Abstract: A transverse framework for an avionics bay of an aircraft is delimited by a primary structure and a floor, the transverse framework having a mesh structure with square and/or rectangular mesh cells. According to one arrangement, an avionics bay of an aircraft includes two longitudinal rows of avionics racks, parallel to the longitudinal direction and arranged on each side of a clear zone, and a transverse avionics rack supported by the transverse framework situated to the rear of the two longitudinal rows of avionics racks at the rear boundary of the avionics bay. This transverse framework makes it possible to optimize the space occupied by the avionics bay.

Abstract: The present disclosure relates to a chassis and a heat sink for use in the chassis. Disks in rows are arranged in the chassis, and the heat sink comprises an air ingress channel extending from a first end of a housing of the chassis to a side portion of the disks away from the first end; an air egress channel extending from the first end to a second end opposite to the first end, the air egress channel being spaced apart from the air ingress channel by the disks; an intermediate channel comprised of gaps between the disks and fluidically communicating the air ingress channel with the air egress channel; and a fan disposed in the air egress channel and being operable to form a negative pressure in the air egress channel.

Abstract: A deflector assembly includes an acoustic deflector that defines at least a portion of an electronics compartment; and electronics mounted within the electronics compartment. The deflector assembly is configured to provide convective cooling of the electronics via a stack effect air flow through the electronics compartment.

Abstract: An omni-directional acoustic deflector includes an acoustically reflective body having a substantially conical outer surface, and an inner surface opposite the outer surface. The inner surface defines a region that is configured to be coupled to a first electronic component such that heat is transferred from the first electronic component to the outer surface of the acoustically reflective body.

Abstract: This disclosure relates to loudspeakers that use one or more stacks of electrically actuated cards that pump air through vents to produce sound waves in response to an acoustic signal. Each stack can include several electrostatic actuator cards that are stacked on top of each other and collectively operate to pump air through a vent to produce a sound wave. Each card may include an electrically conductive membrane that is pushed/pulled between two electrically conductive stators. As the membrane is pushed and pulled along a first axis, air is pumped through vents in a direction orthogonal to the first axis. In one embodiment, stacks of cards can be arranged in series to increase sound pressure generated by the loud speaker. In another embodiment, a single stack of cards can be driven with relatively high electric field strength to increase the sound pressure generated by the loud speaker.

Abstract: Internal interchangeable modular avionics platform assemblies and methods for removably mounting and interchanging modular avionics platforms within an aircraft. In some embodiments, modular avionics platform assemblies may include a modular avionics platform configured to support various avionics equipment, suitable for removable mounting within a forward fuselage, and interchangeable with a number of alternate platforms. A platform may include a frame structure, and mounting pins and a connector assembly disposed on the frame structure. The mounting pins may project outwardly from the frame structure to align with and detachably secure to corresponding airframe members of an aircraft when the frame structure is in a mounted position. The connector assembly may be disposed on the frame structure and have a plurality of connectors, including connectors for alternating current, direct current, and data.

Abstract: The invention proposes a printed circuit board with multiple layers, which features at least one outer layer and at least one inner layer adjacent to the outer layer. The printed circuit board features a plurality of micro-through-holes, which are formed between a supply voltage area of at least one outer layer and a supply voltage area of at least one inner layer.

Abstract: The electronic computer according to the invention comprises: a storage case comprising a housing including an air inlet and an air outlet for the circulation of a flow of cooling air through the housing, an electronic motherboard comprising a first surface and a second surface, the second surface being provided with connectors for receiving electronic daughterboards, and an air channeling system configured so as to channel the air hitting the first surface of the electronic motherboard to bring it to the side of the second surface of the electronic motherboard. According to one aspect of the invention, the air channeling system is configured to spray the electronic daughterboards, so as to cool said electronic daughterboards through convection of the air.

Abstract: An apparatus is provided in one example embodiment and includes a faceplate having a plurality of slots arranged on a front portion of the faceplate, a top plate attached to a top portion of the faceplate, and a screen attached to the faceplate and the top plate. A channel may be disposed behind the faceplate and between a bottom surface of the top portion of the faceplate, a bottom surface of the top plate and a top surface of the screen. The screen may include a plurality of openings. In a specific embodiment, the apparatus may be removably attached to a removable line card of a switch. In a specific embodiment, air may be guided through the slots, by a fan operating behind the apparatus, along the channel and through the plurality of openings to one or more heat generating components on the line card.

Abstract: A storage apparatus S comprises a disk controller for controlling data I/O processing between a host H and a disk unit. The disk controller includes a plurality of circuit board modules each having a circuit board and a module case storing the same, and a chassis shaped like a hollow cylinder having a front side opening and a rear side opening and configured to store the circuit board modules from the front and rear side openings. A CM module is configured to introduce cooling air from a cooling fan through an opening provided on at least one side surface toward a circuit component mounted on the circuit board. A MP module is configured to introduce cooling air by a cooling fan through an opening provide on a front surface of the module case.

Abstract: A thermal management component for a Rechargeable Energy Storage Systems (RESS) assembly and a method of managing the temperature of a RESS battery module using the component are disclosed. The thermal management component comprises (i) a frame having a chamber defined therein; and (ii) a heat exchange plate in mechanical communication with at least a portion of the frame. The method comprises (a) providing a thermal management component as described herein; and (b) circulating at least one heat transfer fluid through said component.

Abstract: A system of computing assets arranges a plurality of backplanes to form a perimeter of a central region of a backplane structure. A plurality of computing assets are coupled to the backplanes and extend away from the central region of the backplane structure. A plurality of air intake openings are located along the perimeter of the backplane structure. An exhaust duct is coupled to an exhaust opening of the backplane structure and configured to direct air away from the backplane structure and is coupled to an air moving device. When the air moving device is operational, air flows across the computing assets through the air intake openings towards the central region of the backplane structure and into the exhaust duct, which directs the air away from the backplane structure.

Abstract: A heat dissipation system includes a computer case has a base plate and a back plate, a heat sink, a second heat source, and an air partition panel. The back plate defines a plurality of first air outlet holes aligned with the heat sink, and a plurality of second air outlet holes aligned with the second heat source. The heat sink is positioned on the base plate in contact with a first heat source. The second heat source is positioned on the base plate adjacent to the base plate. The air partition panel is positioned on the base plate between the motherboard and the second heat source. A first air path is defined between the air partition panel and the plurality of first air outlet holes. A second air path is defined between the air partition panel and the plurality of second air outlet holes.

Abstract: The present invention discloses a backlight module and a ventilation component thereof, and a back plate of the backlight module is provided with a plurality of the ventilation components. The ventilation component comprises: a tubular body, a ventilating filter, a filter washer, and a fixing ring. The tubular body is hollow, and the ventilating filter is carried in the tubular body. The ventilating filter can communicate the internal air with the external air of the backlight module circulate to effectively descend the temperature of the internal air, so that the thermal expansion of the light guide plate in the backlight module can be decreased to prevent from generating an optical problem.

Abstract: An electronic apparatus with improved heat dissipation comprises a first body with a first shell and a second shell, a second body, a coupling device and a linkage device. The first shell is pivotally connected to the second shell to form an accommodation space. The first shell can pivot relative to the second shell to enlarge the accommodation space and form an opening between the first shell and the second shell. The coupling device couples the second body and the second shell to pivot the second body relative to the second shell to expose or hide the first shell. The linkage device drives the first shell to pivot relative to the second shell. When the second body pivots relative to the second shell toward a first direction, the linkage device drives the first shell to pivot relative to the second shell toward a second direction opposite to the first direction.

Abstract: The power conversion apparatus includes electronic components constituting a power conversion circuit, a cooler for cooling at least some of the electronic components, and a case housing the electronic components and the cooler. The at least some of the electronic components and the cooler are fixed to and integrated in a frame as an internal unit . The internal unit including therein the semiconductor modules also includes a control circuit board fitted to board fixing sections formed in the frame so as to project from the frame in the height direction perpendicular to the plane of the frame. Each of the board fixing sections has a board abutment surface at a position closer to the frame than the tips of control terminals of the semiconductor modules formed so as to project in the height direction.

Abstract: A horizontal subrack includes a ventilation box, a fan box and a board area. The ventilation box is located on the top and/or at the bottom of the board area, and includes an air partition plate, an air inlet, and a first air outlet; the air partition plate is set inside the ventilation box, and divides the ventilation box into an air-in chamber and an air-out chamber; the fan box is installed in the air-in chamber, and a fan is installed on the fan box; the air inlet is set on the front wall of the ventilation box; and the first air outlet is set on the rear wall of the ventilation box. The board area includes board slots, an air-in duct and an air-out duct.

Abstract: An exemplary server system includes a server cabinet, two rows of racks arranged in the server cabinet, a number of servers mounted in the racks and a heat dissipating device. The server cabinet includes two side plates parallel to each other. The servers of each row are evenly distributed between the side plates. A channel is defined between the two rows of racks. The heat dissipating device includes an air conditioner arranged over the racks for generating cooling air and an air guiding mechanism. The air conditioner defines a number of apertures facing the passage. The guiding mechanism includes a number of tubes received in the passage and respectively coupled to the apertures of the air conditioner. Each of the tubes defines a number of air outlets for exhausting the cooling air towards the servers.

Abstract: A housing structure for a vehicle electronic control unit (“ECU”) includes an ECU case, a mounting bracket, and a seal ring. The ECU case is for housing a vehicle ECU and includes a ventilation opening. The mounting bracket connects with the ECU case and is configured to connect with an associated vehicle frame for mounting the ECU case to the associated vehicle frame. The seal ring surrounds the ventilation opening and seals against both the ECU case and the mounting bracket. A method for mounting an electronic control unit (“ECU”) case to a vehicle frame is also disclosed.

Abstract: The present invention discloses a backlight module and a ventilation component thereof, and a back plate of the backlight module is provided with a plurality of the ventilation components. The ventilation component comprises: a tubular body, a ventilating filter, a filter washer, and a fixing ring. The tubular body is hollow, and the ventilating filter is carried in the tubular body. The ventilating filter can communicate the internal air with the external air of the backlight module circulate to effectively descend the temperature of the internal air, so that the thermal expansion of the light guide plate in the backlight module can be decreased to prevent from generating an optical problem.

Abstract: An electronic apparatus includes: a housing 100 formed of a conductive material; and a digital processing circuit 102 which is disposed in the housing 100 and which radiates an electromagnetic wave. The housing 100 includes a ventilation part 101 through which air is ventilated into and out of the housing 100. The ventilation part 101 is divided into a plurality of holes by a conductive member. When a maximum length in one of the vertical direction and the horizontal direction of one of the plurality of holes that has the largest opening area is R m, and when the frequency of the electromagnetic wave radiated from the digital processing circuit 102 is A Hz, a relationship expressed as 3.0×108/A×½>R is satisfied.

Abstract: An adjustable filler panel assembly, configured for use in an electronic equipment enclosure, includes a first panel and a second panel, each adapted to block airflow. The first panel has pairs of horizontally aligned adjustment openings formed therein, and the second panel has a pair of horizontally aligned attachment members disposed near one end. The first and second panels are connected to one another in an overlapping arrangement to form an air-blocking panel assembly with the attachment members of the second panel being aligned with and connected to a pair of adjustment openings of the first panel. In addition, the first panel and the second panel are telescopically adjustable relative to one another such that a length of the air-blocking panel assembly is selectively adjustable to fill at least a portion of an opening in the electronic equipment enclosure, thereby blocking air from flowing through the opening.

Abstract: A liquid cooling system includes a monolith that is configured to be coupled to a motherboard of the computer. The monolith may be monolithic planar body having a first surface and an opposite second surface, and may include a heat absorption region and a heat dissipation region. The heat absorption region may be at least one location on the monolith that is configured to be in thermal contact with a heat generating component of the motherboard, and the heat dissipation region may be at least one location on the monolith where a liquid-to-air heat exchanger is attached to the monolith. The liquid cooling system may also include a channel extending on the second surface of the monolith and a pump that is configured to circulate the liquid coolant through the channel. The channel may be a trench on the second surface of the monolith that is configured to circulate a liquid coolant between the heat absorption region and the heat dissipation region.

Abstract: Carrying cases (e.g., for a computer mouse) comprising a pad and a fastener (e.g., a zipper) around the perimeter of the pad that may form a mouse pad when the fastener is unfastened, and may be folded along a dimension and the fastener fastened to form a storage pouch. Such carrying cases may include a rim to prevent a mouse from sliding off of the mouse pad, an attachment mechanism that may include a strap, a snap button, or both, or a combination thereof. Embodiments are neoprene having a thickness of 1 to 5 mm, have a fold dimension between 15 and 30 cm, or both. The fastener may have a pull tab located at one end of the fold when the fastener is unfastened and at an opposite end of the fold when the fastener is fastened. Pads may be round, oval, or rectangular with rounded corners.

Abstract: A housing, which may contain a hard disk drive, is configured to removably mount to a recessed surface of a console. The housing includes a lip and a biased latch arm so that the lip can be inserted into a corresponding feature in the recessed surface and the housing can be rotatably mounted to the recessed surface. The biased latch arm is retained by a latch arm retainer so that the housing is held in place. A cable connector extends from the bottom of the housing and is configured to connect to a receptor on the console when the housing is installed. When desired, a latch on the housing can be translated where the translation cause the biased latch arm to translate so as to clear the latch arm retainer. Thus the housing can be readily removed from the console. Preferably a portion of the housing extends beyond a wall of the recessed surface so that when installed, the housing alters the profile of the console.

Abstract: An electronic device module includes an electronic device, a rack accommodating the electronic device, and a shield adjusting assembly. The rack defines a number of ventilation holes, and the shield adjusting assembly defines a number of through holes. The electronic device is placed in the rack to drive the shield adjusting assembly to a first position in which the through holes align with the ventilation holes. When the electronic device is detached from the rack, the shield adjusting assembly is restored by a resilient element to a second position in which the through holes offset the ventilation holes such that the ventilation holes are shielded.

Abstract: A data center includes a housing, a number of server modules arranged in the housing, a number of cooling units arranged in the housing and above the server modules, and a fan mounted in the housing near the cooling units. When the data center is operating, heated air is driven to the cooling units by fans, and then the cooled air is driven to enter the server modules.

Abstract: A storage apparatus S comprises a disk controller 1 for controlling data I/O processing between a host H and a disk unit 2. The disk controller 1 includes a plurality of circuit board modules each having a circuit board 210 and a module case 200 storing the same, and a chassis 100 shaped like a hollow cylinder having a front side opening and a rear side opening and configured to store the circuit board modules from the front and rear side openings. A CM module 20 is configured to introduce cooling air from a cooling fan 10F through an opening provided on at least one side surface toward a circuit component mounted on the circuit board 210. A MP module 30 is configured to introduce cooling air by a cooling fan 10R through an opening provide on a front surface of the module case 200.

Abstract: According to one embodiment, a centrifugal fan includes an impeller and a fan casing containing the impeller. An intake port configured to draw air and a first outlet port and a second outlet port configured to expel the air are provided in the fan casing. The first outlet port is open in a direction different from a direction in which the intake port is open. The second outlet port is open in a direction same as the direction in which the intake port is open in a position apart from the impeller.

Abstract: Settop box (STB) or other housing for use in protecting electronic components. The housing may include an interior portion for protecting the components. The housing may include feet on a bottom and side to facilitate stabilizing the STB in a vertical and horizontal position. The housing may include vents to facilitate air flow to the interior. The vents may be associated with blocking aspects to protect against blocking the vents.

Abstract: A cabinet having a pair of vertically stacked chassis separated by a central, vertically extending region. A pair of laterally spaced, vertically extending panels is disposed in the central region, the panels forming: a pair of outer compartments for receiving air exiting a corresponding one of the pair of laterally spaced vertically stacked chassis; and an inner compartment for receiving air exiting the pair of vertically stacked chassis. The panels have therein an array of openings in a lower portion thereof for passing portions of air in the outer compartments into the inner compartment. An upper portion of the panels inhibits portions of air in the outer compartments from passing into the inner compartment. The openings extend in rows horizontally across the panel. The number of opening in lower ones of the rows is greater than the number of opening in upper ones of the rows.

Abstract: A cooling device for dissipating heat for an electronic device includes a shell to absorb heat generating from a heat generating element in the electronic device, and a number of fins. The shell bounds a heat exchanging space and defines an air intake and an air outlet. The number of fins extends into the heat exchanging space. The shell guides air outside the shell to enter into the shell through the air intake and to exit from the shell through the air outlet after exchanging heat in the heat exchanging space.

Abstract: A housing, which may contain a hard disk drive, is configured to removably mount to a recessed surface of a console. The housing includes a lip and a biased latch arm so that the lip can be inserted into a corresponding feature in the recessed surface and the housing can be rotatably mounted to the recessed surface. The biased latch arm is retained by a latch arm retainer so that the housing is held in place. A cable connector extends from the bottom of the housing and is configured to connect to a receptor on the console when the housing is installed. When desired, a latch on the housing can be translated where the translation cause the biased latch arm to translate so as to clear the latch arm retainer. Thus the housing can be readily removed from the console. Preferably a portion of the housing extends beyond a wall of the recessed surface so that when installed, the housing alters the profile of the console.

Abstract: A waterproof and heat-dissipating module mounted on an electronic device includes a housing structure, a compartment structure, and a fan. A first ventilation hole, a second ventilation hole, a first drainage holes, and a second drainage holes are formed on the housing structure. The compartment structure is disposed inside the housing structure and for partitioning an inside space of the housing structure off that includes an inhaling chamber, a fan room, an accommodated space, and an exhausting chamber. The fan is disposed inside the fan room so that airflow is guided from the first ventilation hole to the second ventilation hole via the inhaling chamber, the fan room, the accommodated space, and the exhausting chamber so as to dissipate heat from circuit boards disposed inside the accommodated space away.

Abstract: A first printed wiring board extends in the vertical direction within a first duct that extends in the vertical direction. A first axial flow fan generates airflow which absorbs heat from the first printed wiring board. Second and third ducts extends in parallel with the first duct. A fourth duct extends between the second and third ducts. A second printed wiring board extends in the horizontal direction within the fourth duct. A second axial flow fan is connected to the third duct. The second axial flow fan generates airflow which absorbs heat from the second printed wiring board. The electronic apparatus can be reduced in size.

Abstract: A system and method for cooling heat-producing devices using synthetic jet embedded heat sinks is disclosed. The cooling system includes a heat sink comprising a base portion and a plurality of fins disposed on the base portion and extending vertically out therefrom, the plurality of fins spaced to define a channel between adjacent fins. The cooling system also includes at least one synthetic jet actuator attached to the heat sink, with each of the at least one synthetic jet actuators comprising a plurality of orifices therein and being configured to generate and project a series of fluid vortices out from the plurality of orifices and toward at least a portion of the channels of the heat sink.

Abstract: A shield can includes a frame having a hole in the top wall thereof, and an enclosure attached to the frame and covering the hole. The frame and the enclosure are formed by punching a metallic piece, the enclosure corresponds to the hole in shape and size, the enclosure is fixed to the upper surface of the top wall. The invention also discloses the method for fabricating the shield can.

Abstract: A fan holder for mounting a fan, includes two opposite sidewalls defining a receiving area therebetween, each of the sidewalls defining a through hole therein; two or more polygonal auxiliary members arranged in the through hole of each of the sidewalls and located about an axis; and wherein the polygonal auxiliary members are rotationally offset from each other.

Abstract: An enclosure for electrical system includes a side plate and an adjusting piece movably attached to the side plate. The side plate includes a heat dissipating part in which a plurality of heat dissipating holes is defined. The adjusting piece is movable with respect to the heat dissipating part for covering portions of at least some of the heat dissipating holes. The enclosure provides a function of adjusting of heat dissipation and noise suppression of an electrical system.

Abstract: A heat-dissipating device includes a housing having a housing wall that defines an inner space and that is formed with first and second openings. A heat source is disposed inside the inner space. A heat-conductive set is in heat-communication with the heat source inside the inner space. A heat-exchange member is in heat-communication with fins of the heat-conductive set, and includes an inner tunnel that extends from the first opening to the second opening through the inner space so as to open to ambient air. The inner tunnel is free of fluid communication with the inner space, and ambient air can flow through the inner tunnel for heat exchange.

Abstract: An assembly device for a power supply is composed of a rectangular case which is provided with a transversal spacer grid in a horizontal direction, with an upper spacer grid and a lower spacer grid being vertically installed above and below the transversal spacer grid, to divide the rectangular case into four rectangular positioning holes; and four rectangular power supplies which are inserted and fitted into the four rectangular positioning holes respectively, such that when the four power supplies start, four fans at their front parts can be activated, thereby allowing air inside and outside the rectangular case to be able to flow uniformly.

Abstract: A computer system includes a computer rack configured to support a plurality of computer chassis in a computer stack region of the computer rack; a cooling plenum configured to draw air from a back side of a computer chassis supported in the computer rack and exhaust the air through an outlet port; and an airflow control member positioned between the cooling plenum and the computer stack region and providing an impedance to airflow between the computer stack region and the cooling plenum, said airflow control member providing a greater airflow impedance to a first portion of the computer stack region than to a second portion of the computer stack region.

Abstract: A power adapter includes a housing formed of a bottom cover shell and a top cover shell and having an air passage extending across the bottom cover shell and an exhaust port in the top cover shell, a PC board mounted in the housing, two heat sinks covered on the PC board for absorbing heat from the primary and secondary sides of the PC board respectively for enabling absorbed heat to be carried to the outside of the housing by outside cooling air that is circulating through the exhaust port and the air passage, and a spacer set in the air passage between the heat sinks and working with the heat sinks to protect the PC board against outside dust and water.

Abstract: Disclosed is an apparatus for improving server electromagnetic shielding at high and low frequencies, including a metallic plate in fixed association with a surface of a server casing, the metallic plate defining a plurality of openings, and a substantially plastic shield including conductive metal fibers and defining a plurality of bosses extending from a boss surface of the plastic shield, the bosses configured to be insertable within the plurality of openings to allow the boss surface to be disposed adjacent to the metallic plate, each of the plurality of bosses defining a boss cavity that extends entirely through the plurality of bosses and the plastic shield.

Abstract: A fan holder is used for dissipating heat from electronic devices. The fan holder includes a fan bracket and an expansion bracket. The fan bracket has a first plate and a second plate. A plurality of partitions is configured between the first plate and the second plate, for connecting the first plate with the second plate. Thereby four same-size receiving rooms are formed in the fan bracket. These receiving rooms are used to receive fans. A plurality of insert slots is defined in four corners of the receiving rooms adjacent to the fixing member. The expansion bracket includes a front plate and a pair of side plates extending perpendicularly from two opposite sides of the front plate. A plurality of hooks is formed on corners of the backside of the side plates, inserting into the insert slots to mount the expansion bracket on the fan bracket.

Abstract: EMI shielding is provided for power electronics circuits and the like via a direct-mount reference plane support and shielding structure. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support forms a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Abstract: An apparatus for cooling electronics is disclosed. The apparatus generally relates to heat sinks that are operatively connected to electronics enclosures. The heat sinks may be part of the electronics enclosure, or alternately they may be operatively connected to the electronics enclosure. An enclosure preferably prevents solar radiation from striking the surface of the heat sink. At the same time, the enclosure allows air to flow over the heat sink, allowing heat to be dissipated.

Abstract: A data center includes an electronic equipment rack having a front face and a back face and a cooling unit positioned adjacent to the rack, the cooling unit having a front face and a back face, the cooling unit being configured to exhaust cooled air from the front face of the cooling unit to cool the rack. The cooling unit is configured to release the cooled air along a substantial portion of a height of the front face of the rack.

Abstract: Methods and apparatus for shielding an object from relative high electromagnetic radio frequencies while allowing airflow to pass to and from the object are disclosed. According to one aspect of the present invention, a shield arrangement that shields a chassis includes at least a first plane and a second plane. The first plane has a thickness and defines a first plurality of openings that include a first opening and a second opening that are separated by at least a distance that is a function of the thickness. The second plane defines at least a third opening, and is approximately parallel to the first plane. The second plane is spaced apart from the first plane by a spacing that is a function of at least the thickness.

Abstract: A power-supplying device includes a casing, a power-supplying unit, and a fan. The casing has a set of exhausting holes. An arrangement hole forms on an upper surface of the casing. The power-supplying unit is received in the casing. The fan corresponds to the arrangement hole and is obliquely disposed in the casing. The power-supplying device draws external hot air into the casing. The fan make the hot air flow in the power-supplying device more smoothly, thereby solving the problem of circulation of hot air in the casing.