Abstract: A semiconductor module includes: a semiconductor device having a front-side electrode; a bonding wire having a bonding portion bonded to the front-side electrode; a first sealing member; and a second sealing member. The first sealing member seals a portion where the front-side electrode and the bonding wire are bonded to each other. The second sealing member covers the first sealing member. The first sealing member is higher than the second sealing member in elastic modulus.

Abstract: An improved electronic component is described. The electronic component has a capacitor with first planer internal electrodes in electrical contact with a first termination and second planer internal electrodes in electrical contact with a second termination. A dielectric is between the first planer electrodes and the second planer internal electrodes. The electronic component further comprises at least one of: an inductor comprising a conductive trace wherein said conductive trace is between the first termination and a third termination; and an overvoltage protection component comprising: a third internal electrode contained within the dielectric and wherein the third internal electrode is electrically connected to the first termination; a fourth internal electrode contained within the ceramic and electrically connected to a fourth termination; and a gap between the third internal electrode and the fourth internal electrode.

Abstract: A solid capacitor and the manufacturing method thereof are disclosed. The solid capacitor consists of a dielectric layer and two electrodes. A plurality of holes formed by an opening process is disposed on surface of the dielectric layer. The two electrodes connect with the dielectric layer by the holes. By means of a plurality of high temperature volatile matters, the plurality of holes is formed on surface of the dielectric layer during sintered process. The holes are connected with the outside so as to increase surface area of the dielectric layer and further the capacity is increased. And the solid capacitor stores charge by physical means. Moreover, the solid capacitor can be stacked repeatedly to become a multilayer capacitor.

Abstract: The mica capacitor and fabrication method there for, resulting in parallely stacking basic laminates in which an electrode sheet is arranged between parallely stacked mica sheets to protrude in a zigzag manner, arranging an insulation plate in which the basic laminates are parallely stacked where the insulation plate protruding in a zigzag manner is formed between the basic laminates, and filling a conductor between insulation protrusions, whereby a parallel connection is implemented on the basic laminates themselves while a serial connection is implemented between the basic laminates, thereby enabling a provision of mica capacitor having a high voltage property.

Abstract: Electrical contact between foil electrodes and conductive coated plates in a solid dielectric capacitor is improved by coating or embossing the foil electrodes with a conductive particulate material.

Abstract: A mica capacitor is made of two elementary modular mica capacitors which can be of different values. The leads of the capacitor are placed between the two modular mica capacitors.