Abstract: A blower fan according to a preferred embodiment of the present invention is a centrifugal fan. At least a portion of each of a plurality of blades of an impeller portion is arranged above a stator. A lower plate portion is arranged to define an air channel portion and an air outlet arranged on a lateral side of the impeller portion when a side wall portion arranged to surround an outer circumference of the impeller portion and an upper plate portion arranged above the impeller portion are present. The air channel portion is arranged to extend in a circumferential direction between an outer circumference of the stator and the side wall portion. At least a portion of a circuit board is arranged in the air channel portion and on the lower plate portion. A plurality of lead wires extending from the stator are connected to the circuit board in the air channel portion.

Abstract: A blower fan according to a preferred embodiment of the present invention is a centrifugal fan including a stationary portion, a bearing mechanism, and a rotating portion. The stationary portion includes a lower plate portion and a stator. The stator includes a plurality of teeth each of which has a radially inner end including an upward projecting portion arranged to extend axially upward.

Abstract: In a casing, a printed circuit board is arranged such that a first side of the printed circuit board has a first angle of ?° with respect to a first side surface plate. A cooling device is arranged to have a second angle of ? with respect to the first side surface plate. Accordingly, an amount of cooling air flowing in and out via an air intake port and an air discharge port may be increased. Furthermore, by reducing the angle of the change in the flow direction of the cooling air flowing over the printed circuit board, the cooling air flowing over the printed circuit board may be made to efficiently flow through an air discharge port 119a. Furthermore, the efficiency with which a heat-generating component on the printed circuit board is cooled may be improved.

Abstract: A small form factor desktop computing device having a suitable internal cooling arrangement is disclosed. The device can be formed of a single piece seamless housing machined from a single billet of aluminum. The single piece seamless housing includes an aesthetically pleasing foot support having at least a portion formed of RF transparent material that provides easy user access to selected internal components as well as offers electromagnetic shielding. The device can also include a removable foot, a heat producing element, a fan, an air processing manifold having a plurality of angled fins, and a heat exchanger.

Abstract: In an axial fan, a housing includes a side wall arranged to surround an outer circumference of an impeller, and a substantially square or substantially rectangular flange arranged to project radially outward from an outer circumferential surface of the side wall. The side wall preferably includes three slit groups each including a plurality of slits arranged in a circumferential direction and arranged to extend through the side wall from an inner circumferential surface to the outer circumferential surface thereof. Two of the slit groups are defined in portions of the side wall which correspond to two adjacent corner portions in an upper half portion of the flange, while the remaining slit group is defined in a portion of the side wall which corresponds to a lower half portion of the flange. The upper and lower half portions are divided at a line parallel or substantially parallel to two opposing sides of the flange and passing through a central axis.

Abstract: A portable system that includes a portable housing having a section for reception of portable wireless computing devices such as tablets, and components to provide recharging capability and information to the portable wireless devices.

Abstract: A computing system includes a chassis, one or more backplanes coupled to the chassis. Computing devices are coupled to the one or more backplanes. The one or more backplanes include backplane openings that allow air to pass from one side of the backplane to the other side of the backplane. Air channels are formed by adjacent circuit board assemblies of the computing devices and the one or more backplanes. Channel capping elements at least partially close the air channels.

Abstract: A container that holds rack mountable electronics equipment includes a plurality of rack enclosures and a corresponding plurality of enclosure cooling units. Each rack enclosure is movably mounted in the container such it can move from a position abutting a front of an enclosure cooling unit to a maintenance and access position spaced apart from the enclosure cooling unit. Each enclosure cooling unit is capable of providing varying amounts of cool air to the rack enclosure it abuts, so that the interior of each rack enclosure can be maintained at a different temperature.

Abstract: A fan frame includes a blade holder, a pair of ventilation plates, and at least one side plate. The pair of ventilation plates is attached to opposite sides of the blade holder along a first direction and includes a pair of securing blocks. The at least one side plate is attached to the blade holder along a second direction substantially perpendicular to the first direction and located between the pair of ventilation plates. The pair of mounting slots is defined in the at least one side plate and engaged with the pair of securing blocks, thereby securing the pair of ventilation plates and the at least one side plate to the blade holder.

Abstract: A rotation speed control circuit is disclosed. The rotation speed control circuit includes a temperature-controlled voltage duty generator, a pulse-width signal duty generator, a multiplier and a rotation speed signal generator. The temperature-controlled voltage duty generator converts temperature-controlled voltage to digital temperature-controlled voltage and executes linear interpolation operation according to a first setting data so as to output temperature-controlled voltage duty signal. The pulse-width signal duty generator coverts pulse-width input signal to a digital pulse-width input signal and executes linear interpolation operation according to a second setting data so as to output a pulse-width duty signal. The temperature-controlled voltage duty signal and the pulse-width duty signal are executed for multiplication by the multiplier so as to output mixing-duty signal.

Abstract: A delay circuit for a fan includes a signal generation circuit, a first switch, a delay microchip, and a second switch. The signal generation circuit receives a driving signal and generates a control signal according to the driving signal. The first switch is electronically connected to the signal generation circuit to receive the control signal. The second switch is electronically connected between the delay microchip and the fan. When the signal generation circuit is electronically connected to the fan via the first switch, the control signal is transmitted to the fan to activate the fan. When the signal generation circuit is electronically connected to the delay microchip, the delay microchip receives the control signal and outputs a delayed control signal after a predetermined delay time, and the delayed control signal is transmitted to the fan via the second switch to activate the fan.

Abstract: A mounting device for mounting a fan includes a base board and two fixing assemblies. The fan includes two opposite boards. The base board forms four rods. Each fixing assembly includes a receiving member and an engaging member. The receiving member includes a first pole capable of extending through a corresponding one of the boards and a first block abutting against an outer surface of the board. The engaging member includes a second pole capable of extending though the other one of the boards to be engaged in the first pole, and a second block abutting against an outer surface of the other board. Each of the first and second blocks defines a fixing hole through which a corresponding one of the rods is capable of extending.

Abstract: A computer system includes a computer case, an enclosure, and a heat dissipating device. The computer case includes a rear plate with a plurality of ventilation holes. The enclosure includes a separating portion to divide the computer case into a first receiving area and a second area. The heat dissipating device includes a first heat sink, a second heat sink, a heat pipe and a fan. The first heat sink is attached to a chip, and the fan communicates with the second heat sink. The first heat sink and the fan are received in the first receiving area, and the second heat sink is received in the second receiving area. The heat pipe extends through the separating portion, and the plurality of ventilation holes, the first heat sink, the fan, the heat pipe, and the second heat sink together defines an air path for air flowing through.

Abstract: A plugboard heat dissipation system is provided. The system may include a plugboard, an enclosure, and an air supply apparatus that provides an air source for heat dissipation, a length of a first board edge on the plugboard is greater than a length of a second board edge, an output port is disposed on the first board edge, a spatial position of the second board edge is corresponding to that of the first board edge, a connecting part connected to another plugboard orthogonal to the plugboard is disposed, the output port is output out of an enclosure using a first end face of the enclosure, the connecting part is output out of the enclosure using a second end face of the enclosure. In the system, when space in which the plugboard is located is limited, the number of ports on the plugboard can be expanded.

Abstract: A motor driving system including command value output means configured to output an analog value according to a rotation speed command; a first power line having first switching means; a drive circuit, to which power is supplied via the first switching means and the first power line, driving a motor supplying rotation based on the analog value; and switching control means configured to make the first switching means nonconductive when the analog value is smaller than a first predetermined value, and independent of the command value output means.

Abstract: A heat transfer device is described. In one or more implementations, a heat transfer device includes a heat sink and a thermal storage enclosure disposed proximal to at least a portion of the heat sink. The thermal storage enclosure configured to be disposed proximal to a heat-generating component of a device. The thermal storage enclosure includes a phase change material configured to have a melting temperature that is below a temperature at which a cooling fan of the device is set to operate to cool the heat-generating device.

Abstract: An air containment cooling system for containing and cooling air between two rows of equipment racks includes a canopy assembly configured to enclose a hot aisle defined by the two rows of equipment racks, and a cooling system embedded within the canopy assembly. The cooling system is configured to cool air disposed within the hot aisle. Other embodiments and methods for cooling are further disclosed.

Abstract: In the electronic device, an inlet 10 is provided on a front face 1c of a first housing 1. Thus, it is possible to reduce the possibility of the inlet 10 being blocked by objects. That is, when a user uses a notebook computer in a normal position, his body opposes the front face 1c in many cases. Thus, when the inlet is provided on the front face 1c, the inlet is less likely to be blocked than when it is provided on any other face of the first housing 1. For this reason, the cooling efficiency within the first housing 1 does not drop.

Abstract: A notebook computer 1 is provided with: a casing in which a CPU is accommodated; a heat-dissipating component 37 having a plurality of fins; and a fan 31, and operates such that heat transferred from the CPU to the heat-dissipating component 37 is heat-exchanged with air supplied from the fan 31, and released to the exterior of the casing. The heat-dissipating component 37 is disposed at an air outlet 32b of the fan 31. An opening 35 is formed, between the air outlet 32b and a fan main unit 33, in a fan case 32. First shutter means 39 is provided on a discharge outlet surface of the heat-dissipating component 37. With this structure, increase in cost and weight can be restrained, and dust on the heat-dissipating component can be removed with a simplified structure.

Abstract: A computing center module with a module casing and a module area in which electronic devices are arrangeable, at least one access path being provided in the module area. The module area has a hot air outlet region, and the module casing tapers towards the hot air outlet region such that a natural cooling process is allowed. The computing center module is easily and inexpensively produced, requires little surface area, can be cooled efficiently and inexpensively, and offers the possibility to scale the provided module area as needed in a simple manner and to protect against specific environmental risks. The module casing is formed by a pipe which is closeable at the axial ends, and the module casing is provided with at least one movable coupling device for connecting to another computing center module casing such that a common module area is produced when the module casings are connected.

Abstract: An expansion apparatus suitable for an electronic apparatus is provided. The expansion apparatus includes a base, a supporter and an airflow guiding structure. The base has a first fan disposed therein. The supporter is pivoted to the base along a rotating axis and has a cooling channel. The cooling channel has a first port and a second port opposite to the first port. When the electronic apparatus is assembled to the supporter, the second port of the cooling channel faces to the electronic apparatus. The airflow guiding structure is disposed between the supporter and the base movably. When the supporter is pivoted relative to the base to an expanded state, an active airflow generated by the first fan is guided by the airflow guiding structure to pass through the base and the electronic apparatus. An electronic equipment including the expansion apparatus is also provided.

Abstract: A computer assembly includes a processor integrated circuit; a hard disk drive electrically connected to the processor integrated circuit and a power supply assembly, powering the processor integrated circuit and hard disk drive; a liquid-tight case, entirely containing and physically isolating and protecting the processor integrated circuit, hard disk drive and power supply assembly, the liquid-tight case defining fluid channels; electrical connectors to permit connection of the computer to outside devices; and a fan in the liquid-tight case, adapted to drive fluid through the fluid channel, thereby facilitating the movement of heat through the computer assembly.

Abstract: An electrical equipment chassis includes a frame open to a first side and an opposite second side and a power board located near a mid-plane of the chassis coupling power supply modules to first networking modules and a second networking module. A first region open to the first side can receive first power supply modules. A second region open to the first side is adjacent to the first region and can receive the first networking modules and the second networking module oriented with a first orientation. A third region open to the second side can receive fan trays with fans and third networking modules. The third networking modules are oriented orthogonal to the first orientation. The power board at least partially separates the first and third regions and only partially separates the second and third regions. The chassis permits air flow from the first side to the second side.

Abstract: A method for generating a fan table includes the following. A temperature of each electronic component and a speed of a fan are obtained at preset intervals, The obtained temperature of each electronic component is compared with the corresponding preset temperature. In addition, the speed and a corresponding combination of loads are recorded to a fan table of the electronic component when the temperature of the electronic component is equal to the corresponding present temperature.

Abstract: A cooling system comprises an electronics module and a duct. The electronics module produces more heat at a first location than at a second location, and is rated to a safe operating temperature. The duct surrounds the electronics module, and has a shaped baffle with a constricted region near the first location and an open region near the second location. The expanded region has greater cross-sectional flow area than the constricted region. Airflow through the duct cools both the first location and the second location to within an efficiency margin below the safe operating temperature.

Abstract: A server cooling device is described that includes an enclosure defining an interior space and at least one server rack port configured to engage a rack such that one or more rack mounted units installed in the rack interface with the interior space. The server cooling device also includes a mixing chamber including one or more cooling coils that is connected to the interior space defined by the enclosure.

Abstract: Apparatus for retracting and extending sets of operational processing devices in a multi-device enclosure. In accordance with some embodiments, an enclosed housing is provided with opposing first and second ends. Sleds are individually movable between a retracted position within the enclosed housing and an extended position in which the sled projects from the first end. Each sled supports a group of processing devices. A control board is disposed within the enclosed housing adjacent the second end. A plurality of flex circuits contactingly engage the processing devices to provide communication paths between the processing devices and the control board in both the retracted and extended positions of the sleds.

Abstract: A server system is provided. The server system includes at least one fan module, a plurality of server nodes and a system management module. Each of the server nodes includes at least one sensor and a node management chip. The sensor detects temperature information of the server node. The node management chip stores an algorithm and retrieves the temperature information to calculate a node fan speed value according to the algorithm. The system management module manages the server system, retrieves the node fan speed values from the node management chip of each of the server nodes, generates at least one coordinated fan speed value according to the node fan speed values and controls the speed of the fan module according to the coordinated fan speed value to perform heat dissipation for the server node.

Abstract: A memory combination includes a first riser board, a second riser board, and a pivotal plate. The first riser hoard includes a plurality of first memory sockets of which long axis directions are parallel to each other. The second riser board includes a plurality of second memory sockets of which long axis directions are parallel to each other. Two end of the pivotal plate are pivotally connected to the first riser board and the second riser board based on an axial direction respectively. When the first and second riser boards rotate to be perpendicular to the pivotal plate, the first memory sockets face the second riser board, and the second memory sockets face the first riser board. The axial direction is perpendicular to the long axis directions of the first memory sockets and the long axis directions of the second memory sockets.

Abstract: First and second units are mounted on a rear side of a housing of a storage system. Either of the first and second units includes a fan. The rear side of the housing includes an upper-tier portion defining an upper-tier opening, and a lower-tier portion defining a lower-tier opening, and the housing further includes a boundary portion that is a boundary between the upper-tier portion and the lower-tier portion, and a shutter unit. The boundary portion includes a first through hole that is a through hole connecting an upper-tier passage and a lower-tier passage. When the fan is operating, if the first unit is removed from the upper-tier portion, the shutter unit blocks the upper-tier passage, and if the second unit is removed from the lower-tier portion, the shutter unit blocks the lower-tier passage.

Abstract: A connection arm couples to a cooling fan main body to enclose wires extending from the main body to an end of the connection arm that holds a plug of the wires in a position aligned with a circuit board cooling fan socket. Wires enclosed in the connection arm slip through a slot along the side of the connection arm and are protected from view by a cable cover disposed along the top surface of the cooling fan and connection arm.

Abstract: A system for removing heat from electrical systems includes a dehumidification device including a desiccant, an evaporative cooling device, and air moving devices, and an air flow control devices. The air moving device moves air through the dehumidification device, the evaporative cooling device, and the electrical systems.

Abstract: A storage apparatus S comprises a disk controller for controlling data I/O processing between a host H and a disk unit. The disk controller includes a plurality of circuit board modules each having a circuit board and a module case storing the same, and a chassis shaped like a hollow cylinder having a front side opening and a rear side opening and configured to store the circuit board modules from the front and rear side openings. A CM module is configured to introduce cooling air from a cooling fan through an opening provided on at least one side surface toward a circuit component mounted on the circuit board. A MP module is configured to introduce cooling air by a cooling fan through an opening provide on a front surface of the module case.

Abstract: An electronic device with a housing or enclosure. At least one heat-generating electronic component is contained within the housing. The electronic device further comprises a fan module configured to direct cooling air over the at least one heat-generating electronic component. The fan module is pivotably secured to the housing and capable of pivoting through at least 180°, such that the cooling air can be directed in a front-to-back flow path or a back-to-front flow path. Either of a manufacturer and a customer can reconfigure the direction of airflow.

Abstract: A notebook computer 1 is provided with: a casing 20a in which electronic components including a CPU are accommodated; and a heat-dissipating unit 30 that includes a heat-dissipating component 37 having a plurality of fins 37a to which heat is transferred from the CPU, and a fan 31 for supplying air to the heat-dissipating component 37, and, in the heat dissipating unit 30, heat exchange between heat transferred from the CPU to the heat-dissipating component 37, and air supplied from the fan 31, is performed to release heated air to the exterior of the casing 20a. A communicating path 36 is formed, between an air outlet 32b of the fan 31, and an inflow surface 37b of the heat-dissipating component 37, for communicating therebetween, and a dust removal path 38 is formed in the communicating path 36 so as to communicate with the exterior of the casing 20a.

Abstract: A heat dissipation structure includes a circuit board that is disposed inside an outer casing having a chassis formed with air inlet holes, and in which a first electronic component generating heat when driven and a second electronic component not generating heat when driven are mounted on one surface of a base plate, and a heat sink that releases the heat generated in the first electronic component. Here, in the heat sink, a heat dissipation unit positioned facing the base plate, an eaves portion protruding from the heat dissipation unit, and a pair of enclosing portions protruding from ends of the eaves portion in a direction perpendicular to a protruding direction from the heat dissipation unit, and at least one of the air inlet holes is formed in a position facing the eaves portion.

Abstract: The present disclosure relates to an adjustable air suction device, comprising a driving structure, an air suction structure, and a link structure. The driving structure and the air suction structure are disposed on a housing of an electronic device. The link structure is disposed inside the housing. Both ends of the link structure correspond to the driving structure and the air suction structure, respectively. The driving structure drives one end of the link structure to move towards a first direction, and drives the other end of the link structure to move towards a second direction. The other end of the link structure pushes the air suction structure, and projects from the housing. Besides, the air suction structure corresponds to a heat dissipating device of the electronic device and draws a great deal of fluids into the electronic device for dissipating the heat of the electronic components in the electronic device.

Abstract: A heat dissipation system includes a computer case having a base plate and a back plate perpendicularly to the base plate, a motherboard on the base plate adjacent to the back plate, and a mass storage device beside the motherboard. The motherboard has a heat sink and a first fan on the heat sink. The base plate has a second fan beside the motherboard. The second fan is adjacent to the back plate. The mass storage device is away from the back plate. The first fan rotates in such a manner that airflow is drawn into the computer case, flows through the heat sink and is exhausted out of the computer case. The second fan rotates in such a manner that airflow is drawn into the computer case, flows through the mass storage device and is exhausted out of the computer case.

Abstract: Provided is an apparatus, a system, and a method for operating the same. The apparatus, in one embodiment, includes a chassis having a front configured to accept one or more circuit boards, a back, and first and second sides. The apparatus, in this embodiment, further includes one or more slots located within the chassis, each slot configured to receive one of the circuit boards at an angle with respect to the first and second sides. The slots, in this embodiment, at least partially define a first plenum opening to the front and a second plenum opening to the back. The apparatus additionally includes a fan assembly coupled to one of the first plenum or the second plenum.

Abstract: A server includes a tray that has a front portion and a back portion. A motherboard is disposed in the front portion of the tray and the motherboard is coupled to a heat sink. A fan is disposed in the back portion of the tray. A hard drive is disposed between the motherboard and the fan and the hard drive is operatively connected to the motherboard. The server also includes a heat pipe that has a body longitudinally bounded by an inlet and an outlet. The inlet is coupled to the heat sink, while the outlet is coupled to the fan. The body of the heat pipe extends past the hard drive. A power supply is also disposed in the tray and is operatively connected to the motherboard, the fan, and the hard drive.

Abstract: High pressure fans are mounted in the middle of an enclosure to create a low pressure zone and a high pressure zone within the enclosure. The high pressure fans pull air through high density sets of hard disk drives in the back of an enclosure and push air through high density disk drives in the front of the enclosure. Being positioned in the middle of an enclosure allows the high pressure fans to mix hot air pulled through the low pressure zone with cool air existing on the other side of the fans. The fans then push the cool mixed air through the next set of hard drives, forming a high pressure zone and allowing the air to exit at the front of the enclosure.

Abstract: A matrix converter includes first to third AC reactors connected in series with first- to third-phase outputs of three-phase AC electric power, and a first cooling fan that generates cool air for cooling the first to third AC reactors. The first to third AC reactors are arranged side-by-side in a direction intersecting a direction in which the cool air flows.

Abstract: Examples disclose a removable air guide assembly with a processor air cooler to direct air over a processor on a circuit board, the processor air cooler is not directly aligned over the processor. Further, the examples provide the removable airflow guide assembly with memory bank coolers to direct air over memory banks also positioned on the circuit board. Additionally, the examples also disclose the removable airflow guide assembly with a connector socket to align with the circuit board and provide power to the processor air cooler and the memory bank coolers.

Abstract: A server including a chassis, an electronic module, a fan module and a handle is provided. The chassis has a first wedging portion. The electronic module is disposed in the chassis. The fan module is disposed in the chassis and is adjacent to the electronic module. The handle is pivotally connected to the fan module and has a second wedging portion, and the first wedging portion is used for wedging the second wedging portion. When the handle is rotated, the fan module is moved relatively to the first wedging portion for entering or exiting the chassis.

Abstract: Surfaces for electromagnetic shielding, retaining electrostatic charge and indeed collecting ion current in EHD fluid mover designs may be formed as or on surfaces of other components and/or structures in an electronic device. In this way, dimensions may be reduced and packing densities increased. In some cases, electrostatically operative portions of an EHD fluid mover are formed as or on surfaces of an enclosure, an EMI shield, a circuit board and/or a heat pipe or spreader. Depending on the role of these electrostatically operative portions, dielectric, resistive and/or ozone robust or catalytic coatings or conditioning may be applied.

Abstract: An electronic device housing device includes a housing, a plurality of slots that are arranged side by side inside the housing, the slots each housing the electronic device, a gas passage that guides a gas flowing into each of the slots in a direction across the slots, a connection substrate provided inside the housing to extend upright, the connection substrate being arranged to face the slots, the connection substrate including a connected portion to which a connecting portion of the electronic device housed in each of the slots is to be connected, a ventilation port provided at an end portion of the connection substrate, the ventilation port allowing the gas to flow into through the gas passage from each of the slots, and a fan that sucks the gas flowing into each of the slots into the ventilation port through the gas passage.

Abstract: The invention relates to a cooling circuit system, comprising a plurality of juxtaposed racks; a double bottom consisting of double bottom elements mounted on a base bottom on which double bottom the racks are mounted; electric or electronic components to be cooled, which components are accommodated in the racks; and a cooling system, the components of which are accommodated in the double bottom, wherein the cooling system comprises fans that are connected in parallel and that blow cooled air from the double bottom towards the juxtaposed racks. The invention relates also to a method of controlling a cooling circuit system of that type.

Abstract: DIMMs to be cooled are mounted in DIMM areas of a printed circuit board of a system board. An air intake port that introduces cooling air is arranged on a side plate of the system board, whereas an air discharge port that discharges the cooling air is arranged on another side plate. The cooling air flows in a direction that is oblique with respect to the side plate. The air intake port is arranged at a position that is offset in the direction in which the cooling air is supplied. Accordingly, cooling is possible by efficiently bringing the cooling air into contact with the DIMMs.

Abstract: A server system includes a rack, a power supply module, a switch, and a plurality of servers. The rack can be divided into a plurality of rack units. The rack units are parallel to each other and vertically arranged. The power supply module and the switch are disposed in close proximity to each other in at least one of the rack units. The power supply is adjacent to the rear side of the rack. The switch is adjacent to the front side of the rack. Each of the servers is disposed in one of the other rack units and electrically connected to the power supply module and the switch.

Abstract: A panel type display device for minimizing temperature increase in the interior of a case and a display panel. The display device includes a case, a display panel mounted in an interior of the case, at least one circuit board for controlling the display panel, a first cooling fluid path for cooling the display panel, and a second cooling fluid path for cooling the circuit board. In the display device, the first and second cooling fluid paths are separated from each other.