Abstract: Disclosed herein are methods, systems, and devices for allowing access for maintenance and servicing of environmental control systems of prefabricated equipment enclosures. In one embodiment, an enclosure includes a first wall, a first environmental control unit, and a first door. The first door is mechanically coupled with the first environmental control unit and the first wall. The first door is configured to have a first closed position allowing in-service operation of the first environmental control unit for an internal space of the enclosure.

Abstract: A rack-mountable heat-exchanger for modular electronic systems is provided that include a heat exchanger including ambient air inlets and outlets forming an ambient airflow path in a first direction, and recirculating air inlets and outlets forming a recirculating airflow path in a second direction perpendicular to the first direction separated from the ambient airflow path; housing for an electronic device, the housing including internal air inlets and outlets forming an internal airflow path; a first duct configured to link the recirculating air outlet to the internal air inlet; a second duct configured to link the recirculating air inlet to the internal air outlet; and fan assemblies located one of the airflow path, configured to propel air through the heat exchanger in the respective airflow path.

Abstract: A mobile device temperature-regulating case is disclosed. Mobile devices, such as tablet computers and smartphones, may be exposed to extreme temperatures, such as extreme cold and extreme heat. Under these extreme temperatures, the mobile devices may not function properly or at all. In that regard, the mobile device temperature-regulating case is configured to at least partially encase a side of the mobile device and conductively cool and/or heat the side of the mobile device. For example, a solid-state heat pump may conductively cool the side of the mobile device, with a fan convectively cooling the solid-state heat pump. In this way, temperature of the mobile device may be kept less than or greater than a predetermined temperature so that the mobile device may function properly.

Abstract: A rack and system for cooling computing devices such as in a data center is disclosed. In one embodiment, the rack supports computing devices and comprises planar annular sector or trapezoidal shelves, each having one or more positions for holding computing devices. The rack may be configured to be connected to other similar racks to form a vertical geometric prism or annular cylinder, which may be tapered, and the computing devices may be installed to discharge exhaust at an angle. A number of vertical supports may hold the shelves in a vertically spaced arrangement to from a helix within the prism or cylinder. An air barrier may be affixed to the rack and have openings permitting exhaust air to flow from the computing devices through the air barrier. The helix formed by the shelves may channel the airflow generated by the computing devices into a vortex to improve cooling.

Abstract: A power supply device includes an outer casing, a fan and a wire. Wherein the outer casing has four sides, wherein two adjacent ones of the four sides intersect, thus forming four corners. A central axis of which being parallel to an extending direction of the outer casing, and the fan being placed in the outer casing to divide the power supply device into a first part and a second part. The fan includes a fan frame having three positioning holes adjacent to any three of the four corners of the outer casing, wherein the fan frame has no positioning hole adjacent to the remaining corner of the four corners of the outer casing which forms a reserved space. The wire is connected to the second part from the first part of the power supply device through the reserved space.

Abstract: The present disclosure provides a cooling casing and a cooling device applied to a vehicle and an in-vehicle server. The cooling device applied to the in-vehicle server includes: a first housing and a second housing, an accommodating cavity is formed between the first housing and the second housing; and a cooling duct, the cooling duct being spirally disposed in the accommodating cavity, two ends of the cooling duct are connected to an external cooling system, and the cooling duct is filled with cooling liquid. The present disclosure is simple in structure and low in costs, and can effectively resolve the heat dissipation problem of the in-vehicle server.

Abstract: A computer chassis can include an airflow channel for permitting airflow specifically to cool one or more power supply units (PSUs) within respective power supply receiving space(s). The chassis can include a baffle device positioned between the power supply receiving space and the airflow channel for directing airflow through the PSU into the airflow channel. The airflow channel can be located between first and second spaces of the chassis, each containing computing components. The baffle device can include a cable passthrough that receives a cable that facilitates communication between component(s) in the first space and component(s) in the second space. The baffle device can include one or more ribs that stop the PSU from being fully inserted into the power supply receiving space when the PSU is inserted in an incorrect orientation, thus signaling to the user to remove the PSU and re-insert it in a correct orientation.

Abstract: A system to improve cooling of rack mounted components may include a first rack mounted component including a first motherboard, the first motherboard having a first edge and a second rack mounted component disposed above the first rack mounted component; the second rack mounted component having a second motherboard having a first edge, wherein the second motherboard is similar to the first motherboard. The second motherboard may be disposed above the first motherboard, and wherein the second motherboard is angled with respect to the first motherboard so that the first edge of the second motherboard is non-aligned with the first edge of the first motherboard. In addition, the first motherboard may be arranged horizontally in a first plane and the second mother board may be arranged horizontally in a second plane that is parallel to the first plane.

Abstract: A chassis includes a receiver frame for receiving a plurality of electronic components. The receiver frame includes a front end, a rear end, a top wall, and a bottom wall. The receiver frame also includes one or more apertures positioned in the bottom wall or the top wall at a location adjacent to the front end. The receiver frame also includes a plurality of air flow channels coupling openings in the front end to the one or more apertures such that air flow from the openings of the front end is first directed towards the rear end across the plurality of electronic components before being directed back towards the front end and then exiting the one or more apertures.

Abstract: An electronic apparatus includes a chassis, a lower cover member constituting the bottom surface of the chassis, and a foot member provided projecting from the surface of the lower cover member. The foot member includes a metal core member having a bar shape and extending along one edge of the lower cover member, and a rubber or resin skin member provided on the surface of the core member.

Abstract: Examples may include racks for a data center and sleds for the racks, the sleds arranged to house physical resources for the data center. The sleds can house physical resources and heat sinks thermally coupled to the physical resources. The physical resources are arranged on the sleds and the heat sinks are configured so as to limit thermal shadowing between physical resources to reduce interference with airflow provided by fans of the racks.

Abstract: A data storage enclosure for storing data on digital storage media has a lid that secures to a base. The enclosure has an upper insulating block that is located adjacent the lid and a lower insulating block that is located in the base. Each insulating block has a corresponding cover that overlays and protects its respective block. A storage unit has outer thermal management layers and a center layer located therebetween. The thermal management layers each contain a corresponding heat absorber that absorbs energy and changes from solid to liquid as the temperature of the storage unit begins to rise to excessive temperatures. The center layer contains a digital storage drive that is connected to a flexible cable that is connected to a sacrificial connector. When assembled, the insulating blocks and covers constrain and hold the storage unit and flexible cable.

Abstract: A data storage enclosure for storing data on digital storage media has a lid that secures to a base. The enclosure has an upper insulating block that is located adjacent the lid and a lower insulating block that is located in the base. Each insulating block has a corresponding cover that overlays and protects its respective block. A storage unit has outer thermal management layers and a center layer located therebetween. The thermal management layers each contain a corresponding heat absorber that absorbs energy and changes from solid to liquid as the temperature of the storage unit begins to rise to excessive temperatures. The center layer contains a digital storage drive that is connected to a flexible cable that is connected to a sacrificial connector. When assembled, the insulating blocks and covers constrain and hold the storage unit and flexible cable.

Abstract: A system, a shelf, and a high density platform optimize the physical arrangement of cards to maximize cooling effectiveness and line card pitch while minimizing backplane trace lengths between line interface and switch fabric cards. The shelf and system and associated card arrangement supports scaling to a larger, double-size system that maintains the required length of backplane traces for card communications without compromising card cooling. Advantageously, the shelf and system maintains full NEBS compliance through an arrangement supporting full air intake/outtake through a front and/or back of the shelf or system, i.e. no side ventilation, and includes a false front to ensure all cards (switch fabric and line interface cards) are substantially flush with one another.

Abstract: An electronic equipment chassis in one embodiment comprises a housing having a front portion and a rear portion, first and second rows of cooling modules disposed at respective upper and lower levels of the front portion, and a plurality of storage devices arranged in the front portion between the first and second rows of cooling modules. At least a subset of the cooling modules and the storage devices are configured so as to be removable from the chassis through a vertical plane of the front portion of the housing.

Abstract: A server includes a shell and at least one server assembly. The shell has a first accommodation space. The server assembly includes a motherboard tray, a motherboard module, a bearing frame and a storage device. The motherboard tray is detachably located in the first accommodation space. The motherboard module is located on the motherboard tray. The motherboard module includes a motherboard and at least one central processing unit which are located on the motherboard. The bearing frame having a loading plate is fastened to the motherboard tray and is located above the motherboard module. The storage device is detachably located on the loading plate.

Abstract: An electronics chassis has many removable boards on sleds that are interconnected by a honeycomb interconnect structure. Interconnect boards in Y-planes and Z-planes are orthogonal to each other and form cells. Cooling air flows through the cells in an X direction, parallel to surfaces of the interconnect boards. The removable boards have connectors that mate with an edge of Z-divider interconnect boards. Fans blow air through the cells in the honeycomb structure unimpeded since no boards are perpendicular to the airflow. Notches in the rear of the Z-divider boards provide airflow equalization allowing closer spacing of fans to the honeycomb structure. A sled carrier honeycomb structure is placed in front of the honeycomb interconnect structure to guide sleds into position. Sled carrier dividers are offset from the Z-divider boards to allow removable boards to align with Z-divider boards in the Z-planes, parallel to airflow.

Abstract: A hardware plane providing improved cooling air flow is disclosed herein. The hardware plane includes one or more minor planes extending from a major plane so that a gap or opening is formed for air flow. A cooling unit moves air through the gap and across the surface of hardware cards connected to the hardware plane in order to cool the hardware plane and the hardware cards. The hardware plane allows for both improved cooling air flow and for space-efficient and cost-efficient positioning of hardware cards, data buses, and control buses.

Abstract: Enclosures and systems that can control airflow and signal connectivity in a blade enclosure are provided. Some examples include a front section including a number of blade server modules, a rear section including a number of switch modules; and a middle section having a number of openings and a number of connectors, wherein the middle section controls airflow between the front section and the rear section in the blade enclosure with the number of openings and the middle section controls signal connectivity between a number of blades in the number of blade server modules and a number of switches in the number of switch modules with the number of connectors.

Abstract: A cooling and noise-reduction apparatus for a computing device disposable within a structure having a central air conditioning system is provided. The computing device includes a heat generating component, an enclosure having first and second inlets, a fan configured to drive coolant from the first inlet to the heat generating component, a vent operably interposed between the second inlet and the heat generating component and a controller coupled to the fan and the vent to respectively control operations thereof. The cooling and noise-reduction apparatus includes a ducting element configured to flexibly and fluidly couple the second inlet with the central air conditioning system.

Abstract: A cooling and noise-reduction apparatus for a computing device disposable within a structure having a central air conditioning system is provided. The computing device includes a heat generating component, an enclosure having first and second inlets, a fan configured to drive coolant from the first inlet to the heat generating component, a vent operably interposed between the second inlet and the heat generating component and a controller coupled to the fan and the vent to respectively control operations thereof. The cooling and noise-reduction apparatus includes a ducting element configured to flexibly and fluidly couple the second inlet with the central air conditioning system.

Abstract: In a computer system, airflow through first and second cooling regions are normally separated by a chassis wall, and are independently controlled by respective first and second fan modules. The internal chassis wall includes a bypass opening that is normally blocked by the second fan module. In response to removal of the second fan module, the bypass opening is unblocked, to fluidly couple the two cooling regions. A redundant fan module is optionally included in fluid communication with the first cooling region, to either generate airflow through the first cooling region in response to failure or removal of the first fan module, or to supplement the airflow capacity of the first fan module in response to removal of the second fan module.

Abstract: An electrical device includes a housing, a motherboard module and a holding assembly. The housing includes a top shell and a bottom shell which are assembled with each other. The top shell has a top wall and a hook fixed to the top wall. The bottom shell has a bottom wall which is opposite to the top wall. The hook is located on an area of the top wall which faces toward the bottom wall. The motherboard module is located on the bottom wall. The motherboard module includes a motherboard and a central processing unit located on the motherboard. The holding assembly is securely located on the motherboard module and hung on the hook for providing an upward pulling force for the motherboard module.

Abstract: The disclosed embodiments related to a component for use in a portable electronic device. The component includes a wall of the portable electronic device, containing an intake zone that includes a set of intake vents directed at a first angle toward one or more heat-generating components of the portable electronic device. The wall also includes an exhaust zone containing a set of exhaust vents directed at a second angle out of the portable electronic device.

Abstract: Techniques for cooling in a data center are provided. In one aspect, a computer equipment rack is provided comprising one or more air inlets; one or more exhaust outlets; and one or more of: an air inlet duct mounted to the computer equipment rack surrounding at least a portion of the air inlets, the air inlet duct having a lateral dimension that approximates a lateral dimension of the computer equipment rack and a length that is less than a length of the computer equipment rack, and an air exhaust duct mounted to the computer equipment rack surrounding at least a portion of the exhaust outlets, the air exhaust duct having a lateral dimension that approximates the lateral dimension of the computer equipment rack and a length that is less than the length of the computer equipment rack.

Abstract: An apparatus with some embodiments is described having ducts positioned above and below a main device housing to provide cooling air flow to at least a portion of the top and bottom surfaces of the associated computing device. In some embodiments, the device is a mobile computing device. In some embodiments, air may be drawn through inlets located on at least one side of the device. The inlet air may be supplied via upper and lower air ducts to an air mover positioned on an opposite side of the device. In some embodiments, air discharged from the air mover may be supplied to a main housing of the device in which heat producing components may be located. Other embodiments are described.

Abstract: A computer system includes a computer case, an enclosure, and a heat dissipating device. The computer case includes a rear plate with a plurality of ventilation holes. The enclosure includes a separating portion to divide the computer case into a first receiving area and a second area. The heat dissipating device includes a first heat sink, a second heat sink, a heat pipe and a fan. The first heat sink is attached to a chip, and the fan communicates with the second heat sink. The first heat sink and the fan are received in the first receiving area, and the second heat sink is received in the second receiving area. The heat pipe extends through the separating portion, and the plurality of ventilation holes, the first heat sink, the fan, the heat pipe, and the second heat sink together defines an air path for air flowing through.

Abstract: An approach is provided in which a cooling manager detects a failed fan included in an electronic enclosure. The electronic enclosure includes multiple fans that each cool different component areas in the electronic enclosure. The cooling manager selects an airflow compensator that corresponds to a functioning fan included in the electronic enclosure, which includes a fixed perforated member and a movable perforated member. In turn, the cooling manager adjusts the selected airflow compensator to redirect a portion of airflow generated by the functioning fan to the component area corresponding to the failed fan.

Abstract: A multi-floor data center, comprising in one implementation, a plurality of floors; a first set of server racks disposed about a first vertical center axis on each floor, the first set of server racks formed in a substantially closed shape, with a substantially vertical open center comprising a first airflow plenum at least for air flow; a first opening in each of the floors, with the first opening aligned with the substantially vertical first airflow plenum on it respective floor, wherein the substantially vertical first airflow plenums on the floors are aligned for communication through the first openings in the floors; outer wall; a roof with a roof opening therein.

Abstract: An electronic device comprises a casing, an electronic element, and an ejection mechanism. The casing has a receiving space and an opening. The ejection mechanism includes: a holder for holding and carrying the electronic element to pass through the opening to be exposed outside the casing; a first biasing spring biasing the holder to project outwardly from the opening; a stopping member rotatably pivoted to the casing and contactable with a projection of the holder; a second biasing spring biasing the stopping member to contact the projection, and having an elastic modulus greater than that of the first biasing spring; and a releasing member operable for driving the stopping member to detach from the projection.

Abstract: A notebook computer 1 is provided with: a casing in which a CPU is accommodated; a heat-dissipating component 37 having a plurality of fins; and a fan 31, and operates such that heat transferred from the CPU to the heat-dissipating component 37 is heat-exchanged with air supplied from the fan 31, and released to the exterior of the casing. The heat-dissipating component 37 is disposed at an air outlet 32b of the fan 31. An opening 35 is formed, between the air outlet 32b and a fan main unit 33, in a fan case 32. First shutter means 39 is provided on a discharge outlet surface of the heat-dissipating component 37. With this structure, increase in cost and weight can be restrained, and dust on the heat-dissipating component can be removed with a simplified structure.

Abstract: A chassis for a network storage system contains a first thermal chamber that houses conventional electronic components and a second thermal chamber that houses non-volatile solid state memory such as flash memory. A cooling system keeps the electronics in first thermal chamber below their maximum junction temperature. Meanwhile, a temperature regulating system maintains the solid state memory in the second thermal chamber within a range of a preferred operating temperature selected to extend the lifetime and/or improve the reliability of the solid state memory. Thus, the chassis provides dual zone temperature control to improve performance of the network storage system.

Abstract: A heat dissipation device is mounted in a chassis of an information handling apparatus. The heat dissipation device includes a box and a cooling member, a first heat sink, a second heat sink, and a fan received in the box. A partitioning plate mounted inside the box. The box includes defines two air passage arranged at opposite sides of the partitioning plate. The cooling member is fixed to the partitioning plate. The first and second heat sinks are respectively received in the first and second air passages, and respectively abut cold and hot sides of the cooling member. The fan drives air to flow into the box through the first air passage to be cooled by the first heat sink. At the same time, the fan drives air to flow into the box through the second air passage to absorb heat from the second heat sink.

Abstract: A modular datacenter having multiple levels. The levels are stackable, and the number of levels can be selected based upon a desired installation. The datacenter includes walls or other structures that define ducts that extend through all the levels. The ducts can be used as hot and cold aisles for servers and networking equipment. The ducts can be formed by concentric cylinders.

Abstract: A cooling system comprises an electronics module and a duct. The electronics module produces more heat at a first location than at a second location, and is rated to a safe operating temperature. The duct surrounds the electronics module, and has a shaped baffle with a constricted region near the first location and an open region near the second location. The expanded region has greater cross-sectional flow area than the constricted region. Airflow through the duct cools both the first location and the second location to within an efficiency margin below the safe operating temperature.

Abstract: A server includes a rack, at least one server unit, at least one communication exchange unit, at least one rack control unit and an electric power transmission unit. The rack has a plurality of shelving spaces. The server unit, the communication exchange unit, and the rack control unit are moved into or moved out of a corresponding shelving space along a horizontal axis, respectively. The server unit is communicatively connected to the communication exchange unit, and communicates with the rack control unit through the communication exchange unit. The electric power transmission unit is disposed in the rack and runs adjacent to the shelving spaces along a vertical axis. After the server unit, the communication exchange unit and the rack control unit are moved into corresponding shelving spaces, the server unit, the communication exchange unit and the rack control unit are electrically connected to the electric power transmission unit.

Abstract: A system of computing assets arranges a plurality of backplanes to form a perimeter of a central region of a backplane structure. A plurality of computing assets are coupled to the backplanes and extend away from the central region of the backplane structure. A plurality of air intake openings are located along the perimeter of the backplane structure. An exhaust duct is coupled to an exhaust opening of the backplane structure and configured to direct air away from the backplane structure and is coupled to an air moving device. When the air moving device is operational, air flows across the computing assets through the air intake openings towards the central region of the backplane structure and into the exhaust duct, which directs the air away from the backplane structure.

Abstract: First and second units are mounted on a rear side of a housing of a storage system. Either of the first and second units includes a fan. The rear side of the housing includes an upper-tier portion defining an upper-tier opening, and a lower-tier portion defining a lower-tier opening, and the housing further includes a boundary portion that is a boundary between the upper-tier portion and the lower-tier portion, and a shutter unit. The boundary portion includes a first through hole that is a through hole connecting an upper-tier passage and a lower-tier passage. When the fan is operating, if the first unit is removed from the upper-tier portion, the shutter unit blocks the upper-tier passage, and if the second unit is removed from the lower-tier portion, the shutter unit blocks the lower-tier passage.

Abstract: A storage apparatus S comprises a disk controller for controlling data I/O processing between a host H and a disk unit. The disk controller includes a plurality of circuit board modules each having a circuit board and a module case storing the same, and a chassis shaped like a hollow cylinder having a front side opening and a rear side opening and configured to store the circuit board modules from the front and rear side openings. A CM module is configured to introduce cooling air from a cooling fan through an opening provided on at least one side surface toward a circuit component mounted on the circuit board. A MP module is configured to introduce cooling air by a cooling fan through an opening provide on a front surface of the module case.

Abstract: A computer chassis cooling sidecar for cooling one or more computers in a chassis of computers in a data center, the sidecar including an air intake chamber and a chassis delivery chamber, the air intake chamber having a first opening at a bottom end for receiving air from beneath the data center through perforated tiles in the floor of the data center located on the side of the computer chassis, the air intake chamber having at the top end a directional vane shaped to direct airflow from the side of the chassis to a chassis delivery chamber; wherein the chassis delivery chamber resides in front or back of the chassis and has an opening to receive air from the air intake chamber and an opening to deliver the received air to the front or back of the computer chassis.

Abstract: A computer cart has removable electrical connector management system which may be removed from the computer cart to install portable electronic device electrical transformers, and then reinserted into the computer cart to enable multiple electrical transformers to be installed into the cart as a group. An electrical charging system uses a staggered round robin approach to control distribution of power within the computer cart without requiring the amount of power used from each power strip to be individually monitored.

Abstract: Apparatuses, methods, and systems directed to efficient cooling of data centers. Some embodiments of the invention allow encapsulation of cold rows through an enclosure and allow one or more fans to draw cold air from the cold row encapsulation structure to cool servers installed on the server racks. In other particular embodiments, the systems disclosed can be used to mix outside cool air into the cold row encapsulation structure to cool the servers. In some embodiments, the present invention involves fanless servers installed on the server racks and introduces fan units to draw cooling air from the cold row encapsulation structure through the fanless servers on the racks.

Abstract: A converter arrangement includes a housing having a first cooling air channel, at least one capacitor disposed in the housing, a fan for generating a cooling air flow, and a first power electronics module disposed in the housing between the at least one capacitor and the fan, as viewed in a direction of the cooling air flow. The first power electronics module is positioned in relation to the fan so as to only be cooled by a first partial air flow. A second partial air flow provided for cooling the at least one capacitor is routed via the first cooling air channel past the first power electronics module such that the second partial air flow is thermally separated from the first power electronics module.

Abstract: A first conduit is externally attached to one of two opposing sidewalls of electronic equipment and a second conduit is externally attached to the other of the opposing sidewalls. Each conduit has an open end, a closed end, and a side having a vent that is aligned with a vent in the sidewall of the electronic equipment to which that conduit is attached. The first conduit takes air in through its open end, channels the air in a direction substantially orthogonal to the direction of air flowing through the electronic equipment, and directs the air into the electronic equipment through its aligned vents. The second conduit receives air from the electronic equipment through its aligned vents, channels the air in a direction that is substantially orthogonal to the direction of air flowing through the electronic equipment, and exhausts the air through the open end of the second conduit.

Abstract: A heat dissipation system includes a computer case having a base plate and a back plate perpendicularly to the base plate, a motherboard on the base plate adjacent to the back plate, and a mass storage device beside the motherboard. The motherboard has a heat sink and a first fan on the heat sink. The base plate has a second fan beside the motherboard. The second fan is adjacent to the back plate. The mass storage device is away from the back plate. The first fan rotates in such a manner that airflow is drawn into the computer case, flows through the heat sink and is exhausted out of the computer case. The second fan rotates in such a manner that airflow is drawn into the computer case, flows through the mass storage device and is exhausted out of the computer case.

Abstract: A system of computing assets arranges a plurality of backplanes to form a perimeter of a central region of a backplane structure. A plurality of computing assets are coupled to the backplanes and extend away from the central region of the backplane structure. A plurality of air intake openings are located along the perimeter of the backplane structure. An exhaust duct is coupled to an exhaust opening of the backplane structure and configured to direct air away from the backplane structure and is coupled to an air moving device. When the air moving device is operational, air flows across the computing assets through the air intake openings towards the central region of the backplane structure and into the exhaust duct, which directs the air away from the backplane structure.

Abstract: The methods and apparatuses described herein is a data center. In one embodiment is described a data center comprising: a building having a plurality of rooms and first and second exterior load walls disposed on opposite sides of the building; a plurality of air handler and fluid cooler devices disposed exterior to the building along the first exterior load wall; a plurality of condenser unit devices disposed exterior to the building along the second exterior load wall; a data sector disposed inside the building, adjacent to the first exterior load wall; three separate UPS and substation distribution equipment rooms, each containing UPS and substation distribution equipment therein, as well as air conditioning equipment that is connected to certain of the plurality of condenser unit devices; and a power spine room disposed between the three separate UPS and substation distribution equipment rooms and the data sector, the power spine room including a plurality of PDU devices.

Abstract: Examples disclose a removable air guide assembly with a processor air cooler to direct air over a processor on a circuit board, the processor air cooler is not directly aligned over the processor. Further, the examples provide the removable airflow guide assembly with memory bank coolers to direct air over memory banks also positioned on the circuit board. Additionally, the examples also disclose the removable airflow guide assembly with a connector socket to align with the circuit board and provide power to the processor air cooler and the memory bank coolers.

Abstract: The present disclosure discloses a cooling system and an electronic device. The cooling system is configured to cool a circuit board assembly in an orthogonal architecture, where the circuit board assembly is arranged inside a cabinet. The cooling system includes: a first cooling air duct that allows air to flow from the front area of the cabinet corresponding to the region of the circuit board assembly into the cabinet and flow through the front portion of the circuit board assembly, then be distributed into two lateral sides of the circuit board assembly, and be discharged out of the cabinet; and a second cooling air duct that allows air to flow from the front area of the cabinet corresponding to one end of the circuit board assembly into the cabinet and through the rear portion of the circuit board assembly, and then be discharged out of the cabinet.

Abstract: A computer system includes a rack-mountable server unit with a closed server housing. The server housing has a channel with a recessed channel wall in conductive thermal communication with a processor or other heat-generating component. An elongate conduit is received into the channel of the server housing in conductive thermal communication with an external surface of the server housing. The server is cooled by conductive fluid flow through the conduit, with no appreciable airflow through the server housing. The system may be operated in an optional burst cooling mode, wherein a volume of cooling fluid is trapped in the conduit for a period of time before being quickly released.