Aluminum Or Tantalum Patents (Class 361/529)
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Patent number: 7251123Abstract: Implantable defibrillators are implanted into the chests of patients prone to suffering ventricular fibrillation, a potentially fatal heart condition. A critical component in these devices is an aluminum electrolytic capacitors, which stores and delivers one or more life-saving bursts of electric charge to a fibrillating heart. These capacitors make up about one third the total size of the defibrillators. Unfortunately, conventional manufacturers of these capacitors have paid little or no attention to reducing the size of these capacitors through improved capacitor packaging. Accordingly, the inventors contravened several conventional manufacturing principles and practices to devise unique space-saving packaging that allows dramatic size reduction.Type: GrantFiled: December 17, 2004Date of Patent: July 31, 2007Assignee: Cardiac Pacemakers, Inc.Inventors: Michael J. O'Phelan, James M. Poplett, Robert R. Tong, Alexander Gordon Barr
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Patent number: 7245479Abstract: The present invention provides an electrolytic capacitor manufacturing method capable of manufacturing an electrolytic capacitor having the PTC function as easy as possible. A main electrode layer in a cathode is formed so as to have the PTC function. Different from a conventional electrolytic capacitor manufacturing method of connecting a PTC thermistor to a capacitor element to give the PTC function to an electrolytic capacitor so that an electrolytic capacitor manufacturing process is complicated and the number of manufacturing processes is increased by the amount corresponding to the PTC thermistor connecting process, the process of connecting the PTC thermistor to the capacitor element is unnecessary. Consequently, complication of the electrolytic capacitor manufacturing process and increase in the number of manufacturing processes caused by the PTC thermistor connecting process can be prevented.Type: GrantFiled: December 6, 2006Date of Patent: July 17, 2007Assignee: TDK CorporationInventors: Masaaki Kobayashi, Atsushi Monden, Tokuhiko Handa
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Patent number: 7233483Abstract: A solid electrolytic capacitor having an anode of valve metals or of an alloy of which main component is valve metals; a dielectric layer formed by anodizing said anode; an electrolyte layer formed on said dielectric layer; and a cathode formed on said electrolyte layer; wherein said cathode has a silver layer using silver and sulfur and/or sulfur compound is contained in said silver layer.Type: GrantFiled: March 9, 2006Date of Patent: June 19, 2007Assignee: Sanyo Electric Co., Ltd.Inventors: Kazuhiro Takatani, Takahisa Iida, Mamoru Kimoto
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Patent number: 7227739Abstract: A solid electrolytic capacitor having significantly lowered its ESL is provided. In solid electrolytic capacitor elements adjacent each other in the solid electrolytic capacitor in accordance with the present invention, their respective anodes are connected to each other by an anode conduction path of a conduction path pair, whereas their respective cathodes are connected to each other by a cathode conduction path of the conduction path pair. Therefore, when electrons migrate between the solid electrolytic capacitor elements, respective currents directed opposite from each other flow through a pair of substantially parallel conduction paths. Consequently, a magnetic field caused by the current flowing through one conduction path is offset by a magnetic field caused by the current flowing through the other conduction path, whereby both magnetic fields cancel each other out. Hence, the solid electrolytic capacitor lowers its ESL.Type: GrantFiled: September 20, 2004Date of Patent: June 5, 2007Assignee: TDK CorporationInventor: Masaaki Kobayashi
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Patent number: 7221555Abstract: The surface mount MELF capacitor of the present invention includes a wire and a conductive powder element electrically connected to the wire. The surface mount MELF capacitor has insulative material surrounding at least a portion of the conductive powder element and the wire extending from the conductive powder element. A first terminal is formed on the surface mount chip capacitor at the first end surface of the wire and a second terminal is formed by being electrically connected to the conductive powder element. The surface mount MELF capacitor of the present invention is created by methods which include the steps of providing a wire and placing conductive powder upon the wire. An embodiment of the present invention feeds the wire in a reel to reel system and electrophoretically deposits the conductive powder element upon the wire.Type: GrantFiled: November 2, 2005Date of Patent: May 22, 2007Assignee: Vishay Sprague, Inc.Inventor: Haim Goldberger
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Patent number: 7218505Abstract: A chip solid electrolyte capacitor with low ESR and small initial failure ratio comprising a plurality of solid electrolyte capacitor elements each produced by stacking a dielectric oxide film layer, a semiconductor layer and an electrically conducting layer in this order to form a cathode part on a surface of an anode substrate exclusive of the anode part at one end, the anode substrate comprising a sintered body of a valve-acting metal or an electrically conducting oxide or comprising the sintered body connected with a metal wire, which is a chip solid electrolyte capacitor obtained by horizontally laying the plurality of electrolyte capacitor elements in parallel with no space on a pair of oppositely disposed end parts of a lead frame such that the anode part or the metal wire and the cathode part come into contact with the lead frame, joining each element, and molding the entire with a resin while leaving outside the external terminal parts of the lead frame, wherein the volume ratio of one sintered bodyType: GrantFiled: March 2, 2004Date of Patent: May 15, 2007Assignee: Showa Denko K.K.Inventors: Kazumi Naito, Katutoshi Tamura
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Patent number: 7218506Abstract: The present invention provides an electrolytic capacitor manufacturing method capable of manufacturing an electrolytic capacitor having the PTC function as easy as possible. A main electrode layer in a cathode is formed so as to have the PTC function. Different from a conventional electrolytic capacitor manufacturing method of connecting a PTC thermistor to a capacitor element to give the PTC function to an electrolytic capacitor so that an electrolytic capacitor manufacturing process is complicated and the number of manufacturing processes is increased by the amount corresponding to the PTC thermistor connecting process, the process of connecting the PTC thermistor to the capacitor element is unnecessary. Consequently, complication of the electrolytic capacitor manufacturing process and increase in the number of manufacturing processes caused by the PTC thermistor connecting process can be prevented.Type: GrantFiled: March 25, 2005Date of Patent: May 15, 2007Assignee: TDK CorporationInventors: Masaaki Kobayashi, Atsushi Monden, Tokuhiko Handa
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Patent number: 7215533Abstract: A chip-type solid electrolytic capacitor has a four-terminal structure. The chip-type solid electrolytic capacitor includes capacitor elements laminated such that anode electrodes face alternately in opposite directions; a pair of anode terminals opposing each other; and a pair of cathode terminals opposing each other. The magnetic fluxes generated by current passing between respective terminals are mutually cancelled, thus allowing ESL to be drastically reduced. Further reduction of ESL is feasible by shortening the distance between the terminals as much as possible so as to reduce the current loop area.Type: GrantFiled: May 22, 2006Date of Patent: May 8, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Junichi Kurita, Hiroshi Fujii, Tsuyoshi Yoshino
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Patent number: 7208104Abstract: A mixture solution for preparing conducting polymers. The conducting polymer is formed from a mixture of monomer and oxidant solution. The oxidant solution has a high concentration, and also includes a five or six-member ring compound with a functional group which acts as a retardant for the polymerization. Thus, the mixture of a monomer and oxidant solution exhibits excellent stability at room temperature. The conducting polymer accumulating in the space of the capacitor element can be more efficiently formed by using this high concentration oxidant solution. Therefore, the immersion and polymerization processes to form conducting polymer as the electrolyte of a solid electrolytic capacitor can be limited to only a few occurrences.Type: GrantFiled: November 14, 2003Date of Patent: April 24, 2007Assignee: Industrial Technology Research Institute Material Research LaboratoriesInventors: Li-Duan Tsai, Yi-Chang Du
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Patent number: 7204866Abstract: A niobium or tantalum powder of the present invention comprises aggregates in which primary particles of niobium or tantalum are aggregated, and have a pore distribution having a peak in the range from 1 to 20 ?m as measured by mercury porosimetry. That is, the niobium or tantalum powder of the present invention comprises aggregates having large pores, which connect with vacancies between the primary particles and facilitate the permeation of an electrolyte over the entirety of the inside of each aggregate. Accordingly, a solid electrolytic capacitor comprising an anode electrode made of the niobium or tantalum powder has high capacity and also a low ESR.Type: GrantFiled: May 31, 2001Date of Patent: April 17, 2007Assignee: Cabot Supermetals K.K.Inventors: Yukio Oda, Yujiro Mizusaki
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Patent number: 7198733Abstract: A formed substrate, wherein the surface of the valve-acting metal having a dielectric film is at least partially covered with an oxide comprising Si, valve-acting metal element and oxygen, preferably, wherein the content of Si in the formed foil having an aluminum oxide dielectric film decreases continuously from the surface of the dielectric film toward the inner part in some regions in the aluminum dielectric film thickness; a method for producing the formed substrate; and a solid electrolytic capacitor comprising a solid electrolyte on the formed substrate. A solid electrolytic capacitor manufactured by using a formed substrate according to the present invention, improved in adhesion to an electrically conducting polymer (solid electrolyte) with its area coverage contacting the polymer being sufficiently large, is increased in the electrostatic capacitance among individual capacitors and improved in the LC yield as compared with capacitors otherwise manufactured.Type: GrantFiled: June 11, 2002Date of Patent: April 3, 2007Assignee: Showa Denko K.K.Inventors: Hiroshi Konuma, Katsuhiko Yamazaki, Takenori Umikawa, Masakazu Yagi, Tamotsu Yamashita
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Patent number: 7190572Abstract: An object of the invention is to provide a capacitor element capable of reducing product defects caused in the process step of forming a cathode electrode film and capable of reducing the size and weight of a solid electrolytic capacitor incorporating the capacitor element. The capacitor element includes an anode chip body including a porous sintered body formed by sintering valve metal powder into a rectangular parallelepiped, an anode wire fixed to a first end surface of the anode chip body, a dielectric film formed on the metal powder of the anode chip body, a solid electrolyte layer formed on the dielectric film, and a cathode-side electrode film formed on the anode chip body via the solid electrolyte film. The object is achieved by rounding or chamfering at least two of four edges of the anode chip body at which four side surfaces of the anode chip body meet a second end surface which is opposite from the first end surface, the two edges being parallel with each other.Type: GrantFiled: July 18, 2003Date of Patent: March 13, 2007Assignee: Rohm Co., Ltd.Inventor: Takahiro Maeda
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Patent number: 7184257Abstract: A solid electrolytic capacitor includes a capacitor element and a board mounting the capacitor element thereon. The capacitor element includes a support made of a valve metal, and an anode and a cathode provided on the support. Anode and cathode lead conductors connected to the anode and the cathode are provided on a first principal surface of the support, and anode and cathode lands are formed on a second principal surface. A conductive portion passing through the board electrically connects either the anode lead conductor to the anode land or the cathode lead conductor to the cathode land.Type: GrantFiled: February 26, 2004Date of Patent: February 27, 2007Assignee: TDK CorporationInventors: Masaaki Kobayashi, Masaaki Togashi
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Patent number: 7175781Abstract: A solid electrolytic capacitor includes a valve acting metal having microfine pores, a dielectric film formed on a surface of the valve acting metal, and a solid electrolyte layer provided on the dielectric film, in which at least a portion of the solid electrolyte layer is of a lamellar structure. In particular, a solid electrolytic capacitor includes an electrically conducting polymer having a specified condensed ring structure containing (1) a solid electrolyte layer containing a sulfoquinone anion, and (2) a solid electrolyte layer containing an anthracenesulfonate ion and other anion.Type: GrantFiled: September 14, 2004Date of Patent: February 13, 2007Assignee: Showa Denko K.K.Inventors: Hiroshi Konuma, Koro Shirane, Ryuji Monden, Atsushi Sakai, Yuji Furuta, Katsuhiko Yamazaki, Toru Sawaguchi, Hideko Ohata, Yoshiaki Ikenoue
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Patent number: 7167357Abstract: The surface mount MELF capacitor of the present invention includes a wire and a conductive powder element electrically connected to the wire. The surface mount MELF capacitor has insulative material surrounding at least a portion of the conductive powder element and the wire extending from the conductive powder element. A first terminal is formed on the surface mount chip capacitor at the first end surface of the wire and a second terminal is formed by being electrically connected to the conductive powder element. The surface mount MELF capacitor of the present invention is created by methods which include the steps of providing a wire and placing conductive powder upon the wire. An embodiment of the present invention feeds the wire in a reel to reel system and electrophoretically deposits the conductive powder element upon the wire.Type: GrantFiled: October 26, 2005Date of Patent: January 23, 2007Assignee: Vishay Sprague, Inc.Inventor: Haim Goldberger
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Patent number: 7150776Abstract: High purity refractory metals, valve metals, refractory metal oxides, valve metal oxides, or alloys thereof suitable for a variety of electrical, optical and mill product/fabricated parts usages are produced from their respective oxides by metalothermic reduction of a solid or liquid form of such oxide using a reducing agent that establishes (after ignition) a highly exothermic reaction, the reaction preferably taking place in a continuously or step-wise moving oxide such as gravity fall with metal retrievable at the bottom and an oxide of the reducing agent being removable as a gas or in other convenient form and unreacted reducing agent derivatives being removable by leaching or like process.Type: GrantFiled: March 3, 2004Date of Patent: December 19, 2006Assignee: H.C. Starck Inc.Inventors: Leonid N. Shekhter, Terrance B. Tripp, Leonid L. Lanin, Anastasia M. Conlon, Howard V. Goldberg
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Patent number: 7142408Abstract: Methods of forming tantalum powders and other valve metal powders are described. The method involves high impact milling a starting powder in a fluid medium and optionally a milling media using a high energy mill. The methods of the present invention have the ability to reduce DC leakage and/or increase capacitance capabilities of valve metal powders when formed into capacitor anodes. The methods of present invention further reduce the milling time necessary to form high surface area valve metal powders and leads to reducing contaminant levels in the valve metal powders. The process is particularly well-suited for forming metal flakes, such as tantalum or niobium flakes, of high purity.Type: GrantFiled: June 9, 2004Date of Patent: November 28, 2006Assignee: Cabot CorporationInventor: Duan-Fan Wang
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Patent number: 7138000Abstract: A method is provided for making a solid electrolytic capacitor comprising a flattened porous body. According to this method, use is made of a pair of pressure blocks and a vertical movement block for engagement with the pair of pressure blocks. The pair of pressure blocks face each other and are horizontally movable. A space is formed between these two pressure blocks for loading powder made of a valve metal. The powder loaded in the space is compressed by the pair of pressure blocks to form a flattened porous body. The compression by the pair of pressure blocks is brought about by a downward motion of the vertical movement block held in engagement with the pair of pressure blocks.Type: GrantFiled: August 31, 2004Date of Patent: November 21, 2006Assignee: Rohm Co., Ltd.Inventor: Chojiro Kuriyama
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Patent number: 7136275Abstract: The present invention includes a dielectric. The dielectric includes a polymer that has a high dielectric constant. The polymer includes polarizable species. The present invention also includes an embedded capacitor, and an IC package made with the dielectric.Type: GrantFiled: September 12, 2002Date of Patent: November 14, 2006Assignee: Intel CorporationInventors: Paul A. Koning, Paul H. Wermer
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Patent number: 7133276Abstract: A solid electrolytic capacitor of the present invention includes a capacitor element with an anode element and a cathode layer, having an anode lead member planted on one end surface of the anode element, an anode terminal connected to the anode lead member, a platy cathode terminal placed on a reverse surface of the capacitor element and connected to the cathode layer, and an enclosure resin part enclosing the capacitor element, a part of the cathode terminal and a part of the anode terminal being exposed from a bottom surface of the enclosure resin part. At least the cathode terminal has formed thereon a plurality of projections projecting in a position apart from a reverse surface of the enclosure resin part in a direction along the reverse surface.Type: GrantFiled: October 6, 2005Date of Patent: November 7, 2006Assignee: Sanyo Electric Co., Ltd.Inventors: Eizo Fujii, Hidenori Kamigawa
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Patent number: 7126811Abstract: A miniature solid electrolytic capacitor is provided, which is suitable for being disposed within an electrically insulating layer, and is connected to a component using an electrically conductive adhesive with a connection resistance at an anode being low and with connection reliability being improved. Specifically, the electrolytic capacitor includes a valve metal element for an anode having a capacitor forming part and an electrode lead part, a dielectric oxide film formed on the valve element, a solid electrolyte layer formed on the dielectric oxide film and a charge collecting element for a cathode formed on the solid electrolyte layer, wherein at least one through hole is formed in the electrode lead part so as to expose a core of the valve metal element, and wherein an exposed portion of the core is used as a connecting portion.Type: GrantFiled: December 4, 2003Date of Patent: October 24, 2006Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Koichi Hirano, Tsunenori Yoshida, Hiroyuki Handa, Yoshihisa Yamashita, Seiichi Nakatani
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Patent number: 7113390Abstract: In a surface-mount thin-profile capacitor including an aluminum foil as a base member composed of an aluminum core and a pair of etched layers covering opposite surfaces of the aluminum core, a resist resin is formed at a boundary between an anode as each of opposite end portions of the aluminum foil and a cathode formed at a center area of each of opposite surfaces of the aluminum foil. The resist resin separates and isolates the etched layer on the side of the anode and a conductive polymer layer from each other. If a part of the conductive polymer layer climbs up onto the resist resin, the climbing part of the conductive polymer layer is covered with an additional resist resin.Type: GrantFiled: January 18, 2005Date of Patent: September 26, 2006Assignees: NEC TOKIN Corporation, NEC TOKIN Toyama, Ltd.Inventors: Yuichi Maruko, Akihiro Kawai, Toshihisa Nagasawa, Tadamasa Asami
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Patent number: 7099146Abstract: The present invention is to provide an electrolyte with which the withstand voltage and capacitor capacity can be prevented from lowering, and an electrochemical capacitor containing the same. The present invention uses an electrolyte for an electrochemical capacitor comprising a cyclic amidinium salt (B) represented by the general formula (1), wherein the total amount of a cyclic amidinium salt derivative (A) represented by the general formula (2) is not larger than 10 mole % relative to the sum of (A) and (B).Type: GrantFiled: July 28, 2003Date of Patent: August 29, 2006Assignees: Sanyo Chemical Industries, Ltd., Matsushita Electric Industrial, Co., Ltd.Inventors: Yukiya Kobayashi, Hideo Seike, Yoshinori Takamuku
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Patent number: 7099145Abstract: It is an object of the present invention to provide a solid electrolytic capacitor which can reduce the ESL and the ESR and increase electrostatic capacitance at a small size, and a method for manufacturing such a solid electrolytic capacitor. A solid electrolytic capacitor component includes a foil-like aluminum substrate whose surface is roughened or enlarged and which is formed with an aluminum oxide film 2x on the surface thereof and foil-like aluminum substrates whose surfaces are not roughened and a cathode electrode including a solid high molecular polymer electrolyte layer, a graphite paste layer and a silver paste layer is formed on the surface of the foil-like aluminum substrate. In the solid electrolytic capacitor component 110, lead electrode pairs including anode lead electrodes are disposed adjacent with each other, whereby magnetic fields to be generated are canceled.Type: GrantFiled: June 18, 2003Date of Patent: August 29, 2006Assignee: TDK CorporationInventors: Masaaki Kobayashi, Masaaki Togashi
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Patent number: 7095605Abstract: A solid electrolytic capacitor includes a capacitor element and an outer shell, made of an insulating resin, that covers the capacitor element. The capacitor element has a winding portion that is formed by rolling an anode foil with a dielectric oxidized film formed on its surface, a cathode foil, and a separator that is sandwiched between the anode foil and the cathode foil, and a conductive polymer layer is formed between the anode foil and the cathode foil. An anode lead wire electrically connected to the anode foil, and a cathode lead wire electrically connected to the cathode foil extend from the winding portion, penetrate the outer shell, and are respectively connected to an anode electrode terminal and a cathode electrode terminal that are arranged on a surface of the outer shell.Type: GrantFiled: March 13, 2003Date of Patent: August 22, 2006Assignees: Sanyo Electric Co., Ltd., Saga Sanyo Industries Co., Ltd.Inventors: Kazuhiro Suenaga, Kazumasa Fujimoto, Tetsuyuki Sakuda
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Patent number: 7092242Abstract: An electrolytic capacitor comprising a plurality of polymeric structures molded about the periphery of the anode pellet is described. The polymeric structures contact between a weld strap surrounding the butt seam between mating “clamshell” casing portions and the anode pellet sidewall. That way, the anode pellet is restrained from moving along both an x- and y-axes inside the casing. Having the cathode active material contacting the opposed major casing sidewalls being in a closely spaced relationship with the anode pellet through an intermediate separator prevents movement along the z-axis. The resulting capacitor is particularly well suited for use in high shock and vibration conditions.Type: GrantFiled: September 8, 2005Date of Patent: August 15, 2006Assignee: Greatbatch, Inc.Inventors: Edward Gloss, Rodney Stringham, J. Michael Druding, Barry Muffoletto
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Patent number: 7088573Abstract: The surface mount MELF capacitor of the present invention includes a wire and a conductive powder element electrically connected to the wire. The surface mount MELF capacitor has insulative material surrounding at least a portion of the conductive powder element and the wire extending from the conductive powder element. A first terminal is formed on the surface mount chip capacitor at the first end surface of the wire and a second terminal is formed by being electrically connected to the conductive powder element. The surface mount MELF capacitor of the present invention is created by methods which include the steps of providing a wire and placing conductive powder upon the wire. An embodiment of the present invention feeds the wire in a reel to reel system and electrophoretically deposits the conductive powder element upon the wire.Type: GrantFiled: March 2, 2004Date of Patent: August 8, 2006Assignee: Vishay Sprague, Inc.Inventor: Haim Goldberger
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Patent number: 7085127Abstract: The surface mount chip capacitor of the present invention includes a wire and a conductive powder element electrically connected to the wire. The surface mount chip capacitor has insulative material surrounding at least a portion of the conductive powder element and the wire extending from the conductive powder element. A first terminal is formed on the surface mount chip capacitor at the first end surface of the wire and a second terminal is formed by being electrically connected to the conductive powder element. The surface mount chip capacitor of the present invention is created by methods which include the steps of forming a wire and placing conductive powder upon the wire. An embodiment of the present invention, presses the wire from a foil sheet and electrophoretically depositing the conductive powder element upon the wire.Type: GrantFiled: March 2, 2004Date of Patent: August 1, 2006Assignee: Vishay Sprague, Inc.Inventors: Haim Goldberger, Alex Eidelman, Anatoly Agulyansky, Ilia Skatkov
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Patent number: 7070631Abstract: A method for producing an aluminum foil for solid electrolytic capacitors, comprising the steps of cutting an aluminum foil into a shape of a capacitor element, etching a cut end part formed by said cutting, and then electrochemically forming the etched aluminum foil, aluminum foil for solid electrolytic capacitors obtained by the method, solid electrolytic capacitor using the aluminum foil, and method for producing such a solid electrolytic capacitor are disclosed. By use of the aluminum foil for solid electrolytic capacitors according to the present invention, capacitor characteristics such as an increase in the capacitor capacitance and a decrease in the leakage current from the cut end part of a stacked type aluminum solid electrolytic capacitor can be efficiently improved, the anode moieties can be efficiently connected without fail on stacking elements and the productivity of stacked type aluminum solid electrolytic capacitor can be elevated.Type: GrantFiled: February 7, 2002Date of Patent: July 4, 2006Assignee: Showa Denko K.K.Inventors: Ryuji Monden, Atsushi Sakai, Teruto Ohta
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Patent number: 7072173Abstract: An electrolyte for an electrolytic capacitor which is high in electrolytic conductivity, excellent in heat stability and high in withstand voltage. An electrolyte for an electrolytic capacitor including a tetrafluoroaluminate ion; and an electrolyte for an electrolytic capacitor containing a salt and a solvent, characterized in that electrolytic conductivity X (mS·cm?1) at 25° C. and withstand voltage Y (V) of a capacitor satisfy the relationships of formulae (I):Y??7.5X+150, and X?4, Y>0.Type: GrantFiled: November 12, 2003Date of Patent: July 4, 2006Assignee: Mitsubishi Chemical CorporationInventors: Masayuku Takeda, Masahiro Takehara, Makoto Ue
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Patent number: 7054142Abstract: There is provided a niobium alloy powder suitable for manufacturing solid electrolytic capacitors having small leakage currents and high capacitances, where the powder is obtained by enhancing the thermal stability of the niobium oxide coating film while improving the temperature dependence of the sintering behavior of the powder. The niobium alloy powder includes one or more of molybdenum, chromium, and tungsten each with a content of 0.002 to 20% by mass, and phosphorus and boron each with a content of 0.002 to 5% by mass, and moreover, includes hydrogen with a content of 0.005 to 0.10% by mass, the balance being substantially niobium; the specific surface area of the powder is from 1 to 20 m2/g; the powder has a cumulative pore volume of 0.2 ml/g or more; and the cumulative volume of the pores each having a diameter of 1 ?m or less makes up 10% or more and the cumulative volume of the pores each having a diameter of 10 ?m or less makes up 40% or more in relation to the total cumulative pore volume.Type: GrantFiled: August 8, 2003Date of Patent: May 30, 2006Assignee: JFE Mineral Company, Ltd.Inventors: Tadasu Kirihara, Nobuyuki Sato, Osamu Ebato, Kan Saito
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Patent number: 7042709Abstract: A solid electrolytic capacitor includes a valve metal support, a dielectric layer, a solid polymer electrolyte layer, and an insulating layer. The valve metal support has an opening formed about an anode terminal forming area except for a part of surroundings thereof. The dielectric layer is formed on a surface of the valve metal support so as to expose a part of the anode forming area. The solid polymer electrolyte layer is formed on the dielectric layer. The solid electrolytic capacitor is provided with the insulating layer for electrically insulating the anode terminal forming area in the valve metal support and the solid polymer electrolyte layer from each other.Type: GrantFiled: November 2, 2004Date of Patent: May 9, 2006Assignee: TDK CorporationInventors: Masaaki Kobayashi, Masaaki Togashi
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Patent number: 7038901Abstract: A capacitor working electrolyte containing water and a silicate additive is described. The silicate additive does not alter the electrolyte properties and/or cause any separation of the electrolyte composition. Instead, it stabilizes capacitor long-term performance.Type: GrantFiled: February 11, 2005Date of Patent: May 2, 2006Assignee: Wilson Greatbatch Technologies, Inc.Inventors: Barry Muffoletto, Yanming Liu
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Patent number: 7016179Abstract: A solid electrolytic capacitor includes a capacitor element assembly, an anode lead and a cathode lead. The assembly includes a plurality of capacitor elements each consisting of a sintered valve metal chip, an anode wire projecting from the chip, a solid electrolytic layer formed on the chip, and a cathode layer formed on the electrolytic layer. The chip of each capacitor element is flat, having a thickness smaller than its length and width. The capacitor elements are stacked in a thickness direction of the chip so that the cathode layers of the respective capacitor elements are connected to each other. The anode wires are fixed to the anode lead. At least one of the cathode layers is directly connected to the cathode lead.Type: GrantFiled: December 1, 2004Date of Patent: March 21, 2006Assignee: Rohm Co., Ltd.Inventor: Hideki Ando
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Patent number: 6999304Abstract: In one aspect, a method of interconnecting two or more foils of a capacitor, the method comprising connecting together one or more anode connection members of one or more anode foils and one or more cathode connection members of one or more cathode foils and electrically isolating the one or more anode foils from the one or more cathode foils.Type: GrantFiled: March 18, 2004Date of Patent: February 14, 2006Assignee: Cardiac Pacemakers, Inc.Inventors: Brian L. Schmidt, Michael J. O'Phelan, Michael Krautkramer, Gregory J. Sherwood, A. Gordon Barr
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Patent number: 6999303Abstract: The solid electrolytic capacitor of the invention is provided with a first electrode layer and a second electrode layer between which are disposed a dielectric layer formed on the surface of the first electrode layer, and a solid electrolyte layer. The solid electrolyte layer is formed adjacent to the dielectric layer, and it is made of a solid electrolyte containing a conjugated polymer compound and a polymer compound having a proton-donating functional group. Repaired sections are formed in the solid electrolytic capacitor as damaged sections generated in the dielectric layer undergo self-repair due to the metal oxidation power or oxidation catalyzing power of the solid electrolyte. It is thereby possible to reduce deterioration with time and sufficiently inhibit defects and short circuits between electrodes.Type: GrantFiled: February 10, 2004Date of Patent: February 14, 2006Assignee: TDK CorporationInventor: Hiroaki Hasegawa
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Patent number: 6965510Abstract: A sintering method for valve metal powders, such as tantalum, niobium, aluminum, titanium, and their alloys, is described. The valve metal powders are pressed into a pellet and sintered at a relatively high temperature, but for a relatively short time. The anodized valve metal structure is then useful as an anode in an electrolytic capacitor.Type: GrantFiled: December 13, 2004Date of Patent: November 15, 2005Assignee: Wilson Greatbatch Technologies, Inc.Inventors: Yanming Liu, David Goad, Barry Muffoletto
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Patent number: 6933041Abstract: A method for increasing the surface area of foil electrodes of electrolytic capacitors. A valve metal is deposited by evaporation on a valve metal foil in a low pressure inert atmosphere including oxygen at a pressure one to two orders of magnitude lower than the pressure of the inert gas. The resulting surface is fractal-like. The foil thus treated is suitable as such for use as a cathode. Prior to anodization to produce an anode, a discontinuous layer of a valve metal oxide is deposited on the foil, to preserve the high surface area of the fractal-like surface and otherwise promote the formation of a dielectric coating whose interface with the metal foil has a high surface area.Type: GrantFiled: June 28, 2001Date of Patent: August 23, 2005Assignee: Acktar Ltd.Inventors: Dina Katsir, Iris Tartakovsky, Israel Tartakovsky
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Patent number: 6930877Abstract: An anode member is provided which includes a valve metal thin plate and a valve metal powder layer formed on at least one plate surface of the valve metal thin plate. At least one groove is formed in the valve metal powder layer, and the valve metal under powder layer having the at least one groove formed therein is sintered to form the anode member.Type: GrantFiled: January 13, 2004Date of Patent: August 16, 2005Assignee: NEC Tokin CorporationInventor: Katsuhiro Yoshida
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Patent number: 6906913Abstract: A solid electrolytic capacitor having excellent electrical characteristics due to an insulating protective layer. A water-shedding silicone rubber that cures by moisture or heat energy is coated to form the insulating protective layer on a protruding portion of a valve metal foil, at a protruding portion on the end surface of a porous valve metal body and on the surface of a dielectric layer covering the protruding portion of the valve metal foil.Type: GrantFiled: October 17, 2002Date of Patent: June 14, 2005Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Ayumi Kochi, Seiji Takagi, Yuji Mido, Yasuo Kanemitsu
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Patent number: 6891717Abstract: The invention provides a process for fabricating a solid electrolytic capacitor of the chip type which process includes the steps of plating a fabrication frame comprising an anode terminal member and a cathode terminal member projecting from a pair of side frame members respectively so as to be opposed to each other, the anode terminal member being stepped so as to provide a lower portion toward the cathode terminal member, a hole extending vertically and being formed in each of the anode terminal member and a higher portion of the cathode terminal member, joining an anode lead of a capacitor element to an upper surface of the cathode terminal member and a bottom surface of the capacitor element to an upper surface of the lower portion of the cathode terminal member, forming a packaging resin portion around the capacitor element without permitting resin to ingress into the holes, and cutting the anode and cathode terminal members along vertical planes extending through the respective holes.Type: GrantFiled: September 11, 2003Date of Patent: May 10, 2005Assignees: Sanyo Electric Co., Ltd., Sanyo Electronic Components Co., Ltd.Inventors: Eizo Fujii, Hideki Ishida
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Patent number: 6891716Abstract: A capacitor includes an anode body, a dielectric layer adjacent to the anode body, a cathode layer adjacent to the dielectric layer, and an enclosure that substantially encloses the anode body, the dielectric layer, and the cathode body. The enclosure has an upper side and an underside and is made of a castable material. The capacitor includes an anode contact having a contact section on the underside of the enclosure, an anode conductor that connects the anode body to the anode contact, and a cathode conductor that contacts the cathode layer and that exits the enclosure. The cathode conductor is a plate having holes at a portion of the cathode conductor inside the enclosure. The holes are at least partially filled with castable material.Type: GrantFiled: November 20, 2001Date of Patent: May 10, 2005Assignee: EPCOS AGInventors: Jörg-Rudolf Maier, Hans-Georg Keck
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Patent number: 6884277Abstract: The present invention relates to a powdered niobium for a capacitor, characterized in that the content of each of the elements such as iron, nickel, cobalt, silicon, sodium, potassium and magnesium is about 100 ppm by weight or less or that the total content thereof is about 350 ppm by weight or less is used, a sintered body thereof, a sintered body comprising niobium monoxide crystal and/or diniobium mononitride crystal, a capacitor using the sintered body and the production method of the capacitor. A capacitor using the above described niobium sintered body has a large capacity per the unit weight, a good specific leakage current value and excellent high temperature property.Type: GrantFiled: March 28, 2002Date of Patent: April 26, 2005Assignee: Showa Denko K.K.Inventor: Kazumi Naito
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Patent number: 6882519Abstract: The present invention relates to a method of manufacturing a flat aluminum electrolytic capacitor comprising a separator impregnated with an electrolytic solution, an anode foil and a cathode foil, a flat capacitor element that has external lead-out terminals connected respectively to the anode foil and the cathode foil, and a flexible casing that houses the capacitor element and is hermetically sealed, said method comprising the steps of encasing the capacitor element in the flexible casing and applying aging treatment before hermetically sealing the casing, and hermetically sealing the flexible casing, and also relates to a flat aluminum electrolytic capacitor comprising a separator impregnated with the electrolytic solution, the anode foil and the cathode foil, the flat capacitor element that has the external lead-out terminals connected respectively to the anode foil and the cathode foil, and the flexible casing that houses the capacitor element and is hermetically sealed, wherein the electrolytic capacitType: GrantFiled: September 19, 2003Date of Patent: April 19, 2005Assignee: Rubycon CorporationInventors: Shigeru Uzawa, Yoshiki Makino, Katsuhisa Kamakura, Yuuichi Kobayashi, Akihiko Komatsu, Taketo Matsuzawa
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Patent number: 6882520Abstract: The invention provides a solid electrolytic capacitor which comprises a capacitor element including an anode body having an anode leading member, and a dielectric coating layer, a solid electrolyte layer and a cathode leading layer which are formed successively over a surface of the anode body. The anode leading member has an anode terminal member connected thereto, the cathode leading layer has a cathode terminal member connected thereto, and the capacitor element is covered with a packaging resin portion. The cathode terminal member is connected to the cathode leading layer with current control means provided therebetween. The current control means comprises a current control layer reversibly increasable in electrical resistance with overcurrent or excessive heat, and a pair of electrode members each in the form of a plate or foil and having the current control layer sandwiched therebetween. The electrode members are joined to the cathode leading layer and the cathode terminal member, respectively.Type: GrantFiled: November 26, 2003Date of Patent: April 19, 2005Assignees: Tyco Electronics Raychem K.K., Sanyo Electric Co., Ltd., Sanyo Electronic Components Co., Ltd.Inventors: Hidenori Kamigawa, Kouichi Morita, Hitoshi Ibuta
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Patent number: 6876541Abstract: An aluminum material for electrolytic capacitor electrodes, the aluminum material having aluminum purity of 99.9% or more, consisting of: Si: 2 to 50 ppm; Fe; 2 to 50 ppm; Cu: 15 to 150 ppm; Zn: 1 to 80 ppm; Pb: 0.1 to 3 ppm; at least one of Zr and V: 11 ppm or more, a total content of the at least one of Zr and V being 11 to 100 ppm; and the balance being Al and impurities, wherein a content of B is controlled to be 2 ppm or less. In the aluminum material, Ti: 1 to 30 ppm, Mn group composition (at least one of Mn, Ga, Mg and Ca): 1 to 50 ppm in total, and In group composition (at least one of In, Sn, Sb): 1 to 30 ppm in total are selectively added. A method for manufacturing an aluminum foil for electrolytic capacitor electrodes according to the present invention, comprises the steps of: rolling the aforementioned aluminum material into a foil; and performing final annealing of the foil at the temperature of 430 to 580° C.Type: GrantFiled: September 20, 2001Date of Patent: April 5, 2005Assignees: Nichicon Corporation, Showa Denko K.K.Inventors: Taro Kato, Akira Koyama, Masato Akao, Tadao Fujihira, Tomoaki Yamanoi, Jin Zhang
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Patent number: 6876540Abstract: An electrolyte includes (a) 70-99 wt. % of ethylene glycol, and (b) 1-2 wt. % of a substance which is selected from a group that includes the following carboxylic acids and carboxylic acid salts: substituted cinnamic acids, ammonium cinnamate, ammonium ?-methyl cinnamate, and ammonium trans-4-phenyl-3-butenoate. The electrolyte may be used in an aluminum electrolytic capacitor.Type: GrantFiled: December 27, 2001Date of Patent: April 5, 2005Assignee: EPCOS AGInventor: Thomas Ebel
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Patent number: 6876542Abstract: A nitrogen containing metal powder wicth a large specific surface area, and containing a suitable quantity of nitrogen dispersed uniformly within the metal is produced with good productivity, and provides a solid electrolytic capacitor with a high capacitance, minimal leakage current, and excellent long term reliability. This nitrogen containing metal powder has a ratio W/S between the nitrogen content W [ppm] of the powder, and the specific surface area S [m2/g], as measured by a BET method, that falls within a range from 500 to 3000. This type of powder can be produced by a process in which a metal salt containing the metal is reacted with a reducing agent and undergoes reduction within a diluent salt, thereby generating the metal, wherein a nitrogen containing gas is introduced into the space contacting the reaction melt comprising the metal salt, the reducing agent and the diluent salt, thereby generating the metal and incorporating the nitrogen within the metal.Type: GrantFiled: August 13, 2002Date of Patent: April 5, 2005Assignee: Cabot Supermetals K.K.Inventors: Yukio Oda, Isayuki Horio
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Patent number: 6873518Abstract: A dielectric oxide film is formed on the surface of a valve metal plate formed of aluminum and a conductive polymer layer is provided so as to cover the valve metal plate and the dielectric oxide film. The conductive polymer layer is formed of polyaniline having para-toluenesulfonic acid as a dopant. A conductive carbon paste layer and a silver paste layer are provided at the outer side of the conductive polymer layer and a metal plate, comprising a copper foil, is overlapped onto the silver paste layer. Anode lead terminals are connected to the ends of the valve metal plate and the respective end parts of the metal plate are arranged as cathode lead terminals. A shield strip line device, which is low in impedance, especially in high-frequency ranges of 100 MHz or more, and is favorably adapted to high speed and high frequencies, mainly for use as a bypass device for a noise filter or as a decoupling device, is thus obtained.Type: GrantFiled: November 5, 2003Date of Patent: March 29, 2005Assignee: NEC CorporationInventors: Koichiro Masuda, Hirokazu Tohya, Masaharu Satoh
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Patent number: 6859354Abstract: An electrolytic capacitor comprising an anode, cathode and an electrolyte. The electrolyte comprises: about 35-60%, by weight water; about 10-55%, by weight organic solvent; about 0.05 to 10%, by weight, sulphuric acid; about 0.05 to 10%, by weight, boric acid; and about 0.05 to 10%, by weight, phosphorus oxy acid.Type: GrantFiled: May 30, 2003Date of Patent: February 22, 2005Assignees: Kemet Electronic Corporation, Medtronic, Inc.Inventors: Mark Edward Viste, Joachim Hossick-Schott, Zhi Fang, Brian John Melody, John Tony Kinard