Abstract: An interconnect structure for an integrated circuit includes a plurality of first-type interconnect elements and a second-type of interconnect element which directly contact an underlying first-type interconnect element. The second-type interconnect element extends along a first axis to define a horizontal length and along a second axis to define a vertical height. The second-type interconnect element and the first-type interconnect element define a conductive via comprising a metal material extending continuously along the second axis from a base of the underlying first-type interconnect element and stopping at the upper surface of the second-type interconnect element. The vertical height of the second-type interconnect element is greater than the vertical height of the first-type interconnect elements.

Abstract: A multilayer ceramic electronic component includes: a body including dielectric layers as well as a plurality of internal electrodes stacked with respective dielectric layers interposed therebetween and including a first metal; and external electrodes disposed on external surfaces of the body including a second metal, wherein at least some of the plurality of internal electrodes include a core-shell region including the first and second metals, and average contents of the second metal in a core portion and a shell portion of the core-shell region are different from each other.

Abstract: An energy storage element and method of fabrication thereof are disclosed. An energy storage element includes a set of electrodes where one or more electrodes have extended conductive paths through nano-channel electric interconnections with ceramic particles in one or more dielectric layers. The electrode's electric field is extended into the dielectric material providing increased capacitance. The set of electrodes can include a pair of electrode layers respectively attached directly to opposing sides of one dielectric layer. The set of electrodes, which can also be referred to as multi-layer electrodes, can include a plurality of electrode layers interleaved between, and directly attached to, a plurality of stacked dielectric layers.

Abstract: A multilayer capacitor includes a capacitor body including first to sixth surfaces, dielectric layers and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween in a first direction; and first and second external electrodes; wherein the first and second internal electrodes are disposed to be offset in the first direction, wherein a first plurality of the first and second internal electrodes is disposed to be adjacent to the fifth surface in the third direction, a second plurality is disposed to be adjacent to the sixth surface in the third direction, and a third plurality is disposed in a central region in the third direction, and wherein internal electrodes among the first and second internal electrodes, disposed to be adjacent to the surface in the same direction, include an even number of two or more of internal electrodes disposed to be offset therebetween.

Abstract: In this present invention lateral voltage variable capacitor designs are disclosed. The lateral voltage variable capacitor utilizes a dielectric material with an electric field dependent dielectric permittivity (dielectric constant). Variable capacitor structures are defined laterally in the plane of the substrate as opposed to vertical device structures defined out of the plane of the substrate.

Abstract: An apparatus includes a dielectric tile array including a plurality of dielectric tiles; and a plurality of electroactive (EA) material blocks configured to expand or contract in response to being actuated by the application of an actuation voltage.

Abstract: A capacitor component includes a body having a lamination portion in which first internal electrodes and second internal electrodes are alternately disposed to face each other in a first direction with dielectric layers disposed therebetween, and first and second margin portions disposed on respective opposing sides of the lamination portion in a second direction perpendicular to the first direction. First and second external electrodes are disposed on respective opposing sides of the body in a third direction and are electrically connected to the first and second internal electrodes, respectively. Each of the first and second margin portions includes a reinforcing pattern.

Abstract: A multi-layer ceramic electronic component includes: a ceramic body including internal electrodes laminated in a first direction, a first main surface including a first flat region facing in the first direction, and a second main surface including a second flat region facing in the first direction; and a pair of external electrodes connected to the internal electrodes and facing each other in a second direction orthogonal to the first direction, a dimension of the ceramic body in the first direction being 1.1 times or more and 1.6 times or less a dimension of the ceramic body in a third direction orthogonal to the first and second directions, the first flat region being formed at a center portion of the first main surface in the second direction, the second flat region being formed at a center portion of the second main surface in the third direction.

Abstract: A multilayer capacitor includes a body including a multilayer structure in which a plurality of dielectric layers are stacked and a plurality of internal electrodes stacked with the dielectric layer interposed therebetween and external electrodes disposed on an exterior of the body and connected to the internal electrodes. At least one of the plurality of dielectric layers includes a plurality of grains, and a ratio of grains having dislocations, among the plurality of grains, is 20% or greater.

Abstract: A method of capacitance structure manufacturing includes following operations. A plurality of insulating tubes is formed over a substrate and perpendicular to the substrate. A first supporting layer and a second supporting layer above the first supporting layer are formed and connect the insulating tubes. The first supporting layer protrudes from the second supporting layer. Conductive material is filled in the insulating tubes to form rod capacitors forming a capacitor array and the capacitor array is covered by an oxide layer from its top to the substrate. The oxide layer is formed along the first supporting layer and the second supporting layer such that the oxide layer extends along a direction having an angle with respect to the substrate.

Abstract: A capacitor that includes a substrate, a lower electrode on the substrate, a dielectric film on the lower electrode, an upper electrode on a part of the dielectric film, a protective layer that covers the lower electrode and the upper electrode, and an external electrode that penetrates the protective layer. The external electrode is formed only in a region defined by a periphery of the upper electrode in a plan view of the capacitor viewed from an upper surface thereof towards the substrate.

Abstract: In a multilayer ceramic electronic component, a stacked body includes a first outer layer and a first outermost internal electrode layer. The first outer layer defines a first main surface. The first outermost internal electrode layer is adjacent to the first outer layer. The first outermost internal electrode layer is in contact with a first external electrode at a first end surface. The thickness of the first outer layer at the first end surface is greater than the thickness of the first outer layer at the center or approximate center in a length direction.

Abstract: A method of manufacturing a multilayer ceramic electronic component includes preparing a ceramic green sheet, forming an internal electrode pattern by applying a paste for an internal electrode including a conductive powder to the ceramic green sheet, forming a ceramic laminate structure by layering the ceramic green sheet on which the internal electrode pattern is formed, forming a body including a dielectric layer and an internal electrode by sintering the ceramic laminate structure, and forming an external electrode by forming an electrode layer on the body, and forming a conductive resin layer on the electrode layer, and the conductive powder includes a conductive metal and tin (Sn), and a content of tin (Sn) is 1.5 wt % or higher, based on a weight of the conductive metal.

Abstract: A multilayer ceramic capacitor includes a laminate including ceramic layers and internal electrode layers laminated together in a lamination direction, and at a widthwise end of at least one of the internal electrode layers in a cross section of the laminate perpendicular to the lamination direction, a ratio of a length X to a length Y is about 1.2 or more and about 3.0 or less, where the length X denotes a length of a straight boundary line between the internal electrode layer and the ceramic layer when the shape of the internal electrode layer is considered as a polygon, and the length Y denotes a length of an actual boundary line between the internal electrode layer and the ceramic layer.

Abstract: A semiconductor processing system is provided to form a capacitor dielectric layer in a metal-insulator-metal capacitor. The semiconductor processing system includes a precursor tank configured to generate a precursor gas from a metal organic solid precursor, a processing chamber configured to perform a plasma enhanced chemical vapor deposition, and at least one buffer tank between the precursor tank and the processing chamber. The at least one buffer tank is coupled to the precursor tank via a first pipe and coupled to the processing chamber via a second pipe.

Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers and first and second inner electrodes that are laminated, and first and second outer electrodes. Each of the first inner electrodes includes a first opposing electrode portion and a first extending electrode portion. The first extending electrode portions at least positioned in a vicinity of the first and second principal surfaces in a lamination direction among the first inner electrodes include a first bent portion bent inward and a second bent portion bent outward in the lamination direction. A distance between vertices of the first and second bent portions in the lamination direction in the first inner electrodes positioned in the vicinity of the first and second principal surface in a lamination direction is larger than a distance in the first inner electrodes positioned in a central portion in the lamination direction.

Abstract: A semiconductor device includes a substrate, a fin protruding over the substrate, a gate structure over the fin, a bottom electrode over and electrically coupled to the gate structure, a ferroelectric layer around the bottom electrode, and a top electrode around the ferroelectric layer.

Abstract: The present invention provides a chip component that achieves outstanding LC characteristics. The present invention provides a chip component (1), including: a substrate (12); an inorganic insulating layer (13), formed on the substrate (12); an organic insulating layer (14), formed on the inorganic insulating layer (13); and an LC circuit (6), including a first capacitor (C1) formed in the inorganic insulating layer (13), and a first inductor (L1) formed, in a manner of being electrically connected to the first capacitor (C1), in the organic insulating layer (14).

Abstract: Ceramic raw material powder includes: a main phase having a perovskite structure, wherein elements acting as a donor and an acceptor are solid-solved in B sites of the perovskite structure, wherein a relationship of (concentration of the element acting as a donor)×(valence of the element acting as a donor?4)<(concentration of the element acting as an acceptor)×(4?valence of the element acting as an acceptor) is satisfied, in a center region of each grain of the ceramic raw material powder, wherein a relationship of (concentration of the element acting as a donor)×(valence of the element acting as a donor?4)>(concentration of the element acting as an acceptor)×(4?valence of the element acting as an acceptor) is satisfied, in a circumference region of each grain of the ceramic raw material powder.

Abstract: The present disclosure provides a substrate for an integrated circuit. The substrate includes a dielectric layer. The substrate further includes a plurality of conductive elements at least partially embedded within the dielectric layer and having a substantially smooth outer surface. The substrate further includes an interlayer disposed between the individual conductive elements and the dielectric layer. The interlayer has a first surface comprising a plurality of protrusions interlocked with the dielectric layer and a second surface adhered to the outer surface of the individual conductive elements.

Abstract: A multilayer ceramic capacitor includes: a multilayer chip in which each of dielectric layers and each of internal electrode layers are alternately stacked and each of the internal electrode layers is alternately exposed to two end faces; external electrodes including a ground layer and a plated layer, the ground layer extending from the two end faces to at least one face of four faces of the multilayer chip, the plated layer being provided on the ground layer, a part of the plated layer contacting the at least one face; and a dummy layer that is provided between a capacity region and the at least one face and intersects with a region in which the plated layer contacts the multilayer chip without the ground layer, a main component of the dummy layer being a metal or an alloy including at least Ni.

Abstract: An electro-optic device includes a substrate and a waveguide on the substrate. The waveguide includes a layer stack including a plurality of electro-optic material layers interleaved with a plurality of interlayers, a waveguide core adjacent to the layer stack, a waveguide cladding layer, and a pair of electrodes in electrical contact with the plurality of electro-optic material layers. The plurality of interlayers maintains a first lattice structure at room temperature and a cryogenic temperature. The plurality of electro-optic material layers maintains a second lattice structure and crystallographic phase at the room temperature and the cryogenic temperature.

Abstract: An electrode includes a core portion including a first metal, and a porous portion disposed in contact with the core portion. The porous portion includes a porous body, a first dielectric layer, and a second dielectric layer. The porous body is integrated with the core portion and includes the first metal. The first dielectric layer covers at least a part of a surface of the porous body. And the second dielectric layer covers at least a part of the first dielectric layer. The first dielectric layer includes oxide of first metal, and the second dielectric layer includes oxide of a second metal. The second metal is different from the first metal. When T is a thickness of the porous portion, the second metal is distributed to a region closer to the core portion than a position of 0.5T from a boundary between the core portion and the porous portion.

Abstract: A capacitor that includes a substrate, a lower electrode on the substrate, a dielectric film on the lower electrode, an upper electrode on a part of the dielectric film, a protective layer that covers the lower electrode and the upper electrode, and an external electrode that penetrates the protective layer. The external electrode is formed only in a region defined by a periphery of the upper electrode in a plan view of the capacitor viewed from an upper surface thereof towards the substrate.

Abstract: An electronic device is disclosed. The electronic device includes a conductor, and a conductive oxide material electrically connected to the conductor. The conductive oxide materials is substantially amorphous, and the conductive oxide material includes first and second oxide materials. In addition, the first oxide material is different from the second oxide material. The electronic device also includes a second material, electrically connected to the conductive oxide material.

Abstract: An electrical discharge irrigation device and method is described. An electrical discharge irrigation device includes a power source, a circuit coupled to the power source, and an output tip coupled to the circuit. The output tip includes a first end and a second end and a longitudinal axis extending between them, an electrode located in an interior space of the output tip configured to receive an electrical charge from the circuit and to release an electric discharge, and a ground return including an inner surface of the output tip, wherein a space between the electrode and the ground return comprises a conductive medium, the conductive medium being in contact with the electrode and the ground return to produce the electric discharge.

Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and a plurality of internal electrodes disposed to face each other with each of the dielectric layers interposed therebetween, and external electrodes disposed on external surfaces of the ceramic body and electrically connected to the internal electrodes, respectively. The external electrodes include electrode layers electrically connected to the internal electrodes and conductive resin layers disposed on the electrode layers, and the conductive layers are disposed to extend first and second surfaces of the ceramic body. When a distance from an outer edge of one of the first or second external electrodes disposed on a first or second surface to an inner edge thereof is defined as BW and surface roughness of the ceramic body is defined as Ra, a ratio of 100 times the surface roughness Ra to the distance BW (Ra*100/BW) satisfies (Ra*100/BW)?1.0.

Abstract: Oxide compositions comprising a modified structure which includes the formula ABOz. The A component may comprise at a cation of least one element selected from the group consisting of Mg, Ca, Sr, Ba, Sc, Y, La, Ce, Pr, Nd, Gd, and Zn, and the B component may comprise a cation of at least one element selected from the group consisting of V, Cr, Mn, Fe, Co, and Ni. Batteries and supercapacitors comprising the oxide compositions of the present disclosure and methods of making the oxide compositions of the present disclosure are also provided.

Abstract: A multilayer ceramic capacitor includes a ceramic body including a plurality of dielectric layers stacked therein in a stacking direction; first and second external electrodes disposed externally on the ceramic body; first and second internal electrodes alternately stacked with the plurality of dielectric layers, forming an internal active layer of the ceramic body, and respectively connected to the first and second external electrodes; a dummy layer, including a conductive material and having a mesh shape, disposed in at least one of an upper cover layer or a lower cover layer respectively disposed above or below the internal active layer of the ceramic body in the stacking direction.

Abstract: A multi-layer ceramic electronic component includes a ceramic body enclosing internal electrodes laminated in a first direction, wherein the ceramic body has a main surface having a flat face normal to the first direction, a first side surface having a flat face normal to a second direction orthogonal to the first direction, and a rounded ridge connecting the main surface and the first side surface to each other and curved in a convex shape; a maximum dimension of the ceramic body in the first direction is 120 ?m or less; and the rounded ridge satisfies a condition of Rb/Ra>3.0, where Ra represents a dimension of the rounded ridge in the first direction and Rb represents a dimension of the rounded ridge in the second direction on a cross-sectional surface of the ceramic body taken along a virtual cut plane parallel to the first direction and the second direction.

Abstract: A dielectric material includes a layered metal oxide including a first layer having a positive charge and a second layer having a negative charge, wherein the first layer and the second layer are alternately disposed; a monolayered nanosheet; a nanosheet laminate of the monolayered nanosheets; or a combination thereof, wherein the dielectric material includes a two-dimensional layered material having a two-dimensional crystal structure, wherein the two-dimensional layered material is represented by Chemical Formula 1 X2[A(n?1)MnO(3n+1)]??Chemical Formula 1 wherein, in Chemical Formula 1, X is H, an alkali metal, a cationic polymer, or a combination thereof, A is Ca, Sr, La, Ta, or a combination thereof, M is La, Ta, Ti, or a combination thereof, and n?1.

Abstract: A multilayer ceramic capacitor includes: a multilayer structure in which each of a plurality of dielectric layers and each of internal electrode layers are alternately stacked; wherein a main component of the dielectric layers is a ceramic material, wherein a main phase of the ceramic material has a perovskite structure expressed by a general formula ABO3, wherein a B site of the ceramic material includes an element acting as a donor; wherein an A site and the B site of the ceramic material includes a rare earth element, wherein (an amount of the rare earth element substitutionally solid-solved in the A site)/(an amount of the rare earth element substitutionally solid-solved in the B site) is 0.75 or more and 1.25 or less.

Abstract: An optical apparatus may comprise: an electrically reconfigurable optical layer comprising at least one phase-change material, wherein an optical property of the phase-change material is reconfigurable by an electric field; an optically transparent top electrode and a bottom electrode, the top and bottom electrodes configured to apply the electric field to the electrically reconfigurable optical layer, wherein the electrically reconfigurable optical layer is disposed between the optically transparent top electrode and the bottom electrode; and a colossal-K dielectric layer disposed between the electrically reconfigurable optical layer and the bottom electrode. The phase-change material of the electrically reconfigurable optical layer may comprise phase-change nickelate or tungsten oxide. The phase-change material of the electrically reconfigurable optical layer may have a perovskite structure.

Abstract: A ceramic dielectric including: a bulk dielectric including barium (Ba) and titanium (Ti); a ceramic nanosheet; and a composite dielectric of the bulk dielectric and the ceramic nanosheet.

Abstract: A plasma processing apparatus includes: a processing chamber in which a sample is subjected to plasma treatment; a radio frequency power supply configured to supply radio frequency power that generates plasma; a sample stage on which the sample is placed; and an ultraviolet light source configured to apply an ultraviolet ray. The apparatus further includes a controller configured to control the ultraviolet light source such that before the radio frequency power is supplied into the processing chamber, a pulse-modulated ultraviolet ray is applied into the processing chamber.

Abstract: An integrated circuit structure includes: a first conductive plate disposed in a first layer on a semiconductor substrate; a second conductive plate disposed in a second layer on the semiconductor substrate; a plurality of conductive lines disposed in the first layer, for surrounding the first conductive plate; and a plurality of conductive vias arranged to couple the plurality of conductive lines to the second conductive plate; wherein the second layer is different from the first layer, and the first conductive plate is physically separated from the second conductive plate, the plurality of conductive lines, and the plurality of conductive vias.

Abstract: Embodiments of the present disclosure provide an arrangement for single wire communications (SWC) for an electronic device. In one instance, the arrangement may comprise a cable assembly to connect with the electronic device, wherein the cable assembly may include a wire to conduct SWC and a cover portion to cover a portion of the wire. The cover portion may comprise a ferro-dielectric material. The arrangement may further include a control logic coupled with the cable assembly, to adjust characteristics associated with the ferro-dielectric material, to tune a signal termination impedance value associated with the cable assembly. Other embodiments may be described and/or claimed.

Abstract: In a thin film capacitor, a first electrode layer 1 has one or more regions B in which a distance Hb between a boundary surface I of the first electrode layer 1 and a dielectric layer 2, and a surface of the first electrode layer 1, becomes maximum, and an outer layer 12 has one or more regions T in which a distance Ht between the boundary surface I and a surface of the outer layer 12 becomes maximum, as well as one or more regions t in which the distance Ht between the boundary surface I and the surface of the outer layer 12 does not become maximum. A projected area SHb, a projected area SHt, and a projected area S, satisfy equations (1) and (2): 60%?(SHb/S)??(1); 60%?(SHt/S)??(2).

Abstract: An electronic component embedded substrate includes: a substrate that includes an insulating layer and has a first principal surface and a second principal surface; an electronic component that is embedded in the substrate and has at least one first terminal, at least one second terminal, and a capacity part; at least one via conductor that are formed in the insulating layer and electrically connected to the second terminal; and an adhesion layer that is in contact with the second terminal on an end face of the second terminal which are close to the second principal surface. The electronic component is laminated with the insulating layer, and adhesion strength between the adhesion layer and the insulating layer is higher than that between the second terminal and the insulating layer.

Abstract: A multilayer ceramic capacitor having a ceramic sintered body with alternately laminated dielectric layers and internal electrodes. The dielectric layers are formed from a perovskite-type compound represented by the general formula ABO3, and the perovskite-type compound contains at least Ti and a volatile element that forms a solid solution at a B site thereof. The internal electrodes are formed from a base metal material and contain the volatile element. The content of the volatile element is greater than 0 parts by mole and less than or equal to 0.2 parts by mole with respect to 100 parts by mole of the constituent element at the B site, and excluding the volatile element at the B site.

Abstract: A multilayer ceramic electronic component includes: a ceramic body including a dielectric layer and first and second internal electrodes stacked to be alternately exposed to one side surface and the other side surface with the dielectric layer disposed therebetween; and first and second external electrodes disposed on an external surface of the ceramic body to be connected to the first and second internal electrodes, respectively, in which the ceramic body includes an area of overlap in a thickness direction of the first and second internal electrodes, margin region, and/or cover region, and the margin region in the width direction and/or the cover region includes a phosphoric acid-based second phase.

Abstract: Disclosed are a dielectric material, a multi-layered capacitor, and an electronic device including the same. The dielectric material includes a dielectric material particle represented by ADO3, wherein A includes Sr, Ba, Ca, Pb, K, Na, or a combination thereof, D includes Ti, Zr, Mg, Nb, Ta, or a combination thereof, the dielectric material particle includes about 2.5 moles to about 4 moles of the donor element, based on 100 moles of D, and a diameter of the dielectric material particle is in a range of from about 100 nanometers to about 300 nanometers.

Abstract: A printed wiring board includes a core substrate having cavity to accommodate an electronic component and including a front conductor layer formed on front side of the core substrate, and a back conductor layer formed on back side of the core substrate, through-hole conductors formed through the core substrate such that the through-hole conductors connect the front and back conductor layers of the core substrate, a front build-up layer formed on front surface of the core substrate and including interlayer insulating layers and conductor layers, and a back build-up layer formed on back surface of the core substrate and including interlayer insulating layers and conductor layers. The conductor layers in the front build-up layer include a conductor layer sandwiching one of the interlayer insulating layers with the front conductor layer such that the conductor layer and the front conductor layer have the same electric potential in region surrounding the cavity.

Abstract: An improved multilayer ceramic capacitor is described. The multilayered ceramic capacitor comprises first internal electrodes and second internal electrodes. The first internal electrodes and said second internal electrodes are parallel with dielectric there between. A first external termination is in electrical connection with the first internal electrodes and a second external termination is in electrical contact with the second internal electrodes. A closed void layer, comprising at least one closed void, is between electrodes.

Abstract: A capacitor component includes a body in which a dielectric layer and an internal electrode are alternately stacked, and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a composite layer including a dielectric material powder and a metallic particle and first and second protective layers including a dielectric material powder and spaced apart by the composite layer. A thickness of each of the first and second protective layers is equal to or greater than ? of a thickness of the dielectric layer.

Abstract: Sensors, sensing arrangements and devices, and related methods are provided. In accordance with an example embodiment, an impedance-based sensor includes a flexible dielectric material and generates an output based on pressure applied to the dielectric material and a resulting compression thereof. In certain embodiments, the dielectric material includes a plurality of regions separated by gaps and configured to elastically deform and recover in response to applied pressure.

Abstract: A multilayer ceramic capacitor includes a ceramic body with first and second internal electrodes facing each other and dielectric layers interposed therebetween. First and second external electrodes are on external surfaces of the ceramic body and electrically connected to the first and second internal electrodes, respectively. A dielectric layer includes dielectric grains including, respectively, first regions in which dysprosium (Dy) is not present and second regions surrounding the first regions. Where a shortest distance between boundaries of the first regions (in which dysprosium (Dy) is not present) of two of the dielectric grains is “L,” the concentration of dysprosium (Dy) in a region within ±0.2 L from a halfway point between the boundaries is lower than that of dysprosium (Dy) in the second regions.

Abstract: A multilayer ceramic capacitor includes a ceramic body with first and second internal electrodes facing each other and dielectric layers interposed therebetween. First and second external electrodes are on external surfaces of the ceramic body and electrically connected to the first and second internal electrodes, respectively. A dielectric layer includes dielectric grains including, respectively, first regions in which dysprosium (Dy) is not present and second regions surrounding the first regions. Where a shortest distance between boundaries of the first regions (in which dysprosium (Dy) is not present) of two of the dielectric grains is “L,” the concentration of dysprosium (Dy) in a region within ±0.2L from a halfway point between the boundaries is lower than that of dysprosium (Dy) in the second regions.

Abstract: A multilayer ceramic capacitor includes a ceramic body with first and second internal electrodes facing each other and dielectric layers interposed therebetween. First and second external electrodes are on external surfaces of the ceramic body and electrically connected to the first and second internal electrodes, respectively. A dielectric layer includes dielectric grains including, respectively, first regions in which dysprosium (Dy) is not present and second regions surrounding the first regions. Where a shortest distance between boundaries of the first regions (in which dysprosium (Dy) is not present) of two of the dielectric grains is “L,” the concentration of dysprosium (Dy) in a region within ±0.2 L from a halfway point between the boundaries is lower than that of dysprosium (Dy) in the second regions.

Abstract: A method for producing a galvanic element includes applying a first electrode to a substrate, applying a separator to the first electrode, and applying a second electrode to the separator. At least one of the electrodes is applied in the form of a composite electrode using an aerosol separation method.