Plurality Of Air Streams Patents (Class 361/679.5)
  • Patent number: 10509445
    Abstract: A data storage enclosure for storing data on digital storage media has a lid that secures to a base. The enclosure has an upper insulating block that is located adjacent the lid and a lower insulating block that is located in the base. Each insulating block has a corresponding cover that overlays and protects its respective block. A storage unit has outer thermal management layers and a center layer located therebetween. The thermal management layers each contain a corresponding heat absorber that absorbs energy and changes from solid to liquid as the temperature of the storage unit begins to rise to excessive temperatures. The center layer contains a digital storage drive that is connected to a flexible cable that is connected to a sacrificial connector. When assembled, the insulating blocks and covers constrain and hold the storage unit and flexible cable.
    Type: Grant
    Filed: October 22, 2018
    Date of Patent: December 17, 2019
    Inventor: Patrick Scott Heller
  • Patent number: 10185372
    Abstract: A data storage enclosure for storing data on digital storage media has a lid that secures to a base. The enclosure has an upper insulating block that is located adjacent the lid and a lower insulating block that is located in the base. Each insulating block has a corresponding cover that overlays and protects its respective block. A storage unit has outer thermal management layers and a center layer located therebetween. The thermal management layers each contain a corresponding heat absorber that absorbs energy and changes from solid to liquid as the temperature of the storage unit begins to rise to excessive temperatures. The center layer contains a digital storage drive that is connected to a flexible cable that is connected to a sacrificial connector. When assembled, the insulating blocks and covers constrain and hold the storage unit and flexible cable.
    Type: Grant
    Filed: March 1, 2018
    Date of Patent: January 22, 2019
    Inventor: Patrick Scott Heller
  • Patent number: 9769959
    Abstract: A system, a shelf, and a high density platform optimize the physical arrangement of cards to maximize cooling effectiveness and line card pitch while minimizing backplane trace lengths between line interface and switch fabric cards. The shelf and system and associated card arrangement supports scaling to a larger, double-size system that maintains the required length of backplane traces for card communications without compromising card cooling. Advantageously, the shelf and system maintains full NEBS compliance through an arrangement supporting full air intake/outtake through a front and/or back of the shelf or system, i.e. no side ventilation, and includes a false front to ensure all cards (switch fabric and line interface cards) are substantially flush with one another.
    Type: Grant
    Filed: October 28, 2015
    Date of Patent: September 19, 2017
    Assignee: Ciena Corporation
    Inventors: Anthony J. Mayenburg, Simon J. E. Shearman, Michael Bishop, Michael Tabatchnik, Lloyd Cosman
  • Patent number: 9706687
    Abstract: An electronic equipment chassis in one embodiment comprises a housing having a front portion and a rear portion, first and second rows of cooling modules disposed at respective upper and lower levels of the front portion, and a plurality of storage devices arranged in the front portion between the first and second rows of cooling modules. At least a subset of the cooling modules and the storage devices are configured so as to be removable from the chassis through a vertical plane of the front portion of the housing.
    Type: Grant
    Filed: June 30, 2014
    Date of Patent: July 11, 2017
    Assignee: EMC IP Holding Company LLC
    Inventors: Ralph C. Frangioso, Jr., Robert Wierzbicki
  • Patent number: 9179572
    Abstract: A server includes a shell and at least one server assembly. The shell has a first accommodation space. The server assembly includes a motherboard tray, a motherboard module, a bearing frame and a storage device. The motherboard tray is detachably located in the first accommodation space. The motherboard module is located on the motherboard tray. The motherboard module includes a motherboard and at least one central processing unit which are located on the motherboard. The bearing frame having a loading plate is fastened to the motherboard tray and is located above the motherboard module. The storage device is detachably located on the loading plate.
    Type: Grant
    Filed: September 17, 2013
    Date of Patent: November 3, 2015
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Ming-Gang Li, Ji-Peng Xu
  • Patent number: 9148975
    Abstract: An electronics chassis has many removable boards on sleds that are interconnected by a honeycomb interconnect structure. Interconnect boards in Y-planes and Z-planes are orthogonal to each other and form cells. Cooling air flows through the cells in an X direction, parallel to surfaces of the interconnect boards. The removable boards have connectors that mate with an edge of Z-divider interconnect boards. Fans blow air through the cells in the honeycomb structure unimpeded since no boards are perpendicular to the airflow. Notches in the rear of the Z-divider boards provide airflow equalization allowing closer spacing of fans to the honeycomb structure. A sled carrier honeycomb structure is placed in front of the honeycomb interconnect structure to guide sleds into position. Sled carrier dividers are offset from the Z-divider boards to allow removable boards to align with Z-divider boards in the Z-planes, parallel to airflow.
    Type: Grant
    Filed: June 22, 2012
    Date of Patent: September 29, 2015
    Assignee: Advanced Micro Devices, Inc.
    Inventor: Jean-Philippe Fricker
  • Patent number: 9078375
    Abstract: A hardware plane providing improved cooling air flow is disclosed herein. The hardware plane includes one or more minor planes extending from a major plane so that a gap or opening is formed for air flow. A cooling unit moves air through the gap and across the surface of hardware cards connected to the hardware plane in order to cool the hardware plane and the hardware cards. The hardware plane allows for both improved cooling air flow and for space-efficient and cost-efficient positioning of hardware cards, data buses, and control buses.
    Type: Grant
    Filed: June 25, 2012
    Date of Patent: July 7, 2015
    Assignee: Google Inc.
    Inventors: Roy Michael Bannon, Scott McCauley
  • Publication number: 20150098173
    Abstract: Enclosures and systems that can control airflow and signal connectivity in a blade enclosure are provided. Some examples include a front section including a number of blade server modules, a rear section including a number of switch modules; and a middle section having a number of openings and a number of connectors, wherein the middle section controls airflow between the front section and the rear section in the blade enclosure with the number of openings and the middle section controls signal connectivity between a number of blades in the number of blade server modules and a number of switches in the number of switch modules with the number of connectors.
    Type: Application
    Filed: April 27, 2012
    Publication date: April 9, 2015
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Kevin B. Leigh, David W. Sherrod, George D. Megason
  • Patent number: 8995123
    Abstract: A cooling and noise-reduction apparatus for a computing device disposable within a structure having a central air conditioning system is provided. The computing device includes a heat generating component, an enclosure having first and second inlets, a fan configured to drive coolant from the first inlet to the heat generating component, a vent operably interposed between the second inlet and the heat generating component and a controller coupled to the fan and the vent to respectively control operations thereof. The cooling and noise-reduction apparatus includes a ducting element configured to flexibly and fluidly couple the second inlet with the central air conditioning system.
    Type: Grant
    Filed: November 7, 2013
    Date of Patent: March 31, 2015
    Assignee: International Business Machines Corporation
    Inventors: Andreas Marten, Martin R. Naish, Brian Stewart, Sam Rogers, Paul Thorpe
  • Patent number: 8988874
    Abstract: A cooling and noise-reduction apparatus for a computing device disposable within a structure having a central air conditioning system is provided. The computing device includes a heat generating component, an enclosure having first and second inlets, a fan configured to drive coolant from the first inlet to the heat generating component, a vent operably interposed between the second inlet and the heat generating component and a controller coupled to the fan and the vent to respectively control operations thereof. The cooling and noise-reduction apparatus includes a ducting element configured to flexibly and fluidly couple the second inlet with the central air conditioning system.
    Type: Grant
    Filed: November 7, 2013
    Date of Patent: March 24, 2015
    Assignee: International Business Machines Corporation
    Inventors: Andreas Marten, Martin R. Naish, Brian Stewart, Sam Rogers, Paul Thorpe
  • Patent number: 8988877
    Abstract: In a computer system, airflow through first and second cooling regions are normally separated by a chassis wall, and are independently controlled by respective first and second fan modules. The internal chassis wall includes a bypass opening that is normally blocked by the second fan module. In response to removal of the second fan module, the bypass opening is unblocked, to fluidly couple the two cooling regions. A redundant fan module is optionally included in fluid communication with the first cooling region, to either generate airflow through the first cooling region in response to failure or removal of the first fan module, or to supplement the airflow capacity of the first fan module in response to removal of the second fan module.
    Type: Grant
    Filed: December 22, 2011
    Date of Patent: March 24, 2015
    Assignee: Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
    Inventors: Kevin M. Cash, David J. Jensen, Jared E. Schott, Brian A. Trumbo
  • Publication number: 20150055283
    Abstract: An electrical device includes a housing, a motherboard module and a holding assembly. The housing includes a top shell and a bottom shell which are assembled with each other. The top shell has a top wall and a hook fixed to the top wall. The bottom shell has a bottom wall which is opposite to the top wall. The hook is located on an area of the top wall which faces toward the bottom wall. The motherboard module is located on the bottom wall. The motherboard module includes a motherboard and a central processing unit located on the motherboard. The holding assembly is securely located on the motherboard module and hung on the hook for providing an upward pulling force for the motherboard module.
    Type: Application
    Filed: November 12, 2013
    Publication date: February 26, 2015
    Applicants: Inventec Corporation, Inventec (Pudong) Technology Corporation
    Inventors: Jin ZHANG, JianXin ZHOU
  • Patent number: 8964375
    Abstract: Techniques for cooling in a data center are provided. In one aspect, a computer equipment rack is provided comprising one or more air inlets; one or more exhaust outlets; and one or more of: an air inlet duct mounted to the computer equipment rack surrounding at least a portion of the air inlets, the air inlet duct having a lateral dimension that approximates a lateral dimension of the computer equipment rack and a length that is less than a length of the computer equipment rack, and an air exhaust duct mounted to the computer equipment rack surrounding at least a portion of the exhaust outlets, the air exhaust duct having a lateral dimension that approximates the lateral dimension of the computer equipment rack and a length that is less than the length of the computer equipment rack.
    Type: Grant
    Filed: November 4, 2013
    Date of Patent: February 24, 2015
    Assignee: International Business Machines Corporation
    Inventors: Alan Claassen, Hendrik F. Hamann, Madhusudan K. Iyengar, James A. Lacey, Yves C. Martin, Roger R. Schmidt, Theodore G. van Kessel
  • Patent number: 8964383
    Abstract: The disclosed embodiments related to a component for use in a portable electronic device. The component includes a wall of the portable electronic device, containing an intake zone that includes a set of intake vents directed at a first angle toward one or more heat-generating components of the portable electronic device. The wall also includes an exhaust zone containing a set of exhaust vents directed at a second angle out of the portable electronic device.
    Type: Grant
    Filed: September 26, 2012
    Date of Patent: February 24, 2015
    Assignee: Apple Inc.
    Inventors: Brett W. Degner, Bartley K. Andre, Jeremy D. Bataillou, Jay S. Nigen, Christiaan A. Ligtenberg, Ron A. Hopkinson, Charles A. Schwalbach, Matthew P. Casebolt, Nicholas A. Rundle, Frank F. Liang
  • Patent number: 8953313
    Abstract: An apparatus with some embodiments is described having ducts positioned above and below a main device housing to provide cooling air flow to at least a portion of the top and bottom surfaces of the associated computing device. In some embodiments, the device is a mobile computing device. In some embodiments, air may be drawn through inlets located on at least one side of the device. The inlet air may be supplied via upper and lower air ducts to an air mover positioned on an opposite side of the device. In some embodiments, air discharged from the air mover may be supplied to a main housing of the device in which heat producing components may be located. Other embodiments are described.
    Type: Grant
    Filed: September 24, 2010
    Date of Patent: February 10, 2015
    Assignee: Intel Corporation
    Inventor: Mark MacDonald
  • Patent number: 8941986
    Abstract: A computer system includes a computer case, an enclosure, and a heat dissipating device. The computer case includes a rear plate with a plurality of ventilation holes. The enclosure includes a separating portion to divide the computer case into a first receiving area and a second area. The heat dissipating device includes a first heat sink, a second heat sink, a heat pipe and a fan. The first heat sink is attached to a chip, and the fan communicates with the second heat sink. The first heat sink and the fan are received in the first receiving area, and the second heat sink is received in the second receiving area. The heat pipe extends through the separating portion, and the plurality of ventilation holes, the first heat sink, the fan, the heat pipe, and the second heat sink together defines an air path for air flowing through.
    Type: Grant
    Filed: April 11, 2012
    Date of Patent: January 27, 2015
    Assignee: ScienBizIP Consulting (Shenzhen) Co., Ltd.
    Inventor: Yang Li
  • Patent number: 8936443
    Abstract: An approach is provided in which a cooling manager detects a failed fan included in an electronic enclosure. The electronic enclosure includes multiple fans that each cool different component areas in the electronic enclosure. The cooling manager selects an airflow compensator that corresponds to a functioning fan included in the electronic enclosure, which includes a fixed perforated member and a movable perforated member. In turn, the cooling manager adjusts the selected airflow compensator to redirect a portion of airflow generated by the functioning fan to the component area corresponding to the failed fan.
    Type: Grant
    Filed: July 31, 2012
    Date of Patent: January 20, 2015
    Assignee: International Business Machines Corporation
    Inventors: Benjamin William Mashak, Arden Lot Moore, Katie L. Pizzolato
  • Patent number: 8931221
    Abstract: A multi-floor data center, comprising in one implementation, a plurality of floors; a first set of server racks disposed about a first vertical center axis on each floor, the first set of server racks formed in a substantially closed shape, with a substantially vertical open center comprising a first airflow plenum at least for air flow; a first opening in each of the floors, with the first opening aligned with the substantially vertical first airflow plenum on it respective floor, wherein the substantially vertical first airflow plenums on the floors are aligned for communication through the first openings in the floors; outer wall; a roof with a roof opening therein.
    Type: Grant
    Filed: November 21, 2012
    Date of Patent: January 13, 2015
    Assignee: Google Inc.
    Inventors: Ankit Somani, Christopher Gregory Malone
  • Patent number: 8934243
    Abstract: A notebook computer 1 is provided with: a casing in which a CPU is accommodated; a heat-dissipating component 37 having a plurality of fins; and a fan 31, and operates such that heat transferred from the CPU to the heat-dissipating component 37 is heat-exchanged with air supplied from the fan 31, and released to the exterior of the casing. The heat-dissipating component 37 is disposed at an air outlet 32b of the fan 31. An opening 35 is formed, between the air outlet 32b and a fan main unit 33, in a fan case 32. First shutter means 39 is provided on a discharge outlet surface of the heat-dissipating component 37. With this structure, increase in cost and weight can be restrained, and dust on the heat-dissipating component can be removed with a simplified structure.
    Type: Grant
    Filed: July 24, 2012
    Date of Patent: January 13, 2015
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Naoyuki Ito, Kazuhiro Shiraga, Shinji Goto
  • Patent number: 8934233
    Abstract: An electronic device comprises a casing, an electronic element, and an ejection mechanism. The casing has a receiving space and an opening. The ejection mechanism includes: a holder for holding and carrying the electronic element to pass through the opening to be exposed outside the casing; a first biasing spring biasing the holder to project outwardly from the opening; a stopping member rotatably pivoted to the casing and contactable with a projection of the holder; a second biasing spring biasing the stopping member to contact the projection, and having an elastic modulus greater than that of the first biasing spring; and a releasing member operable for driving the stopping member to detach from the projection.
    Type: Grant
    Filed: June 6, 2012
    Date of Patent: January 13, 2015
    Assignee: Wistron Corporation
    Inventor: Chien-Jung Liao
  • Patent number: 8929066
    Abstract: A chassis for a network storage system contains a first thermal chamber that houses conventional electronic components and a second thermal chamber that houses non-volatile solid state memory such as flash memory. A cooling system keeps the electronics in first thermal chamber below their maximum junction temperature. Meanwhile, a temperature regulating system maintains the solid state memory in the second thermal chamber within a range of a preferred operating temperature selected to extend the lifetime and/or improve the reliability of the solid state memory. Thus, the chassis provides dual zone temperature control to improve performance of the network storage system.
    Type: Grant
    Filed: August 28, 2012
    Date of Patent: January 6, 2015
    Assignee: Skyera, Inc.
    Inventors: Pinchas Herman, Radoslav Danilak
  • Patent number: 8917503
    Abstract: A heat dissipation device is mounted in a chassis of an information handling apparatus. The heat dissipation device includes a box and a cooling member, a first heat sink, a second heat sink, and a fan received in the box. A partitioning plate mounted inside the box. The box includes defines two air passage arranged at opposite sides of the partitioning plate. The cooling member is fixed to the partitioning plate. The first and second heat sinks are respectively received in the first and second air passages, and respectively abut cold and hot sides of the cooling member. The fan drives air to flow into the box through the first air passage to be cooled by the first heat sink. At the same time, the fan drives air to flow into the box through the second air passage to absorb heat from the second heat sink.
    Type: Grant
    Filed: November 8, 2012
    Date of Patent: December 23, 2014
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Qiang Chen
  • Patent number: 8917502
    Abstract: A modular datacenter having multiple levels. The levels are stackable, and the number of levels can be selected based upon a desired installation. The datacenter includes walls or other structures that define ducts that extend through all the levels. The ducts can be used as hot and cold aisles for servers and networking equipment. The ducts can be formed by concentric cylinders.
    Type: Grant
    Filed: August 29, 2012
    Date of Patent: December 23, 2014
    Assignee: Amazon Technologies, Inc.
    Inventor: Brock R. Gardner
  • Patent number: 8913382
    Abstract: A server includes a rack, at least one server unit, at least one communication exchange unit, at least one rack control unit and an electric power transmission unit. The rack has a plurality of shelving spaces. The server unit, the communication exchange unit, and the rack control unit are moved into or moved out of a corresponding shelving space along a horizontal axis, respectively. The server unit is communicatively connected to the communication exchange unit, and communicates with the rack control unit through the communication exchange unit. The electric power transmission unit is disposed in the rack and runs adjacent to the shelving spaces along a vertical axis. After the server unit, the communication exchange unit and the rack control unit are moved into corresponding shelving spaces, the server unit, the communication exchange unit and the rack control unit are electrically connected to the electric power transmission unit.
    Type: Grant
    Filed: February 22, 2012
    Date of Patent: December 16, 2014
    Assignee: Inventec Corporation
    Inventor: Shi-Feng Wang
  • Patent number: 8913385
    Abstract: A cooling system comprises an electronics module and a duct. The electronics module produces more heat at a first location than at a second location, and is rated to a safe operating temperature. The duct surrounds the electronics module, and has a shaped baffle with a constricted region near the first location and an open region near the second location. The expanded region has greater cross-sectional flow area than the constricted region. Airflow through the duct cools both the first location and the second location to within an efficiency margin below the safe operating temperature.
    Type: Grant
    Filed: October 8, 2012
    Date of Patent: December 16, 2014
    Assignee: Hamilton Sundstrand Corporation
    Inventor: Robert Scott Downing
  • Publication number: 20140355185
    Abstract: A system of computing assets arranges a plurality of backplanes to form a perimeter of a central region of a backplane structure. A plurality of computing assets are coupled to the backplanes and extend away from the central region of the backplane structure. A plurality of air intake openings are located along the perimeter of the backplane structure. An exhaust duct is coupled to an exhaust opening of the backplane structure and configured to direct air away from the backplane structure and is coupled to an air moving device. When the air moving device is operational, air flows across the computing assets through the air intake openings towards the central region of the backplane structure and into the exhaust duct, which directs the air away from the backplane structure.
    Type: Application
    Filed: August 20, 2014
    Publication date: December 4, 2014
    Inventor: Jon Brian Ehlen
  • Patent number: 8897006
    Abstract: First and second units are mounted on a rear side of a housing of a storage system. Either of the first and second units includes a fan. The rear side of the housing includes an upper-tier portion defining an upper-tier opening, and a lower-tier portion defining a lower-tier opening, and the housing further includes a boundary portion that is a boundary between the upper-tier portion and the lower-tier portion, and a shutter unit. The boundary portion includes a first through hole that is a through hole connecting an upper-tier passage and a lower-tier passage. When the fan is operating, if the first unit is removed from the upper-tier portion, the shutter unit blocks the upper-tier passage, and if the second unit is removed from the lower-tier portion, the shutter unit blocks the lower-tier passage.
    Type: Grant
    Filed: March 23, 2012
    Date of Patent: November 25, 2014
    Assignee: Hitachi, Ltd.
    Inventors: Takuji Ito, Akihiro Inamura, Tsuyoshi Sasagawa
  • Patent number: 8879248
    Abstract: A storage apparatus S comprises a disk controller for controlling data I/O processing between a host H and a disk unit. The disk controller includes a plurality of circuit board modules each having a circuit board and a module case storing the same, and a chassis shaped like a hollow cylinder having a front side opening and a rear side opening and configured to store the circuit board modules from the front and rear side openings. A CM module is configured to introduce cooling air from a cooling fan through an opening provided on at least one side surface toward a circuit component mounted on the circuit board. A MP module is configured to introduce cooling air by a cooling fan through an opening provide on a front surface of the module case.
    Type: Grant
    Filed: July 20, 2012
    Date of Patent: November 4, 2014
    Assignee: Hitachi, Ltd.
    Inventors: Shigeaki Tanaka, Kentaro Abe
  • Patent number: 8879247
    Abstract: A computer chassis cooling sidecar for cooling one or more computers in a chassis of computers in a data center, the sidecar including an air intake chamber and a chassis delivery chamber, the air intake chamber having a first opening at a bottom end for receiving air from beneath the data center through perforated tiles in the floor of the data center located on the side of the computer chassis, the air intake chamber having at the top end a directional vane shaped to direct airflow from the side of the chassis to a chassis delivery chamber; wherein the chassis delivery chamber resides in front or back of the chassis and has an opening to receive air from the air intake chamber and an opening to deliver the received air to the front or back of the computer chassis.
    Type: Grant
    Filed: April 13, 2012
    Date of Patent: November 4, 2014
    Assignee: International Business Machines Corporation
    Inventors: Matthew R. Archibald, Jerrod K. Buterbaugh
  • Patent number: 8870195
    Abstract: A computer cart has removable electrical connector management system which may be removed from the computer cart to install portable electronic device electrical transformers, and then reinserted into the computer cart to enable multiple electrical transformers to be installed into the cart as a group. An electrical charging system uses a staggered round robin approach to control distribution of power within the computer cart without requiring the amount of power used from each power strip to be individually monitored.
    Type: Grant
    Filed: February 24, 2014
    Date of Patent: October 28, 2014
    Assignee: Bretford Manufacturing, Inc.
    Inventors: Jack Guasta, Morad Ghassemian
  • Publication number: 20140301027
    Abstract: Apparatuses, methods, and systems directed to efficient cooling of data centers. Some embodiments of the invention allow encapsulation of cold rows through an enclosure and allow one or more fans to draw cold air from the cold row encapsulation structure to cool servers installed on the server racks. In other particular embodiments, the systems disclosed can be used to mix outside cool air into the cold row encapsulation structure to cool the servers. In some embodiments, the present invention involves fanless servers installed on the server racks and introduces fan units to draw cooling air from the cold row encapsulation structure through the fanless servers on the racks.
    Type: Application
    Filed: May 27, 2014
    Publication date: October 9, 2014
    Applicant: Yahool Inc.
    Inventors: Scott Noteboom, Albert Dell Robison
  • Patent number: 8854815
    Abstract: A first conduit is externally attached to one of two opposing sidewalls of electronic equipment and a second conduit is externally attached to the other of the opposing sidewalls. Each conduit has an open end, a closed end, and a side having a vent that is aligned with a vent in the sidewall of the electronic equipment to which that conduit is attached. The first conduit takes air in through its open end, channels the air in a direction substantially orthogonal to the direction of air flowing through the electronic equipment, and directs the air into the electronic equipment through its aligned vents. The second conduit receives air from the electronic equipment through its aligned vents, channels the air in a direction that is substantially orthogonal to the direction of air flowing through the electronic equipment, and exhausts the air through the open end of the second conduit.
    Type: Grant
    Filed: February 28, 2012
    Date of Patent: October 7, 2014
    Assignee: International Business Machines Corporation
    Inventor: Atul Tambe
  • Patent number: 8854807
    Abstract: A converter arrangement includes a housing having a first cooling air channel, at least one capacitor disposed in the housing, a fan for generating a cooling air flow, and a first power electronics module disposed in the housing between the at least one capacitor and the fan, as viewed in a direction of the cooling air flow. The first power electronics module is positioned in relation to the fan so as to only be cooled by a first partial air flow. A second partial air flow provided for cooling the at least one capacitor is routed via the first cooling air channel past the first power electronics module such that the second partial air flow is thermally separated from the first power electronics module.
    Type: Grant
    Filed: August 1, 2012
    Date of Patent: October 7, 2014
    Assignee: Siemens Aktiengesellschaft
    Inventors: Ingolf Hoffmann, Wolfgang Lottes
  • Patent number: 8848363
    Abstract: A heat dissipation system includes a computer case having a base plate and a back plate perpendicularly to the base plate, a motherboard on the base plate adjacent to the back plate, and a mass storage device beside the motherboard. The motherboard has a heat sink and a first fan on the heat sink. The base plate has a second fan beside the motherboard. The second fan is adjacent to the back plate. The mass storage device is away from the back plate. The first fan rotates in such a manner that airflow is drawn into the computer case, flows through the heat sink and is exhausted out of the computer case. The second fan rotates in such a manner that airflow is drawn into the computer case, flows through the mass storage device and is exhausted out of the computer case.
    Type: Grant
    Filed: June 3, 2011
    Date of Patent: September 30, 2014
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Chen Chen, Hong-Zhi Sun, Yang Li
  • Patent number: 8842432
    Abstract: A system of computing assets arranges a plurality of backplanes to form a perimeter of a central region of a backplane structure. A plurality of computing assets are coupled to the backplanes and extend away from the central region of the backplane structure. A plurality of air intake openings are located along the perimeter of the backplane structure. An exhaust duct is coupled to an exhaust opening of the backplane structure and configured to direct air away from the backplane structure and is coupled to an air moving device. When the air moving device is operational, air flows across the computing assets through the air intake openings towards the central region of the backplane structure and into the exhaust duct, which directs the air away from the backplane structure.
    Type: Grant
    Filed: September 22, 2012
    Date of Patent: September 23, 2014
    Assignee: Facebook, Inc.
    Inventor: Jon Brian Ehlen
  • Publication number: 20140268530
    Abstract: The methods and apparatuses described herein is a data center. In one embodiment is described a data center comprising: a building having a plurality of rooms and first and second exterior load walls disposed on opposite sides of the building; a plurality of air handler and fluid cooler devices disposed exterior to the building along the first exterior load wall; a plurality of condenser unit devices disposed exterior to the building along the second exterior load wall; a data sector disposed inside the building, adjacent to the first exterior load wall; three separate UPS and substation distribution equipment rooms, each containing UPS and substation distribution equipment therein, as well as air conditioning equipment that is connected to certain of the plurality of condenser unit devices; and a power spine room disposed between the three separate UPS and substation distribution equipment rooms and the data sector, the power spine room including a plurality of PDU devices.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Applicant: Switch Communications Group LLC
    Inventor: Switch Communications Group LLC
  • Patent number: 8837138
    Abstract: Examples disclose a removable air guide assembly with a processor air cooler to direct air over a processor on a circuit board, the processor air cooler is not directly aligned over the processor. Further, the examples provide the removable airflow guide assembly with memory bank coolers to direct air over memory banks also positioned on the circuit board. Additionally, the examples also disclose the removable airflow guide assembly with a connector socket to align with the circuit board and provide power to the processor air cooler and the memory bank coolers.
    Type: Grant
    Filed: February 27, 2012
    Date of Patent: September 16, 2014
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Andrew L. Wiltzius, Tom J Searby, Robert Lee Crane, Adolfo Adolfo Gomez
  • Patent number: 8830674
    Abstract: The present disclosure discloses a cooling system and an electronic device. The cooling system is configured to cool a circuit board assembly in an orthogonal architecture, where the circuit board assembly is arranged inside a cabinet. The cooling system includes: a first cooling air duct that allows air to flow from the front area of the cabinet corresponding to the region of the circuit board assembly into the cabinet and flow through the front portion of the circuit board assembly, then be distributed into two lateral sides of the circuit board assembly, and be discharged out of the cabinet; and a second cooling air duct that allows air to flow from the front area of the cabinet corresponding to one end of the circuit board assembly into the cabinet and through the rear portion of the circuit board assembly, and then be discharged out of the cabinet.
    Type: Grant
    Filed: July 12, 2012
    Date of Patent: September 9, 2014
    Assignee: Huawei Technologies Co., Ltd.
    Inventor: Zhijun Qu
  • Patent number: 8830672
    Abstract: A computer system includes a rack-mountable server unit with a closed server housing. The server housing has a channel with a recessed channel wall in conductive thermal communication with a processor or other heat-generating component. An elongate conduit is received into the channel of the server housing in conductive thermal communication with an external surface of the server housing. The server is cooled by conductive fluid flow through the conduit, with no appreciable airflow through the server housing. The system may be operated in an optional burst cooling mode, wherein a volume of cooling fluid is trapped in the conduit for a period of time before being quickly released.
    Type: Grant
    Filed: July 27, 2012
    Date of Patent: September 9, 2014
    Assignee: International Business Machines Corporation
    Inventors: Shareef F. Alshinnawi, Gary D. Cudak, Christopher J. Hardee, Randall C. Humes, Adam Roberts, Edward S. Suffern, J. Mark Weber
  • Patent number: 8824137
    Abstract: An electronic device housing device includes a housing, a plurality of slots that are arranged side by side inside the housing, the slots each housing the electronic device, a gas passage that guides a gas flowing into each of the slots in a direction across the slots, a connection substrate provided inside the housing to extend upright, the connection substrate being arranged to face the slots, the connection substrate including a connected portion to which a connecting portion of the electronic device housed in each of the slots is to be connected, a ventilation port provided at an end portion of the connection substrate, the ventilation port allowing the gas to flow into through the gas passage from each of the slots, and a fan that sucks the gas flowing into each of the slots into the ventilation port through the gas passage.
    Type: Grant
    Filed: April 20, 2012
    Date of Patent: September 2, 2014
    Assignee: Fujitsu Limited
    Inventor: Takaya Nakayama
  • Patent number: 8817465
    Abstract: A method is provided which includes providing a multi-rack assembly having adjacent first and second electronics racks, each being at least partially air-cooled, and an air-to-liquid heat exchanger associated with the first rack for cooling at least a portion of air passing through the first rack. The heat exchanger, which is disposed at the air inlet or air outlet side of the first rack and is coupled in fluid communication with a coolant loop to receive coolant from the loop and exhaust coolant to the loop, transfers heat from air passing thereacross to coolant passing therethrough. The assembly also includes a cooling unit, associated with the first rack and cooling coolant in the coolant loop, and an airflow director associated with the second rack and facilitating ducting at least a portion of air passing through the second rack to also pass across the heat exchanger associated with the first rack.
    Type: Grant
    Filed: November 26, 2012
    Date of Patent: August 26, 2014
    Assignee: International Business Machines Corporation
    Inventors: Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Madhusudan K. Iyengar, Robert E. Simons
  • Patent number: 8817470
    Abstract: DIMMs to be cooled are mounted in DIMM areas of a printed circuit board of a system board. An air intake port that introduces cooling air is arranged on a side plate of the system board, whereas an air discharge port that discharges the cooling air is arranged on another side plate. The cooling air flows in a direction that is oblique with respect to the side plate. The air intake port is arranged at a position that is offset in the direction in which the cooling air is supplied. Accordingly, cooling is possible by efficiently bringing the cooling air into contact with the DIMMs.
    Type: Grant
    Filed: April 16, 2012
    Date of Patent: August 26, 2014
    Assignee: Fujitsu Limited
    Inventors: Nobumitsu Aoki, Hideo Kubo, Yoshinori Uzuka, Jun Taniguchi
  • Patent number: 8811010
    Abstract: An exemplary electronic device includes a container, a fan assembly and a duct received in the container. The fan assembly includes a centrifugal fan and a fin group thermally contacting an electronic component in the container. An air passage is defined between each adjacent fins of the fin group. An inner side of the fin group is mounted on an outlet of the centrifugal fan. A bottom surface of the fin group and an inner surface of the container cooperatively define a first channel therebetween. The duct includes an inlet and a first outlet. Airflow guided by the centrifugal fan flows through the duct and the first channel to cool a bottom end of the fin group, then is absorbed into the centrifugal fan from an inlet of the centrifugal fan, and then flow through the air passages of the fin group to cool a central portion the fin group.
    Type: Grant
    Filed: June 7, 2012
    Date of Patent: August 19, 2014
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Zhen-Yu Wang, Chang-Shen Chang, Ben-Fan Xia
  • Publication number: 20140204516
    Abstract: A grate access floor panel comprising a support frame and a plurality of vanes supported by the frame, each of the plurality of vanes having an upstream end and a downstream end with respect to a direction of airflow across the plurality of vanes and faces that extend between the upstream and downstream ends, wherein at least some of the vanes have openings that extend through the faces thereof and have angled tips.
    Type: Application
    Filed: March 21, 2014
    Publication date: July 24, 2014
    Applicant: TATE ACCESS FLOORS LEASING, INC.
    Inventors: William W. REYNOLDS, Daniel B. KENNEDY
  • Patent number: 8787014
    Abstract: A server includes a chassis, a motherboard, a number of data storage devices, a number of system fans, and a power supply mounted in the chassis. The system fans generate an airflow flowing through the chassis, from a front portion of the chassis to a rear portion of the chassis. The power supply includes a power fan causing an airflow directed rearwards through the front portion of the chassis to prevent a disturbance with the airflow from the system fans.
    Type: Grant
    Filed: November 3, 2011
    Date of Patent: July 22, 2014
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Xin-Ping Zhang
  • Patent number: 8780551
    Abstract: A chassis-based processing system includes a first set of processing blades mounted in parallel within a card cage and attached to a backplane within a chassis. An air intake plenum allows air to flow into the chassis, and over the first set of processing blades in an optimized manner. A separate processing blade is located in the air intake plenum, and is attached to the backplane. This processing blade may have less restrictive proximity requirements than the first set of processing blades. The processing blade in the plenum is positioned perpendicular to the first set of processing blades. As a result, airflow over the processing blade in the plenum has a different orientation than airflow over the first set of processing blades. An air deflector structure in the plenum deflects some of the air flowing into the plenum onto the processing blade located in the plenum, thereby providing improved cooling.
    Type: Grant
    Filed: January 31, 2012
    Date of Patent: July 15, 2014
    Assignee: Brocade Communications Systems, Inc.
    Inventor: Eric W. Farnholtz
  • Patent number: 8773852
    Abstract: A heat management system may include a generally planar printed circuit board extending in a first plane, heat-generating electrical components mounted on a first side of the PCB, and an air baffle coupled to the PCB and configured to direct air flow across some of the components. The air baffle may include a generally planar air baffle body extending in a second plane parallel to and offset from the first plane of the PCB such that at least one of the components is located in an area between the air baffle body and the PCB, an opening in the generally planar body, and a generally planar wing coupled to the air baffle body at a first side of the opening and extending toward the PCB at an askew angle relative to the first plane of the air baffle body, the wing being configured to facilitate air flow through the opening.
    Type: Grant
    Filed: June 21, 2012
    Date of Patent: July 8, 2014
    Assignee: BreakingPoint Systems, Inc.
    Inventor: Gregory L. Singleton
  • Patent number: 8767400
    Abstract: A cooling system for an electronics chassis includes a plurality of centrifugal blowers arranged to motivate cooling air through the electronics chassis. The centrifugal blowers are arranged in one or more sets, each having blowers oriented with respective inlets in mutual facing relationship. The orientation, positioning, and alignment of the centrifugal blowers facilitates a compact arrangement of the plurality of blowers that achieves increased aerodynamic efficiencies to reduce noise output and energy consumption.
    Type: Grant
    Filed: June 27, 2012
    Date of Patent: July 1, 2014
    Assignee: The Bergquist Torrington Company
    Inventors: Roger Dickinson, John O'Connor
  • Patent number: 8764405
    Abstract: An approach is provided in which a cooling manager detects a failed fan included in an electronic enclosure. The electronic enclosure includes multiple fans that each cool different component areas in the electronic enclosure. The cooling manager selects an airflow compensator that corresponds to a functioning fan included in the electronic enclosure, which includes a fixed perforated member and a movable perforated member. In turn, the cooling manager adjusts the selected airflow compensator to redirect a portion of airflow generated by the functioning fan to the component area corresponding to the failed fan.
    Type: Grant
    Filed: January 14, 2013
    Date of Patent: July 1, 2014
    Assignee: International Business Machines Corporation
    Inventors: Benjamin William Mashak, Arden Lot Moore, Katie L. Pizzolato
  • Publication number: 20140177163
    Abstract: A data center includes a wind collecting structure that directs prevailing winds external to the data center into an interior of the wind collecting structure. The wind collecting structure includes vents around its perimeter configured to selectively open on a side of the wind collecting structure receiving prevailing wind, pressurizing the intake air. The pressurized air flows from the wind collecting structure through a compartment of the data center including computing assets. The air is directed across the computing assets to extract heat from the computing assets during operation.
    Type: Application
    Filed: December 21, 2012
    Publication date: June 26, 2014
    Inventor: Scott Wiley