Aluminum Or Tantalum Patents (Class 361/529)
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Patent number: 5559667Abstract: A capacitor includes a cathode having a porous coating including an oxide of one of ruthenium, iridium, nickel, rhodiumm platinum, palladium, and osmium, an anode including a metal selected from the group consisting of tantalum, aluminum, niobium, zirconium, and titanium, spaced from the porous coating, and an electrolyte in contact with the porous coating and the anode.Type: GrantFiled: August 11, 1995Date of Patent: September 24, 1996Assignee: Evans Findings CompanyInventor: David A. Evans
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Patent number: 5518823Abstract: An aluminum foil to be etched for use as the electrolytic condenser electrodes is composed of a foil body of an aluminum purity of 99.9% or higher, and an oxide layer 20-70 .ANG. thick and formed due to contact of the foil body with an oxidizing atmosphere. At least one etching nuclei-forming element is concentrated in a boundary region and/or in an outermost surface region of the oxide layer, the boundary region being disposed between the foil body and the oxide layer, and both the regions having a thickness of 20 .ANG. or less. The ratio in ion intensity of a maximum concentration of the elements in these regions to a concentration of the elements in the inner layer of the foil body is 1.2-30. There are three patterns in distribution of the elements, so that the maximum concentration is in a predetermined ratio to the concentration in the surface region, the inner layer or a minimum concentration appearing between the regions.Type: GrantFiled: September 12, 1994Date of Patent: May 21, 1996Assignee: Showa Aluminum KabushikiInventors: Tadao Fujihira, Masashi Sakaguchi, Kiyoshi Tada, Makoto Tanio, Eizo Isoyama
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Patent number: 5486977Abstract: A process is provided for making a tantalum capacitor chip which includes a tantalum chip body as well as an anode wire partially inserted into and partially projecting from the chip body. The process comprises the steps of compacting an initial divided amount of tantalum powder into an initial mass portion which is dimensionally smaller than the chip body, and compacting at least one additional divided amount of tantalum powder with the initial mass portion into the chip body. The capacitor chip thus obtained may be enclosed in a resin package to provide a surface mounting type tantalum capacitor.Type: GrantFiled: November 30, 1993Date of Patent: January 23, 1996Assignee: Rohm Co., Ltd.Inventor: Miki Hasegawa
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Patent number: 5483415Abstract: A solid electrolytic capacitor is provided which comprises a capacitor element including a porous sintered chip of metal particles, a solid electrolytic substance electrically insulated from the metal particles by a dielectric substance, an anode terminal layer electrically connected to the metal particles, and a cathode terminal layer electrically connected to the solid electrolytic substance. The capacitor element has a terminal portion located adjacent to the anode terminal layer and provided with barrier means for preventing the solid electrolytic substance from entering to the terminal portion.Type: GrantFiled: February 25, 1994Date of Patent: January 9, 1996Assignee: Rohm Co., Ltd.Inventors: Shinji Nakamura, Miki Hasegawa
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Patent number: 5469326Abstract: Provided is a solid electrolytic capacitor including a capacitor element, an internal anode lead extending from a substantially central portion of one lateral surface of the capacitor element, other surfaces of the capacitor element normal to the lateral surface being adapted to serve as cathode terminal walls, an external anode lead connected to the internal anode lead, an external cathode lead connected to one of the cathode terminal wall, and a resin mold encapsulating the capacitor element as well as connecting portions associated therewith, wherein the external anode lead connected to the internal anode lead is bent to have at least two steps at its end portion, a lower step of said at least two steps being fixed to another one of the cathode terminal walls through an insulating material, an upper step of said at least two steps being fixed to the internal anode lead.Type: GrantFiled: October 8, 1993Date of Patent: November 21, 1995Assignee: Rohm Co., Ltd.Inventor: Yasuo Kanetake
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Patent number: 5461538Abstract: A capacitor element for a solid electrolytic capacitor is provided which comprises a sintered chip of metal powder, the chip having a first end and a second end opposite to the first end. The chip includes a tapered body whose cross-sectional area reduces from the first end to the second end, and a cathode layer covering the chip excepting at least the first end.Type: GrantFiled: April 7, 1994Date of Patent: October 24, 1995Assignee: Rohm Co., Ltd.Inventor: Chojiro Kuriyama
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Patent number: 5448447Abstract: A process for producing capacitor grade powder, electrodes, and finished capacitors therefrom having reduced electrical leakage characteristics. The powder is prepared by reacting Group V-B base materials with quantities of between 500 to 7000 ppm of nitrogen and 700 to 3000 ppm of oxygen. Electrical leakage is reduced by at least 28% for electrodes anodized at 100 volts or greater in comparison with electrodes and finished capacitors made from undoped materials. A range of specific charge of up to 25,000 uFV/g is achieved for sintering temperatures of 1400.degree. C. to 1800.degree. C.Type: GrantFiled: April 26, 1993Date of Patent: September 5, 1995Assignee: Cabot CorporationInventor: Hongju Chang
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Patent number: 5431971Abstract: The invention relates to a plate which is intended to produce either an anode or a cathode of an electrolytic condenser. The plate is in the form of an electricity conducting substrate coated with an aluminium based deposit constituted of grain agglomerates where more than 50% by weight of the total deposited aluminium is in oxide state and forms a porous matrix of aluminium oxide containing metallic aluminium crystallites. The invention enables plates to be obtained which have an increased output, and the invention thus enables the condensers which will be associated with them to be of reduced size.Type: GrantFiled: February 12, 1993Date of Patent: July 11, 1995Assignee: SatmaInventors: Francis Allegret, Mohamed Benmalek, Emmanuel Gariel
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Patent number: 5390074Abstract: A chip-type solid electrolytic capacitor includes a cathode conductive layer provided on a whole surface of a cathode layer formed on an outer surface of a capacitor element, which whole surface is opposite to a surface where an anode lead wire is lead out, and on a surface adjacent to the first-mentioned whole surface. With this arrangement, if the capacitor element is obliquely inserted into a mold during the formation of a resin shell, the inner walls of the mold will not come into contact with cathode layer of the capacitor element, but will instead come into contact with the cathode conductive layer to prevent the cathode layer from being exposed to the resin shell. As a result, any possible damage to the cathode layer of the capacitor element when the peripheral surface of the resin shell on a cathode side is subjected to roughening is prevented to eliminate defects in electric characteristics such as leakage of electric current and a tan.delta. value.Type: GrantFiled: September 23, 1992Date of Patent: February 14, 1995Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Nobuo Hasegawa, Sumio Nishiyama, Hideto Yamaguchi, Takashi Ida, Junichi Kurita, Koji Ueoka, Yasuhiro Kobashi, Hideo Hashimoto
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Patent number: 5357399Abstract: A method of simultaneously forming a multiplicity of surface mountable solid state capacitors is disclosed.Type: GrantFiled: September 25, 1992Date of Patent: October 18, 1994Assignee: AVX CorporationInventor: Ian Salisbury
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Patent number: 5268822Abstract: The object of the invention is a lead frame for electrolytic capacitor anodes characterized by the fact that it comprises, for each anode to be connected, a tab with near its free end a window, the said window being sufficiently large to stop the rise by capillary action which can occur during manufacture of electrolytic capacitors.Type: GrantFiled: April 6, 1992Date of Patent: December 7, 1993Assignee: Compagnie Europeenne de Composants Electroniques LCCInventors: Francois Delalande, Patrice Besnard
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Patent number: 5245514Abstract: Tantalum electrode material is produced which has extremely low tortuosity, exceptionally low ESL and ESR, potentially extended high frequency performance, very high volumetric efficiency, and reduced tantalum consumption per electrode. The electrode material is characterized by having a cross-section composed of plates of tantalum separated by spaced gaps resulting in a highly dense (volumetric efficiency) electrode. The plates are electrically interconnected which also adds to the structural stability of the article. This is made possible by being able to carefully control the geometry of the tantalum material during processing. A method for producing such material includes extruding a billet filled with a (preferentially geometrically uniform) mixture of rods of tantalum and an extrudable metal. When the billet has been sufficiently reduced in size and severed, the extrudable metal is removed by selectively dissolving with acid.Type: GrantFiled: May 27, 1992Date of Patent: September 14, 1993Assignee: Cabot CorporationInventors: James A. Fife, David A. Knudson, Prabhat Kumar, Viren Pathare
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Patent number: 5211741Abstract: The invention relates to flaked tantalum powders suitable for use in electrodes and capacitors. The tantalum powders have a mean particle size of about 2 to 55 micrometers, a BET surface area greater than about 0.5 m.sup.2 /g, and an aspect ratio between about 2 and 50. The powders are in the form of fractured flakes, which contain substantially no tapering of their peripheral edges.Type: GrantFiled: July 31, 1991Date of Patent: May 18, 1993Assignee: Cabot CorporationInventor: James A. Fife
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Patent number: 5198968Abstract: An improved surface mountable tantalum capacitor and method of making same are disclosed. In accordance with the method of tubular tantalum container is fully or partially filled with tantalum powder, sintered to bond the powder to itself and to the container and thereafter conventionally processed to form dielectric and counter-electrode coatings. An anode termination is secured to an exterior surface of the container and a cathode termination is secured to a portion of the counter-electrode exposed through an opening in the container. The resultant capacitor is characterized by high capacitance per volume, a small footprint, shock resistance and low ESR.Type: GrantFiled: July 23, 1992Date of Patent: March 30, 1993Assignee: AVX CorporationInventor: John Galvagni
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Patent number: 5184286Abstract: A process for manufacturing tantalum capacitors in which microwave energy is used to sinter a tantalum powder compact in order to achieve higher surface area and improved dielectric strength. The process comprises cold pressing tantalum powder with organic binders and lubricants to form a porous compact. After removal of the organics, the tantalum compact is heated to 1300.degree. to 2000.degree. C. by applying microwave radiation. Said compact is then anodized to form a dielectric oxide layer and infiltrated with a conductive material such as MnO.sub.2. Wire leads are then attached to form a capacitor to said capacitor is hermetically packaged to form the finished product.Type: GrantFiled: March 18, 1992Date of Patent: February 2, 1993Assignee: Martin Marietta Energy Systems, Inc.Inventors: Robert J. Lauf, Cressie E. Holcombe, Norman L. Dykes
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Patent number: 5128836Abstract: An aluminum foil for electrolytic capacitors in which the sub-surface layer having a depth range from 0.1 to 0.2 .mu.m below the surface contains at least one element selected from the group consisting of Pb, Bi, and In at a total average concentration ranging from 0.001 to 0.1 wt %, and in which the inner part below the sub-surface layer contains less than 0.0001 wt % average concentration for each of Pb, Bi, and In, and in which the average aluminum purity throughout all layers from the surface to the inner part is not less than 99.90 wt %. This aluminum foil has adequate development of tunnel type etch pits and possesses superior electric characteristics and strength.Type: GrantFiled: August 16, 1991Date of Patent: July 7, 1992Assignee: Sumitomo Light Metal Industries, Ltd.Inventors: Kiyoshi Fukuoka, Masaharu Kurahashi, Nobuo Osawa
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Patent number: 5075940Abstract: The present invention provides a process which is particularly suited for mass-producing solid electrolytic capacitors. The process utilizes a combination of a mold and a presser member. The mold has a series of molding recesses, and a lead receiving groove extending along and through the series of molding recesses. The presser member has a corresponding series of pressing projections. A portion of a continuous lead wire is placed in the groove, and powdered electrode material is loaded in the molding recesses. The presser member is then moved toward the mold, so that the powdered material is compacted within the molding recesses by the pressing projections. The resulting compacts are removed from the mold together with the wire. The same process steps are repeated with respect to other portions of the wire.Type: GrantFiled: March 19, 1991Date of Patent: December 31, 1991Assignee: Rohm Co., Ltd.Inventors: Chojiro Kuriyama, Tatsuhiko Oshima, Miki Hasegawa
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Patent number: 5036433Abstract: A transfer and connection strip for anodes of electrolytic capacitrs for in situ fabrication of electrolytic capacitors includes a main part and tabs for each anode to be connected thereto. Each tab includes a first portion made of the same metal as the anodes and a second portion made of material of good soldering quality.Type: GrantFiled: April 4, 1990Date of Patent: July 30, 1991Assignee: Compagnie Europeenne de Composants Electroniques LCCInventors: Francois Delalande, Georges Boulloy
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Patent number: 4984134Abstract: A service mountable non-polar capacitor assembly is disclosed. The assembly includes a pair of polar tantalum capacitors disposed in axial alignment the anode rods of the capacitors being mechanically and electrically connected as by welding. An insulating sleeve encompasses the body portions of the capacitors leaving projecting portions extending beyond the ends of the sleeve. The void space within the sleeve between the opposed ends of the capacitors may be filled by a polymeric insulating and rigidifying material.Type: GrantFiled: January 16, 1990Date of Patent: January 8, 1991Assignee: AVX CorporationInventor: Gerald M. Locke
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Patent number: 4957541Abstract: Tantalum powders of capacitor grade are provided, containing interacting silicon and phosphorous dopants to effect low D.C. leakage of electrolytic capacitors having anodes made from such powders, with anodic formation at low temperatures (40.degree.-60.degree. C.), consistent with high capacitance.Type: GrantFiled: November 1, 1988Date of Patent: September 18, 1990Assignee: NRC, Inc.Inventors: Terrance B. Tripp, Richard W. Hildreth
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Patent number: 4945452Abstract: A method of manufacturing a tantalum capacitor includes compacting tantalum powder about a tantalum anode rod in such manner than the tantalum powder in a region in registry with the tantalum rod is compacted to a density of from about 8 to 10 grams per cc or more, whereas the density of the remaining portions of the tantalum powder mass are compacted to a density of from about 4 to 7 grams per cc. The disclosure further relates to a improved capacitor formed in accordance with the method, as well as to an improved capacitor preform, the capacitor and preform being characterized in that a higher reliability mechanical and electrical connection is effected between the anode rod and the tantalum materials surrounding the rod.Type: GrantFiled: November 30, 1989Date of Patent: July 31, 1990Assignee: AVX CorporationInventors: John Sturmer, John Y. Cadwallader
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Patent number: 4907130Abstract: A method for the fabrication of aluminium electrolytic capacitors with solid or gelled liquid electrolyte, as well as the capacitor obtained by this method are disclosed. The method comprising the following steps:the obtaining of a connections strip made of aluminium, having anode contacts,the fixing, to the anode contacts, of aluminium blocks either by sintering or by the spraying of molten aluminium,the anodization of the aluminium blocks;the impregnation of the blocks with the electrolyte;the positioning of the cathode contacts.Type: GrantFiled: December 29, 1988Date of Patent: March 6, 1990Assignee: Compagnie Europeenne de Composants Electroniques - LCCInventors: Georges Boulloy, Francois Delalande
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Patent number: 4791532Abstract: A porous tantalum body is pressed with a cavity compacted locally, and a connection wire is joined to the tantalum body within the cavity.Type: GrantFiled: June 5, 1987Date of Patent: December 13, 1988Assignee: Sprague Electric CompanyInventors: Didier Gouvernelle, Daniel Gatesoupe