Abstract: A multi-case rack for an industrial computer includes a rack body and a plurality of removable cases. The removable case can be installed with either its axial end positioned ahead, thus compatible to both a front circuit board and a rear circuit board. The removable case has an anti-shock HD mount capable of holding either two 2.5? hard drives or one 3.5? hard drive. The removable case allows heat-dissipating fans to be installed and positioned in a screw-free, hot-swap manner. The removable cases can be readily installed into or from a rack body.

Abstract: A module for data center is presented, which is used for heat sinking of a heat source. The module for data center includes a first chamber, a second chamber, and a heat pipe. The heat source is positioned in the first chamber. The second chamber is adjacent to the first chamber. In addition, the heat pipe has an evaporation end positioned inside the first chamber and a condensation end positioned inside the second chamber. The heat pipe absorbs the heat energy in the first chamber with the evaporation end, transfers the heat energy to the condensation end, and eliminates the heat energy with the condensation end.

Abstract: A semiconductor package includes: a substrate having a first surface and a second surface opposing the first surface, the first surface having a fan placement zone, a hole and a ventilation hole penetrating the substrate formed at the fan placement zone of the substrate; an electronic component disposed on the first surface surrounding the fan placement zone, the electronic component electrically connected to the substrate; an encapsulant formed on the electronic component and the first surface of the substrate, the encapsulant having an encapsulant opening exposing the fan placement zone; and a fan unit disposed in the encapsulant opening and electrically connected to the substrate. Since the electronic component is disposed on the substrate outside the fan placement zone, heat generated by the electronic component can efficiently dissipate while damage problems of over heat will not occur, and the overall height of the fan unit can thus be decreased.

Abstract: A container data center includes a mobile container and a number of servers. The mobile container includes a main room receiving the servers, and an air shower room isolated from the main room. The air shower room includes an outer door, an inner door, a blower, and a dust absorber. The outer door connects the air shower room and is used to separate the air shower room from the outer environment. The inner door connects the air shower room and is used to separate the air shower room from the main room. The blower and the dust absorber are secured on two opposite walls of the air shower room respectively, the blower being configured for blowing air towards the dust absorber.

Abstract: A fan control system for a computer system is provided. The fan control system includes a power sensor and a controller. The power sensor detects the power dissipated by a target device in the computer system. The controller calculates a suggested airflow speed required for the target device and thus outputs a control signal for controlling a fan within the computer system according to at least the dissipated power.

Abstract: A cooling system includes a chassis. A thermal sensor is located in the chassis. A plurality of fan zones are located in the chassis. Each of the plurality of fan zones includes at least one fan. A first mapping is provided between the thermal sensor and a first fan zone of the plurality of fans zone, and a second mapping is provided between the first fan zone and a second fan zone in the plurality of fan zones. A controller is coupled to the thermal sensor and the at least one fan in each of the plurality of fan zones. In response to receiving a signal from the thermal sensor, the controller is operable to activate the at least one fan in the first fan zone according to the first mapping and activate the at least one fan in the second fan zone according to the second mapping.

Abstract: A projector includes: an illumination system which has a light source, and a light control unit opened and closed to shield a part of light emitted from the light source; a light modulation device illuminated by illumination light received from the illumination system; an air supply device which supplies air to the light control unit and the light modulation device; and an air supply control unit which decreases an air supply amount to the light modulation device when increasing an air supply amount to the light control unit in accordance with a relatively closed condition of the light control unit.

Abstract: A disk drive test slot thermal control system includes a test slot. The test slot includes a housing and an air mover (e.g., a blower or a fan). The housing includes an outer surface, and an internal cavity. The internal cavity includes a test compartment for receiving a disk drive for testing. The housing also includes an inlet aperture extending from the outer surface of the housing to the internal cavity. The air mover can be disposed outside of the internal cavity to provide an air flow towards the test compartment through the inlet aperture.

Abstract: A high-performance network switch chassis has multiple network ports and air openings on the front end of the chassis, and multiple fan modules mounted on the back end of the chassis. The fan modules are hot-swap replaceable so that replacement of one of the fan modules does not require interruption of network switch operation. Air-blockers associated with each fan module prevent recirculation of air when fan modules are removed. Different types of fan modules may be used to provide either front-to-rear or rear-to-front airflow through the chassis. A fan speed controller determines fan speed based on temperature using one of two profiles. The two profiles correspond to the two different airflow directions.

Abstract: A mobile computing apparatus includes a shell, a circuit board, a first heat-dissipation module, a centrifugal fan for exhaust, and a centrifugal fan for convection. The shell has a first through hole. The circuit board is disposed on the shell, and has a first heat-generation device. The first heat-dissipation module has a first heat-absorption end and a first heat-dissipation end, and the first heat-absorption end thermally contacts with the first heat-generation device. The centrifugal fan for exhaust has a first gas outlet, and the first heat-dissipation end is located between the first gas outlet and the first through hole, so that the centrifugal fan for exhaust exhausts to an outside of the shell. The centrifugal fan for convection is configured in the shell, and exhausts to an inside of the shell. Therefore, gas flow circulation occurs in the shell, so that the mobile computing apparatus has a desirable heat-dissipation effect.

Abstract: A server system includes a server cabinet, several servers, several fan groups coupled to a rear side of the server cabinet, and several fan control boards each connected to a group of the servers and a corresponding one of the fan groups. Each server includes several electronic components, a detecting module to detect performance characteristics of the electronic components, a comparison module to obtain a rotation speed according to the performance characteristics, and an executing module to convert the rotation speed into a fan speed control signal. Each fan group corresponds to a group of the servers. When the fan control board receives fan speed control signals from the servers, the fan control board converts the fan speed controls into an electrical signal to the fan group, thereby controlling the fan group to rotate at a corresponding speed to satisfy heat dissipation needs of the servers.

Abstract: A cooling system for a mobile computing device configured to drive two devices, a fan and an alert device. The fan cools components of the mobile computing device by exchanging air between an inner cavity of the mobile computing device and an outer environment surrounding the mobile computing device. The alert device produces an alert, e.g., a vibration, for the mobile computing device. The cooling system includes a motor operably connected to a first device (either the fan or the alert device) and operably connected via a clutch to a second device (either the fan or the alert device). The clutch allows the second device to be selectively activated depending on a speed or rotational direction of a drive shaft of the motor.

Abstract: An enclosure includes a housing, partition plates received in the housing, hard disk drives fixed between the partition plates, a cover fixed to the housing, a printed circuit board received in the housing and a fan assembly fixed within the housing. The housing includes a bottom plate and a pair of side plates. Each side plate has a guiding device mounted thereon. The guiding device includes a supporting element fixed to the side plate, a fixing element fixed with the printed circuit board, and a rod pivotably connecting the fixing element with the supporting element. The partition plates each have a hook, and the printed circuit board defines multiple slots corresponding to the hooks. The printed circuit board can be driven towards the partition plates by the fixing element around the supporting element so that the slots are aligned and locked with the hooks.

Abstract: A system includes a rack, one or more computer systems mounted in the rack, and two or more alternating current (AC) fans mounted in the rack. The AC fans move air through the computer systems mounted in the rack. At least one of the AC fans can move air through at least two of the computer systems mounted in the rack.

Abstract: An airflow shielding device is configured for being secured to fan and includes a first member, a second member, and a plurality of shielding pieces. The first member defines a first through opening. The second member defines a second through opening corresponding to the first through opening. The shielding pieces are rotatably secured between the first member and the second member and rotate between a closed position, where the shielding pieces cover the first through opening, and an open position, where the shielding pieces are located so that air can flow through the first and second through openings.

Abstract: An electronic device includes a bottom plate, a circuit board having an electronic component, a fan, and an airflow guide member. The circuit board is fixed to the bottom plate. The fan is arranged at the front of the circuit board. The airflow guide member is arranged between the fan and the circuit board. The airflow guide member includes an airflow guide wall defining a number of spaced slots, and a number of stop plates selectively inserted into the corresponding slots of the airflow guide wall, to leave some of the slots directly in front of the bottom of the electronic component open.

Abstract: Methods are provided for creating and operating data centers. A data center may include an information technology (IT) load and a fuel cell generator configured to provide power to the IT load.

Abstract: A cabinet includes a chassis, a server module, a first cooling module, and a number of second cooling modules. The server module includes servers received in the chassis, and each server includes heat generating components. The first cooling module includes first fans. The second cooling modules are mounted in each server. Each second cooling module includes a second fan and a temperature sensor electrically connected to the second fan. When temperatures measured by the sensors are lower than a predetermined temperature, only the first fans are employed to dissipate heat of the servers; when any of the measured temperatures is higher than the predetermined temperature, the temperature sensor that detected the higher temperature transmits a signal to the corresponding second fan for starting the second fan.

Abstract: Systems are provided for creating and operating data centers. A data center may include an information technology (IT) load and a fuel cell generator configured to provide power to the IT load.

Abstract: A data center includes a row of one or more racks. Computer systems are mounted in the racks. A cold aisle is on a first side of the rack row and a hot aisle is on the second side of the rack row. An air handling system moves air from the cold aisle on the first side of the row of racks through computer systems in at least one of the racks and exhausts air from the computer systems into the hot aisle on the second side of the row of racks. The computer systems include input/output connectors, power input connectors, and power supply air inlets on the first side (cold-aisle side) of the row. One or more power rack power distribution units are provided on the first side (cold-aisle side) of the row.

Abstract: A server including a chassis, an electronic module, a fan module and a handle is provided. The chassis has a first wedging portion. The electronic module is disposed in the chassis. The fan module is disposed in the chassis and is adjacent to the electronic module. The handle is pivotally connected to the fan module and has a second wedging portion, and the first wedging portion is used for wedging the second wedging portion. When the handle is rotated, the fan module is moved relatively to the first wedging portion for entering or exiting the chassis.

Abstract: A rack-mount server system includes a cabinet, a number of server units mounted in the cabinet, and a number of fan modules. Each fan module cools one or a group of server units. Each fan module includes a mounting bracket fixed to the cabinet, a number of fans attached to the mounting bracket, an air flap, and a control box to control the power supply to the fans. The mounting bracket defines an air passage dedicated to each fan, through which air from the fan is guided to the one or a group of server units. Each mounting bracket defines a cutout, through which the air passages of two neighboring fans communicate with each other. The air flap may be slid closed or slid open to redirect or gather a cooling airflow as required, depending on the distribution of server units within the cabinet.

Abstract: A cooling system is used for cooling an electronic apparatus in an electronic device. The electronic device includes a top wall, a bottom wall, a first sidewall, and a second sidewall. The electronic apparatus is supported on a middle of the bottom plate. The cooling system includes an evaporator, a fan, a condenser, a heat sink attached to the condenser, and a refrigerant pipe connected between the condenser and the evaporator. The heat sink and the condenser are set on an inner surface of the first sidewall. The fan is set on the first sidewall and aligns with the heat sink. The condenser operates to cool refrigerant and transfers the cooled refrigerant to the evaporator. A first airflow cooled by and coming from the evaporator flows through the electronic apparatus and the condenser to cool the electronic apparatus and the condenser, and is then vented through the fan.

Abstract: A server system includes a server cabinet, several servers accommodated in the server cabinet, several fan groups coupled to a rear side of the server cabinet, and several fan control boards. The servers each include an intelligent platform management interface. Each fan group includes a row of fans to provide a horizontal airflow to cool several of the servers. The fan control boards each include several intelligent platform management interfaces each connected to the intelligent platform management interface via an intelligent platform management bus, thereby allowing the servers sending a message to a corresponding one fan control board. When the fan control board receives one or more messages from the servers, the fan control board is capable of transmitting an electrical signal corresponding to the one or more messages for controlling a rotation speed of a corresponding one fan group.

Abstract: A server system includes a server cabinet, a network switch, a number of servers accommodated in the server cabinet, a number of fan groups, and a number of fan control boards connected to the network switch via Ethernet connections. The servers are connected to the network switch via Ethernet connections for transmitting a data packet to the network switch. The fan groups are coupled to a rear side of the server cabinet and each comprising a number of parallel fans to provide a horizontal airflow to cool several of the servers. Each of the fan control boards is connected to one of the fan groups and configured to convert a data packet to an electrical signal for controlling a rotation speed of the corresponding one of the fan groups.

Abstract: An electronic device includes a bottom plate, a circuit board, a fan, and an airflow guide member. The circuit board is fixed to the bottom plate. The fan is arranged at the front of the circuit board. The airflow guide member is arranged between the fan and the circuit board. The airflow guide member includes an airflow guide wall for guiding most of airflow upwards to the top of the circuit board. A number of slots is defined in the airflow guide wall, for allowing only a minimum portion of the airflow to flow underneath the circuit board.

Abstract: A computer system includes a display, a computer case securing the display, a fan assembly and a cover. A motherboard is attached to the computer case. A chip, a heat dissipating device, and a system fan are located on the motherboard. The fan assembly includes a securing plate and a fan attached to the securing plate. The securing plate covers the plurality of the memory cards. The cover defines a plurality of air intakes and a plurality of air outlets. The plurality of air intakes, the fan, the heat dissipating device, the chip, the system fan and the plurality of air outlets together form an air path for moving air therethrough.

Abstract: A server comprises a holding chassis. The holding chassis comprises a front open end and a back open end. A cable interface area is disposed in the back open end. A fan is disposed in the front open end. The fan is configured to force air form the front open end to the back open end. The holding chassis also comprises a computer rack mounting system being configured to hold a plurality of computers. The server also comprises a blade tray being configured to be removably joined to the rack mounting system. The blade tray comprises a computer and a DC to DC power converter. The server also comprises a power supply shelf being configured to hold a power supply for the blade tray and a power supply for the fan. For alternate off-grid operation, the server may also comprises a DC power distribution box being configured to distribute DC power from external sources.

Abstract: A rack-mount computer system includes one or more rows of computer racks, wherein each row of computer racks includes a pair of rows of computer racks positioned back-to-back relative to each other, a plurality of computer motherboards mounted in each of the racks in each row of computer racks and having front edges open to a workspace for receiving circulating air over the motherboards, the motherboards positioned to create a warm air plenum near a back edge of each motherboard, and a fan positioned adjacent each of the plurality of computer motherboards to circulate air across the computer motherboards and into the warm air plenum.

Abstract: A server rack system for managing a fan rotation speed is provided, and the system includes: at least one first network switch, multiple servers, at least one fan unit, at least one fan control unit and an Integrated Management Module (IMM). Each of the servers has at least one temperature detecting element, and the temperature detecting element detects and obtains temperature information related to multiple servers, in which the temperature information is uploaded to a management network. The fan control unit is connected to the fan unit. The IMM has a management network port connected to the management network, obtains the temperature information through the management network, then generates a control command according to the temperature information, and transmits the control command to the fan control unit through the management network. The fan control unit adjusts the rotation speed of the fan unit according to the control command.

Abstract: A container data center includes a portable container, server cabinets, a decibel-meter, fans to cool the server cabinets, fan controlling systems to speed up or slow down the fans, an air conditioner to adjust a temperature inside the container, and a temperature adjustment system to receive a decibel level sensed by the decibel-meter. The temperature adjustment system compares the value of the received decibel level with a preset value. If the value of the received decibel level is greater than the preset value, the temperature adjustment system decreases the temperature of air outputted by the air conditioner, thereby the fan controlling systems slowing down the fans. If the value of the received decibel level is not greater than the preset value, the temperature adjustment system increases the temperature of the air outputted by the air conditioner, thereby the fan controlling systems speeding up the fans.

Abstract: A server rack system includes a management network switch, servers, a power supply unit, fan units, and an integrated management module (IMM). Management network ports of baseboard management controllers (BMCs) of the servers are connected to the management network switch. A management network port of the power supply unit is connected to the management network switch. Management network ports of the fan units are connected to the management network switch. A management network port of the IMM is connected to the management network switch. The IMM communicates with the BMCs of the servers, the fan units, and the power supply unit through the management network switch, so as to obtain operation states of the servers, the fan units and the power supply unit, or control operations of the servers, the fan units and the power supply unit.

Abstract: A server rack system is provided, which includes a rack, a rack management module, a plurality of servers, and a management network connection module. The rack management module is located in the rack and coupled to a management network line (MNL). The servers are located in the rack. Each server includes a baseboard management controller (BMC), and each BMC is used to monitor a working status of the server where the BMC is located. The management network connection module is located in the rack and coupled to the MNL to be connected to the rack management module and the BMC through the MNL. The rack management module is used to allocate an Internet Protocol (IP) address to the BMC and manage each server through the BMC corresponding to each IP address.

Abstract: An electronic device includes: a chassis for housing an electronic unit; and a hold member capable of holding to a fan unit blowing air toward the electronic unit and attachable to and detachable from a plurality of positions of the chassis.

Abstract: A storage device testing system cooling circuit includes a plurality of test racks. Each of the test racks include a test slot compartment and a test electronics compartment. Each of the test slot compartments includes multiple test slots, and one or more cooling conduits configured to convey a cooling liquid toward the test slots. Each of the test electronics compartments includes test electronics configured to communicate with the test slots for executing a test algorithm, and a heat exchanger in fluid communication with the one or more cooling conduits. The heat exchanger is configured to cool an air flow directed toward the test electronics.

Abstract: An enclosure of an electronic apparatus, includes a chassis and a fan bracket assembly. The fan bracket assembly is mounted in the chassis. The fan bracket assembly includes a first fan bracket with a first fan mounted therein and a second fan bracket with a second fan mounted therein. The second fan bracket is pivotably mounted on the first fan bracket, and configured to be positioned at different positions relative to the first fan bracket.

Abstract: A keyboard including a case, a first fan, an air deflector and a keycap module is provided. The case includes a first side and a second side. The first side has an opening, the second side is disposed at a side of the first side and has at least one hole. The first fan is disposed at the second side and located between the first side and the second side. The air deflector is disposed between the first side and the second side of the case and corresponding to the hole of the second side and the opening of the first side. The keycap module is disposed at the opening of the first side.

Abstract: A mounting device secures a fan module to a chassis. The mounting device includes a bracket and a spring. The bracket includes a bottom plate and a vent plate substantially perpendicular to the bottom plate. The bottom plate defines a through hole. The spring is fixed on the bottom plate adjacent to the vent plate. The spring includes an elastic portion and a securing tab protruding through the through hole. The elastic portion can retract the securing tab into the bracket.

Abstract: Enclosing arrangements of racks of computing devices fully encloses a space, either solely by the racks themselves, or in conjunction with structural features, such as walls and doors. The enclosed space can be either a hot aisle, whose hot air is vented out by fans positioned in at least one vertical extremity of the enclosed space, such as the floor, or ceiling, or it can be a cold aisle, whose cold air is pumped in by those fans. To maintain proper pressurization across a vertical cross-section of the enclosed space, specific ones of the computing devices have their fans adjusted based on their vertical position within the racks or have passive airflow adjustments, such as impedance screens. Computing devices can draw or vent air from their sides, taking advantage of the interstitial space between the racks provided by the enclosing arrangement.

Abstract: A server including a rack, chassis, a power module, first copper columns, and second copper columns is provided. The rack has a front end and an opposite back end. The chassis are disposed in the rack and suitable for being pulled out from the front end. Each chassis contains a motherboard module. The power module is disposed in the rack. The first copper columns are fixed on the rack, electrically connected to the power module, and are suitable for electrically connecting an external power supply. The second copper columns are fixed on the rack and electrically connected to the power module and the motherboard modules. A high voltage from the external power supply is transmitted to the power module via the first copper columns. The power module converts the high voltage into a low voltage and transmits the low voltage to the motherboard modules via the second copper columns.

Abstract: An electronic device includes a casing, a fan bracket and a fan module. The casing includes a top plate and a bottom plate spaced from and facing the top plate. The fan bracket is mounted on the bottom plate. The fan module includes a fan, a fan holder enclosing the fan therein, and two vibration dampening structures mounted on opposite top and bottom sides of the fan holder. The fan holder is engaged in the fan bracket. The vibration structures protrude beyond the top and bottom sides of the fan holder and abut the top plate and the bottom plate of the casing, respectively.

Abstract: A low profile heat removal system suitable for removing excess heat generated by a component operating in a compact computing environment is disclosed. The low profile heat removal system is capable of removing disproportionately high amounts of heat given its small form factor, by virtue of a highly efficient staggered cooling fin configuration.

Abstract: An exemplary heat dissipation device is adapted for dissipating heat generated by an electronic component mounted on a printed circuit board. The printed circuit board is secured on a casing of an electronic system. The heat dissipation device includes a heat sink disposed on the electronic component; and a plurality of fasteners extending through the heat sink, respectively, to assemble the heat sink to the printed circuit board. Each of the fasteners includes a supporting member fixed in the printed circuit board, an engaging member fixed in the board, and a screwing post engaging with the heat sink. A bottom portion of the screwing post extends through the printed circuit board via the supporting member, and is screwed into the engaging member.

Abstract: A computer includes a power supply for providing electrical power, a system fan, a power fan for cooling the power supply, and a fan speed control system. The fan speed control system is configured to synchronize a rotation speed of the system fan and the power fan.

Abstract: The disclosure relates to a method, circuit, and electronic device for controlling a rotation speed of a fan. The method provides a multistage function curve associates temperatures with rotation speed values. The multistage function curve comprises a first steady-state function segment with slope of zero, a second steady-state function segment with slope of zero and N function segments positioned between the first and second steady-state function segments. N is a positive integer. The slope of a (i+1)th function segment is greater than that of an ith function segment, and i is a positive integer in the range from 1 to N. The electronic device comprising the circuit may use the temperature of the processor based on the multistage function curve to dynamically control the rotation speed.

Abstract: Embodiments of the present invention provide a server, including a transition board which is disposed with power interfaces and fan interfaces, and the power interfaces and the fan interfaces are connected to a standardized power interface and a standardized fan interface on a motherboard respectively; the number of the power interfaces and the number of the fan interfaces are not smaller than the maximum number of power interfaces and the maximum number of fan interfaces in the commonly-used server motherboard respectively; and the power interfaces and the fan interfaces are connected to the power supply and the fan through the backplane respectively, so that the power interfaces and the fan interfaces are connected to the power supply and the fan through the power interfaces and the fan interfaces on the transition board respectively. Through the embodiments of the present invention, flexibility of replacing a motherboard may be improved.

Abstract: A cooling apparatus comprising an impeller, a housing that encloses the impeller, an inlet opening formed between the hosing and impeller and a projection formed on the housing that extends from the housing towards the impeller.

Abstract: The disclosure provides a motherboard module, which includes a motherboard, a cover, a plurality of raised posts and a plurality of plates. The cover covers the motherboard thereon and a first space is formed by the cover and the motherboard. The raised posts are disposed in the first space. The plates are detachably assembled to the raised posts and connected between any two adjacent raised posts so as to partition the first space into a plurality of second spaces. The plates and the raised posts can restrict the heat generated by the heat sources at different limited areas, which is advantageous for the cooling air-flow to cool the heat sources and the motherboard module thereby has better cooling performance.

Abstract: An electronic device and a method for controlling heat reflux of the electronic device include setting a speed decrease value and standard temperatures for each of the first device and the second device. The control method further includes detecting a working temperature of the second device using a temperature sensor of the electronic device, if a speed of the second fan is at a full speed. The control method further includes reducing a speed of the first fan according to the speed decrease value, if the speed of the second fan is at the full speed and the detected working temperature exceeds the standard temperature of the second device.

Abstract: According to one embodiment, an electronic apparatus includes a housing including an outlet, a cooling fan in the housing, a component in the housing configured to serve as a wall guiding air from the cooling fan to the outlet, and a wind shielding portion between the component and an inner surface of the housing.