingers may be arranged in two parallel rows to mitigate variations in the semiconductor die. The interconnected metal fingers may comprise first and second metal layers formed on the semiconductor die.
    Type: Grant
    Filed: June 30, 2014
    Date of Patent: July 5, 2016
    Assignee: Maxlinear, Inc.
    Inventor: Weizhong Cai
  • Patent number: 9374908
    Abstract: In an electronic component, a laminate is obtained by laminating a plurality of ceramic layers, and includes an upper surface and a bottom surface which are at ends of the laminate in the z-axis direction, end surfaces facing each other, and side surfaces facing each other. First capacitor conductors, second capacitor conductors, and the ceramic layers are laminated. One of the first capacitor conductors and one of the second capacitor conductors face each other via one of the ceramic layers. A first external electrode and a second external electrode are located on one of the end surfaces and one of the side surfaces, respectively, and are connected to the first capacitor conductors. A third external electrode and a fourth external electrode are located on the other one of the end surfaces and the other one of the side surfaces, respectively, and are connected to the second capacitor conductors.
    Type: Grant
    Filed: August 30, 2012
    Date of Patent: June 21, 2016
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Yasuo Fujii
  • Patent number: 9363896
    Abstract: A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.
    Type: Grant
    Filed: January 14, 2014
    Date of Patent: June 7, 2016
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yasuhiro Nishisaka, Yukio Sanada, Koji Sato, Seiichi Matsumoto
  • Patent number: 9355775
    Abstract: A ceramic electronic component includes an electronic component body and a pair of metal terminals. The electronic component body includes a ceramic element assembly and outer electrodes. The pair of metal terminals are connected to the outer electrodes by a bonding member. Each of the pair of metal terminals includes a terminal body and a plated film that is located on a surface of the terminal body. In addition, each of the pair of metal terminals includes a terminal bonding portion, a mounting portion, and an extension portion that is provided between the terminal bonding portions and the mounting portion. A plating-removal portion from which the plated film is removed is provided at least at a peripheral surface of the mounting portion, and thus a surface of the terminal body is exposed.
    Type: Grant
    Filed: May 21, 2014
    Date of Patent: May 31, 2016
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Yoji Itagaki
  • Patent number: 9336948
    Abstract: A laminated ceramic capacitor includes a laminate including an inner layer portion including a ceramic dielectric layer and an internal electrode, and an outer layer portion defined by a ceramic dielectric layer. At both end portions of the laminate, external electrodes are connected to the internal electrode. In the outer layer portion, a glass layer is provided. An outer ceramic dielectric layer positioned outwardly of the glass layer has a different color from the color of an inner ceramic dielectric layer positioned inwardly of the glass layer.
    Type: Grant
    Filed: December 13, 2013
    Date of Patent: May 10, 2016
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hiroki Awata, Sui Uno, Takatoshi Sueto
  • Patent number: 9332645
    Abstract: A main body of an electronic part has multiple electrodes, to which multiple terminals are respectively connected. The terminals include a fuse terminal and a normal terminal, each of which extends from the main body to a printed board so that the main body is supported at a position above and separated from a board surface of the printed board. The fuse terminal has an intermediate portion between an electrode-connected portion and a land-connected portion. The intermediate portion has a cut-off portion having a smaller width than other portions of the fuse terminal, so that the cut-off portion is melted down when excess current flows in the fuse terminal. The intermediate portion extends in a direction parallel to the board surface or in a direction inclined to the board surface at an angle smaller than 90 degrees.
    Type: Grant
    Filed: February 26, 2014
    Date of Patent: May 3, 2016
    Assignees: DENSO CORPORATION, Murata Manufacturing Co., Ltd.
    Inventors: Yuuto Kamiya, Toru Itabashi, Ryoichi Shiraishi, Yuki Mikami, Akihiro Yanagisawa, Shigeki Nishiyama
  • Patent number: 9324501
    Abstract: A hard start capacitor replacement unit has a plurality of capacitors in a container sized to fit in existing hard start capacitor space. The capacitors are 4 metallized film capacitors wound in a single cylindrical capacitive element. The container has a common terminal and capacitors value terminals for the plurality of capacitors, which may be connected singly or in combination to provide a selected capacitance. An electronic or other relay connects the selected capacitance in parallel with a motor run capacitor. The hard start capacitor replacement unit is thereby adapted to replace a wide variety of hard start capacitors.
    Type: Grant
    Filed: June 9, 2014
    Date of Patent: April 26, 2016
    Assignee: American Radionic Company, Inc.
    Inventor: Richard W. Stockman
  • Patent number: 9313876
    Abstract: A mounting structure includes a first ceramic electronic component including a ceramic body including internal electrodes and outer electrodes. When a voltage is applied to the outer electrodes, the ceramic body is strained with a first strain amount, and a second ceramic electronic component including a ceramic body including internal electrodes and outer electrodes. When a voltage is applied to the outer electrodes, the ceramic body is strained with a second strain amount greater than the first strain amount. The second ceramic electronic component is arranged above the first ceramic electronic component, and the first and second ceramic electronic components are connected to each other via each other's outer electrodes. The first ceramic electronic component to which the second ceramic electronic component is connected is connected to a land on a circuit substrate via the outer electrodes of at least the first ceramic electronic component.
    Type: Grant
    Filed: May 30, 2013
    Date of Patent: April 12, 2016
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Kazuo Dogauchi
  • Patent number: 9269492
    Abstract: An orthogonal finger capacitor includes a layer having an anode bone frame adjacent a cathode bone frame, the anode bone frame having a first portion extending along an axis and a second portion extending perpendicular to the axis. A set of anode fingers extends from the first portion. A set of cathode fingers extends from the cathode bone frame, interdigitated with the set of anode fingers. An overlaying layer has another anode bone frame having a first portion parallel to the axis and a perpendicular second portion. A via couples the overlaying anode bone frame to the underlying anode bone frame. The via is located where the first portion of the overlaying anode bone frame overlaps the second portion of the underlying anode bone frame or, optionally, where the second portion of the overlying anode bone frame overlaps the first portion of the underlying anode bone frame.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: February 23, 2016
    Assignee: QUALCOMM Incorporated
    Inventors: John J. Zhu, Pr Chidambaram, Lixin Ge, Bin Yang, Jihong Choi
  • Patent number: 9240475
    Abstract: A semiconductor device is provided that includes a substrate including a device region and a peripheral region surrounding the device region, a first interconnection including one or more first conductive lines extending in a first direction, a second interconnection including one or more second conductive lines extending in the first direction, the second interconnection spaced apart from the first interconnection, a first conductive plate and a second conductive plate spaced apart from each other, the first conductive plate corresponding to the first interconnection and the second conductive plate corresponding to the second interconnection, one or more first vias connecting the first conductive lines to the first conductive plate and overlapping the device region and one or more second vias connecting the second conductive lines to the second conductive plate, the second vias overlapping the device region and arranged in a staggered, alternating configuration with the one or more first vias.
    Type: Grant
    Filed: July 17, 2013
    Date of Patent: January 19, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Yong-Don Kim
  • Patent number: 9209240
    Abstract: A capacitor from a Metal-Oxide-Metal (“MoM”) process may include a plurality of metal layers arranged with different design structures. The metal layers may be connected with vias. The metal layers may include wires, such as rows and/or fingers that are arranged for maximizing capacitance between adjacent fingers, as well as between fingers of different metal layers. As the spacing of the fingers is increased, the reliability, yield of final product, and ease of manufacturing both increase. The capacitor increases the spacing of wires/fingers while either maintaining or improving the capacitance per unit area.
    Type: Grant
    Filed: February 21, 2013
    Date of Patent: December 8, 2015
    Assignee: SanDisk Technologies Inc.
    Inventors: Santhosh Kumar, Smitha Naganna, Deepak Pancholi
  • Patent number: 9171673
    Abstract: Methods of fabricating an on-chip capacitor with a variable capacitance, as well as methods of adjusting the capacitance of an on-chip capacitor and design structures for an on-chip capacitor. The method includes forming first and second ports configured to be powered with opposite polarities, first and second electrodes, and first and second voltage-controlled units. The method includes configuring the first voltage-controlled unit to selectively couple the first electrode with the first port, and the second voltage-controlled unit to selectively couple the second electrode with the second port. When the first electrode is coupled by the first voltage-controlled unit with the first port and the second electrode is coupled by the second voltage-controlled unit with the second port, the capacitance of the on-chip capacitor increases.
    Type: Grant
    Filed: June 12, 2014
    Date of Patent: October 27, 2015
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Douglas M. Daley, Mete Erturk, Edward J. Gordon
  • Patent number: 9143011
    Abstract: A power receiving device includes a resonant coil, an electromagnetic coupling coil, a rectifier circuit, a smoothing circuit, a voltage converter circuit which converts a voltage value of DC power into another voltage value, a control circuit which obtains voltage and current values of the DC power input to the voltage converter circuit, calculates an impedance from the obtained voltage and current values, and generates a pulse width modulation signal for controlling an output voltage and an output current of the voltage converter circuit, and a load to which the output voltage and the output current of the voltage converter circuit are input. The duty ratio of the pulse width modulation signal is determined so that the impedance calculated by the control circuit becomes close to an impedance for the maximum efficiency in transferring the AC power. The power receiving device is included in a contactless power feeding system.
    Type: Grant
    Filed: September 13, 2012
    Date of Patent: September 22, 2015
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventor: Koichiro Kamata
  • Patent number: 9117595
    Abstract: An electronic component with terminal strips joined to end faces of external electrodes via a solder is characterized in that two plate-like supports of each terminal strip are formed by bending two plate-like parts projecting outward in a line-symmetrical manner from both side edges of a plate-like leg in the width direction such that at least tips of the thickness surfaces on the electronic component sides of the two plate-like parts are positioned below an external electrode of the electronic component, and the electronic component is supported from below by the tips of the thickness surfaces on the electronic component sides of the four plate-like supports. Slipping of the electronic component from both terminal strips due to melting of the solder can be suppressed in a reliable manner.
    Type: Grant
    Filed: August 29, 2013
    Date of Patent: August 25, 2015
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Naoki Saito, Katsunosuke Haga, Jae Hee Oh
  • Patent number: 9064640
    Abstract: An EMI filtered terminal assembly including at least one conductive terminal pin, a feedthrough capacitor, and a counter-bore associated with a passageway through the capacitor is described. Preferably, the feedthrough capacitor having counter-drilled or counter-bored holes on its top side is first bonded to a hermetic insulator. The counter-drilled or counter-bore holes in the capacitor provide greater volume for the electro-mechanical attachment between the capacitor and the terminal pin or lead wire, permitting robotic dispensing of, for example, thermal-setting conductive adhesive.
    Type: Grant
    Filed: June 25, 2013
    Date of Patent: June 23, 2015
    Assignee: Greatbatch Ltd.
    Inventors: Richard L. Brendel, Jason Woods, Jose Luis Lorente-Adame, Robert A. Stevenson, John E. Roberts, Buehl E. Truex
  • Patent number: 9042081
    Abstract: There is provided a multilayer ceramic capacitor including: a ceramic body having first and second side surfaces opposite to each other, and third and fourth end surfaces connecting the first and second side surfaces; a plurality of internal electrodes formed in the ceramic body and having one ends thereof exposed to the third or fourth end surface; and first and second side margin parts formed from the first and second side surfaces to respective edges of the internal electrodes, the first and second side margin parts having an average thickness of 18 ?m or less, wherein when a boundary surface between a cover layer and the first or second side margin part in the ceramic body is divided into two regions in a thickness direction of the ceramic body, a region adjacent to the internal electrode is S1, and a porosity of S1 is P1, 1?P1?20 is satisfied.
    Type: Grant
    Filed: June 21, 2013
    Date of Patent: May 26, 2015
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Hyung Joon Kim
  • Patent number: 9042080
    Abstract: There are provided a multilayer ceramic electronic component and a method of manufacturing the same. Here, an average diameter (Dc) of ceramic grains in a cover area is smaller than an average diameter (Da) of ceramic grains in the active area, and when a thickness of the cover area is expressed by Tc, 9 um?Tc?25 um and Tc/Dc?55 are satisfied. A multilayer ceramic capacitor having excellent moisture-resistance properties may be obtained.
    Type: Grant
    Filed: December 26, 2012
    Date of Patent: May 26, 2015
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hyo Jung Kim, Seok Hyun Yoon, Chang Hoon Kim, Byoung Hwa Lee, Sang Hoon Kwon